印制线路板术语中英对照简表..
PCB专业用语-中英文对照
PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB中英文对照词汇
PCB 中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb) 11双面印制板Double-sided printed board(dsb) 12多层印制板Multilayer printed board(mlb) 13多层印制电路板Multilayer printed circuit board 14多层印制线路板Multilayer printed wiring board 15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board 17刚性双面印制板Rigid double-sided printed board 18刚性多层印制板Rigid multilayer printed board 19挠性多层印制板Flexible multilayer printed board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board 、 rigid-flexprinted board26刚性双面印制板Flex-rigid double-sided printed board、rigid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum) 41积层挠性印制板Build-up flexible printed board42表面层合电路板Surface laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs) 45层间全内导通多层印Alivh multiplayer printed board制板46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit 64互连interconnection65导线Conductor trace line 66齐平导线Flush conductor 67传输线Transmission line 68跨交crossover69板边插头Edge-board contact 70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side 75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern 80非导电图形Non-conductive pattern 81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-clad bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate 6双面覆铜箔层压板Double-sided copper laminate 7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate 10金属基覆铜层压板Metal base copper-clad laminate 11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film 12基体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet 16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process 18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board21涂胶催化层压板Adhesive-coated catalyzed laminate 22涂胶无催化层压板Adhesive-coated uncatalyzed laminate 23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-cladlaminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-cladlaminates(epoxy paper ccl)41环氧玻璃布基覆铜箔Epoxide woven glass fabric copper-clad 板laminate42环氧玻璃布纸复合覆Epoxide cellulose paper core glass cloth 铜箔板surfaces copper-clad laminate43环氧玻璃布玻璃纤维Epoxide non woven glass reinforced 复合覆铜箔板copper-clad laminate44聚酯玻璃布覆铜箔板Polyester wovenglass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜Polyimide woven glass fabric copper-clad箔板laminate46双马来酰亚胺三嗪环Bismaleimide triazine epoxide woven 氧玻璃布覆铜板glass fabric copper-clad laminate47环氧合成纤维布覆铜Epoxide synthetic fiber copper-clad箔板laminates48聚四乙烯玻璃纤维覆Teflon fiber glass copper-clad laminate铜箔板49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate 51紫外线阻挡型覆铜箔Uv blocking copper-clad laminates板三、基材的材料序号中文英文1 a 阶树脂a-stage resin2 b 阶树脂b-stage resin3 c 阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树Bismaleimide-triazine resin脂9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin 11多功能环氧树脂Polyfunctional epoxy resin 12溴化环氧树脂Brominated epoxy resin 13环氧酚醛Epoxy novolac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe) 27环氧值Epoxy value28双氰胺dicyandiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylenecopolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass fiber42 E 玻璃纤维e-glass fiber43 D 玻璃纤维d-glass fiber44S 玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric 47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise 、 filling-wise 56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fabric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric78聚酰胺纤维Polyarmide fiber79聚酯纤维非织布Non-woven polyester fabric 80浸渍绝缘纵纸Impregenating insulation paper 81聚芳酰胺纤维纸Aromatic polyamide paper 82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copperfoil)90压延铜箔Rolled copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copperfoil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔（剖面）轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim) 8计算机集成制造Computer integrat manufacturing 9计算机辅助工程Computer-aided engineering(cae) 10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda) 12工程设计自动化Engineering design automaton(eda2) 13组装设计自动化Assemnly aided architecturaldesign(aaad) 14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd) 16布局placement17布线routing18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf) 27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化（设计）Optimization(design)31供设计优化坐标轴Predominant axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation 37队列支撑数据库Queue support database38元件安置component positioning 39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logic design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49自顶向上设计Bottom-up design50线网net51数字化digitzing52设计规则检查Design rule checking53走（布）线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis 56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp) 59交互式制图设计Interactive drawing design 60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem 66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatton distance70欧几里德距离Euclidean distance71网络Network72阵列Array73段Segment74逻辑Logic75逻辑设计自动化Logic design automation 76分线Separated time77分层Separated layer78定顺序Definite sequence79对准度registration80孔环Annular ring81公差Tolerance82同心Concentricity83样片coupon84变色discolorations85污点Stains86试样Specimen 87钻孔Drilling88剪裁Shearing 89切外型Routing90刮线Scoring91倒角Chamfering 92切空Blanking 93适应性suitability 94板弯Bow95板扭Twist96应力Stress97防焊膜Solder mask 98阻焊膜Solder resist 99文字标记Legend 100版本代字Revision letter 101料号Part No 102跳漏Skipping 103浮空Soda strawing 104流动Flow 105整平Leveling 106FPR First pass yield ‘。
PCB专业用语中英文对照
PCB专业用语中英文对照PCB，全称是Printed Circuit Board，即印制电路板，是电子器件中不可缺少的一部分。
在PCB的生产和使用过程中，有许多特定的专业术语，以下将列出一些常见的PCB专业用语的中英文对照，以帮助PCB行业的从业人员更好地了解和使用这些术语。
1. Pad - 表面贴装元件引脚焊盘2. Via - 通孔3. Trace - 线路走线4. Solder mask - 焊盘阻焊5. Silkscreen - 字体绘制6. Substrate - 基板7. RoHS - 过度有害物质限制指令8. PCB Assembly - PCB组装9. Panel - 夹板10. Gerber file - Gerber文件（PCB板图文件的一种）11. Copper weight - 铜箔厚度12. SMD - 表面贴装元件13. Through-hole - 贯通孔除此之外，还有一些专业用语需要注意：1. Blind via - 盲孔2. Buried via - 埋孔3. Soldering - 焊接4. Copper pour - 铜泡5. Annular ring - 环形垫片6. Plated through-hole - 化学镀铜孔7. Gold finger - 金手指（PCB板边部的带触点金属部件）8. OSP - 有机锡防护（一种PCB表面处理方法）以上仅列举了部分PCB专业用语的中英文对照，如需更全面的了解，需要从事相关行业或有专业经验的人士掌握更多知识。
在PCB制造和使用过程中，正确使用这些专业用语是非常重要的，它们不仅可以帮助我们更好地了解PCB的生产过程和使用方法，还可以提高工作效率和避免出现误解和错误。
PCB专业英译术语
PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
印刷电路板术语中英对照简表
【印刷電路板術語中英對照簡表】【印刷電路板術語中英對照簡表】排序英語簡稱註解A Accelerate Aging 加速老化使用人工的方法，加速正常的老化過程。
Acceptance Quality Level (AQL) 一批產品中最大可以接受的缺陷數目，通常用于抽樣計畫。
Acceptance Test 用來測定產品可以接受的試驗，由客戶與供應商之間決定。
Access Hole 在多層電路板連續層上的一系列孔，這些孔的中心在同一個位置，而且通到電路板的一個表面。
Annular Ring 是指孔周遭的導體部分。
Artwork 用于生產“Artwork Master”“production Master”,有精確比例的底片。
Artwork Master 通常是有精確比例的底片，其按1︰1的圖案用于生產“Production Master”。
B Back Light 背光法是一種檢查通孔銅壁完好與否得放大目檢方法，其做法是將孔壁外的基材自某一方向上小心的予以磨薄，再利用樹脂半透明的原理，從背后射入光線。
假如化學銅孔壁品性完好而無任何破洞或針孔時，則該銅層必能阻絕光線而在顯微中呈現黑暗，一旦銅壁有破洞時，則必有光點出現而被觀察到，並可放大攝影存証，稱為背光法，但只能看到半個孔。
Base Material 基材絕緣材料，線路在上面形成。
（可以是剛性或柔性，或兩者綜合。
它可以是不導電的或絕緣的金屬板。
）。
Base Material thickness 不包括銅箔層或鍍層的基材的濃度。
Bland Via 導通孔僅延伸到電路板的一個表面。
Blister 離層的一種形式，它是在基材的兩層之間或基材與銅箔之間或保護層之間局部的隆起。
Board thickness 指包括基材和所有在上面形成導電層在內的總濃度。
Bonding Layer 結合層，指多層板之膠片層。
Bury hole 埋孔C C-Staged Resin 處于固化最後狀態的樹脂。
印制电路词汇中英对照
印制电路词汇中英对照一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sidedprinted27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printedboard28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan。
线路板常用术语中英文对照表
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamim ates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
印制线路板术语手册中英文对照
A- stage A阶段Abietic Acid 松脂酸Abrasion Resistance 耐磨性Abrasives 磨料,刷材ABS 树脂Absorption 吸收,吸入AC impedance 交流阻抗Accelerated(Aging) Test 加速试验,加速老化Acceleration 速化反应Accelerator 加速剂,速化剂Acceptability, Acceptance 允收性,允收Acceptable Quality Level(AQL) 允收质量水平Access 存取,使用,接近,进入Access Hole 露出孔(穿露孔,露底孔) Accuracy 准确度Acid Copper Plating 酸性电镀铜Acid Dip浸酸Acid Number(Acid Value) 酸值Acoustic Microscope(AM) 感音成像显微镜Acrylic 压克力Actinic Light(or intensity ,or Radiation) 有效光Activation 活化Activator 活化剂Active Carbon 活性炭Active Parts(Components or Devices) 主动零件Acutance 解像锐利度Addition Agent 添加剂Additive Process 加成法Additives 添加剂Adhesion 附着力Adhesion Promotor 附着力促进剂Adhesive 胶类或接着剂Admittance 导纳Aerosol 喷雾剂,气溶胶,气悬体Agglomeration 凝絮Aging 老化Air Agitation空气搅伴Air Bearing空气轴承Air inclusion气泡夹杂Air Knife气刀,气廉Algorithm 算法Aliphatic Solvent 脂肪族溶剂Aluminium Nitride(AIN) 氮化铝Ambient Temp 环境温度Amorphous 无定形,非晶形Amp-Hour 安培小时Analog Circuit/Analog Signal 模拟电路/模拟讯号Anchoring Spurs 着力爪Angle of Attack 攻角Angle of Contact 接触角Anion 阳向游子(阴离子)Anisotropic 异向的,单向的Anisotropic Conductive Adhesive (ACA)单向(垂直)导向胶Anisotropic Conductive Film (Adhesive)单向导电接着膜Anneal 韧化Annular Ring 孔环Anode 阳极Anode Sludge 阳极泥Anodizing 阳极化ANSI 美国标准协会Anti-foaming Agent 消泡剂Anti-pad 空圆,隔离空垫Anti-pit Agent 抗凹剂Any Layer interstitial Via Hole(ALIVH) 阿力夫制程AOI 自动光学检验Apertures开口,钢版开口,光束出口AQL 质量允收水平Aramid 聚酰胺树脂Aramid Fiber 聚酰胺纤维Arc Resistance 耐电弧性Area Array Package 面积格列封装(组件)Array 格列,排列,数组,一排,一条,一套组合Artwork 底片As Received 到货,收货ASIC 特定用途的集成电路器Aspect Ratio 纵横比Assembly 装配,组装,构装Automatic Testing Equipment(ATE) 自动电测设备Attenuation 讯号衰减Autoclave 压力锅Auxiliary Anode(or Cathode) 辅助阳极(阴极) Availability 航空电子品Axial Lead 轴心引脚Azeotrope 共沸混合液B-stage B阶段Back Light(Back Lighting) 背光法Back Taper 反斜锥角Back-up 垫板Backpanels,Backplanes 背板,支撑板Bail Outqyi 勺出Balanced Transmission Lines 平衡式传输线Ball Grid Array 球脚数组(封装)Bandability 可弯曲性,弯曲能力Bandwidth 频带宽度,频宽Banking Agent 护岸剂Bar Chart 直方圆Bar Code条形码Bare Board 空板,未装板(大陆业称光板)Bare Chip Assembly裸体芯片组装Barrel 孔壁,滚镀Barrier 障凝层Base Material 基材Baseband Area 基频区Basic Grid 基本方格Batch 批Baume 波美度Beam Lead 光芒式的平行密集引脚Bed-of-Nails Testing 针床测试Bellows Contact 弹片式接触Bend Test 弯曲试验Beta Ray Backscatter 具他射线反弹散射Bevelling 切斜边Bias 斜张网布,斜织法Bi-level Stencil 双阶式钢版Binder 黏结剂Bipolar Electrodes 偶极性电极组Bits 头,针尖Black Oxide 黑氧化层Blanking 冲空断开Bleach 漂洗Bleeding 渗流Blind Via Hole 盲导孔Blister 局部性分层或起泡Block Diagram 电路系统整合图Blockout 封网Blotting 干印Blotting Paper 吸水纸,吸墨纸Blow Hole 吹孔Blue Plaque 蓝纹Blue Print 蓝图Bluetooth 蓝牙/蓝芽(短期无线通讯之整合技术) Blur Edge(Circle) 模糊边带,模糊边圈Bomb Sight 弹标Bond Strength 结合强度,固着强度Bondability 结合性,固着性Bonding Layer 结合层,固着层Bonding Sheet(Ply,Layer) 接合片,接着层Bonding Wire 结合线Bow,Bowing 板弯Braid 编线Brazing 硬焊Break Point 出像点,显像点,露铜点Breakaway Panel 可断开板Breakdown Voltage 崩溃电压Break-out 破出Bridging 搭桥,桥接Bright Dip 光泽浸溃处理Brightener 光泽剂Brown Oxide 棕氧化Brush Plating 刷镀Build-up 增厚,堆积,增层Build-up Multilayer(BUM) 增层法多层板Build-up Process 增层法制程Built-in 内建Bulge 鼓起,凸出Bulk Solution 主槽液,主体溶液Bump 突块,凸块Bumping 凸块封装技术Bumping Process 凸块制程Buoyancy 浮力Buried Capacitor (or Resistor) 埋入式(内建式)电容器(或电阻器) Buried Hole 埋通孔Buried Via Hole 埋导孔Burn-in 高温加速老化试验Burning 烧焦Burr 毛头Bus Bar 汇电杆Butter Coat 外表树脂层By-product 副产品,副产物C-stage C阶段Controlled Collapse Chip Connection(C4 Chip Joint)C4芯片焊接Cable 电缆CAD 计算机辅助设计Calendered Fabric 轧平式网布Camcorder 摄录像(像)机Cap Lamination 帽式压合法Capacitance 电容Capaci电容耦合Capillary Action 毛细作用Capillary Direct Film(CDF) 毛细式直接版膜Capture Pad 微盲孔之外环,面环Carbide 碳化物Carbon Arc Lamp 碳弧灯Carbon lnk 碳胶,碳膜Carbon Treatment, Active 活性碳处理Card 卡板Card Cages, Card Racks 电路板构装箱Carlson Pin 卡式定位梢Carrier 载体Cartridge 滤芯Cascade Rinse 连续溢流式清洗Castallation 堡型集成电路器Catalyzed Board, Catalyzed Substrate (or Material)催化板材Catalyzing 催化Cathode 阴极Cathode Rod Agitation 阴极杆搅拌Cation 阴向游子,阳离子Caul Plate 隔板Cavitation 空泡化,半真空状态Cavity Down/Cavity Up 方凹区朝下或朝上Cell Phone 行动电话Center-to-Center Spacing 中间间距Ceramics 陶瓷Cermet 陶金粉Certificate 证明书CFC 氟氯碳化物Chamfer 倒角Characteristic lmpedance 特性阻抗Chase 网框Check List 检查清单Chelate 螯合,螯合剂,ChelatorChemical Milling 化学研磨Chemical Resistance 抗化性,耐化性Chemisorption 化学吸附Chip 晶粒,芯片,片状Chip Clearance 排屑间隙Chip Clogging 堵屑,塞屑Chip interconnection 芯片互连Chip On Board(COB) 晶板接装法Chip on Flex (COF) 芯片直接安装软板Chip On Glass (COG) 晶玻接装法(芯片对玻璃电路板的直接安装) Chip Scale Package 芯片级封装Chisel 錾刃Chlorinated Solvent 含氯溶剂,氯化溶剂Choline Hydroxide 瞻碱Circuitization 成线Circumferential Separation 环状断孔Clad/Cladding 披覆Clean Room 无尘室,洁净室Cleanliness 清洁度Clearance 空环,余隙Clinched Lead Terminal 紧箝式引脚Clinched-wire Through Connection 通孔弯线连接法Clip Terminal 绕线端接Clock Frequency(Clock Speed Clock Rate) 频率速率Coat, Coating 皮膜,表层Coaxial Cable 同轴缆线Coefficient of Thermal Expansion 热膨胀系数Co-firing 共烧Cold Flow 冷流Cold Solder Joint 冷焊点Collapse 塌扁Collect 夹头,夹筒Collimated Light 平行光Colloid 胶体Columnar Structure 柱状组织Comb Pattern 梳型电路Commodity Board 商品板Comparative Tracking lndex 比较性漏电指数Complex lon错离子Component Density 零件密度Component Hole 零件孔Component Orientation 零件方向Component Side 组件面Composite Epoxy Material (CEM)环氧树脂复合板材Compositech 非纺织型玻织布Composites(CEM-1,CEM-3) 复合板材Condensation Soldering 凝热焊接,液化放热焊接Conditioning 整孔Conductance 导电Conductive Adhesive 导电胶Conductive Anodic Filament 玻织纱式漏电Conductive Paste 导电膏Conductive Salt 导电盐Conductivity 导电度Conductor Spacing 导体间距Conform贴护层,护形Conformal Mask 铜窗Conformity 吻合性,服贴性Connector 连接器Contact Angle 接触角Contact Area接触区Contact Resistance 接触电阻Continuity 连通性Continuous Lamination 连续压合,连续层压Contract Electronic Manufacturer (CEM or CM) 电子品合同式制造商Contract Service 协力商,分包商,外包厂Controlled Colaspse 定高坍塌Controlled Depth Drilling 定深钻孔Conversion Coating 转化皮膜Coplanarity 共面性Copolymer 共聚物Copper Foil 铜箔,铜皮Copper-invar-Copper(ClC) 综合夹心板Copper Mirror Test 铜镜试验Copper Paste 铜膏Core(Board) 核心板,核板Core Material 内层板材,核材Corner Crack通孔断角Corner Mark 板角标记Counterboring 垂直向下扩孔,埋头孔Counterflow (槽液)上下翻流,上下回流Countersinking 锥型扩孔,喇叭孔Coupling Agent 耦合剂Coupon, Test Coupon 板边试样Coverlayer, Coverlay 表护层Crack 裂痕Crater 弹坑,凹坑Crazing 白斑Crease 皱褶Creep 潜变Crossection Area 截面积Crosshatching 十字交叉区Crosshatch Testing 十字割痕试验Crosslinking, Crosslinkage 交联,回桥Crossover 越交,搭交Crosstalk 噪声,串讯Crush zone 磨碎区Crystalline Melting Point 晶体熔点Cure 硬化,熟化Current-Carrying Capability 载流能力Current Density 电流密度Curtain Coating 濂涂法Cycle Mode逐次打击式D-glass D玻璃Daisy Chained Design, Daisy Chaining 菊瓣设计, 菊花瓣连垫Datum Reference 基准参考点Daughter Board 子板Debris 碎屑,残材Deburring 去毛头Decibel(Db) 分贝Declination Angle 斜射角Definition 边缘齐直度,边缘逼真度Degradation 劣化Degrasing 脱脂Deionized Water 去离子水Delamination 分层Delay Line(Serpentine Line) 延迟线路(蛇形线路)Dendritic Growth 枝状生长Denier 丹尼尔Densitomer 透光度计Dent 凹陷Depanelization 切开,分开Deposition 沉积,附积,皮膜处理Desiccator 干燥器Desmearing 除胶渣Desoldering 解焊Developer 显像液,显像机Developing 显像Deviation 偏差Device 电子组件Demetting 缩锡Diazo Film 偶氮棕片Dichromate 重铬酸盐Dicing 芯片分割Dicyandiamide(Dicy) 双氰胺Die 冲模,铸模Die Attach 晶粒安装Die Bonding 晶粒接着Die Stamping 冲压Dielectric 介质Dielectric Breakdown 介质崩溃Dielectric Breakdown Voltage 介质崩溃电压Dielectric Constant 介质常数Dielectric Strength 介质强度Differential Scanning Calorimetry(DSC) 微差扫瞄熟卡分析法Diffusio扩散层Digitizing 数字化Dihedral Angle 双反斜角Dimensional Stability 尺度安定性,尺寸安定性Dimensional Stable Anode(DSA) 尺度稳定之阳极Dimple 酒窝,微凹Diode 二极管DlP(Dual lnline Package) 双排脚封装体Dip Coating 浸涂法Dip Soldering 浸焊法Dipole 偶极,双极Direct Clip Attach(DCA) 芯片直接安装在电路板Direct Emulsion 直接乳胶Direct/ lndirect Stencil 直间版膜Direct Plating 直接电镀,直接镀板Discrete Component 散装零件Discrete Wiring Board 散线电路板,复线板Dish Down 碟型下陷Dispensing 逐点分配,定点分配,定量分配Dispersant 分散剂Disspation Factor 散失因素Disturbed Joint 受扰焊点Doctor Blade 修平刀,刮平刀Dog Bone Design 哑铃式(原文狗骨式)互连设计Dog Ear 狗耳Doping 掺杂Double Access 双面露出Double Density 双倍密度Double Layer 电双层Double Treated Foil 双面处理铜箔Drag ln/Drag Out 带进/带出Drag Soldering 拖焊Drawbridging 吊桥效应Drift 漂移Drill Facet 钻尖切削面Drill Pointer 钻针重磨机Drilled Blank 已钻孔的裸板Dross 浮渣Drum Side铜箔光面,光胴面Dry Film干膜Dual Wave Soldering双波焊接Ductility 展性Dummy, Dummying 假镀片(板),假镀Dummy Land 假垫Durometer 橡胶硬度计DYCO strate电浆蚀孔增层法Dynamic Flex (FPC) 动态软板Dynamic Flexible Printed Board 动态软板Dynamic Mechanical Analysis (DMA) 动态热机分析法E-Beam(Electron Beam) 电子束E-glass 电子级玻璃Eddy Current 涡电流Edge-Board Connector 板边(金手指)承接器Edge-Board contact 板边金手指Edge Clip 板边插针Edge-Dip Solderability Test 板面焊锡性测试Edge Spacing 板边空地,边宽EDTA 乙二胺四醋酸Eductor (液中)强流器,增流器Effluent 排放物Elastomer 弹性体Electric Strength (耐)电性强度Electro-deposited Photoresist 电着光阻,电泳光阻Electrodeposition 电镀Electroforming 电铸Electroless Deposition 无电镀,化学镀Electroless Nickel/lmmersion Gold(EN/LG)化镍浸金Electrolytic Cleaning 电解清洗Electrolytic Tough Pitch 电解铜Electro-migration 电迁移Electronic Package Hierarchy 电子构装层极Electro-phoresis 电泳动,电渗,电子构装Electro-static Damage 静电伤害Electro-tinning 镀锡Electro-winning 电解治炼Elongation 延伸性,延伸率Embossing 凸出性压花EMF 电动势EMI 电磁干扰Emulsion 乳化Emulsion Side 药膜面Encapsulating 囊封,胶囊Encapsulation 封胶,封包Encroachment 沾污,侵犯End Cap 封头Entek 有机保焊处理Entrapment 夹杂物Entry Material 盖板Epoxy Resin 环氧树脂Etchant 蚀刻剂,蚀刻液Etchba回蚀Etch Factor 蚀刻因子,蚀刻函数Etching Indicator 蚀刻指标Etching Resist 抗蚀阻剂Eutetic Composition 共融组成Excimer Laser 准分子雷射Exotherm 放热(曲线)Expanded PTFE 扩张型“聚四氟乙烯”补强材简写为ePTFEExposure 曝光Eyelet 铆眼Fabric 网布Face Bonding 晶面朝下之结合Failure 故障,损坏Failure Analysis 故障分析Fan Out Wiring/Fan In Wiring扇出布线/扇入布线Farad 法拉Faraday 法拉第Fatigue Strength 抗疲劳强度Fault 缺陷,瑕疵Fault Plane 断层面Feasibility Analysis 可行性分析Features 成员,诸元Feed Through Hole 导通孔Feeder 进料器,送料器Fiber Exposure 玻纤显露Fiducial Mark 基准记号,光学靶标Filament 纤丝,单丝Fill 纬向Filler 填充料Fillet 内圆填角,填锡Film 底片Film Adhesive 接着膜,黏合膜Filter 过滤器,滤光镜片,滤波器Final Finishing 外表处理,终面处理Fine Line 细线Fineness 纯度,成色,粒度Fine Pitch 密脚距,密线距,密垫距Finger 手指(板边连续排列接点)Finishing 终饰,终修Finite Element Method 有限要素分析法First Article首产品First Pass-Yield 初检良品率Fish Bone Chant 鱼骨图Fixture 夹具Flair 第一面外缘变形,刃角变形Flag 芯片安置区Flame Point 自燃点Flammability 燃性Flame Resistant 耐燃性Flammability Rate 燃性等级Flare 扇形崩口Flash Plating 闪镀Flashover 闪络Flat Coat 全平涂布,板面平铺Flat Plug 平塞,平填Flat Cable 扁平排线Flat Pack 扁平封装(之零件)Flatness 平坦度Flexible Printed Circuit ,FPC 软板Flexural Failure 挠曲故障Flexural Module 弯曲模数,抗挠性模数Flexural Strength 抗挠强度Flexural Strength at Elevalted Temperature 高渐中抗挠强度Flip Chip 覆晶,扣晶Flip Chip Packaging 覆晶封装法(或组装法)Floating Shielding 浮起式挡架Flocculation 絮凝,凝聚Flood Stroke Print 覆墨冲程印刷Flow Soldering 流焊Fluorescence 荧光Flurocarbon Resin 碳氟树脂Flush Board 表面全平板Flush Conductor 嵌入式线路,贴平式导体Flush Point 闪火点Flute 退屑槽Flux 助焊剂Flying Lead 飞脚Foil Burr 铜箔毛边Foil Lamination 铜箔压板法Foot 残足Foot Print(Land Pattern) 脚垫Foreign Material 外来物,异物Form-to-List 布线说明清单Four Point Twisting四点扭曲法Freeboard 干舷Free Radical 自由基,自由根Frequency 频率Frit 玻璃熔料Fully-additive Process 全加成法Fungus抗霉性Fused Coating 熔锡层Fusing 熔合Fusing Fluid 助熔液Gage, Gauge量规Gallium Arsenide(GaAs) 砷化镓Galvanic Corrosion 贾凡尼式腐蚀Galvanic Series 贾凡尼次序Galvanizing 镀锌Galvanometer Mirror 电流计式反射镜GAP 第一面分离,长刃断开Gas Knife Cooling 氯刀冷却法Gate Array 阐极数组,阐列Gel Time 胶性时间Gelation Particle 胶凝点Gerber Date, Gerber File格博档案GETEK 奇异公司板材Ghost image 阴影Gilding 镀金Glass Fiber 玻纤Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破Glass Transition Temperature , Tg 玻璃态转化温度Glaze 釉面,釉料Glob Top 圆顶封装体Globule Test 球状测试法Glycol(Ethylene Glycol) 乙二醇Golden Board 测试用标准板Grain Size 结晶粒度Graphite 石墨Grid 标准格Ground Plane(or Earth Plane) 接地层Ground Plane Clearance 接地空环Gull Wing Lead 鸥翼引脚Grid Spacing(Distance) 格距,孔距Gross Leak 大漏Guide Pin导针GP (Global Warming Potentials) 地球温室潜因Galf Angle 半角Halide 卤化物Haloing 白圈,白边Halon 海龙Halation 环晕Hard Anodizing 硬阳极化Hard Chrome Plating 镀硬铬Hard Soldering 硬焊Hardener 硬化剂Hardness 硬度Haring-Blum Cell 海因槽Harness 电缆组合Hay Wire 跳线Heat Cleaning 烧洁Heat Dissipation 散热Heat Distortion Point (Temp.) 热变形点(温度)Heat Sealing 热封Heat Sink 散热器Heat Sink Plane 散热层Heatsink Tool 散热工具Heat Transfer Paste 导热膏,传热膏Hertz(tz) 赫High Efficiency Particulate Air Filter高效空气尘粒过滤机Hi-Rel 高可靠度Hipot Test 高压电测Hit 击Holding Time 停置时间Hole Breakout 孔位破出Hole Counter 数孔机Hole Density 孔数密度Hole Location 孔位Hole Preparation 通孔准备Hole Pull Strength 孔壁抗拉强度Hole Void 破洞Hook 切削刃缘外凸Hot Air Solder Levelling (HASL) 喷锡Hot Bar (Reflow) Soldering 热把焊接Hot Gas Soldering 热风手焊Hot Roll Lamination 热转轴压贴法THE (High Temperature Elongation) 高温延伸性(率) Hull Cell 哈氏槽Hybrid integrated Circuit 混成电路Hydraulic Bulge Test 液压鼓起试验Hydrogen 氢气Hydrogen Embrittlement 气脆Hydrogen Overvoltage 氢超电压,氢过电压Hydrolic Pressure 液压,油压Hydrolysis 水解Hydrophilic 亲水性Hygroscopic 吸湿性Hypersorption 超吸附I. C. So集成电路器插座icicle 锡尖Illuminance 照度Image Transfer 影像转移,图像转移Imaging 成像处理Immersion Plating 浸镀Immersion Silver 浸镀银Immersion Tin浸镀锡Impedance 阻抗Impedance Match 阻抗匹配Impinge 冲打Impregnate 含浸In-circuit Testing 组装板电测Inclusion 异物,夹杂物Interconnection Defect (ICD)孔壁与孔环互连处之缺失Indexing Hole 基准孔,参考孔Inductance (L) 电感In-feed Rate(Down-feed Rate) 进刀速率Information Appliance(IA) 信息家电Infrared (IR) 红外线Input/Output 输入/输出Insert, Insertion 插接,插装Inspection Overlay 重合套检底片Insulation Resistance 绝缘电阻Integrated Circuit (IC) 集成电路器Interconnection 互连Interface 界面Intermatallic Compound(IMC) 界面合金共化物Internal Stress 内应力Interposer 互连导电物,互连体Interstitial Via Hole (IVH)/Inner Hole局部层间导通孔,内通孔Invar 殷钢Ion Cleanliness 离子清洁度Ion Exchange Resins 离子交换树脂Ion Migration 离子迁移Ionizable (Ionic) Contaimination 离子性污染Ionization 游离,电离Ionization Voltage (Corona Level)电离化电压(电晕水平)IPC 美国印刷电路板协会Isolation 隔离性,隔绝性Isotropic Conductive Adhesive 均向导电胶J-Lead J型接脚,弯钩型接脚JEDEC 联合电子组件工程委员会Job Shop 专业工厂,职业工厂Joule 焦耳Jump Wire 跳线Junction 接(合)面,接头Just-In-Time (JIT) 适时供应,及时出现Kapton 聚亚酰胺软材Karat 克拉,开Kauri-Butanol Value考立丁醇值(简称K.B值) Kerf 切形,裁截Kevlar 聚酰胺纤维Key 电键Key Board 键盘,键盘板Kiss Pressure 吻压,低压Knoop Hardness 努普硬度Known Good Die (KGD) 已知之良好芯片Kovar 科伐合金Kraft Paper 牛皮纸Lamda Wave 延伸平波Laminar Flow 平流Laminar Structure 片状结构Laminate Void 板材空洞Lamination Void 压合空洞Laminate(s) 基板/积层板Laminator 压膜机Land 孔环焊垫,表面(方型)焊垫Land Grid Array (LGA) 承垫(焊垫)格列封装法Landless Hole 无环通孔Large Window 开大窗Laser 雷射,激光Laser Ablation 雷射烧蚀,雷射成孔Laser Ablation Thresholds 烧蚀起限Laser Absorption (Absortance) 雷射吸收度Laser Beam Divergence雷射散射光束Laser Conformal Mask 铜窗Laser Direct Imaging (LDI) 雷射直接成像Laser Fluence 能量密度Laser Heat Affedted Zone 雷热感应Laser Machining 雷射加工法Laser Photochemical Ablation 光化性裂蚀Laser Photogenerator (LPG), Laser Photoplotter 雷射曝光机Laser Photothermal Ablation光热性烧蚀Laser Power Density 功率密度Laser Pulse Frequency 脉冲频率Laser P脉冲稳定性Laser Pulse Width, Pulse Length (or Pulse Duration) 脉冲长度Laser Soldering 雷射焊接法Laser Structuring 雷射成线术Laser Trepanning 雷射环锯成孔法Lay Back 刃角磨损,突刃Lay Up 迭合Layout 布线,布局Layer to Layer Registration 层间对准度Layer to Layer Spacing 层间距离Leaching 焊点熔渗,漂出,溶出Lead 引脚,接脚Lead Frame 脚架Lead Pitch 脚距,中距,跨距Leading Edge 尖端,先锋Leakage Current 漏电电流Learning Curve 学习阶段,学习曲线Legend 文字标记,符号Leveling 整平Lifted Land 孔环(或焊垫)浮起Ligand 错离子附属体Light Integrator 光能累积器,光能积分器Light Emitting Diodes ,LED 发光二极管Light Intensity 光强度Limiting Current Density 极限电流密度Lipophilic 亲油性Liquid Crystal Display ,LCD 液晶显示器Liquid Crystal Polyester Fiber(LCP)液晶聚酯类纤维Liquid Dielectrics 液态介质Liquid Photoimagible Solder Mask, LPSM液态感光防焊绿漆Lithography 影像转移,网印技术Local Area Network 局域网络Logic 逻辑Logic Circuit 逻辑电路Loop 回路Loss Tamgent(TanδD k) 损失正切Lot Size 批量Luminance 发光强度,耀度Lyophilic 可亲水性胶体Macro-throwing Power 巨观分布力Major Defect 严重缺点,主要缺点Major Weave Direction 主要纤向Margin 刃带,脉筋Marking 标记Mask 阻剂Mass Finishing 大量整面,大量抛光Mass Lamination 大型压板(层压)Mass Transport 质量输送Master Drawing 主图Mat 席Matte Side 毛面Mealing 泡点Mean Time To Failure 故障前可使用之平均时数Measling 白点Mechanical Stretcher 机械式张网机Mechanical Warp 机械性缠绕Mechanism 机理Membrane Switch薄膜开关Meniscograph Test 弧面状沾锡试验Meniscus 弯月面,上凹面Mercury Vaper Lamp汞气灯Mesh Count 网目数Metal core Boad (Sulstrate) 金属夹心板Metal Halide Lamp 金属卤素灯Metallization 金属化Metallized Fabric 金属化网布Metal phototool 金属底片Micelle 微胞Micro BGE (μ-BGA) 微型BGAMicro –electronics 微电子Microetching 微蚀Microsectioning 微切片法Microstrip 微条线,微带线Microstrip Line 微条线,微带线Microthrowing Power 微分布力Microvia 微盲孔,微孔Microwave 微波Microwire Board 复线板,微封线(漆包线)路板Migration 迁移Migration Rate 迁移率Mil 英丝,条Minimum Annular Ring 孔环下限Minimum Electrical Spacing下限电性间距,最窄电性间距Minor Weave Direction 次要纤向Misregistration 失准,对不准Mixed Component Mounting T echnology混合零件之组装技术Modelling 模型法,模式法Modem调变及解调器,调制解调器Modification 修改,改质Module 模块Modulus of Elasticity 弹性模数,弹性系数Moisture Absorption 吸湿率,吸水率(又名Water Absorption)Moisture and Insulation Resistance Test湿气与绝缘电阻试验(MIR)Mold Release 脱模剂,离型剂Mole 摩尔,克分子,克原子Monofilament 单丝Mother Board 主构板,母板,主机板Moulded Circuit 模造立体电路板Mounting Hole 组装孔,机装孔Mouse Bite 鼠齿Multi-Chip-Module (MCM) 多芯片(芯片)模块Multiwiring Board(or Discrete Wiring Board)复线板Nail Head 钉头N.C 数值控制Near IR 近红外线Needle Dispense 针管注射法Negative 负片,钻尖第一面外缘变窄Negative-acting Resist 负性作用之阻剂,负型阻剂Negative Etchback 反回蚀Negative Stencil 负性感光版膜Network 网状组件Newton (N) 牛顿Newton Ring 牛顿环Newtonian Liquid 牛顿流体Nick 缺口N-Methyl Pyrrolidine (NMP) N-甲基四氢比咯Noble Metal Paste 贵金属印膏Node 节点Nodule 瘤Noise Budget 噪声上限Nomencleature 标示文字符号,命名法Nominal Cured Thickness 标示厚度Non-circular Land 非圆形孔环焊垫Non-contact Testing 非接触性电性测试Non-flammable 非燃性Non-Flow 非流性Non-recurring Engineering Cost 非经常性工程成本Non-Wetting 不沾锡Normal Concentration (Strength) 标准浓度,当量浓度Normal Distribution 常态分配,常态分布Novolac 酯醛树脂Nucleation, Nucleating 核化Numerical Control 数值控制,数控Nylon 耐龙Occlusion 吸藏Off-contact 架空Offset 第一面大小不均OFHC 无氧高导电铜Ohm 奥姆Oilcanning 盖板弹动OLB(Outer Lead Bond) 外引脚结合Oligomer 寡聚物Omega Meter 离子污染检测仪Omega Wave 振荡波On-contact Printing 密贴式印刷Opaquer 不透明剂,遮光剂Open Circuits 断线Optical Comparator 光学对比器(光学放大器) Optical Density 光密度Optical Fiber 光纤Optical Inspection 光学检验Optical Instrument 光学仪器Organic Solderability Preservatives 有机保焊剂Osmosis 渗透Outgassing 出气,吹气Outgrowth 悬出,横出,侧出Output 产出,输出Overflow 溢流Overhang 总浮空Overiap 钻尖点分离Overpotential (Overvoltage) 过电位,过电压Oxidation氧化Oxidation Reduction Potential(ORP)氧化还原电位Oxygen lnhibitor 氧气抑制现象Ozone Depletion 臭氧层耗损Ozone Killer 臭氧层杀手Packaging 封装,构装Packaging Efficiency 封装效率Pad 焊垫,圆垫Pad Master 圆垫底片(孔位底片)Pads on Via 盖盲孔,反盲孔Pads Only Board 唯环板Palladium 钯Panel 生产板面,制程(排)板,一个大片板Panel Plating 全板镀铜,Panel P全板电镀法Paper Phenolic 纸质酚醛树脂(板材) Parasitics Capacity (Capacitance) 寄生电容Parting Agent 脱膜剂Passivation 钝化,钝化处理Passive Device (Conponent) 被动组件(零件) Paste 膏,糊Pastevia 铜膏导孔Pattern 板面圆形Pattern Plating 线路电镀(大陆术语称圆形电镀) Pattern Process 线路电镀法Peak Voltage 峰值电厌Peel Strength 抗撕强度Periodic Reverse(PR) Current 周期性反电流Peelable Resist 可剥胶,可撕阻剂Perimeter Array 周边排列,四周排列Periodic Reverse(PR) Current 周期性反向电流Peripheral 周边附属设备Permeability 透气性,导磁率Permittivity 容电率(日文为诱电率)Phase 相Phase Diagram 相图Phenolic 酚醛树脂Ph Value 酸碱值Photofugitive 感光褪色Photographic Film 感光成像之底片Photo-imagible Dielectric (PID) 感光介质(材料) Photoinitiator 感光启始剂Photomask 光罩Photoplotter, Plotter 光学绘图机Photoresist 光阻Photoresist Chemical Machining (Milling)光阻式化学(铣刻)加工Phototool 底片Photo-Via 感光孔,感光成孔Pick and Place 拾取与放置Piezoelectric 压电性Pin 接脚,插梢,插针Pin Grid Array (PGE) 针脚格列封装体Pin-In-Paste (PIP) 锡膏中插脚Pinhole 针孔Pink Ring 粉红圈Pitch 跨距,脚距,垫距,线距,中距Pits 凹点Plain Weave 平纤Planarity 平坦性Planarization 精密磨平,精密压平Plasma 电浆Plasticizers 可塑剂,增塑剂Plated Through Hole ,PTH 镀通孔Platen 热盘Plating 镀Plotting 标绘Plowing 犁沟Plug 插脚,塞柱Plug Gauge 孔规Ply 层,股Pneumatic Stretcher 气动拉伸器Pogo Pin 伸缩探针Point Angle 钻尖角Point Source Light 点状光源Point 钻尖Poise 泊Polar Solvent 极性溶剂Polarity 电极性Polarization 分极化,极化Polarizing Slot 偏槽Poly Solder 聚合物焊料Polyester Films 聚酯类薄片Polyimide (PI) 聚亚酰胺Polymer Thick Film(PTF) 厚膜糊Polymerization 聚合,聚合反应Popcorn Effect 爆米花效应Porosity Test 疏孔度试验Positive Acting Resist 正型(性)光阻剂Post Separation 后制程分离,事后分离Post Treatment 后处理Postcure 后续硬化,后烤Pot Life 适用期,堪用时段Potting 铸封,模封Porcelain 瓷材,瓷面Power Supply 电源供应器Preform 预制品Preheat 预热Prepreg 胶片,树脂片Press Plate 钢板Press-Fit Contact 挤入式接触Pressure Cooker Test 压力铜试验Pre-tinning 预先沾锡Primary image 线路成像Probe 探针Pressure Foot 压力脚Print and Etch 印后即蚀,成像后立即蚀刻Print Through 压透,过度挤压Prism Hole Inspector 九孔镜Process Camera 制程用照像机Process Window 操作范围Production Master 生产底片Profile 轮廓,剖面图,升温曲线图,棱线Propagation 传播Propagation Delay 传播延迟Puddle Effect 水坑效应Pull Away 拉离Pulse Plating 脉冲电镀法Pumice Powder 浮石粉Punch 冲切Purge, Purging 净空,净洗Purple Plague 紫疫Pyrolysis 热裂解,高温分解Q-Factor (Quality Factor) (板材之)质量因素Quad Density 四倍密度Quad Flat Pack(QFP) 方扁形封装体Qualification 资格认可Qualification Agency 资格认证机构Qualification inspection 资格检验Qualified Products List 合格产品(供应者)名单Qualitative Analysis 定性分析Quality Assurance 质量保证Quality Conformance Test Circuitry (Coupon) 质量符合之试验线路(样板)Quality Control 质量管理Quality Inspection 质量检查,质量检验Quantitative Analysis 定量分析Quench 淬火,骤冷Quick Disconnect 快速接头Quill 纬纱绕轴Rack 挂架Radial Lead 放射状引脚Radio Frequency Interference (RFL) 射频干扰Radiometer 辐射计,光度计Rake Angle (or Helix Angle)耙起角,盘旋角,抠角,耙角Rated Temperature, Voltage 额定温度,额定电压Reactance 电抗Real Estate 板面空地,底材面,基板面Real-Time System 实时系统Reclaiming 再生,再制Reel to Reel 卷轮(盘)式操作Reference Dimension 参考尺度,参考尺寸Reference Edge 参考边缘Reflection 反射Reflow Profile 熔焊温度曲线Reflow Soldering 重熔焊接,熔焊Refraction 折射Refractive Index 折射率Register Mark 对准用标记Registration 对准度Reinforcement 补强物,补强材Rejection 剔退,拒收Relamination (Re-Lam) 多层板压合Relative Permitivity(ε) 相对容电率Relaxation 松驰,缓和Relay 继电器Release Agent , Release Sheets 脱模剂,离型膜Reliability 可靠度,信赖度Relief 削空Relief Angle 浮角,切削浮角,浮空角Repair 修理Repeated Insertion 多次插触Resin Coated Copper Foil 背胶铅箔Resin Content 胶含量,树脂含量Resin Flow 胶流量,权脂流量Resin Recession 树脂缩陷Resin Rich Area 树脂丰富区,多胶区Resin Smear 胶糊渣,胶渣Resin Starved Area 树脂缺乏区,缺胶区Resist 阴剂,阴膜Resistivity 电阻系数,电阻率Resistor 电阻器,电阻Resistor Drift 电阻漂移Resistor Paste 电阻印膏Resolution 解像,解像度,分辨率Resolving Power 解析力,解像力(分辨力) Retraction Rate 退刀(针)速率Return Path 归路,回程Reverse Blind Hole反盲孔,压合盲孔Reverse Current Cleaning 反电流(电解)清洗Reverse Etchback 反回蚀Reverse lmage 负片影像(阻剂)Reverse Osmosis (RO) 逆渗透Revers反转,还原Revision 修正版,改订版Rework (ing ) 重工,再加工Rhology流变学,流变性质Ribbion Cable 圆线缆带Rigid-Flex Printed Board 硬软合板Ring 套环Rinsing 水洗,冲洗Ripple 纹波Rise Time(tr) 升起时间,上升时间Roadmap 产品变化趋势Robber 辅助阴极Roll to Roll (Reel to Reel) 卷轴对卷轴(连续生产位)Rolled and Annealed Copper Foil (RA Foil) 辊辗铜箔,压延铜箔Roller Coating 滚筒涂布法,辊轮涂布法Roller Cutter 辊切机(业界俗称锯板机)Roller Tinning 辊锡法,滚锡法Rosin 松香Rotary Dip Test 摆动沾锡试验Route and Retain Stiffeners(软板)切术外形之补强模板Routing 切外型Runout 偏转,累积距差Rupture 进裂Sacrificial Protection 牺牲性保护层Salt Spray Test 盐雾试验Sand Blast 喷砂Saponification 皂化作用Saponifier 皂化剂Satellite Handset 卫星行动电话手机Satin Finish 缎面处理Scaled Flow Test 比便流量试验Scavening 刮凹,刮走,刮凹带走Schematic Diagram 电路概略图Scoring 刻沟,刻槽,V型刻槽Scratch 刮痕Screen Printing 网版印刷Screenability 网印能力Scrubber 磨刷机,磨刷器Sculptured Flex Circuit 雕刻式软板Scum 透明歼膜Sealing 封孔Secondary Side 第二面Seeding 下种Selective Plating 选择性电镀Self-Alignment 自我回正Self-Distinguishing 自熄性Selvage 布边Semi-additive Process 半加成制程Semiconductor 半导体Sensitizing 敏化Separable Component Part 可分离式零件Separator Plate 隔板,钢板,镜板Sequential Build-UP(SBU) 完工后(逐次)增层Sequential Buried Via(SBV) 增层后之埋孔Sequential Electrochemical Reduction Analysis (SERA) 顺序性电化学还原分析法Sequential Lamination 接续压合法,镀后压合式制程Sequestering Agent 螫合剂Serpentine Line 蛇形线路Shadowing 阴影,回蚀死角Shadow Moire (or Ther Moire) 莫瑞光影法Shear Strength 抗剪(力)强度Shelf Life 储龄Shield 遮蔽,屏遮Shore Hardness 萧氏硬度Short 短路Shoulder Angle 肩斜角Shunt 分路Side Wall 侧壁Siemens 电阻值Sigma(Stamdard Deviation) 标准差Signal 讯号Signal Integrity (SI) 讯号完整性Silane 硅烷Silica Gel 硅胶砂Silicon 硅Silicon Platforms 封装载板,硅芯片平柜Silicone 硅铜Silk Screen 丝网Silver Migration 银迁移Silver Paste 银膏Silver Fhrough Hole (STH) 银胶贯孔,银胶通孔Single-Inline Package (SIP) 单边插脚封装体Singulation 单片化,裁切单片Sintering 烧结Sizing 上浆处理,上浆Skew (讯号)正时歪斜,错时Skin Effect 集肤效应,表皮效应Skip Printing, Skip Plating 漏印,漏镀Skip So缺锡,漏焊Slash Sheet (规范)附列规格单Slashing 浆经Sleeve Jint 套接Sliver 边丝,边条Slot, Slotting 槽口,开槽Sludge 沉殿物,淤泥Smear 胶糊渣,胶渣Smudging 锡点沾污Snap-off 弹回高度Socket 插座Soft Contact 轻触Soft Glass 软质玻璃(铅玻璃)Solder 焊锡Solder Ball 焊锡球,锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Column Package 锡柱脚封装法Solder Connection 焊接点Solder Coat 焊锡皮膜Solder Dam 防焊,锡堤,阻焊堤Solder Fillet 填锡Solder Joint Density 焊点密度Solder Levelling 喷锡,热风整平Solder Mask(S/M) 绿漆,防焊膜Solder Paste 锡膏Solder Plug 锡塞,锡柱Solder Preforms 预焊料Solder Projection 焊锡突点Solder Sag 焊锡垂流物Solder Side 焊锡面Solder Spatter 溅锡Solder Splash 溅锡Solder Spread Test 散锡试验Solder Webbing 锡网Solder Wicking 焊锡之灯芯效应,渗锡Solder Wire 焊锡丝,软焊丝Solderability 焊锡性,可焊性Soldering 软焊,焊接Soldering Fluid Soldering oil 助焊液,护焊油Soldering iron 烙铁,焊枪Solid Content 固体含量,固形份,固形物Solidus Line 固相线Solubility Product 溶解度乘积,溶解度积Spacing 间距Span 跨距Spark Over 闪络Specification (Spec) 规范,规格Specific Heat 比热Specimen 样品,试样Spectrophotometry 分光光度计检测法Spindle 钻轴,主轴Spinning Coating 自转涂布Splay 斜钻孔Spoke Connection 轮辐状连接垫Spray Coating 喷着涂装,喷射涂装Spur 底片图形边缘突出Spurs and Nodules 突刺与歼瘤Sputtering 溅射Squeege 刮刀Stacked Height 迭高Stacked Microvia 迭置式微盲孔Stacked CSP (Stacked Chips) 重迭式芯片级封装体Stagger Grid 蹒跚格点Stalagometer 滴管式表面张力计Stand-off Terminals 直立型端子Starvation 缺胶State of the Art 艺术境界Static Eliminator 静电消除器Steel Rule Die (钢)刀模Stencil 版膜Step and Repeat 逐次重复曝光Step Microvia (Via) 梯阶式微盲孔(盲孔)Step Plating 梯阶式镀层Step Tablet 阶段式(光密度)曝光表Stiffener 补强条,补强板Stop-off 阻剂,防镀膜Strain 变形,应变Strand 绞Stray Current 迷走电流,散杂电流Stress Corrosion 应力腐蚀Stress Relief 消除应力Strike 预镀,打底Stringing 拖尾,牵丝Stripline 条线,带线Stripper 剥除液,剥除器Stub 支线,线脚Sublimates 升华Substractive Process 减成法Substrate 板材,素材,底材,封装载板。
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排序
英语
简称
注解
A
Accelerate Aging
加速老化
使用人工的方法，加速正常的老化过程。
Acceptance Quality Level (AQL)
一批产品中最大可以接受的缺陷数目，通常用于抽样计划。
Acceptance Test
用来测定产品可以接受的试验，由客户与供应商之间决定。
软板
是一种特殊性质的线路板，在组装时可做三维空间的外形变化，其底材为可挠性的聚亚酰胺（PI）或聚酯类（PE）。这种软板也可以象硬板一样，可作镀通孔或表面装配。
Flexural Strength
Board thickness
指包括基材和所有在上面形成导电层在内的总厚度。
Bonding Layer
结合层，指多层板之胶片层。
C
C-Staged Resin
处于固化最后状态的树脂。
Chamfer (drill)
钻咀柄尾部的角。
Characteristic Impendence
特性阻抗，平行导线结构对交流电流的阻力，通常出现在高速电流上，而且通常由在一定频率宽度范围的常量组成。
耐燃性
是指线路板在其绝缘的树脂中，为了达到某种燃性等级（在UL中分HB，VO，V1及V2），必须在其树脂的配方中加入某些化学药品（如在FR－4中加入20％以上的溴），是板材之性能可达到一定的耐燃性。通常FR－4在其基材表面之径向方面，会加印制造者红色的UL水印，而未加耐燃剂的G－10，则径向只能加印绿色的水印标记。
Dimensioned Hole
指线路板上的一些孔，其位置已经由其使用尺寸确定，不用和栅格尺寸一致。
Double-Side Printed Board
双面板
Drill body length
从钻咀的钻尖到钻咀直径与肩部角度交叉点处ຫໍສະໝຸດ 距离。EEyelet
铆眼
是一种青铜或黄铜制作的空心铆钉，当线路板上发现某一通孔断裂时，即可加装上这种铆眼，不但可以维持导电的功能，亦可以插焊零件。不过由于业界对线路板品质的要求日严，使得铆眼的使用越来越少。
Crease
皱褶
在多层板中常在铜皮处理不当时所发生的皱褶。
D
Date Code
周期代码
用来表明产品生产的时间。
Delamination
基材中层间的分离，基材与铜箔之间的分离，或线路板中所有的平面之间的分离。
DeliveredPanel (DP)
为了方便下工序装配和测试的方便，在一块板上按一定的方式排列一个或多个线路板。
Flare
扇形崩口
在机械冲孔中，常因其模具的不良或板材的脆化，或冲孔条件不对，造成孔口板材的崩松，形成不正常的扇形喇叭口，称为扇形崩口。
Flashover
闪络
在线路板面上，两导体线路之间（即使有阻焊绿漆），当有电压存在时，其间绝缘物的表面上产生一种“击穿性的放电”，称为“闪络”。
Flexible Printed Circuit,FPC
Circuit Card
见“Printed Board”。
Circuitry Layer
线路板中，含有导线包括接地面，电压面的层。
Circumferential Separation
电镀孔沿镀层的整个圆周的裂缝或空隙。
Crack
裂痕
在线路板中常指铜箔或通孔之镀层，在遭遇热应力的考验时，常出现各层次的部分或全部断裂。
C-Staged Resin
处于固化最后状态的树脂。
Chamfer (drill)
钻咀柄尾部的角。
Characteristic Impendence
特性阻抗，平行导线结构对交流电流的阻力，通常出现在高速电流上，而且通常由在一定频率宽度范围的常量组成。
Circuit
能够完成需要的电功能的一定数量的电元素和电设备。
F
Fiber Exposure
纤维暴露
是指基材表面当受到外来的机械摩擦，化学反应等攻击后，可能失去其外表所覆盖的树脂层，露出底材的玻璃布，称为纤维暴露，位于孔壁处则称为纤维突出。
Fiducial Mark
基准记号
在板面上为了下游的组装，方便其视觉辅助系统作业起见，常在大型的IC于板面焊垫外缘的右上及左下各加一个圆状或其它形状的“基准记号“，以协助放置机的定位。
Flair
第一面外形变形，刃角变形，在线路板行业中是指钻咀的钻尖部分，其第一面之外缘变宽使刃角变形，是因钻咀不当地翻磨所造成，属于钻咀的次要缺点。
Flammability Rate
燃性等级
是指线路板板材的耐燃性的程度，在既定的试验步骤执行样板试验之后，其板材所能达到的何种规定等级而言。
Flame Resistant
Base Material
基材
绝缘材料，线路在上面形成。（可以是刚性或柔性，或两者综合。它可以是不导电的或绝缘的金属板。）。
Base Material thickness
不包括铜箔层或镀层的基材的厚度。
Bland Via
导通孔仅延伸到线路板的一个表面。
Blister
离层的一种形式，它是在基材的两层之间或基材与铜箔之间或保护层之间局部的隆起。
B
Back Light
背光法
是一种检查通孔铜壁完好与否得放大目检方法，其做法是将孔壁外的基材自某一方向上小心的予以磨薄，再利用树脂半透明的原理，从背后射入光线。假如化学铜孔壁品质完好而无任何破洞或针孔时，则该铜层必能阻绝光线而在显微中呈现黑暗，一旦铜壁有破洞时，则必有光点出现而被观察到，并可放大摄影存证，称为背光法，但只能看到半个孔。
Access Hole
在多层线路板连续层上的一系列孔，这些孔的中心在同一个位置，而且通到线路板的一个表面。
Annular Ring
是指孔周围的导体部分。
Artwork
用于生产“Artwork Master”“production Master”,有精确比例的菲林。
Artwork Master
通常是有精确比例的菲林，其按1：1的图案用于生产“Production Master”。
Dent
导电铜箔的表面凹陷，它不会明显的影响到导铜箔的厚度。
Design spacing of Conductive
线路之间的描绘距离，或者在客户图纸上定义的线路之间的距离。
Desmear
除污
从孔壁上将被钻孔摩擦融化的树脂和钻孔的碎片移走。
Dewetting
缩锡
在融化的锡在导体表面时，由于表面的张力，导致锡面的不平整，有的地方厚，有的地方薄，但是不会导致铜面露出。