和伸堂电容规格书

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插件电容规格型号对照表

插件电容规格型号对照表插件电容是一种常用的电子元件，用于存储和释放电荷以及滤波等电路应用。

在电子设备的设计和维修中，选择合适的插件电容非常重要。

为了帮助大家更好地了解不同型号的插件电容，本文将提供一个插件电容规格型号对照表，以便大家在实际应用中能够准确选择合适的插件电容。

一、对照表以下是一个插件电容规格型号对照表，包含了常用的插件电容型号及其规格参数：型号容量（μF）电压（V）尺寸（mm）电极间距（mm）C1 1 50 6.3x11 2.5C2 2.2 50 7.3x13 2.5C3 4.7 50 7.3x13 2.5C4 10 50 9x15 5C5 22 50 11x19 5C6 47 50 13x21 5C7 100 50 16x25 7.5二、插件电容规格解读1. 容量（μF）：容量是指插件电容可以存储的电荷量，单位为微法（μF）。

容量越大，插件电容可以存储的电荷量越多。

2. 电压（V）：电压是插件电容可以承受的最大电压，单位为伏特（V）。

超过额定电压会导致插件电容损坏或发生故障，因此选择合适的电压等级非常重要。

3. 尺寸（mm）：尺寸是指插件电容的外形尺寸，单位为毫米（mm）。

在实际应用中，需要根据电路板和元器件的尺寸要求来选择合适的插件电容。

4. 电极间距（mm）：电极间距是指插件电容两个电极之间的距离，单位为毫米（mm）。

电极间距需要与电路板上的焊盘尺寸相匹配，以确保插件电容可以正确焊接在电路板上。

三、插件电容的选择和应用在实际应用中，选择合适的插件电容需要考虑以下几个因素：1. 容量选择：根据电路设计的要求，选择合适的容量。

如果需要存储大量的电荷，可以选择较大容量的插件电容。

2. 电压等级：根据电路的工作电压，选择符合要求的电压等级。

如果电压超过插件电容的额定电压，会导致插件电容损坏或发生故障。

3. 尺寸匹配：根据电路板和元器件的尺寸要求，选择合适尺寸的插件电容。

尺寸太大或太小都会导致插件电容无法正确安装在电路板上。

禾伸堂HEC贴片电容型号规格080、120六、1210、180八、181二、2220等系列简介

简介
随着电子产品制造水平的提升和系统性能需求愈来愈苛刻，系统厂商的工程师和采购人员对电容器的性能提出了新的要求。

在工业、电源等应用中，系统厂商对高容量、低ESR、小体积的电容器的需求加倍迫切，而在汽车、军工和航空航天等应用中，那么对电容器寿命、耐压、靠得住性等提出了更高的要求。

禾伸堂 HEC 推出的中高压系列产品迎合了市场需求，知足了不断提出来的新要求。

那么很多人就会问，禾伸堂 HEC贴片
电容的型号规格？下面小编就来帮忙大伙儿回答禾伸堂 HEC贴片电容的型号规格?
们向您推荐深圳市兴鸿宇科技，该公司作为电子元器件专业代理和分销商，技术支持，售后效劳是他们在市
场中立于不败之地的有力保证。

必然会给您在产品分类、信息、参数方面以科学准确的信息，为您的购买提
供专门大帮忙。

三星电容规格书

三星电容规格书三星电容规格书是指描述三星电容器性能、特征和使用方法的文档。

该文档的目的是为用户提供关于使用和选择三星电容器的详细信息。

以下是一些常见的参考内容，包括电容器的基本概念、规格、参数、应用建议等。

1. 电容器的基本概念：电容器是一种能够存储电能的被动元件，由两个导体板（电极）和介质组成。

介质可以是电解质、陶瓷、聚合物等。

电容器的主要功能是存储、释放电荷以及滤波和耦合。

2. 电容器的规格说明：规格说明包括电容器的容量、额定电压、尺寸、温度特性等。

容量是电容器存储电荷的能力，通常以法拉(F)为单位。

额定电压是电容器能够承受的最大电压，过高的电压可能导致电容器损坏。

尺寸是指电容器的外观尺寸，通常以长度、宽度和高度表示。

温度特性是指电容器在不同温度下的电容值变化情况。

3. 电容器的参数：电容器的参数包括ESR（等效串联电阻）、ESL（等效串联电感）、Q值、ES（等效串联电阻）、DF（损耗因子）等。

ESR是电容器在交流电路中的等效串联电阻，通常以欧姆(Ω)为单位。

ESL是电容器电极之间的等效串联电感，通常以纳亨(νH)为单位。

Q值是电容器的品质因数，表示其内部损耗的程度。

ES是电容器的等效串联电阻，通常用于表示电容器的交流特性。

DF是电容器的损耗因子，表示电容器内部的能量损耗。

4. 电容器的应用建议：电容器广泛应用于各种电子设备和电路中，如电源管理、通信设备、储存器、调光器、电动机驱动器等。

对于不同的应用场景，选择合适的电容器非常重要。

一般来说，对于高频应用，陶瓷电容器是一个不错的选择；对于高容量和高温度应用，聚合物电容器是一个不错的选择；对于高电压和高频应用，铝电解电容器是一个不错的选择。

以上是关于三星电容器规格书的一些参考内容。

根据具体的产品型号和应用需求，还会有更多详细的规格和参数说明。

在选择和使用电容器时，用户应该仔细阅读和理解规格书，以确保正确选择和合理使用电容器，从而提高电路的性能和可靠性。

台湾CCT承认书,CCT电容规格书

承認書APPROVAL SHEET零件名稱：積層陶瓷電容Description ：Multi-Layer Chip CapacitorDATE ：20020099/1201深圳市宸远科电子有限公司ChipCera Technology CO.,LTD 深圳市宝安区银田工业区A9栋厂房TEL ：+86-7+86-7555555--29120592FAX ：+86-7+86-7555555--29120593Reference No.：PD0PD091201912019120100000011Customer Customer::宸遠科技料號CCT Part Numbers客戶料號Customer Customer’’s Part Numbers 宸遠科技ChipCera Technology Co.,LTD 客戶承認Customer Customer’’s Approval 製表Prepared by 審查Checked by 核准Approved byEngineer QA Manager Vice G.M.Tolerance Capacitance for dielectricA=±0.05pF B=±0.10pF C=±0.25pF D=±0.50pF F=±1.0% G=±2.0% J=±5.0% K=±10% M=±20%NP0X7R X5R Y5V 10pF and below More than10pF100pF~1μF(101~105)1uf~100uf(105~107)10nF~10uF(103~106) B,C,D G,J J,K,M K,M M,ZProduct dimensions in mm.X7R SeriesX7R/X5R SeriesY5V Series7Resistance tosoldering heatPreheat the capacitor at120℃to150℃for1minute.Immerse the capacitor in an eutectic soldersolution at270270±±5℃for1010±±1seconds.After set it atroom temperature for2424±±2hours(temperaturecompensation type)or4848±±4hours(high dielectricconstant type),then measure.*High dielectric constant type:Initial measurement of X7RX7R/X5R/X5R and Y5V.Perform a heat treatment at150150±±5℃for one hourand then set it at room temperature for4848±±4hours.Perform the initial measurement.Dielectric NP0X7RX7R//X5RY5VAppearance No defectCapacitanceChange＜±2.5%or＜±0.25pF±7.5%±20%DF The same as No.2IRMore than500500ΩΩ-F(whichever is smaller)DielectricStrengthNo failure8Resistance toleachingThe capacitors are dipped into the solder at260260±±5℃for3030±±1seconds,and then check the solderingby measuring the areas covered with solder.95%of the terminations are to be soldered evenly andcontinuously.9Solder ability ofterminationZero hour test,and test after storage(20to24months)in original atmosphere in normalatmosphere;un-mounted chips completelyimmersed for2±0.5s in a solder bath of235±5℃.95%of the termination is to be soldered evenly andcontinuously.10Rapid change oftemperatureNPO/X7R:-55℃to+125℃,5cycleX5R:-55℃to+85℃,5cycleY5V:-25℃to+85℃,5cycleDuration:30mins.Recovery:24±2hrs.No visible damage after24h recoveryClass I NPO:∆C/C≤2.5%or±0.25pFClassⅡX7RX7R/X5R/X5R/X5R::∆C/C≤±15%Y5V:∆C/C≤±20%11Damp heat,steadystate500±12hours at40±2℃;90to95%RHNo visible damage after24±2(NPO)or48±4hoursrecoveryClassⅠ(NPO)1.∆C/C±5%or1pF,whichever is greater2.C<10pF；Q≥200+10C10≤C≤30pF；Q≥275+5/2CC>30pF；Q≥3503.IR≥4000MΩorRiCR≥4040ΩΩF,whichever is lessClassⅡ(X7R(X7R/X5R/X5R/X5R))1.∆C/C within±15%2.2.tantanδ≤7%3.3.R R≥2000MΩorRiCR≥5050ΩΩF,whichever is lessClassⅡ(Y5V)1.∆C/C within±30%2.50/25V:tanδ≤9%16V:tanδ≤12.5%10V:tanδ≤15%3.IR≥2000MΩorRiCR≥5050ΩΩF,whichever is less12Endurance 1000h at maximum temperatureVr(rated voltage)≤250VAt2×V rVr(rated voltage)=500VAt1.5VrVr(rated voltage)>500VAt1.2VrC>0..1UF,At1.5VrNo visible damage after24±2(NPO)or48±4hoursrecoveryClass1(NPO)1.∆C/C±2%or1pF,whichever is greater2.tanδ≤2x specified value3.IR≥4000MΩor RiCR≥4040ΩΩF,whichever is lessClass2(X7R(X7R/X5R/X5R/X5R))1.∆C/C within±15%2.tanδ≤7%3.IR≥2000MΩor RiCR≥5050ΩΩF,whichever is lessClass2(Y5V)1.∆C/C within±30%2.50/25V:tanδ≤9%16V:tanδ≤12.5%3.IR≥2000MΩor RiCR≥5050ΩΩF,whichever is lessAll dimensions in mmSize SymbolABPLT(Paper)T(Embossed)04020.62±0.05 1.12±0.05 2.00±0.058.00±0.200.60±0.05N/A 0603 1.10±0.10 1.90±0.10 4.00±0.108.00±0.20 1.00±0.05N/A 0805 1.65±0.05 2.40±0.05 4.00±0.108.00±0.20 1.00±0.05N/A 1206 2.00±0.10 3.50±0.10 4.00±0.108.00±0.20 1.00±0.05Max.2.01210 2.80±0.20 3.70±0.20 4.00±0.108.00±0.20N/A Max.2.01808 2.50±0.30 4.90±0.30 4.00±0.1012.0±0.20N/A Max.2.518123.60±0.304.90±0.308.00±0.1012.0±0.20N/AMax.2.5Paper Tape T ≦1.1mmEmbossed Tape T ≦2.60mm8.4+1.5/-0 All dimensions in mm6.1Capacitor ClassificationMulti-layer ceramic capacitors are available in wide range of characteristics.Electronic Industries Association (EIA)and the military have established categories to help divide the basic characteristics into more easily specified classes.The basic indu industrystry specification for ceramic capacitor is EIA specification RS-198and as noted in the general section,it specifies temperature-compensating capacitors as class I capacitors.These are specified by the military under specification MIL-C-20.General-pur General-purposepose capacitors with non-linear temperature coefficients are called Class II capacitors by EIA and specified by military under MIL-C-11015and MIL-C-39014.The new high reliability military specification,MIL-C-123covers both class Iand class II dielect dielectrics.rics.Class I —Class I capacitors or temperature-compensating capacitors are usually made from mixtures of titanates where barium titanate is normally not a major part of mix.They have predictable temperature coefficients and in general,do not have an aging characteristic.Thus they are the most stable capacitor available.Normally the T.C.s of Class I temperature-compensating capacitors are NP0(±30ppm/℃).Class II —General-purpose ceramic capacitors are called Class II capacitors and have become extremely popular because of the high capacitance values available in very small size.These capacitors are ferroelectrics and vary in capacitance value under the influence of the environmental and electrical operating conditions.Class II capacitors are affected by temperature 、voltage 、frequency and time.Temperature effects for Class II ceramic capacitors are exhibited as non-linear capacitancechanges with tem temperature.perature.Industry standards for Mid-K dielectrics,such as X7R X7R/X5R /X5R and High-K dielectrics,such as Z5U Z5U..6.2The Characterization of MaterialsThe T.C curve of each material (for reference)DesignationClass Temperature Range (℃)Temp.Characteristics NPO(COG)I -55~+125±30ppm/℃X7RII -55~+125±15%X5RII -55~+85±15%Y5V II -25~+85-82~+22%6.3Recommend IR reflow and wave solderng profile(Pb-Free)Typical profile band of IR reflow Typical profile band of wave soldering。

国巨电容规格书

国巨电容规格书一、引言电容器是一种能够储存电荷的被动元件，被广泛应用于电子设备中。

国巨电容是一家专业生产电容器的公司，其规格书是对其产品性能和技术参数的详细描述。

本文将对国巨电容规格书进行全面、详细、完整地探讨。

二、国巨电容规格书的作用和重要性规格书是产品的技术文件，对于制造商和用户来说都具有重要的作用。

国巨电容规格书的编写可以帮助用户了解产品的性能指标、使用条件和注意事项，以便正确选择和使用电容器。

对于制造商来说，规格书可以作为产品质量的保证和技术交流的依据。

三、国巨电容规格书的内容和结构国巨电容规格书通常包括以下内容：1. 产品型号和命名规则国巨电容规格书中会列出不同型号电容器的命名规则和对应的产品型号。

这有助于用户准确地选择所需的电容器。

2. 产品性能参数国巨电容规格书会详细列出电容器的各项性能参数，包括额定电容量、额定电压、容差、工作温度范围等。

这些参数直接影响着电容器的使用性能，用户可以根据自己的需求来选择合适的产品。

3. 产品尺寸和外观国巨电容规格书中会给出电容器的尺寸和外观描述，包括长度、宽度、高度、引线形式等。

这些信息对于用户来说很重要，可以帮助用户确定电容器的安装方式和空间要求。

4. 产品使用条件和注意事项国巨电容规格书会给出电容器的使用条件和注意事项，包括工作电压范围、存储温度范围、使用寿命等。

用户在使用电容器时需要遵守这些条件和注意事项，以确保产品的正常运行和使用寿命。

四、国巨电容规格书的编写要求和技巧编写国巨电容规格书需要遵循一定的要求和技巧，以确保规格书的准确性和易读性。

1. 准确性规格书应准确地描述电容器的性能参数和技术指标，避免出现错误和模糊的表述。

制造商应通过严格的测试和检验来确保规格书的准确性。

2. 清晰性规格书应使用清晰简明的语言，避免使用专业术语和复杂的句子结构。

制造商应考虑到用户的理解能力，尽量以用户为导向来编写规格书。

3. 完整性规格书应包含电容器的所有重要信息，避免遗漏关键参数和注意事项。

各品牌贴片电容规格资料汇总

各品牌贴片电容规格资料汇总贴片电容是一种常见的电子元器件，被广泛用于电路设计和生产中。

它们具有小巧的尺寸、稳定性好以及较低的成本。

各品牌贴片电容的规格资料是电子行业从业人员日常工作所必需的信息之一、本文将汇总一些知名品牌的贴片电容规格资料，供读者参考。

1. Murata（村田）Murata是一家日本电子元器件制造企业，也是全球最大的陶瓷电容制造商之一、以下为Murata的一些常用贴片电容规格资料：-容量范围：从0.1pF到100μF-额定电压范围：从4V到100V-外观尺寸：包括0201、0402、0603、0805、1206、1210、1808、1812等常见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、NPO等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等2. Samsung（三星）三星是一家韩国综合电子企业，也是全球最大的半导体制造商之一、以下为三星的一些常用贴片电容规格资料：-容量范围：从0.5pF到22μF-额定电压范围：从4V到100V见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X8S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等3.TDK（TDK公司）TDK是一家日本电子元器件制造企业，也是全球最大的磁性元件制造商之一、以下为TDK的一些常用贴片电容规格资料：-容量范围：从0.1pF到220μF-额定电压范围：从4V到100V-外观尺寸：包括0201、0402、0603、0805、1206、1210、1812等常见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X7S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等4. Yageo（圆石）圆石是一家台湾电子元器件制造企业，也是全球最大的无源元件制造商之一、以下为圆石的一些常用贴片电容规格资料：-容量范围：从0.1pF到2.2μF-额定电压范围：从4V到100V见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X7S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等5.AVX（AECOM公司）AVX是一家美国电子元器件制造企业，也是全球领先的陶瓷电容制造商之一、以下为AVX的一些常用贴片电容规格资料：-容量范围：从0.1pF到47μF-额定电压范围：从6.3V到100V-外观尺寸：包括0201、0402、0603、0805、1206、1210、1808、1812等常见尺寸-允许偏差：±0.1pF到±20%不等-温度系数：X7R、X5R、X6S、X7S等不同温度系数可选-特殊系列：如高温型、高电压型、耐震性、防激波等以上仅为一些知名品牌贴片电容规格资料的简要汇总，实际应用中还需要根据具体的设计要求、电路需求以及可用的供应商和库存情况选择最合适的贴片电容。

固态电容规格书

固态电容规格书引言固态电容是一种新型电子元件，它采用固态电解质代替了传统电解电容中的液体电解质，具有体积小、容量大、工作稳定等特点。

本规格书旨在介绍固态电容的基本规格和性能参数，以便用户了解和选择合适的固态电容。

基本规格尺寸固态电容的尺寸主要包括长度、宽度和高度三个方向的尺寸。

常见的固态电容尺寸有1210、1812、2010等规格，分别代表长度和宽度的尺寸值。

焊盘布局固态电容的焊盘布局是指电容器两端的焊盘形状和布局方式。

常见的焊盘布局有直接插装式（DIP）、贴片式（SMD）等。

使用DIP焊盘布局的固态电容可以直接插入电路板中的插槽中，而SMD焊盘布局的固态电容则需要使用热风枪或回流焊接设备焊接在电路板表面。

额定电压固态电容的额定电压是指其能够承受的最高电压值。

一般来说，固态电容的额定电压应大于等于电路中的工作电压，以保证其正常工作和稳定性。

容量范围固态电容的容量范围是指其可以存储的电荷量的大小范围。

常见的容量范围有1μF、10μF、100μF等，分别代表微法、毫法和微法的单位。

性能参数电压漏泄电压漏泄是指固态电容长时间存储电荷后，电容器本身逐渐失去电荷的能力。

电压漏泄率是衡量电容器损耗的指标，单位为％/天。

一般来说，电压漏泄率越小，电容器的性能越稳定。

介电强度介电强度是指固态电容在一定的电场作用下能够承受的最高电压值。

介电强度是固态电容的一个重要参数，可以衡量其耐受电场应力的能力。

工作温度范围工作温度范围是指固态电容正常工作的环境温度范围。

一般来说，固态电容具有较宽的工作温度范围，可以适应不同工作环境下的温度变化。

寿命固态电容的寿命是指其工作可靠的时间。

寿命与电容器的结构和制造工艺有关，一般来说，寿命越长，电容器的使用寿命就越长。

安装和使用注意事项1.安装固态电容时，请注意正确连接其正负极，避免错误连接导致损坏或火灾。

2.在焊接固态电容时，应控制焊接温度和焊接时间，避免过高温度和过长时间造成电容器性能下降。

固态电容产品规格书

日期:2012年07月16日Date: JUL 16 2012东莞市诚韬电子有限公司规格承认书SPECIFICATIONS FOR APPROVALISO9001/14001 ISO9001/14001 品名导电聚合物固体电解质铝电解电容器PRODUCT NAME: ELECTROLYTIC CAPACITORS系列SERLES: ULG规格/尺寸1U承制方确认客户确认拟订审核批准拟订审核批准曾燕胡乐平唐赣锋签认后,敬请回返一份,多谢!Please chop,sign and returu to us a copy after approval .Thank you!TEL:0769-******** FAX:0769-******** E-mail: xiaoyue36@地址：东莞市长安镇上沙管理区北横路8号东莞市诚韬电子有限公司编号:201111-00006 产品规格书目录表1. 产品结构及外形尺寸1~21．1产品结构 11．2产品外形尺寸 22．产品技术性能及试验条件2~5 2．1产品初始性能 22．2试验项目及条件3~52.3标志 62.3.1标志图 63．应用注意事项 63.1电路设计： 63.2使用： 61．产品结构及外形尺寸1．1产品结构：见图1，1-浸锡铜线或CP线(无铅) 2-铝引出端子3-密封弹性材料4-阳极铝箔5-阴极铝箔6- 涂膜铝外壳7 –电解纸1．2产品外形尺寸：见图2表1引线（无铅）涂膜铝外壳φφ图 2 外形尺寸图表 1 外形尺寸（mm）ФD×L Фd P6.3×8 0.5 2.58×8 0.6 3.58×11.5 0.6 3.510×10.5 0.6 510×12.5 0.6 52．产品技术性能及试验条件：2.1产品初始性能表2 产品初始性能产品型号额定电压(V)浪涌电压(v)标称电容量（μF）电容量误差(±％)外形尺寸（mm）Ф×LD F≤ES R(mΩ)≤I(μA)≤纹波电流（ma）≤额定温度范围ULG 35 44 100 20 10*12.5 0.12 60 700 1870 -55℃至105℃2．2试验项目及条件：试验项目试验方法2.2.1 电容量测量频率：120H Z±12HZ测量电压：AC≤0.5Vrms+1V DC 测量温度: 20℃±2℃测量结果:在表2规定范围内2.2.2 DF 测量频率：120H Z±12HZ测量电压：AC≤0.5Vrms+1V DC 测量温度: 20℃±2℃测量结果:在表2规定范围内2.2.3 ESR 测量频率：100KH Z测量温度: 20℃±2℃测量点：距密封端面最大2mm 测量结果:≤表2规定值2.2.4 I 测量电压：表2规定的额定电压；充电：应串联1KΩ±10Ω的电阻对电容器进行充电充电时间：在达到额定电压2分钟后进行读数测量结果：≤表2规定值*当测量结果超过表2规定时，可在105℃下加额定电压2小时进行处理后，重新进行测量2.2.5 浪涌电压试验浪涌电压;按表2规定,在电容器和电源之间串联1KΩ电阻加上直流电压充放电时间: 充电30秒,放电5分30秒为1次重复次数: 1000次试验温度: 15℃--35℃试验结果:电容量变化:≤±20%初始测量值DF: ≤1.5倍表2规定值ESR :≤1.5倍表2规定值I: ≤表2规定值2.2.6 最大允许纹波电流表2规定的最大允许纹波电流是指100KHZ下允许通过的最大纹波电流频率因子频率120H Z≤f＜1KHZ1KH Z≤f＜10KHZ10KH Z≤f＜100KHZ100KH Z≤f＜500KHZ系数0.05 0.3 0.7 12.2.7 高低温阻抗比试验步骤项目测试条件阻抗比要求1 20℃阻抗：Z2020℃±2℃频率：100KHZ2 -55℃下阻抗：Z-55在-55℃+3℃温度下保持30分钟，Z-55/ Z20=0.75-1.253 恢复在15℃—35℃室温下保持30分钟4 105℃下阻抗:Z105在105℃±2℃温度下保持30分钟，Z105/ Z20=0.75—1.252.2.8 湿热试验试验方法:将电容器放在60℃±2℃,湿度90—95%RH的潮湿箱中保持1000小时±48小时后取出在室温下恢复2小时后进行测量:试验结果:电容量变化:≤±20%初始测量值DF :≤1.5倍表2规定值ESR :≤1.5倍表2规定值I :≤表2规定值外观: 无明显改变2.2.9 温度冲击试验方法：一个循环由以下步骤组成，共5 个循环室温—55℃-55℃±3℃ 30分钟-55℃---105±2 ≤3分钟105℃±2℃ 30分钟105℃---室温试验结果：电容量变化:≤±10%初始测量值DF :≤表2规定值I :≤表2规定值外观: 无明显改变2.2.10 寿命试验试验方法:电容器在105℃±2℃下加上表2规定的直流额定电压,经2000小时后测量电性能试验结果: 电容量变化:≤±20%初始测量值DF :≤1.5倍表2规定值ESR :≤1.5倍表2规定值I :≤表2规定值外观: 无明显改变2.2.11 引线强度拉力试验：在引出端的轴线方向施加10N静态力，历时10±1秒弯曲试验：电容器放在垂直位置，在1根引线上施加5N的力，缓慢旋转90度到水平位置，然后再回到垂直位置为1次弯曲。

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1. ScopeThis specification is applies to Multilayer Ceramic Chip Capacitor(MLCC) for use in electric equipment for the voltage is ranging from 4V to 50V.The series suitable for general electrics circuit, telecommunications, personal computers and peripheral, power circuit and mobile application. (This product compliant with the RoHS.)2. Parts Number Code(6)Rated Voltage Code Rated Voltage (Vdc)0044 007 6.3 01010 01616 025 25 035 35 05050 (1) (2) (3) (4) (5) (6) (7) (1)ProductProduct CodeC Multilayer Ceramic Chip Capacitor(3)Temperature CharacteristicsCode Temperature Characteristic Temperature Range Temperature CoefficientN NPO -55℃~+125℃ 30 ppm/℃ X X7R -55℃~+125℃ ± 15% B X5R -55℃~+85℃ ± 15%R X7S -55℃~+125℃ ± 22% S X6S -55℃~+105℃ ± 22%Y Y5V -30℃~+85℃ +22/-82%Z Z5U +10℃~+85℃ +22/-56% E Y5U -30℃~+85℃ +22/-56%(4)Capacitance unit :pico farads(pF)Code Nominal Capacitance (pF) 5R0 5.0 120 12.0 151 150.0222 2,200.0 473 47,000.0 224 220,000.0 105 1,000,000.0106 10,000,000.0※. If there is a decimal point, it shall be expressed by an English capital letter R(5)Capacitance Tolerance Code Tolerance Nominal Capacitance B ± 0.10 pF C ± 0.25 pF D ± 0.50 pF F ± 1.00 pF Less Than 10 pF (Include 10 pF) F ± 1.00 % G ± 2.00 %J ± 5.00 % K ± 10.0 %M ± 20.0 % Z +80/-20 % More Than 10 pF (7)TappingCode TypeT Tape & Reel B Bulk(2)Chip Size Code Length×Width unit : mm(inch) 0201 0.60× 0.30 (.024× .011) 0402 1.00× 0.50 (.039× .020) 0603 1.60× 0.80 (.063× .031) 0805 2.00× 1.25 (.079× .049) 12063.20× 1.60 (.126× .063) 1210 3.20× 2.50 (.126× .098)18084.60× 2.00 (.181× .079) 1812 4.60× 3.20 (.181× .125)1825 4.60× 6.35 (.181× .250)22085.70× 2.00 (.220× .197) 2211 5.70× 2.80 (.220× .110)2220 5.70× 5.00 (.220× .197)22255.70×6.35 (.220× .250)3. Nominal Capacitance and Tolerance3.1 Standard Combination of Nominal Capacitance and Tolerance Class Characteristic Tolerance Nominal CapacitanceB (± 0.10 pF)0.5,1,1.5,2,2.5,3C (± 0.25 pF)0.5,1,1.5,2,2.5,3,3.5,4,4.5,5 D (± 0.50 pF) 5,6,7,8,9,10 Less Then 10 pF F (± 1.00 pF)6,7,8,9,10F (±1.00 %)G (±2.00 %) J (± 5.00 %) Ⅰ NPO More Than 10 pF K (± 10.0 %)E-12, E-24 seriesX7R/X7S/X5R/X6S K (± 10.0 %), M (± 20.0 %)E-3, E-6 series Y5V Z5U Ⅱ Y5U M (± 20.0 %), Z(＋80/－20 %) E- 3 series3.2 E series(standard Number)Standard No. Application CapacitanceE- 3 1.0 2.2 4.7 E- 6 1.0 1.5 2.2 3.3 4.7 6.8 E-12 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2 1.0 1.2 1.5 1.8 2.2 2.7 3.3 3.9 4.7 5.6 6.8 8.2E-24 1.1 1.3 1.6 2.0 2.4 3.0 3.6 4.3 5.1 6.2 7.5 9.14. Operation Temperature RangeClass Characteristic Temperature Range Reference Temp.Ⅰ NPO (N) -55 ~ +125℃℃ 20℃ X7R (X) -55 ~ +125℃℃ 20℃ X7S (R) 55 ~ +125℃℃ 20℃ X5R (B) -55 ~ +85℃℃ 20℃ X6S (S) -55 ~ +1℃05℃ 20℃ Y5V (Y) -30 ~ +85℃℃ 20℃ Z5U (Z) +10 ~ +85℃℃ 25℃ ⅡY5U (E) -30 ~ +85℃℃ 25℃ Other -25 ~ +85℃℃ 20℃5. Storage ConditionStorage Temperature ：5 to 40℃ Relative Humidity ：20 to 70 % Storage Time ：6 months max.6. Dimensions6.1 Configuration and Dimension ：Unit:mmTYPE LW T (max) B (min) BW (min) 0201 0.60± 0.03 0.30± 0.03 0.33 0.200.10 0402 1.00± 0.05 0.50± 0.05 0.55 0.30 0.15 0603 1.60± 0.10 0.80± 0.10 0.90 0.40 0.15 0805 2.00± 0.20 1.25± 0.20 1.45 0.70 0.20 1206 3.20± 0.30 1.60± 0.20 1.80 1.50 0.30 1210 3.20± 0.30 2.50± 0.20 2.60 1.60 0.30 1808 4.60± 0.30 2.00± 0.20 2.20 2.50 0.30 1812 4.60± 0.30 3.20± 0.30 3.00 2.50 0.30 1825 4.60± 0.30 6.35± 0.40 2.60 2.50 0.30 2208 5.70± 0.40 2.00± 0.20 2.20 3.50 0.30 2211 5.70± 0.40 2.80± 0.40 3.00 3.50 0.30 2220 5.70± 0.40 5.00± 0.40 3.00 3.50 0.30 22255.70± 0.406.35± 0.403.003.500.306.2 Termination Type ：Ceramic BodyNo.ItemSpecificationTest ConditionAppear-anceNo mechanical damage shall occur.Characteristic Cap. ChangeClass Ⅰ (NPO) Within ± 7.5% or ± 0.75pF whichever is larger ofinitial valueX7R/X7S/X6S/X5R ≤ ±12.5% of initial value Capacit- anceY5V/Y5U/Z5U ≤ ±30% of initial valueQClass Ⅰ 30pF & Over : Q ≧350 10 to 30pF : Q ≧275+2.5C30pF & Below: Q ≧200+10CTan δ Class ⅡShall meet the value in Table 1,Tble 2,Table 3 14 Humidity Load Insulation Resistance 500M Ω or 25/C Ω whichever is smaller forrated voltage>10V and greater 5/C Ω for rated voltage ≦10V. (C in Farad)Class Ⅱ capacitors applied DC voltage of the rated voltage is applied for one hour at maximum operation temperature ± 3then shall be set for ℃48± 4 hours at room temperature and the initialmeasurement shall be conducted. Applied Voltage :Rated Voltage Temperature : 40± 2℃Relative Humidity : 90 ~ 95%RH Test Time : 500 +12/-0Hr Current Applied : 50 mA Max. Measure at room temperature after cooling forClass Ⅰ: 24 ± 2 Hours Class Ⅱ: 48 ± 4 HoursAppear- anceNo mechanical damage shall occur.Characteristic Cap. ChangeClass Ⅰ(NPO)Within 5.0% or ±0.5pF whichever is larger of initial value X7R/X7S/X6S/X5R ≤ ±12.5% of initial value Capacit- ance Y5V/Y5U/Z5U≤ ±30% of initial value QClass Ⅰ 30pF & Over : Q ≧350 10 to 30pF : Q ≧275+2.5C30pF & Below: Q ≧200+10CTan δ Class ⅡShall meet the value in Table 1,Tble 2,Table 315 High Temperat. Load (Life Test) InsulationResistance 1,000M Ω or 50/C Ω whichever is smaller for rated voltage>10V and greater 10/C Ω for rated voltage ≦10V. (C in Farad)Class Ⅱ capacitors applied DC testing voltage is applied for one hour at maximum operation temperature ±3 then shell be set for 48± 4 ℃hours at room temperature and the initial measurement shall be conducted. Applied Voltage:200% Rated Voltage for C < 1.0uF and150% Rated Voltage for C ≥1.0uF. However: The rated voltage is 4V/6.3V/10V,applied voltage of 100% rated voltage. Temperature: max. operation temperature Test Time : 1000 +48/-0 Hr Current Applied : 50mA Max Measure at room temperature after cooling forClass Ⅰ: 24 ± 2 HoursClass Ⅱ: 48 ± 4 HoursAppear- anceNo mechanical damage shall occurCapacit- ance Within the specified toleranceQ Class ⅠTo satisfy the specified initial value 16 Vibration Tan δ Class Ⅱ Shall meet the value in Table 1,Tble 2,Table 3 Solder the capacitor on P .C. board. Vibrate the capacitor with amplitude of1.5mm P-P changing the frequenciesfrom 10Hz to 55Hz and back to 10Hzin about 1 min.Repeat this for 2 hours each in 3 perpendiculardirections. Note:OUR STANDARD MEASURING INSTRUMENT MEASURING INSTRUMENT*C 10uf ≦4278A 1KHZ/1MHZ CAPACITANCE METER (Agilent) *C>10uf4268A 120HZ/1KHZ CAPACITANCE METER (Agilent) MEASURING MODEPARALLEL MODERECOMMENDED MEASURING JIG HP 16334E TEST FIXTURE (Agilent) STANDARD ENVIRONMENTTemperature 20℃Relate Humidity 50±2%Temp char: X7R,X7S,X6S,X5RtanδRated voltage CapacitanceRange 5. Initial16.Vibration11.Resistance to solder heat12.Temperature cycle13.Humidity14.Humidity loading15.High temperature loadingC≦0.01uF 5.0% 7.5% DC 6.3VC=0.1uF 15.0% 25.0% DC 10V C≦0.01uF 5.0% 7.5%C≦2.2nF 2.5% 5.0% DC 16V2.2nF<C≦3.3nF 5.0% 7.5%DC 25V C≦2.2nF 2.5% 5.0%0201DC 50V C≦1nF 2.5% 5.0%C≦0.22uF 10.0% 15.0% DC 6.3VC≦1uF 15.0% 25.0%C≦0.1uF 5.0% 7.5% DC 10V0.1uF＜C≦1uF 15.0% 25.0%DC 16V C≦0.22uF 5.0% 7.5%DC 25V C≦0.01uF 2.5% 5.0%0402DC 50V C≦3.9nF 2.5% 5.0%DC 4.0V C≧10uF 15.0% 25.0% C<1uF 5.0%7.5%1uF≦C＜2.2uF 7.5% 12.5%2.2uF≦C＜4.7uF 10.0% 15.0%DC 6.3VC≧4.7uF 15.0%20.0%C<1uF 5.0%7.5%1uF≦C＜2.2uF 7.5% 12.5% DC 10VC≧2.2uF 10.0% 15.0%C≦0.1uF 2.5% 5.0%C＜1uF 5.0% 7.5% DC 16VC≧1uF 7.5% 12.5%C≦0.1uF 2.5% 5.0%0.1uF＜C≦0.47uF 3.5% 7.0%DC 25VC≧0.47uF 7.5% 12.5%0603DC 50V All Capacitance 2.5% 5.0%DC 4.0V C≧10uF 15.0% 25.0%C≦3.3uF 5.0% 7.5%C≧4.7uF 10.0% 15.0% DC 6.3VC≧10uF 15.0% 20.0%C≦2.2uF 5.0% 7.5%2.2uF＜C≦4.7uF 10.0% 15.0%DC 10VC＞4.7uF 15.0% 20.0%C≦0.47uF 2.5% 5.0%0.47uF＜C≦1uF 5.0% 7.5%1uF＜C≦4.7uF 10.0% 15.0% DC 16VC＞4.7uF 15.0% 20.0%C≦0.47uF 2.5% 5.0% DC 25VC≦4.7uF 10.0% 15.0%0805DC 50V All Capacitance 2.5% 5.0%C≦10uF 5.0% 7.5% DC 6.3VC≧22uF 10.0% 15.0% DC 10V All Capacitance 5.0%7.5%C＜4.7uF 2.5% 5.0% DC 16VC≧4.7uF 5.0% 7.5%C≦2.2uF 2.5% 5.0%2.2uF＜C≦4.7uF 5.0% 7.5%DC 25V4.7uF＜C≦10uF 10.0% 15.0%1206DC 50V All Capacitance 2.5% 5.0%Table 1tan δSizeRated voltageCapacitance Range5. Initial16.Vibration11.Resistance to solder heat 12.Temperature cycle13.Humidity14.Humidity loading15.High temperature loadingC ≦47uF10.0% 15.0%DC 6.3V 47uF ＜C ≦100uF15.0% 25.0% C 10u ≦ F 5.0%7.5% 10uF ＜C ≦22uF10.0% 15.0% DC 10V22uF ＜C ≦47uF15.0% 25.0% C ≦10uF5.0% 7.5% DC 16V 10uF ＜C ≦47uF15.0% 25.0% C ≦10uF5.0% 7.5%DC 25V 10uF ＜C ≦22uF15.0% 25.0% DC 35V All Capacitance 2.5%5.0%1210DC 50V C ≦1uF2.5% 5.0%DC 6.3V 10.0% 15.0% DC 10V 10.0% 15.0% DC 16V 5.0%7.5% DC 25V 5.0% 7.5% DC 35V 2.5% 5.0%1812DC 50V All Capacitance2.5%5.0% 2220DC 35VAll Capacitance 2.5%5.0%Temp char:Y5Vtan δ SizeRated voltageCapacitance Range5.Initial16.Vibration11.Resistance to solder heat 12.Temperature cycle13.Humidity14.Humidity loading15.High temperature loading0201 DC 6.3V All Capacitance 20.0%30.0%DC 6.3V All Capacitance20.0% 30.0% DC 10V All Capacitance 12.5% 15.0% DC 16V All Capacitance 9.0% 11.0% DC 25V All Capacitance 5.0% 7.5% 0402DC 50V All Capacitance 5.0% 7.5% DC 6.3V All Capacitance 20.0%30.0%C<1uF7.0% 10.0% C ≧1uF12.5% 15.0% DC 10V C ≧2.2uF20.0% 30.0%C<1uF 7.0%10.5% DC 16VC ≧1uF12.5% 20.0% C ≦0.1uF5.0% 7.5% C<1uF7.0% 10.5% DC 25VC ≧1uF12.5% 20.0% 0603DC 50V All Capacitance 5.0% 7.5% DC 6.3V All Capacitance 20.0%30.0%C ≦4.7uF12.5% 15.0% DC 10V C ≧10uF20.0% 30.0%C<1uF 7.0%10.5% 1uF ≦C ＜4.7uF10.0% 15.0% DC 16VC ≧4.7uF12.5% 20.0%C<1uF 7.0%10.5% DC 25V C 1u ≧ F10.0% 15.0% C ＜1uF 5.0% 7.5%0805DC 50VC ≧1uF10.0%15.0%Table 2tan δ SizeRated voltageCapacitance Range5.Initial16.Vibration11.Resistance to solder heat 12.Temperature cycle13.Humidity14.Humidity loading15.High temperature loadingC ≦1.0uF12.5% 15.0%DC 10VC ≧2.2uF20.0% 30.0% C ＜1uF 7.0% 10.5% 1uF ≦C ＜10uF10.0% 15.0%DC 16V C ≧10uF12.5% 20.0% C ＜1uF 5.0% 7.5% 1uF ≦C ＜4.7uF7.0% 10.0% C ≧4.7uF10.0% 15.0% DC 25V C ≧10uF12.5% 20.0% DC 35V C ≦2.2uF7.0% 10.0% C ＜1uF5.0% 7.5%1206 DC 50V C =1uF 7.0%10.0% DC 6.3V All Capacitance 20.0% 30.0%DC 10V All Capacitance 20.0% 30.0% DC 16V All Capacitance 12.5% 20.0%C ＜1uF7.0% 10.5% C ≦10uF10.0% 15.0% DC 25V 10uF ＜C ≦22uF12.5% 20.0% DC 35V C ≦10uF 10.0% 15.0% 1210DC 50V All Capacitance 7.0% 10.0% DC 6.3V 20.0%30.0% DC 10V 20.0% 30.0% DC 16V 12.5% 20.0% DC 25V 10.0% 15.0% DC 35V 10.0%15.0%1812DC 50VAll Capacitance10.0% 15.0%Table 3Temp char:Y5U/Z5Utan δSizeRated voltageCapacitance Range5.Initial16.Vibration11.Resistance to solder heat12.Temperature cycle13.Humidity 14.Humidity loading 15.High temperature loading DC 25V 4.0% 6.0%0603 DC 50V All Capacitance 4.0% 6.0% DC 10V C ≧10uF 20.0% 30.0% DC 16V C ≧4.7uF 12.5% 20.0% DC 25V 4.0% 6.0% DC 35V 4.0% 6.0%0805DC 50V All Capacitance 4.0% 6.0% DC 10V C ≧10uF 20.0% 30.0% DC 16V C ≧10uF 12.5% 20.0% DC 25V 4.0% 6.0%1206DC 50V All Capacitance 4.0% 6.0% DC 25V 4.0% 6.0%1210 DC 50V All Capacitance 4.0% 6.0% DC 25V 4.0% 6.0%1812 DC 50V All Capacitance 4.0% 6.0% DC 25V 4.0% 6.0%2220DC 50V All Capacitance 4.0% 6.0%Fig.1P.C. Board for Bending Strength TestMaterial : Glass Epoxy SubstrateCopper(Thickness : 0.035mm): Solder ResistTest SubstrateMaterial : Glass Epoxy Substrate: Copper (Thickness : 0.035mm)Thickness : 1.6 mmUnit:mm Type ABC0201 0.2 0.9 0.4 0402 0.5 1.5 0.6 0603 1.0 3.0 1.0 0805 1.2 4.0 1.6 1206 2.2 5.0 2.0 1210 2.2 5.0 2.9 1808 3.5 7.0 2.5 1812 3.5 7.0 3.7 2208 4.5 8.0 2.5 2211 4.5 8.0 3.0 2220 4.58.05.68. Packing8.1 Bulk PackingAccording to customer request.8.2 Chip Capacitors Tape Packing8.3 Material And QuantityTape0201 0402 0603/0805Material T0.≦0mm T＞0.90mm≦T0.9≦33mm T0.55mmPaper 15,000 pcs/Reel10,000 pcs/Reel4,000 pcs/Reel NAPlastic NA NA NA 3,000pcs/ReelTape1206 1210/1808 Material T0.9≦0mm 0.90mm＜T 1.25mm≦T＞1.25mm T≦1.25mm T＞1.25mmPaper 4,000pcs/Reel NA NA NA NApcs/Reel3000 pcs/Reel 2000 pcs/Reel2,000Plastic NA 3,000pcs/ReelTape1812/2211/2220 1825/2225 2208Material T≦2.20mm T＞2.20mm T≦2.20mm T＞2.20mm T≦2.20mmNA NA NA NA NAPaperPlastic 1000 pcs/Reel 700 pcs/Reel 700 pcs/Reel400 pcs/Reel1000 pcs/ReelNA：Not Available8.4 Cover Tape Reel Off Force9.4.1 Peel-Off Force≦·f≦-Off Force 70 g5 g·f Peel9.4.2 Measure Method8.5 Paper TapeUnit:mm8.6 Plastic TapeUnit:mmTYPE A B C D E 0201 0.37± 0.1 0.67± 0.1 0402 0.61± 0.1 1.20± 0.1 2.00± 0.10603 1.10± 0.2 1.90± 0.2 0805 1.50± 0.2 2.30± 0.2 1206 1.90± 0.2 3.50± 0.2 1210 2.90± 0.2 3.60± 0.24.00± 0.1 2.00± 0.054.00± 0.1 TYPE F G H I t0201 0402 060308051206 12101.75± 0.10 3.50± 0.05 8.0± 0.30 φ1.50 +0.10/-0 1.10 max.Type A B C D E F 0805 1.5±0.2 2.3±0.2 1206 1.9±0.2 3.5±0.2 1210 2.9±0.2 3.6±0.2 1808 2.5±0.2 4.9±0.2 4.0± 0.11812 3.6±0.2 4.9±0.2 1825 6.9±0.2 4.9±0.2 2208 2.5±0.2 6.1±0.2 2211 3.2±0.2 6.1±0.2 2220 5.4±0.2 6.1±0.2 2225 6.9±0.2 6.1±0.24.0± 0.1 2.0± 0.058.0± 0.11.75± 0.18.7 Reel DimensionsReel Material ：PolystyreneType G H IJ t O 0805 1206 1210 3.5± 0.058.0± 0.33.0 max.1808 1812 1825 2208 2211 2220 22255.5± 0.05 12.0 ± 0.3 φ1.5+0.1/-04.0 max.0.3 max.0.15 min.Type AB C DE W 02010402 0603 0805 1206 1210 φ382 max φ50 min 10± 0.151808 1812 1825 2208 2211 2220 2225φ178±0.2 φ60±0.2 φ13± 0.5φ21± 0.82.0±0.513±0.3Unit:mmPrecautionary Notes:1. StorageStore the capacitors where the temperature and relative humidity don’t exceed 40°C and 70%RH. Werecommend that the capacitors be used within 6 months from the date of manufacturing. Store the products in the original package and do not open the outer wrapped, polyethylene bag, till just before usage. If it is open, seal it as soon as possible or keep it in a desiccant with a desiccation agent.2. Construction of Board PatternImproper circuit layout and pad/land size may cause excessive or not enough solder amount on the PC board. Not enough solder may create weak joint, and excessive solder may increase the potential of mechanical or thermal cracks on the ceramic capacitor. Therefore we recommend the land size to be as shown in the following table: 2.1 Size and recommend land dimensions for reflow soldering2.2 Mechanical strength varies according to location of chip capacitors on the P .C. board.Design layout of components on the PC board such a way to minimize the stress imposed on the components, upon flexure of the boards in depanelization or other processes.Component layout close to the edge of the board or the “depanelization line” is not recommended. Susceptibility to stress is in the order of: a>b>c and d>eChip (mm)Land (mm)EIA CodeL WA B C D E 0201 0.600.300.2~0.30.2~0.4 0.2~0.4 -- -- 0402 1.000.500.3~0.50.3~0.5 0.4~0.6 -- -- 0603 1.600.800.4~0.60.6~0.7 0.6~0.8 -- -- 0805 2.00 1.250.7~0.90.6~0.8 0.8~1.1 -- -- 1206 3.20 1.60 2.2~2.40.8~0.9 1.0~1.4 1.0~2.0 3.2~3.71210 3.20 2.50 2.2~2.4 1.0~1.2 1.8~2.3 1.0~2.0 4.1~4.61808 4.60 2.00 2.8~3.4 1.8~2.0 1.5~1.8 1.0~2.8 3.6~4.11812 4.60 3.20 2.8~3.4 1.8~2.0 2.3~3.0 1.0~2.8 4.8~5.31825 4.60 6.35 2.8~3.4 1.8~2.0 5.1~5.8 1.0~4.07.1~8.32208 5.70 2.00 4.0~4.6 2.0~2.2 1.5~1.8 1.0~4.0 3.6~4.12211 5.70 2.80 4.0~4.6 2.0~2.2 2.0~2.6 1.0~4.0 4.4~4.92220 5.70 5.004.0~4.6 2.0~2.2 3.5~4.8 1.0~4.0 6.6~7.122255.706.35 4.0~4.6 2.0~2.2 5.1~5.8 1.0~4.07.1~8.32.3 Layout Recommendation3. Mounting3.1 Sometimes crack is caused by the impact load due to suction nozzle in pick and place operation.In pick and place operation, if the low dead point is too low, excessive stress is applied to component. This maycause cracks in the ceramic capacitor, therefore it is required to move low dead point of a suction nozzle to the higher level to minimize the board warp age and stress on the components. Nozzle pressure is typically adjusted to 1N to 3N (static load) during the pick and place operation.錯誤3.2 Amount of Adhesivea0.2mm min. b70 ~ 100 μmcDo not touch the solder landExample : 0805 & 12064. Soldering4.1. Wave SolderingMost of components are wave soldered with solder at 230 to 250°C. Adequate care must be taken to prevent the potential of thermal cracks on the ceramic capacitors. Refer to the soldering methods below for optimum soldering benefits.Recommend flow soldering temperature ProfileTo optimize the result of soldering, proper preheating is essential: 1) Preheat temperature is too low a. Flux flows to easily b. Possibility of thermal cracks2) Preheat temperature is too high a. Flux deteriorates even when oxide film is removed b. Causes warping of circuit boardc. Loss of reliability in chip and other componentsCooling Condition:Natural cooling using air is recommended. If the chips are dipped into a solvent for cleaning, the temperature difference (ΔT) between the solvent and the chips must be less than 100°C.4.2 Reflow SolderingPreheat and gradual increase in temperature to the reflow temperature is recommended to decrease the potential of thermal crack on the components. The recommended heating rate depends on the size of component, however it should not exceed 3°C/Sec.Recommend reflow profile for Lead-Free soldering temperature Profile (MIL-STD-202G #210F)Soldering MethodChange in Temp.( )℃1206 and Under ΔT 190 ≦℃ 1210 and OverΔT 130 ≦℃Soldering Method Change in Temp.( )℃1206 and UnderΔT ≤ 100~130 max.SolderingT e m p e r a t u r e (°C )T e m p e r a t u r e (°C )※ The cycles of soldering : Twice (max.)4.3 Hand SolderingSudden temperature change in components, results in a temperature gradient recommended in the following table, and therefore may cause internal thermal cracks in the components. In general a hand soldering method is not recommended unless proper preheating and handling practices have been taken. Care must also be taken not to touch the ceramic body of the capacitor with the tip of solder Iron.Soldering Method Change in Temp.( )℃1206 and Under ΔT 190≦℃1210 and Over ΔT 130≦℃How to Solder Repair by Solder Iron1) Selection of the soldering iron tipThe required temperature of solder iron for any type of repair depends on the type of the tip, the substrate material, and the solder land size.2) recommended solder iron conditiona.) Preheat the substrate to (60°C to 120°C) on a hot plate. Note that due to the heat loss, the actual settingof the hot plate may have to be higher. (For example 100°C to 150°C)b.) Soldering iron power shall not exceed 30 W.c.) Soldering iron tip diameter shall not exceed 3mm.d.) Temperature of iron tip shall not exceed 350°C to perform the process within 5 seconds.(refer to MIL-STD-202G)f.) Do not touch the ceramic body with the tip of solder iron. Direct contact of the soldering iron tip to ceramicbody may cause thermal cracks.g.) After soldering operation, let the products cool down gradually in the room temperature.5. Handling after chip mounted5.1 Proper handling is recommended, since excessive bending and twist of the board, depends on the orientationof the chip on the board, may induce mechanical stress and cause internal crack in the capacitor.TwistTemperature(°C)200→Higher potential of crack Lower potential of crack ╳5.3 Mechanical stress due to warping and torsion.(a) Crack occurrence ratio will be increased by manual separation.(b) Crack occurrence ratio will be increased by tensile force , rather than compressive force.:Tensile Stress ╳ ○ :Compressive Stress6. Handling of Loose Chip Capacitor 6.1 If dropped the chip capacitor may crack.6.2 In piling and stacking of the P .C. boards after mounting for storage or handling, the corner of the P .C. boardmay hit the chip capacitor mounted on another board to cause crack.7. Safekeeping condition and periodFor safekeeping of the products, we recommend to keep the storage temperature between +5 to +40°C and under humidity of 20 to 75% RH. The shelf life of capacitors is 6 months.。