微电子科学与工程专业本科培养计划.doc

微电子科学与工程专业本科培养计划Undergraduate Program for Specialty inMicroelectronic Science and Engineering一、培养目标Ⅰ．Program Objectives本专业培养掌握微电子科学与工程专业必需的基础知识、基本理论和基本实验技能，能够从事该领域的各种微电子材料、器件、封装、测试、集成电路设计与系统的科研、教学、科技开发、工程技术、生产管理等工作的高级专门人才。

This program trains advanced talents with basic knowledge, theory and experimental skills necessary for Microelectronic Science and Engineering. These talents can be engaged in various works in microelectronic materials, devices, packaging, testing, integrated circuit design and sy stem as well as the scientific research, education, technique development, engineering technology, production management.二、基本规格要求Ⅱ．Learning Outcomes毕业生应获得以下几个方面的知识和能力：1、具有扎实的自然科学基础，良好的人文社会科学基础和外语能力；2、掌握本专业领域较宽的基础理论知识，主要包括固体物理、半导体物理、微电子材料、微电子器件、集成电路设计等方面的基础理论知识；在本专业领域内具备从事科学研究的能力；3、受到良好的工程实践训练，掌握各种微电子器件与集成电路的分析、设计与制造方法，具有独立进行微电子材料及器件性能分析、集成电路设计、微电子工艺流程的基本能力；具备一定的工程开发和组织管理能力；4、了解本专业的最新发展动态和发展前景，了解微电子产业的发展状况。

The program requires that the learners have the knowledge and abilities listed as follows:1. Have solid foundation in natural science, basic fine knowledge in humanities and social sciences and good foreign language skills;2. Master wide branch of fundamental theoretical knowledge of this specialty, which mainly include the solid state physics, semiconductor physics, microelectronic materials, microelectronic devices, integrated circuit design and so on. Master the ability to conduct scientific research in the field of this specialty；3. Have good trainings in engineering practice, master the analysis, design and fabrication methods of different kinds of microelectronic devices and integrated circuits, have the fundamental ability to independently deal with the performance analysis of microelectronic materials and devices, integrated circuit design and microelectronics processing. Master the ability of engineering development and organization management；4. Have the knowledge of the latest developments and prospects in this specialty, have the knowledge of the current situation of microelectronic industry.三、培养特色Ⅲ．Program Highlights本专业以微纳电子材料和工艺为基础，以微纳电子器件和集成电路制造为核心，以集成电路设计及其系统应用为方向；坚持理工结合，重视基础理论，强调实践技能，培养“基础-to-应用”与“器件-to-系统”相结合的综合思考及横向思维的能力，培养具有良好科学素养、微纳电子材料-器件-电路-版图-工艺-系统的综合设计与研究能力和组织管理能力的工程技术与科研人才。

Based on micro-/nano- electronics materials and processing, taking micro-/nano- electronic devices and integrated circuits fabrication as the core, oriented in integrated circuit design and its system application, this program insists on the combination of science and engineering, values the theoretical foundation and emphasizes the practical skills. By training the ability of comprehensive and lateral thinking with the combination of “basis-to-application”and “devices-to-system”, this program aims at cultivating scientific and engineering talents with good scientific quality, capability in integrated design of micro-/nano- electronics material-devices-circuits-layout-processing-systems, as well as the ability of research and organization management.四、主干学科Ⅳ．Main Discipline电子科学与技术Electronic Science and Technology五、学制与学位Ⅴ．Program Length and Degree学制：四年Duration: 4 years授予学位：工学学士Degrees Conferred: Bachelor of Engineering六、学时与学分Ⅵ．Credits Hours and Units完成学业最低课内学分（含课程体系与集中性实践教学环节）要求：159学分。

Minimum Credits of Curricular(Comprising course system and intensified internship practical training)：159 credits.其中，专业基础课程、专业核心课程学分不允许用其他课程学分进行学分冲抵和替代。

Major-related basic courses and core courses cannot be covered using credits from other courses in the program完成学业最低课外学分要求：3学分。

Minimum Extracurricular Credits：3 credits.1. 课程体系学时与学分Practicum Credits注：参加校体育运动会获第一名、第二名者与校级一等奖等同，获第三名至第五名者与校级二等奖等同，获第六至第八名者与校级三等奖等同。

Note: In HUST Sports Meeting, the first and the second prize, the third to the fifth prize, and the sixth prize to the eighth prize are deemed respectively the first prize, the second prize and the third prize of university level.七、专业核心课程Ⅶ．Core Courses in Specialty量子力学Quantum Mechanics、固体物理Solid State Physics、半导体物理Semiconductor Physics、微电子材料Microelectronic Materials、半导体器件物理Physics of Semiconductor Devies、纳电子器件Nanoelectronic Devices、微电子工艺学Microelectronic Process、CMOS模拟集成电路CMOS Analog Integrated Circuit、数字集成电路基础Fundamentals of Digital IC、微电子封装与测试Microelectronic Packaging and Testing、微电子器件可靠性技术基础Fundamental of Microelectronic Devices Reliability Technology.八、主要实践教学环节（含专业实验）Ⅷ．Practicum Module (experiments included)新生专业认知实践Experiments for Specialty Cognition、电工实习Electrical Engineering Practice、软件课程设计Course Project for Software Design、集成电路课程设计Course Project for ICs、微电子工艺课程设计Course Project for Microelectronic Fabrication、微电子器件建模课程设计Course Project for Modeling of Microelectronic Devices、微电子专业实验Experiments of Microelectronics Specialty、专业实习Professional Social Practice、毕业设计Undergraduate Thesis.九、教学进程计划表Ⅸ．Course Schedule院（系）：光学与电子信息学院专业：微电子科学与工程School (Department): School of Optical and Electronic Information Specialty: Microelectronic Science and Engine ering续表。