自恢复保险丝SMD0805封装参数型号规格书大全
0805自恢复保险丝
A.Features重要特性♦Smaller size saves board space and cost超小尺寸、节约空间和成本♦Resettable circuit protection自恢复保护、免维护♦Fast time-to-trip动作时间快♦Low resistance低内阻值♦Surface mount packaging for automated assembly贴片式封装，方便自动化生产♦Lead-free and compliant with the European Union RoHS Directive2002/95/EC 符合欧州ROHS无铅环保要求B.Application应用范围Polymer Resettable Fuse for over-current,over-temperature and short-circuit protection 可恢复保险丝用于过流、温度和线路短路保护♦Computer motherboards计算机主板♦IEEE1394PortsIEEE1394通讯接口♦USB hub,ports and peripheralsUSB交换机及外围设备♦Phones电话设备♦Data communication数据交换机♦Modems/Ethernet/LAN调制解调器/以太网C.General Description简要概述Polymer resettable fuse are made of polymeric PTC materials which is a matrix of自恢复保险丝是聚合物高分子材料通过特殊工艺而成，polymer containing dispersed conductive particles.Generally,the device has a very高分子粒子按一定的规律排列，自恢复保险丝器件有低内阻low resistance.If an over-current happened,as a response to the damage current,当电路中电流突然增大时，the resistance will immediately increase to very high,reducing the current of the器件将会在短时间内阻值升到高阻状态、高分子膨胀circuit to a safe value that the loading can carry.Once fault to the circuit is weed out从而起到减少过电流；and power is recuperated,the polymer will deflate itself,the device will reset and is 一旦故障排除后，高分子将会恢复正常规则排序。
0805贴片自恢复保险丝系列型号尺寸规格书
(a) RoHS Compliant & Halogen Free(b) Applications: All high-density boards(c) Product Features: Small surface mountable, Solid state, Faster time to trip thanstandard SMD devices, Lower resistance than standard SMD devices (d) Operation Current: 0.10A~1.10A (e) Maximum Voltage: 6V~24V DC(f) Temperature Range : -40℃ to 85℃2. Agency RecognitionUL : File No. E211981TÜV: File No. R500905563. Electrical Characteristics (23℃)H I T =Trip current-minimum current at which the device will always trip at 23℃ still air. V MAX =Maximum voltage device can withstand without damage at it rated current.(I MAX )I MAX = Maximum fault current device can withstand without damage at rated voltage (V MAX ).Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23℃ still air environment. R MIN =Minimum device resistance at 23℃ prior to tripping.R 1MAX =Maximum device resistance at 23℃ measured 1 hour after tripping or reflow soldering of 260℃ for 20 seconds. Termination pad characteristicsTermination pad materials: Pure Tin4.FSMD Product Dimensions (Millimeters)6. Typical Time-To-Trip at 23℃Tim e -t o -t r i p (S )7. Material SpecificationTerminal pad material: Pure TinSoldering characteristics: Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 38. Part Numbering and Marking SystemPart Numbering System Part Marking SystemS M D □ □ □ - □ □ - 0805 F □Warning: electrical arcing and/or flame.-PPTC device are intended for occasional overcurrent protection. Application for repeated overcurrent condition and/or prolonged trip are not anticipated. 甲、 -Avoid contact of PPTC device with chemical solvent. Prolonged contact will damage the deviceperformance. A = SMD010-0805 / SMD010-24-0805 B = SMD020-0805 C = SMD035-0805 D = SMD050-0805 / SMD050-9-0805 E = SMD075-0805 F = SMD100-0805 G= SMD110-0805Current Rating Part Identification Logo Example Voltage Rating9. Pad Layouts 、Solder Reflow and Rework RecommendationsThe dimension in the table below provide the recommended pad layout for each SMD 0805 deviceNote 1: All temperatures refer to of the package,measured on the package body surface.Reflow Profile。
0805尺寸规格的说明
贴片电阻的功率是指通过电流时由于焦耳热电阻产生的功率。
可根据焦耳定律算出：P=I2 R。
额定功率：是指在某个温度下最大允许使用的功率，通常指环境温度为70°C时的额定功率。
额定电压：可以根据以下公式求出额定电压。
额定电压(V)＝√额定功率(W)× 标称阻值(Ω)最高工作电压：允许加载在贴片电阻两端的最高电压。
贴片电阻的封装与功率、电压关系如下表：图1 (-55 ~+125)功率及环境温度降额曲线图图2 (-55 ~+155)功率及环境温度降额曲线图注意事项：•设计和使用贴片电阻时，最大功率不能超过其额定功率，否则会降低其可靠性。
•一般按额定功率的70%降额设计使用。
•也不能超过其最大工作电压，否则有击穿的危险。
•一般按最高工作电压的75%降额设计使用。
•当环境温度超过70°C，必须按照降额曲线图(图1,图2)降额使用。
我们俗称的封装是指英制。
规格书//电容规格书.pdf贴片电阻常见封装有9种，用两种尺寸代码来表示。
一种尺寸代码是由4位数字表示的EIA(美国电子工业协会)代码，前两位与后两位分别表示电阻的长与宽，以英寸为单位。
我们常说的0603封装就是指英制代码。
另一种是米制代码，也由4位数字表示，其单位为毫米。
下表列出贴片电阻封装英制和公制的关系及详细的尺寸：英制(inch ) 公制(mm)长(L)(mm)宽(W)(mm)高(t)(mm)a(mm)b(mm)02010603 0.60±0.050.30±0.050.23±0.050.10±0.050.15±0.0504021005 1.00±0.100.50±0.100.30±0.100.20±0.100.25±0.1006031608 1.60±0.150.80±0.150.40±0.100.30±0.200.30±0.2008052012 2.00±0.201.25±0.150.50±0.100.40±0.200.40±0.2012063216 3.20±0.201.60±0.150.55±0.100.50±0.200.50±0.201210 322 3.20±0. 2.50±0.0.55±0.0.50±0.0.50±0.Note：我们俗称的封装是指英制。
贴片压敏电阻0805封装参数型号规格书大全
UN Semiconductor Co., Ltd.
Revision December 18, 2013
3/5
@ UN Semiconductor Co., Ltd. 2013
MULTILAYER CHIP VARISTORS
UN0805-XXXH Series
Packaging Specification
hours, the change of varistor voltage shall be within 10%.
Damp Heat Load/ Humidity Load
The specimen should be subjected to 40℃,90 to 95%RH environment, and the maximum allowable voltage applied for 1000 hours, then stored at room temperature and humidity for one or two hours. The change of varistor voltage shall be within 10%.
machine. And a normal paper tape shall be connected in the head of taping for the operator handle.
type
0402 0603 0805 1206 1210 1812 2220 3220
A0 ±0.10
1.08
B0
K0
±0.10 ±0.10
1.88 1.04
T ±0.05 0.22
T2
D0
±0.05 +0.10
0805共模电感规格书
A
B
Epoxy
C
Terminations Wires
①
④
(0.4)
②
(0.45)
(0.4)
③
(0.45)
Equivalent circuit
①
④
②
③
No Polarity
A : 2.0 ± 0.2 B : 1.2 ± 0.2 C : 1.2 ± 0.2
Drawn by Checked by Approved by
(1) Product name (2) Shapes and dimensions (3) Shielding Type (4) Impedance【 at 100MHz】
900:90Ω (5) Number of Line
2P:2-Line (6) Taping Type
3. Shapes and Dimensions [Dimensions in mm]
Measurement terminal
①
④
②
③
PRODUCT SPECIFICATION
5.Reliability Test
6/10 SPEC. NO.
T-0602-001T
Operating temperature : -25 to +85℃
Storage temp and humidity : 20~25℃ ,60%RH max.
1000 100
CMF2012F-400-2P-T
Common Mode Differential Mode
Insulation Resistance (MΩ)Min.
10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10
自恢复保险丝SMD0805封装参数型号规格书大全
The SMD0805Series PTC provides surface mount over-current protection for applications where space is at a premium and reset table protection is desired.◆RoHS compliant,Lead-Free and Halogen-Free ◆Fast time-to-trip◆Compact design saves board space ◆Agency recognition:UL ◆Low-profileAlmost anywhere there is a low voltage power supply,up to 16V and a load to be protected,including:◆Computer mother board,B hub ◆PDAs &Charger,Analog &digital line card ◆Digital cameras,Disk drivers,CD-ROMs ◆USB peripherals ◆Power ports◆General electronicsPartNumberIhold (A)I trip (A)V max (Vdc)I max (A)P dtyp.(W)Maximum TimeTo Trip ResistanceCurrent (A)Time (Sec.)R min (Ω)R max (Ω)SMD0805-0100.100.30151000.500.50 1.50 1.000 6.000SMD0805-0200.200.5091000.508.000.020.650 3.500SMD0805-0350.350.7561000.508.000.100.250 1.200SMD0805-0500.50 1.0061000.508.000.100.1500.085SMD0805-0750.75 1.506400.608.000.200.0900.385SMD0805-1001.01.9561000.608.000.300.0600.230I hold =Hold current:maximum current device will pass without tripping in 25°C still air.I trip =Trip current:minimum current at which the device will trip in 25°C still air.V max =Maximum voltage device can withstand without damage at rated current (I max )I max =Maximum fault current device can withstand without damage at rated voltage (V max )P dtyp.=Power dissipated from device when in the tripped state at 25°C still air.R min =Minimum resistance of device in initial (un-soldered)state.R max =Maximum resistance of device in initial (un-soldered)state.R 1max =Maximum resistance of device at 25°C measured one hour after tripping.Caution:Operation beyond the specified rating may result in damage and possible arcing and flame.Part NumberAmbient Operation Temperature-40°C-20°C0°C25°C40°C 50°C 60°C 70°C 85°CHold Current (A)SMD0805-0100.140.120.110.10.80.70.60.50.3SMD0805-0200.280.250.230.200.170.140.120.100.07SMD0805-0350.470.440.390.350.300.270.240.200.14SMD0805-0500.680.620.550.500.400.370.330.290.23SMD0805-075 1.000.900.790.750.630.570.530.410.34SMD0805-1001.351.251.151.000.820.740.650.550.42A=SMD0805-010B=SMD0805-020C=SMD0805-035D=SMD0805-050E=SMD0805-075F=SMD0805-100Part MarkingXPart Identification1Example1= SMD0805-010 2= SMD0805-020 3= SMD0805-035 5= SMD0805-050 7= SMD0805-075 0= SMD0805-100Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max) 150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1.Recommended max past thickness > 0.25mm.2.Devices can be cleaned using standard methods and aqueous solvent.3.Rework use standard industry practices.4.Storage Environment : < 30℃/ 60%RHCaution:1.If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2.Devices are not designed to be wave soldered to the bottom side of the board.Soldering ParametersRamp-downPreheatCritical Zone T L to T PTime to peak temperature(t 25℃ to peak)T PT L T S(max)T S(min)25T e m p e r a t u r eRamp-upTimeA B C DeviceNominalNominal Nominal 0805 Series1.201.001.50The dimension in the table below provide the recommended pad layout for each SMD0805 devicePart Numbering Pa c k ag ingPad Layouts Unit: mmTerminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3Material Specifications010SMD0805Product nameSMD ：surface mount deviceHold Current 0.10ATape & Reel Quantity5,000 pcs/reelABCDEPart NumberMin.Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD0805-010 2.00 2.20 1.20 1.50 0.50 1.00 0.20 0.60 0.10 0.45 SMD0805-020 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-035 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-050 2.00 2.20 1.20 1.50 0.30 0.60 0.20 0.60 0.10 0.45 SMD0805-075 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.60 0.10 0.45 SMD0805-1002.002.201.201.500.501.100.200.600.100.45Dimensions Unit: mmu Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.WarningTape and Reel SpecificationsDirection of Feed0.33 (8.4)0.512(13.0)Arbor Hole Diameter7.0 (177.8)0.212 (5.4)0.157 (4.0) 0.059(1.5)Diameter Cover tape0.314 (8.0)0.157 (4.0)Dimensions are in inches(and millimeters)。
0805封装尺寸0402封装尺寸0603封装尺寸1206封装尺寸
1210表示1210、1812表示1812、10表示1210、12表示2512。
K －表示温度系数为100PPM,102－5％精度阻值表示法：前两位表示有效数字，第三位表示有多少个零，基本单位是Ω，102＝10000Ω＝1KΩ。
1002是1％阻值表示法：前三位表示有效数字，第四位表示有多少个零，基本单位是Ω，1002＝100000Ω＝10KΩ。
J －表示精度为5％、F－表示精度为1％。
T －表示编带包装1：0402(1/16W) 2:0603(1/10W) 3:0805(1/8W) 4:1206(1/4W) 5:1210(1/3W) 6:2010(1/2W) 7:2512(1W)1206 20欧1/4 *4 5欧1w120无极性电容以0805、0603两类封装最为常见；0805具体尺寸：2.0×1.25×0.51206具体尺寸：3.0×1.50×0.5贴片电容以钽电容为多，根据其耐压不同，又可分为A、B、C、D四个系列，具体分类如下：类型封装形式耐压A 3216 10VB 3528 16VC 6032 25V 尺寸：L:6.0 w3.2D 7343 35V贴片钽电容的封装是分为A型（3216），B型（3528），C型（6032），D型（7343），E型（7845）。
贴片电容正负极区分一种是常见的钽电容，为长方体形状，有“-”标记的一端为正；另外还有一种银色的表贴电容，想来应该是铝电解。
上面为圆形，下面为方形，在光驱电路板上很常见。
这种电容则是有“-”标记的一端为负。
发光二极管：颜色有红、黄、绿、蓝之分，亮度分普亮、高亮、超亮三个等级，常用的封装形式有三类：0805、1206、1210二极管：根据所承受电流的的限度，封装形式大致分为两类，小电流型（如1N4148）封装为1206，大电流型（如IN4007）暂没有具体封装形式，只能给出具体尺寸：5.5 X 3 X 0.5电容：可分为无极性和有极性两类:无极性电容下述两类封装最为常见，即0805、0603；有极性电容也就是我们平时所称的电解电容，一般我们平时用的最多的为铝电解电容，由于其电解质为铝，所以其温度稳定性以及精度都不是很高，而贴片元件由于其紧贴电路版，所以要求温度稳定性要高，所以贴片电容以钽电容为多，根据其耐压不同，贴片电容又可分为A、B、C、D四个系列，具体分类如下：类型封装形式耐压A 3216 10VB 3528 16VC 6032 25VD 7343 35V贴片钽电容的封装是分为A型（3216），B型（3528），C型（6032），D型（7343），E型（7845）。
SMD贴片元件的封装尺寸
SMD 贴片元件的封装尺寸贴片元件的封装尺寸【SMD 贴片元件的封装尺寸贴片元件的封装尺寸】】公制：3216——2012——1608——1005——0603——0402英制：1206——0805——0603——0402——0201——01005注意注意：：0603有公制，英制的区分公制0603的英制是英制0201，英制0603的公制是公制1608还要注意1005与01005的区分，1005也有公制，英制的区分英制1005的公制是公制2512公制1005的英制是英制0402像在ProtelDXP(Protel2004)及以后版本中已经有SMD 贴片元件的封装库了，如CC1005-0402：用于贴片电容，公制为1005，英制为0402的封装 CC1310-0504：用于贴片电容，公制为1310，英制为0504的封装 CC1608-0603：用于贴片电容，公制为1608，英制为0603的封装CR1608-0603：用于贴片电阻，公制为1608，英制为0603的封装，与CC16-8-0603尺寸是一样的，只是方便识别。
【贴片电阻规格贴片电阻规格、、封装封装、、尺寸尺寸】】 英制 (inch) 公制(mm) 长(L) (mm) 宽(W) (mm) 高(t) (mm) a (mm) b (mm) 0201 0603 0.60±0.05 0.30±0.05 0.23±0.05 0.10±0.05 0.15±0.05 0402 1005 1.00±0.10 0.50±0.10 0.30±0.10 0.20±0.10 0.25±0.10 0603 1608 1.60±0.15 0.80±0.15 0.40±0.10 0.30±0.20 0.30±0.20英制 (inch) 公制(mm) 长(L) (mm) 宽(W) (mm) 高(t) (mm) a (mm) b (mm) 0805 2012 2.00±0.20 1.25±0.15 0.50±0.10 0.40±0.20 0.40±0.20 1206 3216 3.20±0.20 1.60±0.15 0.55±0.10 0.50±0.20 0.50±0.20 1210 3225 3.20±0.20 2.50±0.20 0.55±0.10 0.50±0.20 0.50±0.20 1812 4832 4.50±0.20 3.20±0.20 0.55±0.10 0.50±0.20 0.50±0.20 2010 5025 5.00±0.20 2.50±0.20 0.55±0.10 0.60±0.20 0.60±0.20 2512 6432 6.40±0.20 3.20±0.20 0.55±0.10 0.60±0.20 0.60±0.20国内贴片电阻的命名方法：1、5%精度的命名：RS-05K102JT2、1％精度的命名：RS-05K1002FTR －表示电阻S －表示功率0402是1/16W、0603是1/10W、0805是1/8W、1206是1/4W、 1210是1/3W、1812是1/2W、2010是3/4W、2512是1W。
贴片保险丝
型号额定电压 额定电流外型尺寸 通过认证 资料下载2920SMD 自复保险丝15~60V0.3~3.0A7.3 ×5.0mmUL TUVPtc2920-1.PDF29 20 英寸 1812SMD 自复保险丝10~40V0.1~2.6A4.6 ×3.0mmUL TUVPTC1812-1.PDF PTC1812-2.PDF18 12 英寸 1206SMD 自复保险丝6V0.35~1.5A3.2×1.6mmUL TUV PTC1206-1.PDF PTC1206-2.PDF12 06 英寸0805SMD 自复保险丝6~15V0.1~0.75A2.0×1.2mmUL TUVPTC0805-1.PDF PTC0805-2.PDF系列外型尺寸1206 系列贴片保险丝3.2*1.6mm 0.12*0.06 英寸0603 系列贴片保险丝 1.6*0.8mm 0.06*0.03 英寸0402 系列贴片保险丝 1.0*0.5mm 0.01*0.005 英寸2410 系列贴片保险丝 6.8*2.7mm 0.24*0.10 英寸型号额定电压额定电流外型尺寸(mm)通过认证资料下载20N 速断型250V/125V 0.1∽20AΦ2.7*7.2 UL/CSA/PSE20N.pdf20T.pdf 20T 延时型250V/125V0.1∽7.0AΦ2.7*7.2 UL/CSA/PSEMCR.pdf MCR 速断型125V0.062∽10AΦ3.1*7.5UL/CSAR251 速断型125V0.062∽15AΦ2.4*7.2 UL/CSA r251-253.pdf型号额定电压额定电流外型尺寸(mm)通过认证资料下载SR5 圆柱型250V 1∽5A Φ8.4*7.6 UR/VDE/CCC SR5.pdfSS5.pdf SS5 方型250V1∽5A Φ8.6*7.6*4 UR/CCCmet.pdf MET 圆柱型250V0.04∽6.3AΦ8.4*7.6UR/VDE/CCCMST 方型250V0.04∽6.3AΦ8.6*7.6*4 UR/VDE/CCC mst.pdfU30系列自恢复保险丝 耐压 30VG16系列自恢复保险丝 耐压 16VS 系列自恢复保险丝 耐压 6-16V BR 系列自恢复保险丝 耐压 125V R250系列自恢复保险丝 耐压 250V原理说明 参数说明：保持电流（Ih ）：25℃静止空气环境中不触发电阻突越的最高电流。
各封装电阻
各封装电阻封装电阻是电子元器件中常见的一种电阻元件。
常见的封装电阻的尺寸和形状各不相同，可以根据不同的应用需求进行选择。
一、SMD封装电阻：SMD封装电阻是表面贴装器件，适用于小型电路板的制造。
常见的SMD封装电阻有0201、0402、0603、0805、1206等尺寸。
其中，尺寸代表了电阻组件的尺寸，如0201代表该电阻的长度为0.02英寸、宽度为0.01英寸。
这些小尺寸的电阻适用于需要高密度元件布局的电路板。
二、贴片封装电阻：贴片封装电阻与SMD封装电阻类似，可以直接贴装在电路板上。
常见的贴片封装电阻有0805、1206、1210、1812、2010等尺寸。
与SMD封装电阻相比，贴片封装电阻的尺寸较大，适用于需要较高功率承载和需要手动焊接的应用场景。
三、插装封装电阻：插装封装电阻的引脚设计为直插型，适用于通过插孔或插接器与电路板相连的应用。
常见的插装封装电阻有电解铝电容、晶振、单片机、继电器等器件。
插装封装电阻与贴片封装电阻相比，具有更高的功率承载能力，适用于需要高功率电阻的应用。
四、网络封装电阻：网络封装电阻是由多个电阻连接在一起组成的。
常见的网络封装电阻有二联、三联、四联等不同组合方式。
网络封装电阻能够实现不同组合方式的电阻值和精度，适用于需要多个电阻分配的应用场景。
它们广泛应用于模拟电路中的分压电路、滤波电路，数字电路中的电平转换、阻抗匹配等。
五、可调封装电阻：可调封装电阻也称为可变电阻或可调电阻，可以通过外部操作改变电阻值。
可调封装电阻通常有旋转式、滑动式和数字式三种类型。
它们常用于电子设备中的电流、电压调节、音量、亮度控制等应用。
封装电阻通常由电阻材料、封装材料和焊接引脚组成。
不同的封装类型和尺寸适用于不同的应用需求，设计者需要根据具体的电路设计来选择合适的封装电阻。
除了常见的封装类型外，还有一些特殊的封装电阻，如高温阻焊电阻、射频电阻等，它们在特定的应用场景中具有特殊的性能优势。
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The SMD0805Series PTC provides surface mount over-current protection for applications where space is at a premium and reset table protection is desired.◆RoHS compliant,Lead-Free and Halogen-Free ◆Fast time-to-trip◆Compact design saves board space ◆Agency recognition:UL ◆Low-profileAlmost anywhere there is a low voltage power supply,up to 16V and a load to be protected,including:◆Computer mother board,B hub ◆PDAs &Charger,Analog &digital line card ◆Digital cameras,Disk drivers,CD-ROMs ◆USB peripherals ◆Power ports◆General electronicsPartNumberIhold (A)I trip (A)V max (Vdc)I max (A)P dtyp.(W)Maximum TimeTo Trip ResistanceCurrent (A)Time (Sec.)R min (Ω)R max (Ω)SMD0805-0100.100.30151000.500.50 1.50 1.000 6.000SMD0805-0200.200.5091000.508.000.020.650 3.500SMD0805-0350.350.7561000.508.000.100.250 1.200SMD0805-0500.50 1.0061000.508.000.100.1500.085SMD0805-0750.75 1.506400.608.000.200.0900.385SMD0805-1001.01.9561000.608.000.300.0600.230I hold =Hold current:maximum current device will pass without tripping in 25°C still air.I trip =Trip current:minimum current at which the device will trip in 25°C still air.V max =Maximum voltage device can withstand without damage at rated current (I max )I max =Maximum fault current device can withstand without damage at rated voltage (V max )P dtyp.=Power dissipated from device when in the tripped state at 25°C still air.R min =Minimum resistance of device in initial (un-soldered)state.R max =Maximum resistance of device in initial (un-soldered)state.R 1max =Maximum resistance of device at 25°C measured one hour after tripping.Caution:Operation beyond the specified rating may result in damage and possible arcing and flame.Part NumberAmbient Operation Temperature-40°C-20°C0°C25°C40°C 50°C 60°C 70°C 85°CHold Current (A)SMD0805-0100.140.120.110.10.80.70.60.50.3SMD0805-0200.280.250.230.200.170.140.120.100.07SMD0805-0350.470.440.390.350.300.270.240.200.14SMD0805-0500.680.620.550.500.400.370.330.290.23SMD0805-075 1.000.900.790.750.630.570.530.410.34SMD0805-1001.351.251.151.000.820.740.650.550.42A=SMD0805-010B=SMD0805-020C=SMD0805-035D=SMD0805-050E=SMD0805-075F=SMD0805-100Part MarkingXPart Identification1Example1= SMD0805-010 2= SMD0805-020 3= SMD0805-035 5= SMD0805-050 7= SMD0805-075 0= SMD0805-100Profile FeaturePb-Free Assembly Average Ramp-Up Rate (T S max to T P ) 3°C/second max. Preheat :Temperature Min (T S min) Temperature Max (T S max) Time (T S min to T S max) 150°C 200°C60-180 seconds Time maintained above: Temperature(TL) Time (tL)217°C60-150 seconds Peak/Classification Temperature(T P ): 260°C Time within 5°C of actual peak: Temperature20-40 seconds Ramp-down Rate:6°C/ second max. Time 25°C to Peak Temperature8 minutes max.Note: All temperatures refer to of the package, measured on the package body surface.Solder reflowDue to “Lead Free ” nature, Temperature and Dwelling time for the soldering zone is higher than those for Regular. This may cause damage to other components.1.Recommended max past thickness > 0.25mm.2.Devices can be cleaned using standard methods and aqueous solvent.3.Rework use standard industry practices.4.Storage Environment : < 30℃/ 60%RHCaution:1.If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.2.Devices are not designed to be wave soldered to the bottom side of the board.Soldering ParametersRamp-downPreheatCritical Zone T L to T PTime to peak temperature(t 25℃ to peak)T PT L T S(max)T S(min)25T e m p e r a t u r eRamp-upTimeA B C DeviceNominalNominal Nominal 0805 Series1.201.001.50The dimension in the table below provide the recommended pad layout for each SMD0805 devicePart Numbering Pa c k ag ingPad Layouts Unit: mmTerminal pad material Pure TinSoldering CharacteristicsMeets EIA specification RS 186-9E, ANSI/J-std-002 Category 3Material Specifications010SMD0805Product nameSMD ：surface mount deviceHold Current 0.10ATape & Reel Quantity5,000 pcs/reelABCDEPart NumberMin.Max. Min. Max. Min. Max. Min. Max. Min. Max. SMD0805-010 2.00 2.20 1.20 1.50 0.50 1.00 0.20 0.60 0.10 0.45 SMD0805-020 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-035 2.00 2.20 1.20 1.50 0.45 1.00 0.20 0.60 0.10 0.45 SMD0805-050 2.00 2.20 1.20 1.50 0.30 0.60 0.20 0.60 0.10 0.45 SMD0805-075 2.00 2.20 1.20 1.50 0.40 1.00 0.20 0.60 0.10 0.45 SMD0805-1002.002.201.201.500.501.100.200.600.100.45Dimensions Unit: mmu Operation beyond the specified maximum ratings or improper use may result in damage and possible electrical arcing and/or flame.u PPTC device are intended for occasional over-current protection. Application for repeated over-current condition and/or prolonged trip are not anticipated.uAvoid contact of PPTC device with chemical solvent. Prolonged contact will damage the device performance.WarningTape and Reel SpecificationsDirection of Feed0.33 (8.4)0.512(13.0)Arbor Hole Diameter7.0 (177.8)0.212 (5.4)0.157 (4.0) 0.059(1.5)Diameter Cover tape0.314 (8.0)0.157 (4.0)Dimensions are in inches(and millimeters)。