MAX1471接收器
S7-1200选型手册(2017)
PROFINET 通信
S7-1200 CPU 可以与以下设备通信：
S7-1200 家族提供各种各样的通信选项以满足您所有的网络要求。
• I-Device • PROFINET • PROFIBUS • 远距离控制通信 • 点对点（PtP）通信 • USS 通信 • Modbus RTU • AS-i • I/O Link MASTER
支持以下协议： • TCP/IP • ISO-on-TCP • S7 通信（服务器端）
更多 SIMATIC S7-1200 控制器
组网简单
SIMATIC S7-1200 通信接口由一个抗干扰的 RJ45 连接器组成。该连 接器具有自动交叉网线（auto-cross-over）功能，支持最多 23 个以太 网连接，数据传输速率达 10/100 Mbit/s。为了使布线最少并提供最
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SIMATIC S7-1200 技术综述
西门子控制器家族产品
西门子控制器系列是一个完整的产品组合，包括从高性能可编程 SIMATIC S7-1200 小型可编程控制器充分满足中小型自动化的系统
需求）。
可编程控制器的发展方向，西门子也将一如既往开拓创新，引领自
动化潮流。
西门子 SIMATIC 系列产品定位
应用复杂性
SIMATIC S7-400 SIMATIC S7-300 SIMATIC S7-200 LOGO!0BA6
SIMATIC S7-1500
SIMATIC S7-1200 / S7-200 SMART
MAX2870中文规格书
PARAMETER
CONDITIONS
REFERENCE OSCILLATOR INPUT (REF_IN)
REF_IN Input Frequency Range
REF_IN Input Sensitivity
REF_IN Input Capacitance
REF_IN Input Current
CONDITIONS
CP[3:0] = 1111, RSET = 5.1kI CP[3:0] = 0000, RSET = 5.1kI
With output dividers (1/2/4/8/16/32/64/128)
Open loop Open loop into 2:1 VSWR Fundamental VCO output Fundamental VCO output VCO output divided-by-2 VCO output divided-by-2
定购信息在数据资料的最后给出。 典型应用电路在数据手资料的最后给出。
相关型号以及配合该器件使用的推荐产品，请参见：china.maximintegrated. com/MAX2870.related。
功能框图
MAX2870
REF_IN
CLK DATA
LE
MUX
R COUNTER
X2
SPI AND REGISTERS
Both channels enabled, maximum output power
Total, including RFOUT, both channel (Note 3)
Each output divide-by-2 ICCVCO + ICCRF (Note 3) Low-power sleep mode
MAX13487EESA+
Half-Duplex RS-485-/RS-422-Compatible Transceiver with AutoDirection Control MAX13487E/MAX13488E
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND.) Supply Voltage VCC ...............................................................+6V SHDN, RE, DI..............................................................-0.3V to +6 A, B........................................................................... -8V to +13V Short-Circuit Duration (RO, A, B) to GND ..................Continuous Continuous Power Dissipation (TA = +70°C) 8-Pin SO (derate 5.9mW/°C above +70°C)..................471mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature ......................................................+150°C Storage Temperature Range .............................-65°C to +150°C Lead Temperature (soldering 10s) ..................................+300°C
TH71071
基于TH71071的315/433MHZ ASK发射器电路设计摘要本文简要介绍由TH71071芯片构成的315/433MHZ ASK发射器的功能、内部结构、引脚排列及典型的应用电路。
该TH71071 ASK发送器是专为IC应用程序中的欧洲433MHz工业科学医疗（ISM）频带所设计的，根据EN300 220电信标准.它也可以用于任何载波频率从310 MHz到450 MHz范围的其他系统。
发射机TH71071由一个完全集成的压控振荡器(VCO),32分频器一divide-by-32一(div32),相位频率检波器(PFD)和充电泵.外部环路滤波器（引脚LF）决定着引脚PLL和参考杂散信号抑制动态行为.该VCO的输出信号送入功率放大器（每年）. RF信号功率Po可被六步调整从Po= –12 dBm 到+2 dBm，通过改变电阻值R1或改变PS/数据引脚电压VPS .开放式集电极差分输出(OUT1, OUT2)可以用来直接驱动环形天线或通过一个balanced-to-unbalanced（不平衡变压器）变压器将其转换为单端阻抗.为了获得最大的可用的输出功率，差分输出应匹配的负载约 1 kΩ.带隙偏置确保了IC 稳定运行在一个2.2 V到5.5 V的供电范围。
关键字：ASK发射器晶体振荡器压控振荡器VCO分频器外部环路滤波器相频检波器AbstractIt briefly introduced The TH71071 ASK transmitter IC with 315/433MHZ function, internal structure, pin array and typical apply circuit. the TH71071 transmitter consists of a fully integrated voltage-controlled oscillator (VCO), a divide-by-32 divider (div32), a phase-frequency detector (PFD) and a charge pump. An external loop filter at pin LF determines the dynamic behaviour of the PLL and suppresses reference spurious signals.The VCO’s output signal feeds the power amplifier (PA). RF signal power P o can be adjusted in six steps from P o = –12 dBm to +2 dBm either by changing the value of resistor R1 or by varying the voltage V PS at pin PS/DATA. The open-collector differential output (OUT1, OUT2) can be used to either directly drive a loop antenna or to be converted to a single-ended impedance by means of a balanced-to-unbalanced (balun) transformer. For maximum available output power, the differential output should be matched to a load of approx.1 k .Bandgap biasing ensures stable operation of the IC at a power supply range of 2.2 V to 5.5 V.Key word:ASK transmitter crystal oscillator voltage-controlled oscillator (VCO)divider External loop filter phase-frequency detector (PFD)目录1.TH71071芯片简介------------------------------------------41.1 概述---------------------------------------------------------------------------------41.2 主要性能指标---------------------------------------------------------------------------------41．2．1 主要性能指标----------------------------------------------------------------------4 1．2．2 绝对最大额定值---------------------------------------------------------------------5 1．2．3 正常工作条件---------------------------------------------------------------------------------5 1．2．4 DC特征------------------------------------------------------------------------------------5 1．2．5 AC特征--------------------------------------------------------------------------------5 1. 3 芯片特征---------------------------------------------------------------------------------62. TH71071芯片封装与引脚功能------------------------------------63. TH71071内部结构与工作原理---------------------------------------------------93.1 功率放大器-------------------------------------------------------------------------------------93.2 压控振荡器---------------------------------------------------------------------93.3 锁相环合成器--------------------------------------------------------------------------------93.4 载波频率------------------------------------------------------------------------------93.5 振幅键控调制---------------------------------------------------------------------------93.6L O源-------------------------------------------------------------103.7 调频--------------------------------------------------------------------------103.8模式控制--------------------------------------------------------------------104. TH71071应用电路设计---------------------------------------------------------------------114.1 应用电路与元器件参数------------------------------------------------------------114.2 电原理图---------------------------------------------------------------------124.3P C B图-------------------------------------------------------------134．3．1 底层图-------------------------------------------------------------------------------134．3．2 顶层图--------------------------------------------------------------------------14 4．3．3 三维图-------------------------------------------------------------------------14 4．4谱的曲线图-------------------------------------------------------------155. 总结--------------------------------------------------------------------------------------------------------16参考文献------------------------------------------------------------------------------------------------181.TH71071芯片简介1.1概述TH71071 是一个单片ASK 发射器芯片，可工作在310 MHz～440 MHz 频段，ASK 调制通过开关内部的功率放大器完成，芯片内集成了晶体振荡器、压控振荡器（VCO）、相频检波器、分频器、功率放大器等电路。
办公用品价格清单
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彩色 C8728AA价格惠普 彩色 HPC8727AA价格惠普 黑色 C8765ZZ价格惠普 彩色 C8766/855价格惠普 彩色 C9363/857价格惠普 黑色 C8767Z/853价格惠普 黑色 C8816AA价格惠普 彩色 C8817AA价格惠普 彩色 CC643ZZ/818价格惠普 黑色 CC640ZZ/818价格惠普 彩色 CC656AA/901价格三星 黑色 M40价格EPSON-T04x 黑色墨盒 T0461价格EPSON-T04x 彩色墨盒系列价格兄弟墨盒 黑色 LC950BK价格兄弟墨盒 彩色：蓝色，红色，黄色价格联想墨盒 黑色 LC6001B+H(双包装)价格联想墨盒 彩色 LC6002C价格惠普硒鼓 Q7553A价格惠普硒鼓 CC388A价格惠普硒鼓 Q2612A价格惠普硒鼓 Q2613A价格惠普硒鼓 Ce278价格惠普硒鼓 CE505A价格惠普硒鼓Q6000系列 黑色（Q6000A ）价格惠普硒鼓Q6000系列 彩色（青色、黄色、红色）价格映美色带架 JMR101 (用于530K/KII540K/580/590/230/330) 价格三星硒鼓 SCX-4521D3价格三星硒鼓 ML-2150D8 黑色价格三星硒鼓 SCX-D4725A价格SANSUNG (ML1710)价格SANSUNG (ML1210)价格理光复印机碳粉 1610D价格理光复印机碳粉 2220D价格理光复印机碳粉 1220D价格佳能硒鼓 传真机W鼓价格佳能硒鼓 E16价格佳能硒鼓 FX3价格佳能硒鼓 FX-9价格佳能硒鼓 303/LBP2900价格佳能硒鼓 CRG-308 黑色价格佳能硒鼓 Ep22 原装（鼓粉一起）黑色价格佳能复印机粉盒 G-20价格佳能复印机粉盒 NPG-28价格兄弟硒鼓 硒鼓（DR-2050)价格兄弟硒鼓 墨粉盒（TN-2050)价格兄弟硒鼓 墨粉盒（TN-2115)价格兄弟硒鼓 DR-2150价格联想硒鼓 Lt2922/粉盒价格联想硒鼓 Lt2020价格齐心（COMIX）T168 大按键超值电话机 白色价格齐心（COMIX）T128 超大屏录音王商务电话机价格飞利浦（PHILIPS） TD-2808 来电显示电话机（白色）价格飞利浦（PHILIPS） TD-2808 来电显示电话机（黑色）价格飞利浦（PHILIPS）CORD 040来电显示电话机（白色）价格飞利浦（PHILIPS）CORD 040来电显示电话机（蓝色）价格飞利浦（PHILIPS）CORD 042来电显示电话机（白色）价格飞利浦（PHILIPS）TD-2816D来电显示电话机（白色）价格飞利浦（PHILIPS）CORD 042来电显示电话机（蓝色）价格飞利浦（PHILIPS） CORD118大屏幕，免电池工作 来电显示电话机 白色价格飞利浦（PHILIPS） CORD118大屏幕，免电池工作 来电显示电话机 黑色价格飞利浦（PHILIPS）TD-2816D来电显示电话机（蓝色）价格飞利浦（PHILIPS）TD2815D来电显示电话机（白色）价格飞利浦（PHILIPS） CORD108 来电显示电话机（白色）价格飞利浦（PHILIPS） CORD108 来电显示电话机（黑色）价格飞利浦（PHILIPS）TD2815D来电显示电话机（蓝色）价格飞利浦（PHILIPS) TD2801 有绳电话机 可挂墙不带来电显示 （白）价格飞利浦（PHILIPS) TD2801 有绳电话机 可挂墙不带来电显示 （黑色）价格飞利浦电话机 CORD-040 白色价格飞利浦电话机 CORD-118 黑色价格飞利浦电话机 CORD-042 白色价格飞利浦无绳子母电话机 TD-6816A 白色价格x北恩话务员耳机 VF-560 座机 耳机 价格北恩话务机 DT60 价格西门子 5020 来电显示办公电话机价格德信HCD8588TSD电话机价格中诺 (CHINO-E)C028价格中诺（CHINO-E）C168来电显示电话机（灰白色）价格中诺（CHINO-E）C168来电显示电话机（红色）价格中诺 C228 来电显示电话机（黑色）价格中诺 C228 来电显示电话机（白色）价格中诺 C228 来电显示电话机（蓝色）价格中诺 C228 来电显示电话机（红色）价格中诺（CHINO-E） C229 来电显示电话机 白色价格中诺（CHINO-E）G015来电显示电话机（黑色）价格中诺（CHINO-E） G015 来电显示电话机 白色价格中诺来电显示电话机 HCD6138（20）C044 灰白色价格中诺来电显示电话机 C168 灰白价格中诺有绳电话机 C-229 白色价格中诺来电显示电话机 HCD6138(20)C028 灰白价格中诺来电显示电话机 HCD6138（20）24 灰白色价格中诺来电显示电话机 HCD6138（20）C052 白色价格中诺电话机 C131 白色价格中诺多功能电话机（耳麦接听功能） C301 价格中诺商务电话机 G056 黑色价格步步高普通电话机 HCD007（6082）TSDL 白色价格步步高来电显示电话机 HCD007(6033)TSDL 白色价格TCL HA868（9A）普通按键电话机（米白）价格TCL HA868(9A) 普通按键电话机(冰蓝)价格TCL HCD868(131)TSD 来电显示电话机（灰白色）价格TCL HCD868(17B)TSD 来电显示电话 （火红）价格TCL HCD868（37） 来电显示电话机（米白）价格TCL HCD868(37)TSD 来电显示 (黑色)价格TCL HCD868(131)TSD 来电显示电话机 蓝黑色价格TCL HCD868（79） 来电显示电话机（黑色）价格TCL HCD868（79） 来电显示电话机（灰白）价格TCL HCD868（17B） 来电显示电话机（灰白）价格TCL HA868（32）P/T 普通按键电话（白色）价格TCL HCD868(210)TSD来电显示电话 （雅致白）价格TCL HCD868(201)TSD来电显示电话机（雅致白）价格TCL HCD868（201）TSD 来电显示电话机 （火红）价格TCL HCD868(201)TSD 来电显示电话机 （深灰）价格TCL来电显示电话机 HCD868（203）TSD 白色价格TCL来电显示电话机 HCD868（206）TSD 雅白价格TCL无绳子母电话机 HWCD868(16A)TSD 白色价格摩托罗拉SMP商务对讲机 SMP818 118*58*21mm 0.205KG 黑色价格¥9,800.00其他¥233.40科密¥175.90科密¥1,207.50佳能¥2,613.90佳能¥1,207.50佳能¥423.20佳能¥1,248.90科密¥1,914.70科密¥2,778.40准星¥2,427.60普霖¥677.30普霖¥591.10齐心¥718.70齐心¥1,523.70科密¥794.60科密¥1,145.40科密¥1,028.10科密¥794.60科密¥1,307.50科密¥0.00惠普¥460.00其他¥454.20其他¥977.503M¥86.20其他¥138.00其他¥86.20其他¥1,265.00其他¥1,472.00其他¥326.60其他¥442.70其他¥442.70其他¥489.90其他¥501.40其他¥583.00其他¥212.70其他¥431.20其他¥437.00其他¥517.50其他¥21.80齐心¥293.30其他¥195.50其他¥343.80其他¥166.80其他¥828.00其他¥573.80其他¥2,298.90其他¥1,782.50其他¥2,298.90其他¥149.50飞利浦¥144.90其他¥144.90其他¥222.00其他¥32.20其他¥32.20其他¥207.00其他¥77.00貂王¥87.60冲击波¥75.90冲击波¥29.20其他¥78.20其他¥148.30其他¥308.20其他¥75.90金士顿¥123.00金士顿¥228.90金士顿¥525.50金士顿¥46.00金士顿¥69.00金士顿¥112.70金士顿¥46.00金士顿¥69.00金士顿¥112.70金士顿¥74.70金士顿¥135.70金士顿¥270.30金士顿¥87.60朗科¥153.00朗科¥327.80朗科¥817.60朗科¥123.00爱国者¥223.10爱国者¥386.40爱国者¥2.10其他¥3.10Sony¥3.70Sony¥5.40Sony¥13.80Sony¥23.30Sony ¥112.70Sony ¥7.90Sony ¥10.70Sony ¥31.60其他¥80.00双飞燕¥80.00双飞燕¥80.00双飞燕¥47.10双飞燕¥50.30罗技¥64.30罗技¥62.00罗技¥67.80罗技¥67.80罗技¥67.80罗技¥67.80罗技¥85.30罗技¥88.80罗技¥87.60罗技¥51.70罗技¥56.30罗技¥90.80罗技¥101.20罗技¥31.60现代¥31.60现代¥31.60现代¥38.60现代¥38.60现代¥40.90现代¥57.30现代¥57.30现代¥54.00双飞燕¥51.70双飞燕¥63.20双飞燕¥86.20双飞燕¥93.10双飞燕¥135.70罗技¥169.00惠普¥223.10惠普¥232.30惠普¥156.40惠普¥233.40惠普¥172.50惠普¥142.60惠普¥197.80惠普¥228.90惠普¥316.30惠普¥288.70惠普¥174.80惠普¥209.30惠普¥164.50惠普¥162.10惠普¥222.00惠普¥319.70惠普¥111.80爱普生C63/C65/CX3500寿命（5%覆盖率）：540页¥73.60爱普生C63/C65/CX3500寿命（5%覆盖率）：250页¥193.20兄弟¥91.10兄弟¥415.20联想¥241.50联想¥677.30惠普¥549.70惠普¥524.40惠普¥625.60惠普¥690.00惠普¥923.40惠普¥748.60惠普¥724.50惠普¥17.20其他¥724.50三星¥1,343.20三星¥899.30三星¥361.10三星¥361.10三星¥170.20理光¥350.80理光¥409.40理光¥678.50佳能¥617.50佳能¥553.10佳能¥555.40佳能¥572.70佳能¥549.70佳能¥245.00佳能¥269.10佳能¥806.10兄弟¥420.90兄弟¥325.40兄弟¥929.20兄弟¥327.80联想¥504.80联想¥65.80齐心¥487.60齐心¥87.30飞利浦¥87.30飞利浦¥90.80飞利浦¥93.10飞利浦¥93.10飞利浦¥100.40飞利浦¥102.20飞利浦¥104.30飞利浦¥104.30飞利浦¥105.30飞利浦¥105.30飞利浦¥109.30飞利浦¥109.30飞利浦¥110.40飞利浦¥114.40飞利浦¥114.40飞利浦¥89.70飞利浦¥101.20飞利浦¥97.70飞利浦¥285.20飞利浦¥287.50其他¥239.20其他¥383.00西门子¥77.60德信¥52.30中诺¥46.60中诺¥46.60中诺¥53.80中诺¥53.80中诺¥53.80中诺¥53.80中诺¥57.40中诺¥58.60中诺¥58.60中诺¥43.70中诺¥51.70中诺¥47.10中诺¥48.30中诺¥59.80中诺¥64.40中诺¥66.70中诺¥66.70中诺¥86.20步步高¥94.30步步高¥58.60TCL ¥58.60TCL ¥58.60TCL ¥62.60TCL ¥65.80TCL ¥65.80TCL ¥65.80TCL ¥70.60TCL ¥68.20TCL ¥70.60TCL ¥70.60TCL ¥81.30TCL ¥82.60TCL ¥82.60TCL ¥82.60TCL ¥86.20TCL ¥97.70TCL ¥247.20TCL ¥754.40摩托罗拉。
MAX3232EEUE中文资料
General DescriptionThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24communications interface devices feature low power con-sumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±15kV using IEC 1000-4-2 Air-G ap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge (±9kV for MAX3246E), and ±15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmit-ter output pins are protected to ±15kV using the Human Body Model.A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge pump requires only four small 0.1µF capacitors for opera-tion from a +3.3V supply. Each device guarantees opera-tion at data rates of 250kbps while maintaining RS-232output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232-compliant output levels.The MAX3222E/MAX3232E have two receivers and two transmitters. The MAX3222E features a 1µA shutdown mode that reduces power consumption in battery-pow-ered portable systems. The MAX3222E receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only 1µA of supply current. The MAX3222E and MAX3232E are pin, package, and func-tionally compatible with the industry-standard MAX242and MAX232, respectively.The MAX3241E/MAX3246E are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX3237E (five drivers/three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shut-down mode in which all receivers remain active, while consuming only 1µA (MAX3241E/MAX3246E) or 10nA (MAX3237E).The MAX3222E, MAX3232E, and MAX3241E are avail-able in space-saving SO, SSOP, TQFN and TSSOP pack-ages. The MAX3237E is offered in an SSOP package.The MAX3246E is offered in the ultra-small 6 x 6 UCSP™package.ApplicationsBattery-Powered Equipment PrintersCell PhonesSmart Phones Cell-Phone Data Cables xDSL ModemsNotebook, Subnotebook,and Palmtop ComputersNext-Generation Device Features♦For Space-Constrained ApplicationsMAX3228E/MAX3229E: ±15kV ESD-Protected, +2.5V to +5.5V, RS-232 Transceivers in UCSP ♦For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx, RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers________________________________________________________________Maxim Integrated Products 119-1298; Rev 10; 1/06Ordering Information continued at end of data sheet.*Dice are tested at T A = +25°C, DC parameters only.**EP = Exposed paddle.Pin Configurations, Selector Guide, and Typical Operating Circuits appear at end of data sheet.For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc.†Covered by U.S. Patent numbers 4,636,930; 4,679,134;4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 TransceiversABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Notes 3, 4)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V V+ to GND (Note 1)..................................................-0.3V to +7V V- to GND (Note 1)...................................................+0.3V to -7V V+ + |V-| (Note 1).................................................................+13V Input Voltages T_IN, EN , SHDN , MBAUD to GND ........................-0.3V to +6V R_IN to GND.....................................................................±25V Output Voltages T_OUT to GND...............................................................±13.2V R_OUT, R_OUTB (MAX3241E)................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT to GND.......................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C)..........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C).......754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C).....1666.7mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW 20-Pin TQFN (derate 21.3mW/°C above +70°C)........1702mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C)........879mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 28-Pin TSSOP (derate 12.8mW/°C above +70°C)......1026mW 32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW 6 x 6 UCSP (derate 12.6mW/°C above +70°C).............1010mW Operating Temperature Ranges MAX32_ _EC_ _...................................................0°C to +70°C MAX32_ _EE_ _.................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 2)Infrared, 15s..................................................................+200°C Vapor Phase, 20s..........................................................+215°C Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devicecan be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.Preheating is required. Hand or wave soldering is not allowed.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________3M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers4_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX3237E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 3)±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =0.33µF tested at +5.0V ±10%. MAX3246E; C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at 5.0V ±10%.Note 4:MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.Note 5:The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are atthe supply rails.Note 6:MAX3241EEUI is specified at T A = +25°C.Note 7:Transmitter skew is measured at the transmitter zero crosspoints.TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246EMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________5-6-4-202460MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )10001500500200025003000531-1-3-5-6-2-42046-5-31-135010001500500200025003000LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-7.5-5.0-2.502.55.07.5MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )500100015002000__________________________________________Typical Operating Characteristics(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)-6-5-4-3-2-10123456010002000300040005000MAX3241ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )302010405060020001000300040005000MAX3241EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )04286121014010002000300040005000MAX3241ESLEW RATE vs. LOAD CAPACITANCEM A X 3237E t o c 05LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )-6-5-4-3-2-10123456010002000300040005000MAX3222E/MAX3232ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U TV O L T A G E (V )624108141216010002000300040005000MAX3222E/MAX3232ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /µs)2520155103530404520001000300040005000MAX3222E/MAX3232E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)20604080100MAX3237ETRANSMITTER SKEW vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)100015005002000T R A N S M I T T E R S K E W (n s )-6-2-42046-3-51-1352.03.03.52.54.04.55.0SUPPLY VOLTAGE (V)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. SUPPLY VOLTAGE (MBAUD = GND)10203040502.0MAX3237E SUPPLY CURRENT vs. SUPPLY VOLTAGE (MBAUD = GND)SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (m A )3.03.52.54.04.55.0MAX3246ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )4000300010002000-5-4-3-2-101234567-65000468101214160MAX3246ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E WR A T E (V /µs )200030001000400050001020304050600MAX3246EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCEM A X 3237E t o c 17LOAD CAPACITANCE (pF)S U P P L Y C U R R EN T (m A )1000200030004000500055453525155024681012MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )10001500500200025003000010203050406070MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /µs )5001000150020001020304050MAX3237ESUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )10001500500200025003000MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________7Pin DescriptionM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers8_______________________________________________________________________________________MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________9Detailed DescriptionDual Charge-Pump Voltage ConverterThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246Es’ internal power supply consists of a regu-lated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump) over the +3.0V to +5.5V V CC range. The charge pump operates in discontinuous mode; if the output voltages are less than 5.5V, the charge pump is enabled, and if the output voltages exceed 5.5V, the charge pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies (Figure 1).RS-232 TransmittersThe transmitters are inverting level translators that con-vert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compli-ant levels.The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E transmitters guarantee a 250kbps data rate with worst-case loads of 3k Ωin parallel with 1000pF,providing compatibility with PC-to-PC communication software (such as LapLink™). Transmitters can be par-alleled to drive multiple receivers or mice.The MAX3222E/MAX3237E/MAX3241E/MAX3246E transmitters are disabled and the outputs are forcedinto a high-impedance state when the device is in shut-down mode (SHDN = G ND). The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E permit the outputs to be driven up to ±12V in shutdown.The MAX3222E/MAX3232E/MAX3241E/MAX3246E transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC . The MAX3237E’s trans-mitter inputs have a 400k Ωactive positive-feedback resistor, allowing unused inputs to be left unconnected.MAX3237E MegaBaud OperationFor higher-speed serial communications, the MAX3237E features MegaBaud operation. In MegaBaud operating mode (MBAUD = V CC ), the MAX3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k Ωin parallel with 250pF for +3.0V < V CC < +4.5V. For +5V ±10% operation, the MAX3237E transmitters guarantee a 1Mbps data rate into worst-case loads of 3k Ωin parallel with 1000pF.RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222E/MAX3237E/MAX3241E/MAX3246E receivers have inverting three-state outputs.Drive EN high to place the receiver(s) into a high-impedance state. Receivers can be either active or inactive in shutdown (Table 1).Figure 1. Slew-Rate Test CircuitsLapLink is a trademark of Traveling Software.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers10______________________________________________________________________________________The complementary outputs on the MAX3237E/MAX3241E (R_OUTB) are always active, regardless of the state of EN or SHDN . This allows the device to be used for ring indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where V CC drops to zero in shutdown to accommodate peripherals such as UARTs (Figure 2).MAX3222E/MAX3237E/MAX3241E/MAX3246E Shutdown ModeSupply current falls to less than 1µA in shutdown mode (SHDN = low). The MAX3237E’s supply current falls to10nA (typ) when all receiver inputs are in the invalid range (-0.3V < R_IN < +0.3). When shut down, the device’s charge pumps are shut off, V+ is pulled down to V CC , V- is pulled to ground, and the transmitter out-puts are disabled (high impedance). The time required to recover from shutdown is typically 100µs, as shown in Figure 3. Connect SHDN to V CC if shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB (MAX3237E/MAX3241E).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated to protect against electrostatic dis-charges encountered during handling and assembly.The driver outputs and receiver inputs of the MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.The ESD structures withstand high ESD in all states:normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup.Furthermore, the MAX3237E logic I/O pins also have ±15kV ESD protection. Protecting the logic I/O pins to ±15kV makes the MAX3237E ideal for data cable applications.SHDN T2OUTT1OUT5V/div2V/divV CC = 3.3V C1–C4 = 0.1µFFigure 3. Transmitter Outputs Recovering from Shutdown or Powering UpMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 TransceiversESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAX3222E/MAX3232E/MAX3241E/MAX3246E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2•±9kV (MAX3246E only) using the Contact Discharge method specified in IEC 1000-4-2•±15kV using the Air-G ap Discharge method speci-fied in IEC 1000-4-2Figure 4a. Human Body ESD Test ModelFigure 4b. Human Body Model Current WaveformFigure 5a. IEC 1000-4-2 ESD Test Model Figure 5b. IEC 1000-4-2 ESD Generator Current WaveformM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceiverscharacterized for protection to ±15kV per the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 4a shows the Human Body Model, and Figure 4b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E help you design equipment that meets level 4 (the highest level)of IEC 1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 5a shows the IEC 1000-4-2 model, and Figure 5b shows the current waveform for the ±8kV IEC 1000-4-2 level 4 ESD Contact Discharge test. The Air-G ap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS-232 inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Table 2. Required Minimum Capacitor ValuesFigure 6a. MAX3241E Transmitter Output Voltage vs. Load Current Per TransmitterTable 3. Logic-Family Compatibility with Various Supply VoltagesMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 TransceiversApplications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capaci-tors for 3.3V operation. For other supply voltages, see Table 2 for required capacitor values. Do not use val-ues smaller than those listed in Table 2. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, C4,and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degradeexcessively with temperature. If in doubt, use capaci-tors with a larger nominal value. The capacitor’s equiv-alent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+and V-.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. In applications sensitive to power-supply noise, use a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible.Operation Down to 2.7VTransmitter outputs meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.Figure 6b. Mouse Driver Test CircuitM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 TransceiversFigure 7. Loopback Test CircuitT1IN T1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V C1–C4 = 0.1µFFigure 8. MAX3241E Loopback Test Result at 120kbps T1INT1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V, C1–C4 = 0.1µFFigure 9. MAX3241E Loopback Test Result at 250kbps+5V 0+5V 0-5V +5VT_INT_OUT5k Ω + 250pFR_OUTV CC = 3.3V C1–C4 = 0.1µFFigure 10. MAX3237E Loopback Test Result at 1000kbps (MBAUD = V CC )Transmitter Outputs Recoveringfrom ShutdownFigure 3 shows two transmitter outputs recovering from shutdown mode. As they become active, the two trans-mitter outputs are shown going to opposite RS-232 levels (one transmitter input is high; the other is low). Each transmitter is loaded with 3k Ωin parallel with 2500pF.The transmitter outputs display no ringing or undesir-able transients as they come out of shutdown. Note thatthe transmitters are enabled only when the magnitude of V- exceeds approximately -3.0V.Mouse DrivabilityThe MAX3241E is designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manu-facturers such as Microsoft and Logitech. The MAX3241E successfully drove all serial mice tested and met their current and voltage requirements.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 TransceiversFigure 6a shows the transmitter output voltages under increasing load current at +3.0V. Figure 6b shows a typical mouse connection using the MAX3241E.High Data RatesThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E maintain the RS-232 ±5V minimum transmit-ter output voltage even at high data rates. Figure 7shows a transmitter loopback test circuit. Figure 8shows a loopback test result at 120kbps, and Figure 9shows the same test at 250kbps. For Figure 8, all trans-mitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 9, a single transmitter was driven at 250kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 1000pF.The MAX3237E maintains the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps.Figure 10 shows a loopback test result at 1Mbps with MBAUD = V CC . For Figure 10, all transmitters were loaded with an RS-232 receiver in parallel with 250pF.Interconnection with 3V and 5V LogicThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 3for more information on possible combinations of inter-connections.UCSP ReliabilityThe UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environ-ment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as the wafer-fabrication process primarily determines it.Mechanical stress performance is a greater considera-tion for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid-ered. Table 4 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through envi-ronmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at .Table 4. Reliability Test DataM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers__________________________________________________________Pin ConfigurationsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 TransceiversPin Configurations (continued)。
英迈达科技 MIDAS系列 MD-600 全系列单纤收发器 说明书
英迈达科技MIDAS 系列MD-600全系列单纤收发器北京英迈达科技有限公司Beijing Inmidas Technology Co., LtdMD-600 使用手册z采用波分复用技术实现数据一根光纤上的双向传输z收发采用双波长必须配对使用提高了系统的稳定性z独立式2U 2.5Uz网管非网管模式可选z机架式结构可选z电源可选择220V AC/-48VDCz可通过拨码开关强制10M 100M 全双工半双工z具有自动恢复功能防止死机现象出现z10M 、100M 、10/100M 三种速率单纤收发器可选详细信息100Mbps 10M/100Mbps单纤收发器采用光复用技术，使光的发射和接收在同一根光纤中完成，节省了光纤开销，主要用于光纤资源紧张、租用别人的光纤或两芯光纤有一根出现故障不能正常工作的情况下，是宽带网远距离传输的理想设备性能指标支持IEEE802.3 10Base-T 、IEEE802.3u 100Base-TX(UTP) ，100Base-FX 光纤协议工作方式：全双工、半双工、具有全双工半双工自动协商功能光纤接口支持：单模（波长 1310nm 、1550nm）传输距离：单模20Km 40Km双绞线接口：NODE\HUB 或SWITCH （5 类UTP ）状态指示灯PWR(电源状态) 、TXL （电口连接状态）、SPD(电口工作速度)、FDX(电口双工状态)、RX （光口接收状态）、FXL （光口连接状态）其他参数外型尺寸：150mmX115mmX38mm重量：0.854Kg电源：100V~275V AC 50~60Hz或-48VDC可选工作温度：0º~60保存温度：-10 ~70工作湿度：5%~95%(无冷凝)产品兼容协议：IEEE802.3 以太网(10Mbps)IEEE802.3u 快速以太网(100Mbps) IEEE802.3x 全双工流量控制IEEE802.1d 生成树协议IEEE802.1Q VLAN 标记IEEE802.1p QOS 优先级如需要超长距离或者特殊型号的收发器请与我们联系公司地址北京市海淀区中关村东路18 号财智国际大厦C 座305 室邮编100080公司电话82600046/47/48传真82600388。
mb202i,max202芯片资料datasheet
5 V DINROUTDOUT RS-232RIN RS-232120 kb/s15 kV HBMCopyright © 2016,Texas Instruments IncorporatedProduct FolderSample &BuyTechnical Documents Tools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016MAX2025-V Dual RS-232Line Driver and Receiver With ±15-kV ESD Protection1Features•Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28Standards•ESD Protection for RS-232Bus Pins:±15-kV Human-Body Model•Operates at 5-V V CC Supply •Operates Up to 120kbit/s•Two Drivers and Two Receivers•Latch-Up Performance Exceeds 100mA Per JESD 78,Class II2Applications•Battery-Powered Systems •Notebooks •Laptops•Palmtop PCs•Hand-Held Equipment3DescriptionThe MAX202device consists of two line drivers,two line receivers,and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins,including GND).The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector.The charge pump and four small external capacitors allow operation from a single 5-V supply.The device operates at data signaling rates up to 120kbit/s and a maximum of 30-V/µs driver output slew rate.Device Information (1)PART NUMBER PACKAGE BODY SIZE (NOM)MAX202CD MAX202ID SOIC (16)9.90mm ×3.91mm MAX202CDW MAX202IDW SOIC WIDE (16)10.30mm ×7.50mm MAX202CPW MAX202IPWTSSOP (16)5.00mm x 4.40mm(1)For all available packages,see the orderable addendum atthe end of the data sheet.Block Diagram2MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments IncorporatedTable of Contents1Features ..................................................................12Applications ...........................................................13Description .............................................................14Revision History .....................................................25Pin Configuration and Functions . (36)Specifications .........................................................46.1Absolute Maximum Ratings......................................46.2ESD Ratings..............................................................46.3Recommended Operating Conditions.......................46.4Thermal Information..................................................46.5Electrical Characteristics...........................................56.6Switching Characteristics..........................................56.7Typical Characteristics .............................................67Parameter Measurement Information ..................78Detailed Description . (8)8.1Overview...................................................................88.2Functional Block Diagram.. (8)8.3Feature Description...................................................88.4Device Functional Modes (8)9Application and Implementation (10)9.1Application Information............................................109.2Typical Application.. (10)10Power Supply Recommendations .....................1311Layout . (13)11.1Layout Guidelines ................................................1311.2Layout Example. (13)12Device and Documentation Support (14)12.1Receiving Notification of Documentation Updates 1412.2Community Resources..........................................1412.3Trademarks...........................................................1412.4Electrostatic Discharge Caution............................1412.5Glossary................................................................1413Mechanical,Packaging,and OrderableInformation (14)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision E (April 2007)to Revision F Page•Added ESD Ratings table,Feature Description section,Device Functional Modes ,Application and Implementation section,Power Supply Recommendations section,Layout section,Device and Documentation Support section,andMechanical,Packaging,and Orderable Information section..................................................................................................1•Removed the Ordering Information table;see POA at the end of the data sheet .................................................................1•Changed values in the Thermal Information table to align with JEDEC standards (4)C1+ V CC V+ GND C1± DOUT1C2+ RIN1C2± ROUT1V ± DIN1DOUT2 DIN2RIN2ROUT23MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated 5Pin Configuration and FunctionsD,DW,or PW Package 16-Pin SOIC or TSSOPTop ViewPin FunctionsPINI/O DESCRIPTION 1C1+—Positive lead of C1capacitor2V+O Positive charge pump output for storage capacitor only 3C1–—Negative lead of C1capacitor 4C2+—Positive lead of C2capacitor 5C2–—Negative lead of C2capacitor6V–O Negative charge pump output for storage capacitor only 7DOUT2O RS-232line data output (to remote RS-232system)8RIN2I RS-232line data input (from remote RS-232system)9ROUT2O Logic data output (to UART)10DIN2I Logic data input (from UART)11DIN1I Logic data input (from UART)12ROUT1O Logic data output (to UART)13RIN1I RS-232line data input (from remote RS-232system)14DOUT1O RS-232line data output (to remote RS-232system)15GND —Ground16V CC—Supply voltage,connect to external 5-V power supply4MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltages are with respect to network GND.6Specifications6.1Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)MINMAX UNIT Supply voltage,V CC (2)–0.36V Positive charge pump voltage,V+(2)V CC –0.314V Negative charge pump voltage,V–(2)–140.3V Input voltage,V I Drivers –0.3V++0.3V Receivers ±30Output voltage,V ODrivers V––0.3V++0.3VReceivers–0.3V CC +0.3Short-circuit duration,D OUTContinuousOperating junction temperature,T J 150°C Storage temperature,T stg –65150°C (1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.2ESD RatingsVALUEUNITV (ESD)Electrostatic dischargeHuman-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)Pins 7,8,13,and 14±15000V All other pins±2000Charged-device model (CDM),per JEDEC specification JESD22-C101(2)±1500(1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted (1);see Figure 10)MINNOMMAX UNIT Supply voltage4.555.5V V IH Driver high-level input voltage (D IN )2V V IL Driver low-level input voltage (D IN )0.8V V I Driver input voltage (D IN )0 5.5V Receiver input voltage –3030T A Operating free-air temperatureMAX202C 070°CMAX202I–4085(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report.6.4Thermal InformationTHERMAL METRIC (1)MAX202UNITD (SOIC)DW (SOIC)PW (TSSOP)16PINS 16PINS 16PINS R θJA Junction-to-ambient thermal resistance 76.276.8101°C/W R θJC(top)Junction-to-case (top)thermal resistance 36.839.636.4°C/W R θJB Junction-to-board thermal resistance 33.941.545.9°C/W ψJT Junction-to-top characterization parameter 6.712.6 2.7°C/W ψJB Junction-to-board characterization parameter33.640.945.3°C/W5MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated (1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.(2)All typical values are at V CC =5V,and T A =25°C.(3)Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings,and not more than one output should be shorted at a time.6.5Electrical Characteristicsover recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted;see Figure 10)(1)PARAMETERTEST CONDITIONSMINTYP (2)MAX UNIT I CC Supply currentNo load,V CC =5V815mADRIVER SECTIONV OH High-level output voltage D OUT at R L =3k Ωto GND,D IN =GND 59V V OL Low-level output voltage D OUT at R L =3k Ωto GND,D IN =V CC –5–9V I IH High-level input current V I =V CC 0200µA I IL Low-level input current V I at 0V0–200µA I OS (3)Short-circuit output current V CC =5.5V,V O =0V±10±60mA r O Output resistance V CC ,V+,and V–=0V,V O =±2V 300ΩRECEIVER SECTIONV OH High-level output voltage I OH =–1mA 3.5V CC –0.4V V OL Low-level output voltageI OL =1.6mA 0.4V V IT+Positive-going input threshold voltage V CC =5V,T A =25°C 1.7 2.4V V IT–Negative-going input threshold voltage V CC =5V,T A =25°C0.8 1.2V V hys Input hysteresis (V IT+–V IT–)0.20.51V r i Input resistanceV I =±3V to ±25V357k Ω(1)Test conditions are C1–C4=0.1µF at V CC =5V ±0.5V.(2)All typical values are at V CC =5V,and T A =25°C.(3)Pulse skew is defined as |t PLH –t PHL |of each channel of the same device.6.6Switching Characteristicsover recommended ranges of suply voltage and operating free-air temperature (unless otherwise noted;see Figure 10)(1)PARAMETERTEST CONDITIONSMINTYP (2)MAXUNITDRIVER SECTIONMaximum data rateC L =50pF to 1000pF,R L =3k Ωto 7k ΩoneD OUT switching,see Figure 6120kbit/s t PLH(D)Propagation delay time,low-to high-level output C L =2500pF,R L =3k Ω,all drivers loaded,see Figure 62µs t PHL(D)Propagation delay time,high-to low-level output C L =2500pF,R L =3k Ω,all drivers loaded,see Figure 62µs t sk(p)Pulse skew (3)C L =150to 2500pF,R L =3k Ωto 7k Ω,see Figure 7300ns SR(tr)Slew rate,transition regionC L =50to 1000pF,R L =3k Ωto 7k Ω,V CC =5V,see Figure 63630V/µsRECEIVER SECTION (SEE Figure 8)t PLH(R)Propagation delay time,low-to high-level output C L =150pF 0.510µs t PHL(R)Propagation delay time,high-to low-level output C L =150pF 0.510µs t sk(p)Pulse skew (3)C L =150pF300ns6MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated6.7Typical Characteristicsat T A =25°C (unless otherwise noted)TEST CIRCUITVOLTAGE WAVEFORMS50%50%–3 V3 V1.5 V1.5 VOutputInputV OL V OHt PHL (R)t PLH (R)OutputA)TEST CIRCUITVOLTAGE WAVEFORMS0 V 3 VOutputInputV OLV OHt PLH (D)t PHL (D)50%50%1.5 V1.5 VRS-232OutputA)TEST CIRCUITVOLTAGE WAVEFORMS0 V3 VOutputInputV OLV OH t PLH (D)RS-232Outputt PHL (D)A)1.5 V1.5 V3 V –3 V3 V –3 VSR(tf) =6 Vt or t PHL(D PLH(D))7MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated 7Parameter Measurement InformationA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:PRR =120kbit/s,Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 6.Driver Slew RateA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:PRR =120kbit/s,Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 7.Driver Pulse SkewA.C L includes probe and jig capacitance.B.The pulse generator has the following characteristics:Z O =50Ω,50%duty cycle,t r ≤10ns,t f ≤10ns.Figure 8.Receiver Propagation Delay Times5 V DINROUTDOUT RS-232RIN RS-232120 kb/s15 kV HBMCopyright © 2016,Texas Instruments Incorporated8MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated8Detailed Description8.1OverviewThe MAX202device is a dual driver and receiver that includes a capacitive voltage generator using four capacitors to supply TIA/EIA-232-F voltage levels from a single 5-V supply.Each receiver converts TIA/EIA-232-F inputs to 5-V TTL/CMOS levels.These receivers have shorted and open fail safe.The receiver can accept up to ±30-V inputs and decode inputs as low as ±3V.Each driver converts TTL/CMOS input levels into TIA/EIA-232-F levels.Outputs are protected against shorts to ground.8.2Functional Block Diagram8.3Feature Description8.3.1PowerThe power block increases and inverts the 5-V supply for the RS-232driver using a charge pump that requires four 0.1-µF external capacitors.8.3.2RS-232DriverTwo drivers interface standard logic levels to RS-232levels.The driver inputs do not have internal pullup resistors.Do not float the driver inputs.8.3.3RS-232ReceiverTwo Schmitt trigger receivers interface RS-232levels to standard logic levels.Each receiver has an internal 5-k Ωload to ground.An open input results in a high output on ROUT.8.4Device Functional Modes8.4.1V CC Powered by 5-VThe device is in normal operation when powered by 5V.8.4.2V CC UnpoweredWhen MAX202is unpowered,it can be safely connected to an active remote RS-232device.DIN1DOUT1RIN1ROUT1DIN2DOUT2RIN2ROUT29MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated Device Functional Modes (continued)8.4.3Truth TablesTable 1and Table 2list the function for each driver and receiver (respectively).(1)H =high level,L =low levelTable 1.Function Table forEach Driver (1)INPUT DIN OUTPUT DOUTL H HL(1)H =high level,L =low level,Open =input disconnected or connected driver offTable 2.Function Table forEach Receiver (1)INPUT RIN OUTPUT ROUTL H H L OpenHFigure 9.Logic Diagram (Positive Logic)CBYPASS = 0.1F,m C10.1F,m 6.3 VCopyright © 2016,Texas Instruments Incorporated10MAX202SLLS576F –JULY 2003–REVISED SETPEMBER 2016Product Folder Links:MAX202Submit Documentation FeedbackCopyright ©2003–2016,Texas Instruments Incorporated9Application and ImplementationNOTEInformation in the following applications sections is not part of the TI component specification,and TI does not warrant its accuracy or completeness.TI’s customers are responsible for determining suitability of components for their purposes.Customers should validate and test their design implementation to confirm system functionality.9.1Application InformationFor proper operation,add capacitors as shown in Figure 10.Pins 9through 12connect to UART or general purpose logic lines.RS-232lines on pins 7,8,13,and 14connect to a connector or cable.9.2Typical ApplicationA.C3can be connected to V CC or GND.B.Resistor values shown are nominal.C.Nonpolarized ceramic capacitors are acceptable.If polarized tantalum or electrolytic capacitors are used,they must be connected as shown.Figure 10.Typical Operating Circuit and Capacitor Values9.2.1Design Requirements •V CC minimum is 4.5V and maximum is 5.5V.•Maximum recommended bit rate is 120kbps.RVHBM MAX202 SLLS576F–JULY2003–REVISED SETPEMBER2016 Typical Application(continued)9.2.2Detailed Design Procedure9.2.2.1Capacitor SelectionThe capacitor type used for C1through C4is not critical for proper operation.The MAX202requires0.1-µF capacitors.Capacitors up to10µF can be used without harm.Ceramic dielectrics are suggested for the0.1-µF capacitors.When using the minimum recommended capacitor values,make sure the capacitance value does not degrade excessively as the operating temperature varies.If in doubt,use capacitors with a larger(for example, 2×)nominal value.The capacitors'effective series resistance(ESR),which usually rises at low temperatures, influences the amount of ripple on V+and V–.Use larger capacitors(up to10µF)to reduce the output impedance at V+and V–.Bypass V CC to ground with at least0.1µF.In applications sensitive to power-supply noise generated by the charge pumps,decouple V CC to ground with a capacitor the same size as(or larger than)the charge-pump capacitors(C1to C4).9.2.2.2ESD ProtectionMAX202devices have standard ESD protection structures incorporated on all pins to protect against electrostatic discharges encountered during assembly and handling.In addition,the RS-232bus pins(driver outputs and receiver inputs)of these devices have an extra level of ESD protection.Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of±15-kV when powered down.9.2.2.3ESD Test ConditionsStringent ESD testing is performed by TI based on various conditions and procedures.Please contact TI for a reliability report that documents test setup,methodology,and results.9.2.2.4Human-Body Model(HBM)The HBM of ESD testing is shown in Figure11.Figure12shows the current waveform that is generated during a discharge into a low impedance.The model consists of a100-pF capacitor,charged to the ESD voltage of concern,and subsequently discharged into the device under test(DUT)through a1.5-kΩresistor.Figure11.HBM ESD Test Circuit1001502005001.51.00.50.0I -AD U T MAX202SLLS576F –JULY 2003–REVISED SETPEMBER Typical Application (continued)Figure 12.Typical HBM Current Waveform9.2.3Application Curve120kbit/s,1-nF loadFigure 13.Driver and Receiver Loopback SignalMAX202 SLLS576F–JULY2003–REVISED SETPEMBER201610Power Supply RecommendationsThe V CC voltage must be connected to the same power source used for logic device connected to DIN and ROUT pins.V CC must be between4.5V and5.5V.11Layout11.1Layout GuidelinesKeep the external capacitor traces short.This is more important on C1and C2nodes that have the fastest rise and fall times.For best ESD performance,make the impedance from MAX202ground pin to the ground plane of the circuit board as low as e wide metal and multiple vias on both sides of ground pin.11.2Layout ExampleFigure14.MAX202Circuit Board LayoutMAX202SLLS576F–JULY2003–REVISED 12Device and Documentation Support12.1Receiving Notification of Documentation UpdatesTo receive notification of documentation updates,navigate to the device product folder on .In the upper right corner,click on Alert me to register and receive a weekly digest of any product information that has changed.For change details,review the revision history included in any revised document.12.2Community ResourcesThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.12.3TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.12.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.12.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.13Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATIONAddendum-Page 1(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.Addendum-Page 2(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 3TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant MAX202CDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX202CDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX202CPWR TSSOPPW 162000330.012.4 6.9 5.6 1.68.012.0Q1MAX202IDR SOICD 162500330.016.4 6.510.3 2.18.016.0Q1MAX202IDWR SOICDW 162000330.016.410.7510.7 2.712.016.0Q1MAX202IPWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) MAX202CDR SOIC D162500333.2345.928.6 MAX202CDWR SOIC DW162000367.0367.038.0 MAX202CPWR TSSOP PW162000367.0367.035.0 MAX202IDR SOIC D162500333.2345.928.6 MAX202IDWR SOIC DW162000367.0367.038.0MAX202IPWR TSSOP PW162000367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46,latest issue,and to discontinue any product or service per JESD48,latest issue.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. 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MAX3222EEAP中文资料
For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim's website at .General DescriptionThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24communications interface devices feature low power con-sumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±15kV using IEC 1000-4-2 Air-G ap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge (±9kV for MAX3246E), and ±15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmit-ter output pins are protected to ±15kV using the Human Body Model.A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge pump requires only four small 0.1µF capacitors for opera-tion from a +3.3V supply. Each device guarantees opera-tion at data rates of 250kbps while maintaining RS-232output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232-compliant output levels.The MAX3222E/MAX3232E have two receivers and two transmitters. The MAX3222E features a 1µA shutdown mode that reduces power consumption in battery-pow-ered portable systems. The MAX3222E receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only 1µA of supply current. The MAX3222E and MAX3232E are pin, package, and func-tionally compatible with the industry-standard MAX242and MAX232, respectively.The MAX3241E/MAX3246E are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX3237E (five drivers/three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shut-down mode in which all receivers remain active, while consuming only 1µA (MAX3241E/MAX3246E) or 10nA (MAX3237E).The MAX3222E, MAX3232E, and MAX3241E are avail-able in space-saving SO, SSOP, TQFN and TSSOP pack-ages. The MAX3237E is offered in an SSOP package.The MAX3246E is offered in the ultra-small 6 x 6 UCSP™package.ApplicationsBattery-Powered Equipment PrintersCell PhonesSmart Phones Cell-Phone Data Cables xDSL ModemsNotebook, Subnotebook,and Palmtop ComputersNext-Generation Device Features♦For Space-Constrained ApplicationsMAX3228E/MAX3229E: ±15kV ESD-Protected, +2.5V to +5.5V, RS-232 Transceivers in UCSP ♦For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx, RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers________________________________________________________________Maxim Integrated Products 119-1298; Rev 11; 10/07Ordering Information continued at end of data sheet.*Dice are tested at T A = +25°C, DC parameters only.**EP = Exposed paddle.Pin Configurations, Selector Guide, and Typical Operating Circuits appear at end of data sheet.MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc.†Covered by U.S. Patent numbers 4,636,930; 4,679,134;4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Notes 3, 4)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V V+ to GND (Note 1)..................................................-0.3V to +7V V- to GND (Note 1)...................................................+0.3V to -7V V+ + |V-| (Note 1).................................................................+13V Input Voltages T_IN, EN , SHDN , MBAUD to GND ........................-0.3V to +6V R_IN to GND.....................................................................±25V Output Voltages T_OUT to GND...............................................................±13.2V R_OUT, R_OUTB (MAX3241E)................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT to GND.......................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C)..........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C).......754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C).....1666.7mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW 20-Pin TQFN (derate 21.3mW/°C above +70°C)........1702mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C)........879mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 28-Pin TSSOP (derate 12.8mW/°C above +70°C)......1026mW 32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW 6 x 6 UCSP (derate 12.6mW/°C above +70°C).............1010mW Operating Temperature Ranges MAX32_ _EC_ _...................................................0°C to +70°C MAX32_ _EE_ _.................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 2)Infrared, 15s..................................................................+200°C Vapor Phase, 20s..........................................................+215°C Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devicecan be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.Preheating is required. Hand or wave soldering is not allowed.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________3M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers4_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX3237E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 3)±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =0.33µF tested at +5.0V ±10%. MAX3246E; C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at 5.0V ±10%.Note 4:MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.Note 5:The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are atthe supply rails.Note 6:MAX3241EEUI is specified at T A = +25°C.Note 7:Transmitter skew is measured at the transmitter zero crosspoints.TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246EMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________5-6-4-202460MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )10001500500200025003000531-1-3-5-6-2-42046-5-31-135010001500500200025003000LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-7.5-5.0-2.502.55.07.5MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )500100015002000__________________________________________Typical Operating Characteristics(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)-6-5-4-3-2-10123456010002000300040005000MAX3241ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V)302010405060020001000300040005000MAX3241EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )04286121014010002000300040005000MAX3241ESLEW RATE vs. LOAD CAPACITANCEM A X 3237E t o c 05LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )-6-5-4-3-2-10123456010002000300040005000MAX3222E/MAX3232ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P UT V O L T A G E (V )624108141216010002000300040005000MAX3222E/MAX3232ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs)2520155103530404520001000300040005000MAX3222E/MAX3232E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)20604080100MAX3237ETRANSMITTER SKEW vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)100015005002000T R A N S M I T T E R S K E W (n s )-6-2-42046-3-51-1352.03.03.52.54.04.55.0SUPPLY VOLTAGE (V)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. SUPPLY VOLTAGE (MBAUD = GND)10203040502.0MAX3237E SUPPLY CURRENT vs. SUPPLY VOLTAGE (MBAUD = GND)SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (m A )3.03.52.54.04.55.0MAX3246ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )4000300010002000-5-4-3-2-101234567-65000468101214160MAX3246ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L EW R A T E (V /μs )200030001000400050001020304050600MAX3246EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCEM A X 3237E t o c 17LOAD CAPACITANCE (pF)S U P P L Y C U R R EN T (m A )1000200030004000500055453525155024681012MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )10001500500200025003000010203050406070MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )5001000150020001020304050MAX3237ESUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )10001500500200025003000MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________7Pin DescriptionM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers8_______________________________________________________________________________________MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________9Detailed DescriptionDual Charge-Pump Voltage ConverterThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246Es’ internal power supply consists of a regu-lated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump) over the +3.0V to +5.5V V CC range. The charge pump operates in discontinuous mode; if the output voltages are less than 5.5V, the charge pump is enabled, and if the output voltages exceed 5.5V, the charge pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies (Figure 1).RS-232 TransmittersThe transmitters are inverting level translators that con-vert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compli-ant levels.The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E transmitters guarantee a 250kbps data rate with worst-case loads of 3k Ωin parallel with 1000pF,providing compatibility with PC-to-PC communication software (such as LapLink™). Transmitters can be par-alleled to drive multiple receivers or mice.The MAX3222E/MAX3237E/MAX3241E/MAX3246E transmitters are disabled and the outputs are forcedinto a high-impedance state when the device is in shut-down mode (SHDN = G ND). The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E permit the outputs to be driven up to ±12V in shutdown.The MAX3222E/MAX3232E/MAX3241E/MAX3246E transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC . The MAX3237E’s trans-mitter inputs have a 400k Ωactive positive-feedback resistor, allowing unused inputs to be left unconnected.MAX3237E MegaBaud OperationFor higher-speed serial communications, the MAX3237E features MegaBaud operation. In MegaBaud operating mode (MBAUD = V CC ), the MAX3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k Ωin parallel with 250pF for +3.0V < V CC < +4.5V. For +5V ±10% operation, the MAX3237E transmitters guarantee a 1Mbps data rate into worst-case loads of 3k Ωin parallel with 1000pF.RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222E/MAX3237E/MAX3241E/MAX3246E receivers have inverting three-state outputs.Drive EN high to place the receiver(s) into a high-impedance state. Receivers can be either active or inactive in shutdown (Table 1).Figure 1. Slew-Rate Test CircuitsLapLink is a trademark of Traveling Software.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers10______________________________________________________________________________________The complementary outputs on the MAX3237E/MAX3241E (R_OUTB) are always active, regardless of the state of EN or SHDN . This allows the device to be used for ring indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where V CC drops to zero in shutdown to accommodate peripherals such as UARTs (Figure 2).MAX3222E/MAX3237E/MAX3241E/MAX3246E Shutdown ModeSupply current falls to less than 1µA in shutdown mode (SHDN = low). The MAX3237E’s supply current falls to10nA (typ) when all receiver inputs are in the invalid range (-0.3V < R_IN < +0.3). When shut down, the device’s charge pumps are shut off, V+ is pulled down to V CC , V- is pulled to ground, and the transmitter out-puts are disabled (high impedance). The time required to recover from shutdown is typically 100µs, as shown in Figure 3. Connect SHDN to V CC if shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB (MAX3237E/MAX3241E).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated to protect against electrostatic dis-charges encountered during handling and assembly.The driver outputs and receiver inputs of the MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.The ESD structures withstand high ESD in all states:normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup.Furthermore, the MAX3237E logic I/O pins also have ±15kV ESD protection. Protecting the logic I/O pins to ±15kV makes the MAX3237E ideal for data cable applications.SHDN T2OUTT1OUT5V/div2V/divV CC = 3.3V C1–C4 = 0.1μFFigure 3. Transmitter Outputs Recovering from Shutdown or Powering UpMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAX3222E/MAX3232E/MAX3241E/MAX3246E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2•±9kV (MAX3246E only) using the Contact Discharge method specified in IEC 1000-4-2•±15kV using the Air-G ap Discharge method speci-fied in IEC 1000-4-2Figure 4a. Human Body ESD Test ModelFigure 4b. Human Body Model Current WaveformFigure 5a. IEC 1000-4-2 ESD Test Model Figure 5b. IEC 1000-4-2 ESD Generator Current WaveformM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceiverscharacterized for protection to ±15kV per the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 4a shows the Human Body Model, and Figure 4b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E help you design equipment that meets level 4 (the highest level)of IEC 1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 5a shows the IEC 1000-4-2 model, and Figure 5b shows the current waveform for the ±8kV IEC 1000-4-2 level 4 ESD Contact Discharge test. The Air-G ap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS-232 inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Table 2. Required Minimum Capacitor ValuesFigure 6a. MAX3241E Transmitter Output Voltage vs. Load Current Per TransmitterTable 3. Logic-Family Compatibility with Various Supply VoltagesMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversApplications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capaci-tors for 3.3V operation. For other supply voltages, see Table 2 for required capacitor values. Do not use val-ues smaller than those listed in Table 2. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, C4,and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degradeexcessively with temperature. If in doubt, use capaci-tors with a larger nominal value. The capacitor’s equiv-alent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+and V-.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. In applications sensitive to power-supply noise, use a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible.Operation Down to 2.7VTransmitter outputs meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.Figure 6b. Mouse Driver Test CircuitM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversFigure 7. Loopback Test CircuitT1IN T1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V C1–C4 = 0.1μFFigure 8. MAX3241E Loopback Test Result at 120kbps T1INT1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V, C1–C4 = 0.1μFFigure 9. MAX3241E Loopback Test Result at 250kbps+5V 0+5V 0-5V +5VT_INT_OUT5k Ω + 250pFR_OUTV CC = 3.3V C1–C4 = 0.1μFFigure 10. MAX3237E Loopback Test Result at 1000kbps (MBAUD = V CC )Transmitter Outputs Recoveringfrom ShutdownFigure 3 shows two transmitter outputs recovering from shutdown mode. As they become active, the two trans-mitter outputs are shown going to opposite RS-232 levels (one transmitter input is high; the other is low). Each transmitter is loaded with 3k Ωin parallel with 2500pF.The transmitter outputs display no ringing or undesir-able transients as they come out of shutdown. Note thatthe transmitters are enabled only when the magnitude of V- exceeds approximately -3.0V.Mouse DrivabilityThe MAX3241E is designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manu-facturers such as Microsoft and Logitech. The MAX3241E successfully drove all serial mice tested and met their current and voltage requirements.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversFigure 6a shows the transmitter output voltages under increasing load current at +3.0V. Figure 6b shows a typical mouse connection using the MAX3241E.High Data RatesThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E maintain the RS-232 ±5V minimum transmit-ter output voltage even at high data rates. Figure 7shows a transmitter loopback test circuit. Figure 8shows a loopback test result at 120kbps, and Figure 9shows the same test at 250kbps. For Figure 8, all trans-mitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 9, a single transmitter was driven at 250kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 1000pF.The MAX3237E maintains the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps.Figure 10 shows a loopback test result at 1Mbps with MBAUD = V CC . For Figure 10, all transmitters were loaded with an RS-232 receiver in parallel with 250pF.Interconnection with 3V and 5V LogicThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 3for more information on possible combinations of inter-connections.UCSP ReliabilityThe UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environ-ment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as the wafer-fabrication process primarily determines it.Mechanical stress performance is a greater considera-tion for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid-ered. Table 4 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through envi-ronmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at .Table 4. Reliability Test DataM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________________Pin ConfigurationsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversPin Configurations (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________Typical Operating CircuitsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers______________________________________________________________________________________21Selector Guide___________________Chip InformationTRANSISTOR COUNT:MAX3222E/MAX3232E: 1129MAX3237E: 2110MAX3241E: 1335MAX3246E: 842PROCESS: BICMOSOrdering Information (continued)†Requires solder temperature profile described in the AbsoluteMaximum Ratings section. UCSP Reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this datasheet for more information.**EP = Exposed paddle.。
MCP2120红外编码解码器_cn
通常选择单片机同 IR 编码 / 解码器接口。
2.2 器件复位
当 RESET 引脚为低电平状态时， MCP2120 被迫进入 复位状态。一旦 RESET 引脚变为高电平，器件复位定 时器就会启动。DRT 定时一旦结束，器件就开始正常操 作。
2.3 位时钟
器件晶振用于产生通信位时钟（BITCLK）。每个位时间 有 16 个 BITCLK。BITCLK 用于产生起始位和 8 个数据 位。当数据发送结束后 （不用于数据接收），停止位使 用 BITCLK。
引脚号
PDIP
1 2 3 4 5 6 7
SOIC
1 2 3 4 5 6 7
BAUD2 BAUD1 BAUD0 RX TX EN VSS 图注：
8
8
9
9
10
10
11
11
12
12
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14
TTL = TTL 兼容输入 I = 输入 P = 电源
引脚 类型
— I O I I O I
I I I O I I —
DS21618B_CN 第 5 页
MCP2120
2.4.1.2 软件选择
当 BAUD2:BAUD0 引脚配置为 “111”时，MCP2120 的默认波特率为 FOSC / 768。 若需 MCP2120 处于命令模式，则需将 MODE 引脚连 接到低电平。在命令模式下， MCP2120 UART 接收到 的任何数据都被返回给控制器，而不进行编码 / 解码。 回波数据的延时短于 1 个位时间 （见参数 IR141）。当 MODE 引脚变为高电平时，器件将返回到数据模式，其 编码 / 解码器处于正常工作状态。
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（MAX1471接收器）
专业班级： 电子071
课 程： 通信原理课程设计
学 号： 20074470147
学生姓名： 蒋佳成
指导老师： 陈 和
摘要
目前，射频技术在各个领域都有着广泛的应用，各种基
于射频的设备都在向小体积、低功耗、抗干扰、高纠错的方
向发展，使用分离元件构成的射频设备已不能满足需要。因
此，使用FSK/ASK调制的集成射频收发芯片便应运而生。
基于FSK／ASK的超外差收发机在远程无线进入、汽车胎压
检测、无线传感器等方面都有很广泛的应用。本设计以
PIC16F189单片机和MAX1479、MAX1471为核心器件，设
计一款为无线遥控门锁使用的FSK/ASK超外差射频收发机；
介绍PIC16F819芯片和MAX1479、MAX1471芯片的性能，
详细讨论收发机的硬件和软件系统设计并予以实现。
关键字：
FSK 、 ASK 、 PIC16F819 、
MAX1479、MAX1471 、 超外差收发机
一、 元器件的选择：
(1) 控制器的选择（PICl6F819）
在本系统设计中，需要涉及到以下几个方面：处理器
性能、所支持的开发工具、处理器的成本和功耗．综合以上
几个方面考虑，微控制器选择Microchip公司的一款高性价
比的8位微控制器PICl6F819。PICl6FSl9采用20脚贴片
封装，在线方式进行程序调试和烧写；可采用内部晶振，工
作频率可选31 kHz~8 MHz；工作电压从2~5.5V；正常
工作时使用2V电压供电、使用内部晶振频率为32kHz、电
流为7μA；睡眠状态时使用2V电压供电、电流为0．7μA。
（2）收发器器件的选择（MAXl479和MAXl471）
随着无线技术的发展，无线收发芯片的集成度和性能都
得到大幅度提高，芯片性能也各有特色。生产此类芯片的厂
商主要有Nordic、TI和Maxim等。选择无线收发芯片时，
应考虑以下几点因素：功耗、发射功率、接收灵敏度、传输
速率和芯片成本等。Maxim公司的MAXl479和MAXl471
分别是超外差射频发射机和接收机，都采用+2．1~+3．3V
的单电源供电，可以选择FSK／ASK调制方式，低工作电流，
小贴片封装。
二、系统硬件的构成：
2.1
发射部分
发射部分由微控制器PICl6F819和射频发射芯片
MAXl479组成，其系统构成原理图如图1所示。
图1
微控制器PICl6F819通过PA口的8个引脚控制MAXl479的
发射工作。MAXl479的主要引脚功能如表l所列。
表1 表3
其中，Mode引脚用于选择发射芯片是FSK模式或ASK
模式。Enable引脚为高电平，则MAXl179进入发射状态。DIN
引脚输入串行数据。
Clk0和Clk1共同决定Clkout引脚的输出频率，该频率可以作
为微控制器的时钟频率输入。Clk0和Clkl的状态组合如表2所
列。
Dev0、Devl、Dev2共同决定FSK调制时的背离频率的大小，
其组合状态表如表3所列。
发射的载波频率由MAXl479所用的晶振决定，晶振同发射
载波频率间的关系是：
如果选择的发射载波频率为315MHz，则所使用品振为
9.8437MHz；如发射载波频率为433MHz，则所使用品振为
13.56MHz。
MAXl479使用的天线要符合50Ω阻抗匹配，天线可以采用
l／4波长的鞭状天线，也可以使用PCB布线作为天线。
2.2
接收部分
接收部分由射频接收芯片MAXl47l和微控制器构成，接收
方一般和其他系统连接在一起，故不需要刻意根据低功耗选择微
控制器，而是根据数据处理的需要自行选择。构成框图如图2
所示。
MAXl47l需要外接一个lO.7MHz的低通滤波器，晶振的频率同
接收载波的频率的关系为：
如果接收载波的频率为315MHz，则晶振的频率为9.509MHz；
接收载波的频率为433.92MHz，则晶振的频率为
13.2256MHz。
MAXl47l的主要引脚如表4所列。
图2
其中，IFIN+MIXOUT、AGND连接10.7MHz的低通滤波
器，用于ASK数据的解调。ADATA引脚为高，表示到来的是
ASK解调数据；FDATA为高，表示到来的是FSK解调数据。
微控制器连接SCLK、CS、DIO引脚对MAXl472内部的寄存
器进行读写。
MAXl471同样要求50Ω阻抗匹配的天线，可以使用PCB
布线作为天线。
三、系统软件设计：
3.1
发射部分
发射部分的编程主要是对PIC16F819的操作。程序由
PlCl6F8l9初始化、MAXl479初始化和数据发射三部分组成。
对PICl6F819的初始化包括设置内部晶振的工作频率和
PA口的状态。对MAXl479的初始化包括设置工作模式、晶振
输出频率选择和FSK背离频率的选择。数据发射部分包括：设
置数据帧格式、发送位“0”或“l”子程序、发送一个字节数据子程
序和循环发送多个字节数据子程序。程序流程图如图3所示。
图3
3.2
接收部分
接收部分程序主要是微控制器通过SCLK、CS、DIO等引
脚对MAX147l内部寄存器进行读写的过程。
对MAXl471内部寄存器进行写操作的时序图如图4所示。
CS引脚为低，MAXl47l进入工作状态，SCLK引脚产生串行输
入时钟，DIO向MAXl47l串行输出命令。命令的格式为；4位
命令码、4位地址、8位数据。命令码共有3个：0x01代表写、
0x02代表读、0x03代表复位。
图4
对MAXl47l内部寄存器进行读操作的时序图如图5所示。
CS引脚为低，MAX147l进入工作状态，SCLK引脚产生串行输
出时钟，DI0从MAXl471串行输出数据。当ADATA为高，输
出ASK解调数据；当FDATA为高，输出FSK解调数据。输出
数据遵循同样的数据格式。
MAX147l内部常用寄存器和地址的对照表如表5所列。
表5
图5
以接收315MHz的FSK数据为例说明接收数据的编程
步骤：
①写0x3000对芯片进行复位。
②写0x10f0使能所有的RF和基带部分。
③写0x135f设置晶振寄存器，芯片工作于315 MHz频率。
④写0x1120置配置寄存器的FSKCALLSB位，使能FSK
校准。
⑤写0x1121开始FSK校准。
⑥读0x2900读状态寄存器位0和位1的状态，以确定FSK
校准已完成。
⑦读FSK调试后的数据，由微控制器进行处理。
四、小结：
通过这次通信原理的课程设计，我初步掌握FSK/ASK
超外差射频收发机的原理。以及认识到它在无线射频领域的重要
性。在设计过程中遇到很多不懂的地方，通过上网查阅资料以及
在同学、老师的帮助下，设计得以按时完成。以及通信原理在当
今社会的发展前景，虽然在前面的学习中自己没有学好，但我有
信心有激情去学习这门课程，掌握一门技能。