电路板中英文专业术语词汇(A-M)
最全电子行业术语英文翻译
最全电子行业术语英文翻译本文档收集了电子行业中最常见的术语及其英文翻译，以帮助读者更好地理解和使用这些术语。
1. 常见术语及英文翻译- 电子设备 (Electronic device)- 半导体 (Semiconductor)- 集成电路 (Integrated circuit)- 电路板 (Circuit board)- 芯片 (Microchip)- 电 (Capacitor)- 电阻器 (Resistor)- 电感器 (Inductor)- 发光二极管 (Light-emitting diode)- 二极管 (Diode)- 可编程逻辑门阵列 (Programmable logic gate array)- 可编程逻辑控制器 (Programmable logic controller)- 集成封装 (Integrated packaging)- 数字信号处理 (Digital signal processing) - 触摸屏 (Touchscreen)- 无线充电 (Wireless charging)- 人工智能 (Artificial intelligence)- 物联网 (Internet of Things)- 虚拟现实 (Virtual reality)- 增强现实 (Augmented reality)- 机器研究 (Machine learning)2. 其他相关术语- 电池 (Battery)- 蓝牙 (Bluetooth)- Wi-Fi (Wi-Fi)- 供应链管理 (Supply chain management) - 电子支付 (Electronic payment)- 信息安全 (Information security)- 数据隐私 (Data privacy)- 用户界面 (User interface)- 数据存储 (Data storage)- 硬件 (Hardware)- 软件 (Software)- 网络安全 (Network security)- 数据备份 (Data backup)- 电子签名 (Electronic signature)- 电子邮箱 (Email)- 数据恢复 (Data recovery)- 电子证书 (Digital certificate)- 电子表格 (Spreadsheet)- 数据分析 (Data analysis)- 电子文档 (Electronic document)- 云存储 (Cloud storage)请注意，本文档收集的是最常见的电子行业术语及其英文翻译，如果有其他术语需要翻译或有任何疑问，请随时与我联系。
电路板术语
A Assembly--裝配.組裝.構裝A-stage -- A階段ATE--自動電測設備Abietic Acid--松脂酸Autoclave--壓力鍋Abrasion Resistance--耐磨性Axial-lead--軸心引腳ABS--樹脂Azeotrope--共沸混合液Absorption--吸收,吸入abrasives--磨料,刷料abcceptable quality level(AQL)--允收品質水準Accelerated Test(Aging)加速試驗,加速老化Acceleration--速化反應AC impedance--交流阻抗Accelerator--加速劑,速化劑acoustic microscope(AM)-- 感音成像顯微鏡Acceptability,Acceptance--允收性,允收active carbon--活性炭Access Hole --露出孔(穿露孔,露底孔)aerosol -- 噴霧劑,氣溶膠,氣懸體Accuracy--準確度aluminium nitride(AIN)--氮化鋁Acid Number(Acid Value)--酸值amorphous--無定形,非晶形Acrylic--壓克力analog circuit/analog signal--類比電路/類比訊號anisotropic--異向的,單向的Actinic Light(Intensity,Radiation)--有效Activation--活化anti-foaming agent--消泡劑Activator--活化劑apertures--開口,鋼版開口Active parts(Devices)--主動零件aramid fiber--聚硫胺纖維Acutance--解像銳利度attenuation--訊號衰減Addition Agent--添加劑BAdditive Process--加成法back light (back lighting)--背光法Adhesion--附著力back taper--反錐斜角Adhesive--膠類或接著劑back up--墊板Admittance--導納backpanels, backplanes--支撐板Aging--老化bandability--彎曲性,彎曲能力Adhesion Promotor--附著力促進劑backing agent--護岸劑Air Inclusion--氣泡夾雜bare chip assembly--祼體晶片組裝Air Knife--風刀barrel--孔壁,滾鍍Algorithm--演算法base material--基材Aliphatic Solvent--脂肪族溶劑basic grid--基本方格Ambient Tamp--環境溫度batch--批Amp-Hour--安培小時baume--波美度Anchoring Spurs--著力爪beam lead--光芒式的平行密集弔腳Angle of Attack--攻角bed-of-natil testing--針床測試Angle of Contack--接觸角bellows contact--彈片式接觸Anion--陽向游子(陰離子)beta ray backscatter--貝他射線反彈散射Anneal--軔化bevelling--切斜邊Annular Ring--孔環bias--斜張網布,斜織法Anode--陽極binder--黏結劑Anode Sludge--陽極泥bits--頭Anodizing--陽極化black oxide--黑氧化層ANSI--美國標準協會blanking--沖空斷開Anti-Pit Agent--抗凹劑bleach--漂洗AOI--自動光學檢驗bleeding--溢流AQL--品質允收水準bling via hole--盲導孔Arc Resistance--耐電弧性blister--局部性分層或起泡Array--排列,陣列block diagram--電路系統塊圖Artwork--底片blockout--封網ASIC--特定用途的積體電路器blotting--乾印Aspect Ratio--緃橫比blotting paper--吸水紙blue plaque--藍紋carrier--載體blow hole--吹孔cartridge--濾芯bomb sight--彈標castallation--堡型積體電路器bond strength--結合強度catalyzed board,catalyzed substrate/material催bondability--結合性catalyzing--催化bonding layer--結合層,接著層cathode--陰極bonding sheet(layer)--接合片,接著層caul plate--隔板bonding wire--結合線cavitation--空泡化,半真空bow, bowing--板彎center-to-center spacing--中心間距braid--編線ceramics--陶瓷brazing--硬焊cermet--陶金粉break-away panel--可斷開板certificate--證明書break point --出像點,顯像點CFC--氟氯碳化物breakdown voltlage--崩潰電壓chamfer--倒角break out--破出characteristic impedance--特性阻抗bridging--搭橋,橋接chase--網框bright-dip--光澤浸漬處理check list--檢查清單brightener--光澤劑chelate--螫合brush plating--刷鍍chemical milling--化學研磨build-up--增厚,堆積chemical resistance--抗化性bulge--鼓起,凸出chemisorption--化學吸附bump--突塊chip--晶粒.晶片.片狀buoyancy--浮力chip on board--晶片黏著板buried via hole--埋導孔chisel--鑿刄burin-in--高溫加速老化試驗circumferential separation--環狀斷孔burning--燒焦clad/cladding--披覆burr--毛頭clean room--無塵室.潔淨室bus bar--滙電桿cleanliness--清潔度butter coat--外表樹脂層claearance--餘地.餘隙.餘環balanced transmission lines--平衡式傳輸線clinched lead terminal--緊箝式引腳ball grid array--球腳陣列(封裝)clinched -wire through connection--通孔彎鷥連接bi-level stencil--雙階式鋼版clip terminal--繞線端接blur edge(circle)模糊邊帶,模糊邊圈co-firing--共燒brown oxide--棕氧化coat,coating--皮膜,表層build up process--增層法製程coaxial cable--同軸纜線chip joint--晶片焊接coefficient of thermal expansion--熱膨脹係數C cold flow--冷流cable--電纜cold solder joint--冷焊點CAD--電腦輔助設計 collimated light--平行光calendered fabric--軋平式網布 colloid--膠體cap lamination--帽式壓合法columnar structure--柱狀組織capacitance--電容comb pattern--梳型電路capacitive coupling--電容耦合complex ion--錯離子caillary action--毛細作用component hole--零件孔carbide--碳化物component orientation--零件方向carbon arc lamp--硸弧燈component side--組件面carbon treatment, active--沽性炭處理composites,(CEM-1,CEM-3)--複合板材card--卡板conditioning--整孔card cages/card racks--電路板構裝箱conductance--導電carlson pin-- 卡氏定位梢conductive salt--導電鹽conductivity--導電度deburring --去毛頭conductor spacing--導體間距declination angle--斜射角conformal coating--貼護層.護形definition--邊緣逼真度conformity--吻合性,服貼性degradation--劣化connector--連接器degrasing--脫脂contact angle--接觸角deionized water--去離子水contact area--接觸區delamination--分層contact resistance--接觸電阻dendritic growth--枝狀生長continuity--連通性denier--丹尼爾contract service--協力廠,分包商densitomer--透光度計conversion coating--轉化皮嫫dent--凹陷coplanarity--共面性deposition--皮膜處理copolymer--共聚物desiccator--乾燥器copper foil--銅箔.銅皮desmearing--除膠渣copper mirror test--銅鏡試験desoldering--解焊copper paste--銅層developer--顯像液,顯像機copper paste--銅膏developing--顯像corner crack--通孔斷角deviation--偏差corner mark--板角標記device--電子元件counterboring--方型擴孔,埋頭孔dewetting--縮锡countersinking--錐型擴孔,喇叭孔diazo film--偶氮棕片coupling agent--偶合劑dichromate--重鉻酸鹽coupon,test coupon--板邊試樣dicyandiamide(dicy)雙氰胺coverlay/covercoat--表護層.保護層die--沖模,鑄模crack--裂痕diebonding--晶粒接著crazing--白斑die stamping--沖壓crease--皺褶dielectric breakdown voltage--介質崩潰creep--潛變dielectric constant--介質常數crossection area--截面積dielectric strength--介質強度crosshatching--十字交叉區differential scanning calorimetry(DSC)微差掃瞄crosslinking,crosslinkage--交聯,架橋diffusion layre--擴散層crosstalk--雜訊.串訊digitizing--數位化cure--硬化dihedral angle--雙反斜角current density--電流密度dimensional stability--尺度安定性curtain coating --濂塗法diode--二極體current-carrying capability--載流能力DIP(dual inline package)--雙排腳封裝體cation--陰向游子,陽離子dip coating--浸塗法chip interconnection--晶片互連dip soldering--浸焊法chip on glass--晶玻接裝dipole--偶極,雙極chlorinated solvent--含氯溶劑,氯化溶劑direct emulsion--直接乳膠condensation soldering--凝熱焊接,液化放熱焊接direct/indirect stencil---直間版膜controlled depth drilling--定深鑽孔direct plating--直接電鍍,直接鍍板copper-invar-copper(CIC)--綜合夾心板discrete compenent--散裝零件core material--內層板材,核材dish down--碟型下陷crossover--越交,搭交dispersant--分散劑crosshatch testing--十字割痕試驗disspation factor--散逸因子crystalline melting point--晶體溶點dog ear--狗耳D doping--摻雜datum reference--基準參考double layre--電雙層daughter board--子板double treated foif--雙面處理銅箔drag in/drag out--帶進/帶出entrapment--夾雜物drag soldering--拖焊entry material--蓋板drawbringing--吊橋效應epoxy resin--環氧樹脂drilled blank--已鑽孔的裸板etchant--蝕刻劑.蝕刻液drill facet--鑽尖切削面etchback--回蝕drill pointer--鑽針重磨機etch factor--蝕刻因子.蝕刻函數dross --浮渣etching indicator--蝕刻指標drum side --銅箔光面etching resist--抗蝕阻劑dry film--乾膜eutetic composition--共融組成dual wave soldering--雙波焊接exposure--曝光dutility--展性eyelet--鉚眼cummy,dummying--假鍍片,假鍍E-Beam(electron beam)--電子束dummy land--假焊墊electroforming--電鑄durometer--橡膠硬度計emulsion side--藥膜面daisy chained design--菊瓣環設計encroachment--沾污,侵犯debris --碎屑,殘材entek--有機護銅處理(指裸銅板)dicing--晶片分割exotherm--放熱(曲線)die attach--晶粒安裝Fdiscrete wiring board--散線電路板,複線板fabric--網布disturbed joint--受擾焊點face bonding--反面朝下之結合doctor blade--修平刀,刮平刀failure--故障,損壞drift--漂移farad--法拉dynamic flex(FPC)--動態軟板farady--法拉第一DYCOstrate--電漿蝕孔增層法fatique strength--抗疲勞強度E fault--缺陷.瑕疵eddy current--渦電流 fault plane--斷層面feed throught hole--導通孔edge-board connector--板邊(金手指)承接器edge-board contact--板邊金手指feeder--進料器.送料器edge-dip solderability test--板邊焊錫性fiber exposure--玻纖顯露edge spacing--板邊空地fiducial mark--基準記號EDTA--乙二胺四醋酸filament--纖絲effluent--排放物fill--緯向elastomer--彈性體filler--填充料electric strength--(耐)電性強度fillet--內圓填角electrodeposition--電鍍film--底片electro-deposited photoresist--電著光阻filter--過濾器.濾光鏡片electro-migration--電遷移fine line--細線electro-phoresis--電泳動,電滲fineness--純度.成色.粒度electro-tinning--鍍錫(老式說法)新式-tin finger--手指(板邊連續排列接點) electro-winning--電解治煉finishing--終飾.終修electroless-deposition--無電鍍first article--首產品electrolytic cleaning--電解清洗first pass-yield--初檢良品率electrolytic tough pitch--電解銅 fixture--夾具elongation--延伸性,延伸率flair--第一面外緣變形.刄角變形embossing--凸出性壓花flame resistant--耐燃性EMF--電動勢(electromotive force)flammability rate--燃性等級EMI--電磁干擾(electromagnetic interfere flare--扇形崩口emulsion--乳化flash platin--閃鍍encapsulatiog-- 囊封.膠囊flashover--閃絡end cap--封頭flat cable--扁平封裝(之零件) flexible printed circuit, fpc--軟板golden board--測試用標準板flexural failure--撓曲損壞grain size--結晶粒度flexural strength--抗撓強度grid--標準格flocculation--絮凝,凝聚ground plane(earth plane)--接地層flood stroke print--覆墨衝程印刷ground plane clearnce--接地空環flow soldering--流焊gull wing lead--鷗翼引腳fluorescence--螢光grass leak--大漏flurocarbon resin--碳氟樹脂guide pin--導針flush conductor--嵌入式線路,貼平式導體gallium arsenide(GaAs)--砷化鎵flute--退屑槽galvanic corrosion--賈凡尼式腐蝕flux--助焊劑gate array--閘極陣列,閘列foil burr--銅箔毛邊glaze--釉面,釉料foil lamination--銅箔壓板法glob top--圓頂封裝體foot --殘足glycol(ethylene glycol)--乙二醇foot print(land pattern)腳墊Hforeign material--外來物,異物half angle--半角form-to-list--佈線說明清單halide--卥化物free radical--自由基haloing--白圈.白邊frequency--頻率halon--海龍fully-additive process--全加成法hard anodizing--硬陽極化fungus resistance--抗霉性hard chrome plating--鍍硬銘fused coating--熔錫層hard soldering--硬焊fusing--熔合hardener--硬化劑(curing agent)hardness--硬度fan out wiring/fan in wiring --扇出佈線/扇入佈線film adhesive--接著膜,黏合膜haring-blum cell--海因槽finite element method--有限要素分析法harness--電纜組合fine pitch--密腳距,密線距,密墊距hay wire--跳線flame point--自燃點heat cleaning--燒潔flatness--平坦度heat sink plane--散熱層flexural module--彎曲模數,抗撓性模數heatsink tool--散熱工具flip chip--覆晶,扣晶hertz(Hz)--赫flush point--閃火點hi-rel--高可靠度(High potential test )four point twisting--四點扭曲法hit--擊freeboard--乾舷holding time--停置時間frit--玻璃熔料hole breakout--孔位破出fusing fluid--助熔液hole counter--數孔機G hole density--孔數密度gage,gauge--量規hole location--孔位galvanic series--費凡尼次序hole pull stength--孔壁強度galvanizing--鍍鋅hole void--破洞GAP--第一面分離,長刄斷開hook--切削刄緣外凸gel time--膠化時間hot air levelling--噴錫gelation particle--膠凝點hot bar(reflow)soldering--熱把焊接gerber date, gerber file--格博檔案hot gas soldering--熱風手焊ghost image--陰影HTE(high temperature elongation)-- 高溫延伸性gilding--鍍釒hul cell--哈氏槽glass fiber--玻纖hybrid integrated circuit--混成電路hydraulic bulge test--液壓鼓起試驗glass fiber protrusion/gouging ,groove玻glass transition temperature,Tg--玻璃態hydrogen embrittlement--氫脆gloube test--球狀測試法hydrogen overvoltage--氫超電壓，氫過電壓hydrolysis--水解junction--接(合)面,接頭hydrophilic--親水性Khygroscopic--吸濕性kapton--聚亞硫胺軟材hypersorption--超吸附karat--克拉,開halation--環暈kerf--切形,裁截heat dissipation--散熱kevlar--聚硫胺纖維heat distortion point(temp.)--熱變形點(溫度)key--鑰槽,電鍵heat sealing--熱封key board--鍵盤,鍵盤板heat transfer paste--導熱膏,傳熱膏kiss pressure--吻壓.低壓knoop hardness--努普硬度high efficiency particulate air filter(HEPA)-高效空氣塵粒過濾機I kovar--科伐合金I.C.Socket--積體電路器插座kraft paper--牛皮紙icicle--錫尖kaui-butanol value--考立丁醇值簡稱K.B.值illuminance--照度known good die(KGD)已知的良好晶片image transfer--影像轉移，圖像轉移Limmersion plating--侵鍍laminar flow--平流impedance--阻抗，特性阻抗laminar structure--片狀結構impedance match--阻抗匹配laminate void--板材空洞in0circuit testing--組裝板電測lamination void--壓合空泂inclusion--異物.夾雜物laminate--基板,積層板indexing hole --基準孔.參考孔laminator--壓膜機inductance(L)電感land --孔環焊墊.表面(方型)焊墊infrared(IR)--紅外線landless hole--無環通孔input/output--輸入/輸出laser direct imaging (LDI)--雷射直接成像insert.insertion--插接.插裝laser maching--雷射加工法inspection overlay--套檢底片laser photogenerator/photoplotter(LPG)--雷射曝insulation resistance--絕緣電阻lay back--刄角磨損integrated circuit(IC)--積體電路器lay out--佈線.佈局interconnection--互連lay up--疊合interface--介面layer to layer spacing--層間距離intermatallic compound(IMC)--介面合金共leaching--焊散.漂出.溶出internal stress--內應力lead frame--腳架lead--引腳.接腳interstitial via-hole(IVH)--局部層間導通invar--殷鋼legend--文字標記.符號ion exchange resins--離子交換樹脂leveling--整平lifted land--孔環(焊墊)浮起ionizable(Ionic)contaimination--離子性污ionization--游離,電離ligand--錯離子附屬體light integrator--光能累積器.光積分器ionization volatge(corona level)--電離化IPC(Instiute of printed circuits)--美國light emitting diodes (LED)--發光二極體impregnate--含浸light intensity--光強度interposer--互速導電物limiting current density--極限電流密度ion migration--離子遷移liquid crystal display(LCD)--液晶顯示器isolation--隔離性,隔絕性liquid dielectrics--液態介質J liquid photoimagible solder mask (LPSM)--液態感J-Lead--J型接腳logic circuit--邏輯電路JEDEC--聯合電子元件工程委員會lot size--批量job shop--專業工廠,職業工廠luminance--發光強度,耀度joule--焦耳lyophilic--親水性膠體jumper wire--跳線lamda wave--延伸平波just-in-time(JIT)--適時供應,及時出現laser soldering--雷射焊接法lead pitch--腳距multi-chip-module(MCM)--多晶片斷(芯片)leakage current--漏電電流multiwiring board/discret wiring board--複線板local area network--區域性網路major weave direction--主要織向logic--邏輯mean time to failure--故障前可用之平均時數loss tangent--損失正切micelle--微胞M microstrip line--微條線,微帶線macro-throwing power--巨觀分佈力microwave--微波major defect--嚴重缺點,主要缺點micro wire board--微封線(漆包線)板margin--刄帶.脈筋minor weave direction--次要織向marking--標記mole--摩爾,克分子,克原子mask --阻劑mold release--腳模劑,離型劑mass finishing--大量整面.大量拋光moulded circuit--模造立體電路板mass lamination--大型壓板(層壓)mounting hole--組裝孔,機裝孔mass transport--質量輸送Nmaster drawing--主圖nail head--釘頭mat--蓆N.C--數值控制(Numerically controlled/Numerical matte side--毛面near IR(Infra-Red)--近紅外線measling--白點negative--負片.鑽尖第一面外緣變窄mechanical stretcher--機械式張網機negative-acting resist--負性作用之阻劑,負型阻劑mechanical warp--機械性纏繞negative etch -back--反回蝕mechanism--機理negative stencil--負性感光膜membrane switch--薄膜開關network--網狀元件meniscograph test--弧面狀沾錫試驗newton(N)--牛頓 (1N/cm2=129 g/cm2)meniscus--彎月面,上凹面newton ring--牛頓環mercury vaper lamp--汞氣燈newtonian liquid--牛頓流體mesh count--網目數nick--缺口metal halide lamp--金屬卥素燈noble metal paste--貴金屬印膏metallized fabric--金屬化的網布node--節點metallization--金屬化nodule--瘤micro-electronios--微電子nomencleature--標示文字符號microetching--微蝕nominal cured thickness--標示厚度microsectioning--微切片法non0circular land--非圓形孔環焊墊microstrip--微條non-flammable--非燃性microthrowing power--微分佈力non-wetting--不沾錫migration--遷移normal distribution--常態分配,常態分佈migration rate--遷移率novolac--酯醛樹脂mil--英絲(千分之一英吋0.001 in)nucleation,nucleating--核化minimum annular ring--孔環下限numerical control--數值控制,數控nylon--耐龍.尼龍minimum electrical spacing--電性間距下限misregistration--對不準,對不準度N-Methyl phyrrolidine(NMP)--N甲基四氫吡咯normal concentration(strength)--標準濃度,當量濃度mixed componmt mounting technology--混合modem--調變.解調器.數據機Omodification--修改.改質occlusion--吸藏module--模組off-contact--架空modulus of elasticity--彈性係數offset--第一面大小不均moisture and insulation resistancetest-OFHC(oxygen free high conductivity)--無monofilament--單絲ohm--歐姆mother board --主機板.主構板.母板OLB(outer lead bond)--外引腳結合mounting hole --安裝孔oligomer--寡聚物mouse bite--鼠齧omega meter--離子污染檢測儀omega wave--振盪波photoresist chemical machinning(milling)--光阻opaquer--不透明劑,遮光劑phototool--底片open circuits--斷線 pick and place--拾取與放置optical comparater--光學對比器(光學放大piezoelectric--壓電性optical density--光密度pin grid array(PGA)--矩陣式針腳封裝optical inspection--光學檢驗pinhole--針孔optical instrument--光學儀器pin--接腳,插梢,插針osmosis--滲透pink ring--粉紅圈outgassing--出氣,吹氣plain weave--平織outgrowth--懸出,橫出,側出plasma--電漿output--產出,輸出plasticizers--可塑劑,增塑劑overflow--溢流plated through hole ,PTH--鍍通孔overhang--總浮空platen--熱盤overlap--鑽尖點分離plating--鍍plotting--標繪overpotantial (overvoltage)--過電位,過電oxidation--氧化plug--插腳,塞柱oxygen inhibitor--氧氣抑制現象ply--層,股ozone depletion--臭氧層耗損pneumatic stretcher--氣動拉伸器oilcanning--蓋板彈動point angle--鑽尖角on-contact printing--密貼式印刷point soure light--點狀光源point--鑽尖organic solderability pressrvatives(OSP)--有機保焊劑p poise--泊packaging--封裝,構裝polar solvent-- 極性溶劑pad--焊墊,圓墊polarity--電極性pad master--圓墊底片polarization--分極,極化palladium --鈀polarizing slot--偏槽panel--製程板polyester films--聚酯類薄片panel plating--金板鍍銅polyimide(PI)--聚亞硫胺panel process--全板電鍍法porosity test--疏孔度試驗paper phenolic--紙質酚醛樹脂(板材）positive acting resist--正性光阻劑parting agent--脫膜劑post cure--後續硬化,後烤pot life--適用期,鍋中壽命passive device(component)--被動元件(零件paste--膏,糊potting--鑄封,模封pattern--板面圖形power supply--電源供應器pattern plating--線路電鍍pre-tinning--預先沾錫pattern process--線路電鍍preform--預製品pattern process--線路電鍍法preheat--預熱peak voltage--峰值電壓prepreg--膠片,樹脂片peel strength--抗撕強度press plate--鋼板periodic reverse(PR)current--週期性反電press-fit contact--擠入式接觸peripheral--週邊附屬設備primary image--線路成像permeability--透氣性,導磁率probe--探針permittivity--誘電率,透電率process camera--製程用照像機phenolic--酚醛樹脂profile--輪廓.部面圖.升溫曲線圖稜線photofugitive--感光褪色propagation--傳播photographic film--感光成像之底片 puddle effect--水坑效應photoinitiator--感光啟始劑pull away 拉離photomask--光罩pulse plating--脈衝電鍍法photoplotter,plotter--光學繪圖機pumice powder--浮石粉photoresist--光阻punch--衝切purge,purging--淨空,淨洗relief angle--浮角purple plague--紫疫repair--修理post separation--後期分離,事後分離resin content--膠含量,樹脂含量PH value--酸鹼值resin recession--樹脂下陷phase--相resin rich area --樹脂豐富區,多膠區phase diagram-相圖rsin smear--膠糊渣,膠渣pits--凹點resist--阻劑,阻膜pitch--跨距,腳距,墊距,線距resistivity--電阻器,電阻plowing-犁溝resistor drift--電阻漂移pogo pin--伸縮探針resolution--解像,解像度,解析度polymerization--聚合resolving power--解析力,解像力(分辨力) polymer thick film(PTF)--厚膜糊reverse current cleanning--反電流(電解)清流popcorn effect--爆米花效應reverse etchback--反回蝕porcelain--瓷材,瓷面reverse image--負片影像(阻劑)pressure foot--壓力腳reversion--反轉.還原print through--壓透,過度擠壓revision--修正版.改訂版process window--操作範圍rework--重工,再加工production master--生產底片rhology--流變學,流變性質propagation delay--傳播延遲ribbon cable--圓線纜帶pyrolysis--熱裂解,高溫分解rigid-flex printed board--硬軟合板Q rinsing--水洗.沖洗quad flat pack(QFP)--方扁形封裝體ripple--紋波qualification agency--資格認證機構roadmap--線路與零件之佈局圖qualification inspection--資格檢驗robber--輔助陰極qualified products list--合格產品(供應者)名單roller coating--輥輪塗佈qualitative analysis--定性分析roller cutter--輥切機(業界俗稱鋸板機)roller tinning--輥錫法,滾錫法quality conformance test circuitry(coupon)--品質符合試驗線路quantitative analysis--定量分析rosin--松香quench--淬火,驟冷rotary dip test--擺動沾錫試驗quill--緯紗繞軸routing--切外型R runout--偏轉,累積距差rack--掛架rupture--迸裂radial lead--放射狀引腳radio frequency interference(RFI)--射頻干擾radiometer--輻射計,光度計real time system--即時系統rake angle0--摳角,耙角reflection--反射rated temperature,voltage--額定溫度,額定電壓relamination(Re-Lam)--多層板壓合reactance--電抗resin coated copper foil--背膠銅箔real estate--底材面,基板面resistor paste--電阻印膏reclaiming --再生,再製reverse osmosis(RO)--逆滲透real to reel--捲輪(盤)式操作ring--套環reference dimension--參考邊緣rise time--上升時間reflow soldering--重熔焊接,熔焊roller coating--滾動塗佈法refraction--折射Srefractive index--折射率sacrificial protection--犠牲性保護層register mark--對準用標記salt spray test--鹽霧試驗reinforcement--補強物sand blast--噴砂rejection--剔退,拒收saponification--皂化作用relay--繼電器satin finish--緞面處理relaease agent,release sheets--脫模劑,離型膜scaled flow test--比例流量試驗reliability--可靠度,信賴度scratch--刮痕screen printing--網版印刷solder bridging--鍚橋screenability --網印能力solder bump--銲錫凸塊scrubber--磨刷機.磨刷器solder connection--焊接scum--透明殘膜solder cost--銲錫著層sealing--封孔solder dam--錫堤secondary side--第二面solder fillet--填錫seeding--下種solder levelling--噴錫.熱風整平selective plating--選擇性電鍍solder mask(S/M)--緣漆,防焊膜self-extinguishing--自熄性solder paste--錫膏selvage--布邊solder plug--錫塞,錫柱semi-additive process--半加成製程solder preforms--預銲料semi-conductor--半導體solder projection--銲錫突點sensitizing--敏化solder sag--銲錫垂流物separable component part--可分離式零件solder side--焊錫面`solder spatter--濺錫sequestering agent--整合劑solder spread test--散錫試驗shadowing--陰影,回蝕死角solder webbing--錫網shank--鑽針柄部solder wicking--銲錫之燈芯效應,滲錫shear strength--抗剪(力)強度soldering--軟焊,焊接shelf life--儲齡soldering fluidm, soldering oil--助焊液,護焊油shield--遮蔽,屏遮saponifier--皂化劑shoer hardness--蕭氏硬度scoring --V型刻槽short--短路separator plate--隔板,鋼板,鏡板shoulder ange--肩斜角silver paste--銀膏shunt--分路silica gel--矽膠砂side wall--側壁sintering--燒結siemens--電阻值sizing--上漿處理sigma(standard deviation)--標準差silver migration--銀遷移signal--訊號skp solder--缺錫,漏銲silane--矽烷smudging--錫點沾污silicon--矽soft contact--輕觸silicone--矽酮soft glass--軟質玻璃(鉛玻璃)silk screen--網版印刷,絲網印刷solder column package--錫柱腳封裝法single-in-line package(SIP)--單邊插腳封裝體solder splash--濺錫sizing--上膠,上漿solder webbing--錫網skin effect--集膚效應specific heat--比熱skip printing ,skip plating--漏印,漏鍍spinning coating--自轉塗佈slashing--漿經stagger gird--蹣跚格點sleeve jint--套接super solder--超級焊錫sliver--邊絲,邊條surface resistivity--表面電阻率slot,slotting--槽口,開槽surface speed--鑽針表面(切線)速度sludge--沉澱物,淤泥solid content--固體含量,固形份,固形物slump --塌散solidus line--固相線small hole--小孔spacing--間距smear--膠糊渣,膠渣span--跨距snap-off--彈回高度spark over--閃路socket--插座specification(Spec.)--規範.規格solder--銲錫specimen--樣品,試樣solderability--焊錫性,可焊性spectrophotometry--分光光度計檢測法solder bal--銲錫球,鍚球spindle--鑽軸,主軸splay--斜鑽孔template--模板spray coating--噴著塗裝,噴射塗裝tensile strength--抗拉強度spur--底片圖形邊緣突出tensiomenter--張力計supttering--濺射tenting--蓋孔法squeege--刮刀terminal--端子stalagometer--滴管式表面張力計terminal clearance--端子空環,端子讓環stand-off terminals--直立型端子tetrafuncitional resin--四功能樹脂starvation--缺膠thermal coefficient of expansion(TCE)--熱膨脹係數static eliminator--靜電消除器thermal conductivity--導熱率steel rule die--(鋼)刀模thermal cycling--熱循環,熱震盪stencil--版膜thermal mismstch--感熱失諧step and repeat--逐次重覆曝光thermal relief--散熱式鏤空step plating--梯階式鍍層thermal zone--感熱區step tablet--階段式(光密度)曝光表thermocompression bonding--熱壓結合stiffener--補強條,補強板thermocouple--熱電偶stop off--阻劑,防鍍膜thermode--發熱體strain--變形,應變thermomechanical analysis(TMA)--熱機分析法strand--絞thermoplastic--熱塑性stray current--迷走電流,散雜電流thermosetting--熱固性stress corrosion--應力腐蝕thermosonic bonding--熱超音波結合stress relief-- 消除應力thermo-via--導熱孔strike --預鍍,打底thick film circuit--厚膜電路stringing--拖尾,牽絲thief--輔助陰極,竊流陰極stripline--條線thin copper foil--薄銅箔stripper--剝除液,剝除器thin core--薄基板substractive process--減成法thin film technology--薄膜技術substrate--底材thinner--調薄劑supported hole--(金屬)支助通孔thixotropy--抗垂流性,搖變性,搖溶性,靜凝性surface energy--表面能three-layer carrier--三層式載體threshold limit value(TLV)--極限值surface insulation resistance(SIR)--表面絕緣電阻surface mounting technology--表面黏裝技術through hole mounting--通孔插裝surface tension--表面張力through put--物流量,物料通過量surface-mount device--表面黏裝零件throwing power--分佈力surfactant--表面潤濕劑tie bar--分流條surge--突流,突壓tin drift--錫量漂飄失swelling agents;sweller--膨鬆劑tin immersion--浸鍍錫swimming--線路滑離tin pest-- 錫疫synthetic resin--合成樹脂tin whishers--錫鬚T tinning--熱沾銲錫tab--接點,金手指tolerance--公差,誤差值taber abraser--泰伯磨試器tombstoning--墓碑效應tape automatic bonding(TAB)--捲帶自動結合tooling feature--工具標的物tape test--撕膠帶試驗torsion strength--抗扭強度tape up master--原始手貼片touch up --觸修.簡修taped components--捲帶式速載零件trace--線路.導線taper pin gauge--錐狀孔規traceability--追溯性.可溯性tarnish--污化transducer--轉能器teflon--鐵氟龍transfer bump--移用式突塊,轉移式突塊telegraphing--浮印,隱印t4ransfer laminatied circuit--轉壓式線路temperature profile--溫度曲線transfer soldering--移焊法transistor--電晶體varnish--清漆,凡力水transimission line--傳輸線very large-scae integration(VLSI)--極大積體電路器transmittance--透光率via hole --導通孔treament,treating--含浸處理vickers hardness--維氏硬度treeing--枝狀鍍物,鍍鬚viscosity--黏滯度,黏度trim line--截切線vision systems --視覺系統trimming--修整.修邊visual examination(Inspection)--目視檢查true position--真位void--空洞.破洞tungsten--鎢volatile content--揮發份含量tungsten carbide--碳化鎢voltage--電壓turnkey system--包辦式系統voltage breakdown--崩潰電壓turret solder terminal--塔立式焊接端子voltage drop--電壓隆落twill weave--斜織法,菱織法voltage efficiency--電壓效率twist--板翹.板扭voltage plane--電壓層two layer carrier--兩層式載體voltage plane clearance--電壓層的空環tackiness--黏著性,黏手性volume resistivity--體積電阻率tape casting--帶狀鑄材volumetric analysis--容量分析法tarnish --污化,污著vulcanization--硫化,交聯tetra-etch--氟樹脂蝕粗劑vacyikes--焊洞thermal via--導熱孔,散熱孔W thermogravimetric analysis(TGA)--熱重分析法wafer--晶圓thermode soldering--熱模焊接法waive--暫准過關,暫不檢驗thermount--聚硫胺短織蓆材warp,warpage--板彎thin small outline packange--薄小型積體電路器warp size--漿經處理three point bending--表面地形washer--墊圈translucency--半透性waste treatment--廢棄處理trim--修整,修改數值,精修water absorption--吸水性U water break --水膜破散,水破UL symbol--保險業試驗所標誌watermark--水印ultimate tensile strength(UTS)--極限抗拉強度watt--瓦特ultra high frequency(UHF)--特高頻率watts bath--瓦茲鍍鎳液ultra violet curing (UV curing)--紫外線硬化wave guide--導波管ultrasonic bonding--超音波結合wave soldering--波焊ultrasonic cleaning--超音波清洗waviness--波紋,波度ultrasonic soldering--超音波焊接wear resistance--耐磨度,耐磨性undercut,undercutting--側蝕weatherability--耐候性underplate--底鍍層weave eposure--織紋顯露universal tester--汎用型電測機weave texture--織紋隱現unsupported hole--非鍍通孔web--蹼部urea--尿素weft yarn--緯紗urethane--胺基甲酸乙脂welding--熔接unbalanced transmission line--非平衡式傳輸線wet blasting--濕噴砂V wet lamination--濕壓膜法V-Cut-- V型切槽wet process--濕式製程vaccum evaporation/deposition--真空蒸鍍法wetting agant--潤濕劑vaccum lamination--真空壓合wetting balance--沾錫天平van der walls force--凡得瓦力wetting--沾濕,沾錫vapor blasting--蒸氣噴砂whirl brush--旋渦式磨刷法vapor degreasing--蒸氣除油法whirl coating--旋渦塗佈法vapor phase soldering--氣相焊接whisker--晶鬚white residue--白色殘渣white spot--白點補充wicking--燈芯效應drill--鉆孔window --操作範圍,傳動齒孔beveling dimension--磨邊尺寸wire bonding--打線結合bare copper--裸銅wire gauge--線規CuSO4--硫酸銅wire lead--金屬線腳KMnO4 --高錳酸鈉wire wrap--繞線互連wiring pattern--佈線圖形working master--工作母片working time--堪用時間workmanship--手藝,工藝水準,製作水準woven cable--扁平編線wrought foil--鍛碾金屬箔wedge void--楔形缺口(破口)wiping action--滑動接觸(導電)wrinkle--皺摺,皺紋XX Axis--X軸X-Ray--X光YY-Axis --Y 軸yarn--紗,線yield --良品率,良率,產率yield point--屈服點,降伏點ZZ-Axis--Z 軸zig-zag in-line package(ZIP)--鏈齒狀雙排腳封裝件zero centering--中心不變(疊合法)。
中英文对照的PCB专业用语
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlay er printed board(mlb)13、多层印制电路板：mulitlay er printed circuit board14、多层印制线路板：mulitlay er prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilay er printed board19、挠性多层印制板：flexible multilay er printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilay er printed board, rigid-flex multilay er printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlay er37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlay er printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-lay ered film substrate(mfs)45、层间全内导通多层印制板：alivh multilay er printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：cataly zed board ,coated cataly zed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncataly zed laminate23、粘结层：bonding lay er24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover lay er (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ploy ester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：poly imide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：poly ester resin7、聚酰亚胺树脂：poly imide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acry lic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：sy nthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicy andiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated poly ester36、聚酯薄膜：poly ester37、聚酰亚胺薄膜：poly imide film (pi)38、聚四氟乙烯：polytetrafluoety lene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethy lene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft y arn52、经纱：warp y arn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish ey e68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of y arn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：poly armide fiber79、聚酯纤维非织布：non-woven poly ester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic poly amide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire lay out4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：lay out19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：lay out effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：phy sical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated lay er78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor lay er5、导线宽度/间距：conductor line/space6、第一导线层：conductor lay er no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any lay er inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业英译术语
PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
电路板中英文专业术语词汇（A-M）
电路板中英文专业术语词汇（A-M）电路板专业词汇（A－M）Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验). Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收. Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜. Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号. Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准. Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr) 凡液体比重比水轻则Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边. Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层.Bonding Sheet(Layer)接合片.Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425℃~870℃下进行熔接的方式). Break Point显像点. Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理. Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程. Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程. Buoyancy浮力.Buried Via Hole埋导孔. Burn-in高温加速老化试验. Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接. Cable电缆.CAD计算机辅助设计. Calendered Fabric轧平式纲布. Cap Lamination帽式压合法. Capacitance电容. Capacitive Coupling电容耦合. Capillary Action毛细作用. Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法. Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂. Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积.Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法. *****D*****Daisy Chained Design菊瓣设计. Datum Reference基准参考. Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)).Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度.Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉. Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板.Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路, 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB 面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金(现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent). Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度). Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink T ool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验.Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻. Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物. Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔. Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染. Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉(1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).Mealing泡点.Mean Time T o Failure (MTTF)故障前可用之平均时数. Measling 白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance T est湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口). Multi-Chip-Module(MCM)多芯片芯片模块. Multiwiring Board (or Discrete Wiring Board)复线板.。
电子厂常用英语
电子厂常用英语在电子厂工作，掌握一些常用的英语词汇和表达方式是非常重要的。
这不仅有助于提高工作效率，还能促进与国际团队的沟通。
以下是一些电子厂中常用的英语词汇和表达：1. 组件（Component）：电子厂中的基本单元，如电阻（Resistor）、电容（Capacitor）、晶体管（Transistor）等。
2. 电路板（Circuit Board）：用于组装电子组件的基板，常见的有印刷电路板（Printed Circuit Board, PCB）。
3. 焊接（Soldering）：将电子组件固定在电路板上的过程。
4. 测试（Testing）：对电子设备进行功能和性能的检验，确保其符合设计要求。
5. 质量控制（Quality Control）：确保产品符合质量标准的过程。
6. 故障诊断（Troubleshooting）：识别并解决电子设备中的问题。
7. 维修（Maintenance）：定期检查和修复电子设备，以保持其良好运行状态。
8. 生产线（Assembly Line）：用于组装电子设备的流水线。
9. 库存管理（Inventory Management）：跟踪和管理电子厂中的物料和成品。
10. 供应链（Supply Chain）：涉及原材料采购、生产、分销和销售的整个流程。
11. 环境控制（Environmental Control）：确保电子厂的生产环境符合安全和健康标准。
12. 工艺流程（Process Flow）：描述电子设备生产过程中的各个步骤。
13. 产品生命周期（Product Life Cycle）：从产品开发到市场退出的整个过程。
14. 技术规格（Technical Specifications）：详细描述电子设备性能和功能的文档。
15. 项目管理（Project Management）：规划、组织和监督电子项目从开始到结束的全过程。
16. 持续改进（Continuous Improvement）：不断寻找提高生产效率和产品质量的方法。
线路板PCB专业英语词汇(制造、测试、缺陷名等)
热固性
Clad
覆箔
Layup
叠层
laminating
层压
Postcure
后固化
Curing time
固化时间
Resinflow
树脂流动度
Resin content
树脂含量
PCB英语词汇（二）
3 设计
3.1 通用术语
Computer-aided design (CAD)
计算机辅助设计
导线宽度/ቤተ መጻሕፍቲ ባይዱ距
Conductor layer
导线层
Component hole
元件孔
Mountinghole
安装孔
Supported hole
支撑孔
Unsupported hole
非支撑孔
Via
导通孔
Plated through hole
镀通孔
Blind via (hole)
盲孔
Buried via (hole)
消泡剂
resolution
分辨率
definition
逼真度
ghost image
重影
halation
晕环
air inclusion
夹杂气泡
tackiness
粘着性
post cure
后固化
shelf life
保存期
pot life/ working life
适用期
dip coating
浸涂法
roller coating
网版印刷
Silk screen
丝印网版
Stencil
网版
Screenability
线路板常用术语中英文对照表
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamim ates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
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电路板专业词汇（A－M）Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS树脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(试验).Acceleration速化反应.Accelerator 加速剂,速化剂.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准确度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像显微镜.Acrylic压克力(聚丙烯酸树脂).Actinic Light (or Intensity, or Radiation)有效光.Activation活化.Activator活化剂.Active Carbon活性炭.Active Parts(Devices)主动零件.Acutance解像锐利度.Addition Agent添加剂.Additive Process加成法.Adhesion附着力.Adhesion Promotor附着力促进剂.Adhesive胶类或接着剂.Admittance导纳(阻抗的倒数).Aerosol喷雾剂,气熔胶,气悬体.Aging老化.Air Inclusion气泡夹杂.Air Knife风刀.Algorithm算法.Aliphatic Solvent脂肪族溶剂.Aluminium Nitride(AlN)氮化铝.Ambient Tamp环境温度.Amorphous无定形,非晶形.Amp-Hour安培小时.Analog Circuit/Analog Signal模拟电路/模拟讯号.Anchoring Spurs着力爪.Angle of Contack接触角.Angle of Attack攻角.Anion阴离子.Anisotropic异向性,单向的.Anneal 韧化(退火).Annular Ring孔环.Anode阳极.Anode Sludge阳极泥.Anodizing阳极化.ANSI美国标准协会.Anti-Foaming Agent消泡剂.Anti-pit Agent抗凹剂.AOI自动光学检验.Apertures开口,钢版开口.AQL品质允收水准.AQL(Acceptable Quality Level)允收品质水准.Aramid Fiber聚醯胺纤维.Arc Resistance耐电弧性.Array排列.Artwork底片.ASIC特定用途绩体电路器.Aspect Ratio纵横比.Assembly组装装配.A-stage A阶段.ATE自动电测设备.Attenuation讯号衰减.Autoclave压力锅.Axial-lead轴心引脚.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反锥斜角.Backpanels, Backplanes支撑板.Back-up 垫板.Balanced Transmission Lines平衡式传输线.Ball Grid Array球脚数组(封装).Bandability弯曲性.Banking Agent护岸剂.Bare Chip Assembly裸体芯片组装.Barrel孔壁,滚镀.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液体比重比水重则Be=145-(145÷Sp.Gr) 凡液体比重比水轻则Be=140÷(Sp.Gr-130)*Sp.Gr 为比重即同体绩物质对"纯水"1g/cm的比值).Beam lead光芒式的平行密集引脚.Bed-of-Nail Testing针床测试.Bellows Conact弹片式接触.Beta Ray Backscatter贝他射线反弹散射. Bevelling切斜边.Bias斜张纲布,斜纤法.Bi-Level Stencil]双阶式钢板.Binder粘结剂.Bits头(Drill Bits).Black Oxide黑氧化层.Blanking冲空断开.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分层或起泡.Block Diagram电路系统块图 .Blockout封纲.Blotting干印.Blotting Paper吸水纸.Blow Hole吹孔.Blue Plaque蓝纹(锡面钝化层).Blur Edge (Circle)模糊边带(圈).Bomb Sight弹标.Bond Strength结合强度.Bondability结合性.Bonding Layer结合层接着层.Bonding Sheet(Layer)接合片.Bonding Wire结合线.Bow, Bowing板弯.Braid编线.Brazing硬焊(用含银的铜锌合金焊条).在425℃~870℃下进行熔接的方式). Break Point显像点.Break-away Panel可断开板. Breakdown Voltage崩溃电压.Break-out破出.Bridging搭桥.Bright Dip光泽浸渍处理.Brightener光泽剂.Brown Oxide棕氧化.Brush Plating刷镀.B-stageB阶段.Build Up Process增层法制程.Build-up堆积.Bulge鼓起.Bump 突块.Bumping Process凸块制程.Buoyancy浮力.Buried Via Hole埋导孔.Burn-in高温加速老化试验.Burning烧焦.Burr毛头.Bus Bar汇电杆.Butter Coat 外表树脂层.*****C*****C4 Chip JointC4芯片焊接.Cable电缆.CAD计算机辅助设计.Calendered Fabric轧平式纲布.Cap Lamination帽式压合法.Capacitance电容.Capacitive Coupling电容耦合.Capillary Action毛细作用.Carbide碳化物.Carbon Arc Lamp碳弧灯.Carbon Treatment, Active活化炭处理.Card卡板.Card Cages/Card Racks电路板构装箱. Carlson Pin卡氏定位稍.Carrier载体.Cartridge滤心.Castallation堡型绩体电路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode阴极.Cation阴向离子, 阳离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心间距.Ceramics陶瓷.Cermet陶金粉.Certificate证明书.CFC氟氢碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase纲框.Check List检查清单.Chelate螯合.Chemical Milling化学研磨.Chemical Resistance抗化性.Chemisorption化学吸附.Chip芯片(粒).Chip Interconnection芯片互连.Chip on Board芯片粘着板.Chip On Glass晶玻接装(COG).Chisel钻针的尖部.Chlorinated Solvent含氯溶剂,氯化溶剂. Circumferential Separation环状断孔.Clad/Cladding披覆.Clean Room无尘室.Cleanliness清洁度.Clearance余地,余环.Clinched Lead Terminal紧箝式引脚.Clinched-wire Through Connection通孔弯线连接法 . Clip Terminal绕线端接.Coat, Coating皮膜表层.Coaxial Cable同轴缆线.Coefficient of Thermal Expansion热膨胀系数.Co-Firing共绕.Cold Flow冷流.Cold Solder Joint冷焊点.Collimated Light平行光.Colloid胶体.Columnar Structure柱状组织.Comb Pattern梳型电路.Complex Ion错离子.Component Hole零件孔.Component Orientation零件方向.Component Side组件面.Composites,(CEM-1,CEM-3)复合板材. Condensation Soldering凝热焊接,液化放热焊接. Conditioning整孔.Conductance导电.Conductive Salt导电盐.Conductivity导电度.Conductor Spacing导体间距.Conformal Coating贴护层.Conformity吻合性, 服贴性.Connector连接器.Contact Angle接触角.Contact Area接触区.Contact Resistance接触电阻.Continuity连通性.Contract Service协力厂,分包厂. Controlled Depth Drilling定深钻孔. Conversion Coating 转化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil铜皮.Copper Mirror Test铜镜试验.Copper Paste铜膏.Copper-Invar-Copper (CIC)综合夹心板. Core Material内层板材,核材.Corner Crack 通孔断角.Corner Mark板角标记. Counterboring方型扩孔. Countersinking锥型扩孔.Coupling Agent 偶合剂.Coupon, Test Coupon板边试样. Coverlay/Covercoat表护层.Crack裂痕.Crazing白斑.Crease皱折.Creep潜变.Crossection Area截面积.Crosshatch Testing十字割痕试验. Crosshatching十字交叉区. Crosslinking, Crosslinkage交联,架桥. Crossover越交,搭交.Crosstalk噪声, 串讯.Crystalline Melting Point晶体熔点.C-Stage C阶段.Cure硬化,熟化.Current Density电流密度.Current-Carrying Capability载流能力. Curtain Coating濂涂法.*****D*****Daisy Chained Design菊瓣设计. Datum Reference基准参考.Daughter Board子板.Debris碎屑,残材.Deburring去毛头.Declination Angle斜射角.Definition边缘逼真度.Degradation 劣化.Degrasing脱脂.Deionized Water去离子水.Delamination分离.Dendritic Growth 枝状生长.Denier丹尼尔(是编织纺织所用各种纱类直径单位,定义9000米纱束所具有的重量(以克米计)).Densitomer透光度计.Dent凹陷.Deposition 皮膜处理.Desiccator干燥器.Desmearing去胶渣.Desoldering解焊.Developer显像液,显像机.Developing显像 .Deviation偏差.Device电子组件.Dewetting缩锡.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重铬酸盐.Dicing芯片分割.Dicyandiamide(Dicy)双氰胺.Die 冲模.Die Attach晶粒安装.Die Bonding晶粒接着.Die Stamping冲压.Dielectric 介质.Dielectric Breakdown Voltage介质崩溃电压.Dielectric Constant介质常数.Dielectric Strength介质强度.Differential Scanning Calorimetry(DSC)微差扫瞄热卡分析法. Diffusion Layer扩散层.Digitizing数字化.Dihedral Angle双反斜角.Dimensional Stability尺度安定性.Diode二极管.Dip Coating浸涂法.Dip Soldering浸焊法.DIP(Dual Inline Package)双排脚封装体.Dipole偶极,双极.Direct / Indirect Stencil直接/间接版膜.Direct Emulsion直接乳胶.Direct Plating直接电镀.Discrete Compenent散装零件.Discrete Wiring Board散线电路板,复线板.Dish Down碟型下陷.Dispersant分散剂.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受扰焊点.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping掺杂.Double Layer双电层.Double Treated Foil双面处理铜箔.Drag In / Drag Out带[进/带出.Drag Soldering拖焊.Drawbridging吊桥效应.Drift漂移.Drill Facet钻尖切削面.Drill Pointer钻针重磨机.Drilled Blank已钻孔的裸板.Dross浮渣.Drum Side铜箔光面.Dry Film干膜.Dual Wave Soldering 双波焊接.Ductility展性.Dummy Land假焊垫.Dummy, Dummying假镀(片).Durometer橡胶硬度计.DYCOstrate电浆蚀孔增层法.Dynamic Flex(FPC)动态软板.*****E*****E-Beam (Electron Beam)电子束.Eddy Current涡电流.Edge Spacing板边空地.Edge-Board Connector板边(金手指)承接器.Edge-Board Contact板边金手指.Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.Effluent排放物.E-glass电子级玻璃.Elastomer弹性体.Electric Strength(耐)电性强度.Electrodeposition电镀.Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.Electroless-Deposition无电镀.Electrolytic Tough Pitch电解铜..Electrolytic-Cleaning电解清洗.Electro-migration电迁移.Electro-phoresis电泳动, 电渗.Electro-tinning镀锡.Electro-Winning电解冶炼.Elongation 延伸性, 延伸率.Embossing凸出性压花.EMF(Electromotive Force)电动势.EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.Emulsion Side药膜面.Encapsulating胶囊.Encroachment沾污,侵犯.End Tap封头.Entek有机护铜处理.Entrapment夹杂物.Entry Material盖板.Epoxy Resin环氧树脂.Etch Factor蚀刻因子.Etchant蚀刻剂(液).Etchback回蚀.Etching Indicator蚀刻指针.Etching Resist蚀刻阻剂.Eutetic Composition共融组成.Exotherm放热(曲线).Exposure曝光.Eyelet铆眼.*****F*****Fabric纲布.Face Bonding反面朝下结合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.Farady法拉第.Fatigue Strength抗疲劳强度.Fault缺陷.Fault Plane断层面.Feed Through Hole导通孔.Feeder 进料器.Fiber Exposure玻纤显露.Fiducial Mark基准记号.Filament纤丝.Fill纬向.Filler填充料.Fillet内圆填角.Film底片.Film Adhesive接着膜,粘合膜.Filter过滤器.Fine Line细线.Fine Pitch密脚距,密线距,密垫距.Fineness粒度, 纯度.Finger手指.Finishing终修(饰).Finite Element Method有限要素分析法. First Article首产品.First Pass-Yield初检良品率.Fixture夹具.Flair刃角变形.Flame Point自燃点.Flame Resistant耐燃性.Flammability Rate燃性等级.Flare扇形崩口.Flash Plating闪镀.Flashover闪络.Flat Cable扁平排线.Flat Pack扁平封装(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)软板.Flexural Failure挠曲损坏.Flexural Module弯曲模数, 抗挠性模数 . Flexural Strength抗挠强度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨冲程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence荧光.Flurocarbon Resin碳氟树脂.Flush Conductor嵌入式线路, 贴平式导体. Flush Point闪火点.Flute退屑槽.Flux助焊剂.Foil Burr铜箔毛边.Foil Lamination铜箔压板法.Foot残足(干膜残余物).Foot Print (Land Pattern)脚垫.Foreign Material 外来物,异物.Form-to-List布线说明清单.Four Point Twisting四点扭曲法.Free Radical自由基.Freeboard干舷.Frequency频率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔锡层.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由连续玻纤所织成的玻纤布与环氧树脂粘结剂所复合成的材料.Gage, Gauge量规.Gallium Arsenide (GaAs)砷化镓.Galvanic Corrosion贾凡尼式腐蚀(电解式腐蚀).Galvanic Series贾凡尼次序(电动次序).Galvanizing镀锌.GAP第一面分离,长刃断开.Gate Array闸列,闸极数组.Gel Time胶化时间.Gelation Particle胶凝点.Gerber Data ,Gerber File格博档案(是美商Gerber公司专为PCB面线路图形与孔位,所发展一系列完整的软件档案).Ghost Image阴影.Gilding镀金(现为:Glod Plating).Glass Fiber玻纤.Glass Fiber Protrusion/Gouging, Groove玻纤突出/挖破.Glass Transition Temperature, Tg玻璃态转化温度.Glaze釉面,釉料.Glob Top圆顶封装体.Glouble Test球状测试法.Glycol (Ethylene Glycol)乙二醇.Golden Board测试用标准板.Grain Size结晶粒度.Grass Leak 大漏.Grid标准格.Ground Plane /Earth Plane接地层.Ground Plane Clearance接地空环.Guide Pin导针.Gull /Wing Lead鸥翼引脚.*****H*****Halation环晕.Half Angle半角.Halide卤化物.Haloing白圈,白边.Halon海龙,是CFC"氟碳化物"的一种商品名.Hard Anodizing硬阳极化.Hard Chrome Plating镀硬铬.Hard Soldering硬焊.Hardener (Curing Agent)硬化剂(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness电缆组合.Hay Wire跳线.Heat Cleaning烧洁.Heat Dissipation散热.Heat Distortion Point (Temp)热变形点(温度).Heat Sealing热封.Heat Sink Plane散热层.Heat Transfer Paste导热膏.Heatsink Tool散热工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空气尘粒过泸机. Hipot Test 高压电测.Hi-Rel高度靠度.Hit 击(钻孔时钻针每一次"刺下"的动作).Holding Time停置时间.Hole Breakout孔位破出.Hole Counter数孔机.Hole Density孔数密度.Hole Preparation通孔准备.Hole Pull Strength孔壁强度.Hole Void破洞.Hook 切削刀缘外凸.Hot Air Levelling喷锡.Hot Bar Soldering热把焊接.Hot Gas Soldering热风手焊.HTE(High Temperature Elongation)高温延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成电路.Hydraulic Bulge Test液压鼓起试验.Hydrogen Embrittlement氢脆.Hydrogen Overvoltage氢过(超)电压.Hydrolysis水解.Hydrophilic亲水性.Hygroscopic吸湿性.Hypersorption超吸咐.*****I*****I.C. Socket绩体电路器插座.Icicle锡尖.Illuminance照度.Image Transfer影像转移.Immersion Plating浸镀.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing组装板电测.Inclusion异物,夹杂物.Indexing Hole基准孔.Inductance(L)电感.Infrared(IR)红外线.Input/Output输入/输出.Insert, Insertion插接.Inspection Overlay套检底片.Insulation Resistance绝缘电阻.Integrated Circuit(IC)绩体电路器.Inter Face接口.Interconnection互连.Intermetallic Compound (IMC)接口共化物.Internal Stress内应力.Interposer互边导电物.Interstitial Via-Hole(IVH)局部层间导通孔.Invar殷钢(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness离子清洁度.Ion Exchange Resins离子交换树脂.Ion Migration离子迁移.Ionizable (Ionic) Contaimination离子性污染.Ionization游离,电离.Ionization Voltage (Corona Level)电离化电压(电缆内部狭缝空气中,引起其电离所施加之最小电压).IPC美国印刷电路板协会.Isolation隔离性,隔绝性.*****J*****JEDEC(Joint Electronic Device 联合电子组件工程委员会.Engineering Council)J-LeadJ型接脚.Job Shop专业工厂.Joule焦耳.Jumper Wire跳线.Junction接(合)面,接头.Just-In-Time(JIT)适时供应,及时出现.*****K*****Kapton聚亚醯胺软板.Karat克拉(1克拉(钻石)=0.2g 纯金则24k金为100%的钝金.Kauri-Butanol Value考立丁醇值(简称K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纤维.Key电键Key Board键盘.Kiss Pressure吻压, 低压.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好芯片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮纸.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片状结构.Laminate Void板材空洞.Laminate(s)基板.Lamination Void压合空洞.Laminator压膜机.Land孔环焊垫,表面焊垫.Landless Hole无环通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光机. Laser Soldering雷射焊接法.Lay Back 刃角磨损.Lay Out布线,布局.Lay Up 叠合.Layer to Layer Spacing层间距离Leaching焊散漂出,熔出.Lead 引脚.Lead Frame脚架.Lead Pitch脚距.Leakage Current漏电电流.Legend文字标记.Leveling整平.Lifted Land孔环(焊垫)浮起.Ligand错离子附属体.Light Emitting Diodes (LED)发光二极管.Light Integrator光能累积器.Light Intensity光强度.Limiting Current Density极限电流密度.Liquid Crystal Display (LCD)液晶显示器.Liquid Dielectrics液态介质.Liquid Photoimagible Solder Mask, (LPSM)液态感光防焊绿漆. Local Area Network区域性网络.Logic 逻辑.Logic Circuit 逻辑电路.Loss Factor损失因素.Loss Tangent (TanδDK)损失正切.Lot Size批量.Luminance发光强度.Lyophilic亲水性胶体.*****M*****Macro-Throwing Power巨观分布力.Major Defect主要(严重)缺点.Major Weave Direction主要织向.Margin刃带(钻头尖部).Marking标记.Mask阻剂.Mass Finishing大量整面(拋光).Mass Lamination大型压板.Mass Transport质量输送.Master Drawing主图.Mat席(用于CEM-3(Composite Epoxy Material)的复合材料.)Matte Side毛面(电镀铜皮(ED Foil)之粗糙面).Mealing泡点.Mean Time To Failure (MTTF)故障前可用之平均时数. Measling白点.Mechanical Stretcher机械式张网机.Mechanical Warp机械式缠绕.Mechanism机理.Membrane Switch薄膜开关.Meniscograph Test弧面状沾锡试验.Meniscus弯月面.Mercury Vaper Lamp汞气灯.Mesh Count纲目数.Metal Halide Lamp 金属卤素灯.Metallization金属化.Metallized Fabric金属化纲布.Micelle微胞.Micro Wire Board微封线板.Micro-electronios微电子.Microetching微蚀.Microsectioning微切片法.Microstrip 微条.Microstrip Line微条线,微带线.Microthrowing Power微分布力.Microwave微波.Migration迁移.Migration Rate迁移率.Mil英丝.Minimum Annular Ring孔环下限.Minimum Electrical Spacing电性间距下限.Minor Weave Direction次要织向.Misregistration 对不准度.Mixed Componmt Mounting Technology混合零件之组装技术. Modem调变及解调器.Modification修改.Module模块.Modulus of Elasticity弹性系数.Moisture and Insulation Resistance Test湿气与绝缘电阻试验. Mold Release 脱模剂,离型剂.Mole摩尔.Monofilament单丝.Mother Board主机板,母板.Moulded Circuit模造立体电路机.Mounting Hole安装孔.Mounting Hole组装孔,机装孔.Mouse Bite鼠齿(蚀刻后线路边缘出现不规则缺口).Multi-Chip-Module(MCM)多芯片芯片模块.Multiwiring Board (or Discrete Wiring Board)复线板.。