半导体制程PPT

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– 一种相移振荡器 (1.3 MHz) – Ge 衬底,晶体管及电阻、电容全部由Ge制成 (面积约11.1x1.6mm2) – 扩散工艺形成晶体管 Kilby和他1958,7,24的设计 – 黑蜡掩蔽腐蚀形成Tr台面结构 – 用细导线互连
证明半导体材料不仅可用于制造分 立器件,而且可以制造整个电子电 路
Outline
1. I百度文库troduction
2. Integrated Circuit and Its Application 3. How is IC made?
J. Kilby的发明-“固体电路”
1958.9.12 J. Kilby 研制成功第一个半 导体集成电路 ---“Solid Circuit”
Wafer Manufacturing
Wafer Bumping
Wafer Probing
Assembly & Final Test
Flip Chip CSP SOP PLCC TSOP QFP BGA µBGA
2008-IC 技术现状
Integration of 108 – 1010 transistors in a chip. Clock frequency of more than 3GHz. Cutoff frequency of 350 GHz for SiGe bipolar.

Migration of Electronics Manufacturing
From inception, electronic manufacturing has migrated geographically from the West to the East: from the US and Europe, over to Japan, through the Taiwan area, Korea, arriving in the East: China and India. The shift in wafer production typically lags behind the rest of the supply chain, but China and India are now at the forefront of IC production!
Outline
1. Introduction
2. Integrated Circuit and Its Application
3. How is IC made?
半导体 Semiconductor
导体 半导体 绝缘体
半导体材料特性:
经掺杂后,可藉由电场(电压)、光、温度、压力、磁场等 改变或控制其导电特性。 最广为应用的集成电路芯片材料: 硅 (Silicon, Si)。
*
Wuhan Xinxin
IC Industry Business Unit
IDM Product design & sales,
(Integrated Device Manufacturer)


Fab
&/or IC assembly
Fab lite

Product design & Sales, Has Fab, but manufacture less than 50% product
China
$62.35
Others $57.80 Japan $37.80 U.S.A $57.90 Others Others $82.10 Japan $33.00 U.S.A $36.50 Japan $57.05 US$billion $87.44 U.S.A $46.56
• In 2005, China’s IC consumption reached USD$40.8 billion, overtaking the top spot as the world’s largest regional IC market for the first time.
SMIC Beijing SMIC Beijing 提供0.35-0.09微米的制程技术
SMIC Tianjin
Beijing Tianjin
SMIC Assembly & Testing (Chengdu)
SMIC Shanghai
Chengdu Shanghai Wuhan
*
Chengdu Cension Shenzhen

2 1
China Becomes World’s Largest IC Market
2000 WW IC Market
6% WW Market
2005 WW IC Market
21% WW Market
2006 WW IC Market
26% WW Market
China
$9.80
China
$40.80
Fabless

Product & sales only, no Fab & assembly house
Foundry

Fab only No product
一条龙的集成代工服务 Dedicated Full Service Provider
Design Services
Mask Making
Smallest transistor realized---5nmMOSFET
Mass production Advanced manufacturing Manufacturing development Process and device R&D ≧90nm ~65nm ~45nm ≦32nm.
纯硅导电特性差, 可藉掺杂(Doping, 将杂质加入硅片中) 改变或控制其导电特性。 如何掺杂及控制杂质在硅片中分 布是半导体重要制程技术之一 。
分离式电路 Discrete Circuit
• By 2010, China’s IC market is estimated to reach USD$124 billion in terms Source: IC insights January of overall consumption. 2007
A Leading Foundry In The World
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