Polishing Metals

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ChemicalMechanicalPolishing(CMP)Overview[化学机械研磨(CMP)概述](PPT-54)

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CMP Consumables
• Slurries for oxide (SiO2) polishing – colloidal suspension of silica particles in alkaline medium – hydroxyl ions attack SiO2, causing softening and chemical dissolution (mechanism unverified) – particles range from 10 to 3000 nm, mean size 160 nm – 12% (wt) particles, KOH used to set pH ~11 – other concerns: particle size distribution (scratching), particle shape, particle agglomeration
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CMP Apparatus
Beaudoin, et al.
NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing
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CMP Basics (cont’d)
• Why do we need CMP? – for precise photolithography for advanced devices – for advanced multilevel metallization processes (Damascene)
– Mechanical action
• polisher rotation and pressure

FiberMark 建议的材料设置说明书

Polishing: Some steel alloys are easier to polish than others. For best results, clean off the surface with alcohol prior to processing. Any leftover grease, oils or residue can affect how well the polished mark turns out. Polishing the metal where the final marks result in a bright white engraving requires finer tuning of settings, more so than the etched or annealed marks. Determine a base speed and frequency setting and adjust the power in small increments/decrements. If you are unable to get a white bright mark, increase the frequency setting and try again by adjusting only the power.
Etching/Marking
600 DPI
Speed: 30 - 40% Power: 100% Frequency: 1% Focus: +.06 to +07
Speed: 40 - 50% Power: 100% Frequency: 1% Focus: +% Power: 100% Frequency: 1% Focus: +.06 to +07

金属表面处理中英文对照表

金属表面处理中英文对照表BRASS(SOLID BRASS銅ANTIQUE#古銅NICKEL叻色PEWTEF黑古銅DK.NICKE黑叻MATTED GOLD®金PLASTIC塑膠SATIN GOLDI砂金GOLDEN/SLIVE金/銀PEARL GOL珍珠金PEARL NICKE珍珠叻POLISHED BRASS 銅MATTED NICKE啞叻MATTED BLAC啞黑BRUSH BRAS掃黃銅BRUSH NICKE掃叻BRUSH GOLDI金TARNISHED BLAC木碳黑BRUSH ANTIQUI掃青古銅GUN METAL槍色BRUSH ANTI NICKE掃黑叻ANTIQUE NICKE淺黑叻BRUSH GUNMETA掃槍色LT GOLD淺金NICKEL FRE無叻叻PEARL GUN METALRED COPPE紅古銅MATTED CHROM 啞路色NKL FREE BRUSH ANTIQ無叻掃青古銅NICKEL FREE GO無叻真金LT GUN META 淺槍ANTIQUE SILVE 古銀色GRE Y NICKELL 叻ANTIQUE COPPERBRUSH MATTED GUN METAL 啞槍NKL FREE MATTED NICK fe叻啞叻NICKEL FREE DK. NICKE 叻黑叻ROLL P LATING GUN METAL電槍色NKL FREE ANTIQUE NICKB叻淺黑叻COPP ER原銅ROLL ANTIQU滾青古銅ALUMINIUM 鋁色BRUSH MATTED LT GO 掃啞淺金MATTED LT GOL 啞淺金SILVER!色BRUSH LT GOL掃淺金DULL ANTIQUE BRAS啞古銅ANTIQUE GOLD古金LT ANTIQUE淺青古銅ROSE GOL玫瑰金ALLOY合金色轲w姒ffaWOIN >0日MG 33dd IMNOaMffia^OIN 人3d9 33dd IMN丄NV ya轲諾S0MOIN ya 劇姒曹诃廻3I/\I Nno MG da 33dd IMN劇咖/丄3i/\i Nno MG Hsnya 劇眾QW丄3I/\I Nno 丄 1 33dd IMN oaBQWJ Hsnda 33dd IMN «ffaW-3iAi NnoHsnda 33dd IMNMQWmiAl Nno 33dd mOINBWQWO丄丄NV 33dd imMOINW^Wi3iAiNn9 丄1 Hsnya軟归lAIOyHO w瓯卿VI日co丄丄VIAI oy丄0313BMQWvda 33dd moiNBM®svda CH 丄丄viAi轲諾<WlM3d QNVS CO人VydSB^Mddoo Q3U Hsnya9 / SWlAiniNVll丄WQWI09 丄1 33dd IMNW6 cno9 丄1 >16BlfSBddoo HsnyaW丁I09M3NLT GUN META淺槍（面掛電,底滾電）NKL FREE BR LT GO ft叻掃淺金NKL FREE BRUSH GO ft叻掃金NKL FREE P EARL GO無叻珍珠金NEW COPPE新原銅BIO P EWTEF古叻DULL GOL［濁金ELECTRO BLAC詠黑SPRAY BLAC噴黑BRONZE BRAS仿銅LT ANTIQUE GOL 淺古金MATTED GUN META 啞槍DULL NICKE濁叻ROLL DK.NICKE滾黑叻NKL FREE ROLL DK.NICKB叻滾黑叻RAW原胚（無電鍍）SP RAY噴色NKL FREE ELECTRO BLACK 電詠黑NKL FREE BRUSH BRA無叻黃銅DK GUN METAl深槍NKL FREE DK GUN METAL叻深槍SPRAY MATTED BLK啞黑NKL FREE MATTED GOLD助哑金常见的表面处理冲床工艺序号俗称（中文）英文（翻译）常见的颜色1 喷塑powder coated 黑白军绿2 烤漆lanking finishbanking varnishingpainting backingspray painted3 镀锌zinc plated 蓝白锌彩锌zinc coated4 镀镍iron with nickel plated 普通镍化学镍序号冲压工序英文翻译1 落料blanking2 切断cutting3 折弯bending4 冲字stamping letter5 拉伸to stretch6 拉深to pull and stretch7 切边side cut /sid scrap8 去毛边trmming9 冲孔pierceiron covered by nickellO抽孑L draw holesteel with nickel platedll 深冲压deep drawing5 光亮镀镍bright nickel-platingdeep stamping6 镀铝aluminum-plated12 折叠folding7 镀铬chrome-plated13 成型molding8 镀银silver-plated14 整形pIastic15 攻丝tapping9 镀金gold-plated10 镀锡tin-plated11 电泳electrophoresis 黑色electro-coating亮铬Polished Chrome仿金Polished 24KGold 拉丝铬Brushed Chrome。

ASTM E3-1995 金相试验制备

be decided.For a casting,a section cut perpendicular to the surface will show the variations in structure from the outside to the interior of the casting.In hot-worked or cold-worked metals,both transverse and longitudinal sections should be studied.Special investigations may at times require specimens with surfaces prepared parallel to the original surface of the product.In the case of wire and small rounds,a longitudinal section through the center of the specimen proves advanta-geous when studied in conjunction with the transverse section.4.3Cross sections or transverse sections taken perpendicu-lar to the main axis of the material are more suitable for revealing the following information:4.3.1Variations in structure from center to surface,4.3.2Distribution of nonmetallic impurities across the sec-tion,4.3.3Decarburization at the surface of a ferrous material (see Test Method E1077),4.3.4Depth of surface imperfections,4.3.5Depth of corrosion,4.3.6Thickness of protective coatings,and4.3.7Structure of protective coating.4.4Longitudinal sections taken parallel to the main axis of the material are more suitable for revealing the following information:4.4.1Inclusion content of steel(see Practice E45),4.4.2Degree of plastic deformation,as shown by grain distortion,4.4.3Presence or absence of banding in the structure(see Practice E1268),and4.4.4The quality attained with any heat treatment.4.5The locations of surfaces examined should always be given in reporting results and in any illustrative micrographs.A suitable method of indicating surface locations is shown in Fig. 1.5.Size of Metallographic Specimens5.1The specimens to be polished for metallographic exami-nation are generally not more than about12to25mm(0.5to 1.0in.)square,or approximately12to25mm in diameter if the material is round.The height of the specimen should be no greater than necessary for convenient handling during polish-ing.5.2It is not always possible to secure specimens having the dimensions given in5.1,when the material to be examined is smaller than the ideal dimensions.For example,in the polish-ing of wire,strip,and other small articles,it is necessary to mount the specimens because of their size and shape.5.2.1Larger samples may be mounted or not,as the available equipment dictates.However,the larger the speci-men,the more difficult it is to prepare,especially by manual methods.5.2.2Specimens that are too small to be handled readily during polishing should be mounted to ensure a surface satisfactory for microscopical study.There are,based on technique used,three fundamental methods of mounting speci-mens(see Sections7-9).6.Cutting of Metallographic Specimens6.1In cutting the metallographic specimen from the main body of the material,care must be exercised to minimize altering the structure of the metal.Three common types of sectioning are as follows:6.1.1Sawing,whether by hand or machine with lubrication, is easy and fast,and relatively cool.It can be used on all materials with hardnesses below approximately35HRC.It does produce a rough surface containing extensive plasticﬂow that must be removed in subsequent preparation.6.1.2An abrasive cut-off wheel will produce a smooth surface often ready forﬁne grinding.This method of sectioning is normally faster than sawing.The choice of cut-off wheel, lubricant,cooling conditions,and the grade and hardness of metal being cut will inﬂuence the quality of the cut.A poor choice of cutting conditions can easily overheat the specimen, producing an alteration of the microstructure.As a general rule, soft materials are cut with a hard bond wheel and hard materials with a soft bond wheel.Aluminum oxide abrasive wheels are preferred for ferrous metals and silicon carbide wheels are preferred for nonferrous alloys.Abrasive cut-off wheels are essential for sectioning metals with hardnesses above about35HRC.Extremely hard metallic materials and ceramics may be more effectively cut using diamond-impregnated cutting wheels.Manufacturer’s instructions should be followed as to the choice of wheel and speeds. 6.1.3Flame cutting completely alters the structure of the metal at theﬂame cut edge.Ifﬂame cutting is necessary to remove the specimen,it should be cut sufficiently large so that it can be recut to the proper size by some other method that will not substantially alter the structure.Exercise care to ensurethat Symbol inDiagramSuggested DesignationA Rolled surfaceB Direction of rollingC Rolled edgeD Longitudinal(or lengthwise)section parallel to rolled sur-faceE Longitudinal section perpendicular to rolled surfaceF Transverse sectionG Radial longitudinal sectionH Tangential longitudinal sectionFIG.1Method of Designating Location of Area Shown inPhotomicrograph.the region of interest is not altered by the heat of the cutting ﬂame.6.2Other methods of sectioning are permitted provided they do not alter the microstructure at the plane of polishing.All cutting operations produce some depth of damage,which will have to be removed in subsequent preparation steps.7.Cleanliness7.1Cleanliness(see Appendix X1.)during specimen prepa-ration is essential.All greases and oils on the specimen should be removed by some suitable organic solvent.Failure to clean thoroughly can prevent cold mounting castable resins from adhering to the specimen surface.Ultrasonic cleaning is particularly effective in removing the last traces of residues ona specimen surface.7.2Any coating metal that will interfere with the subse-quent etching of the base metal should be removed before polishing,if possible.If etching is required,when studying the underlying steel in a galvanized specimen,the zinc coating should be removed before mounting to prevent galvanic effects.The coating can be removed by digestion in cold nitric acid(HNO3,sp gr1.42),in dilute sulfuric acid(H2SO4)or in dilute hydrochloric acid(HCl).The HNO3method requires care to prevent overheating,since large samples will generate considerable heat.By placing the cleaning container in cold water during the stripping of the zinc,attack on the underlying steel will be minimized.7.3Oxidized or corroded surfaces may be cleaned as described in Appendix X1.8.Mounting of Specimens8.1There are many instances where it will be advantageous to mount the specimens prior to grinding and polishing. Mounting of the specimen is usually performed on small,ﬂimsy,or oddly shaped specimens,fractures,or in instances where the specimen edges are to be examined.8.2Specimens may be either mechanically mounted, mounted in plastic,or a combination of the two can be used to provide optimum results.8.3Mechanical Mounting:8.3.1Strip and sheet specimens are frequently mounted by binding or clamping several specimens into a pack held together by two end pieces and two bolts.Clamp mounting generally affords a means of rapid mounting with very good edge retention.8.3.2The specimens should be tightly bound together to prevent absorption and subsequent exudation of polishing materials or etchants.8.3.3The use ofﬁller sheets of a softer material alternated with the specimen may be used in order to minimize the seepage of polishing materials and e ofﬁller material is especially advantageous if the specimens have a high degree of surface irregularities.8.3.4Filler material must be chosen so as not to react electrolytically with the specimen during etching.Thin pieces of plastic,lead,or copper are typical materials that are used. Copper is especially good for steel specimens since the usual etchants for steels will not attack the copper.8.3.5Alternatively,the specimens may be coated with a layer of phenolic or epoxy resin before being placed in the clamp in order to minimize the absorption of polishing materials or etchants.8.3.6The clamp material should be similar in composition to the specimen to avoid galvanic effects that would inhibit etching.The specimen will not etch if the clamp material is more readily attacked by the etchant.8.3.7The clamp should preferably be of similar hardness as the specimens to minimize the rounding of the edges of the specimens during grinding and polishing.8.3.8Exercise care in clamping the specimen.Excessive clamping pressure may damage soft specimens;however,good sealing is required to prevent absorption of polishing materials or etchants.8.4Plastic Mounting:8.4.1Specimens may be embedded in plastic to protect them from damage and to provide a uniform format for both manual and automatic preparation.This is the most common method for mounting metallographic specimens.Mounting plastics may be divided into two classes—compression mount-ing and castable.8.4.2When mounting specimens in plastic,exercise care in order to avoid rounding of specimen edges during the grinding operation.There are several methods available that prevent rounding.The specimens may be surrounded by hard shot, small rivets,rings,etc.,of approximately the same hardness or, when using casting resin,a slurry of resin and alumina may be poured around the specimen to prevent rounding.The speci-mens may also be plated before mounting(see Section9). 8.4.3Compression Mounting—Thermosetting plastics re-quire the use of a mounting press providing heat(up to approximately160°C)and pressure(up to approximately30 MPa).Theﬁnished mounts can be ejected hot but the best results are obtained when theﬁnished mount is cooled under pressure.There are three types of thermosetting compression mounting plastics used predominantly in the metallographic laboratory.Regardless of the resin used to compression mount specimens,the best results are obtained when(1)the speci-mens are clean and dry,and(2)the cured mount is cooled under full pressure to below30°C before ejection from the press.8.4.3.1Wood-ﬁlled bakelite resins cure in5to10min,are relatively inexpensive,can be obtained in several colors,and are opaque.These resins have a tendency to pull away from the specimen leaving a crevice,which will trap liquids that later can smear,stain,and obscure a portion of the specimen.8.4.3.2Diallyl phthalate resins are less likely to shrink and are more resistance to attack by etchants.They are more expensive than the phenolic resins with about the same hardness.8.4.3.3Filled dry epoxy resins provide minimal shrinkage. Commercial resins intended for metallography are usually ﬁlled with hard material,minimizing edge rounding during preparation.These resins are the most expensive of the three types of thermosetting plastics.Cost can be reduced byﬁrst adding a layer ofﬁlled epoxy resin andﬁlling up the remainder of the press cavity with phenolic resin.8.4.3.4Resins are used in a similar fashion.Because oftheadhesive characteristics of the resins,a mold release agent should be applied to the surface of the mold.Do not apply the release agent to the specimen.The specimen is placed in a heated mold face down(the surface to be ground).The appropriate amount of resin is poured over the specimen,the mold is closed,and pressure is applied.The pressure is released at the end of the cure,the mold opened,and theﬁnished mount ejected.As noted in8.4.3,shrinkage can be minimized by cooling to room temperature under pressure.Modern auto-mated mounting presses can apply pressure and heat,time the cure,and cool the mount under pressure.8.4.3.5Acrylic thermosetting resins produce transparent mounts.They require cooling under pressure.Heat and pres-sure must be carefully applied to avoid formation of“cotton ball”defects in the center of the mount.8.4.4Castable Plastics—Castable resins are used at room temperature.Some may require an external heat source or applied pressure in order to cure.These resins consist of two or more components which must be mixed just prior to use.There are three kinds of castable plastics in common use:8.4.4.1Acrylic resins consist of a powder and liquid,and cure rapidly(from8to15min)to a moderate hardness.These resins exhibit low abrasion resistance and a tendency to pull away from the specimen.They also tend to give off an unpleasant odor and enough heat during curing to alter the microstructure of some as-quenched steels.8.4.4.2Polyesters consist of two liquids,and cure to form water-clear mounts with little heat evolution,low shrinkage, and low hardness.The cure takes1to3h and the mixing ratio is critical.They are more expensive than the acrylic resins.8.4.4.3Epoxy resins have the best properties concerning transparency,heat generation,shrinkage,adhesion to the speci-men,and hardness of the three castable resins.They are expensive.Cure times vary broadly,from1to11⁄2h for some formulations to4to8h for others.Some formulations require cooling and others heating.8.4.4.4The molds for castable plastics are simple cups that hold the resin until it cures.They may be reusable or not;the choice is a matter of convenience and cost.Handling castable resins requires care.They all can cause dermatitis.Manufac-turers’recommendations for mixing and curing must be followed to obtain best results.8.5Mounting Porous Specimen:8.5.1Porous or intricate specimens may be vacuum impreg-nated in order toﬁll voids,prevent contamination and seepage, and prevent loss of friable or loose components.Impregnation is accomplished by placing the specimen in a mold into a vacuum chamberﬁtted with a funnel and a stopcock,or a similar commercially available evacuation device,so that the resin can be poured into the mold from outside.A low-viscosity resin will produce the best results but ordinary metallographic resins will work well.The vacuum chamber is then evacuated. The pressure in the chamber must remain above the critical vapor pressure of the hardener to avoid evaporating away the hardener.After the pressure has equilibrated,the resin is introduced into the mold and the vacuum is released and air admitted to the chamber.Atmospheric pressure will force the resin intoﬁne pores,cracks,and holes.Very porous specimens may be turned using a wooden applicator after opening to the atmosphere to ensure the impregnation of the face-down side. The surface to be polished must be returned to the down-side position before the resin starts to set.8.5.2If a low-viscosity resin is used,the funnel and stop-cock may be eliminated.The resin is placed in the cup prior to evacuation.The air in the specimen will bubble out through the resin.Exercise care to ensure the hardening agent is not evaporated during evacuation.Again,turn the specimen over to ensure impregnation of the bottom side.Remember to turn the specimen back over again before the resin starts to set.8.5.3Vacuum impregnation is an effective method for ensuring optimal results for metallographic mounts.It is imperative that porous specimens be completely dry prior to impregnation.8.5.4A more rapid technique but less effective method is to lacquer the specimens with one of the formulations used by the canning industry to line food containers.The formulations are highly penetrating and the cure is a short time at low temperatures.After lacquering,the specimens are mounted in the usual fashion.9.Plating of Specimens9.1Specimens such as fractures or those where it is neces-sary to examine the edges,are often plated to obtain good edge retention.Plating can be done electrolytically or with electro-less solutions.These specimens are invariably mounted prior to the grinding and polishing procedures.9.2Chromium,copper,iron,nickel,gold,silver,and zinc may be electrolytically deposited although copper and nickel are predominantly used in metallographic laboratories.9.3Thoroughly clean the specimen surface prior to plating so as to ensure good adhesion of the plating.Avoid industrial cleaning treatments that are too harsh and may cause damage to the specimen der cleaning treatments that involve detergents,solvents,mild alkaline,or acidic solutions are recommended.9.4Ferrous metals are commonly plated electrolytically with nickel or copper.Aﬂash coat in a copper or electroless nickel bath can beﬁrst applied for specimens that are difficult to electroplate.9.5Nonferrous metals may be plated with silver and the precious metals may be plated with nickel,gold,or silver. 9.6The plating material should be softer,but not much softer,than the specimen in order to avoid differential polishing that may mask the specimen edge.The plating material should not react electrolytically with the base metal of the specimen during plating,polishing,or etching.9.7Electroless plating is preferred to electrolytic plating for specimens with rough,porous,or irregular surfaces,because the electroless solution provides better surface coverage and penetration.9.8Active metals such as zinc and aluminum are difficult to plate.Sometimes aﬂash cyanide copper plate can be deposited, which then can be followed by normal plating from a sulfate bath.Evaporated coatings of copper,gold,or chromium may also be used as startercoatings.10.Grinding and Polishing10.1General—Many metals and alloys can be prepared using a similar sequence of grinding and polishing.Hard alloys may require greater pressure than soft alloys.The major differences,though,will be in theﬁnal polishing.Some metals and alloys will require speciﬁc combinations of abrasive and support material,but a surprising number can be handled by the same procedure.Some composite materials,however, require lapping as a critical step when traditional approaches are not satisfactory.Supplies and instructions for grinding, lapping,and polishing are readily obtainable from laboratory supply houses.10.2Grinding—Grinding consists of two stages—rough andﬁne.10.2.1Rough Grinding—Rough grinding(180grit and coarser)is used to accomplish the following:10.2.1.1Flatten an irregular or damaged cut surface,10.2.1.2Remove scale and other surface conditions prior to mounting,10.2.1.3Remove substantial amounts of specimen material to reach a desired plane for polishing,10.2.1.4Remove plastic mountingﬂash,level the mount surface,and bevel mount edges beforeﬁne grinding,and 10.2.1.5Rough grinding may be performed on belts or rotating wheels.In some methods45or30-µm diamond abrasives are used on hard platens.10.2.2Fine Grinding—Inﬁne grinding,the specimen is ground on successivelyﬁner abrasive papers using water to wash away grinding debris and to act as a lubricant.The specimen should be cleaned between successive papers to prevent carryover of coarser abrasive.10.2.2.1Grinding can be done in a number of ways,ranging from rubbing the specimen on a stationary piece of abrasive paper to the use of automatic devices.The choice of method depends on the number of specimens to be done,ﬁnancial considerations,and requirements such asﬂatness,uniformity, and so forth.Grinding on abrasive-coated rotating disks using hand-held specimens is the traditional method.Mechanical devices to hold the specimen against abrasive-covered rotating disks are becoming increasingly common.Many of these machines permit automated grinding,providing surfaces supe-rior to hand-held specimens.10.2.2.2Grinding should start with theﬁnest paper capable ofﬂattening the specimen and removing the effects of prior operations,such as sectioning.The next paper should remove the effects of the prior paper in a short time.A typical sequence of papers might be240,320,400,and600-grit abrasive papers. Depending on the smoothness of the specimen surface,some of the coarser paper grades can be skipped.10.2.2.3In the hand-held methods,the specimen is rotated 90°between papers to determine when the prior set of scratches have been removed.The specimen should also be moved back and forth across the paper to prevent grooving of the specimen.At the end of the grinding on each paper,the surface of the specimen and its mount,if any,should beﬂat with one set of unidirectional grinding scratches.10.2.2.4Most of the devices for automatic grinding move the specimen around a rotating wheel covered with abrasive so that the specimen follows an epicycloid path.In some devices, the specimen rotates on its own axis as well.The scratch pattern now consists of random arcs.Deciding when the previous scratches have been removed is more difficult than with directional grinding.The specimen surface should show uniform scratches before proceeding to the next step.Cleaning between stages may be necessary to prevent carryover of abrasives and contamination of grinding surfaces.Manufactur-er’s instructions will include suggested machine settings for grinding various metals.10.2.2.5After all grinding is done,the specimen must be cleaned thoroughly.Ultrasonic cleaning in a water-detergent bath is recommended.In hand operations,the hands must be washed also,exercising care to clean beneathﬁngernails. 10.3Polishing—Polishing is usually distinguished from grinding by the use of loose abrasive embedded in an appro-priately lubricated supporting surface.The choice of abrasive, lubricant,and polishing surface support is often speciﬁc to the metal and the object of the investigation.10.3.1The use of graded diamond paste or suspensions as the abrasive can reduce the number of combinations markedly. Those supports most commonly used are non-napped cloths such as nylon or nonwoven textiles available for metallo-graphic purposes.10.3.2Theﬁnal polish may be1-µm diamond abrasive.For high-resolution work,this diamond polish may be followed by polishing on a short nap synthetic suede using an aqueous suspension of0.05-µm gamma alumina or colloidal silica. Other abrasives and supports often are required depending on the particular task in hand.This step should be kept to the shortest time possible to prevent edge rounding,pitting,or other artifacts.Twenty to forty seconds should be sufficient if the previous steps have been correctly performed.10.3.3Careful cleaning of the specimen between stages is mandatory to prevent contamination by coarser abrasive. Ultrasonic cleaning is recommended between each polishing step.10.3.4The polishing operations may be conducted by hand or by automatic methods.10.3.4.1Hand methods consist of holding the specimen by hand against an abrasive-charged rotating wheel and moving the specimen in an elliptical path around the wheel against the direction of rotation of the wheel.The specimen should be held ﬁrmly in contact with the wheel.Just howﬁrm and just how fast to go around the wheel is a matter of experience and personal preference.In the preparation of advanced materials, the operating parameters must be strictly controlled.10.4Automatic Grinding and Polishing:10.4.1Many styles of automatic specimen preparation ma-chinery are available.The most common units can perform all grinding and polishing steps.They use diskﬁxtures accommo-dating multiple specimens;the specimens remain in theﬁxture throughout the preparation.Major advantages in using auto-matic grinding and polishing procedures are the consistent quality of specimen preparation and the substantial decrease in time required for preparing large number of specimens.Careful attention to cleanliness and prevention of cross-contamination from abrasives and residues between steps,particularlyinpolishing,is required.Ultrasonic cleaning is recommended.10.4.2An initial coarse-grinding step is required to make all specimen surfaces co-planar and parallel to theﬁxture.This step is usually used to remove damage to the specimens from sectioning operations.Fine grinding uses either a graded abrasive paper series or a single step with an intermediate(9or 6µm)diamond abrasive on a permanent,grooved wheel to prepare the specimens for polishing.As an alternative,lapping platens may be used to replace theﬁnegrinding paper se-quence.This approach offers the greatest beneﬁts when very hard or highly dissimilar materials must be prepared.10.4.3One polishing step will often suffice for examination up to100X,using a3or1-µm diamond abrasive on napless cloth.Two steps will suffice for almost all requirements,with the second step using aﬁner diamond on a napless or low-nap cloth.A third step withﬁne alumina or colloidal silica on a low-nap cloth can be used forﬁnal polishing but relief polishing will be encountered proportionate to the specimen load and polishing time used.11.Special Procedures11.1Occasionally,every metallographer is faced with the preparation of unusual specimens or with special situations. Anticipation of every possible situation is,of course,impos-sible but some guidance can be mon sense is imperative.11.1.1Electrolytic polishing produces totally deformation-free surfaces but works best on solid solution alloys.Once the operating parameters are set,specimens can be prepared quickly.See Guide E1558.11.1.2Vibratory polishing produces excellent results on a number of alloys.Although slow,a number of specimens can be prepared simultaneously,resulting in a high through-put.It is especially advantageous for soft materials.11.2Porous Specimens—Specimens with continuous or open pores can be vacuum-impregnated with plastic or some other liquid that will solidify.Specimens with closed pores are mounted by a suitable method,ground through theﬁne grinding stage,cleaned,and dried thoroughly.The surface is then wiped with a liquid mounting compound,usually the same material used to mount the specimen,to seal the pores.After hardening,the lastﬁne-grinding stage is repeated to remove the excess material,and specimen preparation is continued as usual.The choice of liquid for impregnation or sealing depends on the nature of the sample.It should,of course,be inert toward the specimen.11.2.1Impregnation can be accomplished by vacuum im-pregnation(see8.4.4.5through8.4.4.8)in the specimen. 11.3Composite Materials—Composite materials,particu-larly hardﬁbers in a soft matrix or wires in a soft insulation, can be particularly difficult to prepare.The best approach is to ﬁrst seal or impregnate pores or holes.Then grind carefully, using copious lubrication.The grinding surface must be kept ﬂat andﬁrm.In the polishing stages,the substrate should have no nap and should be fairly hard.Diamond abrasive is recommended.Both will minimize rounding of the hard components.Sometimes,a compromise will have to be made between accepting a few defects(scratches)or rounded edges. If automatic methods are available,high-polishing pressures and high-nap substrates may provide an alternative method.11.4Coated Materials:11.4.1Coated metals,such as galvanized steel,electroplated metal,enamel ware,and so forth,can be considered a variety of composite materials.They present problems of their own, such asﬂaking,chipping,and rounding.For example,some coatings are so thin as to be unresolvable on simple cross sections(tinplate).Other problems are the presence of a soft coating on a harder substrate(galvanized steel)or a hard brittle coating on a soft substrate(porcelain enamel on aluminum).11.4.2The problem of thin coatings can be handled by usinga taper mount.In this method,the specimen is mounted so that the plane of polish is at a small angle to the plane of the surface.For example,a tapered plug is inserted in the mounting press with the taper up.A blank tapered mount is prepared. Masking tape is wrapped around the circumference of the mount to make a well on the tapered end.A small amount of epoxy mounting compound is mixed.The specimen,cut toﬁt inside the well,is wetted with the epoxy and laid on the face of the tapered mount,coated side ing a probe,the specimen is pressed downﬁrmly onto the tapered face.The balance of the epoxy compound is added and allowed to harden.The mounted specimen is ground and polished on the epoxy face in the conventional manner exercising care that the plane of polish is perpendicular to the cylindrical axis of the mount. This is easily done with most automatic grinding machines.11.4.3The problem of soft coatings can be solved by the use of a suitable backup.A piece of spring steel is useful to hold the backup in place,or the backup may be cemented to the specimen.The cement can act as an insulation to minimize galvanic effects.A particularly suitable backup is another piece of the same material,with the coating sandwiched in.Another solution is to add another coating,for example,electroplate. However,this may introduce undesirable galvanic effects during etching.Galvanic problems may arise also from the interaction of the coating and its substrate.11.4.4Hard coatings on softer substrates can be mounted with a backup piece or a hard-ﬁlled mounting compound. Diamond abrasives on a napless cloth will minimize surface relief during polishing.11.5Fragile specimens should be mounted in one of the liquid cold mounting formulations.Vacuum impregnation will ensureﬁlling of holes and cavities(see section8.4.4.5).Thin walls can be reinforced by electroless nickel plating,which will alleviate the rounding problem.11.6Likewise,friable specimens can be bound together by impregnation with plastic or by electroless nickel plating,or both.Further guidance can be found in texts on preparation of mineralogical specimens.12.Precision and Bias12.1Because use of this practice does not produce numeri-cal results,no statement of precision or bias is possible. 13.Keywords13.1alloys;grinding;metallography;metals;mounting; polishing;specimen preparation(metallographic)。

模具抛光(Polishing)

目前使用的 SPI/SPE 表面光洁度标准是塑料工业协会的标准, 是由手工拋光的, 目前大部份塑料模也大多是用手工抛光的.
SPI/SPE 光洁度标准板由 ABS 模塑制成, 尺寸 8.5“ x 11”. 用於显示典型的表面光洁度, 以便於与客户交流. 由於不同钢种, 不同塑料以及不同生产参数的差别, 这些光洁度等级在外观上可能有与模具的光洁度有轻微的不同.
JY-Vietnam-Jun04
SPI 标准
Type of finish 表面光洁度 Current 目前SPI采用的 SPI Finish 光洁度代号 Numbers A1, 3 u A2, 6 u A3, 15 u B1, 600# B2, 400# B3, 320# C1, 600# C2, 400# C3, 320# D1 D2 D3 Description
JY-Vietnam-Jun04
建议的预加工狀态
预加工方法 1. 精车
三圣
sansheng
粗糙度 Ra (μ)
0.4 - 0.8
2. 精铣
3. 精磨
0.4 - 0.8
0.2 - 0.4
4. 细放电加工
0.3 - 0.5
JY-Vietnam-Jun04
通常的拋光方法
方法去除机加工痕迹砂纸打磨钻石膏拋光拋光工具油石砂纸毛毡加钻石膏步骤 1 200# 600# 14 μm 步骤 2 400# 800# 6 μm
说明
三圣
sansheng
High Polish finish 高抛光表面
Paper finish 砂纸打磨
油石打磨 Stone finish 干打砂表面 Dry Blasted finish
类似于 to is comparable 稍高于 is slightly finer than 略差过 has more imperfections than 高于 is finer than 稍高于 is slightly finer than 类似于 to is comparable 高于 is finer than is slightly finer than 稍高于 is comparable 类似于 to is finer than 高于 is comparable 类似于 to is a little more coarse than 略粗过

金属表面处理中英文对照表

金属表面处理中英文对照表BRASS(SOLID BRASS) 青銅ANTIQUE 青古銅NICKEL 叻色PEWTER 黑古銅DK.NICKEL 黑叻MATTED GOLD 啞金PLASTIC 塑膠 SATIN GOLD 磨砂金GOLDEN/SLIVER 金/銀 PEARL GOLD 珍珠金PEARL NICKEL 珍珠叻POLISHED BRASS 啞銅MATTED NICKEL 啞叻MATTED BLACK 啞黑BRUSH BRASS 掃黃銅 BRUSH NICKEL 掃叻BRUSH GOLD 掃金TARNISHED BLACK 木碳黑BRUSH ANTIQUE 掃青古銅GUN METAL 槍色BRUSH ANTI NICKEL 掃黑叻 TITANIUM 鈦黑ANTIQUE NICKEL 淺黑叻 BRUSH RED COPPER 掃紅古銅BRUSH GUNMETAL 掃槍色SPRAYED SAND PEWTER 噴沙黑叻LT GOLD 淺金MATTED BRASS 啞青銅NICKEL FREE 無叻叻NICKEL FREE BRASS 無叻青銅PEARL GUN METAL ELECTRO MATTED BLACK 電泳啞黑RED COPPER 紅古銅CHROME 鉻色MATTED CHROME 啞鉻色 BRUSH LT GUNMETAL 掃淺槍NKL FREE BRUSH ANTIQUE 無叻掃青古銅NICKEL FREE ANTTQUE 無叻青古銅NICKEL FREE GOLD 無叻真金NICKEL FREE GUN METAL 無叻槍色LT GUN METAL 淺槍NKL FREE BRUSH GUN METAL 無叻掃槍ANTIQUE SILVER 古銀色GREY NICKEL 灰叻ANTIQUE COPPER 古銅BRUSH MATTED GUN METAL 掃啞槍NKL FREE MATTED NICKEL 無叻啞叻NICKEL FREE DK. NICKEL 無叻黑叻ROLL PLATING GUN METAL 滾電槍色NKL FREE ANTIQUE NICKEL 無叻淺黑叻COPPER 原銅ROLL ANTIQUE 滾青古銅ALUMINIUM 鋁色BRUSH MATTED LT GOLD 掃啞淺金MATTED LT GOLD 啞淺金SILVER 銀色BRUSH LT GOLD 掃淺金DULL ANTIQUE BRASS 啞古銅ANTIQUE GOLD 古金LT ANTIQUE 淺青古銅ROSE GOLD 玫瑰金ALLOY 合金色NEW GOLD 新金BRUSH COPPER 掃原銅9K LT GOLD 9K淺金NKL FREE LT GOLDE 無叻淺金NKL FREE BRUSH NKL 無叻掃叻NKL FREE LT GUN METAL 無叻淺槍BRUSH DK GUN METAL 掃深槍NKL FREE BR DK GUN METAL 無叻掃深槍DK BLK NICKEL 深黑叻DK ANTIQUE 深青古銅NKL FREE GREY NICKEL 無叻灰叻NKL FREE DK BLK NICKEL 無叻深黑叻NKL FREE ANTI SILVER 無叻古銀LT GUN METAL 淺槍(面掛電,底滾電)NKL FREE BR LT GOLD 無叻掃淺金NKL FREE BRUSH GOLD 無叻掃金NKL FREE PEARL GOLD 無叻珍珠金NEW COPPER 新原銅BIO PEWTER 古叻DULL GOLD 濁金ELECTRO BLACK 詠黑SPRAY BLACK 噴黑BRONZE BRASS 仿銅LT ANTIQUE GOLD 淺古金MATTED GUN METAL 啞槍DULL NICKEL 濁叻ROLL DK.NICKEL 滾黑叻NKL FREE ROLL DK.NICKEL 無叻滾黑叻RAW 原胚(無電鍍)SPRAY 噴色NKL FREE ELECTRO BLACK 無叻電詠黑NKL FREE BRUSH BRASS 無叻黃銅DK GUN METAL 深槍NKL FREE DK GUN METAL 無叻深槍SPRAY MATTED BLK 噴啞黑NKL FREE MATTED GOLD 无叻哑金常见的表面处理冲床工艺序号俗称（中文）英文（翻译）常见的颜色序号冲压工序英文翻译1 喷塑 powder coated 黑白军绿 1 落料 blanking2 烤漆lanking finish 2 切断 cuttingbanking varnishing 3 折弯 bendingpainting backing 4 冲字stamping letterspray painted 5 拉伸to stretch6 拉深to pull and stretch3 镀锌 zinc plated 蓝白锌彩锌 7 切边side cut /sid scrapzinc coated 8 去毛边trmming4 镀镍 iron with nickel plated 普通镍化学镍9 冲孔pierceiron covered by nickel 10 抽孔draw holesteel with nickel plated 11 深冲压deep drawing5 光亮镀镍 bright nickel-plating deep stamping6 镀铝aluminum-plated 12 折叠folding7 镀铬 chrome-plated 13 成型molding8 镀银silver-plated 14 整形plastic15 攻丝tapping9 镀金gold-plated10 镀锡tin-plated11 电泳 electrophoresis 黑色electro-coating亮铬Polished Chrome仿金Polished 24K Gold拉丝铬Brushed Chrome。

抛光的流程以及注意事项

抛光的流程以及注意事项Polishing is a crucial step in the manufacturing process of many products, as it helps to improve the surface finish and appearance of the final product. 抛光是许多产品制造过程中重要的步骤，因为它有助于改善最终产品的表面光洁度和外观。

The process of polishing involves using abrasive materials to remove imperfections on the surface of the material, resulting in a smooth and shiny finish. 抛光的过程涉及使用磨料材料去除材料表面的瑕疵，从而产生光滑而有光泽的表面。

One important consideration when polishing is the type of material being polished, as different materials may require different polishing techniques and abrasive materials. 抛光时需要考虑的一个重要因素是被抛光的材料类型，因为不同的材料可能需要不同的抛光技术和磨料材料。

For example, metals may require a different polishing process than plastics or wood. 例如，金属可能需要不同于塑料或木材的抛光过程。

It is essential to understand the properties of the material being polished to determine the most effective polishing method. 需要了解被抛光材料的性质，来确定最有效的抛光方法。

materials-9-29

Designing Superhard MaterialsRichard B. Kaner, John J. Gilman, Sarah H. Tolbert*1 U ltrahard materials are used in many applications, from cutting and polishing tools to wear-resistant coatings. Diamond remains the hardest known material, despite years of synthetic (1, 2) and theoretical (3) efforts to improve upon it. However, even diamond has limitations. It is not effective for cutting ferrous metals, including steel, because of a chemical reaction that produces iron carbide. Cubic boron nitride--the second-hardest material, with a structure analogous to that of diamond--can be used to cut ferrous metals. However, it does not occur naturally and must be synthesized under conditions of extreme pressure and temperature, making it quite expensive. New superhard materials are thus not only of great scientific interest, but also could be very useful.2 To design new superhard materials, we must understand what makes diamond special. In diamond, tetrahedrally bonded sp3 carbon atoms form a three-dimensional, covalent network of high symmetry. Other carbon-based materials have shorter and stronger carbon bonds, but not in three dimensions. For example, the trigonal sp2 bonds in graphite form sheets with shorter and stronger carbon-carbon bonds. But only weak van der Waals interactions hold the sheets together, allowing layers of graphite to cleave readily. A three-dimensional network composed of short, strong bonds is thus critical for hardness.3 In thinking about new ultrahard materials, it is useful to consider the types of structural changes that a material can undergo under load. These changes can be divided into elastic (reversible) and plastic (irreversible) deformations.4 A material is considered stiff if it is difficult to compress elastically. Such a material has a large bulk modulus (it is resistant to volume compression) and/or Young's modulus (it is resistant to linear compression). Elastic deformation in a direction different from that (?) of the applied load results in shape rather than volume changes; these motions are measured by the shear modulus. In all elastic distortions, the basic relations between atoms do not change.1 A material is considered hard if it resists plastic deformation. In contrast to elastic deformation, plastic deformation usually involves irreversible motion of the atoms with respect to each other, often via the creation and movement of dislocations.Toward superhard materials. By combiningmetals with a high density of valence electrons,such as osmium, iridium, or rhenium, with small,covalent bond-forming atoms such as boron, ultra-incompressible, hard materials may be created.Mixed metals, as shown in this orthorhombicstructure predicted for (Os, Ir)B2, can act as barriersto the movement of dislocations. Osmium is shownin red, iridium in green, and boron in yellow.2 It is a source of substantial confusion that high modulus and high hardness are often discussed together, even though the underlying deformations are fundamentally different. This grouping occurs because the processes can be correlated: If a material shows large elastic changes under small load (low modulus), it tends to respond to larger loads by deforming plastically (low hardness). This is particularly true for shear motions, which are required to scratch or indent a material; a good correlation has been found between shear modulus and hardness (1-3). Highly directional bonding is needed to withstand both elastic and plastic deformations. Purely covalent bonding (such as in diamond) is best, and some ionic character is acceptable. However, highly ionic or metallic bonding is the same in all directions and therefore poor at resisting either plastic or elastic shape deformations.3 With these ideas in mind, efforts to design superhard materials can be divided into two main approaches. In the first, light elements, including boron, carbon, nitrogen,and/or oxygen, are combined to form short covalent bonds. In the second, elements with very high densities of valence electrons are included to ensure that the materials resist being squeezed together.4 The first approach gained favor in the late 1980s, when calculations suggested that the hypothetical compound C3N4 may be even less compressible than diamond (4). However, after years of experiments, further calculations indicated that even for the least compressible C3N4 structure, the shear modulus would only be 60% of the diamond value (5). New forms of carbon, including fullerenes and nanotubes, generated great excitement in the 1990s, when high-pressure processing produced very hard substances (1). However, these substances, which fall under the rubric of diamondlike coatings, can approach but never reach the hardness of diamond (6); furthermore, squeezing fullerenes and nanotubes is unlikely to be an inexpensive, practical synthetic route to diamondlike carbon. Three-dimensional boron-rich compounds, including B4C, B6O, their solid solutions, and B/C/N phases, are very hard materials that deserve continued study. However, this approach is unlikely to produce materials with hardnesses exceeding those of boron nitride/diamond solid solutions, which are intermediate in hardness between diamond and cubic boron nitride (1, 2, 7).1 In the second approach, transition metals that have a high bulk modulus but low hardness are combined with small, covalent bond-forming atoms such as boron, carbon, nitrogen, and/or oxygen. In this way, a material that can maintain both volume and shape can be created. This idea has led to highly incompressible phases such as RuO2 (8), WC, and Co6W6C (9). Unfortunately, these materials do not even approach the hardness of cubic boron nitride, owing to the partially ionic character of the Ru-O bond and the metallic nature of the W-W and Co-W interactions (3). Borides may be a better choice to achieve the required covalent bonding. Transition metal borides such as the tungsten borides WB4, WB2, and WB are promising (1, 2). Elements with a higher density of valence electrons (and thus high bulk modulus) such as rhenium, osmium, and iridium also have the potential to form very hard borides (10); mixed-metal borides could be even harder (see the figure).2 Once the best combination of elements is found, hardness could be increased by controlling the underlying nanostructure. For example, if the motion of dislocations in a material is hindered, hardness can be increased. This phenomenon is well known to occur in an ultrafine-grained diamond called carbonado (11). More recently, nanoceramics with a grain size of ~10 nm have exhibited the same phenomenon (12). Superlattices ofTiN/AlN or carbon nitride/TiN with a periodicity of 6 to 8 nm also exhibit hardnesses two to three times as great as that of the bulk crystalline form of these materials (13, 14). In all these materials, the interfaces between the nanometer-scale components act as barriers to the movement of dislocations.3 Despite all the research activity into synthesizing superhard materials, many opportunities remain unexplored. For example, the lightest element that could produce three-dimensional structures, beryllium, has been neglected, perhaps because it is toxic and may require specialized high-pressure equipment. Ternary phases of beryllium with other light elements--boron, carbon, nitrogen, and oxygen--could have exciting properties in their own right or in combination with high-valence electron density metals.4 Despite their potential, new materials are unlikely to replace diamond altogether, because in addition to its hardness, diamond possesses many other amazing properties. It is the most incompressible material, has one of the highest indices of refraction, and has a room-temperature thermal conductivity five times as large as that of the best metals. The scientific challenge of finding a superhard material that surpasses diamond in any of these properties will keep the field energized for years to come. Combining high hardness with other properties, such as chemical inertness and low-cost synthesis, could quickly yield practical benefits, for example, by providing a replacement for cubic boron nitride for cutting and polishing steel.。

成表配件中英文对照

不光边no polishing.['pɔliʃ]幼砂fine sand太阳砂radiation brushing.[reidi'eiʃən]打字stamped.[stæmp]光令mirror finishing光滑表面smooth surface光边polishing光边直砂6—12polished brushing光边圆砂circular polished brushing防水度water-resistant level直砂6-12 brushing砂纹sand brushing涂油add grease .[ɡri:s]镀黑black chrome plating .[krəʊm]填黑油black filled鱼鳞纹armor brushing.['ɑ:mə]圆砂circular brushing蚀字chemical etching .['etʃɪŋ]喷砂sand brushing横砂3-9brushing镭射字体laser二、表面（Dial）分位字尾minute struck日历窗date frame .[freim]字印marking字钉index.['indeks表面surface表面加工ackground finishing面底色background color面厚dial thickness面窗dial ring时位字尾hour struck牌子名brand name点dot镶唛applied logo钻石diamond钻石托diamond bushings三、表针（Hand）山型顶faceted分针minute hand平顶flat百分秒针chromo second hand .['krəuməu]夜光luminous .['lu:minəs]秒针second hand针高hand height四、底盖（Caseback）刀口位opening slot内字印inside marking外字印outside marking波子底back snap底保护贴back protective sticker .['st i kə]底匙眼back key slot底盖caseback螺丝screw螺丝牙screw thread .[θred]米底point snap湾形底curved caseback .[kə:v]五、表带（caseband /wristket /band）中珠center link皮带strap/leather皮带扣利口tongue皮带环loop扣制buckle ['bʌkl]尾珠end piece拆生珠removable link/adjustable link表带caseband /wristket /band潜水扣dive buckle单接皮带扣deploy .[di'plɔi]边珠side link实心珠solid link珠宝扣jewellery buckle蝴蝶扣butterfly buckle双开蝴蝶扣hidden butterfly pushed button头珠starting piece壳:Case表胚：watch blank表圈：watch bezel表面：dial晌圈：springed metal ring内影：metal case decoratiue ring不锈钢实心表带：stainless steel semi-solid band包边带：side-wrapped band包边不锈钢表带：side-wrapped stainless steel band 织网表带：mesh band芯片：chip钨钢：tungsten steel皮表带：leather strap皮带扣：buckle forstap霸的：crown霸管：crown tube霸芯及驳管：stem and stem extension胶内影：housing/movement holder蓝宝石玻璃：sapphire crystal普通玻璃：ordinary glass凸晶玻璃：eye glass底盖：back cover生耳：spring bar生耳杆：T-bars with studs orscrews拆生钢枝：s/s pins and shafts拆生锣丝：removable screwed pin搓花钢枝：s/s knurled pins弹簧扣：spring buckel龟壳扣：clasps蝴蝶扣：folding clasps /butterfly style buckle 鸭嘴扣：duck-mouth buckle圆头饰钉：cabochon机芯：movement移印：padprinting吸塑包装：blister&packaging真空镀膜：vacuum coating蚀麦：etchedtrade mark單卜:dome len雙卜:curved len箭咀arrow .['ærəu]六、配件电池battery螺丝的头screw crown螺钉screw pin螺丝耳杆screw spring bar单胶圈的头single o-ring crown双胶圈的头double o-ring crown按的push button八角线octagon thread .['ɔktə,gɔn]八角形的octagon六角形的hexagon填夜光油luminous filled机芯movement实配机芯casing针pin软O-Ring soft o-ring硬o-ring rigid o-ring软胶I令soft plastic I-ring硬胶I令rigid I-ring白色I令white I-ring半透明I令semi-transparent I-ring发夹hair pin贴纸tape双面胶double side tape大头针friction pin字母通capsa pin-pipe（tube）压罩compression on holder[kəm'preʃən]内罩movement holder螺丝巴管screw tubeT行巴管T-tube巴芯stem湾生耳banded spring bar生耳spring bar无托生耳free stand spring bar单托生耳single stand spring bar双托生耳dual stand spring bar ['dju:əl]平头连斜巴flat head with chamfer平头巴的flat head圆头巴的round headT形巴的T-crown丝印玻璃silk screen glass镀膜玻璃plating glass单卜玻璃one side curved glass双卜玻璃both side curved glass蓝宝石水晶sapphire crystal .['sæf,aɪə]玻璃glass白板玻璃mineral glass水晶玻璃crystal glass七、组立（装配）不防水water proof failed不动formfit加防水油add silicon oil半跌half drop全跌full drop玻璃不配壳glass not fitting on case装配assembly配合fitting配带caseband fitting壳带配合不良poor fitting for case band 八、性能（function）拉力pull force顶力retention force.[ri'tenʃən]横拉力horizontal pull force .[,hɔri'zɔntəl]防水测试不合格water test failed防潮water resist退return九、结构面平flat surface镶石圈stone top ringO-ring 坑o-ring ditch/ groove刀口位开在opening notch at .[nɔtʃ]刀口位opening slot大身3-9case side wall大身面3-9case surface细身面6-12case surface细身6-12case side wall开面opening开粗roughing内耳款inner lug width内映reflector内影圈erflector ring丝吼inside diameter .[dai'æmitə]圈bezel弹珠结构ball structure止口高position for snap胶水glue展开长度open-up length压缩长度compressed length外耳款outer lug width避针为hand clearance夜光luminescent顶圈top ring壳耳case lug单卜upper curve bottom .[kə:v]石拓stone bushing巴孔crown opening圆壳round case方壳square case异形壳irregular case底平flat bottom企身为standing point字深=0.5depth of text=0.50有电池托w/battery strop没电池托w/o battery strop耳长lug diameter叉耳fork legs耳吼lug hole耳底lug case耳面lug surface耳脚lug stand耳款lug width检验尺寸inspection size加工尺寸production size按的位position for push button 玻璃位glass position石爪prong假螺钉decorating screw十、缺陷不足够insufficient [ɪnsə'fɪʃənt]磨罍over polishing电镀不良poor plating车线不良poor stitching ['stitʃiŋ]太长too long太短too short太小too small污物dirts利边sharp edge批锋burr.[bɜ:]甩字钉index fall out松loose花scratched表面脱色dial discolor欠缺missing出问题found problems打磨不良poor polishing砂孔sand hole砂过界over brushing打磨错误wrong polishing突出protruded.[prəʊ'tru:d]振刀纹rough turning mark氧化斑点oxidize spot.['ɔksɪ,daɪz]破裂crack起泡bubble崩dented脱落come off倾斜poor printing损坏damaged紧tight轻微minor胶水过多excessive glue断裂broken蜡屎wax严重major变形deformed十一、其它反面图reversed view正常normal名称title制图drafter注意打磨caution on finishing待定T.B.A玻璃外围尺寸outer glass diameter要点remark规格format标准/正规standard检查/签名checker进出口import/export时装表fashion watch经典表classic watch运动表sports watch女/男装women/man model女/男装lady /gents model童装kids watch电子表digital watch日本/瑞士机芯Japan or Swiss movement 日本石英Japan quartz唛头logo/marking士啤spare parts大/小尺寸big/small size抛光polishing/shiny电镀plating防水water resistant功能function皮料/色卡material collection目录catalogue/catalog参考reference附上的附件attached/attachment图片/相片picture/photo方形/圆形square/round shaped椭圆oval .['əuvəl]有/无按的with/ without pusher产品/生产production/product彩图colourful drawing表面设计dial design确认/再次确认conform/double confirm 取消/保留cancel/keep订单order翻单repeat order新订单new order新款new model原始订单original order同样板一样same as sample样品sample出货样shipment sample确认样approval sample假版dummy sample .['dʌmi:]包装packing装箱单packing list发票invoice毛重/净重gross or net weight艺术字artwork单词/字母，信word /letter纸盒paper box小贴纸small sticker标签label吊牌hangtagPP胶袋polybag气泡袋bubble bag详细资料details间电tow-tone透明的transparent时间time多功能计时chrono中间middle左边left右边right1>表壳加工处理电镀（Electro-plating）电染（Anode-oxidizing）蚀字（Acid Etching）镶石（Stone setting/mounting）丝印（Silk printing）烧焊（Solder/Braze）烧青（Epoxy）线切割（Wire-Cut）2>表面内影(Inner Ring)太阳纹底纹(Sunray)油压底纹(Deep press pattern/texture pattern)搪瓷面(Enamel)半消光(Semi-Glossy)镶钉（植钉/真钉/铆钉）(Applied Index Riveted)贴钉（UP钉）(UP labeling)车CD纹（眼钉）(Circular /CD pattern)啤凸(Emboss)3>表针(Hands)时针(Hour hand)分针(Minute hand)长秒针(Second hand)小秒针(small hand)浅绿色夜光(Light green luminous)白夜光(White Luminous)4>表带（Watch band）不锈钢带(S/S band )(Bracelet)实芯钢带(Solid S/S band)包边钢带(Rolled S/S band)片钢带(Folded S/S band)弹弓带（Spring buckle）保险带(Safety buckle)实芯蝴蝶扣(Solid butterfly buckle)成表配件中英文对照1>成表(Completed Watch)石英表(Quartz Watch)计时码表(Chronograph watch)自动表(Automatic Watch)跳字行针表(Analogical Digital Watch)2>表壳壳胚(Blank)玻璃(Glass)普通玻璃(Mineral Glass)蓝宝石玻璃（Sapphire Glass）半蓝宝石玻璃(Semi-sapphire glass)I令(I ring)霸的（表冠）(Crown)霸的管（Crown Tube）按的(Pusher)壳圈（Bezel）分圈(Top Ring)锑片(Aluminium foil)机芯罩(Movement Holder)底盖(Case Back)铜底盖(S/S case back)透视底盖(See-through case back)锁底盖(Screw back)O令(O-ring)(Gasket)生耳/钢闩（End-piece/pin）3>表壳打磨拉沙（Hair Brushed）12/6H方向直沙(912/6H vertical brushed) 3/9H方向横沙(3/6H horizontal brushed)圆沙(Circle brushed)喷沙(Fine Sand Blasted)光令（Satin/Polish）。

联合国国际贸易标准分类

简述[1]国际贸易标准分类（Standard International Trade Classification，简称：SITC）为用于国际贸易商品的统计和对比的标准分类方法。

现行“国际贸易标准分类”于1950年7月12日由联合国经济社会理事会正式通过，目前为世界各国政府普遍采纳的商品贸易分类体系。

到2006年为止，该标准分类经历了四次修改，最近的一次修改为第四次修订版，于2006年3月获联合国统计委员会第三十七届会议通过。

该分类法将商品分为为10大类、63章、223组、786个分组和1924个项目。

具体分类[2]•0 -食品和活畜00 -活的动物以外的其他动物的分裂00 - Live animals other than animals of division01 -肉及肉制品 01 - Meat and meat preparations02 -乳制品和鸟蛋 02 - Dairy products and birds' eggs03 -鱼（不是海洋哺乳动物），甲壳类，软体动物和水生无脊椎动物 03 - Fish (not marine mammals), crustaceans, molluscs and aquatic invertebrates, and preparations thereof04 -谷物和谷物制品 04 - Cereals and cereal preparations05 -蔬菜和水果 05 - Vegetables and fruit06 -糖，糖制品及蜂蜜 06 - Sugars, sugar preparations and honey07 -咖啡，茶，可可，香料，及其制造 07 - Coffee, tea, cocoa, spices, and manufactures thereof08 -喂养（不包括没有碾磨的谷物）08 - Feeding stuff for animals (not including unmilled cereals)09 -杂项食品产品和筹备工作09 - Miscellaneous edible products and preparations• 1 -饮料和烟草1 - Beverages and tobacco11 -饮料11 - Beverages12 -烟草及烟草制品 12 - Tobacco and tobacco manufactures• 2 -粗材料，不能食用，但燃料除外2 - Crude materials, inedible, except fuels21 -皮，表皮和毛皮，原料 21 - Hides, skins and furskins, raw22 -石油种子和含油果实 22 - Oil-seeds and oleaginous fruits23 -天然橡胶（包括合成和再生）23 - Crude rubber (including synthetic and reclaimed)24 -软木及木 24 - Cork and wood25 -纸浆及废纸 25 - Pulp and waste paper26 -纺织纤维（毛条除外和其他精梳羊毛）及其废料（不成纱或布料制造的）26 - Textile fibres (other than wool tops and other combed wool) and their wastes (not manufactured into yarn or fabric)27 -原油肥料，矿产和原油（不包括煤，石油和宝石）27 - Crude fertilizers, other than those of division 56, and crude minerals (excluding coal, petroleum and precious stones)28 -金属矿砂及金属废料 28 - Metalliferous ores and metal scrap29 -原油动物和植物材料制2 9 - Crude animal and vegetable materials, nes• 3 -矿物燃料，润滑剂和相关材料 3 - Mineral fuels, lubricants and related materials32 -煤，焦煤及煤球 32 - Coal, coke and briquettes33 -石油，石油产品及副产品 33 - Petroleum, petroleum products and related materials34 -天然气(天然和制造的) 34 - Gas, natural and manufactured35 -电流 35 - Electric current• 4 -动物和植物油，油脂和蜡 4 - Animal and vegetable oils, fats and waxes41 -动物油脂 41 - Animal oils and fats42 -固定油脂，原油，成品或分馏 42 - Fixed vegetable fats and oils, crude, refined or fractionated43 -动物或植物油脂，加工过的;不宜食的混合物或动物或植物脂肪或油类，不另说明 43 - Animal or vegetable fats and oils, processed; waxes of animal or vegetable origin; inedible mixtures or preparations of animal or vegetable fats or oils, n.e.s• 5 -化学品及有关产品，不另说明 5 -Chemicals and related products, n.e.s.51 -有机化工产品 51 - Organic chemicals52 -无机化学品 52 - Inorganic chemicals53 -染料，鞣革料 53 - Dyeing, tanning and colouring materials54 -医药产品 54 - Medicinal and pharmaceutical products55 -精油及香膏和香水原料;厕所，抛光和清洗的准备工具 55 - Essential oils and resinoids and perfume materials; toilet, polishing and cleansing preparations56 -肥料（除组272人） 56 - Fertilizers (other than those of group 272)57 -初级形状塑料 57 - Plastics in primary forms58 -在非塑料，初级形状 58 - Plastics in non-primary forms59 -化学材料及制品，不另说明 59 - Chemical materials and products, n.e.s• 6 -主要以材料分类的制成品 6 - Manufactured goods classified chiefly by material61 -皮革，皮革制品，不另说明，并经处理的毛皮 61 - Leather, leather manufactures, nes, and dressed furskins62 -橡胶制品，不另说明 62 - Rubber manufactures, nes63 -软木及木制品（不包括家具） 63 - Cork and wood manufactures (excluding furniture)64 -纸，纸板和纸浆的文章，纸或纸板 64 - Paper, paperboard and articles of paper pulp, of paper or of paperboard65 -纺织纱线，织物，制成品，不另说明，以及相关产品 65 - Textile yarn, fabrics, made-up articles, nes, and related products66 -非金属矿产制品，不另说明 66 - Non-metallic mineral manufactures, nes67 -钢铁 67 - Iron and steel68 -有色金属 68 - Non-ferrous metals69 -金属制品 69 - Manufactures of metals, nes•7 -机械和运输设备 7 - Machinery and transport equipment71 -发电机械设备 71 - Power-generating machinery and equipment72 -个别工业专用机械 72 - Machinery specialized for particular industries73 -金属加工机械 73 - Metalworking machinery74 -一般工业机械和设备和机器零件，不另说明 74 - General industrial machinery and equipment, nes, and machine parts, nes75 -办公室机器和自动资料处理仪器 75 - Office machines and automatic data-processing machines76 -电信和录音及音响设备和仪器 76 - Telecommunications andsound-recording and reproducing apparatus and equipment77 -电气机械，仪器和用具，巢，及零件（包括非电气同行，电家庭型设备） 77 - Electrical machinery, apparatus and appliances, nes, and electrical parts thereof (including non-electrical counterparts, nes, of electrical household-type equipment)78 -道路车辆（包括气垫车辆） 78 - Road vehicles (including air-cushion vehicles)79 -其他运输设备 79 - Other transport equipment•8 -杂项制品 8 - Miscellaneous manufactured articles81 -预制建筑物，管道，发热及照明装置和设备，不另说明 81 - Prefabricated buildings; sanitary, plumbing, heating and lighting fixtures and fittings, nes82 -家具及其零件，床上用品，床垫，床垫，软座垫及类似的填充制品 82 - Furniture, and parts thereof; bedding, mattresses, mattress supports, cushions and similar stuffed furnishings83 -旅游用品，手袋及类似容器 83 - Travel goods, handbags and similar containers84 -服装及衣服配件 84 - Articles of apparel and clothing accessories85 -鞋子 85 - Footwear87 -专业，科学及控制用仪器及器具 87 - Professional, scientific and controlling instruments and apparatus, nes88 -摄影仪器，设备和供应品，光学产品;钟表 88 - Photographic apparatus, equipment and supplies and optical goods, nes; watches and clocks89 -杂项制品,不另说明 89 - Miscellaneous manufactured articles, nes•9 -分类商品，而不是其他地方的贸易标准分类交易 9 - Commodities and transactions not classified elsewhere in the SITC91 -邮政包裹并无按实物 91 - Postal packages not classified according to kind93 -特殊交易和商品并无按实物 93 - Special transactions and commodities not classified according to kind96 -硬币（金币除外），没有法定货币 96 - Coin (other than gold coin), not being legal tender97 -金，非货币（不包括黄金矿砂及其精矿） 97 - Gold, non-monetary (excluding gold ores and concentrates)•一、-黄金，货币 I - Gold, monetary•二、-金币和目前的硬币 II - Gold coin and current coin参考文献1.↑国际贸易标准分类.[EB/OL].[2009-12-24]./zh-cn/SITC2.↑ United Nations Statistics Division.国际贸易标准分类.[EB/OL].[2010-3-23]./unsd/cr/registry/regcst.asp?Cl=14。

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M e t a l l o g r a p h i c P r e p a r a t i o n o f M e t a l M a t r i x C o m p o s i t e sMMC -Assess Thematic NetworkV o l u m e 3CONTENTAA6061/ Al 2O 3 /10-22p ...................................................................................................2 A359/SiC/22p ..................................................................................................................2 AA2XXX / SiC / 25p .......................................................................................................4 AlSi7/SiC/(50+16)p-bimodal .........................................................................................5 Dispal ...............................................................................................................................6 AA 357 / C-KC139 /UD or laminates ...........................................................................8 AA1099 / Al2O3 Nextel 610 / 50f-UD ..........................................................................9 AlZn6Mg / Al2O3 Altex/UD50f .................................................................................10 Carbon fiber reinforced magnesium alloys ..............................................................11 Magnesium/ C-T300 /50f-UD ......................................................................................12 Micrographs of C/Mg-composites with Al-content in the magnesium matrix and without ...................................................................................................................13 Micrographs of C/Mg-composites with Al2O3 particles as spacers .....................14 Cu-C (SFRM)// vol. 44%..............................................................................................15 Cu-C (CFRM)// vol 40, 50,60%...................................................................................15 Stainless Steel AISI 316 / 10-20 Vol.% Al2O3...........................................................16 Stainless Duplex Steel (UNS 31803) + 30 w.% Cr3C2..............................................17 Titan-alloys / continuous SiC fibre . (19)V o l u m e 3AA6061/ Al 2O 3 /10-22p A359/SiC/22pT1,T4 or T6 condition.POLISHING CONDITIONS• Automatic polishing. MECAPOL P320 machine with rotating polishing disk +PERE rotatingspecimen holder• Polishing cloths and diamond pastes PRESI ()Table 1: Polishing stages of AA6061/ Al2O3 /10-22p and A359/SiC/22p StageN° SupportAbrasiveForce* (daN)Disc Rotating speed (rpm) Specimen Rotating speed (rpm)Time(min) Lubricant 1 paper SiC P400 6 150 100 1 water 2 paper SiC P800 6 150 100 1 water 3paperSiC 1200 6 150 1001water 4 Polishin g cloth RAMdiamondpaste 6?m LD33 1spray/45 sec 6 150 1005GH (2drop / 5s)5 Polishin g clothRAM diamondpaste 3?m LD33 1spray/45sec 6 150 100 1 + 30” GH (2drop / 5s)6 Polishin g cloth SUPRA Suspension SPM 1/3 SPM+2/3 H2O1drop/sec6 150 100 3 ///* Pressure of 0,15 MPa for typical 32 mm diameter polishFig.1: AA6061/ Al 2O 3 /10p (Duralcan W6A10A)V o l u m e 3Fig.2: AA6061/ Al 2O 3 /22p (Duralcan W6D22A)Fig.3: A359/SiC/22p (Duralcan F3S.20S)V o l u m e 3AA2XXX / SiC / 25pPOLISHING CONDITIONS• Manual polishing with rotating disk (? 300mm)• All grinding and polishing products purchased from Struers ()Table 2: Polishing stages of AA2XXX / SiC / 25p Stage N° Support Abrasive Disc Rotating speed (rpm)Time (min) Lubricant 1 paper SiC 180 300 1 water 2 paper SiC 320 300 1 water 3 paper SiC 500 300 1 water G r i n d i n g4 paper SiC 1200 300 2 water 1Polishing cloth DP-Plan diamond paste 6?m SYNXI 1502-3DP-Blue (DEPIF) (1drop / 3s) 2 Polishing cloth DP-MOL diamond paste 3?m SYNTE 150 2-3DP-Blue (DEPIF) (1drop / 3s)P o l i s h i n g3 Polishing cloth OP-ChemOP-S Suspension150 3-4///V o l u m e 3AlSi7/SiC/(50+16)p-bimodalPOLISHING CONDITIONS• Polishing and grinding by Planopol-3 with Pedemax-2 (STRUERS)Table 3: Polishing stages of AlSi7/SiC/(50+16)p-bimodal StageNr. Support Abrasi ve Pressure Disc RotatingSpeed(rpm) Specimen Rotating Speed (rpm) Time (min) Lubricant1Diamond disc Piano 220 F=170N150110to plain Water 2 Largo-disc 15µmF=170N 150 1108-10 min Diamond- suspension 3 Polishing Cloth PAN 15µm F=170N 150 1105-6 min Diamond- suspension 4 Polishing Cloth DUR 6µm F=170N 150 1106minDiamond- suspension 5 Polishing Cloth MOL3µm F=170N 150 110 6minDiamond- suspension 6PolishingClothOP-CHEMOPS orOPUF=65N 150 110 2min100ml OPS +1ml H 2O 2 +1ml AmmoniakFig.4: AlSi7/SiC/(50+16)p-bimodalFOR MORE INFORMATIONHeidemarie Knoblich, hknobli@mail.zserv.tuwien.ac.at V o l u m e 3DispalDISPAL M1xx (M = reactive milling); AA1085 + submicron Al 4C 3/Al 2O 3 DISPAL M2xx (M = reactive milling); AlSi(12-20) + submicron Al 4C 3/Al 2O 3DISPAL A2xx (A = RS-powder by spraying); AlSi(12-40) + further alloying elementsDISPAL S2xx (S = spray compaction); AlSi(12-40) + further alloying elements DISPAL S7xx (S = spray compaction); AlZn(6-15) + further alloying elementsPOLISHING CONDITIONS• Automatic polishing with RotoPol-31 + RotoForce-4 top (rotating polishing disk (? 200 or300 mm) and rotating specimen holder of ? 100mm) • Polishing cloths: Struers (http://www.struers.de)• Diamond pastes Wirtz-Bühler (), Fig.1Table 4: Polishing stages of DispalStage N°SupportAbrasiveDisc Rotat ing speed (rpm)Force* [N] Time [min] Lubricant 1SiC 80 120 0.25 water 2 SiC 220 90 0.25 water 3 SiC 80090 0.25 water 4SiC 120090 0.25 waterG r i n d i n g5SiC-Paper on MD-Fuga SiC 240015090 0.251Polishing cloth MD-DAC diamond paste 6µm90 5 Struers blue2Polishing cloth MD-MOL diamond paste 3µm605 Struers red 3Polishing cloth MD-MOL diamond paste 1µm605Struers redP o l i s h i n g4Polishing cloth MD-NAPMastermet- Polish suspensionFa. Wirtz Buehler (SiO 2; 0,06 µm)15060 2* Pressure of 0,15 MPa for typical 32 mm diameter polishV o l u m e 3Fig.5: DISPAL S250 (AlSi20Fe5Ni2, spray compacted and extruded, LT)3emuloVAA 357 / C-KC139 /UD or laminatesPOLISHING CONDITIONS• Cutting under water using a diamond cut-off wheel.• Polishing with rotating (? 230mm) polishing plate. Polishing cloths and diamond pastes :PRESI ()STRUERS (), LAM PLAN (mplan.fr),TRIEFUS France (28011 CHARTRES CEDEX, Tel : 02-37-24-40-40)Table 5: Polishing stages of AA 357 / C-KC139 /UD or laminates Stage N°SupportAbrasiveSupplierDisc Rotating speed (rpm)Time (min) Lubricant 1 paper SiC 320 PRESI 250 1-2 water 2 paper SiC 600 PRESI 250 1-2 water 3 paper SiC 1200 PRESI 250 1-2 water 4Flocked cloth PSF (TRIEFUS) diamond paste 6?m LAM PLAN 250-3001-3alcohol5 Woven cloth 432 (LAM PLAN)diamond paste 3?m LAM PLAN 250-300 1-3alcohol6 Flocked cloth TF-R (PRESI) Diamon d paste 0.25 ?mLAM PLAN 250-300 1-3alcoholCleaning with alcohol in an ultrasonic bath and drying after stages 3, 4, 5, 6Fig.6: AA 357 / C-KC139 /UD or laminatesFOR MORE INFORMATIONS vidal@onera.fr V o l u m e 3AA1099 / Al2O3 Nextel 610 / 50f-UDPOLISHING CONDITIONS• Automatic polishing with rotating polishing disk (? 200mm) and rotating specimen holder(? 100mm)• Grinding, polishing cloths and diamond pastes ofTable 6: Polishing stages of AA1099 / Al2O3 Nextel 610 / 50f-UD Stage N° SupportAbrasivePres-sure (bar) Disc Rotation (rpm) SpecimenRotation(rpm)Time(min)Lubricant 1 SiC 320 1flat2 SiC 600 1 13 SiC 1200 1 14 Paper 1Dia-monddisc 2SiC 4000 1PIANO120 20.6 1 150110 2 water 5PolishingclothRAM 1LARGOdisc 2diamond paste 6?m DESY 19µm 2 0.61501103-5 PM 1(1drop / 3s) suspension 2 6 Polishing clothRAM 1 DAC 2 diamond paste 3?mDESY 10.6 150 1103-5PM 1(1drop / 3s) suspension 27 Polishing cloth SUPRA 1 MD-Chem 2 Suspension 25%SPM 1 +75%H2O; OPS or OPU 2 0.6 150 1101-2As above 1 or 100ml OPS 2 +1ml H 2O +1ml NH 3 8 1Polishing clothHS 1As above 10.4 150 1101water1PRESI (), 2 STRUERS (http://www.struers.de)Fig.7: AA1099 / Al2O3 Nextel 610 / 50f-UDFOR MORE INFORMATION:1Paul.Merle@insa-lyon.fr; 2 hknobli@mail.zserv.tuwien.ac.atV o l u m e 3AlZn6Mg / Al2O3 Altex/UD50fPOLISHING CONDITIONS• Automatic polishing with rotating polishing disk (? 300mm) and rotating specimen holder(? 160mm)• Polishing cloths: Struers (http://www.struers.de)• Diamond pastes Wirtz-Bühler (), Fig.1Table 8: Polishing stages of AlZn6Mg / Al2O3 Altex/UD50f Stage N° Support Abrasive Pressure (bar) Disc Rotating speed (rpm) Specimen Rotating speed (rpm)Time(min)Lubricant1 paper SiC 180 1 - 5 300 150 untilflatwater 2Largo ° Honey-comb discdiamond suspensi on 9?m 1 - 5 300 150 3 Dialub sw3 Texmet W * diamond suspension 3?m1 - 5 150 150 3 Dialub sw4 Polishin g cloth F *Masterm et II *1 - 5 150 150 2.1 waterFOR MORE INFORMATIONS Paul.Merle@insa-lyon.frV o l u m e 3Carbon fiber reinforced magnesium alloys• Fiber: Tenax HTA 5331, Toray T300J, Toray T800H, Torray T1000 Fiber coating: TiN and uncoated • Matrix: cp-Mg, AM20, AM50, AZ91POLISHING CONDITIONS• Manuel polishing with a very low pressure• The same preparation conditions like mentioned in the table below are used for thecombination of all fiber matrix types listed above:Table 9: Polishing stages of Carbon fiber reinforced magnesium alloys StageN o SupportAbrasive PressureDisc Rotating speed (rpm)Time (min) Lubricant1 Paper SiC 320 Low 300 1 Ethanol2 Paper SiC 500 Low 300 1 Ethanol3 Paper SiC 800 Low 300 1 Ethanol4 Paper SiC 1200 Low 300 1 Ethanol5 Paper SiC 2400 Low 300 1 Ethanol6 Paper SiC 4000 Low 300 1 Ethanol7 PolishingCloth MOL*Dp suspen- sion 3 µm (Samte*)Low 3005-10Struers Lubricant red* + blue* * Products of Struers (www.struers.de)Comment : In the case of Al2O3 particles as spacers for producing graded carbon fibrereinforced magnesium alloys, the metallographic preparation stays the sameFOR MORE INFORMATIONS Omueller@www.uni-erlangen.deV o l u m e 3Magnesium/ C-T300 /50f-UDPOLISHING CONDITIONS• Automatic polishing. MECAPOL P320 machine with rotating polishing disk +PERE rotatingspecimen holder• Polishing cloths and diamond pastes PRESI ()Table 10: Polishing stages of Magnesium/ C-T300 /50f-UD Stage N° Support AbrasiveForce* (daN) Disc Rotating speed (rpm) Specimen Rotating speed (rpm)Time (min)Lubricant1 paper SiC P240 6 150 100 2EXXSOL D80 2 paper SiC P600 6 150 100 2 EXXSOL D80 3 paper SiC 12006150100 2 EXXSOL D80 4Polishing cloth RAMdiamond paste 6?m PM6 150 1005EXXSOL D80 (1drop/ 2s) 5 Polishin g cloth RAM diamond paste 3?mLD336 1501003EXXSOL D80 (1drop/ 2s)** Pressure of 0,15 MPa for typical 32 mm diameter polishV o l u m e 3Micrographs of C/Mg-composites with Al-content in the magnesium matrix and withoutThe two SEM micrographs show composites with a Tenax HTA 5331 carbon fibre (similar to Toray T300J) as reinforcement and two different magnesium matrix alloys. On the left picture micrograph you see the fibres in a pure magnesium matrix (cp-Mg). On the right micrograph the fibers are infiltrated in a magnesium matrix with an aluminum content of 5% (AM50). To make the fiber/matrix-interface better visible the matrix has been etched for 15 seconds with 2% HNO 3. On the right picture micrograph plate shape Al 2MgC 2 precipitates can be seen at the fiber/matrix-interface.Fig.7: Tenax HTA5331/cp-Mg (SEM) Tenax HTA5331/AM50 (SEM)V o l u m e 3Micrographs of C/Mg-composites with Al2O3 particles as spacersThe two SEM micrographes show composites with a pure magnesium matrix (cp-Mg) and Toray T300J fibres as reinforcement. The Al 2O 3 particles are used as spacers to get a graded fibre volume fraction. On the left micrograph on the bottom there are no Al 2O 3 particles and the composite has a fiber volume fraction of about 60%. Only on top of this micrograph a few Al 2O 3 particles (white) are visible. One the right micrograph the fiber volume fraction is about 30% and a lot of Al 2O 3 are visible in white color.Fig.7: T300J/cp-Mg composite with a very low content of Al 2O 3 particles on top of themicrograph (SEM)Fig.8: T300J/cp-Mg composite with high content lot of Al 2O 3particles (SEM)V o l u m e 3Cu-C (SFRM)// vol. 44%Cu-C (CFRM)// vol 40, 50,60%POLISHING CONDITIONS• Polishing and grinding by hand. The time for grinding depends on the surface morphology which was determined by a visual control of the surface.Table 10: Polishing stages of Cu-C (SFRM)// vol. 44% and u-C (CFRM)// vol 40, 50,60%StageN° Support AbrasivePressure(bar)Disc Rotatingspeed (rpm)SpecimenRotating speed(rpm)Time(min) Lubricant1 paper SiC 320 - ~750 - dep. water2 paper SiC1200- ~750 - dep. water3 paper SiC2400- ~750 - dep. water4 paper SiC4000- ~750 - dep. water5 Polishingwith felts3µand/or1µm- ~750 - dep. alcoholFig.9: Cu-C-SFRM (x-y-direction) Cu-C-SFRM (z-direction)100 µm100 µmFOR MORE INFORMATIONS georg.korb@arcs.ac.at V o l u m e 3Stainless Steel AISI 316 / 10-20 Vol.% Al2O3POLISHING CONDITIONS• Manual polishing with rotating polishing disk (? 250mm in stages 1-5 and ? 200mm instages 6-8). Duration of each stage - polishing until apparent scratches from the previous stage has been disappeared (Table 1. and Fig. 1.).• Abrasive papers: Buehler (/)• Polishing cloths and diamond pastes: Struers (/)Table 11: Polishing stages of the AISI 316 + 20 Vol.% Al 2O 3 PRM MMC. StageNo. Support AbrasiveDisc Rotating speed (rpm)Lubricant 1 paper SiC 60 300 water 2 paper SiC 320 300 water 3 paper SiC 400 300 water 4 paper SiC 600 300 water 5 paperSiC 2400 300 water 6 polishing clothDP-Mol diamond paste 3?m 70 etanol + glycerin 7 polishing clothDP-Nap diamond paste 1?m 70 etanol + glycerin8 polishing clothDP-Napmagnesium oxide(MgO)70waterFig. 10: Polished microstructure of AISI 316 + 20 Vol.% Al 2O 3 PRM MMC (200x).FOR MORE INFORMATIONSAntero.Jokinen@vtt.fi,Topi.Kosonen@vtt.fiV o l u m e 3Stainless Duplex Steel (UNS 31803) + 30 w.% Cr3C2POLISHING CONDITIONS• Manual polishing with rotating polishing disk (? 250mm in stages 1-5 and ? 200mmin stages 6-8). Duration of each stage - polishing until apparent scratches from the previous stage has been disappeared, Table 1. • Polished microstructure, Fig. 1.• • Abrasive papers: Buehler (/)• • Polishing cloths and diamond pastes: Struers (/)ETCHINGEtching solution Aqua regia + glycerin. Etched microstructure, Fig. 2.Table 12: Polishing stages of composite sample.Stage No.Support Abrasive Disc Rotating speed (rpm) Lubricant 1 paper SiC 60 300 water 2 paper SiC 320 300 water 3 paper SiC 400 300 water 4 paper SiC 600 300 water 5 paper SiC 2400 300 water 6 polishing cloth DP-Moldiamond paste 3?m 70 etanol + glycerin7 polishing cloth DP-Napdiamond paste 1?m 70 etanol + glycerin8 polishing cloth DP-Nap magnesium oxide (MgO)70 waterFig. 11: Polished microstructure of Duplex Stainless Steel+30 w.% Cr 3C 2 PRM MMC (200x).V o l u m e 3Fig. 12: Polished+etched microstructure of Duplex Stainless Steel+30 w.% Cr3C2 PRM MMC (200x).FOR MORE INFORMATIONSAntero.Jokinen@vtt.fi,Topi.Kosonen@vtt.fi3emuloVTitan-alloys / continuous SiC fibreCUTTING CONDITIONS• low speed precision saw• resin bonded diamond wheel, thickness 0.6 mm, diamond grain size ca. 126 µm POLISHING CONDITIONS• Automatic polishing device, rotating disk (diameter 300 mm), rotating specimen holder (diameter 140 mm)• Polishing cloths: Struers (http://www.struers.de)• Diamond pastes Wirtz-Bühler (), Fig.1Table 13: Polishing stages of Titan-alloys / continuous SiC fibreStage No. Support Abrasive Lubri-cantLoad(N)DiscRotatingSpeed(rpm)SpecimenRotatingSpeed(rpm)Time(min)1 diamondpadNi-bonded diamondgrainsize20 µmwater hand 150 22 SiC-paperSiC 800 water hand 150 13 SiC-paperSiC 1200 water hand 150 14 syntheticwovensilkpolishingcloth diamondgrainsize3 µmalcoholicsuspension90 150 140 65 syntheticleatherpolishingclothSiO20,04 µmcolloidalsilicasuspensionpH 9.840 150 140 1ETCHING, ALTERNATING WITH POLISHING, STAGE 5100 ml water, 15 ml nitric acid (65 %), 10 ml hydrofluoric acid (40 %) for several seconds at room temperatureMORE INFORMATIONjoerg.hemptenmacher@dlr.de V o l u m e 3Fig. 13:cross section of a metal matrix composite Ti (Timetal 834)/ SiC (SCS-6) fibreV o l u m e 3。