L-41001中文资料
PT4101中文资料
6
4
IN 电压输入端，必须局部旁路
最大极限值
符号
项目
VIN 输入电压范围
VSW 功率开关电压
VIO 其它 I/O 口电压 PTR1 SOT-23-6 封装的热阻
ΘJA ΘJC PTR2 QFN-8 封装的热阻 ΘJA ΘJC Topt 工作温度范围
Tstg 储存温度范围
Tsolder 引脚焊接温度
极限值
引脚说明
引脚序号
符号
SOT-23-6 QFN-8
说明
1
8 SW 功率开关管输出，SW 是内部 MOS 管的漏极，将功率
电感和输出整流器与 SW 相连.
2
1, 5 GND 接地引脚
3
6
FB 反馈输入端。PT4101 调节 FB 与 GND 之间电流采样电
阻上的电压。 在 LED 链的底端与地之间串联一个电流
PT4101
带 OVP 的白光 LED 驱动用升压 DC/DC 转换器
概述
PT4101 是一款由单节锂电池来驱动至多8个串联LED的带OVP升压转换器，在5V输入时，可驱动8颗LED。它包含一个误差放大器、PWM比较器、电 流采样放大器、逻辑控制电路和功率MOS管。PT4101采用固定频率电流模式来调节LED电流，并通过一颗外部电流监测电阻来测量此电流。其104mV的低 反馈电压可降低功耗和提高效率。OV脚监测输出电压并且在输出端由于开路而导致进入过压状态时关断转换器。此外，PT4101还含有电流限制功能，以避 免在输出过载时对器件造成损害。
单位
-0.3~7
V
-0.5~50
V
GND-0.3 to VIN+0.3 V
W/℃ 220 110
Agilent HSDL-4400-1L1和HSDL-5400-1L1高性能IR发射器和IRPIN光
HSDL-5400-1L1Agilent High-Performance IR Emitter and IR PIN Photodiode in Subminiature SMT PackageData SheetFlat Top PackageThe HSDL-4400 Series of flat top IR emitters uses an untinted, nondiffused, truncated lens to provide a wide radiation pattern that is useful for short distance communication where alignment of the emitter and detector is not critical. The HSDL-5400 Series of flat top IR detectors uses the same truncated lens design as the HSDL-4400 Series of IR emitters with the added feature of a black tint that acts as an optical filter to reduce the effects of ambient light, such as sun, incandescent and fluorescent light from interfering with the IR signal.Dome PackageThe HSDL-4420 Series of dome IR emitters uses an untinted, nondiffused lens to provide a 24 degree viewing angle with high on-axis intensity. TheHSDL-5420 Series of IR detectors uses the same lens design as the HSDL-4420 IR emitter and optical filter used in the HSDL-5400 IR detector.Lead ConfigurationAll of these devices are made by encapsulating LED and PIN photodiode chips on axial lead frames to form molded epoxy subminiature packages. A variety of lead configurations is available and includes: surface mount gull wing, yoke lead, orZ-bend and through hole lead bends at 2.54 mm (0.100 inch) center spacing.TechnologyThe subminiature solid state emitters utilize a highly optimized LED material, transparent substrate aluminum gallium arsenide, TS AlGaAs. This material has a very high radiant efficiency, capable of producing high light output over a wide range of drive currents and temperature.HSDL-44xx IR Emitter Series HSDL-54xx IR Detector Series Features•Subminiature flat top and dome packageSize – 2x2 mm•IR emitter875 nm TS AlGaAsIntensity – 17 mW/srSpeed – 40 ns•Wide range of drive currents 500 µA to 500 mA•IR detectorPIN photodiodeHigh sensitivitySpeed – 7.5 ns•Flexible lead configurations Surface mount or through holeApplications•Short distance IR links•IrDA compatible•Small handheld devices PagersIndustrial handhelds •Diffuse LANs•Wireless audioDevice Selection GuideIR EmittersPart Number Device Description[1]Device Outline DrawingHSDL-4400LED, Flat Top, 110 deg AHSDL-4420LED, Dome, 24 deg BIR DetectorsPart Number Device Description[1]Device Outline DrawingHSDL-5400PIN Photodiode, Flat Top, 110 deg CHSDL-5420PIN Photodiode, Dome, 28 deg DPackage Configuration OptionsOption PackageCode Package Configuration Description Outline Drawing 011Gull Wing Lead, Tape and Reel[2]E, J, M021Yoke Lead, Tape and Reel[2]Surface Mount Lead F, K, M031Z-Bend, Tape and Reel[2]G, L, M1L1 2.54 mm (0.100 in) Center Long Leads; 10.4 mm (0.410 in)Thru Hole Lead H1S1Lead Spacing Short Leads; 3.7 mm (0.145 in)INo Option Straight Leads[3]Prototyping A, B, C, DNotes:1.IR Emitters have untinted, nondiffused lenses and IR Detectors have black tinted, nondiffused lenses.2.Emitters and detectors are supplied in 12 mm embossed tape on 178 mm (7 inch) diameter reels, with 1500 units per reel. Minimum order quantityand order increment are in quantity of reels only.3.Emitters and detectors are supplied in bulk form in bags of 50 units.4.The HSDL-44xx and HSDL-54xx families are not designed to be used in medical devices with life support functions or in safety equipment (or similarapplications where components failures would result in loss of life or physical harm), eg. in automotive, medical or airline industries.NOTES:1.ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2.PROTRUDING SUPPORT TAB IS CONNECTED TO ANODE LEAD.3.LEAD POLARITY FOR THESE TS AlGaAs SUBMINIATURE LAMPS IS OPPOSITE TO THE LEAD POLARITY OF SUBMINIATURE LAMPS USING OTHER LED TECHNOLOGIES.4.CATHODE STRIPE MARKING IS DARK BLUE.Package Dimensions (A) Flat Top Emitters(B) Dome Emitters2.16(0.085)0.23(0.009)0.760.89(0.030)(0.035)R.0.180.23(0.007)(0.009)(D) Dome Detectors(C) Flat Top DetectorsNOTES:1.ALL DIMENSIONS ARE IN MILLIMETRES (INCHES).2.PROTRUDING SUPPORT TAB IS CONNECTED TO CATHODE LEAD.3.CATHODE STRIPE MARKING IS DARK BLUE.2.16(0.085)0.23(0.009)0.760.89(0.030)(0.035)R.0.180.23(0.007)(0.009)0.76 (0.030)MAX.(F) “Yoke” Lead, Options 0210.76 (0.030) MAX.Package DimensionsThe following notes affect the package outline drawings E through I.1. The pinout represents the HSDL-54xx IR detectorswhere the protruding support tab is closest to the anode lead. While the pinout isreversed for the HSDL-44xx IR emitters where the pro-truding support tab is closest to the cathode lead.2. The protruding support tab of the HSDL-54xx is connected to the cathode lead. While the protruding support tab of the HSDL-44xx is connected to the anode lead.ALL DIMENSIONS ARE IN MILLIMETRES (INCHES)(E) Gull Wing Lead, Option 011(G) Z-Bend Lead, Options 0310.76 (0.030) MAX.(H) Thru Hole Lead Option 1L1(I) Thru Hole Lead Option 1S1Package Dimensions: Surface Mount Tape and Reel Options (J) 12 mm Tape and Reel, Gull Wing Lead, Option 011GULL WING LEAD SUBMINIATURE PACKAGE NOTES:1. EMPTY COMPONENT POCKETS SEALED WITH TOP COVER TAPE.2. 7 INCH REEL – 1500 PIECES PER REEL.3. MINIMUM LEADER LENGTH AT EITHER END OF THE TAPE IS 500 mm.4. THE MAXIMUM NUMBER OF CONSECUTIVE MISSING DEVICES IS TWO.5. IN ACCORDANCE WITH ANSI/EIA RS-481 SPECIFICATIONS, THECATHODE IS ORIENTED TOWARDS THE TAPE SPROCKETS HOLE.(K) 12 mm Tape and Reel, “Yoke” Lead, Option 021“YOKE” LEADSUBMINIATURE PACKAGE(L) 12 mm Tape and Reel, Z-Bend Lead, Option 031Z-BEND LEADSUBMINIATURE PACKAGE(M) 12 mm Tape and ReelConvective IR Reflow Soldering For information on IR reflow soldering, refer to Application Note 1060, Surface Mounting SMT LED Components.HSDL-44xx Absolute Maximum RatingsParameter Symbol Min.Max.Unit Ref. Peak Forward Current (Duty Factor = 20%,I FPK500mA Fig. 7, 8 Pulse Width = 100 µs)DC Forward Current I FDC100mA Fig. 6 Power Dissipation P DISS100mWReverse Voltage (I R = 100 µA)V R5VTransient Forward Current(10 µs Pulse)I FTR 1.0A[1] Operating Temperature T O-4085°CStorage Temperature T S-55100°CJunction Temperature T J110°CLead Solder Temperature260/5 s°C[1.6 mm (0.063 in.) from body]Reflow Soldering TemperaturesConvection IR235/90 s°C Fig. 20 Vapor Phase215/180 s°CNote:1.The transient peak current in the maximum nonrecurring peak current the device can withstand without damaging the LED die and the wire bonds.HSDL-44xx Electrical Characteristics at T A = 25°CParameter Symbol Min.Typ.Max.Unit Condition Ref. Forward Voltage V F 1.30 1.50 1.70V I FDC = 50 mA Fig. 22.15I FPK = 250 mAForward Voltage∆V F/∆T-2.1mV/°C I FDC = 50 mA Fig. 3 Temperature Coefficient-2.1I FDC = 100 mASeries Resistance R S2ΩI FDC = 100 mADiode Capacitance C O50pF0 V, 1 MHzReverse Voltage V R520V I R = 100 µAThermal Resistance,R q jp170°C/WJunction to PinHSDL-44XX Optical Characteristics at T A = 25°CParameter Symbol Min.Typ.Max.Unit Condition Ref. Radiant On-Axis IntensityHSDL-4400I E138mW/sr I FDC = 50 mA Fig. 4, 56I FDC = 100 mA15I FPK = 250 mA HSDL-4420I E91730mW/sr I FDC = 50 mA Fig. 4, 532I FDC = 100 mA85I FPK = 250 mARadiant On-Axis Intensity∆I E/∆T-0.35%/°C I FDC = 50 mA Temperature Coefficient-0.35I FDC = 100 mAViewing AngleHSDL-44002q1/2110deg I FDC = 50 mA Fig. 9 HSDL-44202q1/224deg I FDC = 50 mA Fig. 10 Peak Wavelength l PK850875900nm I FDC = 50 mA Fig. 1 Peak Wavelength∆l/∆T0.25nm/°C I FDC = 50 mA Temperature CoefficientSpectral Width at FWHM∆l37nm I FDC = 50 mA Fig. 1 Optical Rise and Fall t r/t f40ns I FPK = 50 mATimes, 10%-90%Bandwidth f c9MHz I FDC = 50 mA Fig. 11± 10 mAHSDL-54xx Absolute Maximum RatingsParameter Symbol Min.Max.Unit Power Dissipation P DISS150mW Reverse Voltage (I R = 100 µA)V R40V Operating Temperature T O-4085°C Storage Temperature T S-55100°C Junction Temperature T J110°C Lead Solder Temperature [1.6 mm (0.063 in.) from body]260/5 s°C Reflow Soldering TemperaturesConvection IR235/90 s°C Vapor Phase215/180 s°CHSDL-54xx Electrical Characteristics at T A = 25°CParameter Symbol Min.Typ.Max.Unit Condition Ref. Forward Voltage V F0.8V I FDC = 1 mABreakdown Voltage V BR40V I R = 100 µA,E e = 0 mW/cm2 Reverse Dark Current I D15nA V R = 5 V,Fig. 12E e = 0 mW/cm2Series Resistance R S2000ΩV R = 5 V,E e = 0 mW/cm2Diode Capacitance C O5pF V R = 0 V,Fig. 16E e = 0 mW/cm2f = 1 MHzOpen Circuit Voltage V OC375mV E e = 1 mW/cm2l PK = 875 nm Temperature Coefficient of V OC∆V OC/∆T-2.2mV/K E e = 1 mW/cm2l PK = 875 nmShort Circuit Current I SC E e = 1 mW/cm2HSDL-5400 1.6µA l PK = 875 nmHSDL-5420 4.3µATemperature Coefficient of I SC∆I SC/∆T0.16%/K E e = 1 mW/cm2l PK = 875 nmThermal Resistance,R q jp170°C/WJunction to PinHSDL-54xx Optical Characteristics at T A = 25°CParameter Symbol Min.Typ.Max.Unit Condition Ref. Photocurrent E e = 1 mW/cm2Fig 14, HSDL-5400I PH0.8 1.6µA l PK = 875 nm15 HSDL-5420 3.0 6.0V R = 5 V Temperature Coefficient of I PH∆I PH/∆T0.1%/K E e = 1 mW/cm2Fig. 13l PK = 875 nmV R = 5 VRadiant Sensitive Area A0.15mm2Absolute Spectral Sensitivity S0.5A/W E e = 1 mW/cm2l PK = 875 nmV R = 5 VViewing AngleHSDL-54002q1/2110deg Fig. 18 HSDL-542028Fig. 19 Wavelength of Peak Sensitivity l PK875nm E e = 1 mW/cm2Fig. 17V R = 5 VSpectral Bandwidth∆l770-nm E e = 1 mW/cm2Fig. 171000V R = 5 VQuantum Efficiency h70%E e = 1 mW/cm2l PK = 875 nm,V R = 5 VNoise Equivalent Power NEP 6.2 x W/Hz1/2V R = 5 V10-15l PK = 875 nm Detectivity D 6.3 x cm*V R = 5 V1012Hz1/2/W l PK = 875 nmOptical Rise and Fall Times, 10%-90%t r/t f7.5ns V R = 5 VR L = 1 kΩl PK = 875 nm Bandwidth f c50MHz V R = 5 VR L = 1 kΩl PK = 875 nmR E L A T I V E R A D I A N T I N T E N S I T Yλ – WAVELENGTH – nmI F P K – P E A K F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VFigure 3. Forward voltage vs. ambient temperature.Figure 5. Normalized radiant intensity vs.peak forward current (0 to 10 mA).N O R M A L I Z E D R A D I A N T I N T E N S I T Y5.000I FPK – PEAK FORWARD CURRENT – mA 4.000.502.501.001.502.003.003.504.50N O R M A L I Z E D R A D I A N T IN T E N S I T Y1.000.01I FPK – FORWARD CURRENT – mA0.10I F D C – M A X I M U M D C F O R W A R D C U R R E N T – m A-401001200T A – AMBIENT TEMPERATURE – °C60-20100804020020406080I F P K – P E A K F O R W A R D C U R R E N T – m At PW – PULSE WIDTH – ms I F P K – P E A K F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CFigure 8. Maximum peak forward current vs.ambient temperature. Derated based on T JMAX = 110°C.V F – F O R W A R D V O L TA G E – VT A – AMBIENT TEMPERATURE – °CFigure 1. Relative radiant intensity vs.wavelength.Figure 2. Peak forward current vs. forward voltage.Figure 4. Normalized radiant intensity vs.peak forward current.Figure 6. Maximum DC forward current vs.ambient temperature. Derated based on T JMAX = 110°C.Figure 7. Maximum peak forward current vs.duty factor.Figure 12. Reverse dark current vs. ambient temperature.Figure 13. Relative reverse light current vs.ambient temperature.Figure 10. Relative radiant intensity vs. angular displacement HSDL-4420.R E L A T I V E R A D I A N T I N T E N S I T Y1.00θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)0.80.60.50.70.20.10.30.4°0.9Figure 9. Relative radiant intensity vs. angular displacement HSDL-4400.R E L A T I V E R A D I A N T I N T E N S I T Y1.00θ –ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)0.80.60.50.70.20.10.30.4°0.9Figure 11. Relative radiant intensity vs.frequency.R E L A T I V E R A D I A N T I NT E N S I T Y2-10 f – FREQUENCY – Hz-4-7-110-2-3-5-6-8-9I D – R E V E R S E D A R K CU R R E N T – n A10.0000.001T A – AMBIENT TEMPERATURE – °C 0.1000.0101.000N O R M A L I Z E D P H OT O C U R R E N T1.400.60T A – AMBIENT TEMPERATURE – °C1.000.801.201.301.100.900.70N O R M A L I Z E D P H O T O C U R R E N TE e – IRRADIANCE – mW/cm 2N O R M A L I Z E D P H O T O C U R R E N TV R – REVERSE VOLTAGE – VC O –D I O DE C A P A C I T A N C E –p F50V R – REVERSE VOLTAGE – V4321Figure 14. Reverse light current vs. irradianceFigure 15. Reverse light current vs. reverse voltage.Figure 16. Diode capacitance vs. reverse voltage.At the time of this publication, Light Emitting Diodes (LEDs) that are contained in this product are regulated for eye safety in Europe by the Commission for European Electrotechnical Standardization (CENELEC) EN60825-1. Please refer to Application Brief I-008 for more information.Figure 17. Relative spectral sensitivity vs.wavelength.N O R M A L I Z E D P H O T O C U R R E N Tλ – WAVELENGTH – nmFigure 19. Relative radiant intensity vs. angular displacement.HSDL-5420.N O R M A L I Z E D P H O T O C U R R E N T1.00θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)0.80.60.50.70.2-50°0.10.30.4-40°-30°-20°-10°0°10°20°30°40°50°0.9N O R M A L I Z E D P H O T O C U R R E N T1.00θ – ANGLE FROM OPTICAL CENTERLINE – DEGREES (CONE HALF ANGLE)0.80.60.50.70.20.10.30.4°0.9Figure 18. Relative radiant intensity vs. angular displacement.HSDL-5400./semiconductorsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152(Domestic/International),or 0120-61-1280(Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines,Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2002-2005 Agilent Technologies, Inc.Obsoletes 5988-5284EN May 23, 20055989-3134ENFigure 20. Evaluation soldering profiles (polyled).Process Zone Symbol D TMaximum D T/D time Heat UpP1, R125°C to 160°C 4°C/s Solder Paste Dry P2, R2160°C to 200°C0.5°C/s Solder Reflow P3, R3200°C to 255°C (260°C at 10 seconds max)4°C/s P3, R4255°C to 200°C -6°C/s Cool Down P4, R5200°C to 25°C -6°C/st-TIME (SECONDS)T – T E M P E R A T U R E – (°C )23020016012080180220255P1HEAT UPP2SOLDER PASTE DRY P3SOLDERREFLOWP4COOL DOWN25HSDL-5400-1L1。
检验科仪器档案登记表格模板
检验科仪器档案登记表格模板
仪器名称众驰伟业自动血液流变仪英文名称Zonci自动血液流变仪
编号002
单位及数量1台
型号及规格ZL1000i
使用科室检验科生化室
仪器名称雷杜全自动洗板机英文名称Rayto全自动洗板机编号004
单位及数量1台
型号及规格RT-3100
使用科室检验科免疫室
编号005
仪器名称优普超纯水器
英文名称ULUPURE超纯水器编号007
单位及数量1台
型号及规格UPS-1-40L
使用科室检验科生化室
编号008
仪器名称众驰伟业全自动血凝仪英文名称Zonci全自动血凝仪
编号010
单位及数量1台
型号及规格XL1000i
使用科室检验科血液室
编号011。
SERVOMEX4100操作说明书
1.2：手册的范围本手册涵盖了软件设置和操作。
更多的复本可供订购，订购编号为04000/003C。
•获取技术支持及备件的联系方式请见本手册封底。
•随仪器提供一份安装手册，内容包括了技术指标、日常维护和备件信息，订购编号为04000/005C。
•维护手册是专为专业技术人员而编写的，购编号为04000/002C警告用户应当注意到Xentra仪器内部没有需要用户维护的部件。
仪器外壳保护用户免遭电击或其它危害。
所有维护工作应当由专业技术人员进行。
图A分析仪正视图1．样气过滤器(可选) 4．键盘2．流量计(可选) 5 ．显示对比度调节3．显示6．样气调节针阀(可选) 图BXentra的显示1．标题7．报警图标2．模块位置(2字符) 8．预热图标3．测量值(6字符) 9．自动标定图标4．工程单位(3字符) 10．维护图标5．组份名称(6字符) 11．故障图标6．测量显示条目图C自动标定的典型时序(示例中，标气1为零点气，标气2为量程气) 1．自动标定开始，标气1通入分析仪2．标气1测量中3．标气2通入分析仪4．标气2测量中5．标气1再次通入分析仪6．再次测量标气17．样气体通入分析仪吹扫传感器(后吹扫)图D用户界面菜单结构图1概述11.1警告、注意和提示 11.2手册的范围 11.3用户界面介绍 42初始设置72.1开机和关机步骤72.2分析仪功能的一般操作72.3设定密码82.4设定时间和日期83主要设置93.1组份名称和单位的定义93.2报警10 3.3继电器的分配 11 3.4外部模拟量输入的设置 133.5模拟量输出 133.6定义和选择测量显示屏幕 15 3.7响应时间 16 3.8串行通讯输出163.9氮氧化物(NOx)浓度的计算17 4标定 184.1标定简介 18 4.2设定低点和高点标定的允许误差 19 4.3手动标定和检查19 4.4顺磁模块压力传感器的标定 22 4.5自动标定和自动检查的设置 24 5查看配置和历史文件 285.1显示当前的报警和故障 28 5.2显示报警设定 28 5.3设定显示输出 2 9 5.4显示分析仪历史记录30 5.5显示分析仪标识和诊断信息 32用户界面介绍用户界面由键盘和大屏幕LCD组成。
hp officejet 4100 series all-in-one 说明书
hp officejet 4100series all-in-one参考手册© Copyright Hewlett-Packard Company 2003保留所有权利。
未经 Hewlett-PackardCompany 事先的书面许可，不得将本文的任何部分复印、复制或翻译成另一种语言。
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部分版权所有 © 1989-2003 Palomar Software Inc. HP Officejet 4100Series 融合了 Palomar Software, Inc. 授权的打印机驱动程序技术。
版权所有 © 1999-2003 AppleComputer, Inc 。
Apple 、Apple 徽标、Mac 、Mac 徽标、Macintosh 和 Mac OS 是 AppleComputer, Inc. 在美国和其他国家（地区）的商标。
出版编号： Q1608-90185第一版： 2003年6月在美国、墨西哥、德国、新加坡或中国印刷Windows ®、Windows NT ®、Windows ME ®、Windows XP ®及Windows 2000® 是 Microsoft Corporation 在美国的注册商标。
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通告本文中的信息会随时更改，恕不另行通知，且文中信息不应解释为Hewlett-Packard Company 的承诺。
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LGA-4100仪表运行维护培训课件
LGA-4100仪表结构
发射单元
维护切断阀
吹扫单元
接收单元
7
Copyright @2006 FPI inc, all right reserved
LGA-4100发射单元
图：发射端示意图
8
人机交互
－192×64 LCD ＋ 四键操作
半导体激光器驱动
－激光器驱动和温度控制
光谱计算
－吸收光谱分析、系统中央控制
LGA-4100开机条件
900Pa≥正压压力≥500Pa 15min
16
Copyright @2006 FPI inc, all right reserved
LGA-4100开机步骤
确定电源、气源、信号
进行气源管道吹扫
调节进气减压阀 0.4MPa左右
打开维护切断阀 接通系统电源
微调减压阀，正压压力 指示条保持5-9个点亮
标零结束后，将零点气更换为 标准气，充分置换5分钟，待“气体浓度”
显示值稳定后，关闭标气瓶
在发射端进入标定参数，核实和设定标定光程、 压力、浓度，确认标定
装回现场，在发射端进入测量参数，核实和设定测量光程、 压力、浓度，并确认
上次标定的参数将会记录仪器内， 一般只需修改气体温度、标气浓度
测量参数是被保存好的， 一般不作修改
LGA-4100测量光程
测量光程= L 吹扫光程＝L1+L2+L3+L4(针对测量氧气仪表，需要设置)
19
Copyright @2006 FPI inc, all right reserved
LGA-4100参数设置
1. 测量光程：设定测量光程长度值（0-15）m； 2. 气体温度：设定被测气体温度（100-3000）K，可以选择为输入方式或是测量方式。 3. 现在气体温度的测量方式为(4-20)mA测量方式，(4-20)mA电流值对应气体温度值的
PC410L0YIP资料
6˚
0.5+−00..42
6˚
0.5+−00..42
7.0+−00..27
7.0+−00..27
Product mass : approx. 0.1g
Sheet No.: D2-A04801EN
2
元器件交易网
Date code (2 digit)
A.D. 1990 1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001
Sheet No.: D2-A04801EN
1
Date Nov. 28. 2003
© SHARP Corporation
元器件交易网
■ Internal Connection Diagram
1
6
5
Amp.
3
4
1 Anode 3 Cathode 4 GND 5 VO (Open collector) 6 VCC
Factory identification mark
Epoxy resin
5.3±0.3 45˚
(Unit : mm)
2. Mini-flat Package (VDE0884 option) [ex. PC410L0YIP]
1.27±0.25
3.6±0.3
1.27±0.25
SHARP mark "S"
3. Package resin : UL flammability grade (94V-0)
■ Applications
1. Programmable controllers 2. Inverter
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip.
LGA-4100半导体激光气体分析仪用户手册
FOCUSED PHOTONICS INC阅读说明用户须知非常感谢您选择使用本公司的LGA-4100半导体激光在线气体分析产品（以下简称：LGA-4100激光气体分析仪）。
在使用本产品前，请仔细阅读本用户手册。
本手册涵盖产品使用的各项重要信息及数据，用户必须严格遵守其规定，方可保证LGA-4100激光气体分析仪的正常运行。
同时，相关信息可帮助用户正确使用该产品，并获得准确的分析结果，节省由咨询等服务产生的额外成本。
概况本手册所介绍的产品在离厂前均经过严格的检验，以确保产品具有一流品质。
同时为了保证其安全、优质的运行，获得正确的分析结果，用户必须严格按照制造商所述使用方法进行系统操作。
另外，恰当的运输、仓储和安装及合理的操作和维护都有助于系统的安全和正常运行。
本手册详细介绍了正确使用LGA-4100激光气体分析仪的所有信息。
它为受过专门培训或具有仪器操作控制相关知识（例如自动化技术）的技术人员提供了准确的使用参考。
了解本手册所涉及的安全信息和警告信息，以及如何从技术上对错误进行修正，是对所述产品顺利进行“零危险”安装、试运转和安全运行、维护的先决条件。
只有合格的、具有专业知识的操作人员才能正确理解本手册所提到的安全信息和警告信息，并将他们运用到实际操作当中去。
由于各种原因，该手册不可能对每一产品型号都进行细节性的描述，若用户需要进一步了解相关信息，或解决本手册涉及尚浅的问题，请与当地代理商联系并要求帮助解决。
注意和警示信息本手册介绍了LGA-4100激光气体分析仪的具体应用，以及如何启动、操作和维护，可以指导用户正确地安装和操作LGA-4100激光气体分析仪，并对LGA-4100激光气体分析仪进行预防性的维护工作，以保障该系统的连续可靠运行。
需特别指出的是，本手册中的注意和警示信息至关重要（在接下来的各个章节中被强调显示，并加有适当的图标），能有效地避免不恰当的操作。
本手册所述产品的开发、制造、测试都把适当的安全标准放在首位。