Altera荣获华为2013年度优秀核心合作伙伴奖
4翻译
毕 业 设 计（论 文）外 文 参 考资 料 及 译 文译文题目： CIC MegaCore Function 学生姓名： 高佳 学 号： 1021129024 专 业： 通信工程 所在学院： 龙蟠学院 指导教师： 姜志鹏 职 称： 讲师2013年11月06日CIC MegaCore Function----From DescriptionThis document describes the Altera CIC MegaCore function. The Altera CIC MegaCore function implements a cascaded integrator-comb filter with data ports that are compatible with the Avalon Streaming interface. CIC filters (also known as Hogenauer filters) are computationally efficient for extracting baseband signals from narrow-band sources using decimation, and for constructing narrow-band signals from processed baseband signals using interpolation.CIC filters use only adders and registers, and require no multipliers to handle large rate changes. Therefore, CIC is a suitable and economical filter architecture for hardware implementation, and is widely used in sample rate conversion designs such as digital down converters (DDC) and digital up converters (DUC).The Altera CIC MegaCore function supports the following features:■Support for interpolation and decimation filters with variable rate change factors (2 to 32,000), a configurable number of stages (1 to 12), and two differential delay options (1 or 2).■Single clock domain with selectable number of interfaces and a maximum of 1,024 channels.■Selectable data storage options with an option to use pipelined integrators.■Configurable input data width (1 to 32 bits) and output data width (1 to full resolution data width).■Selectable output rounding modes (truncation, convergent rounding, rounding up, or saturation) and Hogenauer pruning support.■Optimization for speed by specifying the number of pipeline stages used by each integrator.■Compensation filter coefficients generation.■Easy-to-use MegaWizard interface for parameterization and hardware generation.■IP functional simulation models for use in Altera-supported VHDL and Verilog HDL simulators.■DSP Builder ready.Cascaded Integrator Comb (CIC) filters are widely used in modern communication systems. As the signal processing in all aspects of requirements are constantly improve, in digital technology, the design of the filter appears increasingly important.Those who have signal processing ability of device can be referred to as a filter.In the modern telecommunications equipment and all kinds of control system, filter is widely used.Of all the electronic devices, using the most, the most widely used, technology is the most complex filter.Filter quality directly decides the product quality, good performance of filter can make the system more stable, so the filter of the countries all over the research and production has always been highly valued.With the wide application of digital technology, field programmable gate array (FPGA) has been the rapid development, integration and speed is growing.FPGA has high integration and reliability of the gate array (FPGA), and programmable resistance, maximum limit reduces the design cost, shorten the development cycle.Using CIC filters provides a silicon efficient architecture for performing sample rate conversion. This is achieved by extracting baseband signals from narrow-band sources using decimation, and constructing narrow-band signals from processed baseband signals using interpolation. The key advantage of CIC filters is that they use only adders and registers,and do not require multipliers to implement in hardware for handling large rate changes.A CIC filter (also known as a Hogenauer filter) can be used to perform either decimation or interpolation. A decimation CIC filter comprises a cascade of integrators (called the integrator section), followed by a down sampling block (decimator) and a cascade of differentiators (called the differentiator or comb section). Similarly an interpolation CIC filter comprises a cascade of differentiators, followed by an up sampling block (interpolator) and a cascade of integrators .In a CIC filter, both the integrator and comb sections have the same number of integrators and differentiators. Each pairing of integrator and differentiator is called a stage. The number of stages ( N ) has a direct effect on the frequency response of a CIC filter. The response of the filter is determined by configuring the number of stages N , therate change factor R and the number of delays in the differentiators (called the differential delay) M . In practice, the differential delay is set to 1 or 2.The MegaWizard interface only allows you to select legal combinations of parameters, and warns you of any invalid configurations .For high rate change factors, the maximum required data width for no data loss is large for many practical cases. To reduce the output data width to the input level, quantization is normally applied at the end of the output stage. In this case, the following rounding or saturation options are available:■Truncation : The LSBs are dropped. (This is equivalent to rounding to minus infinity.)■Convergent rounding . Also known as unbiased rounding . Rounds to the nearest even number . If the most significant deleted bit is one, and either the least significant of the remaining bits or at least one of the other deleted bits is one, then one is added to the remaining bits.■Round up: Also known as rounding to plus infinity. Adds the MSB of the discarded bits for positive and negative numbers via the carry in.■Saturation: Puts a limit value (upper limit in the case of overflow, or lower limit in the case of negative overflow) at the output when the input exceeds the allowed range. The upper limit is+2n-1 and lower limit is –2n.These rounding options can only be applied to the output st age of the filter. The data widths at the intermediate stages are not changed. The next section describes cases where the data width at the intermediate stages can be changed.Hogenauer pruning [Reference ] is a technique that utilizes truncation or rounding in intermediate stages with the retained numb er of bits decreasing monotonically from stage to stage, while the total error introduced is still no greater than the quantization error introduced by rounding the full precision output. This technique helps to reduce the number of logic cells used by the filter and gives better performance.The existing algorithms for computing the Hogenauer bit width growth for large N and R values are computationally expensive.For more information about these algorithms, refer to U. Meyer-Baese, Digital Signal Processing with Field Programmable Gate Arrays, 2nd Edition, Spinger, 2004.The CIC MegaCore function has pre-calculated Hogenauer pruning bit widths stored within the MegaCore function. There is no need to wait for Hogenauer pruning bit widths to be calculated if Hogenauer pruning is enabled for a decimation filter. Hogenauer pruning is only available to decimation filters when the selected output data width is smaller than the full output resolution data width.There are often many channels of data in a digital signal processing (DSP) system that require filtering by CIC filters with the same configuration. These can be combined into one filter, which shares the adders that exist in each stage and reduces the overall resource utilization. This combined filter uses fewer resources than using many individual CIC filters. For example, a two-channel parallel filter requires two clock cycles to calculate two outputs. The resulting hardware would need to run at twice the data rate of an individual filter. This is especially useful for higher rate changes where adders grow particularly large.To minimize the number of logic elements , a multiple input single output (MISO) architecture can be used for decimation filters, and a single input multiple output (SIMO) architecture for interpolation filters as described in the following sections.In many practical designs, channel signals come from different input interfaces. On each input interface, the same parameters including rate change factors are applied to the channel data that the CIC filter is going to process. The CIC MegaCore function allows the flexibility to exploit time sharing of the low rate differentiator sections. This is achieved by providing multiple input interfaces and processing chains for the high rate portions, then combining all of the processing associated with the lower rate portions into a single processing chain. This strategy can lead to full utilization of the resources and represents the most efficient hardware implementation. These architectures are known as multiple input single output (MISO) decimation filters.Single input multiple output (SIMO) is a feature associated with interpolation CIC filters. In this architecture, all the channel signals presented for filtering come from a single input interface.Like the MISO case, it is possible to share the low sampling rate differentiator section amongst more channels than the higher sampling frequency integrator sections. Therefore, this architecture features a single instance of the differentiator section, and multiple parallel instances of the integrator sections.After processing by the differentiator section, the channel signals are split into multiple parallel sections for processing in a high sampling frequency by the integrator sections. The sampling frequency of the input data is such that it is only possible to time multiplex two channels per bus, therefore the CIC filter must be configured with two input interfaces. Because two interfaces are required, the rate change factor must also be at least two to exploit this architecture. Up to 1,024 channels can be supported by using multiple input interfaces in this way.Single input multiple output (SIMO) is a feature associated with interpolation CIC filters. In this architecture, all the channel signals presented for filtering come from a single input interface. Like the MISO case, it is possible to share the low sampling rate differentiator section amongst more channels than the higher sampling frequency integrator sections.Therefore, this architecture features a single instance of the differentiator section, and multiple parallel instances of the integrator sections.After processing by the differentiator section, the channel signals are split into multiple parallel sections for processing in a high sampling frequency by the integrator sections.The required sampling frequency of the output data is such that it is only possible to time multiplex two channels per bus. Therefore the CIC filter must be configured with four output interfaces. Because four interfaces are required, the rate change factor must also be at least four to exploit this architecture, but in this example a rate change of eight is illustrated.SIMO architecture is applied when an interpolation filter type is chosen and the number of interfaces selected in the MegaWizard interface is greater than one.The total number of input channels must be a multiple of the number of interfaces. To satisfy this requirement, you may need to either insert dummy channels or use more than one CIC MegaCore function. Data is transferred as packets using AvalonStreaming interfaces. CIC filters have a low-pass filter characteristic. There are only three parameters (the rate change factor R , the number of stages N , and the differential delay M ) that can be modified to alter the passband characteristics and aliasing/imaging rejection. However, due to their drooping passband gains and wide transition regions, CIC filters alone cannot provide the flat passband and narrow transition region filter performance that is typically required in decimation or interpolation filtering applications.This problem can be alleviated by connecting the decimation or interpolation CIC filter to a compensation FIR filter which narrows the output bandwidth and flattens the passband gain.You can use a frequency sampling method to determine the coefficients of a FIR filter that equalizes the undesirable passband droop of the CIC and construct an ideal frequency response.The ideal frequency response is determined by sampling the normalized magnitude response of the CIC filter before inverting the response.Generally, it is only necessary to equalize the response in the passband, but you can sample further than the passband to fine tune the cascaded response of the filter chain.The Avalon-ST interface can also support more complex protocols for burst and packet transfers with packets interleaved across multiple channels.The Avalon-ST interface inherently synchronizes multi-channel designs, which allows you to achieve efficient, time-multiplexed implementations without having to implement complex control logic.CIC MegaCore函数----摘自 描述这篇文章对Altera公司的CIC 宏函数作了说明。
鸿鹄论坛_HCNA-Storage (H13-611)题库 v4.0
HCNA-Storage （H13-611）题库v4.01、以下关于华为RAID2.0+技术，描述正确的是：（多选）A、硬盘域中每个存储层的硬盘类型相同B、硬盘的空间被划分成固定大小的块C、用户可以为存储池（storage pool）中的每一个存储层分别设置“RAID策略”D、grain作为数据迁移的最小粒度和构成Thin LUN的基本单位答案：ABC解析：OceanStor存储系统会将Chunk Group（CKG）切分为更小的Extent。
Extent作为数据迁移的最小粒度和构成Thin LUN的基本单位，默认为4MB。
对于Thin LUN或文件系统，会在Extent上再进行更细粒度的划分（Grain），并以Grain为单位映射到Thin LUN、文件系统。
2、以下哪些选项不是FC SAN环境中必须的组件：（多选）A、存储设备B、FC 交换机C、FC HBAD、Windows操作系统答案：BD解析：当主机与存储点对点时不需要FC交换机。
3、SmartThin是华为OceanStor V3存储系统提供的一项按需分配存储资源的存储空间管理技术，基于虚拟化技术，SmartThin减少了物理存储资源的部署，最大限度的提高了存储空间的利用率。
A、对B、错答案：A4、以下关于华为RAID 2.0+技术中的硬盘域的描述，错误的是：A、一个硬盘域是一组硬盘B、一个硬盘只能属于一个硬盘域C、OceanStor V3存储系统可以创建一个或多个硬盘域D、硬盘域中，硬盘的类型是相同，硬盘的大小和转速需要保持一致答案：D解析：在一个硬盘域中，同种类型的硬盘构成一个存储层，每个存储层内部再按一定的规则划分为Disk Group，没有要求硬盘的大小和转速需要保持一致。
5、云计算的商业模式有：（多选）A、IaaSB、PaaSC、SaaSD、MaaS答案：ABC6、华为OceanStor V3 SmartTier特性可用于将数据放置到指定的磁盘类型上。
Verilog_HDL复杂数字系统设计-2_[1]...
![Verilog_HDL复杂数字系统设计-2_[1]...](https://img.taocdn.com/s3/m/3f4f2f7ba26925c52cc5bff2.png)
2013-8-4
南通大学电子信息学院
7
1.3复杂数字系统的设计方法
1.3.1 复杂数字逻辑系统
• 嵌入式微处理机系统
• 数字信号处理系统 • 高速并行计算逻辑
• 高速通信协议电路
• 高速编码/解码、加密/解密电路 • 复杂的多功能智能接口
• 门逻辑总数超过几万门达到几百甚至达几千万门的数
字系统
2013-8-4 南通大学电子信息学院 8
1990 Verilog HDL 公开发表
1995 Verilog IEEE1364 标准公开发表
1990有关Verilog HDL的 全部权利都移交给OVI(Open Verilog International)组织
2013-8-4 南通大学电子信息学院 6
1.2.3 Verilog HDL的优点
2013-8-4
南通大学电子信息学院
24
例2-2b 4选1多路选择器
module mux4_to_1 (out, i0, i1, i2, i3, s1, s0); output out; input i0, i1, i2, i3; input s1, s0; wire s1n, s0n; wire y0, y1, y2, y3; not not0(s1n, s1); not not1(s0n, s0); and and0(y0, i0, s1n, s0n); and and1(y1, i1, s1n, s0); and and2(y2, i2, s1, s0n); and and3(y3, i3, s1, s0); or or0(out, y0, y1, y2, y3); endmodule
2013-8-4 南通大学电子信息学院 3
第二套题(单选)
第二套题（单选）1. 当标准以太网帧长为64Bytes的信号接入以太网单板后，若启用了QinQ功能，则该信号在单板内部的实际帧长是多少（）Bytes？ [单选题] *648468(正确答案)802. 以太网帧结构中DATA字段的长度范围是。
[单选题] *46-1500字节(正确答案)46-1518字节64-1518节64-1500字节3. 主控板单配情况下的单板替换操作比主控板双配时，要多哪个步骤？ [单选题] *下载原配置数据(正确答案)确保更换前后主机软件版本一致，若不一致请先升级更换单板软件。
网管与网元数据的一致性校验。
查询单板告警，确认原来的告警已经解除。
4. 以下关于MPLS-TP OAM层次的说法，正确的是： [单选题] *Section是Tunnel的服务层，Tunnel是PW的服务层，PW是Service的服务层(正确答案)Section是PW的服务层，PW是Tunnel的服务层，Tunel是Service的服务层Service是PW的服务层，PW是Tunnel的服务层，Tunnel是Section的服务层Tunnel是PW的服务层，PW是Service的服务层，Service是Section的服务层5. 以下关于以太网单板的内部端口属性的描述，错误的是： [单选题] *A. 对Access属性的入端口。
如果输入数据带有VLAN ID，丢弃对Tag Aware属性的入端口，如果输入数据带有VLAN ID，透传接收数据(正确答案)对Access属性的入端口，如果输入数据不带VLAN ID，直接透传对Tag Aware属性的入端口，如果输入数据不带VLAN ID，丢弃6. 以下哪项SOM系统监控不到。
[单选题] *主光路性能发端FEC的类型(正确答案)光性能平坦度收端OTU输入光功率7. 告警反转的设置是基于： [单选题] *A. 单板网元端口(正确答案)告警8. 在网管上查询误码及光功率之前需要进行（）操作，否则无法查询相应教据。
华为 FusionServer Pro 2288H V5 服务器 用户指南说明书
FusionServer Pro 2288H V5 服务器V100R005用户指南文档版本08发布日期2019-10-30版权所有 © 华为技术有限公司 2019。
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修改记录目录前言 (ii)1 简介 (1)1.1 产品概述 (1)1.2 物理结构 (2)1.3 逻辑结构 (3)2 硬件描述 (5)2.1 前面板 (5)2.1.1 外观 (5)2.1.2 指示灯和按钮 (7)2.1.3 接口 (11)2.2 后面板 (13)2.2.1 外观 (13)2.2.2 指示灯 (14)2.2.3 接口 (16)2.3 处理器 (18)2.4 内存 (19)2.4.1 内存标识 (19)2.4.2 内存子系统体系结构 (20)2.4.3 内存兼容性信息 (21)2.4.4 内存安装准则 (23)2.4.5 内存插槽位置 (23)2.4.6 内存保护技术 (25)2.5 存储 (25)2.5.1 硬盘配置 (26)2.5.2 硬盘编号 (29)2.5.3 硬盘指示灯 (33)2.5.4 RAID控制卡 (35)2.6 网络 (35)2.6.1 灵活IO卡 (35)2.7 IO扩展 (38)2.7.1 PCIe卡 (38)2.7.2 PCIe插槽 (38)2.7.3 PCIe插槽说明 (42)2.8 电源 (47)2.9 风扇 (48)2.10 单板 (49)2.10.1 主板 (50)2.10.2 硬盘背板 (52)3 产品规格 (57)3.1 技术规格 (57)3.2 环境规格 (62)3.3 物理规格 (63)4 软硬件兼容性 (65)5 管制信息 (66)5.1 安全 (66)5.2 维保与保修 (69)6 静电释放 (70)6.1 防止静电释放 (70)6.2 防止静电释放的接地方法 (70)7 安装与配置 (72)7.1 安装环境要求 (72)7.1.1 空间与通风要求 (72)7.1.2 温度与湿度要求 (73)7.1.3 机柜要求 (73)7.2 安装硬件 (73)7.2.1 安装简介 (74)7.2.2 拆卸服务器外包装 (74)7.2.3 安装硬件选件 (75)7.2.4 安装服务器导轨 (75)7.2.4.1 安装L型滑道 (75)7.2.4.2 安装可伸缩滑道 (77)7.2.4.3 安装抱轨 (78)7.2.5 安装服务器 (79)7.2.5.1 L型滑道/可伸缩滑道上安装服务器 (79)7.2.5.2 抱轨上安装服务器 (80)7.2.6 安装外部线缆 (83)7.2.6.1 布线指导 (84)7.2.6.2 安装鼠标、键盘和VGA接口线缆 (84)7.2.6.3 安装网线 (85)7.2.6.4 安装光口线缆 (87)7.2.6.5 安装IB线缆 (89)7.2.6.6 安装外置USB设备 (91)7.2.6.7 安装串口线缆 (92)7.2.6.8 安装电源模块线缆 (93)7.2.6.8.1 安装交流电源模块线缆 (93)7.2.6.8.2 安装直流电源模块线缆 (94)7.2.6.9 检查线缆连接 (95)7.3 上电与下电 (96)7.3.1 上电 (96)7.3.2 下电 (97)7.4 初始配置 (98)7.4.1 默认数据 (98)7.4.2 配置简介 (99)7.4.3 修改初始密码 (100)7.4.3.1 修改iBMC默认用户的初始密码 (100)7.4.3.2 修改iBMC U-Boot的初始密码 (102)7.4.4 检查服务器 (103)7.4.5 配置iBMC IP地址 (105)7.4.6 配置RAID (106)7.4.7 配置BIOS (106)7.4.7.1 进入BIOS系统 (107)7.4.7.2 设置系统启动顺序 (107)7.4.7.3 设置网卡PXE (108)7.4.7.4 设置BIOS密码 (109)7.4.7.5 切换界面语言 (109)7.4.7.6 重启服务器 (110)7.4.8 安装操作系统 (110)7.4.9 使系统保持最新状态 (111)8 故障处理指导 (112)9 常用操作 (113)9.1 查询iBMC管理网口的IP地址 (113)9.2 登录iBMC WebUI (114)9.3 登录服务器实时桌面 (117)9.3.1 通过远程虚拟控制台登录 (117)9.3.1.1 iBMC (117)9.3.2 通过独立远程控制台登录 (120)9.3.2.1 Windows (120)9.3.2.2 Ubuntu (122)9.3.2.3 MAC (124)9.4 登录服务器命令行 (126)9.4.1 通过PuTTY登录（网口方式） (127)9.4.2 通过PuTTY登录（串口方式） (128)9.5 管理VMD功能 (130)9.5.1 开启VMD功能 (131)9.5.2 关闭VMD功能 (131)9.6 进入BIOS系统 (132)9.6.1 进入BIOS系统（Skylake） (132)9.6.2 进入BIOS系统（Cascade Lake） (133)9.7 清除存储介质数据 (135)10 更多资源 (138)10.1 获取技术支持 (138)10.2 产品信息资源 (139)10.3 产品配置资源 (139)10.4 维护工具 (140)11 软件和配置实用程序 (141)11.1 iBMC (141)11.2 BIOS (142)11.3 FusionServer Tools SmartKit (142)A 附录 (145)A.1 术语 (145)A.1.1 A-E (145)A.1.2 F-J (145)A.1.3 K-O (146)A.1.4 P-T (146)A.1.5 U-Z (147)A.2 缩略语 (147)A.2.1 A-E (147)A.2.2 F-J (148)A.2.3 K-O (150)A.2.4 P-T (151)A.2.5 U-Z (153)A.3 产品序列号 (153)A.4 工作温度规格限制 (155)A.5 铭牌型号 (157)A.6 RAS特性 (157)A.7 传感器列表 (159)1简介1.1 产品概述1.2 物理结构1.3 逻辑结构1.1 产品概述华为FusionServer Pro 2288H V5（以下简称2288H V5）是华为公司针对互联网、IDC（Internet Data Center）、云计算、企业市场以及电信业务应用等需求，推出的具有广泛用途的新一代2U2路机架服务器。
2016年桂林电子科技大学毕业生就业质量年度报告
桂林电子科技大学2016年毕业生就业质量年度报告一、学校简介桂林电子科技大学是全国四所电子科技大学之一，是工业和信息化部与广西壮族自治区共建高校，广西壮族自治区重点建设高校。
中国绕月探测工程总设计师、国家最高科学技术奖获得者、中国科学院孙家栋院士为学校名誉校长。
学校始建于1960年，1980年经国务院批准成立桂林电子工业学院，2006年更名为桂林电子科技大学。
学校先后隶属于第四机械工业部、电子工业部、机械电子工业部、中国电子工业总公司、信息产业部。
2000年管理体制转为中央与地方共建、以地方管理为主。
1990年，时任中共中央总书记江泽民同志亲临学校视察，并为学校亲笔题词“为发展电子工业培养更多的合格人才”。
学校现有金鸡岭校区、六合路校区、花江校区、北海校区（高职），分别位于桂林国家高新技术开发区、桂林市尧山风景区、北海市银海区，校园总面积4153亩。
学校图书馆建筑面积4.5万余平方米。
馆藏纸质图书186.4万册、电子图书150.8万种、高品质外文学术数据库32个、中文数据库42个、中外文期刊（含电子期刊）34997种。
具有先进的网络信息平台和智慧校园平台。
学校开设有本科专业63个，其中，国家综合改革试点专业1个、国家级特色专业5个，通过工程教育认证专业1个；现有国家级精品课程3门、国家级双语教学示范课程1门、国家级精品资源共享课2门。
学校获得“十一五”和“十二五”国家级规划教材9种。
学校获得高等教育国家级教学成果奖4项。
学校现有博士后科研流动站1个；一级学科博士学位授权点3个；一级学科硕士学位授权点11个、一级学科未覆盖的二级学科硕士学位授权点3个；工程、工商管理、会计、法律、翻译等5个硕士专业学位授权点，其中，工程硕士授权领域11个。
学校是教育部卓越工程师教育培养计划高校、国家大学生创新性实验计划实施高校、教育部大学英语教学改革示范点学校，学校是国防生培养单位、全军边防军人子女预科生培养单位。
eda技术实用教程-veriloghdl答案
eda技术实用教程-veriloghdl答案【篇一：eda技术与vhdl程序开发基础教程课后答案】eda的英文全称是electronic design automation2.eda系统设计自动化eda阶段三个发展阶段3. eda技术的应用可概括为4.目前比较流行的主流厂家的eda软件有、5.常用的设计输入方式有原理图输入、文本输入、状态机输入6.常用的硬件描述语言有7.逻辑综合后生成的网表文件为 edif8.布局布线主要完成9.10.常用的第三方eda工具软件有synplify/synplify pro、leonardo spectrum1.8.2选择1.eda技术发展历程的正确描述为（a）a cad-cae-edab eda-cad-caec eda-cae-cadd cae-cad-eda2.altera的第四代eda集成开发环境为（c）a modelsimb mux+plus iic quartus iid ise3.下列eda工具中，支持状态图输入方式的是（b）a quartus iib isec ispdesignexpertd syplify pro4.下列几种仿真中考虑了物理模型参数的仿真是（a）a 时序仿真b 功能仿真c 行为仿真d 逻辑仿真5.下列描述eda工程设计流程正确的是（c）a输入-综合-布线-下载-仿真b布线-仿真-下载-输入-综合c输入-综合-布线-仿真-下载d输入-仿真-综合-布线-下载6.下列编程语言中不属于硬件描述语言的是（d）a vhdlb verilogc abeld php1.8.3问答1.结合本章学习的知识，简述什么是eda技术？谈谈自己对eda技术的认识？答：eda（electronic design automation）工程是现代电子信息工程领域中一门发展迅速的新技术。
2.简要介绍eda技术的发展历程？答：现代eda技术是20世纪90年代初从计算机辅助设计、辅助制造和辅助测试等工程概念发展而来的。
LTE及4G介绍
LTE再掀4G熱潮新通訊2009年5月號99期文〃侯俊宇近期各地雖先後傳出春燕回巢之消息，但業界仍不敢過度樂觀，多抱持保留態度。
相較於此，通訊產業在3GPP標準大致底定、多數電信業者表態支持以及CDMA2000陣營帶槍投靠等利多消息下，LTE聲勢大振，更可望進一步活化量測市場需求，注入新一波成長動能。
新通訊技術陸續問世，訊號品質好壞也成為這些技術能否躍上主流的關鍵因素。
通訊量測與驗證相關業者近期就針對各式新興技術進行深入研究，包括多重輸入多重輸出(MIMO)、正交分頻多重存取(OFDMA)等技術都是重點項目。
而長程演進計畫(LTE)由於極具成長潛力，因此更加吸引業者目光。
一般來說，在一個無所不在的通訊環境中，如何滿足各種訊號的特性，卻又不致互相干擾，必頇仰賴量測廠與原始設備製造商(OEM)的通力合作，符合國際標準與用戶需求的產品才得以問世。
也因此，通訊量測業者向來扮演無線通訊產業火車頭角色，隨著通訊技術標準層出不窮，各式量測儀器也亦步亦趨，陸續問世。
而從近期的市場發展可以看出，量測業者在產品線的投資毫不手軟，顯現通訊產業在低迷的景氣中依舊火熱。
4G商機無限LTE爭寵不落人後繼2008年底3GPP通過LTE標準草案後，該標準也預計在2009年第二季前底定，正式為全球商用營運拉開序幕。
看好此波商機，不少電信業者早已搶先布局，如北美電信營運商AT&T、Verizon與Clearwire皆準備在今年大規模部署LTE。
亞洲則由日本NTT DoCoMo領軍，計畫於2010年推出LTE手機寬頻服務；KDDI亦已開始著手進行LTE布建計畫，從各國電信業者相關進度(表1)可以看出，不少業者對LTE之未來發展均頗有興趣，並積極投入資源，試圖搶先攻下灘頭堡。
資料來源：各公司2013年全球用戶上看八千五百萬市調單位Infonetics Research指出，近期業界對4G尤其是LTE的部署速度可能會不斷加速，直至2013年，4G基礎設施市場的規模將達50億美元。
ds180_7Series_Overview
© Copyright 2010–2013 Xilinx, Inc., Xilinx, the Xilinx logo, Artix, ISE, Kintex, Spartan, Virtex, Vivado, Zynq, and other designated brands included herein are trademarks of Xilinx in the United States and other countries. PCI Express is a trademark of PCI-SIG and used under license. All other trademarks are the property of their respective owners.General DescriptionXilinx® 7series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. The 7series FPGAs include:•Artix®-7 Family: Optimized for lowest cost and power with small form-factor packaging for the highest volume applications.•Kintex®-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.•Virtex®-7 Family: Optimized for highest system performance and capacity with a 2X improvement in system performance. Highest capability devices enabled by stacked silicon interconnect (SSI) technology.Built on a state-of-the-art, high-performance, low-power (HPL), 28nm, high-k metal gate (HKMG) process technology, 7series FPGAs enable anunparalleled increase in system performance with 2.9Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3TMAC/s DSP , while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.Summary of 7Series FPGA Features•Advanced high-performance FPGA logic based on real 6-input look-up table (LUT) technology configurable as distributed memory.•36Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.•High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.•High-speed serial connectivity with built-in multi-gigabit transceivers from 600Mb/s to maximum rates of 6.6Gb/s up to 28.05Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.• A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.•DSP slices with 25x 18 multiplier, 48-bit accumulator, and pre-adder for high performance filtering, including optimized symmetric coefficient filtering.•Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.•Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.•Wide variety of configuration options, including support forcommodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.•Low-cost, wire-bond, lidless flip-chip, and high signal integrity flip-chip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.•Designed for high performance and lowest power with 28nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.7Series FPGAs OverviewDS180 (v1.14) July 29, 2013Advance Product SpecificationTable 1:7Series Families ComparisonMaximum CapabilityArtix-7 FamilyKintex-7 FamilyVirtex-7 FamilyLogic Cells215K478K 1,955K Block RAM (1) 13Mb 34Mb 68Mb DSP Slices7401,9203,600Peak DSP Performance (2)929GMAC/s2,845GMAC/s5,335GMAC/sTransceivers163296Peak Transceiver Speed6.6Gb/s 12.5Gb/s 28.05Gb/s Peak Serial Bandwidth (Full Duplex)211Gb/s 800Gb/s 2,784Gb/s PCIe Interface x4 Gen2x8 Gen2x8 Gen3Memory Interface 1,066Mb/s1,866Mb/s1,866Mb/s I/O Pins 5005001,200I/O Voltage 1.2V , 1.35V , 1.5V , 1.8V , 2.5V , 3.3V 1.2V , 1.35V , 1.5V , 1.8V , 2.5V, 3.3V 1.2V , 1.35V , 1.5V , 1.8V, 2.5V , 3.3V Package Options Low-Cost, Wire-Bond, LidlessFlip-ChipLow-Cost, Lidless Flip-Chip and High-Performance Flip-ChipHighest Performance Flip-ChipNotes:1.Additional memory available in the form of distributed RAM.2.Peak DSP performance numbers are based on symmetrical filter implementation.Device LogicCells Configurable Logic Blocks(CLBs)DSP48E1Slices(2)Block RAM Blocks(3)CMTs(4)PCIe(5)GTPsXADCBlocksTotal I/OBanks(6)Max UserI/O(7) Slices(1)MaxDistributedRAM (Kb)18Kb36Kb Max(Kb)XC7A35T33,2805,20040090100501,80051415250 XC7A50T52,1608,150600120150752,70051415250 XC7A75T75,52011,8008921802101053,78061816300 XC7A100T101,44015,8501,1882402701354,86061816300 XC7A200T215,36033,6502,88874073036513,14010116110500 Notes:1.Each 7series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.2.Each DSP slice contains a pre-adder, a 25x18 multiplier, an adder, and an accumulator.3.Block RAMs are fundamentally 36Kb in size; each block can also be used as two independent 18Kb blocks.4.Each CMT contains one MMCM and one PLL.5.Artix-7 FPGA Interface Blocks for PCI Express support up to x4 Gen 2.6.Does not include configuration Bank 0.7.This number does not include GTP transceivers.Table 3:Artix-7 FPGA Device-Package Combinations and Maximum I/OsPackage(1)CPG236CSG324CSG325FTG256SBG484FGG484(2)FBG484(2)FGG676(3)FBG676(3)FFG1156 Size (mm)10 x 1015 x 1515 x 1517 x 1719 x 1923 x 2323 x 2327 x 2727 x 2735 x 35 Ball Pitch (mm)0.50.80.8 1.00.8 1.0 1.0 1.0 1.0 1.0Device GTPI/OGTPI/OGTPI/OGTPI/OGTPI/OGTPI/OGTPI/OGTPI/OGTPI/OGTPI/O HR(4)HR(4)HR(4)HR(4)HR(4)HR(4)HR(4)HR(4)HR(4)HR(4)XC7A35T21000210415001704250XC7A50T21000210415001704250XC7A75T0210017042858300XC7A100T0210017042858300XC7A200T42854285840016500 Notes:1.All packages listed are Pb-free. Some packages are available in Pb option.2.Devices in FGG484 and FBG484 are footprint compatible.3.Devices in FGG676 and FBG676 are footprint compatible.4.HR = High Range I/O with support for I/O voltage from 1.2V to 3.3V.Device LogicCellsConfigurable LogicBlocks (CLBs)DSPSlices(2)Block RAM Blocks(3)CMTs(4)PCIe(5)GTXs XADCBlocksTotal I/OBanks(6)MaxUserI/O(7) Slices(1)MaxDistributedRAM (Kb)18Kb36Kb Max (Kb)XC7K70T65,60010,2508382402701354,86061816300 XC7K160T162,24025,3502,18860065032511,70081818400 XC7K325T326,08050,9504,00084089044516,02010116110500 XC7K355T356,16055,6505,0881,4401,43071525,740612416300 XC7K410T406,72063,5505,6631,5401,59079528,62010116110500 XC7K420T416,96065,1505,9381,6801,67083530,060813218400 XC7K480T477,76074,6506,7881,9201,91095534,380813218400 Notes:1.Each 7series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.2.Each DSP slice contains a pre-adder, a 25x18 multiplier, an adder, and an accumulator.3.Block RAMs are fundamentally 36Kb in size; each block can also be used as two independent 18 Kb blocks.4.Each CMT contains one MMCM and one PLL.5.Kintex-7 FPGA Interface Blocks for PCI Express support up to x8 Gen 2.6.Does not include configuration Bank 0.7.This number does not include GTX transceivers.Table 5:Kintex-7 FPGA Device-Package Combinations and Maximum I/OsPackage(1)FBG484FBG676(2)FFG676(2)FBG900(3)FFG900(3)FFG901FFG1156 Size (mm)23 x 2327 x 2727 x 2731 x 3131 x 3131 x 3135 x 35 Ball Pitch(mm) 1.0 1.0 1.0 1.0 1.0 1.0 1.0Device GTXI/OGTXI/OGTXI/OGTXI/OGTXI/OGTXI/OGTXI/OHR(4)HP(5)HR(4)HP(5)HR(4)HP(5)HR(4)HP(5)HR(4)HP(5)HR(4)HP(5)HR(4)HP(5)XC7K70T41851008200100XC7K160T418510082501508250150XC7K325T825015082501501635015016350150XC7K355T243000XC7K410T825015082501501635015016350150XC7K420T283800324000 XC7K480T283800324000 Notes:1.All packages listed are Pb-free. Some packages are available in Pb option.2.Devices in FBG676 and FFG676 are footprint compatible.3.Devices in FBG900 and FFG900 are footprint compatible.4.HR = High Range I/O with support for I/O voltage from 1.2V to 3.3V.5.HP = High Performance I/O with support for I/O voltage from 1.2V to 1.8V.Table 6:Virtex-7 FPGA Feature SummaryDevice(1)LogicCellsConfigurable LogicBlocks (CLBs)DSPSlices(3)Block RAM Blocks(4)CMTs(5)PCIe(6)GTX GTH GTZXADCBlocksTotal I/OBanks(7)MaxUserI/O(8)SLRs(9) Slices(2)MaxDistributedRAM (Kb)18Kb36Kb Max(Kb)XC7V585T582,72091,0506,9381,260 1,590795 28,6201833600117850N/A XC7V2000T1,954,560305,40021,5502,160 2,5841,29246,51224436001241,2004XC7VX330T326,40051,0004,3881,1201,50075027,0001420280114700N/A XC7VX415T412,16064,4006,5252,1601,76088031,6801220480112600N/A XC7VX485T485,76075,9008,1752,8002,0601,03037,0801445600114700N/A XC7VX550T554,24086,6008,7252,8802,3601,18042,4802020800116600N/A XC7VX690T693,120108,30010,8883,6002,9401,47052,92020308001201,000N/A XC7VX980T979,200153,00013,8383,6003,0001,50054,0001830720118900N/A XC7VX1140T1,139,200178,00017,7003,3603,7601,88067,68024409601221,1004XC7VH580T580,48090,7008,8501,6801,88094033,84012204881126002XC7VH870T876,160136,90013,2752,5202,8201,41050,760183072161136503 Notes:1.EasyPath™-7 FPGAs are also available to provide a fast, simple, and risk-free solution for cost reducing Virtex-7 T and Virtex-7 XT FPGA designs2.Each 7series FPGA slice contains four LUTs and eight flip-flops; only some slices can use their LUTs as distributed RAM or SRLs.3.Each DSP slice contains a pre-adder, a 25x18 multiplier, an adder, and an accumulator.4.Block RAMs are fundamentally 36Kb in size; each block can also be used as two independent 18 Kb blocks.5.Each CMT contains one MMCM and one PLL.6.Virtex-7 T FPGA Interface Blocks for PCI Express support up to x8 Gen 2. Virtex-7 XT and Virtex-7 HT Interface Blocks for PCI Express support up to x8 Gen 3, with theexception of the XC7VX485T device, which supports x8 Gen 2.7.Does not include configuration Bank 0.8.This number does not include GTX, GTH, or GTZ transceivers.9.Super logic regions (SLRs) are the constituent parts of FPGAs that use SSI technology. Virtex-7 HT devices use SSI technology to connect SLRs with 28.05 Gb/stransceivers.Table 7:Virtex-7 FPGA Device-Package Combinations and Maximum I/Os Package(1)FFG1157FFG1761(2)FHG1761(2)FLG1925 Size (mm)35 x 3542.5 x 42.545 x 4545 x 45 Ball Pitch 1.0 1.0 1.0 1.0Device GTX GTHI/OGTX GTHI/OGTX GTHI/OGTXI/OHR(3)HP(4)HR(3)HP(4)HR(3)HP(4)HR(3) HP(4)XC7V585T2000600360100750XC7V2000T36008501601,200XC7VX330T020060002850650XC7VX415T0200600XC7VX485T20006002800700XC7VX550TXC7VX690T02006000360850XC7VX980TXC7VX1140TNotes:1.All packages listed are Pb-free. Some packages are available in Pb option.2.Devices in FFG1761 and FHG1761 are footprint compatible.3.HR = High Range I/O with support for I/O voltage from 1.2V to 3.3V.4.HP = High Performance I/O with support for I/O voltage from 1.2V to 1.8V.Table 8:Virtex-7 FPGA Device-Package Combinations and Maximum I/Os - ContinuedPackage(1)FFG1158FFG1926(2)FLG1926(2)FFG1927FFG1928(3)FLG1928(3)FFG1930(4)FLG1930(4) Size (mm)35 x 3545 x 4545 x 4545 x 4545 x 4545 x 4545 x 4545 x 45 Ball Pitch 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0Device GTX GTH I/OGTX GTHI/OGTX GTHI/OGTX GTHI/OGTX GTHI/OGTX GTHI/OGTX GTHI/OGTX GTHI/OHP(5)HP(5)HP(5)HP(5)HP(5)HP(5)HP(5)HP(5)XC7V585TXC7V2000TXC7VX330TXC7VX415T0483********XC7VX485T480350560600240700XC7VX550T0483********XC7VX690T0483500647200806000241,000XC7VX980T064720072480024900XC7VX1140T0647200964800241,100 Notes:1.All packages listed are Pb-free. Some packages are available in Pb option.2.Devices in FFG1926 and FLG1926 are footprint compatible.3.Devices in FFG1928 and FLG1928 are footprint compatible.4.Devices in FFG1930 and FLG1930 are footprint compatible.5.HP = High Performance I/O with support for I/O voltage from 1.2V to 1.8V.Table 9:Virtex-7 FPGA Device-Package Combinations and Maximum I/Os - ContinuedPackage(1)HCG1155HCG1931HCG1932Size (mm)35 x 3545 x 4545 x 45Ball Pitch 1.0 1.0 1.0Device GTH GTZI/OGTH GTZI/OGTH GTZI/O HP(2)HP(2)HP(2)XC7VH580T248400488600488300 XC7VH870T4886507216300 Notes:1.All packages listed are Pb-free. Some packages are available in Pb option.2.HP = High Performance I/O with support for I/O voltage from 1.2V to 1.8V.Stacked Silicon Interconnect (SSI) TechnologyThere are many challenges associated with creating high capacity FPGAs that Xilinx addresses with the SSI technology. SSI technology enables multiple super logic regions (SLRs) to be combined on a passive interposer layer, using proven manufacturing and assembly techniques from industry leaders, to create a single FPGA with more than ten thousand inter-SLR connections, providing ultra-high bandwidth connectivity with low latency and low power consumption. There are two types of SLRs used in Virtex-7 FPGAs: a logic intensive SLR used in the Virtex-7 T devices and a DSP/blockRAM/transceiver-rich SLR used in the Virtex-7 XT and HT devices. SSI technology enables the production of higher capability FPGAs than traditional manufacturing methods, enabling the highest capacity and highest performance FPGAs ever created to reach production more quickly and with less risk than would otherwise be possible. Thousands of super long line (SLL) routing resources and ultra-high performance clock lines that cross between the SLRs ensure that designs span seamlessly across these high-density programmable logic devices.CLBs, Slices, and LUTsSome key features of the CLB architecture include:•Real 6-input look-up tables (LUTs)•Memory capability within the LUT•Register and shift register functionalityThe LUTs in 7 series FPGAs can be configured as either one 6-input LUT (64-bit ROMs) with one output, or as two 5-input LUTs (32-bit ROMs) with separate outputs but common addresses or logic inputs. Each LUT output can optionally be registered in a flip-flop. Four such LUTs and their eight flip-flops as well as multiplexers and arithmetic carry logic form a slice, and two slices form a configurable logic block (CLB). Four of the eight flip-flops per slice (one per LUT) can optionally be configured as latches.Between 25–50% of all slices can also use their LUTs as distributed 64-bit RAM or as 32-bit shift registers (SRL32) or as two SRL16s. Modern synthesis tools take advantage of these highly efficient logic, arithmetic, and memory features.Clock ManagementSome of the key highlights of the clock management architecture include:•High-speed buffers and routing for low-skew clock distribution•Frequency synthesis and phase shifting•Low-jitter clock generation and jitter filteringEach 7series FPGA has up to 24 clock management tiles (CMTs), each consisting of one mixed-mode clock manager (MMCM) and one phase-locked loop (PLL).Mixed-Mode Clock Manager and Phase-Locked LoopThe MMCM and PLL share many characteristics. Both can serve as a frequency synthesizer for a wide range of frequencies and as a jitter filter for incoming clocks. At the center of both components is a voltage-controlled oscillator (VCO), which speeds up and slows down depending on the input voltage it receives from the phase frequency detector (PFD).There are three sets of programmable frequency dividers: D, M, and O. The pre-divider D (programmable by configuration and afterwards via DRP) reduces the input frequency and feeds one input of the traditional PLL phase/frequency comparator. The feedback divider M (programmable by configuration and afterwards via DRP) acts as a multiplier because it divides the VCO output frequency before feeding the other input of the phase comparator. D and M must be chosen appropriately to keep the VCO within its specified frequency range. The VCO has eight equally-spaced output phases (0°, 45°, 90°, 135°, 180°, 225°, 270°, and 315°). Each can be selected to drive one of the output dividers (six for the PLL, O0 to O5, and seven for the MMCM, O0 to O6), each programmable by configuration to divide by any integer from 1 to 128. The MMCM and PLL have three input-jitter filter options: low bandwidth, high bandwidth, or optimized mode. Low-bandwidth mode has the best jitter attenuation but not the smallest phase offset. High-bandwidth mode has the best phase offset, but not the best jitter attenuation. Optimized mode allows the tools to find the best setting.MMCM Additional Programmable FeaturesThe MMCM can have a fractional counter in either the feedback path (acting as a multiplier) or in one output path. Fractional counters allow non-integer increments of 1/8 and can thus increase frequency synthesis capabilities by a factor of 8.The MMCM can also provide fixed or dynamic phase shift in small increments that depend on the VCO frequency. At 1600MHz, the phase-shift timing increment is 11.2ps.Clock DistributionEach 7series FPGA provides six different types of clock lines (BUFG, BUFR, BUFIO, BUFH, BUFMR, and the high-performance clock) to address the different clocking requirements of high fanout, short propagation delay, and extremely low skew.Global Clock LinesIn each 7series FPGA, 32 global clock lines have the highest fanout and can reach every flip-flop clock, clock enable, and set/reset, as well as many logic inputs. There are 12 global clock lines within any clock region driven by the horizontal clock buffers (BUFH). Each BUFH can be independently enabled/disabled, allowing for clocks to be turned off within a region, thereby offering fine-grain control over which clock regions consume power. Global clock lines can be driven by global clock buffers, which can also perform glitchless clock multiplexing and clock enable functions. Global clocks are often driven from the CMT, which can completely eliminate the basic clock distribution delay.Regional ClocksRegional clocks can drive all clock destinations in their region. A region is defined as any area that is 50 I/O and 50 CLB high and half the chip wide. 7series FPGAs have between six and twenty-four regions. There are four regional clock tracks in every region. Each regional clock buffer can be driven from either of four clock-capable input pins, and its frequency can optionally be divided by any integer from 1 to 8.I/O ClocksI/O clocks are especially fast and serve only I/O logic and serializer/deserializer (SerDes) circuits, as described in theI/O Logic section. The 7series devices have a direct connection from the MMCM to the I/O for low-jitter, high-performance interfaces.Block RAMSome of the key features of the block RAM include:•Dual-port 36Kb block RAM with port widths of up to 72•Programmable FIFO logic•Built-in optional error correction circuitryEvery 7series FPGA has between 50 and 1,880 dual-port block RAMs, each storing 36Kb. Each block RAM has two completely independent ports that share nothing but the stored data.Synchronous OperationEach memory access, read or write, is controlled by the clock. All inputs, data, address, clock enables, and write enables are registered. Nothing happens without a clock. The input address is always clocked, retaining data until the next operation. An optional output data pipeline register allows higher clock rates at the cost of an extra cycle of latency.During a write operation, the data output can reflect either the previously stored data, the newly written data, or can remain unchanged.Programmable Data WidthEach port can be configured as 32K×1, 16K×2, 8K×4, 4K×9 (or8), 2K×18 (or16), 1K×36 (or32), or 512×72 (or64). The two ports can have different aspect ratios without any constraints.Each block RAM can be divided into two completely independent 18Kb block RAMs that can each be configured to any aspect ratio from 16K×1 to 512×36. Everything described previously for the full 36Kb block RAM also applies to each of the smaller 18Kb block RAMs.Only in simple dual-port (SDP) mode can data widths of greater than 18bits (18Kb RAM) or 36bits (36Kb RAM) be accessed. In this mode, one port is dedicated to read operation, the other to write operation. In SDP mode, one side (read or write) can be variable, while the other is fixed to 32/36 or 64/72.Both sides of the dual-port 36Kb RAM can be of variable width.Two adjacent 36Kb block RAMs can be configured as one cascaded 64K×1 dual-port RAM without any additional logic. Error Detection and CorrectionEach 64-bit-wide block RAM can generate, store, and utilize eight additional Hamming code bits and perform single-bit error correction and double-bit error detection (ECC) during the read process. The ECC logic can also be used when writing to or reading from external 64- to 72-bit-wide memories.FIFO ControllerThe built-in FIFO controller for single-clock (synchronous) or dual-clock (asynchronous or multirate) operation increments the internal addresses and provides four handshaking flags: full, empty, almost full, and almost empty. The almost full and almost empty flags are freely programmable. Similar to the block RAM, the FIFO width and depth are programmable, but the write and read ports always have identical width.First word fall-through mode presents the first-written word on the data output even before the first read operation. After the first word has been read, there is no difference between this mode and the standard mode.Digital Signal Processing — DSP SliceSome highlights of the DSP functionality include:•25×18 two's complement multiplier/accumulator high-resolution (48bit) signal processor•Power saving pre-adder to optimize symmetrical filter applications•Advanced features: optional pipelining, optional ALU, and dedicated buses for cascadingDSP applications use many binary multipliers and accumulators, best implemented in dedicated DSP slices. All 7series FPGAs have many dedicated, full custom, low-power DSP slices, combining high speed with small size while retaining system design flexibility.Each DSP slice fundamentally consists of a dedicated 25×18 bit two's complement multiplier and a 48-bit accumulator, both capable of operating up to 741MHz. The multiplier can be dynamically bypassed, and two 48-bit inputs can feed a single-instruction-multiple-data (SIMD) arithmetic unit (dual 24-bit add/subtract/accumulate or quad 12-bitadd/subtract/accumulate), or a logic unit that can generate any one of ten different logic functions of the two operands. The DSP includes an additional pre-adder, typically used in symmetrical filters. This pre-adder improves performance in densely packed designs and reduces the DSP slice count by up to 50%. The DSP also includes a 48-bit-wide Pattern Detector that can be used for convergent or symmetric rounding. The pattern detector is also capable of implementing96-bit-wide logic functions when used in conjunction with the logic unit.The DSP slice provides extensive pipelining and extension capabilities that enhance the speed and efficiency of many applications beyond digital signal processing, such as wide dynamic bus shifters, memory address generators, wide bus multiplexers, and memory-mapped I/O register files. The accumulator can also be used as a synchronous up/down counter.Input/OutputSome highlights of the input/output functionality include:•High-performance SelectIO technology with support for 1,866Mb/s DDR3•High-frequency decoupling capacitors within the package for enhanced signal integrity•Digitally Controlled Impedance that can be 3-stated for lowest power, high-speed I/O operationThe number of I/O pins varies depending on device and package size. Each I/O is configurable and can comply with a large number of I/O standards. With the exception of the supply pins and a few dedicated configuration pins, all other package pins have the same I/O capabilities, constrained only by certain banking rules. The I/O in 7series FPGAs are classed as High Range (HR) or High Performance (HP). The HR I/Os offer the widest range of voltage support, from 1.2V to 3.3V. The HP I/Os are optimized for highest performance operation, from 1.2V to 1.8V.HR and HP I/O pins in 7 series FPGAs are organized in banks, with 50 pins per bank. Each bank has one common V CCO output supply, which also powers certain input buffers. Some single-ended input buffers require an internally generated or an externally applied reference voltage (V REF). There are two V REF pins per bank (except configuration bank 0). A single bank can have only one V REF voltage value.Xilinx 7series FPGAs use a variety of package types to suit the needs of the user, including small form factor wire-bond packages for lowest cost; conventional, high performance flip-chip packages; and lidless flip-chip packages that balance smaller form factor with high performance. In the flip-chip packages, the silicon device is attached to the package substrate using a high-performance flip-chip process. Controlled ESR discrete decoupling capacitors are mounted on the package substrate to optimize signal integrity under simultaneous switching of outputs (SSO) conditions.I/O Electrical CharacteristicsSingle-ended outputs use a conventional CMOS push/pull output structure driving High towards V CCO or Low towards ground, and can be put into a high-Z state. The system designer can specify the slew rate and the output strength. The input is always active but is usually ignored while the output is active. Each pin can optionally have a weak pull-up or a weak pull-down resistor.Most signal pin pairs can be configured as differential input pairs or output pairs. Differential input pin pairs can optionally be terminated with a 100Ω internal resistor. All 7series devices support differential standards beyond LVDS: HT, RSDS, BLVDS, differential SSTL, and differential HSTL.Each of the I/Os supports memory I/O standards, such as single-ended and differential HSTL as well as single-ended SSTL and differential SSTL. The SSTL I/O standard can support data rates of up to 1,866Mb/s for DDR3 interfacing applications. 3-State Digitally Controlled Impedance and Low Power I/O FeaturesThe 3-state Digitally Controlled Impedance (T_DCI) can control the output drive impedance (series termination) or can provide parallel termination of an input signal to V CCO or split (Thevenin) termination to V CCO/2. This allows users to eliminate off-chip termination for signals using T_DCI. In addition to board space savings, the termination automatically turns off when in output mode or when 3-stated, saving considerable power compared to off-chip termination. The I/Os also have low power modes for IBUF and IDELAY to provide further power savings, especially when used to implement memory interfaces.I/O LogicInput and Output DelayAll inputs and outputs can be configured as either combinatorial or registered. Double data rate (DDR) is supported by all inputs and outputs. Any input and some outputs can be individually delayed by up to 32 increments of 78ps or 52ps each. Such delays are implemented as IDELAY and ODELAY. The number of delay steps can be set by configuration and can also be incremented or decremented while in use.。
存储HCIP测试题(附参考答案)
存储HCIP测试题（附参考答案）一、单选题（共38题，每题1分，共38分）1.存储设备有A和B两个控制器，如果A控的BBU故障，以下哪项描述是正确的（）A、归属A控的LUN会转为透写B、归属B控的LUN会转为透写C、所有的LUN都转为透写D、所有的LUN都不转为透写正确答案：BScanner特性通过哪种方式将需要查杀的文件路径发送给防病毒代理服务器A、轮询B、并发C、快照D、重删正确答案：C3.华为分布式存储系统上电顺序正确的是以下哪一项？A、机柜-->KVM--交换机--->节点B、机柜-->交换机-->KVM-->节点C、机柜-->节点-->KVM---交换机D、机柜-->交换机-->节点---KVM正确答案：B4.某应用的数据初始容量是500GB.，备份频率是每周1次全备，6次增备，全备和增备的数据保存周期均为4周，冗余比为20%。
则4周的后端存储容量为：A、3320GB.B、3504GB.C、4380GB.D、5256GB.正确答案：D5.文件系统备份带宽计算公式正确的是以下哪个选项，A、无复制需求时，需求带宽（不带重删）=全备数据量÷备份窗口÷带宽利用率。
B、有复制需求时，需求带宽（带重删）=复制数据量÷复制窗口÷带宽利用率。
C、无复制需求时，需求带宽（介质端重删）=全备数据量÷重删比÷备份窗口÷带宽利用率。
D、无复制需求时，需求带宽（源端重删）=全备数据量÷备份窗口÷带宽利用率。
正确答案：A6.下列哪个接口模块是SX6018上用于升级防火墙软件以及其他高级调试的:A、USB接口B、I2C接口C、管理网口D、CONSOLE口正确答案：B7.关于目标端重删，以下描述不正确的是哪一项?A、不占用源端的资源。
B、目标端重删等同于后处理重删(Post-processing)。