品质管理英语词汇分类大全

品质管理英语词汇大全Cosmetic Defect Terms1. Soldering Quality2.错件（WRONG PARTS）3.多件（EXCESSIVE PARTS）4.短路（SHORT）5.断路（OPEN）6.线短（WIRE SHORT）7.线长（WIRE LONG）8.拐线（WIRE POOR DDRESS）9.冷焊（COLD SOLDER）10.包焊（EXCESS SOLDER）11.空焊（MISSING SOLDER）12.锡尖（SOLDER ICICLE）13.锡渣（SOLDER SPLASH）14.锡裂（SODER CRACK）15.锡洞（PIN HOLE）16.锡球（SOLDER BALL）17.锡桥（SOLDER BRIDGE）18.滑牙（SCREW LOOSE）19.氧化（RUST）20.异物（FOREIGNER MA TERIAL）21.溢胶（EXCESSIVE GLUE）22.锡短路（SOLDER BRIDGE）23.锡不足（SOLDER INSUFFICIENT）24.极性反（WRONG POLARITY）25.脚未入（PIN UNSEATED）26.脚未出（PIN UNVISIBLE）27.脚未剪（PIN NO CUT）28.脚未弯（PIN NOT BENT）29.缺盖章（MISSING STAMP）30.缺标签（MISSING LABEL）31.缺序号（MISSING S/N）32.序号错（WRONG S/N）33.标签错（WRONG LABEL）34.标示错（WRONG MARK）35.脚太短（PIN SHORT）36.J1不洁（J1 DIRTY）37.锡凹陷（SOLDER SCOOPED）38.线序错（W/L OF WIRE）39.未测试（NO TEST）40.VR变形（VR DEFORMED）41.PCB翘皮（PCB PEELING）42.PCB弯曲（PCB TWIST）43.零件沾胶（GLUE ON PARTS）44.零件脚长（PARTS PIN LONG）45.浮件（PARTS LIFT）46.零件歪斜（PARTS TILT）47.零件相触（PARTS TOUCH）48.零件变形（PARTS DEFORMED）49.零件损坏（PARTS DAMAGED）50.零件脚脏（PIN DIRTY）51.零件多装（PARTS EXCESS）52.零件沾锡（SOLDER ON PARTS）53.零件偏移（PARTS SHIFT）54.包装错误（WRONG PACKING）55.印章错误（WRONG STAMPS）56.尺寸错误（DIMENSION WRONG）57.二极管坏（DIODE NG）58.晶体管坏（TRANSISTOR NG）59.振荡器坏（X'TL NG）60.管装错误（TUBES WRONG）61.阻值错误（IMPEDANCE WRONG）62.版本错误（REV WRONG）63.电测不良（TEST FAILURE）64.版本未标（NON REV LEBEL）65.包装损坏（PACKING DAMAGED）66.印章模糊（STAMPS DEFECTIVE）67.标签歪斜（LABEL TILT）68.外箱损坏（CARTON DAMAGED）69.点胶不良（POOR GLUE）70.IC座氧化（SOCKET RUST）71.缺UL标签（MISSING UL LABEL）72.线材不良（WIRE FAILURE）73.零件脚损坏（PIN DAMAGED）74.金手指沾锡（SOLDER ON GOLDEN FINGERS）75.包装文件错（RACKING DOC WRONG）76.包装数量错（PACKING Q'TY WRONG）77.零件未定位（PARTS UNSEATED）78.金手指沾胶（GLUE ON GOLDEN FINGERS）79.垫片安装不良（W ASHER UNSEATED）80.线材安装不良（WIRE UNSEATED）81.立碑（TOMBSTONE）SMT 不良描述中英文对照1 露底材Base material expose2 偏位Shift3 短路/连锡Short4 少锡Insufficient solder5 多锡/包焊Excess solder6 漏印Missing print7 反白Upside down8 少件Missing component9 反向Wrong orientation10 错件Wrong component11 多件/残件Extra component12 破损Damaged13 空焊No solder14 立碑Tombstoning15 锡珠Solder balls16 侧立Side termination17 零件氧化Parts oxidation18 锡尖Solder projection19 浮高Float20 翘脚Lifted lead21 PAD不上锡PAD discoloration22 针洞Pinholes23 压件Cover component24 残异物Residues25 助焊剂残留Flux residues26 少胶Insufficient glue27 溢胶Overflow glue28 误判No Fail29 其它Other30 印刷不良Print Defect31 上盖脱落/断裂Top cover missing/crack32 掉件/撞件Drop component33 内PIN翘起（缺PIN/短PIN/翘PIN）Lifted inside-pin34 版本混装Mixed edition35 线路偏移Circuit shift36 错位Error position37 脚歪/变形Lead deformed/deformation38 混料Mixed material39 胶未固化Glue not be solidified40 烫伤Scald41 堵孔Obstacle on via42 PCB白化/分层PCB Delamination43 漏洞Exposed copper44 无极性Missing polarity45 压伤Crush46 漏点胶Missing glue47 气泡Air bubble48 屏蔽架变形Shield Deformation49 屏蔽架毛刺Shield Burr50 刮伤Scraped51 弹片翘起Spring lifted52 弹片失效Spring failure53 弹片无法复位Spring can’t replace54 零件沾锡Solder on parts序号汉语意义英文翻译焊锡质量类1 冷焊cold solder2 零件偏移component shifted3 污损contamination4 坏件damaged component5 锡多excessive solder6 装插不良improper insertion7 绝缘不良insulation damaged 8 线脚长lead protrusion out of spec9 漏点胶missing glue 10 漏标示missing marking11 近似短路near short 12 无线尾no lead protruded13 翘皮peeling off 14 极性反polarity reversed15 成型不良poor preforming 16 锡桥solder bridge17 锡裂solder crack 18 锡尖solder icicle19 锡少solder insufficient 20 防焊漆胶落solder mask peeling off 21 锡渣solder spatter 22 锡洞solder void23 错件wrong partICT Fail Cause and Repair Actions1 短路Short2 零件插反Backward Part3 板丢失Board Lost4 板修复Board Repaired5 板报废Board Scrapped6 板送去分析Board Sent For Analysis7 零件损坏Broken Part8 零件缺陷Defective Part9 掉件Missing part 10 加零件Part Added11 零件修复Part Repaired 12 换零件Part Replaced13 PCB缺陷PCB Defect 14 PCB开路PCB Open15 加锡Solder Added 16 桥焊Solder Bridge17 去锡Solder RemovedSolding quality1 空焊Empty Solder2 包焊Excess Solder3 浮焊Floating Solder4 冰柱Icing5 虚焊Inveracious Soldering6 掉件，漏件Missing Component7 开路Open 8 漏焊Open Solder9 锡桥Solder Bridge 10 锡尖突出Solder Tip11 锡裂Split SolderOperational defect terms1 零件插反Backward Part2 零件损坏Broken Part3 碰伤Bumps4 异物Foreign Part5 零件错位Misaligned Part6 漏件Missing Parts (component)7 粘胶Paint Adhesion 8 刮伤Scratches9 错件Wrong PartOthers1 不正常Abnormal2 附件Accessory3 外观Apperance4 装配Assembling5 附着，贴附Attached6 弯曲Bent7 束线Bind 8 翘皮Blister/peeling9 接Bridge 10 破损Broken11 毛边Burrs 12 裂纹Chip / crack13 夹住Clip 14 污染Contamination15 腐蚀Corrosion 16 交叉Cross17 损坏Damage 18 减少Decrease19 深刮伤Deep Scratch 20 缺点Defect21 变形Deformed 22 凹痕Dent23 偏差Deviation 24 尺寸Dimension25 变色(白化) Discoloration 26 化状箱Display box 27 双重Double 28 脱落Drop , Tall off29 超过Excess 30 假焊False Solder (Cold) 31 频率Fequency 32 塞住Fill Up33 浮Float 34 异物Foreign Material 35 碎片塞Fragement 36 胶Glue37 溢胶Glue overflow 38 重Heavy39 不清楚illegible 40 不完全Incomplete41 增加Increase 42 确认Indentify43 指示灯Indicate Lamp 44 不合治具Ingagued45 未固定Insecurely 46 插配Insertion47 内部Inside 48 干扰Interference49 间断，不安定Intermittent 50 杂物Junk51 纠缠Kink 52 布置，配置Layout53 线脚Lead 54 浅音Leakage Sound55 翘起Lifted 56 轻Light57 位置Location 58 松Loose59 方向不对Misorientation 60 未镀表层Misplating61 欠缺Missing 62 混Mix63 多重Multiple 64 不良No Good (NG)65 偏心Off center 66 振荡Oscillation67 外部Outsid 68 脱漆Paint drop69 部分Partial 70 铜箔Pattem (PAD）71 太差Poor 72 凸Protrude73 残留物Residue 74 粗糙Roughness75 生锈Rust 76 LED 数字分节Segment77 陷Sink 78 滑动Slide79 脱落Slip 80 锡珠Solder Ball81 流锡Solder Flow 82 分开，分隔Sparation83 污点Stain 84 粘Stick85 薄Thickness 86 紧Tight87 透明Transparent 88 不平Uneven89 不顺Unsmooth 90 上下颠倒Upside down91 漆Varnish Paint 92 缺洞V oid (Holes)93 弱WeakSMT中英文对照1. Fundamentals of Solders and Soldering（焊料及焊接基础知识）Soldering Theory（焊接理论）Microstructure and Soldering（显微结构及焊接）Effect of Elemental Constituents on Wetting（焊料成分对润湿的影响）Effect of Impurities on Soldering（杂质对焊接的影响）2. Solder Paste Technology（焊膏工艺）Solder Powder ( 锡粉)Solder Paste Rheology（锡膏流变学）Solder Paste Composition & Manufacturing（锡膏成分和制造）3. SMT Problems Occurred Prior to Reflow（回流前SMT问题）Flux Separation（助焊剂分离)Paste Hardening（焊膏硬化）Poor Stencil Life（网板寿命问题)Poor Print Thickness（印刷厚度不理想）Poor Paste Release From Squeegee（锡膏脱离刮刀问题）Smear（印锡模糊）Insufficiency（印锡不足）Needle Clogging（针孔堵塞）Slump（塌落）Low Tack（低粘性）Short Tack Time （粘性时间短）4. SMT Problems Occurred During Reflow（回流过程中的SMT问题）Cold Joints（冷焊）Nonwetting（不润湿）Dewetting（反润湿）Leaching（浸析）Intermetallics（金属互化物）Tombstoning（立碑）Skewing（歪斜）Wicking（焊料上吸）Bridging（桥连）V oiding（空洞）Opening（开路）Solder Balling(锡球)Solder Beading（锡珠）Spattering（飞溅）5. SMT Problems Occurred at Post Reflow Stage（回流后问题）White Residue（白色残留物）Charred Residue（炭化残留物）Poor Probing Contact（探针测接问题）Surface Insulation Resistance or Electrochemical Migration Failure（表面绝缘阻抗或电化迁移缺陷）Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants （分层/ 空洞/ 敷形涂覆或包封的固化问题）6. Challenges at BGA and CSP Assembly and Rework Stage（BGA、CSP组装和翻修的挑战）Starved Solder Joint（少锡焊点）Poor Self-Alignment（自对位问题）Poor Wetting（润湿不良）V oiding（空洞）Bridging（桥连）Uneven Joint Height（焊点高度不均）Open（开路）Popcorn and Delamination（爆米花和分层）Solder Webbing（锡网）Solder Balling（锡球）7. Problems Occurred at Flip Chip Reflow Attachment（倒装晶片回流期间发生的问题）Misalignment（位置不准）Poor Wetting（润湿不良）Solder V oiding（空洞）Underfill V oiding（底部填充空洞）Bridging（桥连）Open（开路）Underfill Crack（底部填充裂缝）Delamination（分层）Filler Segregation（填充分离）Insufficient Underfilling（底部填充不充分）8. Optimizing Reflow Profile via Defect Mechanisms Analysis （回流曲线优化与缺陷机理分析）Flux Reaction（助焊剂反应）Peak Temperature（峰值温度）Cooling Stage（冷却阶段）Heating Stage（加热阶段）Timing Considerations（时间研究）Optimization of Profile（曲线优化）Comparison with Conventional Profiles（与传统曲线的比较）Discussion（讨论）Implementing Linear Ramp Up Profile(斜坡式曲线)。