EMC EMI解决的终极有效方案,80通过。SSDCP1108AF

General Purpose Peak EMI reduction IC General Features• •• •• • •• • 1x, LVCMOS Peak EMI ReductionIncorporates the latest Timing-Safe technologywhich allows the spread of analog video signalInput frequency:1 0MHz - 35MHz @ 2.5V1 0MHz - 40MHz @ 3.3VOutput frequency :1 0MHz - 35MHz @ 2.5V1 0MHz - 40MHz @ 3.3VAnalog Deviation SelectionSpread Spectrum Enable/DisableSupply Voltage: 2.5V±0.2V3.3V±0.3V8pin TDFN(2X2) COL PackagesCommercial temperature rangeDC coupled to XIN/CLKIN) and locks on to it delivering a 1xmodulated clock output. SSDCP1108AF has a SSON pin forenabling and disabling Timing-SafeʳSpread Spectrumfunction.SSDCP1108AF has an SSEXTR pin to select differentdeviations depending upon the value of an external resistorconnected between SSEXTR and GND. Charge Pump (CP)control selects one of the two different ChargePumpcurrent settings.SSDCP1108AF operates from a 3.3V/2.5V supply, and isavailable in an 8 pin TDFN(2X2) COLpackages, over Commercial temperature range.Functional DescriptionSSDCP1108AF is a versatile, 3.3V/2.5V Peak EMI reduction IC. SSDCP1108AF accepts an input clock either from a fundamental Crystal or from an external reference (AC or •ApplicationSSDCP1108AF is targeted for consumer electronicsapplication such as MFP, STB, DSC, MID,HDMI,LCD panel Camcorder,and other timing sensitive analog video imaging applications •Applications of HDMI, RJ45 port has good compatibilityBlock DiagramVDDSSON CPXIN/CLKINXOUTCrystalOscillatorPLL ModOUTSSEXTRGNDPin ConfigurationXIN / CLKIN 1XOUT 2SSON 38 VDDSSEXTRCPModOUT7 SSDCP1108AFSSDCP1108A6GND 4 5 Pin DescriptionPin #12345678 Pin NameXIN / CLKINXOUTSSONGNDModOUTCPSSEXTRVDDPin TypeIOIPOIIPDescriptionCrystal connection or External reference clock input.Crystal connection. If using an external reference, this pin should be left open.Spread Spectrum ON/OFF. Spread Spectrum function enabled when HIGH, disabledwhen LOW. Has an internal pull-up resistor inside.GroundModulated clock outputCharge Pump current Select. When LOW selects Low CP current. Selects High CPcurrent when pulled HIGH. Has an internal pull-up resistor inside.Analog Deviation Selection through external resistor to GND.2.5V /3.3V supply Voltage.Frequency Selection tableVDD (V)2.53.3 Frequency (MHz)15-3515-40Operating ConditionsParameterVDDTACLCINDescriptionSupply VoltageOperating Temperature (Ambient Temperature)Load CapacitanceInput CapacitanceMin2.3Max3.6+70107UnitV°CpFpFAbsolute Maximum RatingSymbolVDD, V INT STG T s T JT DVParameterVoltage on any input pin with respect to GroundStorage temperatureMax. Soldering Temperature (10 sec) Junction TemperatureStatic Discharge Voltage (As per JEDEC STD22- A114-B)Rating-0.5 to +4.6 -65 to +125260 150 2Unit V°C °C °C KVNote: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affectdevice reliability.DC Electrical Characteristics for 2.5V ParameterVDD V IL V IH I IL I IH V OL V OH I CC I DDZ oDescriptionSupply Voltage Input LOW Voltage Input HIGH Voltage Input LOW Current Input HIGH Current Output LOW Voltage Output HIGH Voltage Static Supply Current Dynamic Supply Current Output ImpedanceTest Conditions Min2.3Typ2.5Max2.7 0.71.7V IN V INI OL I OH= 0V= V DD = 8mA = -8mA25 25 0.61.8XIN / CLKIN pulled low Unloaded Output50 1235UnitV V VµA µA V V µA mASwitching Characteristics for 2.5VParameterInput Frequency* / ModoUT 1, 2Duty CycleTest Conditions 1, 2 Output Rise Time 1,2Output Fall Time2Cycle-to-Cycle Jitter 2PLL Lock TimeMeasured at V DD /2Measured between 20% to 80% Measured between 80% to 20%Unloaded output with SSEXTR OPEN @ 27MHz Stable power supply, valid clock presented on XIN / CLKINMin1045Typ 50Max3555 2.2 2±1753UnitMHz% nS nS pSmSNote: 1. All parameters are specified with 10pF loaded outputs.2. Parameter is guaranteed by design and characterization. Not 100% tested in production* Functionality with Crystal is guaranteed by design and characterization. Not 100% tested in production.DC Electrical Characteristics for 3.3V ParameterVDD V IL V IH I IL I IH V OL V OH I CC I DDZ oDescriptionSupply Voltage Input LOW Voltage Input HIGH Voltage Input LOW Current Input HIGH Current Output LOW Voltage Output HIGH Voltage Static Supply CurrentDynamic Supply CurrentOutput ImpedanceTest Conditions Min3.0Typ3.3Max3.6 0.82.0V IN V INI OL I OH= 0V= V DD= 8mA = -8mA 25 25 0.42.4XIN / CLKIN pulled lowUnloaded Output501630UnitV V VµA µA V VµAmASwitching Characteristics for 3.3VParameterInput Frequency* / ModOUT 3, 4Duty CycleTest Conditions 3, 4 Output Rise Time 3, 4Output Fall Time4Cycle-to-Cycle Jitter 4PLL Lock TimeMeasured at V DD /2Measured between 20% to 80% Measured between 80% to 20%Unloaded output with SSEXTR OPEN @ 27MHz Stable power supply, valid clock presented on XIN / CLKINMin1045Typ 50Max4055 1.8 1.6±1503UnitMHz% nS nS pSmSNote: 3. All parameters are specified with10pF loaded outputs.4. Parameter is guaranteed by design and characterization. Not 100% tested in production.* Functionality with Crystal is guaranteed by design and characterization. Not 100% tested in production.Typical Crystal SpecificationsFundamental AT cut parallel resonant crystal Nominal frequency Frequency tolerance Operating temperature range Storage temperatureLoad capacitance(C P ) Shunt capacitance ESR27MHz± 50 ppm or better at 25°C 0°C to +70°C -40°C to +85°C 18pF7pF maximum 25Note: C L is the Load Capacitance and Rx is used to prevent oscillations at overtone frequency of the Fundamental frequency.Typical Crystal Interface CircuitSSDCP1108ARXIN/CLKINCrystalXOUTRxC LC LC L = 2*(C P - C S ),Where C P = Load capacitance of crystal from crystal vendor datasheetC S = Stray capacitance due to C IN, PCB, Trace etc.Switching WaveformsDuty Cycle Timingt 1t 2V DD /2V DD /2 V DD /2OUTPUTOutput Rise/Fall Time80%20%80%20%OUTPUTt 3t 4Application SchematicC L is the load capacitance for proper XTAL operation1 C LSSDCP1108AFXIN/CLKINVDD 8Noise Reduction FilterRCVDDExternal Deviation ControlVDDR1XOUTVDD2 SSEXTR7Analog Deviation Control SSEXTR can be Pulled HIGH to turn OFF Deviation3 SSONCP 6SSON ControlCP Control4 GNDModOUT 5Note: SSON (Pin#3) CP (Pin#6): Connect to VDD or GNDRefer to Pin Description table for Functionality detailsNote: For AC Coupled Interface refer to Application Brief: CT100801Deviation Vs SSEXTR resistance Charts at 27MHzDeviation Vs SSEXTR Resistance @ 27MHz2.5CP=1MR=12.0 1.51.00.50.050 100 150 200 250 300 350 400 450 500 550 600650Resistance(K _))% ± ( n o i t a i v e DDeviation Vs SSEXTR Resistance @ 27MHz2.5CP=0MR=0 2.01.51.00.50.00 50 100 150Resistance(K_) 200 250 300) %±( n o i t a i v e DTDFN COL 2x2 8L package Outline drawingSymbol InchesMin0.027 DimensionsMillimetersA A3 b D E e LMax0.0315Min0.700.008 BSC0.0080.0120.079 BSC0.078 BSC0.020 BSC0.0200.0240.200.50Max0.800.203 BSC0.302.00 BSC2.00 BSC0.50 BSC0.60SSDCP1108AF Spectrum DeviceOrdering CodePart Number SSDCP1108AF-08-CR MarkingDAPackage8- pin 2-mm TDFN COL - TAPE & REEL, GreenTemperature0 °C to +70 °CDevice Ordering InformationS S D C P 1 1 0 8 A F - 08 - CRR = Tape & Reel, T = Tube or TrayO = TSOT23S = SOICT = TSSOPA = SSOPV = TVSOPB = BGAQ = QFNU = MSOPE = TQFPL = LQFPU = MSOPP = PDIPD = QSOPX = SC-70J=TSOT26C=TDFN (2X2) COLDEVICE PIN COUNTF = LEAD FREE AND RoHS COMPLIANT PARTG = GREEN PACKAGE, LEAD FREE, and RoHSPART NUMBERI= Industrial(-40 °C to +85 °C )A = Clock GeneratorB = Non PLL basedC = EMI ReductionD = DDR support productsE = STD Zero Delay BufferP or n/c = Commercial(0 °C to +70 )°CF = Power ManagementG = Power ManagementH = Power ManagementIJ= Hi Performance= ReservedSpread Spectrum Device CO.,LTDCopyright All rights reserved by Spread Spectrum Device Part Number:SSDCP1108AFDocument Version:0.22。