HLW3070规格书
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表目录
表 1 HLW3070 极限值 .............................................................................................................7 表 2 HLW3070 数字逻辑特性..................................................................................................7 表 3 HLW3070 电气特性（VDD = 5V、3.3V ） ...................................................................8 表 4 HLW3070 电源电气特性（VDD = 5V）........................................................................8 表 5 HLW3070 电源电气特性（VDD = 3.3V）.....................................................................8 表 6 PIN 脚说明 ........................................................................................................................9 表 7 输出速率设置..................................................................................................................14 表 8 理想输出码和输入信号(1) ..............................................................................................14 表 9 读取数据时序表..............................................................................................................15 表 10 HLW3070 命令字说明表........................................................................................16 表 11 Config 寄存器说明表..............................................................................................17
HLW3070 用户手册
24-bit Sigma-Delta ADC
Rev 1.3
Rev.1.0
第 1 页，共 19 页
历史版本
REV 1.0 初始版本
版本历史
修改内容
HLW3070
版本日期
2013-8-17
Rev.1.3
第 2 页，共 19 页
HLW3070
目录
版本历史 ...........................................................................................................................................2
2 芯片功能模块描述..................................................................................................................10
2.1 2.2 2.3 2.4 2.5 2.6
2.6.1 2.6.2 2.6.3 2.6.4 2.6.5 2.6.6 2.6.7
数据准备/数据输入输出( DRDY / DOUT ) ........................................................14
串行时钟输入(SCLK) .............................................................................................14 数据发送 ..................................................................................................................15 功能配置 ..................................................................................................................16 2.6.7.1 SPI 命令字 ................................................................................................16 2.6.7.2 SPI 寄存器 ................................................................................................17 Power down 模式.....................................................................................................18
1.4
芯片绝对最大极限值 ................................................................................................7
1.5
HLW3070 数字逻辑特性 .........................................................................................7
2.6.8
模拟输入前端 ..........................................................................................................10 温度传感器 ..............................................................................................................10 低噪声 PGA 放大器................................................................................................11 时钟信号源 ..............................................................................................................12 复位和断电(POR&power down) ............................................................................12 SPI 串口通信 ...........................................................................................................13 建立时间 ..................................................................................................................13 ADC 数据输出速率 ................................................................................................14 数据格式 ..................................................................................................................14
1.6
HLW3070 电气特性..................................................................................................8
1.7
芯片引脚 ....................................................................................................................9
1.2
芯片应用场合 ............................................................................................................5
1.3
芯片基本结构功能描述 ............................................................................................6
目 录 .................................................................................................................................................3
3 芯片的封装 .......................................................................................................................Biblioteka Baidu......19
Rev.1.3
第 3 页，共 19 页
1 芯片功能说明 ............................................................................................................................5
1.1
芯片主要功能特性 ....................................................................................................5
HLW3070
图目录
图 1 HLW3070 原理框图..........................................................................................................6 图 2 HLW3070 芯片引脚图......................................................................................................9 图 3 模拟输入结构图..............................................................................................................10 图 4 PGA 结构图.....................................................................................................................11 图 5 HLW3070 数据建立过程 1.............................................................................................13 图 6 HLW3070 数据建立过程 2.............................................................................................13 图 7 HLW3070 读取数据时序图 1.........................................................................................15 图 8 HLW3070 读取数据时序图 2.........................................................................................15 图 9 功能配置时序图..............................................................................................................16 图 10 HLW3070 PowerDown 模式示意图.......................................................................18 图 11 芯片 SOP8 封装尺寸信息 ......................................................................................19
表 1 HLW3070 极限值 .............................................................................................................7 表 2 HLW3070 数字逻辑特性..................................................................................................7 表 3 HLW3070 电气特性（VDD = 5V、3.3V ） ...................................................................8 表 4 HLW3070 电源电气特性（VDD = 5V）........................................................................8 表 5 HLW3070 电源电气特性（VDD = 3.3V）.....................................................................8 表 6 PIN 脚说明 ........................................................................................................................9 表 7 输出速率设置..................................................................................................................14 表 8 理想输出码和输入信号(1) ..............................................................................................14 表 9 读取数据时序表..............................................................................................................15 表 10 HLW3070 命令字说明表........................................................................................16 表 11 Config 寄存器说明表..............................................................................................17
HLW3070 用户手册
24-bit Sigma-Delta ADC
Rev 1.3
Rev.1.0
第 1 页，共 19 页
历史版本
REV 1.0 初始版本
版本历史
修改内容
HLW3070
版本日期
2013-8-17
Rev.1.3
第 2 页，共 19 页
HLW3070
目录
版本历史 ...........................................................................................................................................2
2 芯片功能模块描述..................................................................................................................10
2.1 2.2 2.3 2.4 2.5 2.6
2.6.1 2.6.2 2.6.3 2.6.4 2.6.5 2.6.6 2.6.7
数据准备/数据输入输出( DRDY / DOUT ) ........................................................14
串行时钟输入(SCLK) .............................................................................................14 数据发送 ..................................................................................................................15 功能配置 ..................................................................................................................16 2.6.7.1 SPI 命令字 ................................................................................................16 2.6.7.2 SPI 寄存器 ................................................................................................17 Power down 模式.....................................................................................................18
1.4
芯片绝对最大极限值 ................................................................................................7
1.5
HLW3070 数字逻辑特性 .........................................................................................7
2.6.8
模拟输入前端 ..........................................................................................................10 温度传感器 ..............................................................................................................10 低噪声 PGA 放大器................................................................................................11 时钟信号源 ..............................................................................................................12 复位和断电(POR&power down) ............................................................................12 SPI 串口通信 ...........................................................................................................13 建立时间 ..................................................................................................................13 ADC 数据输出速率 ................................................................................................14 数据格式 ..................................................................................................................14
1.6
HLW3070 电气特性..................................................................................................8
1.7
芯片引脚 ....................................................................................................................9
1.2
芯片应用场合 ............................................................................................................5
1.3
芯片基本结构功能描述 ............................................................................................6
目 录 .................................................................................................................................................3
3 芯片的封装 .......................................................................................................................Biblioteka Baidu......19
Rev.1.3
第 3 页，共 19 页
1 芯片功能说明 ............................................................................................................................5
1.1
芯片主要功能特性 ....................................................................................................5
HLW3070
图目录
图 1 HLW3070 原理框图..........................................................................................................6 图 2 HLW3070 芯片引脚图......................................................................................................9 图 3 模拟输入结构图..............................................................................................................10 图 4 PGA 结构图.....................................................................................................................11 图 5 HLW3070 数据建立过程 1.............................................................................................13 图 6 HLW3070 数据建立过程 2.............................................................................................13 图 7 HLW3070 读取数据时序图 1.........................................................................................15 图 8 HLW3070 读取数据时序图 2.........................................................................................15 图 9 功能配置时序图..............................................................................................................16 图 10 HLW3070 PowerDown 模式示意图.......................................................................18 图 11 芯片 SOP8 封装尺寸信息 ......................................................................................19