R-500-2油墨参数

3. SPECIFICATION3-1. Characteristic*After mixing with hardener.3-2. Tack Dry WindowTack dry window (min. @72¢J )40 50 60 70 80 Develop abilityDevelopment condition : 1%Na 2CO 3 , 32¢J , 60 sec , 2.5kg/cm 23-3. Holding TimeHold time 12hr 24hr 36hr 48hr Develop abilityHolding at 22¢J / 60%RH after drying at 72¢J / 25 mins.Item Specification Main agent R-500 Hardener HD – 5 Mixing ratio depend on product Viscosity depend on product Solid content 75 ~ 80wt%Tack- dry window 72¢J X 80 min (maximum) Exposure energy400 – 600 mj / cm 2 (on the solder mask) * Pot life 24 hours ( stored in dark and below 25¢J )Shelf life6 months after manufacturing ( stored in dark and below 25¢J )3-4. PhotosensitivityItem Ink Thickness Energy Dwell time Sensitivity SensitivityKodak No.2 (2l steps tablet) 25 µm300 mj/cm2400 mj/cm2500 mj/cm260 sec6~8 steps7~9 steps9~11 stepsResolution (Between QFP) 30 µm300 mj/cm2400 mj/cm2500 mj/cm260 sec70~80 µ m60 ~70µ m50~60 µ m4. PROCESS CONDITIONSSurface treatment :Chemical and mechanical treatmentCoating:Screen printing with 90~120 mesh screenHolding time:10 – 20 min.Tack dry: A.Single side process1st side : 72-75¢/15~20 min.( Hot air convention oven )2nd side : 72-75¢/20~30 min. ( Hot air convention oven )B.Both sides process72-75¢/30~40 min.( Hot air convention oven )Exposure:400 – 600 mj / cm2 (on the solder mask)Hold time:10 – 30 min.Development: Developer : 1 wt% Na2CO3Temperature : 31-33¢Spray pressure : 2.5 – 3.0 kg / cm2Dwell time : 70-100 sec.Post cure: for Immersing gold process150¢/ 60 min.(Hot air convention oven) for HAL process 160¢/ 60 min. (Hot air convention oven)5. PROPERTIESItem Test method ResultAdhesion JIS D0202 Cross hatch peeling 100/100 Pencil hardness JIS K5400 standard Above 6H Solder heat resistance Rosin flux 260¢J/ 30sec , 1 cycle PassSolvent resistance PGM-Ac, room temp./30min.Cross hatch peelingPassAcid resistance 10vo1¢M H2SO4 ,room temp./20min.Cross hatch peelingPassAlkaline resistance 10wt¢M NaOH , room temp./20min.Cross hatch peelingPassInsulation resistanceIPC-B-25 pattern25¢J/ 65¢M RH , 500V/l・min.Initial1.0 1013ΩE’less gold plate Ni 125 µ-inch ; Au 3 µ-inch PassNote : The all test data mentioned in this technical data sheet are based on our laboratory tests and only for reference, we suggest testing for suitability in your application.6. IPC-SM-840C Class TPropertyTestMethodRequirementTestResult3.4.4.Curing 3.6.1.Solvent&flux resistance.3.7.2.Solder resistance.3.7.3.solder/desolering.Must meet requirements of3.6.1., 3.7.2.and 3.7.3.PASSPASSPASS3.4.7.Visual Magnifying lens rated between1.75 to 10X magnificationNo cracks. No peeling androughness Free of foreignmaterials.OK3.5.2.1.Adhesion(tape test) Determined in accordance withTM2.4.28.1 of IPC-TM-650.Differentiation of class shall berequired.Bare Copper 0%Gold or Nickel 5%Base Laminate 0%Melting Metals 10%(Tin-Lead plating)PASSPASSPASSPASS3.5.3. Mashinability Subjected to drilling, routing,sawing or punching.No cracks, No peeling androughness.PASS3.5.1.2.Pencil Hardness 45degree angle, forwardpressure in a 1/4 inch.No softer than “F” PASS/6H3.6.1.Resistance Solvents Resistance CleaningAhents Resistance Flux Isopropanol (room temperature)T richloroethane(room temperature)An azeotrope of 4%ethyl-Alcohol and 96%tri-chloro-tri-fluoroethane. (by vilume) Vapor degreaser, boiling.10% Alkaline detergentEXP. 40% alkanolamine20% 2-butoxyethanol20% glycol ether andthe remaining 90% water(PH=13 or less)57±2(135±5K After immersed for 2 minutes,dried in 10 minutes.No surface roughness, blisters, delamination, swelling, and colorchangePASSPASSPASSPASS3.6.2.Hydrolytic Stability/Aging 97±290-98%RH 28 days. No irreversible change of state.PASS3.6.3. UL-94 flammability. UL-94 V number shall not be 94 V-0Flammbility raised.PropertyTest MethodRequirementTest Result3.7.2.Resistance to solder After flux coated, hold at ambient temperature for 5 minutes, preheat and solder float at 260±5 for 10±1 seconds.Solder shall not adhere to the solder mask.PASS3.8.1. Dielectric StrengthTM2.5.6.1 of IPC-TM-650Add 500 VDC when the thickness increase per 0.025 mm [0.001 inch] PASS 1.9KV/mil 3.8.2.Insulation ResistanceMeasure the minimum resistance before and after solderingMinimum 5×108[ at 500 VDC. IPC-B-25B , Pattern A . Befor Soldering 2.30×1013[ After Soldering 2.50×1012[ 3.9.1. Insulation Resistance with Moisture 65/90%RH/100VDC/24hrsMinimum 5×108[ at 500 VDC. IPC-B-25B , Pattern A .Initial 1.8×1013[ After Treatment 1.65×1012[3.9.2.Electro migration 85/85%RH/500 hrs. 45-100 VDC±5% None allowed.PASS 3.9.3.Thermal Shock-65/15 min +125/15 min,100 cycles.No blistering, crazing, and delamination.PASSPhotoimageable Solder Resist Ink R-500E As to the operation environment , it is desirable to deal with the ink in theclean room where has temperature (19~22¢J) and humidity (under 60%) control . Moreover , it is necessarily to avoid using the ink under UV light .E The adequate ink thickness is 22~25 µm (on the board after curing) . Thincoating possibly reduces its solder heat and solvent resistances . In addition , thick coating might cause over-undercut .E Please avoid plugging the ink inside the tooling-hole , otherwise it mightcause the scum .E The parameter of tack dry might be different due to the type of the ovenand the quantity of the boards . Therefore , please set the parameter after the confirmative test . Unsuitable parameter might cause the degradation of properties.E Please check the density , temperature , spray pressure , and dwell time ofthe process of development are under control before developing .E It is desirable to use the ink without dilution . Please dilute the ink as lessas possible (Max 3 wt%) , if you feel difficulty of printing by high viscosity because over-dilution might degrade the properties of the ink .E Please stir up enough after mixing with hardener .。