EL2004中文资料
EN 10327-2004 中文版 冷成形低碳钢持续热浸涂覆讲解

欧洲标准 EN103272004.6ICS 77.140.50; 77.140.10 替代 EN 10142:2000EN 10154:2002EN 10214:1995EN 10215:1995 冷成形用连续热浸镀低碳钢钢板和钢带——交货技术条件CEN欧洲标准化委员会1 范围1.1 本标准规定了厚度在0.35mm~3.0mm(除非另有协议,见1.2的连续热浸镀低碳钢镀锌(Z、镀锌铁合金(ZF、镀锌铝合金(ZA、镀铝锌合金(AZ和镀铝硅合金(AS(见表1的钢板和钢带的交货技术要求。
这里的厚度是指交货产品镀层后的最终厚度。
本标准适用于所有宽度的钢带和从宽度≥600mm的钢带剪切而成的钢板及从宽度<600mm的钢带剪切而成的定尺产品。
1.2 如果在询价和订货时有协议,本标准也适用于厚度>3.0mm的连续热浸镀镀层扁平材产品。
在这种情况下,产品的力学性能、镀层附着性和表面质量要求都应在订货或询价时进行协商。
1.3 本标准规定的产品主要用于那些将冷成形性和耐腐蚀性作为重要参考因素的场合下。
合金的耐腐蚀性与镀层厚度成正比(见7.3.2。
1.4 本标准不适用于:• 结构用热浸镀镀层扁平材产品(见EN10326;• 冷轧电镀扁平材钢产品(见EN 10152;• 连续有机镀层(涂层带卷扁平材钢产品(见EN 10169-1、EN 10169-2和EN 10169-3• 冷成形用较高屈服强度的连续热浸镀涂层钢板和钢带(见EN 10292。
2 引用标准下列文件中的条款通过本标准的引用而成为本标准的条款。
凡是注日期的引用文件,仅该版本适用于本标准。
凡是不注日期的引用文件,其最新版本适用于本标准(包括修改单。
EN 10002-1 金属材料-拉伸试验-第1部分:室温实验方法EN 10020:2000 钢牌号定义和分类EN 10021:1993 钢及钢产品交货一般技术要求EN 10027-1 钢代号体系—第1部分:钢名称、基本符号EN 10027-2 钢代号体系—第2部分:数字代号体系EN 10079 钢产品分类EN 10143 连续热浸镀金属镀层钢板和钢带—尺寸外形及允许偏差EN 10204 金属产品—检验文件的类型EN 10113 金属材料—钢板和钢带—塑性应变比的测定EN 10275金属材料—钢板和钢带—拉伸应变硬化指数的测定EN 10260 钢代号体系—补充符号3 术语和定义本标准除采用EN 10020:2000、EN 10021:1993、EN 10079:1992、EN 10204:1991中的术语和定义外,还采用如下术语和定义:注1 钢铁的防护一般导则见EN ISO 14713.注2 连续热浸镀钢带镀层的成分见3.1到3.4。
BQ2004E中文资料

Features➤Fast charge and conditioning of nickel cadmium or nickel-metal hydride batteries ➤Hysteretic PWM switch-mode current regulation or gated con-trol of an external regulator ➤Easily integrated into systems or used as a stand-alone charger ➤Pre-charge qualification of tem-perature and voltage ➤Configurable,direct LED outputs display battery and charge status ➤Fast-charge termination by ∆tem-perature/∆time,peak volume de-tection,-∆V,maximum voltage,maximum temperature,and maxi-mum time ➤Optional top-off charge and pulsed current maintenance charging ➤Logic-level controlled low-power mode (<5µA standby current)General DescriptionThe bq2004E and bq2004H Fast Charge ICs provide comprehensive fast charge control functions together with high-speed switching power con-trol circuitry on a monolithic CMOS device.Integration of closed-loop current control circuitry allows the bq2004to be the basis of a cost-effective so-lution for stand-alone and system-integrated chargers for batteries of one or more cells.Switch-activated discharge-before-charge allows bq2004E/H-based charg-ers to support battery conditioning and capacity determination.High-efficiency power conversion is accomplished using the bq2004E/H as a hysteretic PWM controller for switch-mode regulation of the charg-ing current.The bq2004E/H may al-ternatively be used to gate an exter-nally regulated charging current.Fast charge may begin on application of the charging supply ,replacement of the battery ,or switch depression.For safety ,fast charge is inhibited unless/until the battery tempera-ture and voltage are within config-ured limits.Temperature,voltage,and time are monitored throughout fast charge.Fast charge is terminated by any of the following:nRate of temperature rise (∆T/∆t)n Peak voltage detection (PVD)n Negative delta voltage (-∆V)n Maximum voltage n Maximum temperature nMaximum timeAfter fast charge,optional top-off and pulsed current maintenance phases with appropriate display mode selections are available.The bq2004H differs from the bq2004E only in that fast charge,hold-off,and top-off time units have been scaled up by a factor of two,and the bq2004H provides different display selections.Timing differ-ences between the two ICs are illus-trated in Table 1.Display differ-ences are shown in Table 2.1Fast-Charge ICsbq2004E/HDCMDDischarge command DSEL Display select VSEL Voltage termination selectTM 1Timer mode select 1TM 2Timer mode select 2TCO Temperature cutoff TS Temperature sense BATBattery voltage1PN2004E01.eps16-Pin Narrow DIP or Narrow SOIC234 5678161514131211109INH DIS MOD V CC V SS LED 2LED 1SNSDCMD DSEL VSEL TM 1TM 2TCO TS BATSNS Sense resistor input LED 1Charge status output 1LED 2Charge status output 2V SS System ground V CC 5.0V ±10% power MOD Charge current control DISDischarge control outputINH Charge inhibit inputPin Connections 6/99 EPin NamesPin DescriptionsDCMD Discharge-before-charge control inputThe DCMD input controls the conditionsthat enable discharge-before-charge.DCMDis pulled up internally.A negative-goingpulse on DCMD initiates a discharge to end-of-discharge voltage(EDV)on the BAT pin,followed by a new charge cycle start.TyingDCMD to ground enables automaticdischarge-before-charge on every new chargecycle start.DSEL Display select inputThis three-state input configures the chargestatus display mode of the LED1and LED2out-puts and can be used to disable top-off andpulsed-trickle.See Table2.VSEL Voltage termination select inputThis three-state input controls the voltage-termination technique used by thebq2004E/H.When high,PVD is active.When floating,-∆V is used.When pulled low,both PVD and-∆V are disabled.TM1–TM2Timer mode inputsTM1and TM2are three-state inputs thatconfigure the fast charge safety timer,voltagetermination hold-off time,“top-off”,andtrickle charge control.See Table1.TCO Temperature cut-off threshold inputInput to set maximum allowable batterytemperature.If the potential between TSand SNS is less than the voltage at the TCOinput,then fast charge or top-off charge is ter-minated.TS Temperature sense inputInput,referenced to SNS,for an externalthermister monitoring battery temperature. BAT Battery voltage inputBAT is the battery voltage sense input,refer-enced to SNS.This is created by a high-impedance resistor-divider network con-nected between the positive and the negativeterminals of the battery.SNS Charging current sense inputSNS controls the switching of MOD based onan external sense resistor in the currentpath of the battery.SNS is the reference po-tential for both the TS and BAT pins.IfSNS is connected to V SS,then MOD switcheshigh at the beginning of charge and low atthe end of charge.LED1–LED2Charge status outputsPush-pull outputs indicating chargingstatus.See Table2.Vss GroundV CC V CC supply input5.0V,±10%power input.MOD Charge current control outputMOD is a push-pull output that is used tocontrol the charging current to the battery.MOD switches high to enable charging cur-rent to flow and low to inhibit chargingcurrent flow.DIS Discharge control outputPush-pull output used to control an externaltransistor to discharge the battery beforecharging.INH Charge inhibit inputWhen low,the bq2004E/H suspends allcharge actions,drives all outputs to high im-pedance,and assumes a low-power opera-tional state.When transitioning from low tohigh,a new charge cycle is started.2bq2004E/HFunctional DescriptionFigure2shows a block diagram and Figure3shows a state diagram of the bq2004E/H.Battery Voltage and Temperature MeasurementsBattery voltage and temperature are monitored for maximum allowable values.The voltage presented on the battery sense input,BAT,should represent a two-cell potential for the battery under charge.A resistor-divider ratio of:RB1 RB2=N2- 1is recommended to maintain the battery voltage within the valid range,where N is the number of cells,RB1is the resistor connected to the positive battery terminal, and RB2is the resistor connected to the negative bat-tery terminal.See Figure1.Note:This resistor-divider network input impedance to end-to-end should be at least200kΩand less than1MΩ.A ground-referenced negative temperature coefficient ther-mistor placed in proximity to the battery may be used as a low-cost temperature-to-voltage transducer.The tempera-ture sense voltage input at TS is developed using a resistor-thermistor network between V CC and V SS.See Figure1.Both the BAT and TS inputs are referenced to SNS,so the signals used inside the IC are:V BAT-V SNS=V CELLandV TS-V SNS=V TEMPDischarge-Before-ChargeThe DCMD input is used to command discharge-before-charge via the DIS output.Once activated,DIS becomes active (high) until V CELL falls below V EDV,at which time DIS goes low and a new fast charge cycle begins.The DCMD input is internally pulled up to V CC(its inac-tive state).Leaving the input unconnected,therefore, results in disabling discharge-before-charge.A negative going pulse on DCMD initiates discharge-before-charge at any time regardless of the current state of the bq2004.If DCMD is tied to V SS,discharge-before-charge will be the first step in all newly started charge cycles. Starting A Charge CycleA new charge cycle is started by:1.Application of V CC power.2.V CELL falling through the maximum cell voltage,V MCV where:V MCV= 0.8∗V CC±30mV3.A transition on the INH input from low to high.If DCMD is tied low,a discharge-before-charge will be executed as the first step of the new charge cycle.Oth-erwise,pre-charge qualification testing will be the first step.The battery must be within the configured temperature and voltage limits before fast charging begins.The valid battery voltage range is V EDV<V BAT<V MCV where:V EDV= 0.4∗V CC±30mV3bq2004E/HFigure 1.Voltage and Temperature MonitoringThe valid temperature range is V HTF <V TEMP <V LTF ,where:V LTF = 0.4∗V CC ±30mVV HTF = [(1/3∗V LTF ) + (2/3∗V TCO )]±30mVV TCO is the voltage presented at the TCO input pin,and is configured by the user with a resistor divider between V CC and ground.The allowed range is 0.2to 0.4∗V CC .If the temperature of the battery is out of range,or the voltage is too low ,the chip enters the charge pending state and waits for both conditions to fall within their al-lowed limits.During the charge-pending mode,the IC first applies a top-off charge to the battery .The top-off charge,at the rateof of the fast charge,continues until the fast-charge are met or the top-off time-out period is exceeded.The IC then trickle charges until the fast-charge conditions are met.There is no time limit on the charge pending state;the charger remains in this state as long as the voltage or tempera-ture conditons are outside of the allowed limits.If the voltage is too high,the chip goes to the battery absent state and waits until a new charge cycle is started.Fast charge continues until termination by one or more of the six possible termination conditions:n Delta temperature/delta time (∆T/∆t)n Peak voltage detection (PVD)n Negative delta voltage (-∆V)n Maximum voltage n Maximum temperature nMaximum timePVD and -∆V TerminationThe bq2004E/H samples the voltage at the BAT pin once every 34s.When -∆V termination is selected,if V CELL is lower than any previously measured value by 12mV ±4mV (6mV/cell),fast charge is terminated.When PVD termination is selected,if V CELL is lower than any previ-ously measured value by 6mV ±2mV (3mV/cell),fast charge is terminated.The PVD and -∆V tests are valid in the range 0.4∗V CC <V CELL <0.8∗V CC .4bq2004E/HFigure 2.Block Diagram5VSEL InputVoltage TerminationLow DisabledFloat -∆V HighPVDVoltage SamplingEach sample is an average of voltage measurements.The IC takes 32measurements in PVD mode and 16measurements in -∆V mode.The resulting sample peri-ods (9.17ms and 18.18ms,respectively)filter out har-monics centered around 55Hz and 109Hz.This tech-nique minimizes the effect of any AC line ripple that may feed through the power supply from either 50Hz or 60Hz AC sources.Tolerance on all timing is ±16%.Temperature and Voltage Termination Hold-offA hold-off period occurs at the start of fast charging.During the hold-off period,-∆V and ∆T/∆t termination are disabled.The MOD pin is enabled at a duty cycle of 260µs active for every 1820µs inactive.This modulation results in an average rate 1/8th that of the fast charge rate.This avoids premature termination on the voltage spikes sometimes produced by older batteries when fast-charge current is first applied.Maximum voltage and maximum temperature terminations are not af-fected by the hold-off period.∆T/∆t TerminationThe bq2004E/H samples at the voltage at the TS pin every 34s,and compares it to the value measured two samples earlier.If V TEMP has fallen 16mV ±4mV or more,fast charge is terminated.The ∆T/∆t termination test is valid only when V TCO <V TEMP <V LTF .Temperature SamplingEach sample is an average of 16voltage measurements.The resulting sample period (18.18ms)filters out har-monics around 55Hz.This technique minimizes the ef-fect of any AC line ripple that may feed through the power supply from either 50Hz or 60Hz AC sources.Tol-erance on all timing is ±16%.Maximum Voltage,Temperature,and TimeAnytime V CELL rises above V MCV ,the LEDs go off and cur-rent flow into the battery ceases immediately .If V CELL then falls back below V MCV before t MCV =1.5s ±0.5s,the chip transitions to the Charge Complete state (maximum voltage termination).If V CELL remains above V MCV at the expiration of t MCV ,the bq2004E/H transitions to the Bat-tery Absent state (battery removal).See Figure 3.Maximum temperature termination occurs anytime V TEMP falls below the temperature cutoff threshold V TCO .Charge will also be terminated if V TEMP rises above the low temperature fault threshold,V LTF ,after fast charge begins.Corresponding Fast-ChargeRate TM1TM2Typical Fast-Charge Safety Time (min)Typical PVD, -∆V Hold-Off Time (s)Top-Off RatePulse-Trickle Rate Pulse-Trickle Period (Hz)2004E 2004H 2004E 2004H 2004E 2004H 2004E 2004H2004E2004HC/4C/8Low Low 325650137273Disabled Disabled Disabled C/2C/4Float Low 154325546546Disabled C/51215301C C/2High Low 77154273546Disabled C/5127.5152C 1C Low Float 3977137273Disabled C/512 3.757.54C 2C Float Float 193968137Disabled C/512 1.88 3.75C/2C/4High Float 154325546546C/16C/32C/51215301C C/2Low High 77154273546C/8C/16C/5127.5152C 1C Float High 3977137273C/4C/18C/512 3.757.54C2CHighHigh193968137C/2C/4C/5121.883.75Note:Typical conditions = 25°C,V CC = 5.0V .Table 1.Fast Charge Safety Time/Hold-Off/Top-Off Tablebq2004E/Hbq2004E/HTable 2.bq2004E/H LED Output SummaryNote:Pulse trickle is inhibited in Mode 2.6Maximum charge time is configured using the TM pin. Time settings are available for corresponding charge rates of C/4,C/2,1C,and2C.Maximum time-out termi-nation is enforced on the fast-charge phase,then reset, and enforced again on the top-off phase,if selected. There is no time limit on the trickle-charge phase.Top-off ChargeAn optional top-off charge phase may be selected to follow fast charge termination for the C/2through4C rates.This phase may be necessary on NiMH or other battery chemistries that have a tendency to terminate charge prior to reaching full capacity.With top-off en-abled,charging continues at a reduced rate after fast-charge termination for a period of time equal to 0.235∗the fast-charge safety time(See Table1.)Dur-ing top-off,the MOD pin is enabled at a duty cycle of 260µs active for every1820µs inactive.This modula-tion results in an average rate1/8th that of the fast charge rate.Maximum voltage,time,and temperature are the only termination methods enabled during top-off.Pulse-Trickle ChargePulse-trickle charging may be configured to follow the fast charge and optional top-off charge phases to com-pensate for self-discharge of the battery while it is idle in the charger.In the pulse-trickle mode,MOD is active for260µs of a period specified by the settings of TM1and TM2.See Table1.The resulting trickle-charge rate is C/512. Both pulse trickle and top-off may be disabled by tying TM1and TM2to V SS or by selecting Mode2in the dis-play.Charge Status IndicationCharge status is indicated by the LED1and LED2out-puts.The state of these outputs in the various charge cy-cle phases is given in Table2and illustrated in Figure3.In all cases,if V CELL exceeds the voltage at the MCV pin,both LED1and LED2outputs are held low regard-less of other conditions.Both can be used to directly drive an LED.Charge Current ControlThe bq2004E/H controls charge current through the MOD output pin.The current control circuitry is designed to sup-port implementation of a constant-current switching regulator or to gate an externally regulated current source.When used in switch mode configuration,the nominal regulated current is:I REG= 0.225V/R SNSCharge current is monitored at the SNS input by the voltage drop across a sense resistor,R SNS,between the low side of the battery pack and ground.R SNS is sized to provide the desired fast charge current.If the voltage at the SNS pin is less than V SNSLO,the MOD output is switched high to pass charge current to the battery.When the SNS voltage is greater than V SNSHI,the MOD output is switched low—shutting off charging current to the battery.V SNSLO= 0.04∗V CC±25mVV SNSHI= 0.05∗V CC±25mVWhen used to gate an externally regulated current source,the SNS pin is connected to V SS,and no sense re-sisitor is required.7bq2004E/Hbq2004E/HFigure 3.Charge Algorithm State Diagram8Absolute Maximum RatingsSymbol Parameter Minimum Maximum Unit NotesV CC V CC relative to V SS-0.3+7.0VV T DC voltage applied on any pin ex-cluding V CC relative to V SS-0.3+7.0VT OPR Operating ambient temperature-20+70°C CommercialT STG Storage temperature-55+125°CT SOLDER Soldering temperature-+260°C10 sec max.T BIAS Temperature under bias-40+85°CNote:Permanent device damage may occur if Absolute Maximum Ratings are exceeded.Functional opera-tion should be limited to the Recommended DC Operating Conditions detailed in this data sheet.Expo-sure to conditions beyond the operational limits for extended periods of time may affect device reliability.DC Thresholds(T A=T OPR;V CC±10%)Symbol Parameter Rating Tolerance Unit NotesV SNSHI High threshold at SNS result-ing in MOD = Low0.05*V CC±0.025VV SNSLO Low threshold at SNS result-ing in MOD = High0.04 *V CC±0.010VV LTF Low-temperature fault0.4*V CC±0.030V V TEMP ≥V LTF inhib-its/terminates charge V HTF High-temperature fault(1/3*V LTF) + (2/3*V TCO)±0.030V V TEMP≤V HTF inhibitschargeV EDV End-of-discharge voltage0.4*V CC±0.030V V CELL<V EDV inhibitsfast chargeV MCV Maximum cell voltage0.8*V CC±0.030V V CELL>V MCV inhibits/terminates chargeV THERM TS input change for∆T/∆tdetection-16±4mV V CC= 5V,T A= 25°C-∆V BAT input change for-∆Vdetection-12±4mV V CC= 5V,T A= 25°CPVD BAT input change for PVDdetection-6±2mV V CC= 5V,T A= 25°Cbq2004E/H9Recommended DC Operating Conditions(T A= T OPR)Symbol Condition Minimum Typical Maximum Unit NotesV CC Supply voltage 4.5 5.0 5.5VV BAT Battery input0-V CC VV CELL BAT voltage potential0-V CC V V BAT- V SNSV TS Thermistor input0-V CC VV TEMP TS voltage potential0-V CC V V TS- V SNSV TCO Temperature cutoff0.2*V CC-0.4*V CC V Valid∆T/∆t rangeV IHLogic input high 2.0--V DCMD,INHLogic input high V CC- 0.3--V TM1, TM2, DSEL, VSEL V ILLogic input low--0.8V DCMD,INHLogic input low--0.3V TM1, TM2, DSEL, VSELV OH Logic output high V CC- 0.8--V DIS, MOD, LED1, LED2,I OH≤-10mAV OL Logic output low--0.8V DIS,MOD,LED1,LED2,I OL≤10mAI CC Supply current-13mA Outputs unloadedI SB Standby current--1µA INH= V ILI OH DIS,LED1,LED2,MOD source-10--mA@V OH= V CC- 0.8VI OL DIS,LED1,LED2,MOD sink10--mA@V OL= V SS+ 0.8VI LInput leakage--±1µA INH, BAT, V = V SS to V CC Input leakage50-400µA DCMD, V = V SS to V CCI IL Logic input low source--70µA TM1, TM2, DSEL, VSEL,V = V SS to V SS+ 0.3VI IH Logic input high source-70--µA TM1, TM2, DSEL, VSEL,V = V CC- 0.3V to V CCI IZ Tri-state-2-2µA TM1,TM2,DSEL,and VSEL should be left disconnected (floating)for Z logic input stateNote:All voltages relative to V SS except as noted. bq2004E/H10ImpedanceSymbol Parameter Minimum Typical Maximum Unit R BAT Battery input impedance50--MΩR TS TS input impedance50--MΩR TCO TCO input impedance50--MΩR SNS SNS input impedance50--MΩTiming(T A= 0 to +70°C; V CC±10%)Symbol Parameter Minimum Typical Maximum Unit Notest PW Pulse width for DCMDand INH pulse command 1--µsPulse start for charge or dischargebefore charged FCV Time base variation-16-16%V CC= 4.75V to 5.25Vf REG MOD output regulationfrequency--300kHzt MCV Maximum voltage termi-nation time limit 1-2sTime limit to distinguish battery re-moved from charge complete.Note:Typical is at T A= 25°C,V CC= 5.0V.bq2004E/H1112bq2004E/H16-Pin DIP Narrow (PN)16-Pin PN (0.300" DIP )DimensionInchesMillimeters Min.Max.Min.Max.A 0.1600.180 4.06 4.57A10.0150.0400.38 1.02B 0.0150.0220.380.56B10.0550.065 1.40 1.65C 0.0080.0130.200.33D 0.7400.77018.8019.56E 0.3000.3257.628.26E10.2300.280 5.847.11e 0.3000.3707.629.40G 0.0900.110 2.29 2.79L 0.1150.150 2.92 3.81S0.0200.0400.511.02bq2004E/H 16-Pin SOIC Narrow (SN)16-Pin SN(0.150" SOIC)DimensionInches MillimetersMin.Max.Min.Max.A0.0600.070 1.52 1.78A10.0040.0100.100.25B0.0130.0200.330.51C0.0070.0100.180.25D0.3850.4009.7810.16E0.1500.160 3.81 4.06e0.0450.055 1.14 1.40H0.2250.245 5.72 6.22L0.0150.0350.380.8913bq2004E/HData Sheet Revision HistoryChange No.Page No.Description Nature of ChangeClarification 1All Combined bq2004E and bq2004H,revised andexpanded format of this data sheetClarification 27Separated bq2004E and bq2004H in Table 2,LEDOutput Summary35Description of charge-pending state Clarification4Note:Change 1 = Oct.1997 B changes from Sept.1996 (bq2004E),Feb.1997 (bq2004H).Change 2 = Feb.1998 C changes from Oct.1997 B.Change 3 = Dec.1998 D changes from Feb.1998 C.Change 4 = June 1999 E changes from Dec.1998 D.14bq2004E/H Ordering Informationbq2004Package Option:PN=16-pin narrow plastic DIPSN=16-pin narrow SOICDevice:E=bq2004E Fast-Charge ICH=bq2004H Fast-Charge IC15IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest version of relevant information to verify, before placing orders, that information being relied on is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those pertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO BE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used. TI’s publication of information regarding any third party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。
BS EN 14427-2004中文翻译完整版-12.11.23

英国标准BS EN 14427:2004合并修正案1液化石油气(LPG)用可移动的可再充填式全包装复合气瓶,设计和建造欧洲标准EN 14427: 2004, 纳入合并修正案 A1: 2005, 位同英国标准ICS 23.020.30未经BSI和版权法允许不得抄袭国际前言英国标准EN 14427: 2004包括修正案A1:2005是官方的英语语言版本。
CEN欧洲标准化委员会修正案介绍或更改的文本的开始和结尾地方用a1标记。
根据更改的的标签标号与CEN修正案上的标注一致。
例如,通过CEN修正案A1改变的文本被a1所指出。
技术委员会PVE/19委托英国参与LPG容器和相关的配件的准备阶段,有如下责任:-----帮助询问者理解文本-----给予负责的国际/欧洲的委员会询问者解释,改变方案,保持了解英国利益情况-----与国际和欧洲发展有关的监控器,并在英国发布经秘书处的要求,将提供一个代表委员会组织的列表相互参照在文中提及的国际或欧洲出版的英国标准可能会在英国标准协会目录,题为国际标准对应索引项下找到,或通过搜索英国标准协会电子目录,在线英国标准找到。
这个发表不包括合同里所有的必要条款。
用户应正确的应用。
遵守此英国标准并不意味着免除自身的法律义务。
本英国标准是2004 年 7 月 20 日根据管理局公布标准政策和战略委员会所出版本页摘要此文件包括封页,内封面,EN题目页,2-48页,一个内部回封底和封底。
文献上显示的英国标准协会(BSI)版权日期表明了此文献最近一次发行的时间。
自出版以来修正案的发行修正案编号日期评论16037 2006.3 见国家前言英文版本液化石油气(LPG)用可移动的可再充填式全包装复合气瓶-设计和建造(包括修正案 A1:2005)欧洲标准在2004.3.18被CEN所认证。
修正案A1在2005.11.17被CEN所认证。
欧洲标准化成员有义务遵循欧洲标准化委员会/欧洲电工标准化委员会的内部规定,该规定阐述了在不做任何更改的前提下,给予这一欧洲标准某一国家标准地位的条件。
NEL2004F02-24中文资料

η c (%)
50 40 30 20 1W 4W Pout (dBm) 20 24 28 32 36 38
–25
f1 = 1970 MHz f2 = 1970.1 MHz Class AB, Vcc = 24 V Iq = 40 mA
–30
IM3
Class A, Vcc = 20 V Iq = 250 mA
PARAMETER Collector to Emitter Cutoff Current Collector to Emitter Voltage (Base to Emitter Registor = 10 Ω) Collector to Emitter Voltage (Open Base) Collector to Base Voltage (Open Emitter) Emitter to Base Voltage (Open Collector) DC Forward Current Gain Output Capacitance SYMBOL ICES SPECIFIED CONDITION V CE = 24 V IC = 3 mA, R = 10 Ω MIN. TYP. MAX. 3 UNIT mA
• Low Internal Modulation Distortion • High Reliability Gold Metallization • Emitter Ballasting • 24 V OBASE 3 - COLLECTOR
ABSOLUTE MAXIMUM RATING (TA = 25 ˚C)
PARAMETER Collector to Base Voltage Collector to Emitter Voltage Emitter to Base Voltage Collector to Emitter Voltage Collector Current Power Dissipation Thermal Resistance Junction Temperature Storage Temperature SYMBOL VCBO VCER VEBO VCEO IC PT Rth(j-c) Tj Tstg R = 10 Ω SPECIFIED CONDITION RATINGS 45 30 3 18 1.5 19.4 9 200 –65 to 150 UNIT V V V V A W ˚C/W ˚C ˚C
EL-USB-4;中文规格书,Datasheet资料

FEATURESORDERING INFORMATIONStock Number Standard Data LoggerEL-USB-4(Data Logger,Measurement Leads,Software on CD and Battery)Replacement BatteryBAT 3V6LASCAR ELECTRONICS L TD.MODULE HOUSE WHITEP ARISHWIL TSHIRE SP52SJ UKTEL:+44(1794)884567FAX:+44(1794)884616E-mail:sales@lascar LASCAR ELECTRONICS (HK)LIMITED FLAT C,5/FL.,LUCKY FTY .BLDG.63-65HUNG TO ROAD KWUN TONG KOWLOON HONG KONGTEL:+852********FAX:+852********E-mail:b4lascar@LASCAR ELECTRONICS INC.3750West 26th Street ErieP A 16506USATEL:+1(814)8350621FAX:+1(814)8388141E-mail:us-sales@ •4-20mA d.c.Current Loop Measurement Range Logging Rates between 1s and 12hr Stores 32,000readingsConnection via two screw terminalsUSB Interface for Set-up and Data Download User-Programmable Alarm Thresholds Red and Green LED Status Indication Replaceable Internal Lithium BatterySpecifications liable to change without prior warning EL-USB-4Issue 1July/2005M.C.Applies to EL-USB-4/1This data logger measures and stores up to 32,000current loop readings over a 4-20mA d.c.measurement range.The user can easily set up the logging rate and start time,and download the stored data by plugging the module straight into a PC's USB port and running the purpose designed software under Windows 98,2000or XP .The data can then be graphed,printed and exported to other applications.The data logger is supplied complete with a long-life lithium battery .Correct functioning of the unit is indicated by a flashing red and green LED.The data logger features a pair of screw terminals and is is supplied complete with a set of measurement leads terminating in crocodile clips.WINDOWS CONTROL SOFTWAREEasy to install and use,the control software runs under Windows 98,2000and XP (Home and Professional Editions).It allows the user to set up and download any EL-USB-4.DATA LOGGER SET -UPSLogger NameLogging Rate (1s,10s,1m,5m,30m,1hr ,6hr ,12hr) High and Low Alarms Start Date and Start Time*depending on ambient temperature,logging rate and use of alarm LEDs.PO Box 770, Londonderry, NH 03053 BATTERY REPLACEMENTrecommend that you replace the battery every 12months,or prior EL-USB-44-20mA Current Loop USB Data Loggerprior warningEL-USB-4Issue 1July/2005M.C.Applies to EL-USB-4/1PO Box 770, Londonderry, NH 03053 1-800-821-0023分销商库存信息: MARTEL-ELECTRONICS EL-USB-4。
德国可再生能源法 2004 中文版

联邦法律公报2004年度第1部分第40号,2004年7月31日于波恩公布关于重新调整电力领域可再生能源法的法律12004年7月21日联邦议会通过了以下法律:第一部分可再生能源优先法(可再生能源法—EEG)第1条法律目的(1) 为了实现能源供应的可持续发展,在同时兼顾长期外部效应的前提下减少能源供应的国民经济成本,保护自然和环境,为避免围绕化石能源可能发生的冲突作出贡献,进一步推动可再生能源发电技术的利用和开发,特以保护气候、自然和环境为宗旨,制定本法。
(2) 此外,制定本法旨在促进提高可再生能源在电力供应中所占的比重,至2010年至少提高到12.5%,至2020年至少提高到20%。
1制定本法旨在实施欧洲议会和欧洲理事会于2001年9月27日颁布的关于在欧盟内部电力市场促进利用可再生能源发电的第2001/77/EG号指令(欧洲共同体公报「ABl. EG」第 L 283号, 第 33页),最近一次修改见2003年4月16日的欧盟入盟文件(欧盟公报「ABl. EU」第 L 236, 第 586页)。
第2条适用范围(1) 依本法规定,1.凡属联邦领域包括德国专属经济区(法律效力范围)内利用可再生能源和矿井废气从事生产的发电设施,优先并入公共供电网,2.电网经营商优先接收和输送这些电力并支付电价,3.在联邦范围内对收购上网的电量进行平衡。
(2) 凡属25%以上归德意志联邦共和国或某一个联邦州所有且在2004年7月31日前已投入运营的发电设施,不适用本法。
第3条概念界定(1) 可再生能源,是指水力包括波浪能、潮汐能、盐度差能和海流能,风能,日辐射能,地热能,生物质能包括沼气、垃圾填埋场气体和污水净化气体以及生活垃圾和工业废料中可生物降解部分产生的能量。
(2) 发电设施,是指任何利用可再生能源或矿井废气发电的独立技术设施。
多个利用同样种类的可再生能源或矿井废气进行生产的发电设施,若是在本法效力范围内建立且与运营必需的共用技术设备或建筑设施直接相连的,被视为一套设施,如果本法第6条至第12条未作出有其它的规定。
EN10204-2004中文版

“) type 2.1 ”
生产厂声明其供应的产品符合合同的要求(不包括试验结果)的文件。
3.2 试验报告“ 2.2”( Test report “ typ)e 2.2
生产厂声明其供应的产品符合合同的要求的文件,且文件中提供基于非规定检验的试
验结果。
4 基于规定检验的检验文件
4.1 检验证明书 3.1( Inspection certificate 3.1
界限范围内其与指令的基本要求和
EFTA 条例相一致,则本标准条款与之的一致性见表
ZA.1 。
表 ZA.1 本标准与指令 97/23/EC 的一致性
本标准条款
指令 97/23/EC 的基本要求
资格说明
3和 4
附录 I 的 4.3
承压设备用材料的不同类型的检验文件的应用见图
ZA.1 。 注:指令 97/23/EC 的术语“规定产品控制证明书” 和本标准中的术语 “基于规定检验的检验文件” 是等
—3—
EN 10204:2004
附录 A (提示性) 检验文件概览
检验文件概览见表 A.1 。
表 A.1—检验文件概览
EN 10204 涉 及的内容
2.1 类
英文版 与合同的一 致性声明
检验文件类型名称 德文版
法文版
2.2 类
试验报告
3.1 类
检验证明书 3.1
3.2 类
检验证明书 3.2
检验文件的内容
—4—
EN 10204:2004
附录 ZA (提示性)
欧洲标准和 EU 指令 97/23/EC 基本要求的关系
பைடு நூலகம்
本标准是欧洲委员会授权 CEN 制定的,目的是提供一种方式使其与欧洲议会新批准的
A2004中文资料

NOTE: For detailed information on purchasing options, contact your local Allegro field applications engineer or sales representative.Allegro MicroSystems, Inc. reserves the right to make, from time to time, revisions to the anticipated product life cycle plan for a product to accommodate changes in production capabilities, alternative product availabilities, or market demand. The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsibility for its use; nor for any infringements of patents or other rights of third parties which may result from its use.Recommended Substitutions:High Voltage High Current Darlington ArraysA2003, A2004, A2023, A2024Date of status change: May 2, 2005Deadline for receipt of LAST TIME BUY orders: October 28, 2005These parts are in production but have been determined to be LAST TIME BUY . This classification indicates that the product is obsolete and notice has been given. Sale of this device is currently restricted to existing customer applications. The device should not be purchased for new design applications because of obsolescence in the near future. Samples are no longer st Time Buy2003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENT DARLINGTON ARRAYSTest ApplicableLimits Characteristic Symbol Fig.DevicesTest Conditions Min.Typ.Max.Units Output Leakage CurrentI CEX1AA llV CE = 50 V, T A = 25°C —< 150µA V CE = 50 V, T A = 70°C—< 1100µA 1BULN2004A/LV CE = 50 V, T A = 70°C, V IN = 1.0 V—< 5500µA Collector-EmitterV CE(SAT)2A llI C = 100 mA, I B = 250 µA—0.9 1.1V Saturation Voltagel C = 200 mA, I B = 350 µA— 1.1 1.3V I C = 350 mA, I B = 500 µA— 1.3 1.6V Input CurrentI IN(ON)3ULN2003A/LV IN = 3.85 V —0.93 1.35mA ULN2004A/LV IN = 5.0 V —0.350.5mA V IN = 12 V— 1.0 1.45mA I IN(OFF)4A ll l C = 500 µA, T A = 70°C5065—µA Input VoltageV IN(ON)5ULN2003A/LV CE = 2.0 V, l C = 200 mA—— 2.4V V CE = 2.0 V, I C = 250 mA—— 2.7V V CE = 2.0 V, l C = 300 mA—— 3.0V ULN2004A/LV CE = 2.0 V, l C = 125 mA—— 5.0V V CE = 2.0 V, l C = 200 mA—— 6.0V V CE = 2.0 V, I C = 275 mA——7.0V V CE = 2.0 V, l C = 350 mA——8.0V Input Capacitance C IN —A ll —1525pF Turn-On Delay t PLH 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Turn-Off Delay t PHL 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Clamp DiodeI R 6A ll V R = 50 V, T A = 25°C ——50µA Leakage Current V R = 50 V, T A = 70°C——100µA Clamp Diode V F7AllI F = 350 mA—1.72.0VForward VoltageComplete part number includes suffix to identify package style: A = DIP, L = SOIC.Types ULN2003A, ULN2003L, ULN2004A, and ULN2004L ELECTRICAL CHARACTERISTICS at +25°C (unless otherwise noted).2003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENTDARLINGTON ARRAYS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Test Applicable LimitsCharacteristic Symbol Fig.DevicesTest ConditionsMin.Typ.Max.Units Output Leakage CurrentI CEX1AA ll V CE = 95 V, T A = 25°C—< 150µA V CE = 95 V, T A = 70°C—< 1100µA 1BULN2024A/LV CE = 95 V, T A = 70°C, V IN = 1.0 V—< 5500µA Collector-EmitterV CE(SAT)2A llI C = 100 mA, I B = 250 µA—0.9 1.1V Saturation Voltagel C = 200 mA, I B = 350 µA— 1.1 1.3V I C = 350 mA, I B = 500 µA— 1.3 1.6V Input CurrentI IN(ON)3ULN2023A/LV IN = 3.85 V —0.93 1.35mA ULN2024A/LV IN = 5.0 V —0.350.5mA V IN = 12 V— 1.0 1.45mA I IN(OFF)4A ll l C = 500 µA, T A = 70°C5065—µA Input VoltageV IN(ON)5ULN2023A/LV CE = 2.0 V, l C = 200 mA—— 2.4V V CE = 2.0 V, I C = 250 mA—— 2.7V V CE = 2.0 V, l C = 300 mA—— 3.0V ULN2024A/LV CE = 2.0 V, l C = 125 mA—— 5.0V V CE = 2.0 V, l C = 200 mA—— 6.0V V CE = 2.0 V, I C = 275 mA——7.0V V CE = 2.0 V, l C = 350 mA——8.0V Input Capacitance C IN —A ll —1525pF Turn-On Delay t PLH 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Turn-Off Delay t PHL 8All 0.5 E IN to 0.5 E OUT —0.25 1.0µs Clamp DiodeI R 6A ll V R = 95 V, T A = 25°C ——50µA Leakage Current V R = 95 V, T A = 70°C——100µA Clamp Diode V F7A llI F = 350 mA—1.72.0VForward VoltageComplete part number includes suffix to identify package style: A = DIP, L = SOIC.Types ULN2023A, ULN2023L, ULN2024A, and ULN2024LELECTRICAL CHARACTERISTICS at +25°C (unless otherwise noted).115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000Dwg. GP-067COLLECTOR-EMITTER SATURATION VOLTAGE Dwg. GP-068INPUT CURRENT IN µA2003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENTDARLINGTON ARRAYS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000PACKAGE DESIGNATOR “A”Dimensions in Inches (controlling dimensions)Dimension in Millimeters (for reference only)NOTES:1.Leads 1, 8, 9, and 16 may be half leads at vendor’s option.2.Lead thickness is measured at seating plane or below.3.Lead spacing tolerance is non-cumulative.4.Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-001-16A mm18Dwg. MA-001-16A in182003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENT DARLINGTON ARRAYSPACKAGE DESIGNATOR “L”Dimensions in Inches (for reference only)Dimension in Millimeters (controlling dimensions)NOTES:1.Lead spacing tolerance is non-cumulative.2.Exact body and lead configuration at vendor’s option within limits shown.Dwg. MA-007-16A mm169Dwg. MA-007-16 in1692003 THRU 2024HIGH-VOLTAGE,HIGH-CURRENTDARLINGTON ARRAYS115 Northeast Cutoff, Box 15036Worcester, Massachusetts 01615-0036 (508) 853-5000The products described here are manufactured under one or more U.S. patents or U.S. patents pending.Allegro MicroSystems, Inc. reserves the right to make, from time to time, such departures from the detail specifications as may be required to permit improvements in the performance, reliability, ormanufacturability of its products. Before placing an order, the user is cautioned to verify that the information being relied upon is current.Allegro products are not authorized for use as critical components in life-support devices or systems without express written approval.The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, Inc. assumes no responsi-bility for its use; nor for any infringement of patents or other rights of third parties which may result from its use.元器件交易网。
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EL2004 EL2004CNovember1993RevG Note All information contained in this data sheet has been carefully checked and is believed to be accurate as of the date of publication however this data sheet cannot be a‘‘controlled document’’ Current revisions if any to these specifications are maintained at the factory and are available upon your request We recommend checking the revision level before finalization of your design documentation Patent pending1989Elantec IncFeaturesSlew rate 2500V m sRise time 1nsBandwidth 350MHzELH0033 pin compatibleg5to g15V operation100mA output currentMIL-STD-883B Rev C devicesmanufactured in U S AApplicationsCoaxial cable driverFast op amp boosterFlash converter driverVideo line driverHigh-speed sample and holdPulse transformer driverA T E pin driverOrdering InformationPart No Temp Range Package OutlineEL2004CG b25 C to a85 C TO-8MDP0002EL2004G b55 C to a125 C TO-8MDP0002EL2004L b55 C to a125 C52-Pad LCC MDP0013EL2004L MIL b55 C to a125 C52-Pad LCC MDP00135962-89659is the SMD version of this deviceConnection DiagramCase is Electrically Isolated2004–1Top ViewGeneral DescriptionThe EL2004is a very high-speed FET input buffer line driverdesigned for unity gain applications at both high current(up to100mA)and at frequencies up to350MHz The2500V m s slewrate and wide bandwidth ensures the stability of the circuitwhen the EL2004is used inside op amp feedback loopsApplications for the EL2004include line drivers video bufferswideband instrumentation and high-speed drivers for inductiveand capacitive loads The performance of the EL2004makes itan ideal buffer for video applications including input buffers forflash A D converters and output buffers for video DACs Itsexcellent phase linearity is particularly advantageous in digitalsignal processing applicationsElantec facilities comply with MIL-I-45208A and are MIL-STD-1772certified Elantec’s Military devices comply withMIL-STD-883B Revision C and are manufactured in our rigidlycontrolled ultra-clean facilities in Milpitas California For ad-ditional information on Elantec’s Quality and Reliability Assur-ance Policy and procedures request brochure QRA-1Simplified Schematic2004–32T D i s 3 2 i n34T D i s 2 7 i n T D i s 3 4 i nAC Test Circuit2004–4Typical Performance CurvesDissipationMaximum Power TO-82004–5Gain vs Input VoltageOutput CurrentOutput Resistance vs2004–75Typical Performance Curves ContdTemperatureRise Time vs ResponseSmall Signal Pulse ResponseLarge Signal Pulse Frequency ResponseVoltageOffset Voltage vs Supply Warm-upCurrent During Normalized Input Bias Supply Voltage Supply Current vs Supply VoltageOutput Voltage vs 2004–86Applications InformationThe EL2004is one member of a family of high performance buffers manufactured by Elantec The2004is optimized for speed while others offer choices of input DC parameters or output drive or cost The following table illustrates those members available at the time of this printing Consult the factory for the latest capabilities in this developing lineElantec’s Buffer FamilySlewBandwidth Input Peak RisePart RateMHz Current I OUT TimeV m s(Warm)mA nsELH0002200506m A4007 ELH003315001002 5nA2502 9 EL200425003502 5nA2501 0 EL200515001400 1nA2502 5Recommended Layout PrecautionsThe very high-speed performance of the EL2004 can only be realized by taking certain precau-tions in circuit layout and power supply decou-pling Low inductance ceramic chip or disc power supply decoupling capacitors of0 1m F or more should be connected with the shortest practical lead lengths between the device supply leads and a ground plane In addition it can be helpful to parallel these with4 7m F electrolytics(Tanta-lum preferred) Failure to follow these precau-tions can result in oscillationCircuit OperationThe EL2004is effectively an ideal unity gain am-plifier with almost infinite input impedance and about6X output impedanceInput CharacteristicsThe input impedance of a junction FET is a strong function of temperature and input volt-age Nominal input resistance of EL2004is1012 at25 C junction but as I B doubles every11 C in the JFET the input resistance falls Duringwarm-up self-heating raises the junction temper-ature up to60 C or more(without heatsink)so operating I B will be much higher than the data sheet25 C specificationAnother factor which can increase bias current is input voltage If the input voltage is more than 20V below the positive supply the input current rises exponentially (See Curve )Input Bias Current vsTemperatureInput VoltageInput Bias Current vs2004–9 In applications such as sample and hold circuits where it is important to maintain low input bias current over input voltage range the EL2005 High Accuracy Fast Buffer is recommendedThe input capacitance of EL2004comprises the FET device gate-to-source capacitance(which isa function of input voltage)and stray capaci-tance to the case Effective input capacitance can be minimized by connecting the case to the out-put since it is electrically isolated Or for reduced radiation the case may be grounded The AC characteristics specified in this data sheet were obtained with the case floatingOffset Voltage AdjustmentThe EL2004’s offset voltages have been actively laser trimmed at g15V supplies to meet specified limits when the offset adjust pin is shorted to the offset preset pin If external offset null is re-quired the offset adjust pin should be connected to a200X trim pot connected to the negative sup-ply7Circuit Operation ContdOffset Zero Adjust2004–10Capacitive LoadingThe EL2004is designed to drive capacitive loadsup to several thousand picofarads without oscil-lation However peak current resulting fromcharging currents on fast edges should be limitedbelow the absolute maximum peak current ratingof250mA In some cases it may be necessary toemploy one of the current limit schemes shownbelowShort Circuit ProtectionDynamic response of the EL2004was preservedby excluding current limit circuits which are notneeded in most applications However in situa-tions where operating conditions are not con-trolled short circuit protection can be added byinserting resistors between the output device col-lectors and supplies as illustratedUsing ResistorCurrent Limiting2004–11Suitable resistor values can be calculated as fol-lowsR SC eV aI SCeV bI SCwhere I SC s100mA for EL2004Current LimitingUsing Current Sources2004–12The inclusion of limiting resistors in the collec-tors of the output devices will reduce the outputvoltage swing and speed Decoupling V C a andV C b pins with capacitors to ground will retainfull output swing for transient pulsesAn alternate active current limit technique thatretains full DC output swing is shown aboveHere the current sources are saturated duringnormal operation thus applying full supply volt-age to the V C pins Under fault conditions thevoltage decreases as the current source reaches itslimitR LIM eV BEI SCe0 6V100mAe6XPower SuppliesThe EL2004has been characterized for both g15and g5V dual supply operation but other combi-nations can also be useful For example in manyvideo applications it is only necessary for the out-put to swing g2V or less but speed and distor-tion are important In this situation the inputstage can be operated at the full g15V supplywhile the output collectors are returned to g5VThe speed and distortion will be almost as goodas if the whole circuit was operating at g15Vbut the dissipation is substantially reduced andhigher load currents can be safely accommodat-ed8Circuit Operation ContdIncreasing Operating Voltageand Reducing Thermal TailWhen driving heavy loads the changing dissipa-tion in the output transistors can sometimescause temperature gradients in the circuit whichcause a shift in offset voltage and the phenome-non known as‘‘thermal tail’’ Bootstrapping theoutput as illustrated substantially reduces thepower in the output transistors and mitigates theeffectHigh Voltage Inputs can be Accommodatedwith Bootstrapped Supplies2004–13HardwareIn order to utilize the full drive capabilities of theEL2004 it should be mounted with a heatsinkparticularly for extended temperature operationSuitable heatsinks include Thermalloy2240A(33 C W) Wakefield215CB(30 C W)andIERC-UP-TO-848CB(15 C W)The case is isolated from the circuit and may beconnected to system chassis Sockets are not rec-ommended as they add substantial inductanceand capacitance which impair the performance ofthe device However for test purposes they areunavoidable and precautions such as shielding in-put from output are suggestedGeneral Application SuggestionsVideo DAC BufferMany of the available video D to A convertersare unable to directly drive50X or75X cablesThe EL2004’s excellent phase linearity at videofrequencies make it an ideal solution In criticalapplications or where line termination is not con-trolled a matching pad should be used as shownThe capacitor should be adjusted for optimumpulse response If properly layed out this circuitwill not overshootVideo DAC Buffer2004–14Impedance MatchingThe EL2004provides power gain and isolationbetween source and load when used as an activetap or impedance matching device as illustratedhere In this example there is no output match-ing pad between the2004and the75X line Suchmatching is not needed when the distant end ofthe cable is properly terminated as there is noreflected signal to worry about and the2004iso-lates the source This technique allows the fulloutput voltage of the EL2004to be applied to theloadImpedance Converter2004–159General Application Suggestions ContdInverting Amplifier for 20MHz Flash Converter2004–16Boosting the OutputUnlike most integrated cicuits two or more EL2004’s can be paralleled for increased output drive This capability results from the finite out-put resistance and low output mismatch of theEL2004 For example a 50X cable driver with g 10V capability can be made by using two EL2004’s A short-circuit protected version is shown below50X Cable Driver with Short Circuit ProtectionNPN e 2N6551(PNP e 2N6554or equivalent 2W devices2004–1710Burn-In Circuit2004–18Pin numbers are for TO-8packageLCC uses the same schematic11EL2004MacromodelConnections inputl V al l Vc al l l V bl l l l Vc bl l l l l outputl l l l l lsubckt M2004512110911Modelsmodel qn npn(is e5e b14bf e150vaf e100rc e1rb e5re e1ikf e200mAa cje e5pF cjc e5pF mje e 42mjc e 23tf e 3nS tr e200nS br e5vtf e0)model qp pnp(is e5e b14bf e150vaf e100rc e2rb e3re e1ikf e100mAa cje e5 7pF cjc e4pF tf e 3nS mje e 32mjc e 43tr e170nS br e5vtf e0)model qf njf(vto eb3V beta e4 0e b3cgd e4pF cgs e10pF lambda e671 0e b6) Resistorsr1202158 33r2271058 33r322112r411232Transistorsj112520qfj4241026qfq2212125qnq3242425qpq512122qnq692423qpq7262627qnends12TAB WIDET Dis38inEL2004Macromodel Contd2004–1913KNALB14KNALB15E L 2004 N o v e m b e r 1993R e v GGeneral DisclaimerSpecifications contained in this data sheet are in effect as of the publication date shown Elantec Inc reserves the right to make changes in the circuitry or specifications contained herein at any time without notice Elantec Inc assumes no responsibility for the use of any circuits described herein and makes no representations that they are free from patent infringementElantec Inc 1996Tarob Court Milpitas CA 95035Telephone (408)945-1323(800)333-6314Fax (408)945-9305European Office 44-71-482-4596WARNING Life Support PolicyElantec Inc products are not authorized for and should not be used within Life Support Systems without the specific written consent of Elantec Inc Life Support systems are equipment in-tended to support or sustain life and whose failure to perform when properly used in accordance with instructions provided can be reasonably expected to result in significant personal injury or death Users contemplating application of Elantec Inc products in Life Support Systems are requested to contact Elantec Inc factory headquarters to establish suitable terms conditions for these applications Elantec Inc ’s warranty is limited to replace-ment of defective components and does not cover injury to per-sons or property or other consequential damagesPrinted in U S A16。