SMK1260F规格书
18 G3VM-62C1 F1 MOS FET 开关电路器件说明书
G3VM-62C1/F1 MOS FET RelaysAnalog-switching MOS FET Relays forHigh Switching Currents, with DielectricStrength of 2.5 kVAC between I/O.•New 2-channel model included in the 60-V load voltageseries.•Switches minute analog signals.•Dielectric strength of 2,500 Vrms between I/O.•Surface-mounting models included in series.RoHS compliant!■Application Examples•Measurement devices•Security systemsNote:The actual product is marked differently from the imageshown here.■List of Models■DimensionsNote:All units are in millimeters unless otherwise indicated.■■PCB Dimensions (Bottom View)Contact form Terminals Load voltage (peak value)Model Number per stick Number per tape DPST-NO PCB terminals60 VAC G3VM-62C150---Surface-mountingterminalsG3VM-62F1G3VM-62F1(TR)---1,500G3VM-62C1G3VM-62F1Note:ly from the imageshown here.Note:The actual productis marked different-ly from the imageshown here.G3VM-62C1G3VM-62C1G3VM-62C1/F1G3VM-62C1/F1■Absolute Maximum Ratings (Ta = 25°C)■Electrical Characteristics (Ta = 25°C)■Recommended Operating ConditionsUse the G3VM under the following conditions so that the Relay will operate properly.■Engineering DataLoad Current vs. Ambient TemperatureG3VM-62C1(F1)■Safety PrecautionsRefer to “Common Precautions” for all G3VM models.ItemSymbol Rating Unit Measurement ConditionsInputLED forward currentI F 50mARepetitive peak LED forward currentI FP 1A 100 µs pulses, 100 pps LED forward current reduction rate∆ I F /°C −0.5mA/°C Ta ≥ 25°CLED reverse voltageV R 5V Connection temperatureT j 125°C OutputOutput dielectric strength V OFF 60V Continuous load current I O 500mA ON current reduction rate ∆ I ON /°C −5.0mA/°C Ta ≥ 25°CConnection temperatureT j 125°C Dielectric strength between input and output (See note 1.)V I-O 2,500Vrms AC for 1 minOperating temperature T a −40 to +85°C With no icing or condensation Storage temperature T stg −55 to +125°CWith no icing or condensation Soldering temperature (10 s)---260°C10 s Note:1.The dielectric strength between the input andoutput was checked by applying voltage be-tween all pins as a group on the LED side and all pins as a group on the light-receiving side.ItemSymbol Mini-mum Typical Maxi-mum UnitMeasurement conditions InputLED forward voltage V F 1.0 1.15 1.3V I F = 10 mA Reverse currentI R ------10µA V R = 5 V Capacity between terminals C T ---30---pF V = 0, f = 1 MHz Trigger LED forward currentI FT --- 1.63mA I O = 500 mA OutputMaximum resistance with output ON R ON --- 1.0 2.0ΩI F = 5 mA, I O = 500 mA Current leakage when the relay is openI LEAK ------ 1.0µA V OFF = 60 V Capacity between I/O terminals C I-O ---0.8---pF f = 1 MHz, Vs = 0 V Insulation resistance R I-O 1,000------M ΩV I-O = 500 VDC, RoH ≤ 60%Turn-ON time tON ---0.8 2.0ms I F = 5 mA, R L = 200 Ω, V DD = 20 V (See note 2.)Turn-OFF timetOFF---0.10.5ms Note:2.Turn-ON and Turn-OFFTimesItemSymbol MinimumTypicalMaximumUnitOutput dielectric strength V DD------48V Operating LED forward current I F 57.525mA Continuous load current I O ------500mA Operating temperatureT a− 20 ---65°CCommon Precautions!WARNINGBe sure to turn OFF the power when wiring the Relay, other-wise an electric shock may be received.!WARNINGDo not touch the charged terminals of the SSR, otherwise an electric shock may be received.!CautionDo not apply overvoltage or overcurrent to the I/O circuits of the SSR, otherwise the SSR may malfunction or burn.!CautionBe sure to wire and solder the Relay under the proper soldering conditions, otherwise the Relay in operation may generate ex-cessive heat and the Relay may burn.Typical Relay Driving Circuit ExamplesUse the following formula to obtain the LED current limiting resis-tance value to assure that the relay operates accurately.Use the following formula to obtain the LED forward voltage value to assure that the relay releases accurately.Protection from Surge Voltage on the Input TerminalsIf any reversed surge voltage is imposed on the input terminals, insert a diode in parallel to the input terminals as shown in the fol-lowing circuit diagram and do not impose a reversed voltage value of 3V or more.Surge Voltage Protection Circuit ExampleProtection from Spike Voltage on the Output TerminalsIf a spike voltage exceeding the absolute maximum rated value isgenerated between the output terminals, insert a C-R snubber or clamping diode in parallel to the load as shown in the following circuit diagram to limit the spike voltage.Spike Voltage Protection Circuit ExampleUnused Terminals (6-pin models only)Terminal 3 is connected to the internal circuit. Do not connect anything to terminal 3 externally.Pin Strength for Automatic Mountingn order to maintain the characteristics of the relay, the force imposed on any pin of the relay for automatic mounting must not exceed the following.In direction A: 1.96 NIn direction B: 1.96 NLoadTransistor10 to 100 kΩLoadR1 =V CC− V OL− V F (ON) 5 to 20 mAV F (OFF) = V CC− V OH < 0.8 VLoad ConnectionDo not short-circuit the input and output terminals while the relay is operating or the relay may malfunction.Solder MountingPerform solder mounting under the following recommended con-ditions to prevent the temperature of the Relays from rising.<Flow Soldering>Through-hole Mounting (Once Only)Note:We recommend that the suitability of solder mounting be verified under actual conditions.<Reflow Soldering>Surface Mounting DIP or SOP Packages (Twice Max.) Surface Mounting SSOP Packages (Twice Max.)Note: 1.We recommend that the suitability of solder mounting be verified under actual conditions.2.Tape cut SSOPs are packaged without humidity resis-tance. Use manual soldering to mount them.Manual Soldering (Once Only)Manually solder at 350°C for 3 s or less or at 260°C for 10 s or less.SSOP Handling Precautions<Humidity-resistant Packaging>Component packages can crack if surface-mounted components that have absorbed moisture are subjected to thermal stress when mounting. To prevent this, observe the following precau-tions.1.Unopened components can be stored in the packaging at 5to 30°C and a humidity of 90% max., but they should be used within 12 months.2.After the packaging has been opened, components can bestored at 5 to 30°C and a humidity of 60% max., but they should be mounted within 168 hours.3.If, after opening the packaging, the humidity indicator turnspink to the 30% mark or the expiration data is exceeded, bake the components while they are still on the taping reel, and use them within 72 hours. Do not bake the same com-ponents more than once.Baking conditions: 60±5°C, 64 to 72 hExpiration date: 12 months from the seal date(given on the label)4. f the same components are baked repeatedly, the tapedetachment strength will change, causing problems when mounting. When mounting using dehumidifying measures, always take countermeasures against component damage from static electricity.5.Do not throw or drop components. If the laminated packag-ing material is damaged, airtightness will be lost.6.Tape cut SSOPs are packaged without humidity resistance.Use manual soldering to mount them.AC ConnectionDC Single Connection DC Parallel Connection LoadLoadLoadLoadSolder type Preheating SolderingLead solderSnPb150°C60 to 120 s230 to 260°C10 s max.Lead-free solderSnAgCu150°C60 to 120 s245 to 260°C10 s max.Solder type Preheating SolderingLead solderSnPb140→160°C60 to 120 s210°C30 s max.Peak240°C max.Lead-free solderSnAgCu180→190°C60 to 120 s230°C30 to 50 sPeak260°C max.Solder type Preheating SolderingLead solderSnPb140→160°C60 to 120 s210°C30 s max.Peak240°C max.Lead-free solderSnAgCu150→180°C120 s max.230°C30 s max.Peak250°C max.。
摩克12英寸无风扇面板计算机产品说明书
MPC-2120Series12-inch industrial fanless panel computers with Zone2certificationsFeatures and Benefits•12-inch panel computer•Intel Atom®processor:E38451.91GHz or E38261.46GHz•-40to70°C wide-temperature design,no fan or heater•1000-nit sunlight-readable LCD•Class1Division2,ATEX Zone2,and IECEx certified•Wide-range10to36VDC power input•DNV certified for marine applicationsCertificationsIntroductionThe MPC-212012-inch panel computers with E3800Series Intel Atom®processor deliver a reliable,durable,and versatile platform for use in industrial environments.With two software selectable RS-232/422/485serial ports and two Gigabit Ethernet ports,the MPC-2120panel computers support a wide variety of serial interfaces as well as high-speed IT communications,all with native network redundancy.The MPC-2120Series panel computers are designed with a wide,-40to70°C temperature range,and come with a fanless,streamlined enclosure designed for highly efficient heat dissipation,making this one of the most reliable industrial platforms available for harsh,hot,outdoor environments like oil and gas fields and drilling platforms.The MPC-2120also features a1000-nit LCD panel offering a sunlight-readable, projected-capacitive,multi-touch screen,providing an excellent user experience for outdoor applications.AppearanceSpecificationsComputerCPU MPC-2120-E2-T:Intel Atom®Processor E3826(1M Cache,1.46GHz)MPC-2120-E4-T:Intel Atom®Processor E3845(2M Cache,1.91GHz)Graphics Controller Intel®HD GraphicsSystem Memory Pre-installed4GB DDR3LSystem Memory Slot SODIMM DDR3/DDR3L slot x1Pre-installed OS MPC-2120-E2-T-W7E/MPC-2120-E4-T-W7E/MPC-2120-E2-T-LB-W7E/MPC-2120-E4-LB-T-W7E:Windows Embedded Standard7(WS7P)64-bitSupported OS Windows10Pro64-bitWindows10Embedded IoT Ent2016LTSB Entry64-bitWindows7Pro for Embedded SystemsWindows Embedded Standard7(WS7P)64-bitLinux Debian9Storage Slot CFast slot x1SD slots x1,SD3.0(SDHC/SDXC)socketStorage Pre-installed MPC-2120-E2-T-W7E/MPC-2120-E4-T-W7E/MPC-2120-E2-LB-T-W7E/MPC-2120-E4-LB-T-W7E:32GB CFast CardComputer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(RJ45connector)x2Serial Ports RS-232/422/485ports x2,software selectable(DB9male)USB2.0USB2.0hosts x2,type-A connectorsDigital Input DIs x4Digital Output DOs x4LED IndicatorsSystem Power x1LAN2per port(10/100/1000Mbps)DisplayLight Intensity(Brightness)MPC-2120-E2-T:1000cd/m2MPC-2120-E4-T:1000cd/m2MPC-2120-E2-T-W7E:1000cd/m2MPC-2120-E4-T-W7E:1000cd/m2MPC-2120-E2-LB-T:500cd/m2MPC-2120-E2-LB-T-W7E:500cd/m2MPC-2120-E4-LB-T:500cd/m2MPC-2120-E4-LB-T-W7E:500cd/m2Active Display Area245.76(H)x184.32(V)mmAspect Ratio4:3Contrast Ratio700:1Max.No.of Colors16.2M(8-bit/color)Panel Size12-inch viewable imagePanel Type TNPixel Pitch(RGB)0.240(H)x0.240(V)mmPixels1024x768Response Time5ms(gray to gray)Viewing Angles160°/140°Touch FunctionTouch Type Capacitive Touch(PCAP)Touch Support Points4pointsGlove Support YesSerial InterfaceBaudrate50bps to115.2kbpsData Bits5,6,7,8Flow Control RTS/CTS,XON/XOFF,ADDC®(automatic data direction control)for RS-485,RTSToggle(RS-232only)Parity None,Even,Odd,Space,MarkStop Bits1,1.5,2Serial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GNDRS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersInput Voltage10to36VDCPower Consumption40W(max.)Physical CharacteristicsHousing MetalIP Rating IP66,frontIP20,rearDimensions306x245x64mm(12x9.6x2.5in)Weight2,640g(5.82lb)Environmental LimitsOperating Temperature-40to70°C(-40to158°F)Storage Temperature(package included)-40to70°C(-40to158°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN55032/24EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-2ESD:Contact:4kV;Air:8kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:1kV;Signal:0.5kVIEC61000-4-5Surge:Power:2kV;Signal:1kVIEC61000-4-6CS:10VIEC61000-4-8PFMFEnvironmental Testing IEC60068-2-1,DNV-CG-0339IEC60068-2-2,DNV-CG-0339IEC60068-2-2,IEC60945IEC60068-2-30,IEC60945Hazardous Locations ATEXClass I Division2IECExMaritime DNVMechanical Protection Rating IEC60529,IP codeSafety EN60950-1IEC60950-1UL60950-1Shock IEC60068-2-27Vibration IEC60068-2-6IEC60068-2-6,IEC60945IEC60068-2-64,DNV-CG-0339DeclarationGreen Product RoHS,CRoHS,WEEEWarrantyWarranty Period LCD:1yearSystem:3yearsDetails See /warrantyPackage ContentsDevice1x MPC-2120Series computerInstallation Kit8x screw,for panel-mounting1x terminal block,2-pin(for DC power input)1x terminal block,10-pin(for DIO)1x terminal block,2-pinfor remote power switchDocumentation1x quick installation guide1x warranty cardDimensionsOrdering InformationMPC-2120-E2-T 12"(4:3)1,000nitsIntelAtom®E38264GB–Capacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E2-LB-T 12"(4:3)500nitsIntelAtom®E38264GB–Capacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E4-T 12"(4:3)1,000nitsIntelAtom®E38454GB–Capacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E4-LB-T 12"(4:3)500nitsIntelAtom®E38454GB–Capacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E2-T-W7E 12"(4:3)1,000nitsIntelAtom®E38264GBW7E32GB CFastCapacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E2-LB-T-W7E 12"(4:3)500nitsIntelAtom®E38264GBW7E32GB CFastCapacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E4-T-W7E 12"(4:3)1,000nitsIntelAtom®E38454GBW7E32GB CFastCapacitive224/412/24VDCIP66(front),IP20(rear)-40to70°CMPC-2120-E4-LB-T-W7E 12"(4:3)500nitsIntelAtom®E38454GBW7E32GB CFastCapacitive224/412/24VDCIP66(front),IP20(rear)-40to70°C©Moxa Inc.All rights reserved.Updated Jul07,2023.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。
2 KEYS电容式触摸按键规格书说明书
TTY6753 2 KEYS 电容式触摸按键规格书 Ver1.0●产品描述 (2)●产品特色 (2)●产品应用 (2)●封装脚位图 (3)●脚位定义 (4)●AC／DC Characteristics (5)1Absolute maximum ratings (5)2 D.C. Characteristics (5)3 A.C. Characteristics (5)●输出指示 (6)●注意事项： (7)●应用线路图 (8)●封装说明 (9)●订购信息 (9)●修订记录 (9)●产品描述提供2个触摸感应按键，一对一直接输出，提供低功耗模式，可使用于电池应用的产品。
对于防水和抗干扰方面有很优异的表现。
●产品特色工作电压范围：2.7V - 5.5V工作电流： 1.8mA (正常模式)；10 uA (休眠模式) @3.3V2个触摸感应按键持续无按键4秒(根据不同产品应用可由FuncEdit修改参数)，进入休眠模式提供一对一的直接输出，未按键为高电平输出可以经由调整CAP脚的外接电容，调整灵敏度，电容越大灵敏度越高具有防水及水漫成片水珠覆盖在触摸按键面板，按键仍可有效判别●产品应用各种大小家电、娱乐产品。
封装脚位图●脚位定义接脚类型●I COMS输入●O COMS输出●P 电源AC ／DC Characteristics2 D.C. Characteristics（Condition : Ta= 25 ± 3 ℃，RH ≦ 65 %，VDD =＋ 5V ，VSS=0V ）3 A.C. CharacteristicsParameterSymbol Test ConditionsMin Typ Max Unit Operating voltage VDD 2.7 5 5.5 V Operating current I OPR1 VDD=5V- 3 - mA Input low voltage for input and I/O portV IL1 0 - 0.3VDD V Input high voltage for input and I/O portV IH10.7VDD- VDD V Output port source current I OH1 V OH =0.9VDD, @5V - 4 - mA Output port sink currentI OL1V OL =0.1VDD, @5V-8-mAParameterSymbol Test Conditions Min Typ Max Unit System clock f SYS1 OSC @5v- 4 - MHz Low Voltage ResetV lvr2.02.22.4V输出指示一提供2 keys 电容触摸按键，输出是采用一对一直接输出。
Kinetis全系列选型手册-14
SPI
I2C
I2S
CA
线
口 接口 T
N
USB QTG(1)
2 41
2 51
2 51
2 41
2 51
2 51
18/16/2
3 5211
20/16/4
4 5211
32/32/6
5 6211
18/16/2
3 5211
20/16/4
4 5211
21/16/5
5 6211
32/32/6
5 6211
18/16/2
4 521
FS
5 6 3 1 1 FS
6 6 3 1 1 FS
32/32/6 8位 32/32/6 8位 32/32/6 8位
6 6 3 1 1 FS 5 6 3 1 1 FS 6 6 3 1 1 FS
32/32/6 8位
6 6 3 1 1 FS
以太网
定时器
模拟 能
电机控 带正 AD ADC ADC
22√
66
32/32/6
4 621
FS￠
2*8 2*2 2 4 38
22√
81
18/16/2
3 5 3 1 1 FS
2*8 2*2 2 2 22
13√
40(38)
20/16/2 4位
4 5 3 1 1 FS
2*8 2*2 2 3 27
13√
52(52)
21/16/5 4位
5 6 3 1 1 FS
2*8 2*2 2 5 33
USB QTG(1)
FS￠ FS￠ FS￠ FS￠ FS￠ FS￠ FS￠ FS￠
以太网
定时器
模拟 能
SVF12N60T F S K 600V N沟道增强型场效应管说明书
版本号：2.2 共 10 页 第 6 页
封装外形图
TO-263-2L
10.15±0.30
SVF12N60T/F/S/K 说明书
1.27±0.10
4.57±0.10
单位：毫米
15.25±0.25 8.70±0.20
TO-262-3L
5.28±0.20
1.27±0.10
1.5±0.20
2.54TYP 4.98～5.18
3. 基本上不受工作温度的影响。
典型值 ----
530 4.8
最大值 12 48 1.3 ---
单位
A V ns µC
典型特性曲线
杭州士兰微电子股份有限公司
http: //
版本号：2.2 共 10 页 第 3 页
典型特性曲线（续）
SVF12N60T/F/S/K 说明书
版本号：2.2 共 10 页 第 5 页
典型测试电路
SVF12N60T/F/S/K 说明书
栅极电荷量测试电路及波形图
与待测器件
VGS
参数一致
Qg
50KΩ
10V
VDS
12V
200nF
300nF
Qgs
Qgd
VGS
3mA
待测器件
电荷量
VDS VGS RG
10V
开关时间测试电路及波形图
RL VDD
待测器件
工作结温范围
贮存温度范围
符号 VDS VGS
ID IDM PD EAS TJ Tstg
SVF12N60T
225 1.8
参数范围
SVF12N60F SVF12N60S
600
±30
12
7.6
LNK364PN开关电源芯片应用方案-奥伟斯科技
●内容导航：LNK362PN/LNK362GN/LNK362DNLNK363PN/LNK363GN/LNK363DNLNK364PN/LNK364GN/LNK364DN●公司简介●LNK364PN产品规格书●产品图片●优势产品简介●公司简介深圳市奥伟斯科技有限公司是一家专注触摸芯片,单片机,电源管理芯片,语音芯片,场效应管,显示驱动芯片,网络接收芯片,运算放大器,红外线接收头及其它半导体产品的研发,代理销售推广的高新技术企业.奥伟斯科技自成立以来一直致力于新半导体产品在国内的推广与销售,年销售额超过壹亿人民币是一家具有综合竞争优势的专业电子元器件代理商.本公司代理推广的一系列优秀触摸芯片及语音芯片，现以大批量应用到智能电子锁、饮水机、电饭煲、LED 台灯等控制器为顾客提供最佳解决方案，受到广大客户的一致赞誉。
奥伟斯科技优势行业集中在家用电器和汽车电子领域，包括：智能电子锁、饮水机、抽烟机、空调、洗衣机、冰箱、洗碗机、电饭煲、电磁炉、微波炉、电动自行车、汽车仪表、汽车音响、汽车空调等。
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奥伟斯科技已为众多世界著名企业提供服务如：美的、小米、云米、长虹、创维、三星、LG、飞利浦、TCL、海尔、美菱、沁园、等众多中国一流品牌电家厂商奥伟斯科技提供专业的智能电子锁触摸解决方案,并提供电子锁整套的芯片配套:低功耗触摸芯片低功耗单片机马达驱动芯片显示驱动芯片刷卡芯片时针芯片存储芯片语音芯片低压MOS管 TVS二极管OWEIS触摸芯片 OWEIS接口芯片 OWEIS电源芯片 OWEIS语音芯片 OWEIS场效应管一.电容式触摸芯片ADSEMI触摸芯片代理芯邦科技触控芯片万代科技触摸按键芯片博晶微触摸控制芯片海栎创触摸感应芯片启攀微触摸IC 融和微触摸感应IC 合泰触摸按键IC 通泰触摸芯片二.汽车电子/电源管理/接口芯片/逻辑芯片:IKSEMICON一级代理 ILN2003ADT IK62783DT IL2596 IL2576 ILX485 ILX3485 ILX232 ILX3232 三.功率器件/接收头/光电开关:KODENSHI AUK SMK系列MOS管SMK0260F SMK0460F SMK0760F SMK1260F SMK1820F SMK18T50F四. LED显示驱动芯片:中微爱芯AIP系列 AIP1668 AIP1628 AIP1629 AIP1616天微电子TM系列 TM1628 TM1668 TM1621 五.电源管理芯片:Power Integrations LNK364PN LNK564PN 芯朋微PN8012 PN8015 AP5054 AP5056 力生美晶源微友达天钰电子FR9886 FR9888六.语音芯片:APLUS巨华电子AP23085 AP23170 AP23341 AP23682 AP89085 AP89170 AP89341 AP89341K AP89682七.运算放大器:3PEAK运算放大器聚洵运算放大器圣邦微运算放大器八.发光二极管:OSRAM欧司朗发光二极管 Lite-On光宝发光二极管 Everlight亿光发光二极管 Kingbright今台发光二极管九. CAN收发器:NXP恩智浦CAN收发器 Microchip微芯CAN收发器十.分销产品线:ONSEMI安森美 TI德州仪器 ADI TOSHIBA东芝 AVAGO安华高十一 MCU单片机ABOV现代单片机MC96F系列 Microchip微芯单片机PIC12F PIC16F PIC18F系列 FUJITSU富仕通单片机MB95F系列 STM单片机STM32F STM32L系列 CKS中科芯单片机CKS32F系列 TI单片机MSP430系列 TMS320F系列 NXP单片机LPC系列LNK362-364®Off-Line Switcher ICProduct HighlightsOptimized for Lowest System Cost•Proprietary IC trimming and transformer construction techniques enable Clampless™ designs with LNK362for lower system cost, component count and higherefficiency•Fully integrated auto-restart for short circuit and open loop protection•Self-biased supply – saves transformer auxiliary winding and associated bias supply components•Frequency jittering greatly reduces EMI•Meets HV creepage requirements between DRAIN and all other pins both on the PCB and at the package •Lowest component count switcher solutionFeatures Superior to Linear/RCC•Accurate hysteretic thermal shutdown protection –automatic recovery improves field reliability •Universal input range allows worldwide operation •Simple ON/OFF control, no loop compensation needed •Eliminates bias winding – simpler, lower cost transformer•Very low component count – higher reliability and single side printed circuit board•Auto-restart reduces delivered power by 95% during short circuit and open loop fault conditions•High bandwidth provides fast turn-on with no overshoot and excellent transient load responseEcoSmart®– Extremely Energy-Efficient•Easily meets all global energy efficiency regulations with no added components•No-load consumption <300 mW without bias winding at 265 VAC input (<50 mW with bias winding)•ON/OFF control provides constant efficiency to very light loads – ideal for mandatory CEC regulations Applications•Chargers/adapters for cell/cordless phones, PDAs, digital cameras, MP3/portable audio players, and shavers •Supplies for appliances, industrial systems, and metering DescriptionLinkSwitch-XT incorporates a 700 V p ower MOSFET, oscillator, simple O N/OFF c ontrol s cheme, a h igh-voltage s witched c urrent source, frequency jittering, cycle-by-cycle current limit and thermal shutdown circuitry onto a monolithic IC. The startup Figure 1. Typical Application with LinkSwitch-XT.Table 1. Output Power Table.Notes:1. Minimum continuous power in a typical non-ventilated enclosedadapter measured at 50 °C ambient.2. Minimum practical continuous power in an open frame designwith adequate heat sinking, measured at 50 °C ambient.3. Packages: P: DIP-8B, G: SMD-8B, D: SO-8C. Please see PartOrdering Information.4. See K ey A pplication C onsiderations s ection f or c omplete d escriptionof assumptions.and operating power are derived directly from the DRAIN pin, eliminating the need for a bias winding and associated circuitry.Figure 2. Functional Block Diagram.Pin Functional DescriptionDRAIN (D) Pin:Power MOSFET drain connection. Provides internal operatingcurrent for both startup and steady-state operation.BYPASS (BP) Pin:Connection point for a 0.1 μF external bypass capacitor for theinternally generated 5.8 V supply. If an external bias winding isused, the current into the BP pin must not exceed 1 mA.FEEDBACK (FB) Pin:During normal operation, switching of the power MOSFET iscontrolled by this pin. MOSFET switching is disabled when acurrent greater than 49 μA is delivered into this pin.Figure 3. Pin Configuration. SOURCE (S) Pin:This pin is the power MOSFET source connection. It is also theground reference for the BYPASS and FEEDBACK pins.LinkSwitch-XTFunctional DescriptionLinkSwitch-XT combines a high-voltage power MOSFET switch with a power supply controller in one device. Unlike conventional PWM (pulse width modulator) controllers, a simple ON/OFF control regulates the output voltage. The controller consists of an oscillator, feedback (sense and logic) circuit, 5.8 V regulator, BYPASS pin undervoltage circuit, over-temperature protection, frequency jittering, current limit circuit, and leading edge blanking integrated with a 700 V power MOSFET. The LinkSwitch-XT incorporates additional circuitry for auto-restart.OscillatorThe typical oscillator frequency is internally set to an average of 132 kHz. Two signals are generated from the oscillator: the maximum duty cycle signal (DC MAX ) and the clock signal that indicates the beginning of each cycle.The oscillator incorporates circuitry that introduces a small amount of frequency jitter, typically 9 kHz peak-to-peak, to minimize EMI emission. The modulation rate of the frequency jitter is set to 1.5 kHz to optimize EMI reduction for both average and quasi-peak emissions. The frequency jitter should be measured with the oscilloscope triggered at the falling edge of the DRAIN waveform. The waveform in Figure 4 illustrates the frequency jitter.Feedback Input CircuitThe feedback input circuit at the FB pin consists of a low impedance source follower output set at 1.65 V for LNK362 and 1.63 V for LNK363/364. When the current delivered into this pin exceeds 49 μA, a low logic level (disable) is generated at the output of the feedback circuit. This output is sampled at the beginning of each cycle on the rising edge of the clock signal. If high, the power MOSFET is turned on for that cycle (enabled), o therwise t he p ower M OSFET r emains o ff (disabled). Since the sampling is done only at the beginning of each cycle, subsequent changes in the FB pin voltage or current during the remainder of the cycle are ignored.5.8 V Regulator and6.3 V Shunt Voltage ClampThe 5.8 V regulator charges the bypass capacitor connected to the BYPASS pin to 5.8 V by drawing a current from the voltage on the DRAIN, whenever the MOSFET is off. The BYPASS pin is the internal supply voltage node. When the MOSFET is on, the LinkSwitch-XT r uns off of the e nergy stored in the b ypass capacitor. Extremely low power consumption of the internal circuitry allows the device to operate continuously from the current drawn from the DRAIN pin. A bypass capacitor value of 0.1 μF is sufficient for both high frequency decoupling and energy storage.In addition, there is a 6.3 V shunt regulator clamping the BYPASS pin at 6.3 V when current is provided to the BYPASS pin through an external resistor. This facilitates powering of the device externally through a bias winding to decrease the no-load consumption to less than 50 mW.BYPASS Pin UndervoltageThe BYPASS pin undervoltage circuitry disables the power MOSFET when the BYPASS pin voltage drops below 4.8 V. Once the BYPASS pin voltage drops below 4.8 V, it must rise back to 5.8 V to enable (turn-on) the power MOSFET.Over-Temperature ProtectionThe thermal shutdown circuitry senses the die temperature. The threshold is set at 142 ︒C typical with a 75 ︒C hysteresis. When the die temperature rises above this threshold (142 ︒C) the power MOSFET is disabled and remains disabled until the die temperature falls by 75 ︒C, at which point it is re-enabled.Current LimitThe current limit circuit senses the current in the power MOSFET. When this current exceeds the internal threshold (I LIMIT ), the power MOSFET is turned off for the remainder of that cycle. The leading edge blanking circuit inhibits the current limit comparator for a short time (t LEB ) after the power MOSFET is turned on. This leading edge blanking time has been set so that current spikes caused by capacitance and rectifier reverse recovery time will not cause premature termination of the switching pulse.Auto-RestartIn the event of a fault condition such as output overload, output short circuit, or an open loop condition, LinkSwitch-XT enters into auto-restart operation. An internal counter clocked by the oscillator gets reset every time the FB pin is pulled high. If the FB pin is not pulled high for approximately 40 ms, the power MOSFET switching is disabled for 800 ms. The auto-restart alternately enables and disables the switching of the power MOSFET until the fault condition is removed.600500400300200100510Time (μs)Figure 4. Frequency Jitter.P I -4047-110205Figure 5. 2 W Universal Input CV Adapter Using LNK362.Applications ExampleA 2 W CV AdapterThe schematic shown in Figure 5 is a typical implementation of a universal input, 6.2 V ±7%, 322 mA adapter using LNK362. This circuit makes use of the Clampless technique to eliminate the primary clamp components and reduce the cost and complexity of the circuit.The EcoSmart features built into the LinkSwitch-XT family allow this design to easily meet all current and proposed energy e fficiency s tandards, i ncluding t he m andatory C alifornia Energy Commission (CEC) requirement for average operating efficiency.The AC input is rectified by D1 to D4 and filtered by the bulk storage capacitors C1 and C2. Resistor RF1 is a flameproof, fusible, wire wound type and functions as a fuse, inrush current limiter and, together with the π filter formed by C1, C2, L1 and L2, differential mode noise attenuator. Resistor R1 damps ringing caused by L1 and L2.This simple input stage, together with the frequency jittering of LinkSwitch-XT, a low value Y1 capacitor and PI’s E-Shield™ windings within T1, allow the design to meet both conducted and radiated EMI limits with >10 dBμV margin. The low value of CY1 is important to meet the requirement for a very low touch current (the line frequency current that flows through CY1) often specified for adapters, in this case <10 μA.The rectified and filtered input voltage is applied to the primary winding of T1. The other side of the primary is driven by the integrated MOSFET in U1. No primary clamp is required as the low value and tight tolerance of the LNK362 internal current limit allows the transformer primary winding capacitance to provide adequate clamping of the leakage inductance drain voltage spike.The secondary of the flyback transformer T1 is rectified by D5, a low cost, fast recovery diode, and filtered by C4, a low ESR capacitor. The combined voltage drop across VR1, R2 and the LED of U2 determines the output voltage. When the output voltage exceeds this level, current will flow through the LED of U2. As the LED current increases, the current fed into the FEEDBACK pin of U1 increases until the turnoff threshold current (~49 μA) is reached, disabling further switching cycles of U1. At full load, almost all switching cycles will be enabled, and at very light loads, almost all the switching cycles will be disabled, giving a low effective frequency and providing high light load efficiency and low no-load consumption. Resistor R3 provides 1 mA through VR1 to bias the Zener closer to its test current. Resistor R2 allows the output voltage to be adjusted to compensate for designs where the value of the Zener may not be ideal, as they are only available in discrete voltage ratings. For higher output accuracy, the Zener may be replaced with a reference IC such as the TL431.O POOR The L inkSwitch-XT i s c ompletely s elf-powered f rom t he D RAIN 2. For designs where P O ≤ 2 W, a two-layer primary should be pin, requiring only a small ceramic capacitor C3 connected to the BYPASS pin. No auxiliary winding on the transformer is used to ensure adequate primary intra-winding capacitance in the range of 25 pF to 50 pF.required.3. For designs where 2 < P ≤ 2.5 W, a bias winding should beKey Application ConsiderationsLinkSwitch-XT Design ConsiderationsOutput Power TableThe data sheet maximum output p ower table (Table 1) represents the maximum practical continuous output power level that can be obtained under the following assumed conditions:1. The minimum DC input voltage is 90 V or higher for 85 VAC input, or 240 V or higher for 230 VAC input or 115 VAC with a voltage doubler. The value of the input capacitance should be large enough to meet these criteria for AC input designs.2. Secondary output of 6 V with a fast PN rectifier diode.3. Assumed efficiency of 70%.4. Voltage only output (no secondary-side constant current circuit).5. Discontinuous mode operation (K >1).6. A primary clamp (RCD or Zener) is used.7. The part is board mounted with SOURCE pins soldered to a sufficient area of copper to keep the SOURCE pin temperature at or below 100 °C. 8. Ambient temperature of 50 °C for open frame designs and an internal enclosure temperature of 60 °C for adapter designs.Below a value of 1, K P is the ratio of ripple to peak primary current. Above a value of 1, K P is the ratio of primary MOSFET OFF time to the secondary diode conduction time. Due to the flux density requirements described below, typically a LinkSwitch-XT design will be discontinuous, which also has the benefits of allowing lower cost fast (instead of ultra-fast) output diodes and reducing EMI.Clampless DesignsClampless designs rely solely on the drain node capacitance to limit the leakage inductance induced peak drain-to-source voltage. Therefore, the maximum AC input line voltage, the value of V OR , the leakage inductance energy, a function of leakage inductance and peak primary current, and the primary winding capacitance determine the peak drain voltage. With no significant dissipative element present, as is the case with an external clamp, the longer duration of the leakage inductance ringing can increase EMI.The following requirements are recommended for a universal input or 230 VAC only Clampless design:1. A Clampless design should only be used for P ≤2.5 W, using the LNK362†and a V ** ≤ 90 V. added to the transformer using a standard recovery rectifier diode to act as a clamp. This bias winding may also be used to externally power the device by connecting a resistor from the bias-winding capacitor to the BYPASS pin. This inhibits the internal high-voltage current source, reducing device dissipation and no-load consumption.4. For designs where P O > 2.5 W Clampless designs are not practical and an external RCD or Zener clamp should be used.5. Ensure that worst-case high line, peak drain voltage is below the BV DSS specification of the internal MOSFET and ideally ≤ 650 V to allow margin for design variation.†For 110 VAC only input designs it may be possible to extend the power range of Clampless designs to include the LNK363. However, the increased leakage ringing may degrade EMI performance.**V OR is the secondary output plus output diode forward voltage drop that is reflected to the primary via the turns ratio of the transformer during the diode conduction time. The V OR adds to the DC bus voltage and the leakage spike to determine the peak drain voltage.Audible NoiseThe cycle skipping mode of operation used in LinkSwitch-XT can generate audio frequency components in the transformer. To limit this audible noise generation, the transformer should be designed such that the peak core flux density is below 1500 Gauss (150 mT). Following this guideline and using the standard transformer production technique of dip varnishing practically eliminates audible noise. Vacuum impregnation of the transformer should not be used due to the high primary capacitance a nd i ncreased l osses t hat r esult. H igher f lux d ensities are possible, however careful evaluation of the audible noise performance should be made using production transformer samples before approving the design.Ceramic capacitors that use dielectrics, such as Z5U, when used in clamp circuits may also generate audio noise. If this is the case, try replacing them with a capacitor having a different dielectric or construction, for example a film type.LinkSwitch-XT Layout ConsiderationsSee Figure 6 for a recommended circuit board layout for LinkSwitch-XT (P & G package).Single Point GroundingUse a single point ground connection from the input filter capacitor to the area of copper connected to the SOURCE p ins.Figure 6. Recommended Printed Circuit Layout for LinkSwitch-XT using P Package in a Flyback Converter Configuration.Bypass Capacitor C BPThe BYPASS pin capacitor should be located as near as possible to the BYPASS and SOURCE pins.Primary Loop AreaThe area of the primary loop that connects the input filter capacitor, transformer primary and LinkSwitch-XT together should be kept as small as possible.Primary Clamp CircuitA clamp is used to limit peak voltage on the DRAIN pin at turn-off. This can be achieved by using an RCD clamp or a Zener (~200 V) and diode clamp across the primary winding. In all cases, to minimize EMI, care should be taken to minimize the circuit path from the clamp components to the transformer and LinkSwitch-XT .Thermal ConsiderationsThe copper area underneath the LinkSwitch-XT acts not only as a single point ground, but also as a heatsink. As this area is connected to the quiet source node, it should be maximized for good heat sinking of LinkSwitch-XT . The same applies to the cathode of the output diode.Y-CapacitorThe placement of the Y-type cap should be directly from the primary input filter capacitor positive terminal to the common/ return terminal of the transformer secondary. Such a placement will route high magnitude common-mode surge currents away from the LinkSwitch-XT device. Note that if an input pi (C, L, C) EMI filter is used, then the inductor in the filter should be placed between the negative terminals of the input filter capacitors.OptocouplerPlace the optocoupler physically close to the LinkSwitch-XT to minimize the primary-side trace lengths. Keep the high current, high-voltage drain and clamp traces away from the optocoupler to prevent noise pick up.Output DiodeFor best performance, the area of the loop connecting the secondary winding, the output diode and the output filterTL i n k S w i t c h -X TFigure 7. Recommended Printed Circuit Layout for LinkSwitch-XT using D Package in a Flyback Converter Configuration. capacitor should be minimized. In addition, sufficient copperarea should be provided at the anode and cathode terminalsof the diode for heat sinking. A larger area is preferred at thequiet cathode terminal. A large anode area can increase highfrequency radiated EMI.Quick Design ChecklistAs with any power supply design, all LinkSwitch-XT designsshould be verified on the bench to make sure that componentspecifications a re n ot e xceeded u nder w orst-case c onditions. T hefollowing minimum set of tests is strongly recommended:1.Maximum drain voltage – Verify that VDS does not exceed650 V at the highest input voltage and peak (overload) outputpower. The 50 V margin to the 700 V BVDSS specificationgives margin for design variation, especially in Clampless designs.2.Maximum d rain c urrent –At m aximum a mbient t emperature,maximum input voltage and peak output (overload) power, verify drain current waveforms for any signs of transformersaturation and excessive leading-edge current spikes at startup.Repeat under steady state conditions and verify that the leading- edge current spike event is below ILIMIT(MIN)at the end of the tLEB(MIN). Under all conditions, the maximum drain current should be below the specified absolute maximum r atings. 3.Thermal Check –At specified maximum output power,minimum i nput v oltage a nd maximum a mbient t emperature, verify that the temperature specifications are not exceeded for LinkSwitch-XT, transformer, output diode and output capacitors. Enough thermal margin should be allowed for part-to-part variation of the RDS(ON)of LinkSwitch-XT as specified in the data sheet. Under low line, maximum power,a maximum LinkSwitch-XT SOURCE pin temperature of105 °C is recommended to allow for these variations. Design ToolsUp-to-date information on design tools can be found at the Power Integrations web site: .TLinkSwitch-XTNotes:DRAIN Voltage ............................................................ V to 700 V Peak DRAIN Current: LNK362. .............. 200 mA (375 mA)(2)Notes:1.All voltages referenced to SOURCE, TA= 25 ︒C.LNK363/364. ....... 400 mA (750 mA)(2) FEEDBACK Voltage ....................................................... V to 9 V FEEDBACK Current ................................................... 100 mA BYPASS Voltage. ............................................................. V to 9 V Storage Temperature .....................................-65 ︒C to 150 ︒C Operating Junction Temperature(3) ................-40 ︒C to 150 ︒C Lead Temperature(4) ................................................................................................. 260 ︒C 2.The higher peak DRAIN current is allowed while theDRAIN voltage is simultaneously less than 400 V.3.Normally limited by internal circuitry.4.1/16 in. from case for 5 seconds.5.Maximum ratings specified may be applied, one at a time,without causing permanent damage to the product.Exposure to Absolute Maximum Rating conditions forextended periods of time may affect product reliability.NOTES:A. Total current consumption is the sum of IS1 and IDSSwhen FEEDBACK pin voltage is ≥2 V (MOSFET notswitching) and the sum of IS2 and IDSSwhen FEEDBACK pin is shorted to SOURCE (MOSFET switching).B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at theDRAIN. An alternative is to measure the BYPASS pin current at 6 V.C. See Typical Performance Characteristics section Figure 15 for BYPASS pin startup charging waveform.D. This current is only intended to supply an optional optocoupler connected between the BYPASS and FEEDBACKpins and not any other external circuitry.E. For current limit at other di/dt values, refer to Figure 14.F. This parameter is guaranteed by design.G. This parameter is derived from characterization.H. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage upto but not exceeding minimum BVDSS.I. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional tofrequency).Figure 8. LinkSwitch-XT General Test Circuit.Figure 9. LinkSwitch-XT Duty Cycle Measurement. Figure 10. LinkSwitch-XT Output Enable Timing.P I -2240-012301D R A I N C u r r e n t (m A )Typical Performance Characteristics1.21.00.80.6 0.40.2-50 -25 0 25 50 75 100 125 150Junction Temperature (︒C)-50 -250 25 50 75 100 125Junction Temperature (︒C)Figure 11. Breakdown vs. Temperature.Figure 12. Frequency vs. Temperature.-5050100150Temperature (︒C)1.41.21.0 0.8 0.6 0.40.20 12345Normalized di/dtFigure 13. Current Limit vs. Temperature. Figure 14. Current Limit vs. di/dt.7400 6 3505 300 4 250 3 200 2 150 1 100500.20.40.60.81.00 24 68 10 12 14 16 18 20Time (ms)Figure 15. BYPASS Pin Startup Waveform.DRAIN Voltage (V)Figure 16. Output Characteristics.C u r r e n t L i m i t (N o r m a l i z e d t o 25 ︒C )B r e a k d o w n V o l t a g e (N o r m a l i z e d t o 25 ︒C )B Y P A S S P i n V o l t a g e (V )P I -2213-012301O u t p u t F r e q u e n c y (N o r m a l i z e d t o 25 ︒C )N o r m a l i z e d C u r r e n t L i m i tP I -4093-081605P I -4092-081505P I -2680-012301Typical Performance Characteristics (cont.)1000100101 0100200300400500600Drain Voltage (V)Figure 17. C OSS vs. Drain Voltage.D r a i n C a p a c i t a n c e (p F )P I -4094-081605Pin-E-.240 (6.10) .260 (6.60).137 (3.48)MINIMUM.367 (9.32)DIP-8BNotes:1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing.2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses.3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side.4. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted.5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm).6. Lead width measured at package body..125 (3.18) .145 (3.68).387 (9.83).057 (1.45) .068 (1.73) (NOTE 6).015 (.38) MINIMUM7. Lead spacing measured with the leads constrained to be perpendicular to plane T..100 (2.54) BSC.014 (.36).120 (3.05) .140 (3.56).048 (1.22)E D S .010 (.25) M .008 (.20) .015 (.38).300 (7.62) BSC (NOTE 7).300 (7.62).390 (9.91)P08BPI-2551-121504.367 (9.32) SEATING PLANE -T- -D-1.004 (.10)D S ⊕For the latest updates, visit our website: Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. Patent InformationThe products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrations patents may be found at . Power Integrations grants its customers a license under certain patent rights as set forth at /ip.htm.Life Support PolicyPOWER INTEGRATIONS PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein:1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii)whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to causethe failure of the life support device or system, or to affect its safety or e ffectiveness.The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, PeakSwitch, EcoSmart, Clampless, E-Shield, Filterfuse, StakFET, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective c ompanies.©2007, Power Integrations, Inc.。
摩克斯 V464 系列芯片计算机产品介绍说明书
The V464 embedded computers are based on the AMD x86 processor, and feature 4 serial ports, quad LAN ports, 4 USB 2.0 hosts, and CompactFlash. A VGA interface is also included, making the V464 computers particularly well-suited for industrial applications such as SCADA and factory automation.The V464 computers’ 4 serial ports can be used to connect a wide range of serial devices, and the quad 10/100 Mbps Ethernet ports offer a reliable solution for network redundancy, promising continuousFront Viewoperation for data communication and management. In addition, the CompactFlash and USB sockets provide the V464 computers with the reliability needed for industrial applications that require data buffering and storage expansion.The V464 computers come with the WinCE 6.0 or WinXP Embedded operating system already installed. WinCE 6.0 and WinXP Embedded provide programmers with a friendly environment for developingsophisticated, bug-free application software at a lower cost.OverviewAppearanceRear View10/100 Mbps SocketSerial Ports x 2Serial Ports x 2 9-36 VDCComputerCPU:******************************************,500 MHzOS (pre-installed): Windows CE 6.0 or Windows XP Embedded System Chipset: AMD CS5536BIOS: 4 Mbit Flash BIOS, supporting Plug & Play, APM 1.2, ACPI 1.0 SRAM: 256 KB, battery backupFSB: 400 MHzSystem Memory: 200-pin SO-DIMM socket with built-in 256 MB (CE) or 512 MB (XPe) DDR, supporting DDR400 up to 1 GB Expansion Bus: PC/104-Plus onboardUSB: USB 2.0 compliant hosts x 4, type A connector, supports system boot upStorageBuilt-in: 256 MB (CE) or 1 GB (XPe) industrial DOM for OS Storage Expansion: CompactFlash socketOther PeripheralsKB/MS: 1 PS/2 interface supporting standard PS/2 keyboard and mouse through Y-type cableAudio: AC97 audio, with line-out interfaceDisplayGraphics Controller: CPU integrated 2D graphicsDisplay Interface: CRT interface for VGA outputEthernet InterfaceLAN: 4 10/100 Mbps, auto-sensing (RJ45) portsController: Realtek RTL8100CLMagnetic Isolation Protection: 1.5 KV built-inSerial InterfaceSerial Standards:• 2 RS-232 ports (DB9 male)• 2 RS-232/422/485 ports, software selectable (DB9 male)ESD Protection: 15 KV for all signalsSerial Communication ParametersData Bits: 5, 6, 7, 8Stop Bits: 1, 1.5, 2Parity: None, Even, Odd, Space, MarkFlow Control: RTS/CTS, XON/XOFF, ADDC® (automatic data direction control) for RS-485Baudrate: 50 bps to 921.6 Kbps (non-standard baudrates supported; see user’s manual for details)Serial SignalsRS-232: TxD, RxD, DTR, DSR, RTS, CTS, DCD, GNDRS-422: TxD+, TxD-, RxD+, RxD-, GND RS-485-4w: TxD+, TxD-, RxD+, RxD-, GNDRS-485-2w: Data+, Data-, GNDLEDsSystem: Power, Battery, StorageLAN: 10M/Link x 2, 100M/Link x 2 (on connector)Switches and ButtonsPower Switch: on/offReset Button: For warm rebootPhysical CharacteristicsHousing: AluminumWeight: 1.32 kgDimensions:Without ears: 223 x 121 x 57 mm (8.78 x 4.76 x 2.24 in)With ears: 248 x 140 x 70 mm (9.76 x 5.51 x 2.76 in)Mounting: DIN-Rail, wallEnvironmental LimitsOperating Temperature: -10 to 60°C (14 to 140°F)Operating Humidity: 5 to 95% RHStorage Temperature: -20 to 80°C (-4 to 176°F)Anti-vibration: 5 g rms @ IEC-68-2-34, random wave, 5-500 Hz, 1 hr per axisAnti-shock: 50 g @ IEC-68-2-27, half sine wave, 11 msPower RequirementsInput Voltage: 9 to 36 VDC (3-pin terminal block for V+, V-, SG) Power Consumption: 26 W• 730 mA @ 36 VDC• 1080 mA @ 24 VDC• 2820 mA @ 9 VDCRegulatory ApprovalsEMC: CE (EN55022 Class A, EN61000-3-2 Class A, EN61000-3-3, EN55024), FCC (Part 15 Subpart B, CISPR 22 Class A), CCC (GB9254, GB 17625.1)Safety: UL/cUL (UL60950-1, CSA C22.2 No. 60950-1-03), LVD, CCC (GB4943)Green Product: RoHS, cRoHS, WEEEReliabilityAlert Tools: Built-in buzzer and RTC (real-time clock) with battery backupAutomatic Reboot Trigger: Built-in WDT (watchdog timer) supporting 1-255 level time interval system reset, software programmable WarrantyWarranty Period: 3 yearsDetails: See /warrantyHardware SpecificationsWindows Embedded CE 6.0System Utilities: Windows command shell, telnet, ftpFile System: FAT (on-board flash)Protocol Stack: TCP, UDP, IPv4, SNMP V2, ICMP, IGMP, ARP, HTTP, CHAP, PAP, SSL, DHCP, SNTP, SMTP, Telnet, FTP, PPP Telnet Server: Allows remote administration through a standard telnet client.FTP Server: Used for transferring files to and from remote computer systems over a network.File Server: Enables clients to access files and other resources over the network (Microsoft® Wincows® CE).Web Server (httpd): Includes ASP, ISAPI Secure Socket Layer support, SSL 2, SSL 3, and Transport Layer Security (TLS/SSL 3.1) public key-based protocols, and Web Administration ISAPI Extensions.Dial-up Networking Service: RAS client API and PPP, supporting Extensible Authentication Protocol (EAP) and RAS scripting. Watchdog Service: CPU Hardware function to reset CPU in a user specified time interval (triggered by calling a MOXA library function).Application Development Software:• Moxa WinCE 6.0 SDK• C Libraries and Run-times• Component Services (COM and DCOM)• Microsoft® .NET Compact Framework 2.0 SP2• XML, including DOM, XQL, XPATH, XSLT, SAX, SAX2• SOAP Toolkit Client• Winsock 2.2Software SpecificationsWindows XP EmbeddedSystem Utilities: Windows command shell, Telnet, ftp, Wireless Zero Configuration File System: NTFSProtocol Stack: DHCP, IPv4, DNS, IPsec, HTTP, TCP, UDP, ICMP, IGMP, ARP, TAPI, TSP, SNMP V2, NTP, ICS, PPP, CHAP, EAP, SNTP, Telnet, SNTP, FTP, SMTP, PPPoE, PPTP, NetBIOSTelnet Server: Allows users to connect to Telnet servers from remote computers.IIS Web Server: Allows you to create and manage Web sites.Terminal Server: Microsoft Terminal Server client application (mstsc.exe).COM+ Services: The next evolution of Microsoft Component Object Model (COM) and Microsoft Transaction Server (MTS).Computer Browser Service: Computer browsing functionalityexposed by Windows through Microsoft Networking. Allows a client machine to browse its network neighborhood for available computers exposing file and print sharing services.Disk Management Services: Support for disk and volumemanagement operations. The component implements a Component Object Model (COM) interface that can be used to query and configure disks and volumes, both basic and dynamic. The component also monitors disk arrivals and removals and other changes in the storage subsystem.Remote Registry Service: Enables remote users to modify registry settings on this computer.Application Development Software:• Microsoft .Net Framework 2.0 with service pack 2 (CLR and the .NET Framework class library)• Active Directory Service Interface (ADSI) Core • Active Template Library (ATL), 2.0• Certificate Request Client & Certificate Autoenrollment (CLR and the .NET Framework class library) • COM APIs• Common Control Libraries • Common File Dialogs• Direct3D, DirectPlay, DirectShow and Direct show filters • Distributed Transaction Coordinator (MSDTC)• Enhanced Write Filter (Redirect disk write operations to volatile (RAM) or non-volatile (disk) storage) • Event Log, Internet Explorer • Mapi32 Libraries• Message Queuing (MSMQ) Core• Microsoft Visual C++ Run Time Libraries • Power Management dynamic-link library • Registry Editor • RPC• Smart Card Cryptographic Service Providers• USB 2.0 core drivers compliant with The USB .95 or 1.0 • Windows API, Media Player 10, Script Engines, and WMIV464 computer• Ethernet cable: RJ45 to RJ45 cross-over • cable, 100 cmDIN-rail Mounting Kit• PS2 to KB/MS Y-type Cable• Document and Software CD or DVD • Quick Installation Guide (printed)• Product Warranty Statement (printed)• Package ChecklistAvailable ModelsV464-CE: x86 embedded computer with 4 serial ports, quad LANs, VGA, CompactFlash, USB, and WinCE 6.0 OSV464-XPE: x86 embedded computer with 4 serial ports, quad LANs, VGA, CompactFlash, USB, and Windows XP Embedded OSOptional Accessories (can be purchased separately)PWR-24250-DT-S1: Power adaptorPWC-C7US-2B-183: Power cord with 2-pin connector, USA plug PWC-C7EU-2B-183: Power cord with 2-pin connector, Euro plug PWC-C7UK-2B-183: Power cord with 2-pin connector, British plug PWC-C7AU-2B-183: Power cord with 2-pin connector, Australia plug PWC-C7CN-2B-183: Power cord with 2-pin connector, China plugOrdering Information。
FOXBORO I A Series HARDWARE产品规格说明书
FOXBORO ®The FBM214 HART ® Communication Input Interface Module provides eight input channels, each accepting a 4 to 20mA analog signal or a digital HART signal superimposed on a 4 to 20 mA analog input signal.FEATURESKey features of the FBM214 module are:Eight analog input channels, each accepting oneof the following inputs:•Standard 4 to 20 mA analog sensor signal •Digital HART Frequency Shift Keying (FSK) signal superimposed on a 4 to 20 mA analog input signal.FSK modem dedicated to each input channel forbi-directional digital communications with a HART field deviceAnalog to digital conversion of each of the 4to20mA input signals from the HART devicesSupport for the HART universal commandsnecessary to interface the field device with the I/A Series ® system databaseGalvanic isolation of the group of 8 inputchannels from ground and module logicCompact, rugged design suitable for enclosure inClass G3 (harsh) environmentsHigh accuracy achieved by sigma-delta dataconversions for each channelTermination Assemblies (TAs) for locally orremotely connecting field wiring to the FBM214Termination Assemblies for per channel internallyand/or externally loop powered transmitters.PSS 21H-2Z14 B4 Page 2OVERVIEWThe FBM214 HART Communication Input Interface Module contains eight 4to20mA group isolated analog input channels. The FBM214 supports any mix of standard 4to20mA devices and HART devices.The FBM214 serves as a HART communications field device host, enabling the I/A Series system to request and receive two digital messages per second from the field device. The message pass-through capability can be used to support HART universal, common practice, and device-specific commands, but not the burst communication mode. These commands are implemented using the Intelligent Field Device Configurator (IFDC — refer toPSS 21S-8A3 B3 for details).The FBM214 provides a common isolated power supply to power all eight channels. Optionally, the channels can be powered by an external power supply. However, when a common external power supply is used with two or more channels, a Cable Balun module is required to prevent channel cross talk.COMPACT DESIGNThe FBM214 has a compact design, with a rugged extruded aluminum exterior for physical protection of the circuits. Enclosures specially designed for mounting the FBMs provide various levels of environmental protection, up to harsh environments per ISA Standard S71.04.HIGH ACCURACYFor high accuracy, the module incorporates a Sigma-Delta converter which can provide new analog input values for each channel every 100 milliseconds.VISUAL INDICATORSLight-emitting diodes (LEDs) incorporated into the front of the module provide visual indication of the module’s operational status, and communication activity on the channels.EASY REMOVAL/REPLACEMENTThe module can be removed/replaced without removing field device termination cabling, power, or communications cabling.FIELDBUS COMMUNICATIONA Fieldbus Communication Module or a Control Processor interfaces the redundant 2 Mbps module Fieldbus used by the FBMs. The FBM214 module accepts communication from either path (A or B) of the redundant 2 Mbps fieldbus – should one path fail or be switched at the system level, the module continues communication over the active path.The use of an external power supply common to two or more loops requires a Cable Balun Module to maintain communication signal line balance.MODULAR BASEPLATE MOUNTINGThe module mounts on a modular baseplate which accommodates up to four or eight FBMs. The modular baseplate is either DIN rail mounted or rack mounted, and includes signal connectors for redundant fieldbus, redundant independent dc power, and termination cables.TERMINATION ASSEMBLIESField input signals connect to the FBM subsystem via DIN rail mounted TAs. The TAs used with theFBM214 are described in “TERMINATION ASSEMBLIES AND CABLES” on page8.PSS 21H-2Z14 B4Page 3CABLE BALUN MODULEThe Cable Balun module is used to maintain digital communication line balance for HART Transmitter to FBM loops that are powered from a common external power supply. This powering effectively connects one line of each loop together. Without the Baluns, in each loop so powered, the common connection at the external power supply, would cause near end crosstalk at the system end of the loop wiring cable. Loops using FBM internal power source do not require Baluns.The Cable Balun module contains multiple Baluns. One Balun segment is interconnected in each loop powered from an external power supply per the diagram above. There is one Cable Balun module.Figure 1. Cable Balun Module Cable Balun ModuleModule Model ModulePart No.No. of Balunsin the ModuleCBM-4P0903SV4PSS 21H-2Z14 B4Page 4FUNCTIONAL SPECIFICATIONSField Device ChannelsVERSION SUPPORTEDHART Protocol v6INTERFACE8 group-isolated channelsCOMMUNICATION TO THE DEVICEPoint-to-point, master/slave, asynchronous, half-duplex, at 1200 baud.ERROR CHECKINGParity on each byte, and one CRC check byte.SPEED2 messages per secondFASTEST ALLOWED ECB BLOCK PERIOD500 msecMAXIMUM DISTANCE (FBM214 TO FIELDDEVICE)Meets HART FSK physical layer specificationHCF_SPEC-54, Revision 8.1 [up to 3030 m(10000ft)](1).COMPLIANCE VOLTAGE18 V dc minimum at 20.5 mACURRENT INPUTSSense Resistor61.9 Ω nominalTotal Input Resistance280 Ω minimumAccuracy (Includes Nonlinearity)±0.03% of full scaleTemperature Coefficient50 ppm/ºCResolution15 bitsUpdate Rate100 msIntegration Time500 msCommon Mode Rejection>100 db at 50 or 60 HzNormal Mode Rejection>35 db at 50 or 60 HzMAXIMUM LOOP RESISTANCE280 Ω (not including the field device)(2)LOOP POWER SUPPLY PROTECTIONEach channel is galvanically group isolated,current limited and voltage regulated. All inputsare limited by their design to less than 30 mA. Ifthe current limit circuit shorts out, the current islimited to about 85 mA.FBM INPUT IMPEDANCE280 Ω minimumFBM INTERNAL POWER FOR FIELD DEVICE24 V dc ±10% common power supply for allchannels. Loop load limited to one device perchannel.ISOLATIONThe channels are not galvanically isolated fromeach other, but are galvanically isolated (bothoptical and transformer isolation) as a group from ground and module logic. Inputs use an internal FBM isolated power supply for field power. Themodule withstands, without damage, a potential of 600 V ac applied for one minute between the group-isolated channels and earth (ground).CAUTIONThis does not imply that these channels areintended for permanent connection tovoltages of these levels. Exceeding the limitsfor input voltages, as stated elsewhere in thisspecification, violates electrical safety codesand may expose users to electric shock. Fieldbus CommunicationCommunicates with its associated FCM or FCP via the redundant 2 Mbps module FieldbusHEAT DISSIPATION4 W (maximum)(1)The maximum allowable distance decreases when the loop is operated through an intrinsic safety barrier. The maximum distance ofthe field device from the FBM is a function of compliance voltage, wire gauge and voltage drop at the device.(2)In an intrinsic safety application, if a zener barrier is used between the FBM and the field device, the power supply must be set at24V dc +5%, -1%. There are no specific constraints with the use of galvanic barriers.PSS 21H-2Z14 B4Page 5 FUNCTIONAL SPECIFICATIONS (CONTINUED)Power RequirementsINPUT VOLTAGE RANGE (REDUNDANT)24V dc ±5%CONSUMPTION7 W (maximum)Regulatory ComplianceELECTROMAGNETIC COMPATIBILITY (EMC) European EMC Directive 89/336/EECMeets:EN 50081-2 Emission standardEN 50082-2 Immunity standardEN 61326 Annex A (Industrial Levels) CISPR 11, Industrial Scientific and Medical(ISM) Radio-frequency Equipment -Electromagnetic Disturbance Characteristics- Limits and Methods of MeasurementMeets Class A LimitsIEC 61000-4-2 ESD ImmunityContact 4 kV, air 8 kVIEC 61000-4-3 Radiated Field Immunity10 V/m at 80 to 1000 MHzIEC 61000-4-4 Electrical FastTransient/Burst Immunity2 kV on I/O, dc power and communicationlinesIEC 61000-4-5 Surge Immunity2kV on ac and dc power lines; 1kV on I/Oand communications linesIEC 61000-4-6 Immunity to ConductedDisturbances Induced by Radio frequencyFields10 V (rms) at 150 kHz to 80 MHz on I/O,dc power and communication linesIEC 61000-4-8 Power Frequency MagneticField Immunity30 A/m at 50 and 60 HzPRODUCT SAFETY (FBM AND CABLE BALUN) Underwriters Laboratories (UL) for U.S. andCanadaUL/UL-C listed as suitable for use inUL/UL-C listed Class I, Groups A-D;Division 2; temperature code T4 enclosurebased systems. These modules are also ULand UL-C listed as associated apparatus forsupplying non-incendive communicationcircuits for Class I, Groups A-D hazardouslocations when connected to specifiedI/A Series® processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Wherepower is supplied by the FBM,communications circuits also meet therequirements for Class2 as defined inArticle725 of the National Electrical Code(NFPA No.70) and Section 16 of theCanadian Electrical Code (CSA C22.1).Conditions for use are as specified in theI/A Series DIN Rail Mounted SubsystemUser’s Guide (B0400FA).European Low Voltage Directive 73/23/EECand Explosive Atmospheres (ATEX) directive94/9/ECCENELEC (DEMKO) certified as EEx nA IICT4 for use in CENELEC certified Zone 2enclosure certified as associated apparatusfor supplying non-incendive field circuits forZone 2, Group IIC, potentially explosiveatmospheres when connected to specifiedI/A Series processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Also,see Table1 on page9.Calibration RequirementsCalibration of the module or termination assembly is not required.PSS 21H-2Z14 B4Page 6ENVIRONMENTAL SPECIFICATIONS(3)OperatingTEMPERATUREModule-20 to +70°C (-4 to +158°F)Termination AssemblyPVC-20 to +50°C (-4 to +122°F)PA-20 to +70°C (-4 to +158°F) RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +3,000m (-1,000 to +10,000ft)StorageTEMPERATURE-40 to +70°C (-40 to +158°F)RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +12,000m (-1,000 to +40,000ft) ContaminationSuitable for use in Class G3 (Harsh) environments as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65, Class III. Vibration7.5 m/S2 (0.75 g) from 5 to 500 Hz(3)The environmental limits of this module may be enhanced by the type of enclosure containing the module. Refer to the applicableProduct Specification Sheet (PSS) which describes the specific type of enclosure that is to be used.PSS 21H-2Z14 B4Page 7 PHYSICAL SPECIFICATIONSMountingMODULEFBM214 mounts on a modular baseplate. Thebaseplate can be mounted on a DIN rail(horizontally or vertically), or horizontally on a19-inch rack using a mounting kit. Refer toPSS21H-2W6B4 for details.TERMINATION ASSEMBLYThe TA mounts on a DIN rail and accommodates multiple DIN rail styles including 32mm (1.26in) and 35mm 1.38in).MassMODULE284 g (10 oz) approximateTERMINATION ASSEMBLYCompression181 g (0.40 lb) approximateRing Lug249 g (0.55 lb) approximateDimensions – ModuleHEIGHT102 mm (4 in)114 mm (4.5 in) including mounting lugsWIDTH45 mm (1.75 in)DEPTH104 mm (4.11 in)Dimensions – Termination AssemblySee page10.Part NumbersFBM214 MODULEP0922VTTERMINATION ASSEMBLIESSee “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” on page8. Termination CablesCABLE LENGTHSUp to 30 m (98 ft)CABLE MATERIALSPolyurethane or Hypalon®/XLPTERMINATION CABLE TYPEType 1 – See Table2 on page9.CABLE CONNECTION – TA25-pin male D-subminiatureConstruction – Termination AssemblyMATERIALPolyvinyl Chloride (PVC), compressionPolyamide (PA), compressionPVC, ring lugFAMILY GROUP COLORGreen – communicationTERMINAL BLOCKS3 tiers, 8 positionsField Termination ConnectionsCOMPRESSION-TYPE ACCEPTED WIRINGSIZESSolid/Stranded/AWG0.2 to 4 mm2/0.2 to 2.5 mm2/24 to 12 AWGStranded with Ferrules0.2 to 2.5 mm2 with or without plastic collarRING-LUG TYPE ACCEPTED WIRING SIZES#6 size connectors (0.375 in (9.5 mm))0.5 to 4 mm2/22 AWG to 12 AWGPSS 21H-2Z14 B4Page 8TERMINATION ASSEMBLIES AND CABLESField input signals connect to the FBM subsystem via DIN rail mounted Termination Assemblies, which are electrically passive.TAs for the FBM214 are available in the following forms: Compression screw type using Polyvinyl Chloride(PVC) materialCompression screw type using Polyamide (PA) material Ring lug type using PVC material.See the following “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” for a list of TAs used with the FBM214.The FBM214 provides sufficient loop resistance to allow use of the HART Hand-Held Terminal, or PC20 Intelligent Field Device Configurator (PSS 2A-1Z3 E).A removable termination cable connects the DIN railmounted TA to the FBM via a field connector on the baseplate in which the FBM is installed. Termination cables are available in the following materials: PolyurethaneHypalon XLP .Termination cables are available in a variety of lengths, up to 30 meters (98feet), allowing the Termination Assembly to be mounted in either theenclosure or in an adjacent enclosure. See Table 2 for a list of termination cables used with the TAs forthe FBM214.FUNCTIONAL SPECIFICATIONS – TERMINATION ASSEMBLIESFBM Type Input SignalTA Part NumberTermination TA Cable TACertification PVC (a)(a)PVC is polyvinyl chloride rated from -20 to +50°C (-4 to +122°F).PA is Polyamide rated from -20 to +70°C (-4 to +158°F).PA (a)Type (b)(b) C = TA with compression terminals; RL = TA with ring lug terminals.Type (c)(c)See Table 2 for cable part numbers and specifications.Type (d)(d)See Table 1 for Termination Assembly certification definitions.FBM2148 input channels, 4 to 20mA analog signal, alone or with HART signal superimposedP0916BX P0926EA P0926TD CRL11, 2PSS 21H-2Z14 B4Page 9Table 1. Certification for Termination AssembliesType Certification (a)(a)All TAs are UL/UL-C listed to comply with applicable ordinary location safety standards for fire and shock hazards. Hazardous locationtypes comply with ATEX directive for II 3 G use. They also comply with the requirements of the European Low Voltage Directive. All listings/certifications require installation and use within the constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA) and the conditions stated in UL and DEMKO reports.Type 1TAs are UL/UL-C listed as suitable for use in Class I; Groups A-D; Division 2 temperature code T4 hazardous locations. They are CENELEC (DEMKO) certified EEx nA IIC T4 for use in Zone 2 potentially explosive atmospheres.Type 2TAs are UL/UL-C listed as associated apparatus for supplying non-incendive field circuits Class I; Groups A-D; Division 2 hazardous locations when connected to specified DIN rail mounted FBMs and field circuits meeting entity parameter constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA). They are also CENELEC (DEMKO) certified as associated apparatus for supplying field circuits for Group IIC, Zone 2 potentially explosive atmospheres. Field circuits are also Class 2 limited energy (60 V dc, 30 V ac, 100 VA or less) if customer-supplied equipment meets Class 2 limits.Table 2. Cables Types and Part NumbersCable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)Cable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)0.5 (1.6)P0916DA P0916VA 10.0 (32.8) P0916DE P0916VE 1.0 (3.2) P0916DB P0916VB 15.0 (49.2) P0916DF P0916VF 2.0 (6.6)P0931RM P0931RR 20.0 (65.6) P0916DG P0916VG 3.0 (9.8) P0916DC P0916VC 25.0 (82.0) P0916DH P0916VH 5.0 (16.4)P0916DDP0916VD30.0 (98.4)P0916DJP0916VJ(a)P/PVC is polyurethane outer jacket and semi-rigid PVC primary conductor insulation.(b)H/XLPE is Hypalon outer jacket and XLPE (cross-linked polyethylene) primary conductor insulation.PSS 21H-2Z14 B4Page 10DIMENSIONS – NOMINALRELATED PRODUCT SPECIFICATION SHEETSCompression Termination AssemblyRing Lug Termination Assembly(a) Overall width – for determining DIN rail loading.(b) Height above DIN rail (add to DIN rail height for total).PSS NumberDescriptionPSS 21H-2W1 B3DIN Rail Mounted FBM Subsystem OverviewPSS 21H-2W2 B3DIN Rail Mounted FBM Equipment, Agency CertificationsPSS 21H-2Z14 B4Page 11PSS 21H-2Z14 B4 Page 12IPS Corporate Headquarters 5601 Granite Parkway Suite 1000 Plano, TX 75024United States of AmericaFoxboro Global Client Support Inside U.S.: 1-866-746-6477 Outside U.S.: 1-508-549-2424 or contact your local Foxboro representative.Facsimile: 1-508-549-4999Invensys, Foxboro, I/A Series and the IPS Logo are trademarks of Invensys plc, its subsidiaries, and affiliates. All other brand names may be trademarks of their respective owners.Copyright 2002-2010 Invensys Systems, Inc.All rights reservedMB 21A Printed in U.S.A. 0210。