主要缺陷中英文对照
缺陷中英文对照
劃形狀 皮 薄的
裂片 細小
弄髒
布類玩具
沾污
焊錫 溶劑 穩定 編法
poor embroidery poor hair inter-lock stitching poor hair style poor heat sticking poor hot melting poor hot stamp poor hot stamping poor lock stitching poor booted hair poor sewing poor silk-screening poor sketching poor stitch poor stuffing pucker ribbon fray rough surface scratch mark screw burst screw came off screw rust screw unfasten seam allowance expose seam open sewing label loosen sewing machinery mark stitching hole stuffing disproportion stuffing expose/cotton expose stuffing expose the eyes can't move smoothly thread trapped by seam under glue uneven shape uneven stuffing untrimmed thread use unmatched swatches in one boll white powder on body velcro come off/magic tape come off velcro detach velcro position too hight/low water stain mark wrong assembly wrong/missing part
验货缺陷中英文对译明
电机不转
motordead无接地电阻Earthyresistancetestfailed
41
高压击穿
Highvoltagetestfailed高High/电压voltage/测试test/失败failed
42
接触不良
Switchpoorconnecting连接connecting
43
焊线虚焊
linefalseWeld线line/假的false/焊接Weld
44
标签翘起
Cnotstickedwell/labelbadsticked/标签Label粘贴sticked好well
45
开关推钮
Switchbutton
46
印刷脱落
PoorPrinting印刷Printing
47
内锅破裂
Innerpotbroken内部的Inner/锅pot/破裂的broken
48
61
配件遗漏
Accessoryismissed附件Accessory/遗漏omitted/错过missed
62
PTC不工作
PTCfunctiondead
63
后盖装配不良
Rearcoverpoorassembling后方Rear/盖cover/装配assembling/前方front
64
有效长度
Effectivelength有效的Effective/长度length
加热元件发黑
Heatingelementblack力口热Heating/兀件elemen/黑black
28
加热元件发红
Heatingelementred红red
29
加热元件发热不均匀
Heatingelementheatinequable热heat不均匀inequable
中英文缺陷描述对照表(1)
缺陷描述中英文对照表
ENGLISH /英文
TORN TRAP TREAD/WIRE TRIM TUMBLE-SANDED UN-TRIM UNEVEN UNSANDED UNSEAL UP SIDE DOWN VELCRO VISUAL WARPAGE WELD WELD LINE WITHOUT GLOSS/DULL COLOR WITHOUT PUNCH HOLE WRINKLE ABRASION MARK AIR BUBBLE ARMS ORLEGSCAN'T HOLD POSITION BALD SPOT ON PLUSH BODY SHELL BROKEN BROKEN HEAD CAUSE BY HAIR ROOTING COLOR CONTAMINATION COLOR DEVIATION COLOR MIGRATION COLOR MISALIGNMENT COLOR MISMATCH COLOR UNMATCH CONTAMINATION MARK CUT MARK DENSITY OF ROOTING SPIN COUNT OF HAIR DENT MARK DIRT MARK DOLL IS NOT FIXED TIGHTLY EDGE OF SEAM FRAYING ELECTRO PLATING ABBADES ELECTRO PLATING RAINBOW ELECTRO PLATING SHADOW FABRIC FRAY FABRIC TEXTURE MISMATCH FOLD MARK/LINE FOREIGN HUMAN HAIR FOREIGN LIQUID FOREIGN MATERIALS GAP GASSY (GLUE) GEAR SMOOTH GLUE MARK GREASE MARK HAIR BELT COME OFF HAIR POOR CUTTING HAIRTRAPPED BY SEAM HAIR YARN IS NOT FLAME RETARDANT HIGH DENSE STITCH INCORRECT COLOR INPURE PLASTIC JUMPING STITCH LABEL PEEL OFF LOW DENT STITCH MATERIAL FRAY MATERIALS RUN MATERIALS TORN MERCURY COME OFF
PCB及PCBA缺陷中英文对照表
1板面凹痕dent2内层白斑I/L white spot3线路缺口circuit nick4蚀刻不净undering etching5绿油剥离S/M peel off6显影不净under developing7基材白点laminate measling 8铜面氧化copper oxi9绿油上焊盘s/m on pad10白字上焊盘c/m on pad11阻焊不良poor S/M12线路擦花 track scratch13锡上线sn on circuit14聚锡sn mass15锡灰sn gray16焊盘露铜copper exposed on pad 17锡上金手指sn on G/F18金手指凹痕G/F dent19金手指擦花G/F scratch20金手指粗糙G/F roughness21v-cut不良poor V-cut22倒边不良poor milling23针床压伤ET den24拖锡不良poor touch up25补金不良poor repairing Au26补油不良poor repairing s/m27针孔pinhole28胶渍paster stain29k孔内毛刺burrs in hole30锡珠入孔solder in hole31露铜expose Cu 40翘板warp41漏印字符skip42金粗Au too big43金簿Au too thin44金手指缺口G/F voids/nick on G/F 45金手指发黑G/F too black46字符印反inverse C/M47金手指针孔G/F pinholes48标志不清symbol unclear49标志错symbol wrong50绿油鬼影ghost in S/M51手指印finger print52补线不良poor line repairing53锡高exessive solde54孔小hole undersize55字符错wrong C/M56字符印偏C/M misalignment57字符入孔C/M in hole58字符重影C/M doubloe image59漏镀金手指missing plating G/F 60金手指发白G/F gray61焊盘脱落pad break off/pad peel off 62焊盘露铜pad expose cu63断绿油桥missing S/M bridge64塞孔block hole65水迹water print66锡珠solder ball67砂孔pitting68油薄69聚油excess solder mask70锡粗Sn too thick32露镍expose Ni33绿油起泡solder mask blister 34绿油起皱solder mask winbles 35金手指氧化G/F oxiding36金颜色不良Au discoloration 37金面凸起Au surface blister 38绿油入孔solder mask in hole 39爆板board angle damafe 71线路上锡Sn overlap scratch72绿油下杂物contamination under S/M 73焊盘损坏land damage74焊盘翘起lifted land75偏位misregistration76漏钻孔missing hole77焊盘缺口nick on pad78线路缺口nick on trac1开路open circuit2短路short circuit3线路缺口circuit nick4线路凹痕circuit dent5渗镀plating Bloody6焊盘缺口pad nick7内层白斑I/L white spot8黑化不良poor B.O9白斑measling10粉红圈pinking ring11层压起泡press blister12错位misregistation13偏位shift14孔内无铜no Cu on PTH15孔内毛刺hole burrs16 NPTH有铜Cu on NPTH17铜面露基材exposed laminate 18铜面凹痕dent on Cu surface 19胶渍gum residue20夹膜D/F nip21蚀刻不尽under etching22线幼line too thin23孔大hole oversize24孔小hole undersize25偏孔hole misregistration26铜面瘤粒Cu nodule27显影不尽under developing28铜面刮伤scratch on Cu surface 29塞孔hole plugged30修理不良poor repairing 31铜薄copper too thin32内层擦花I/L scratch33内层偏位I/L misregistation34内层杂物I/L inclusions35掉膜film off36干膜碎D/F meaking37退锡不尽poor Sn stripping38间隙小space too marrow39板薄board too thin40板厚board too thickness41针孔pinhole42崩孔breakout43侧蚀undercut44镀层粗糙plating layer roughness45亚色dull colour46焊盘翘起lifted land47漏钻孔missing hole 线路狗牙circuit wist 48露布纹weave exposure49钻偏孔hole misregistratiion50孔损害hole damage51基材分层delamination52蚀刻过度over etching53多孔hole too much54残铜remain Cu55孔内露基材laminate exposure in hole 56焊盘脱落pad break off57焊盘凹痕pad dent58焊盘凸起pad bulge59焊盘损坏pad damaged60焊盘缺口pad nick61焊盘露铜pad expos。
胶件缺陷中英文对照
blister 起泡blooming 起霜blow hole 破孔blushing 泛白body wrinkle 侧壁皱纹breaking-in 冒口带肉bubble 膜泡burn mark 糊斑burr 毛边camber 翘曲cell 气泡center buckle 表面中部波皱check 细裂痕checking 龟裂chipping 修整表面缺陷clamp-off 铸件凹痕collapse 塌陷color mottle 色斑corrosion 腐蚀crack 裂痕crazing 碎裂crazing 龟裂deformation 变形edge 切边碎片edge crack 裂边fading 退色filler speak 填充料斑fissure 裂纹flange wrinkle 凸缘起皱flaw 刮伤flow mark 流痕galling 毛边glazing 光滑gloss 光泽grease pits 污斑grinding defect 磨痕haircrack 发裂haze 雾度incrustation 水锈indentation 压痕internal porosity 内部气孔mismatch 偏模mottle 斑点necking 缩颈nick 割痕orange peel 橘皮状表面缺陷overflow 溢流peeling 剥离pit 坑pitting corrosion 点状腐蚀plate mark 模板印痕pock 麻点pock mark 痘斑esin streak 树脂流纹resin wear 树脂脱落riding 凹陷sagging 松垂saponification 皂化scar 疤痕scrap 废料scrap jam 废料阻塞scratch 刮伤/划痕scuffing 深冲表面划伤seam 裂痕shock line 模口挤痕short shot 充填不足shrinkage pool 凹孔sink mark 凹痕skin inclusion 表皮折迭straightening 矫直streak 条状痕surface check 表面裂痕surface roughening 橘皮状表皮皱折surging 波动sweat out 冒汗torsion 扭曲warpage 翘曲waviness 波痕webbing 熔塌weld mark 焊痕whitening 白化wrinkle 皱纹missing part漏件wrong part错件excessive defects过多的缺陷critical defect极严重缺陷major defect主要缺陷minor defect次要缺陷not up to standard不合规格dimension/size is a little bigger尺寸偏大(小) cosmetic defect外观不良slipped screwhead/slippery screw head螺丝滑头slipped screwhead/shippery screw thread滑手speckle斑点mildewed=moldy=mouldy发霉rust生锈deformation变形burr(金属)flash(塑件)毛边poor staking铆合不良excesssive gap间隙过大grease/oil stains油污inclusion杂质painting peel off脏污shrinking/shrinkage缩水mixed color杂色scratch划伤。
PCB及PCBA缺陷中英文对照表
1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点 laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花 track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄29k孔内毛刺burrs in hole 69聚油excess solder mask30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch32露镍expose Ni 72绿油下杂物 contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad38绿油入孔solder mask in hole 78线路缺口nick on track39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu55孔内露基材 laminate exposure in hole 10粉红圈pinking ring 56焊盘脱落pad break off11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping24孔小hole undersize 38间隙小space too marrow25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness。
PCB及PCBA缺陷中英文对照表
PCB及PCBA缺陷中英文对照表 (2010-12-10 205900)001内层开路Inner open002内层断路Inner short003外层开路Outer open004外层断路Outer short005内层蚀刻过度Inner over ecthing006外层蚀刻过度Outer over ecthing007内层树脂气泡Resin void008内层杂物Foreign material009内层图形移位Inner pattern mis-registration 010层与层移位Layer to layer mis-registration 011打孔不良Improper targeting012内层蚀刻不净Inner under etching013露布纹Weave textureexposure014檫花(氧化膜面)Scratch(Oxide surface)015板损坏Damaged board016分层(物料)Delamination (Raw material) 017内层不配套Excessive inner core018板过厚Over thickness019白点(压板)Measling (Pressing)020白点(喷锡)Measling (HSAL)021板曲Warpage022板焦黄Burnt023起皱Wrinkle024起泡(压板)Blistering (Pressing)025镀层起泡Blistering (Cu plating)026喷锡起泡Blistering (HSAL)027板面凹痕DENT (Pressing profilling GF) 028白斑Crazing029胶渣Gum residue030孔未穿Incomplete drilling031披锋Burr032多孔Extra hole033偏孔Hole shift034孔径大Hole oversize035孔径小Hole undersize036少孔Missing Hole037塞孔Block hole038崩孔Hole breakout039孔粗糙(镀铜)Hole roughness(Cu plating)040孔粗糙(机械钻孔)Hole roughness(mechanical drill) 041崩线、线路缺口Nick void on trace042缺口Nick void on pad043曝光过度Over-exposure044曝光不良Under exposure045显影不足Under develop046干膜脱落DF Peel off047干膜碎DF Rdsidue048干膜移位DF Mis-registration049标志不清(曝光)Illegible marking (exposure)050错菲林Wrong AW051非镀铜孔有铜Copper in NPTH052镀铜孔内无铜No copper in PTH053渗镀Nickel smear054电镀粗糙Rough plating055孔壁缺口Hole void (Cu)056金手指颜色不良Gold Finger discoloration057金面颜色不良Gold discoloration058金面阴阳色Two tone colour on gold surface 059铜、镍脱落Copper Nickel peel off060铜镀层厚度超要求Copper thickness out of requirement 061漏镀（金手指等）Skip plating(GF ENIG Cu)062金面污点Stain on gold surface063电镀针孔Plating pits (Cu)064镀锡缺点Tin plating defect065铜碎Copper residue066黑孔Black Hole067镀层白渍Plating haze068金手指凸出Protrusion (GF)069板污Board contamination070手指套Glove mark071褪锡不良Improper Tin stripping072微短路Micro short073粉红圈Pink ring074焊盘崩缺Broken annular ring075蚀刻不净Under etching076焊盘脱落Pad peel off077绿油上焊盘SM on pad078绿油图形移位Pattern mis-registration079绿油露线Expose trace080油薄Uneven SM thickness081入孔SM in hole082绿油冲板不良SM under develop083漏塞孔SM unplugged084IC栏不良Poor IC barrier085绿油脱落SM peel off086塞孔不满Incomplete SM plugging 087多开绿油窗Extra opening088溶剂测试失败Fail in solvent test089漏印Skip printing090水印Water mark091断绿油桥SM Bridge broken092绿油下氧化Oxidation under soldermask 093返工不良Poor rework094错油Wrong Ink095漏印字符Missing legend ink096字符入孔Legend in Hole097字符脱落Legend peel off098字符上焊盘Legend on pad099字符不清Illegible legend100日期不清Illegible date code101锣坑次品Milling Defects102啤板方向错Wrong punch direction103漏锣Missing routing104漏斜切Missing chamfering105斜边过度Over chamfefing106错外形尺寸Wrong outline dimension 107倒边不良Bevelling defect108金手指脱落Gold finger peel off109露镍、铜NiCu exposure110缺口Nick (GF)111涂层不良Poor ENTEK112锡上金手指Solder on GF113上锡不良(缩锡)Dewetting114不上锡(不沾锡)Non wetting115锡珠、锡堆Solder balllump116锡上线Solder on trace117针痕Pin mark118阻抗超出要求Impedance out of requirement 119工程试验Evaluation120微切片(出货)Microsection (outgoing)121微切片(工程试验用)Microsection (engineering)。
PCB及PCBA缺陷中英文对照表
PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料发布时间：2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(Electoless Ni/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。
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主要缺陷中英文对照
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2
德仕科技（深圳）有限公司
品管部中英文对照表（一）
主要缺陷中英文对照
序号中文英文
序
号
中文英文
1 披峰Flash 16 流痕Flow mark
2 走不齐/
缺胶
Short shot 17 色差 abberration
3 变形/注塑
后变形
Deformation 18 夹水线Weld lines
4 偏模Mismatch 19 碰伤Bump damage
5 起泡Blister 20 银线Silver
6 污斑Grease pits 21 少数量Packing shortage
7 雾化Atomization 22 泛白Blushing
8 烧焦Burn mark 23 发白Whitening
9 油污Oil mark 24 刮伤Scratch
10 气泡Blister 25 气纹Gas lines
11 划痕Scffing 26 混色Color mixture
12 泛黄Yellowing 27 斑点/污
点/ 黑点
Macula
13 缩水Sink mark 28 结合线
14 段差29 拉伤Pull
15 抛光不良Polishing mark 30 水印Watermark
主要测量仪器中英文对照
序号中文英文
序
号
中文英文
1 分厘卡(千
分尺)
Micrometer 14 卡尺Caliper
2 C表Dial gauge 15 扁分厘卡Blade micrometer
3 块规Block gauge 16 针规Pin gauge
4 CMM X-Y-Z Coordinate 17 电子卡尺Digital caliper
5 扭力计Torque meter 18 投影仪Projection apparatus
6 高度仪Height gauge 19 直角尺Square master
7 游标卡尺Vernier caliper 20 硬度机Durometer
8 牙规Scre gauge 21 半径规Radius gauge
9 角度规Universal
protractor
22 特别塞规Ring gauge
10 拉/推力计Pull/Push gauge 23 弹力计Spring balance
11 塞尺Clearance gauge 24 专用夹具Special fixture
12 工具显微
镜
Tool-measuring
microscope
25 千分表Dial indicator
13
1 抽样Sampling 11
抽样计划
Sampling
plan
2 样品数量Sample size 12 合格Conformity
3 批量lot size 13 缺陷Defect
4 目测Eyeballing 14 让步Concession
5 外观Appearance 15 检验Inspection
6 测量Measurement 16 规范Specificatio
n
7 质量Quality 17 报废Scrap
8 接收Acceptance 18 纠正Correction
9 不良品Defective
products
19
10 返工Rework 20。