GDW3001A说明书封面
欧姆韦尔钢铁电磁感应器产品说明书
Dimensions: [mm]sectional drawing A-AScale - 2:17447452222744745222274474522227447452222T e m p e r a t u r eT T T 7447452222Cautions and Warnings:The following conditions apply to all goods within the product series of WE-TI of Würth Elektronik eiSos GmbH & Co. KG:General:•This electronic component was designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The customer is responsible for the functionality of their own products. All technical specifications for standard products also apply to customer specific products.Product specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty.•All other soldering methods are at the customers’ own risk.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product. Potting:•If the product is potted in the costumer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects. Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.•Applying currents with audio-frequency signals might result in audible noise due to the magnetostrictive material properties. •Due to heavy weight of the components, strong forces and high accelerations might have the effect to damage the electrical connection or to harm the circuit board and will void the warranty.•Please be aware that products provided in bulk packaging may get bent and might lead to derivations from the mechanical manufacturing tolerances mentioned in our datasheet, which is not considered to be a material defect.•The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum temperature specified.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODTRi001.0072019-08-05DIN ISO 2768-1mDESCRIPTIONWE-TI Radial Leaded Wire WoundInductor ORDER CODE7447452222SIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODTRi001.0072019-08-05DIN ISO 2768-1mDESCRIPTIONWE-TI Radial Leaded Wire WoundInductor ORDER CODE7447452222SIZE/TYPE BUSINESS UNIT STATUS PAGE。
MDX 无线电设备功率放大板说明书
LBI-39051A MAINTENANCE MANUALMDXPOWER AMPLIFIER BOARDS19D904792G2 (403-440 MHz)19D904792G1 (440-470 MHz)19D904792G3 (470-512 MHz)DESCRIPTIONThe Power Amplifier Board (A4) used in the MDX radio is housed in a cavity running parallel to the side of the radio main casting assembly. Refer to the com-bination manual for a complete mechanical layout of the radio.The PA Board amplifies the driver output from the RF Board (approximately 13 watts) to a level of ap-proximately 40 watts, over the frequency range of 403-512 MHz. There are no tuning adjustments on the board.The board consist of a single stage RF power amplifier. Also included on the board are two multi-pin connectors used to distribute non-amplifier related signals in the radio. Two SMB connectors are used to apply drive to and take RF output from the amplifier. The 403-512 MHz range of frequencies is covered by three groups of PA Boards:19D904792G2 (403-440 MHz)19D904792G1 (440-470 MHz)19D904792G3 (470-512 MHz)CIRCUIT ANALYSISThe driver output from the RF Board (13 watts, 50 ohms impedance) is matched to the base of transistor Q1 by capacitors C10, C11, C15 and a 50 ohm microstrip. Inductor L2 provides a bias return for class "C" operation.A network consisting of capacitor C19 and resistor R1 en-hances stability.Once the drive is amplified to approximately 45 watts by Q1, it is matched back up to 50 ohms by capaci-tors C7, C8, C12, C13/C17, C5/C18, C6 and the 50 ohm microstrip. Capacitor C4 is a DC blocking capacitor, which keeps DC voltage from appearing at the amplifier output.Supply voltage (A+) is applied to the collector of power transistor Q1 through a network consisting of induc-tor L1 and capacitors C1, C2, C3, C14 and C16. In addi-tion to enhancing stability, these components also prevent RF from getting onto the A+ line.The amplifier output is fed back to the radio RF Board where it passes through the antenna switch, low pass filter and directional coupler before being applied to the antenna connector.Supply voltage (A+) is applied through 6-pin connector J4 by feedthru capacitor assembly Z903. Other non-amplifier related signals are routed through the PA Board for distribution to other boards in the radio. These include A+, switched A+, relay and volume/squelch HI. A wiring harness plugs into connector J3 for this purpose.LBI-390512SERVICE NOTESThis amplifier can be easily checked without re-moving it from the radio. RF input (at connector J1) and output (at connector J2) impedances are 50 ohms.Remover all power from the radio when servicing the PA Board. The radio power switch does not remove A+ power from the board.There are 12 chip mica capacitors on this PA Board. If any are removed, replace them with a new part since they are easily damaged. Apply them in the exact positions shown in the outline diagram. Failure to do this will have an adverse effect on amplifier gain, bandwidth and efficiency.PA TRANSISTOR REPLACEMENT1.Remove the two retaining screws securing PA transis-tor Q1 to the chassis assembly.2.Unsolder the six leads of the transistor and remove itfrom the printed wire board. Be careful not to damage the board.3.Remove all excess solder from the board near Q1 andclean the board to allow the new transistor to be posi-tioned properly. Refer to the Figure and trim the newtransistor leads (if required) to the same lead lengthsof the transistor just removed.4.Apply silicon grease to the back of the replacementtransistor and place the transistor in the mounting cut-out. Make sure that the base and collector leads are not reversed.5.Replace the transistor mounting screws, leaving themloose at this time. Align the leads on the transistor be-ing replaced with the microstrip. Position each lead so that a maximum amount of lead is in contact with the microstrip. Tighten each mounting screw to 4 ±1 inch-pounds.6."Tin" the 6 transistor leads and then using 2% silversolder. Solder each lead to the printed wire board. 7.Torque the mounting screws to 6 inch-pounds. Re-move any flux left on the circuit board.PA TRANSISTOR LEAD IDENTIFICATIONCopyright© April 1994, Ericsson GE Mobile Communications Inc.PARTS LIST LBI-390513POWER AMPLIFIER BOARD 19D904792G2 (403-440 MHz)19D904792G1 (440-470 MHz)19D904792G3 (470-512 MHz)*COMPONENTS ADDED, DELECTED OR CHANGED BY PRODUCTION CHANGESLBI-39051 OUTLINE DIAGRAM4COMPONENT SIDEPower Amplifier Board19D904792G1, G2 & G3(19D904792, Rev. 2)(19D904690, Component Side, Rev. 3)SCHEMATIC DIAGRAM LBI-390515Power Amplifier19D904792G1, G2 & G3(19D904791, Rev. 0)LBI-390516Printed in U.S.A. Ericsson GE Mobile Communications Inc.Mountain View Road • Lynchburg Virginia 24502。
优波光电技术有限公司 LED 产品说明书
■Features■Outline Dimension●Top view white LED (3.0 x 1.4 x 0.8mm)● Super high brightness of surface mount LED ● Lead frame package with individual 2 pins●Compatible to IR reflow soldering.■Applications●General lighting ●Decoration lighting●Indicator2, Anode 1, CathodeUnit:mmTolerances: ±0.1mm21Top ViewBack ViewSide View■Absolute Maximum Rating (Ta=25℃)■DirectivityItemSymbolValue UnitDC Forward Current I F 30 mA Pulse Forward Current* I FP 100mA Reverse V oltage V R 5 V Power Dissipation P D 110 mWOperating Temperature Topr -40 ~ +85 ℃ Storage Temperature Tstg -40~ +85 ℃Lead Soldering TemperatureTsol260℃/5sec-*Pulse width Max 0.1ms, Duty ratio max 1/10■Electrical -Optical Characteristics(Ta=25(Ta=25℃℃)V F (V)I R (µA) Iv(mcd)CCT2θ1/2(deg)Min. Typ. Max. Max. Min.Typ. Max.Min. Typ. Max. Typ.Part NumberColorI F =20mAV R =5V I F =20mAOSW33014C1AWhiteW ■2.93.1 3.6 10 2000 - 3000 5000K - 6000K 120 OSM53014C1A Warm White M ■2.93.13.6102000-3000 2800K-3500K120Note: * Vf tolerance: ±0.05V* Luminous flux measurement allowance is:±10%LED & Application Technologies■Rank* Correspondence Table of Luminous Flux – Intensity■Chromaticity DiagramLED & Application Technologies*Bin Range of Chromaticity Coordinates (OSW33014C1A)LED & Application TechnologiesCodeX1 Y1 X2 Y2 X3 Y3 X4 Y4 D06 0.3221 0.3523 0.3324 0.3612 0.3324 0.3520 0.3224 0.3420D09 0.3224 0.3430 0.3324 0.3520 0.3323 0.3429 0.3228 0.3336 D12 0.3228 0.3336 0.3323 0.3429 0.3323 0.3337 0.3231 0.3243 D15 0.3231 0.3243 0.3323 0.3337 0.3322 0.3245 0.3234 0.3149 E03 0.3324 0.3612 0.3470 0.3738 0.3461 0.3637 0.3324 0.3520 E05 0.3324 0.3520 0.3461 0.3637 0.3452 0.3536 0.3323 0.3429 E07 0.3323 0.3429 0.3452 0.3536 0.3442 0.3435 0.3323 0.3337 E090.33230.33370.34420.34350.34330.33340.33220.3245*Bin Range of Chromaticity Coordinates (OSM53014C1A)*If color binning is required, only one color group is allowed for each chip within a reel. Chromaticity coordinate groups are measured with an accuracy of ±0.01 *Color coordinate is derived from the CIE 1931 chromaticity.*Bin rank of VFWhiteRank (I F =20mA)88T-999 AAA BBB DC Forward Voltage(v)2.9-3.23.2-3.43.4-3.6*Forward voltage is measured with an accuracy of ±0.1V.LED & Application TechnologiesCodeX1 Y1 X2 Y2 X3 Y3 X4 Y4 G04 0.4160 0.4199 0.4373 0.4302 0.4313 0.4166 0.4112 0.4067G06 0.4112 0.4067 0.4313 0.4166 0.4252 0.4030 0.4063 0.3936 G08 0.4063 0.3936 0.4252 0.4030 0.4192 0.3893 0.4015 0.3804 G10 0.4015 0.3804 0.4192 0.3893 0.4131 0.3757 0.3966 0.3672 H04 0.4373 0.4302 0.4518 0.4354 0.4453 0.4216 0.4313 0.4166 H05 0.4518 0.4354 0.4689 0.4408 0.4614 0.4265 0.4453 0.4216 H07 0.4313 0.4166 0.4453 0.4216 0.4387 0.4077 0.4252 0.4030 H08 0.4453 0.4216 0.4614 0.4265 0.4539 0.4123 0.4387 0.4077 H10 0.4252 0.4030 0.4387 0.4077 0.4322 0.3939 0.4192 0.3893 H11 0.4387 0.4077 0.4539 0.4123 0.4463 0.3980 0.4322 0.3939 H13 0.4192 0.3893 0.4322 0.3939 0.4256 0.3800 0.4131 0.3757 H14 0.43220.39390.44630.39800.43880.38370.42560.3800■Typical Electro-Optical Characteristics CurvesLED & Application TechnologiesRELIABILITY TEST REPORTCLASSIFICATIONTEST TIME TEST CONDTION OPERATION LIFE If:20mA Ta:25+5TEST ITME=1000HRS(-24HRS,+72HRS) HIGHTEMPERTURE HIGH HUMIDITYSTORAGER.H:90~95% Ta:65+5℃TEST ITME=240HRS(+2HRS)HIGH TEMPERTURE STORAGETa:105+5℃TEST ITME=500HRS(-24HRS,+48HRS) ENDURANCE TESTLOWTEMPERTURESTORAGETa:-55+5℃TEST ITME=500HRS(-24HRS,+48HRS) TEMPERTURE CYCLING105℃~25℃~-55℃~25℃ 60min 10min 60min 10min 20cyclesTHERMAL SHOCK105℃~-55℃ 10min 10min 10cyclesSOLDER RESISTANCE Ta:260+5℃ TEST ITME=10+1sec ENVIRONMENTAL TESTSOLDERABILITYTa:230+5℃TEST ITME=5+1secJUDGMENT CRITERIA OF FALURE FOR THE RELIABILITYMEASURING ITMESYMBOLCONDITIONSFAILUERLUMINOUS INTENSITY IV IF=20mA IV<0.5*INITIALV ALUEFORWARD VOLTAGEVFIF=20mA VF>1.2*INITIALV ALUEREVERSE CURRENT IR Vr=5V IR>2*SPECLED & Application Technologies■Recommended Reflow Soldering ProfileSurface mounting conditionIn automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices.Soldering reflow-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for reflow soldering.-In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices.-Wellypower can’t guarantee the LEDs after they have been assembled using the solder dipping method.LED & Application Technologies3) Manual soldering.- Lead solderMax. 300℃for max. 3sec, and only one time. - Lead-free solderMax. 350℃for max. 3sec, and only one time.- There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method use the nitrogen reflow method.- After LEDs have been soldered, repairs should not be done. As repair is unavoidable, a doublehead soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not.- Reflow soldering should not be done more than two times.LED & Application Technologies■Package ModelLoaded Quantity 4000 pcs. Per ReelReel PartLED & Application Technologies。
炜煌新针式打印机说明书
2
6、接口形式：
7、色带： 8、电源：
炜煌针式打印机说明书
倍频型：字符 32 个/行，汉字 16 个/行
M—160 打印头
普通型：字符 24 个/行，汉字 12 个/行
倍频型：字符 48 个/行，汉字 24 个/行
M—164 打印头
字符 40 个/行，汉字 20 个/行
232 串口：
10 针插座，兼容标准 232 串口
* to unsigned int, even unsigned long if necessary.
* Nocky Tian @ 2006-07-17
*/
void PrintByteN( unsigned char* data_src, // pointer to data source
unsigned char N)
1
第一部分 性能指示
1、打印方法： 2、打印有效宽度：
3、打印速度：
4、走纸速度： 5、打印字符：
点行打印 根据打印头不同，打印有效宽度也不相同： M—150 打印头 普通型为 96 点，倍频型为 192 点 M—160 打印头 普通型为 144 点，倍频型为 288 点 M—164 打印头 只能是 240 点，不能做成倍频形式 M—150 打印头 44mm 纸宽，1 行/秒 M—160 打印头 57mm 纸宽，0.7 行/秒 M—164 打印头 57mm 纸宽，0.4 行/秒 与打印速度相同 M—150 打印头 普通型：字符 16 个/行，汉字 8 个/行
炜煌针式打印机说明书
并行接口各引脚信号的定义如下图表所示：
平台式引脚 面板式引脚 信 号 方向
说
明
1
1
-STB
DN300A系列数字式保护测控装置技术使用说明书
5 DN322A 变压器后备保护装置 .............................................................................................19
5.1 装置简介.............................................................................................................................19 5.2 主要技术指标.....................................................................................................................19 5.3 保护原理.............................................................................................................................19 5.4 DN322A 定值及整定说明 .................................................................................................22 5.5 DN322A 信息一览表 .........................................................................................................23 5.6 DN322A 装置背板端子定义图 .........................................................................................24
自动 封装机文字说明书
4．“ ” 检测按键：设备在自动状态下，按下次键，将自动检 测载带穴位中元件的有无，如有元件，设备正常运行，否则，设备暂 停。
5．“ ” 清零键：按下此键，记数归零。 6．“ ” 参数确认键：设置完参数后，按一下此键，参数设置 才有效。 7．“ ” 参数设置键：当主机画面跳转到设定画面时，通过按下 设置键，可设置机器的各种操作参数。
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手动画面一 操作键: 1.“ ” 前进键: 按前进键,主动轮顺时针旋转,带动编带前进； 2.“ ” 后退键: 按后退键, 主动轮逆时针旋转, 带动编带后退； 3．“ ”释放按键，按下此键，主动电机处于自由状态。 4．“ ” 热封键：按热合键，热合电机单独动作，带动热封
将带子一直推到主动轮的链齿处，抬起压带轮，将载带的边孔挂 到主动轮的链齿上。放下压带轮，按下“前进”键，使主动轮驱动带 子。要确保链齿与带子上的链孔齿合而不损坏带子，继续走带，将带 子带子导向下面走过去。 4.3 安装盖带卷盘：
从盖带轴上拆下压簧挡圈和有机玻璃挡圈，将盖带套在供带轮上， 从卷盘下面拉出盖带，卷盘应逆时针旋转。将压簧挡圈和有机玻璃挡 圈安上。 4.4 盖带导向：
带头和带尾留出一段没有元件的部分，即引带部分。次数为头尾之 和。
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1.“手动转速 XXXr/min”:设定机器手动运行时的速度。 2．“热封时间 X.X S”:按封装热合要求设定,范围是 0.1-100.0 秒。热 封时间越长，封合后的撕裂力越大 4．“热封上升时间 X.X S”:气缸到达最高点的时间。封装刀抬起后， 主动轮前进之前的延时。 三. 安装
AIG-300系列硬件用户手册说明书
AIG-300 Series Hardware User’s ManualVersion 1.0, September 2021/product© 2021 Moxa Inc. All rights reserved.AIG-300 Series Hardware User’s Manual The software described in this manual is furnished under a license agreement and may be used only in accordancewith the terms of that agreement.Copyright Notice© 2021 Moxa Inc. All rights reserved.TrademarksThe MOXA logo is a registered trademark of Moxa Inc.All other trademarks or registered marks in this manual belong to their respective manufacturers.DisclaimerInformation in this document is subject to change without notice and does not represent a commitment on the part of Moxa.Moxa provides this document as is, without warranty of any kind, either expressed or implied, including, but not limited to, its particular purpose. Moxa reserves the right to make improvements and/or changes to this manual, or to the products and/or the programs described in this manual, at any time.Information provided in this manual is intended to be accurate and reliable. However, Moxa assumes no responsibility for its use, or for any infringements on the rights of third parties that may result from its use.This product might include unintentional technical or typographical errors. Changes are periodically made to the information herein to correct such errors, and these changes are incorporated into new editions of the publication.Technical Support Contact Information/supportMoxa AmericasToll-free: 1-888-669-2872 Tel: +1-714-528-6777 Fax: +1-714-528-6778Moxa China (Shanghai office) Toll-free: 800-820-5036Tel: +86-21-5258-9955 Fax: +86-21-5258-5505Moxa EuropeTel: +49-89-3 70 03 99-0 Fax: +49-89-3 70 03 99-99Moxa Asia-PacificTel: +886-2-8919-1230 Fax: +886-2-8919-1231Moxa IndiaTel: +91-80-4172-9088 Fax: +91-80-4132-1045Table of Contents1.Introduction ...................................................................................................................................... 1-1Model Descriptions .............................................................................................................................. 1-2 Package Checklist ............................................................................................................................... 1-2 Product Features ................................................................................................................................ 1-3 Product Specifications ......................................................................................................................... 1-3 2.Hardware Introduction...................................................................................................................... 2-1Appearance ........................................................................................................................................ 2-2 AIG-301-AZU-LX ......................................................................................................................... 2-2AIG-301 US, EU, AP, and CN Models .............................................................................................. 2-3 Dimensions ........................................................................................................................................ 2-4 AIG-301-AZU-LX ......................................................................................................................... 2-4AIG-301 US, EU, AP, and CN Models .............................................................................................. 2-4 LED Indicators .................................................................................................................................... 2-5 Reboot .............................................................................................................................................. 2-5 Reset to Default ................................................................................................................................. 2-5 Real-time Clock .................................................................................................................................. 2-5 Installation Options ............................................................................................................................. 2-6 DIN-rail Mounting ........................................................................................................................ 2-6Wall Mounting (optional) .............................................................................................................. 2-6 3.Hardware Connection Description ..................................................................................................... 3-1Wiring Requirements ........................................................................................................................... 3-2 Connecting the Power .................................................................................................................. 3-2Grounding the Unit ...................................................................................................................... 3-3 Connecting to the Network ................................................................................................................... 3-3 Connecting to a USB Device ................................................................................................................. 3-3 Connecting to Serial Ports .................................................................................................................... 3-3 Inserting the microSD Card .................................................................................................................. 3-4 Connecting to the Console Port ............................................................................................................. 3-4 Connecting the CAN Port ..................................................................................................................... 3-4 Connecting the Digital Inputs and Digital Outputs ................................................................................... 3-5 Inserting the SIM Card ........................................................................................................................ 3-5 Installing the Wi-Fi Module (US, EU, AP, and CN models only) .................................................................. 3-5 Connecting the Antennas ..................................................................................................................... 3-9 A.Regulatory Approval Statements ....................................................................................................... A-11Introduction The AIG-300 Series advanced IIoT gateways are designed for Industrial IoT applications, especially for distributed and unmanned sites in harsh operating environments. ThingsPro Edge and Azure IoT Edge software are preloaded and seamlessly integrated with the AIG-300 Series to enable easy, reliable, yet secure sensor-to-cloud connectivity for data acquisition and device management using the Azure Cloud solution. With the use of the ThingsPro Proxy utility, the device provisioning process is easier than ever. Thanks to the robust OTA function, you never have to worry about system failure during software upgrades. With the secure boot function enabled, you can enable the booting process of AIG-300 Series to prevent malicious software injection.The following topics are covered in this chapter:❒Model Descriptions❒Package Checklist❒Product Features❒Product SpecificationsModel DescriptionsThe AIG-300 Series includes the following models:•AIG-301-T-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -40 to 85°C operating temperature •AIG-301-T-US-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, USA LTE band support, ThingsPro Edge and Azure IoT Edge software, -40 to70°C operating temperature•AIG-301-T-EU-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Europe LTE band, ThingsPro Edge and Azure IoT Edge software, -40 to 70°Coperating temperature•AIG-301-T-AP-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Asia Pacific LTE band, ThingsPro Edge and Azure IoT Edge software, -40 to 70°Coperating temperature•AIG-301-T-CN-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -40 to 70°C operatingtemperature•AIG-301-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -20 to 85°C operating temperature •AIG-301-US-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, USA LTE band support, ThingsPro Edge and Azure IoT Edge software, -20 to70°C operating temperature•AIG-301-EU-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Europe LTE band, ThingsPro Edge and Azure IoT Edge software, -20 to 70°Coperating temperature•AIG-301-AP-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, Asia Pacific LTE band, ThingsPro Edge and Azure IoT Edge software, -20 to 70°Coperating temperature•AIG-301-CN-AZU-LX: Advanced IIoT gateway with Arm® Cortex™-A7 dual-core 1 GHz processor, 1 CAN port, 4 DIs, 4 DOs, ThingsPro Edge and Azure IoT Edge software, -20 to 70°C operatingtemperatureNOTE The CN model does not come with the LTE module preinstalled. We have tested the model with the Quectel EC20 R2.1 LTE module and recommend operating the LTE module in the -20 to 65°C temperature range.Contact Moxa’s distributor in China for more information.Package ChecklistThe package contains the following items:•AIG-300 Series advanced IIoT gateway•Power jack•DIN-rail mounting kit•Quick installation guide (printed)•Warranty cardNOTE Notify your sales representative if any of the above items are missing or damaged.NOTE The console cable is not included in the package; you need to purchase it separately.Product Features•Simplifies data acquisition and device management via the ThingsPro Edge software.•Seamless integration with ThingsPro Edge and Azure IoT Edge enables easy, reliable, yet secure cloud connectivity.•Supports easy device-provisioning with the ThingsPro Proxy utility.•Provides robust OTA function to prevent system failure during software upgrades.•Equipped with secure boot to prevent malicious software-injection attacks.Product SpecificationsNOTE The latest specifications for Moxa's products can be found at https://.2Hardware Introduction The AIG-300 Series devices are compact and rugged, making them suitable for industrial applications. The LED indicators allow you to monitor device performance and quickly identify issues, and the multiple ports can be used to connect a variety of devices. The AIG-300 Series comes with a reliable and stable hardware platform that lets you devote the bulk of your time to application development. In this chapter, we provide basic information about the device’s hardware and its various components.The following topics are covered in this chapter:❒AppearanceA IG-301-AZU-LXA IG-301 US, EU, AP, and CN Models❒DimensionsA IG-301-AZU-LXA IG-301 US, EU, AP, and CN Models❒LED Indicators❒Reboot❒Reset to Default❒Real-time Clock❒Installation OptionsD IN-rail MountingW all Mounting (optional)Appearance AIG-301-AZU-LXTop Panel ViewFront Panel ViewBottom Panel ViewAIG-301 US, EU, AP, and CN ModelsNOTE The CN model does not come with the LTE module preinstalled. Contact Moxa’s distributor in China for more information.Top Panel ViewFront Panel ViewBottom Panel ViewDimensionsAIG-301-AZU-LXAIG-301 US, EU, AP, and CN ModelsLED IndicatorsThe function of each LED is described in the table below: LED Name Status Function PWR1/PWR2 Green Power is on OffNo power SIM Green SIM2 is in use Yellow SIM1 is in useUSR Green/Yellow Green: System is operating normallyYellow: System is initializing and running initial boot-up process L1/L2/L3YellowCellular signal strength L1+L2+L3: Strong L2+L3: Normal L3: WeakW1/W2/W3YellowWLAN signal strength W1+W2+W3: Strong W2+W3: Normal W3: WeakLAN1/LAN 2 (RJ45 connector)GreenSteady on 100 Mbps Ethernet linkBlinking Data is being transmitted or received Yellow Steady on 1000 Mbps Ethernet linkBlinkingData is being transmitted or receivedOff No Ethernet connection or 10 Mbps Ethernet linkRebootTo reboot the device, press the function (FN) button for 1 second.Reset to DefaultPress and hold the function (FN) button between 7 to 9 seconds to reset the device to the factory default settings. When the reset button is held down, the USR LED will blink once every second and become steady after 7 to 9 seconds. Release the button within this period to load the factory default settings.Real-time ClockThe real-time clock is powered by a non-chargeable battery. We strongly recommend that you do not replace the lithium battery without help from a qualified Moxa support engineer. If you need to change the battery, contact the Moxa RMA service team.Installation OptionsDIN-rail MountingThe aluminum DIN-rail attachment plate is already attached to the product’s casing. To mount the device on to a DIN rail, make sure that the stiff metal spring is facing upwards and follow these steps.1.Pull down the bottom slider of the DIN-rail bracket located at theback of the unit2.Insert the top of the DIN rail into the slot just below the upperhook of the DIN-rail bracket.tch the unit firmly on to the DIN rail as shown in theillustrations below.4.Push the slider back into place.Wall Mounting (optional)The device can be mounted on to a wall using a wall-mounting kit as shown in the following illustrations.The optional wall-mounting kit is not included in the product package and should be purchased separately.Follow these steps to mount the device on to a wall:Step 1Use four screws to fasten the wall-mounting brackets on the left panel of the device.Step 2Use another four screws to mount the device on a wall or a cabinet.NOTE •Test the screw head and shank size by inserting the screws into one of the keyhole shaped apertures of the wall-mounting plates before attaching the plate to the wall.•Do not drive the screws in all the way—leave a space of about 2 mm to allow room for sliding the wall mount panel between the wall and the screws.3 Hardware Connection DescriptionIn this chapter, we describe how to connect the AIG-300 to a network and other devices.The following topics are covered in this chapter:❒Wiring RequirementsC onnecting the PowerG rounding the Unit❒Connecting to the Network❒Connecting to a USB Device❒Connecting to Serial Ports❒Inserting the microSD Card❒Connecting to the Console Port❒Connecting the CAN Port❒Connecting the Digital Inputs and Digital Outputs❒Inserting the SIM Card❒Installing the Wi-Fi Module (US, EU, AP, and CN models only)❒Connecting the AntennasWiring RequirementsIn this section, we describe how to connect various devices to the AIG-300. Be sure to read and follow these common safety precautions before proceeding with the installation of any electronic device:• Use separate paths to route wiring for power and devices. If power wiring and device wiring paths mustcross, make sure the wires are perpendicular at the intersection point.NOTEDo not run signal or communication wiring and power wiring in the same wire conduit. To avoid interference, wires with different signal characteristics should be routed separately.• You can use the type of signal transmitted through a wire to determine which wires should be keptseparate. The rule of thumb is that wiring that shares similar electrical characteristics can be bundled together.• Keep input wiring and output wiring separate.• When necessary, it is strongly advised that you label wiring to all devices in the system.Connecting the PowerConnect the power jack (in the package) to the DC terminal block (located on the top panel), and then connect the power adapter. It takes about 3 minutesfor the system to boot up. Once the system is ready, the power LEDs will light up. Both models support dual power inputs for redundancy.Grounding the UnitThere is a grounding connector on the top panel of the device. Use this connector to connect a well-grounded mounting surface, such as a metal panel. Grounding and wire routing help limit the effects of noise due to electromagnetic interference (EMI).Connecting to the NetworkThe Ethernet ports are located on the front panel of the device. The pin assignments for the Ethernet ports are shown in the following figure. If you are using your own cable, make sure that the pin assignments on the Ethernet cable connector match the pin assignments on the Ethernet port.Pin 10/100 Mbps1000 Mbps 1 Tx+ TRD(0)+ 2 Tx- TRD(0)- 3Rx+ TRD(1)+ 4 – TRD(2)+ 5 – TRD(2)- 6 Rx- TRD(1)- 7 – TRD(3)+ 8–TRD(3)-Connecting to a USB DeviceThe device comes with a USB port located on the lower part of the front panel, allowing users to connect to a device with an USB interface. The USB port uses a type-A connector.Connecting to Serial PortsThe serial ports can be configured by software for RS-232, RS-422, or RS-485. The pin assignments for the ports are shown in the following table:PinRS-232RS-422/RS-485 4wRS-485 2w1 – TxD-(A) –2 RxD TxD+(B) –3 TxD RxD+(B) Data+(B)4 DTR RxD-(A) Data-(A)5 GND GND GND6 DSR – –7 RTS – – 8CTS––Inserting the microSD CardThe device comes with a microSD socket for storage expansion. The microSD socket is located on the lower part of the front panel. To install the card, remove the screw and the protection cover to access the socket, and then insert the microSD card into the socket directly. You will hear a click when the card is in place. To remove the card, push the card in before releasing it.Connecting to the Console PortThe console port is an RS-232 port located on the top panel and can be connected to a 4-pin pin header cable. You can use this port for debugging or firmware upgrade.Pin Signal 1 TxD 2 RxD 3NC 4GNDConnecting the CAN PortThere is a CAN port in DB9 interface, located on the bottom panel. Refer to the figure on the left for detailed pin definitions.PinDefinition1 –2 CAN_L 3CAN_GND4 –5 (CAN_SHLD)6 (GND)7 CAN_H8 – 9(CAN_V+)Connecting the Digital Inputs and Digital OutputsThere are four digital inputs and four digital outputs on the top panel. Refer to the figure on the left for detailed pin definitions.Inserting the SIM CardThe device comes with a SIM card socket that allows users to install two SIM cards for cellular communication. Step 1Remove the screw on the SIM card holder cover located on the bottom panel of the device.Step 2Insert the SIM card into the socket.Make sure you insert in the right direction. To remove the SIM card, press the SIM card in to release and then you can pull out the SIM card.Installing the Wi-Fi Module (US, EU, AP, and CN models only)The optional Wi-Fi wireless module is not included in the product package and should be purchased separately. The Wi-Fi wireless module package contains the following items: • 1 x Wi-Fi module• 1 x thermal pad (25 x 10 x 1 mm) • 2 x black screws (M2.5 x 4 mm)• 2 x bronze spacers (M/F M3 x 4/M3 x 5 mm) • 1 x insulation pad • 1 x heatsinkNOTENotify your sales representative if any of the above items are missing or damaged.Follow these steps to install the Wi-Fi module for the device.1.Loosen the four screws on the right panel of your computer.2.Remove the right-side cover to expose the Mini-PCIe socket.The Wi-Fi socket is located beside the cellular module socket.3.Remove the plastic sheet on the thermal pad and stick the thermal pad on the metal surface asindicated.4.Insert the wireless module card into the socket at an angle.5.Push down the wireless module card and secure it by fastening the two black screws (M2.5x4 mm).6.Remove the plastic protection covers on the antenna connectors.7.Connect the #W1 SMA cable to the Main connector and the #W2 SMA cable to the Aux connector on thewireless module card installed.8.Stick the insulation tape on the connectors.9.Remove the two silver screws (M3x6 mm) and keep them for later use.10.Fasten the two bronze screws on to the screws on the board.11. Remove the plastic sheet on the thermal pad of the heat sink, install the heat sink pad on the module,and secure the heat sink with the two silver screws (M3 x 6 mm).12. Put back the right cover of the computer and secure it with screws.Connecting the AntennasThere are two cellular antenna connectors (C1 and C2) on the front panel ofthe device. In addition, a GPS connector is provided for the GPS module. Allthree connectors are of SMA type. Connect the antennas to these connectorsas shown below.There are two Wi-Fi antenna connectors (W1 and W2) on the top panel ofthe device. Connect the antennas on the connectors as shown below. BothW1 and W2 connectors are of RP-SMA type.A Regulatory Approval StatementsThis device complies with part 15 of the FCC Rules. Operation is subject to the followingtwo conditions: (1) This device may not cause harmful interference, and (2) this devicemust accept any interference received, including interference that may cause undesiredoperation.Class A: FCC Warning! This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonableprotection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the users will be required to correct the interference at their own expense.European Community。
XL3001规格书(中文版)
引脚名 CS NC VC
VIN
SW GND
描述
输出电流采样引脚，CS 参考电压为 0.21V。 无连接。 内部电压调节器旁路电容引脚，在典型应用中，需要在 VIN 与 VC 引脚之间连接 1 个 1uF 电容。 电源输入引脚，支持 8V 到 40V DC 范围电压输入，需要在 VIN 与 GND 之间并联电解电容以消除噪声。 功率开关输出引脚，SW 是输出功率的开关节点，金属片电气 属性是 SW。 接地引脚。
VIN=8V,IOUT=925mA VIN=12V,IOUT=925mA VIN=24V,IOUT=925mA VIN=36V,IOUT=925mA
2
3
4
LED String(N*3W)
图17. XL3001系统效率曲线
Rev 1.2 10
220KHz 40V 3A开关电流降压型LED恒流驱动器
Datasheet
Rev 1.2
图 18. XL3001 系统参数测量电路（LED OVP）
11
220KHz 40V 3A开关电流降压型LED恒流驱动器
物理尺寸
SOP8-EP
Datasheet
XL3001
Rev 1.2 12
220KHz 40V 3A开关电流降压型LED恒流驱动器
Datasheet
XL3001
特点
220KHz 40V 3A开关电流降压型LED恒流驱动器
典型系统应用(VIN=8V~40V, IOUT=615mA)
Datasheet
XL3001
Efficiency(%)
图 14. XL3001 系统参数测量电路（VIN=8V~40V,IOUT=615mA）
Efficiency VS LED String