Debug常见缺陷中英文对照表
常见c语言错误中英文对照表
1. Ambiguous operators need parentheses — 不明确的运算需要用括号括起2. Ambiguous symbol 'xxx' — 不明确的符号3. Argument list syntax error — 参数表语法错误4. Array bounds missing — 丢失数组界限符5. Array size toolarge — 数组尺寸太大6. Bad character in paramenters — 参数中有不适当的字符7. Bad file name format in include directive — 包含命令中文件名格式不正确8. Bad ifdef directive synatax — 编译预处理ifdef有语法错9. Bad undef directive syntax — 编译预处理undef有语法错10. Bit field too large — 位字段太长11. Call of non-function — 调用未定义的函数12. Call to function with no prototype — 调用函数时没有函数的说明13. Cannot modify a const object — 不允许修改常量对象14. Case outside of switch — 漏掉了case 语句15. Case syntax error — Case 语法错误16. Code has no effect — 代码不可能执行到17. Compound statement missing{ — 分程序漏掉"{"18. Conflicting type modifiers — 不明确的类型说明符19. Constant expression required — 要求常量表达式20. Constant out of range in comparison — 在比较中常量超出范围21. Conversion may lose significant digits — 转换时会丢失意义的数字22. Conversion of near pointer not allowed — 不允许转换近指针23. Could not find file 'xxx' — 找不到XXX文件24. Declaration missing ; — 说明缺少"；"25. Declaration syntax error — 说明中出现语法错误26. Default outside of switch — Default 出现在switch语句之外27. Define directive needs an identifier — 定义编译预处理需要标识符28. Division by zero — 用零作除数29. Do statement must have while — Do-while语句中缺少while部分30. Enum syntax error — 枚举类型语法错误31. Enumeration constant syntax error — 枚举常数语法错误32. Error directive :xxx — 错误的编译预处理命令33. Error writing output file — 写输出文件错误34. Expression syntax error — 表达式语法错误35. Extra parameter in call — 调用时出现多余错误36. File name too long — 文件名太长37. Function call missing ) — 函数调用缺少右括号38. Fuction definition out of place — 函数定义位置错误39. Fuction should return a value — 函数必需返回一个值40. Goto statement missing label — Goto语句没有标号41. Hexadecimal or octal constant too large — 16进制或8进制常数太大42. Illegal character 'x' — 非法字符x43. Illegal initialization — 非法的初始化44. Illegal octal digit — 非法的8进制数字45. Illegal pointer subtraction — 非法的指针相减46. Illegal structure operation — 非法的结构体操作47. Illegal use of floating point — 非法的浮点运算48. Illegal use of pointer — 指针使用非法49. Improper use of a typedefsymbol — 类型定义符号使用不恰当50. In-line assembly not allowed — 不允许使用行间汇编51. Incompatible storage class — 存储类别不相容52. Incompatible type conversion — 不相容的类型转换53. Incorrect number format — 错误的数据格式54. Incorrect use of default — Default使用不当55. Invalid indirection — 无效的间接运算56. Invalid pointer addition — 指针相加无效57. Irreducible expression tree — 无法执行的表达式运算58. Lvalue required — 需要逻辑值0或非0值59. Macro argument syntax error — 宏参数语法错误60. Macro expansion too long — 宏的扩展以后太长61. Mismatched number of parameters in definition — 定义中参数个数不匹配62. Misplaced break — 此处不应出现break语句63. Misplaced continue — 此处不应出现continue语句64. Misplaced decimal point — 此处不应出现小数点65. Misplaced elif directive — 不应编译预处理elif66. Misplaced else — 此处不应出现else67. Misplaced else directive — 此处不应出现编译预处理else68. Misplaced endif directive — 此处不应出现编译预处理endif69. Must be addressable — 必须是可以编址的70. Must take address of memory location — 必须存储定位的地址71. No declaration for function 'xxx' — 没有函数xxx的说明72. No stack — 缺少堆栈73. No type information — 没有类型信息74. Non-portable pointer assignment — 不可移动的指针（地址常数）赋值75. Non-portable pointer comparison — 不可移动的指针（地址常数）比较76. Non-portable pointer conversion — 不可移动的指针（地址常数）转换77. Not a valid expression format type — 不合法的表达式格式78. Not an allowed type — 不允许使用的类型79. Numeric constant too large — 数值常太大80. Out of memory — 内存不够用81. Parameter 'xxx' is never used — 能数xxx没有用到82. Pointer required on left side of -> — 符号->的左边必须是指针83. Possible use of 'xxx' before definition — 在定义之前就使用了xxx（警告）84. Possibly incorrect assignment — 赋值可能不正确85. Redeclaration of 'xxx' — 重复定义了xxx86. Redefinition of 'xxx' is not identical — xxx的两次定义不一致87. Register allocation failure — 寄存器定址失败88. Repeat count needs an lvalue — 重复计数需要逻辑值89. Size of structure or array not known — 结构体或数给大小不确定90. Statement missing ; — 语句后缺少"；"91. Structure or union syntax error — 结构体或联合体语法错误92. Structure size too large — 结构体尺寸太大93. Sub scripting missing ] — 下标缺少右方括号94. Superfluous & with function or array — 函数或数组中有多余的"&"95. Suspicious pointer conversion — 可疑的指针转换96. Symbol limit exceeded — 符号超限97. Too few parameters in call — 函数调用时的实参少于函数的参数不98. Too many default cases — Default太多(switch语句中一个)99. Too many error or warning messages — 错误或警告信息太多100. Too many type in declaration — 说明中类型太多101. Too much auto memory in function — 函数用到的局部存储太多102. Too much global data defined in file — 文件中全局数据太多103. Two consecutive dots — 两个连续的句点104. Type mismatch in parameter xxx — 参数xxx类型不匹配105. Type mismatch in redeclaration of 'xxx' — xxx重定义的类型不匹配106. Unable to create output file 'xxx' — 无法建立输出文件xxx107. Unable to open include file 'xxx' — 无法打开被包含的文件xxx 108. Unable to open input file 'xxx' — 无法打开输入文件xxx109. Undefined label 'xxx' — 没有定义的标号xxx110. Undefined structure 'xxx' — 没有定义的结构xxx111. Undefined symbol 'xxx' — 没有定义的符号xxx112. Unexpected end of file in comment started on line xxx — 从xxx行开始的注解尚未结束文件不能结束113. Unexpected end of file in conditional started on line xxx — 从xxx 开始的条件语句尚未结束文件不能结束114. Unknown assemble instruction — 未知的汇编结构115. Unknown option — 未知的操作116. Unknown preprocessor directive: 'xxx' — 不认识的预处理命令xxx117. Unreachable code — 无路可达的代码118. Unterminated string or character constant — 字符串缺少引号119. User break — 用户强行中断了程序120. Void functions may not return a value — Void类型的函数不应有返回值121. Wrong number of arguments — 调用函数的参数数目错122. 'xxx' not an argument — xxx不是参数123. 'xxx' not part of structure — xxx不是结构体的一部分124. xxx statement missing ( — xxx语句缺少左括号125. xxx statement missing ) — xxx语句缺少右括号126. xxx statement missing ; — xxx缺少分号127. xxx' declared but never used — 说明了xxx但没有使用128. xxx' is assigned a value which is never used — 给xxx赋了值但未用过。
缺陷术语
Categories of DefectCategories of defect depends on experience of maintenance practic e.In this manual,the defaultMethod used to categorize the defect found on the aircraft into fou r areas.Structure defect,Material defect,Common parts and Compo nents defect and General defect.缺陷分类缺陷的分类一般依照维修实践中的经验来分。
在本手册中，我们将缺陷分为四类：结构缺陷、材料缺陷、零部件缺陷和一般性缺陷。
mon Structure Defects Terms结构缺陷术语凹坑（1）dent凹槽（2）notch变形（3）deform划痕（4）nick点腐蚀（5）pitting断裂（6）broken腐蚀（7）corrode划伤（8）scratch裂纹（9）crack毛刺（10）butt磨损（11）chafe凸起（12）protrude凹陷（13）sag粗糙（14）rough漆层剥落（15）finish missing褪色（16）fade积水（17）entrapped watermon material defect terms材料缺陷术语Material is divided in two categories:metallic and non-metallic.材料分为两类：金属材料及非金属材料1）Common metallic defect:一般性金属材料缺陷：氧化（18）oxidize划伤（8）scratch扭曲（19）distort跷起（20）not in contour穿孔（21）puncture碎屑（22）chip腐蚀（7）corrode磨损（11）chafe变形（3）deform风蚀/风化（23）erode裂纹（9）crack2)Common non-metallic defect:一般性非金属材料缺陷：发霉（24）mildew分层（25）delaminate风蚀/风化（23）erode裂纹（9）crack老化（26）deteriorate起皱（27）wrinkle受潮（28）saturated撕裂（29）tear穿孔（21）puncture变色（16）fade陈旧（30）worn脱胶（31）adheremon part component defect terms设备及零部件缺陷术语Common part and component including:Plumbing,Wiring,Mechanical linkage,Fastener and Miscellaneous.设备及零部件分为：管路、线路、传动机构、紧固件及其他。
缺陷中英文对照
劃形狀 皮 薄的
裂片 細小
弄髒
布類玩具
沾污
焊錫 溶劑 穩定 編法
poor embroidery poor hair inter-lock stitching poor hair style poor heat sticking poor hot melting poor hot stamp poor hot stamping poor lock stitching poor booted hair poor sewing poor silk-screening poor sketching poor stitch poor stuffing pucker ribbon fray rough surface scratch mark screw burst screw came off screw rust screw unfasten seam allowance expose seam open sewing label loosen sewing machinery mark stitching hole stuffing disproportion stuffing expose/cotton expose stuffing expose the eyes can't move smoothly thread trapped by seam under glue uneven shape uneven stuffing untrimmed thread use unmatched swatches in one boll white powder on body velcro come off/magic tape come off velcro detach velcro position too hight/low water stain mark wrong assembly wrong/missing part
C语言常见错误中英文对照表
fａtａｌeｒrorC１0０3： ｅｒror coｕnｔeｘｃｅeｄｓnｕmber；sｔopｐｉng compｉlaｔion
中文对照：错误太多,停止编译
分析:修改之前的错误,再次编译
fataｌerrorC100４:uｎｅxpｅcted enｄof file fouｎd
中文对照：文件未结束
中文对照：缺少函数标题(是否是老式的形式表？）
分析：函数定义不正确，函数首部的“（）"后多了分号或者采用了老式的C语言的形参表
errorC2４５０: switch exｐressｉonｏf type＇xxx’ｉs iｌlegaｌ
中文对照：ｓwitｃｈ表达式为非法的ｘxｘ类型
分析：switch表达式类型应为int或chａｒ
errorC2０2１: expｅcted exponｅnｔvaｌue，noｔ’chaｒacter'
中文对照：期待指数值,不能是字符
分析：一般是浮点数的指数表示形式有误,例如１23。456E
errorC203９：’iｄentｉfiｅr1':ｉs noｔa meｍberof ’idenifiｅr2＇
中文对照:标识符1不是标识符的成员
中文对照：下标未知
分析：一般是定义二维数组时未指定第二维的长度，例如“ｉｎｔａ[3］[];”
ｅrｒorC2１00:illegal indirectioｎ
中文对照：非法的间接访问运算符“＊”
分析：对非指针变量使用“＊”运算
ｅｒrorC2１05: ’operaｔor’neｅds l-value
中文对照:操作符需要左值
中文对照：常量中创建新行
分析：字符串常量多行书写
errorC2006:＃ｉncludeｅｘpｅｃtｅd a fiｌｅｎamｅ，ｆｏund'ｉdｅｎtifier’
不良中英文对照表
不良现象中英文对照表1.缺件(missing parts)2.错件(wrong parts)3.多件(excessive parts)4.短路(short)5.断路(open)6.线短(wire short)7.线长(wire long)8.拐线(wire poor ddress)9.冷焊(cold solder)10.包焊(excess solder)11.空焊(missing solder)12.锡尖(solder icicle)13.锡渣(solder splash)14.锡裂(soder crack)15.锡洞(pin hole)16.锡球(solder ball)17.锡桥(solder bridge)18.滑牙(screw loose)19.氧化(rust)20.异物(foreigner material)21.溢胶(excessive glue)22.锡短路(solder bridge)23.锡不足(solder insufficient)24.极性反(wrong polarity)25.脚未入(pin unseated)26.脚未出(pin unvisible)27.脚未剪(pin no cut)28.脚未弯(pin not bent)29.缺盖章(missing stamp)30.缺标签(missing label)31.缺序号(missing s/n)32.序号错(wrong s/n)33.标签错(wrong label)34.标示错(wrong mark)35.脚太短(pin short)36.j1不洁(j1 dirty)37.锡凹陷(solder scooped)38.线序错(w/l of wire)39.未测试(no test) 40.vr变形(vr deformed)43.零件沾胶(glue on parts)41.pcb翘皮(pcb peeling)42.pcb弯曲(pcb twist)44.零件脚长(parts pin long)45.浮件(parts lift)46.零件歪斜(parts tilt)47.零件相触(parts touch)48.零件变形(parts deformed)49.零件损坏(parts damaged)50.零件脚脏(pin dirty)51.零件多装(parts excess)52.零件沾锡(solder on parts)53.零件偏移(parts shift)54.包装错误(wrong packing)55.印章错误(wrong stamps)56.尺寸错误(dimension wrong)57.二极管坏(diode ng)58.晶体管坏(transistor ng)59.振荡器坏(x’tl ng)60.管装错误(tubes wrong)61.阻值错误(impedance wrong)62.版本错误(rev wrong)63.电测不良(test failure)64.版本未标(non rev lebel)65.包装损坏(packing damaged)66.印章模糊(stamps defective)67.标签歪斜(label tilt)68.外箱损坏(carton damaged)69.点胶不良(poor glue)70.ic座氧化(socket rust)71.缺ul标签(missing ul label)72.线材不良(wire failure)73.零件脚损坏(pin damaged)74.金手指沾锡(solder on golden fingers)75.包装文件错(racking doc wrong)76.包装数量错(packing q’ty wrong)77.零件未定位(parts unseated)78.金手指沾胶(glue on golden fingers)79.垫片安装不良(washer unseated)80.线材安装不良(wire unseated)81.立碑(tombstone)。
PCB及PCBA缺陷中英文对照表
1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点 laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花 track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄29k孔内毛刺burrs in hole 69聚油excess solder mask30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch32露镍expose Ni 72绿油下杂物 contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad38绿油入孔solder mask in hole 78线路缺口nick on track39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu55孔内露基材 laminate exposure in hole 10粉红圈pinking ring 56焊盘脱落pad break off11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping24孔小hole undersize 38间隙小space too marrow25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness。
最新PCB及PCBA缺陷中英文对照表
最新PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black 6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment 17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F 20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu 23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB 及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料发布时间：2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(ElectolessNi/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。
常见不良缺陷翻译
常见不良缺陷翻译下面列出一些常用的不合格项目的英文翻译，供参考：线头- Thread end线头未剪- Untrimmed thread end色差- Color difference印刷不良-Poor printing车缝不良- Poor sewing覆膜不良- Poor coating折痕- Crease起皱- Goffer批锋、毛边、毛刺- 五金：Burr，塑胶：Flash 做工不良- Poor workmanship破裂，开裂、破损 - Broken裂缝，裂纹、裂口– Rip缝合处爆开- Seam broken车缝爆开- Sewing broken车线断– Stitch broken抽丝（抽纱）- Poor material (不完全对应)拉毛、起毛– Napping松动- Loose脏污- Dirt油污– Oil mark流水痕(纹) - Flow mark灰尘- Dust刮伤、刮花- Scratch凹坑、凹陷- Dent缩水- shrinkage变形- Deformation退色- discolor发霉- Mould喷涂不良- Poor painting电镀不良- Poor plating杂质- Impurity尖点（铁刺）- Sharp point利边- Sharp edge扭曲- Contortion弯曲、扭曲、翘曲- Curl切割不良– Poor cutting（五金）冲压不良– Poor punch生锈– Rust根据PO和sample验货—Did inspection per PO and the sample.大货和样品基本一致—The product basically same as sample.品质符合SIC要求-- The quality meet SIC.箱唛和包装见图片-- Shipping marks and package see photoes.资料不全、不齐-- The inspection informations not complete.无签样- No approved sample.通过-- Pass失败、不通过-- Failed另外：常用单词外箱- Carton, 内箱（内盒）- Inner box, 彩盒- Color box, 邮购盒- Remailer box唛头- Mark尺寸- Dimension大小- Size重量- Weight长- Length，宽- Width，高- Height, 厚度- Thickness组装（装配）- Assembly配件- Accessory外形- Shape，结构- Structure，连接头（器）- Connector湿度- Humidity，湿度计–Hygrometer，温度计–Thermometer，卷尺- Tapeline，卡尺- Callipers，金属探测仪– Metal detector, 缝纫机– Sartorius冲床– Punch，车床– Lathe，模具– Mold (tooling), 修改模具- Modify mold, 试模– Off tool, 试产– Pilot run电器产品：高压测试- Hi-pot test, 泄漏电流- Current leakage，接地电阻- Earth continuity 电火花- Spark，短路- Short circuit, 断路- Open circuit验货报告中的英文说明：Package包装1. Master carton markings:外箱箱唛2. Inner carton markings:内盒箱唛3. Country of origin:原产地4. Specail requirements on CTN:外箱上的特殊要求5. Master CTN Qty:外箱里的数量6. Inner CTN Qty:内盒里的数量7. Barcode / Upc / Other label 条形码、UPC、其他LABEL8. Words / graphic correct 文字、图案正确否（特殊的）9. Poly bag / warnings:塑胶袋、警告字句Function / Material功能、材料1. Appearance:外观2. Color:颜色3. Shape and demension of product:外形、尺寸4. Assembly test:装配测试5. Material:材料6. Accessories:配件7. Compare with file / approved samples / photo:和文件、签样、相片对照的结果8. Test as user manual / MI:按用户说明手册测试9. Function performance:功能测试的性能是否符合要求Other其他1. No sharp point / edge无尖点、利边2. Safety pull / push test:拉力、推力测试3. Reliability test可靠性测试4. Electrical test: Hi-pot / Polarity / earth电气性能测试：高压测试、电线极性测试、接地电阻测试5. Lab test / Brine test实验室测试、盐水测试6. Abuse test 破坏性测试7. Other test 其他测试8. Ctn size: X X 外箱尺寸，后面填写单位9. NW: 净重，后面填写单位GW:毛重，后面填写单位。
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Solder Residue Stamp Not Clear Bent Pin Component Fall Off Component Distortion PCB Open Sunken Solder Block Hole Part On Side Label Damaged Label Scratch Label Indistinct Cable Broken Block Hole Icile No Body Marking/Discolored Label Placement Exposed Copper Solder Crack Pad Fall Off Panel Scratch PCB Scratch Incoming Defect BIOS Bad
FLEXTRONICS
缺陷（中文） 锡多 装配错误 分析错误 锡连/短路 肮脏 焊球 锡少 锡盘抬起 电子元件缺陷 脚长 元件错 多打元件 元件反向 元件高/元件倾斜 元件损坏 胶水多 胶水少 元件翻面 缺元件 竖立 漏焊 助焊剂残留板上 漏盖章 脚歪 冷焊 元件偏移 机械元件缺陷 脚未过板 软件错误 代分析 调整错误 安装不到位 铆接缺陷 脚翘 缺标签 标签不一致
锡渣 印章模糊 针歪 元件脱落 元件变形 印板开路 焊点凹陷 插孔堵塞标识/色差 标签偏移 露铜 锡裂 焊盘脱落 面板刮伤 印板刮伤 来料不良 BIOS不良
SR SNC BP CFO CD PO SUS BH POS LD LS LI CB BMH IC NBM LBP EC SC PFO PS PBS IND BB
常见缺陷中英文对照表
英文缺陷代号 ES AW AN SS FM SB IS LP EMD LL WP EP RP HP DP EG IG IP MP TP NS FL MS BL CS SK MMD LNP WS TA TE PA RD LF ML LNC 缺陷（英文） Excess Solder Assembled Wrong Analysis Incorrect Solder Short Foreign Material Solder Balls Insufficient Solder Lifted Pads Electrical Material Defect Long Lead Wrong Part Extra Part Reversed Part High Part Damaged Part Excess Glue Insufficient Glue Inverted Part Missing Part Toinbstone Part No Solder Flux On Board Missing Stamp Bent Lead Cold Solder Skewed/Misalignment/Misplacement Mechanical Material Defect Lead Not Protrusion Wrong Software To Be Analyzed Turning Error Poor Assembly Rivet Defects Lead Lift Missing Label Label Non-Conformity