STW8Q2PA

CUSTOMERChecked byApproved bySUPPLIERDrawn byApproved by1.Description2.Absolute Maximum Ratings3.Electro-Optical Characteristics4.Optical characteristics5.Reliability Test6.Color & Binning7.Bin Code Description8.Outline Dimension9.Material Structure10.Reel Structure11.Packing12.Soldering13.Precaution for use14.Handling of Silicone Resin LEDsRev. 09•Electric Signs and Signals •Office Automation, Electrical Appliances, Industrial EquipmentFeaturesApplicationsstandard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by silicone.The package design coupled with careful selection of component materials allow these products toperform with high reliability.White colored SMT package.•Pb-free Reflow Soldering Application •Suitable for all SMT assembly methods ; Suitable for all soldering methods •RoHS Compliant℃125T jJunction Temperature℃-40~+100T stg Storage Temperature [1] Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.[2] IFM was measured at Tw ≤1 msec of pulse width and D ≤1/10 of duty ratio.[3] LED’s properties might be different from suggested values like above and below tables if operation conditionwill be exceeded our parameter range.-90-80-9.029-I F =100mA I v Luminous Intensity*[2](3700~7000K)deg.-120-I F =100mA 2Θ1/2Viewing Angle [3]ºC/W-15-I F =100mA R th JS Thermal resistance [4]KV--51.5k Ω;100pFESD (HBM)--8075I F =100mA RaColor Rendering Index*K 7,000-2,600I F =100mA CCT Color Correlated Temperature Cd lm-8.527.9-I F =100mA I v Luminous Intensity*[2](2600~3700K)V1.20.9-I R =5mA V R Reverse Voltage V 3.43.22.9I F =100mA V F Forward Voltage *[1]Unit Max.Typ.Min.Condition SymbolParameter[1] Forward current is 50mA per die for parallel inner circuit.Package Total Forward Current is 100mA[2] The luminous intensity IV was measured at the peak of the spatial pattern which may not be alignedwith the mechanical axis of the LED package.[3] 2Θ1/2is the off-axis where the luminous intensity is 1/2 of the peak intensity.[4] Thermal resistance: RthJS (Junction / solder), Metal PCB 25*25mm 1.6t * Tolerance : V F :±0.1V, I V :±10%, Ra :±3, x,y :±0.01[Note] All measurements were made under the standardized environment of SSC.3. Electro-Optical characteristics-90-60-30906030DirectivityTa=25℃0204060801001201401600.00.20.40.60.81.01.2 R e l a t i v e L u m i n o u s I n t e n s i t yForward Current I F [mA]2.0 2.2 2.4 2.6 2.83.0 3.2 3.4 3.6 3.84.0110100F o r w a r d C u r r e n t I F [m A ]Forward Voltage V F [V]Forward Currentvs. Chromaticity CoordinateTa=25℃0.3360.3370.3380.3390.3400.34120mA60mA100mA 150mA 200mAyx2550751001250.00.20.40.60.8R e l a t i v e F o r w a r d V o l t a g eJu nction tem peratu re Tj(OC )Junction Temperature (℃)vs. Chromaticity CoordinateIF=100mA0.3150.3200.3250.33025456585105yx2550751001250.00.20.40.60.8R e l a t i v e L i g h t O u t p u tJunction tem perature Tj(OC)4700~7000KR e l a t i v e E m i s s i o n I n t e n s i t yWavelength [nm]-40-2020406080100F o r w a r d C u r r e n t I F [m A ]A m b ie n t te m pe rature Ta(OC )R th J-A =100oC /W0/223 Time260℃< 10sec. Reflow SolderingT solReflow0/223 Time 5KV at 1.5k Ω; 100pF MIL-STD-883DESD(HBM)0/221000 Hours T a =-40o C, I F =100mA Internal Reference Low Temperature Life Test0/22500 Hours T a =85o C, I F =100mA Internal Reference High Temperature Life Test0/22500 Hours T a =60o C, RH=90%, I F =100mAInternal Reference High Temperature High Humidity LifeTest 0/221000 HoursT a =25o C, I F =100mAInternal Reference Operating Endurance Test 0/221000 Hours T a =-40o C EIAJ ED-4701Low TemperatureStorage 0/221000 Hours T a =60o C, RH=90%EIAJ ED-4701High Temp. High Humidity Storage ED-4701Storage -LSL [2] ×0.7I F =100mAI VLuminous IntensityUSL [1] × 1.2-I F =100mA V F Forward Voltage MAXMINCriteria for Judgment ConditionSymbolItemNote : [1] USL : Upper Standard Level[2] LSL : Lower Standard Level□CRITERIA FOR JUDGING THE DAMAGECIE X C I E Y* Measurement Uncertainty of the Color Coordinates : ±0.01* Measurement Uncertainty of the Color Coordinates : ±0.01* Measurement Uncertainty of the Color Coordinates : ±0.01* Measurement Uncertainty of the Color Coordinates : ±0.01[Note] All measurements were made under the standardized environment of SSC.In order to ensure availability, single color rank will not be orderable.IV Rank T5T0S5S0R5R0F 3200~3700 K T5T0S5S0R5R0D 4200~4700 K HG E C B A CIE T5T0S5S0R5R02600~2800 KT5T0S5S0R5R05300~6000 K T5T0S5S0R5R03700~4200 K T5T0S5S0R5R02900~3200 K T5T5S5S5R5R5S0S0T0R04700~5300 K T0R06000~7000 K CCTRev. 09September 2011 Slug (Anode)[Note] Forward current is 50mA per die for parallel inner circuit.Package Total Forward Current is 100mA9. Material StructureSiThermo PlasticSilicone Metal Blue LED Metal Description -Zener Diode⑥+Phosphor Encapsulation④Gold Wire Wire ③GaN on SapphireChip Source②Heat-resistant PolymerBody ⑤Copper Alloy (Silver Plated)LEAD FRAME ①MaterialsName Parts No.①②③④⑤(2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm(3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off fromthe carrier tape at the angle of 10ºto the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package(8) We recommend using solder paste composed of AgCuSn, because pastes that contain Bi or B might cause color change of Ag during surface mount technology.Rev. 09September 2011 c a b1SIDE7inch 245220142SIZE (mm)Outer Box StructureMaterial : Paper(SW3B(B))TYPEabc1HUMIDITY INDICATORAluminum Vinyl BagDESI PAKPART NUMBER :SEOUL SEMICONDUCTOR CO., LTD.PART NUMBER :LOT NUMBER : XXXXXXXXXX QUANTITY : XXXXSEOUL SEMICONDUCTOR CO., LTD.PART NUMBER :LOT NUMBER : XXXXXXXXXX QUANTITY : XXXXSEOUL SEMICONDUCTOR CO., LTD.RoHSLED is correspond to SMT, when LED be soldered dip, interfacial separation may affectthe light transmission efficiency, causing the light intensity to drop.Attention in followed; Keeping of a fractionTemperature : 5 ~ 40ºC Humidity : less than 30%(3) In the case of more than 1 week passed after opening or change color of indicatoron desiccant, components shall be dried 10-12hr. at 60±5ºC.(4) Silver plating might be tarnished in the environment that contains corrosive gasesand materials. Also any product that has tarnished lead might be decreased thesolder-ability and optical-electrical properties compare to normal ones.Please do not expose the product in the corrosive environment during the storage.(5) Any mechanical force or any excess vibration shall not be accepted to apply duringcooling process to normal temperature after soldering.(6) Quick cooling shall be avoided.(7) Components shall not be mounted on warped direction of PCB.(8) Anti radioactive ray design is not considered for the products.(9) This device should not be used in any type of fluid such as water, oil, organicsolvent etc. When washing is required, IPA should be used.(10) When the LEDs are illuminating, operating current should be decided after consideringthe ambient maximum temperature.(11) The LEDs must be soldered within seven days after opening the moisture-proof packing.(12) Repack unused products with anti-moisture packing, fold to close any opening and thenstore in a dry place.(13) The appearance and specifications of the product may be modified for improvementwithout notice.2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area.4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust.As mentioned previously, the increased sensitivity to dust requires special care during processing.In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components.5) SSC suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin.Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED.6) Please do not mold this product into another resin (epoxy, urethane, etc) anddo not handle this product with acid or sulfur material in sealed space.。