SN54HC164_03中文资料

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万年历程序芯片资料

万年历程序芯片资料

DS1302:1: DS1302 简介:DS1302 是美国DALLAS 公司推出的一种高性能、低功耗的实时时钟芯片,附加31 字节静态RAM ,采用SPI 三线接口与CPU 进行同步通信,并可采用突发方式一次传送多个字节的时钟信号和RA RAM M 数据。

实时时钟可提供秒、分、时、日、星期、月和年,一个月小与31 天时可以自动调整,且具有闰年补偿功能。

工作电压宽达2.5 ~5.5V 。

采用双电源供电(主电源和备用电源),可设置备用电源充电方式,提供了对后背电源进行涓细电流充电的能力。

DS1302 的外部引脚分配如图1 所示及内部结构如图2 所示。

DS1302 用于数据记录,特别是对某些具有特殊意义的数据点的记录上,能实现数据与出现该数据的时间同时记录,因此广泛应用于测量系统中。

图1 DS1302 的外部引脚分配图2 DS1302 的内部结构各引脚的功能为:Vcc1 :主电源;Vcc2 :备份电源。

当Vcc2>Vcc1+0.2V 时,由Vcc2 向DS1302 供电,当Vcc2< Vcc1 时,由Vcc1 向DS1302 供电。

SCLK :串行时钟,输入,控制数据的输入与输出;I/O :三线接口时的双向数据线;CE :输入信号,在读、写数据期间,必须为高。

该引脚有两个功能:第一,CE 开始控制字访问移位寄存器的控制逻辑;其次,CE 提供结束单字节或多字节数据传输的方法。

2: 读写时序说明DS1302 是SPI 总线驱动方式。

它不仅要向寄存器写入控制字,还需要读取相应寄存器的数据。

要想与DS1302 通信,首先要先了解DS1302 的控制字。

DS1302 的控制字如图3 :图3 控制字(即地址及命令字节)控制字的最高有效位(位7 )必须是逻辑1 ,如果它为0 ,则不能把数据写入到DS1302 中。

位6 :如果为0 ,则表示存取日历时钟数据,为1 表示存取RAM 数据;位5 至位1 (A4 ~A0 ):指示操作单元的地址;位0 (最低有效位):如为0 ,表示要进行写操作,为1 表示进行读操作。

HC164中文资料参数

HC164中文资料参数

74HC164中文资料参数SN54HC164,/SN74HC164是8位移位寄存器,当其中一个(或二个)选通串行输入端的低电平禁止进入新数据,并把第一个触发器在下一个时钟脉冲来后复位到低电平时,门控串行输入端(A 和B)可完全控制输入数据。

一个高电平输入后就使另一个输入端赋能,这个输入就决定了第一个触发器的状态。

虽然不管时钟处于高电平或低电平时,串行输入端的数据都可以被改变,但只有满足建立条件的信息才能被输入。

时钟控制发生在时钟输入由低电平到高电平的跃变上。

为了减小传输线效应,所有输入端均采用二极管钳位。

功能表:H=高电平(稳定态) L=低电平(稳定态)×=不定↑=从低电平转换到高电平QA0…QH0=在稳定态输入条件建立前QA…QH 的相应电平QAn…QHn=在最近的时钟输入条件(↑)建立前QA…QH 的相应电平,表示移位一位图1 逻辑图(正逻辑)图2 引脚图Absolute Maximum Ratings绝对最大额定值Supply voltage range, 电源电压范围 VCC– V to 7V Input clamp current, 输入钳位电流 IIK (VI < 0 or VI > VCC) (see Note 1)±20 mA Output clamp current,输出钳位电流 IOK (VO < 0 or VO > VCC) (see Note 1)±20 mADC SPECIFICATIONS直流电气规格表:DC SPECIFICATIONS直流电气规格(续)电平电压 V---6 V---IOL = 4mA V---IOL= 6 V---II 输入漏VI = VCC or 0 6 V-±±100-±1000-±1000nA 电流ICC 静态电VI = VCC or 0,IO = 0 6 V--8-160-80μA 源电流Ci 电容-2V to 6V-310-10-10pF图3 参数测量信息图4 typical clear, shift, and clear sequence典型清除、移位和清除时序应用电路:图5 LCD驱动电路图6 LED驱动电路图7 4位数码显示电路。

1642设备作业手册

1642设备作业手册

1642设备作业手册目录1设备介绍 (3)1.1产品概述 (3)1.2系统特点 (3)1.3 主要板卡类型 (5)2 设备安装与督导 (7)2.1机械安装 (7)2.2光电安装 (11)3 设备开通与业务实现 (19)3.1 监控软件安装 (19)3.2 1320CT监控设备 (21)3.2 开通配置 (23)3.3 SDH业务配置 (33)3.4 ISA业务配置 (45)4 设备维护 (68)4.1告警指示灯 (68)4.2 告警查看 (68)4.3 告警处理 (72)5 案例分析 (73)6 问题思考 (74)1 设备介绍1.1产品概述1642EM 是盒式SDH 光传输设备,本设备根据中国国家标准以及ITU-T的各项建议和信息产业部的相关标准和要求设计的,其各项技术指标都达到或超过相关标准要求,符合SDH 设备入网的要求。

1642EM设备可以通过SDH接口与155M、622M、2.5G、10G 等SDH传输设备组成标准的传输网,也可以通过PDH、以太网接口与电话交换机、以太网交换机,接入网设备、移动基站和交换设备等组成各种通信网。

1.2系统特点(1)灵活的组网方式本设备为SDH系列集成型STM-1 的盒式光纤传输设备。

具有灵活的组网能力,适应于多种现场组网情况,支持点到点、链形、环形、星形等多种网络拓扑结构,并支持环切环、环带链等各种复杂的网络拓扑结构。

(2)灵活的系统配置STM-1 光接口:采用不同的光模块,可提供S1.1、L1.1、L1.2 不同的光接口。

E1 接口:选用不同的2M接口板,可提供8 或28 路、75Ohm 或120Ohm 不同要求的E1 接口。

在同一设备中还可同时提供E3/DS3、以太网等接口。

(3)完善、快速的保护机制当系统工作在环形组网结构时,可采用通道保护的方法对每个E1 支路进行保护,即系统提供SNCP 子网连接保护的功能。

(4)提供378X378 VC12 的低阶交叉能力交叉单元可实现任意接入单元之间的业务交叉,可采用直通方式、分叉方式和广播方式进行业务配置。

SN54HC373中文资料

SN54HC373中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

SN54HC354J资料

SN54HC354J资料

IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

74HC164中文资料全参数

74HC164中文资料全参数

74HC164中文资料全参数1.逻辑电平:74HC164使用CMOS技术,逻辑电平为3.3V或5V。

2.工作电流:在3.3V电压下,74HC164的典型工作电流为2mA,最大工作电流为20mA。

在5V电压下,典型工作电流为4mA,最大工作电流为40mA。

3.工作温度范围:74HC164的工作温度范围为-40°C到85°C。

4.串行输入:74HC164的串行输入引脚是SER,用于输入要移位的数据。

输入电平为高电平或低电平。

5.时钟输入:74HC164的时钟输入引脚是CLK,用于控制数据移位的时钟脉冲。

时钟脉冲上升沿或下降沿触发移位操作。

6.清零输入:74HC164的清零输入引脚是MR,用于清除寄存器中的数据。

清零脉冲上升沿触发清零操作。

7.并行输出:74HC164的并行输出引脚是Q0到Q7,共有8个引脚。

这些引脚用于输出移位寄存器中的数据。

8.输出使能:74HC164还有一个输出使能引脚,称为OE,用于控制并行输出引脚的输出状态。

当OE为低电平时,输出引脚将有效;当OE为高电平时,输出引脚将处于高阻态。

9. 数据延迟:74HC164的数据延迟时间(tPD)为20ns。

这是指从时钟边沿到输出数据稳定的时间。

10.封装形式:74HC164有多种封装形式可选,例如DIP、SOP、TSSOP 等。

总结:74HC164是一个串行入并行出的8位移位寄存器,具有3.3V 或5V逻辑电平、2mA到40mA工作电流范围、-40°C到85°C工作温度范围等特点和参数。

它适用于数字系统中需要进行数据移位和存储的场景,如数据传输、显示驱动和状态存储等应用。

SN54AHCT16373WD中文资料

SN54AHCT16373WD中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 2000, Texas Instruments Incorporated。

M54HCT164中文资料

M54HCT164中文资料
PIN DESCRIPTION
PIN No 1, 2 3, 4, 5, 6, 10, 11, 12, 13 8 9 7 14 SYMBOL A, B QA to QH NAME AND FUNCTION Data Inputs Outputs
IEC LOGIC SYMBOL
CLOCK CLEAR GND V CC
M54/M74HCT164
AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, Input t r = tf = 6 ns)
Test Conditions Symbol Parameter VCC (V) 4.5 4.5 TA = 25 C 54HC and 74HC Min. Typ. 8 23 Max. 15 36
Clock Input (LOW to HIGH, Edge-triggered) Master Reset Input Ground (0V) Positive Supply Voltage
ABSOLUTE MAXIMUM RATINGS
Symbol VCC VI VO IIK IOK IO ICC or IGND PD Tstg TL Parameter Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source Sink Current Per Output Pin DC VCC or Ground Current Power Dissipation Storage Temperature Lead Temperature (10 sec) Value -0.5 to +7 -0.5 to VCC + 0.5 -0.5 to VCC + 0.5 ± 20 ± 20 ± 25 ± 50 500 (*) -65 to +150 300 Unit V V V mA mA mA mA mW
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityLow Power TelephonyWirelessVideo&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedPACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-8416201VCA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8416201VDA ACTIVE CFP W141TBD A42N/A for Pkg Type 84162012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 8416201CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN54HC164J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN74HC164D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DG4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DRG4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DT ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DTE4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164DTG4ACTIVE SOIC D14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN74HC164N3OBSOLETE PDIP N14TBD Call TI Call TISN74HC164NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74HC164NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164PW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164PWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164PWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164PWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164PWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC164PWTE4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54HC164FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ54HC164J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ54HC164W ACTIVE CFP W141TBD A42N/A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be 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