工厂英文知识缩写

英文经典知识缩写AF Acceleration factorALT Accelerated life testANOVA Analysis of VarianceAOQL Average Outgoing Quality LevelAPO Auto Power OffAPQP Advanced Product Quality Planning and Control Plan ARE Area OptionsASIC Application Specific Integrated CircuitASSP Application Specific Standard PartATE Automatic test equipmentATO Assembly To OrderAVL RFQ IMPUT CHECKLIST里面用到BAC BackupBCI Bulk current injectionBD Business DeveloperBFR Batch Failure Ratebo BochumBOM Bill of MaterialBU Business Unitc acceptance level (= number of failed components accepted) CBD Cost Break DownCDM Contract Design ManufacturerCDM Charge Device Model –discharge typeCDM Original Design done by Partner specifically to support NokiaCDN Coupling and Decoupling Network.CE Concurrent EngineeringCE Concurrent Engineering (used for product development) CE. E0...E5 Concurrent Engineering (CE) Product Program MilestonesCEM Contract Electronic ManufacturerCER. FILTERS, MONOBL. DUPLEXERS Powder mixing, Block pressing, FiringCI Capacity ImplementationCIM Custom In MouldCLUSTER Group of companies, head by one Cluster leader CM Cost ManagementCMO Customer & Market Operationsco CopenhagenCOC Certificate of complianceCOO Country of OriginCp, Cpk Process Capability indicesCpk Capability IndexCPL Cost Part listCQE Component Quality EngineerCQP Component Quality PlanningCQS Component Quality SpecialistCR Change RequestCRR Component review reportCRYSTALS Crystal wafer manufacturingCSA Current State AnalysisCSMC-TPAT Customs-Trade Partners Against TerrorismCTS Cost Target SettingD Draft, first version of the documentda DallasDC DirectDC Direct CurrentDCN Design change noticeDES Deselect allDFA Design For AssemblyDFBA Design for Board AssemblyDFDS Design for Demand SupplyDfE Design for EnvironmentDFFA Design for Final AssemblyDFM Design For Manufacturing (includes DFPT, DFBA, DFFA) DFMEA Design Failure Mode and Effects AnalysisDFPT Design for Production TestDGDI-EL. DUPLEXERS Resonator preparingDIR Design Improvement ReportsDocMan Type of Lotus Notes database (for documents) DOE Design Of ExperimentDOE Design Of ExperimentDPM Defects Per MillionDSB Demand Supply BalanceDSN Demand Supplier NetworkDUT Device Under TestDV Demand VolumeDVRE0...E5 Concurrent Engineering (CE) MilestonesE0..E5 Concurrent engineering (CE) milestonesECN Engineering Change NoticeEFR Early Failure RateELMECH Electro MechanicalEMC Electro Magnetic CompatibilityEMI Electro Magnetic InterferenceEMS Environmental Management Sys-temEN European NormEoL End of LifeEPA ESD protected areaERPes EspooESD Electrostatic dischargeESDS Electrostatic discharge sensitive deviceESI Early Supplier InvolvementETA Estimate to be arriveEUT Equipment Under TestEV Enclosed volumeEVM Enhancements Version ManagementF Final, document to be archivedFA Failure AnalysisFAC Fully anechoic chamberFAQ Frequently Asked QuestionsFAI First article inspectionFEM Finite Element ModellingFFR Field Failure RateFIL Filter..FIML Fabric Inmold Labeling, same with CIM Custom In Mould FIT Failures in TimeFMEA Failure Mode and Effect AnalysisFORFOT 第一次试模FR Failure RateG.A. General AssemblyGauge R&R Gauge Repeatability and Reproducibility GCPMGD&T Geometrical Dimensioning & TolerancesGRP ground reference planeGRR Gauge Repeatability and ReproducibilityHBM Human Body ModelHBM Human Body Model –discharge typeHCP horizontal coupling planeHIGH Highlight selectedhk Hong KongHUB Warehousing and Shipping functionality locationICDR Integrated Circuit Design ReviewsICDR IC Design ReviewID Industrial DesignIFR Intrinsic Failure RateIMD Insert Mold DecorationIME Inject Mold EquipmentIML Insert Mold LabelingIML IN MOLD LABELINGIPQC In Process Quality ControlIPR Intellectual Property RightsISO International Standardization Organization jk JyväskyläJR&D Joint Research and developmentKCR Key Component ReviewKO Kick OffLA License Agreementla Los AngelesLAB LabelLCL Lower Control LimitLL Lesson LearnedLRVP Long Range Volume PlanLSL Lower Specification LimitLSSE Light SW Subcontractor EvaluationM&O Mechanics & OutsourcingM/C machineM3 Global quality databaseMAR Mechanics Acceptance ReportMAR’s Mechanical Acceptance Report’s MatCoMaMC Measuring CentreMD Mechanics DesginMDF Material Data FormMDFs material data formsME Manufacturing EngineerMECH MechanicsMFI Melt flow indexMISMM Machine Model –discharge typeMOR Monthly Operation ReviewMOSS Visual Quality Criteria’s procedureMPL Material Project LeaderMPL / M Material Project Leader / Manager MPL/MPM Material Project Leader/ ManagerMPM Material Project ManagerMR Measurements ReportMRPⅡMS Manufacturing SolutionsMS MilestoneMSA Measurement System AnalysisMSID Moisture-Sensitive IdentificationMSM Mechnical Supplier ManagementMSM Mechanics Sourcing ManagerMTO Make TO OrderMTS Mechanical Technology SourcingMULTIL.PRODUCTS Ceramic powder manuf, Sheet forming, Cutting, Printing, FiringNC non connectNCTNDA Non Disclosure AgreementNET Nokia NetworksNET NetworksNGP Nokia Global ProcessesNGS Nokia Global StandardsNGSW Nokia Global Supplier WebNMP Nokia Mobile Phones LtdNOSS Nokia Supplier Status databaseNPI Nokia Product IntegrationNPI New Product IntroductionNPSQS Nokia Part Specific Quality StandardsNRT Nokia Rapid ToolingNSL Nokia Substance ListNSM Nokia Supplier ManualNSR Nokia Supplier RequirementNTP Normal temperature and pressure, see laboratory environmentOAP Original Accessory PartnerOCAP Out-of-Control Action PlanOCV Open Circuit VoltageODM Original Design ManufacturerODM Original Design done by Partner independently OEM Original Equipment ManufactureOEM Original Design done by NokiaOPL Operations Project LeaderOQC Outgoing Quality ControlORS Operating Resource SourcingOT Over timeOTD On time deliveryou OuluPA Process AssessmentPA Product AgreementPC Product CreationPC PolycarbonatePCBAPCN Process Change NoticePCNs product change notification casesPCQE Program Component Quality EngineerPCQM Program Component Quality ManagerPD Product DeliveryPDM Product Development ManagerPDM Product Data ManagementPDM Product Data Management SystemPDT Project Development TeamPE Product Engineering (used for product in mass production)PFMEA Process Failure Mode and Effect AnalysisPGP Pretty Good PrivacyPI Product ImplementationPIRPLM Product Line ManagementPLP Product Lifetime ProfitabilityPLRM Program Loading Road mapPM Product ManagerPM Purchasing ManagerPM Project ManagerPM/MP Partner Manufacturing/Manufacturing Partner PMA Project Manager AssistantPMCPMM Program Portfolio ManagementPMT Project Management TeamPO Purchasing OrderPOKA-YOKE Mistake ProofingPOP Package Operation ProcedurePop-Port System connector in NOKIA mobile devices POWER AMPS MMIC and/or IC manufacturingPp, Ppk Process Performance IndicesPPA Product Purchase AgreementPPAP Production Part Approval ProcessPPM Product Program Managerppm Parts per millionPQ Process QualificationPQGFP Package qualification guideline for programs PQM Program Quality ManagerPQP Program Quality PlanPQP Package Qualification ProcedurePR1/2PTO Package TO OrderPV Product ValidationPVD Physical Vapor DepositionPWB Printed Wire BoardQA quality assurenQBR Quarterly Business ReviewQC quality controlQE Quality EngineerQFD Quality Function DeploymentQM quality managementQSR Quality System RequirementQTE Quality Technician EngineerQTE Quality and Technology EngineerQTE / QTM Quality Technology Engineer / ManagerQTE / QTM Quality Technology Engineer / ManagerQTM Quality and Technology ManagerQTY QuantityR&D Research and DevelopmentR&R Roles and ResponsibilitiesR&T Research and TechnologyRAM Random Access MemoryRamp Up/SAREC ReconsiderREL Related toRFP Request For ProposalRFQ Request For QuotationRIPS Recently Introduced Product SupportRMA Return Material AuthorizationSASAC semi anechoic chamberSAW /BAW FILTERS, SAW DUPLEXERS Die wafer manufacturing SCP Service Channel PreparationSEM Scanning Electron MicroscopeSG Save as groupSHO Showsi SingaporeSIDSIP Standard Inspection ProcedureSLI Supply Line Implementation processSLM Supply Line ManagementSLP Supply Line Preparation processSO Solution OfferingSOP Standard Operation ProcedureSOW statement of workSPC Statistical Process ControlSPPM Senior Product Program ManagerSPR Standard Product Requirement (Nokia)SQA Supplier Quality AssuranceSQC statistical quality controlSQE Supply Quality EngineerSQM Supply Quality Managerss sample sizeSTA Short Term AvailabilitySVP Senior Vice PresidentSW Softwaresy SydneyTCRM Technology Competence RoadmapTEC Technology Platformto TokyoTP Technology PlatformTPETPR Technical Product RequirementTPUtre TampereU Update, all updated documents that are not final U/I Voltage / CurrentU/I Voltage / CurrentUCL Upper Control LimitUG Use groupUI User Interfaceul Ulmvc Vancouver¨VCO IC manufacturing (discrete transistors, other ICs) VCTCXO Crystal wafer and IC (LSI-VCTCXO) manufacturing VIS VisibleVPQCT Volume Production Quality Control TestVQD Visual Quality EngineerVQE Visual Quality EngineerVQR Visual Quality RequirementsWBS Work Breakdown Structure。