Ultrasonic pretreatment of sludge A review

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污水处理的英文文献翻译(1)

污水处理的英文文献翻译(1)

Nutrient removal in an A2O-MBR reactor with sludgereductionABSTRACTIn the present study, an advanced sewage treatment process has been developed by incorporating excess sludge reduction and phosphorous recovery in an A2O-MBR process. The A2O-MBR reactor was operated at a flux of 77 LMH over a period of 270 days. The designed flux was increased stepwise over a period of two weeks. The reactor was operated at two different MLSS range. Thermo chemical digestion of sludge was carried out at a fixed pH (11)and temperature (75℃) for 25% COD solubilisation. The released pbospborous was recovered by precipitation process and the organics was sent back to anoxic tank. The sludge digestion did not have any impact on COD and TP removal efficiency of the reactor. During the 270 days of reactor operation, the MBR maintained relatively constant transmembrane pressure. The results based on the study indicated that the proposed process configuration has potential to reduce the excess sludge production as well as it didn't detonated the treated water quality.Keywords: A2O reactor; MBR; Nutrient removal; TMP1. IntroductionExcess sludge reduction and nutrients removal are the two important problems associated with wastewater treatment plant. MBR process has been known as a process with relatively high decay rate and less sludge production due to much longer sludge age in the reactor (Wenet al., 2004). Sludge production in MBR is reduced by 28-68%, depending on the sludge age used (Xia et al.,2008). However, minimizing the sludge production by increasing sludge age is limited due to the potential adverse effect of high MLSS concentrations on membrane (Yoon et al., 2004). This problem can be solved by introducing sludge disintegration technique in MBR (Young et al., 2007). Sludge disintegration techniques have been reported to enhance the biodegradability of excess sludge (Vlyssides and Karlis, 2004). In overall, the basis for sludge reduction processes is effective combination of the methods for sludge disintegration and biodegradation of treated sludge. Advances in sludge disintegration techniques offer a few promising options including ultrasound (Guo et al., 2008), pulse power (Choi et al.,2006), ozone (Weemaes et al., 2000), thermal (Kim et al., 2003), alkaline (Li et al., 2008) acid (Kim et al., 2003) and thermo chemical(Vlyssides and Karlis, 2004). Among the various disintegration techniques, thermo chemical was reported to be simple and cost effective (Weemaes and Verstraete, 1998). In thermal-chemical hydrolysis, alkali sodium hydroxide was found to be the most effective agent in inducing cell lysis (Rocker et al., 1999). Conventionally, the nutrient removal was carried out in an A2O process. It has advantage of achieving, nutrient removal along with organic compound oxidation in a single sludge configuration using linked reactors in series (Tchobanoglous et al., 2003). The phosphoroes removal happens by subjecting phosphorous accumulating organisms (PAO) bacteria under aerobic and anaerobic conditions (Akin and Ugurlu, 2004). These operating procedures enhance predominance PAO, which are able to uptake phosphorous in excess. During the sludge pretreatment processes the bound phosphorous was solubilised and it increases the phosphorousconcentration in the effluent stream (Nishimura, 2001).So, it is necessary to remove the solubilised phosphorus before it enters into main stream. Besides, there is a growing demand for the sustainable phosphorous resources in the industrialized world. In many developed countries, researches are currently underway to recover the phosphoroes bound in the sludge's of enhanced biological phosphorus removal system (EBPR). The released phosphorous can be recovered in usable products using calcium salts precipitation method. Keeping this fact in mind, in the present study, a new advanced wastewater treatment process is developed by integrating three processes, which are: (a) thermo chemical pretreatment in MBR for excess sludge reduction (b) A2O process for biological nutrient removal (c) P recovery through calcium salt precipitation. The experimental data obtained were then used to evaluate the performance of this integrated system.2. Methods2.1. WastewaterThe synthetic domestic wastewater was used as the experimental influent. It was basically composed of a mixed carbon source, macro nutrients (N and P), an alkalinity control (NaHCO3) and a microelement solution. The composition contained (/L) 210 mg glucose, 200 mg NH4C1, 220 mg NaHCO3, 22一34 mg KH2PO4, microelement solution (0.19 mg MnCl2 4H20, 0.0018 mg ZnCl22H2O,0.022 mg CuCl22H2O, 5.6 mg MgSO47H2O, 0.88 mg FeCl36H2O,1.3 mg CaCl2·2H2O). The synthetic wastewater was prepared three times a week with concentrations of 210±1.5 mg/L chemical oxygen demand (COD), 40±1 mg/L total nitrogen (TN) and 5.5 mg/L total phosphorus (TP).2.2. A2O-MBRThe working volume of the A2O-MBR was 83.4 L. A baffle was placed inside the reactor to divide it into anaerobic (8.4 L) anoxic (25 L) and aerobic basin (50 L). The synthetic wastewater was feed into the reactor at a flow rate of 8.4 L/h (Q) using a feed pump. A liquid level sensor, planted in aerobic basin of A2O-MBR controlled the flow of influent. The HRT of anaerobic, anoxic and aerobic basins were 1, 3 and 6 h, respectively. In order to facilitate nutrient removal, the reactor was provided with two internal recycle (1R). IRl (Q= 1)connects anoxic and anaerobic and IR 2 (Q=3) was between aerobic and anoxic. Anaerobic and anoxic basins were provided with low speed mixer to keep the mixed liquid suspended solids (MLSS) in suspension. In the aerobic zone, diffusers were used to generate air bubbles for oxidation of organics and ammonia. Dissolved oxygen (DO) concentration in the aerobic basin was maintained at 3.5 mg/1 and was monitored continuously through online DO meter. The solid liquid separation happens inaerobic basin with the help of five flat sheet membranes having a pore size of 0.23 pm. The area of each membrane was 0.1 m2. They were connected together by a common tube. A peristaltic pumpwas connected in the common tube to generate suction pressure. In the common tube provision was made to accommodate pressure gauge to measure transmembrane pressure (TMP) during suction. The suction pump was operated in sequence of timing, which consists of 10 min switch on, and 2 min switch off.2.3. Thermo chemical digestion of sludgeMixed liquor from aerobic basin of MBR was withdrawn at the ratio of 1.5% of Q/day and subjected to thermo chemical digestion. Thermo chemical digestion was carried out at a fixed pH of 11(NaOH) and temperature of 75℃for 3 h. After thermo chemical digestion the supernatant and sludge were separated. The thermo-chemicallydigested sludge was amenable to further anaerobic bio-degradation (Vlyssides and Karlis, 2004), so it was sent to theanaerobic basin of the MBR2.4. Phosphorus recoveryLime was used as a precipitant to recover the phosphorous in the supernatant. After the recovery of precipitant the content was sent back to anoxic tank as a carbon source and alkalinity supelement for denitrification.2.5. Chemical analysisCOD, MLSS, TP, TN of the raw and treated wastewater were analyzed following methods detailed in (APHA, 2003). The influent and effluent ammonia concentration was measured using an ion-selective electrode (Thereto Orion, Model: 95一12). Nitrate in the sample was analyzed using cadmium reduction method (APHA, 2003).3. Results and discussionFig. 1 presents data of MLSS and yield observed during the operational period of the reactor. One of the advantages of MBR reactor was it can be operated in high MLSS concentration. The reactor was seeded with EBPR sludge from the Kiheung, sewage treatment plant, Korea. The reactor was startup with the MLSS concentration of 5700 mg/L. It starts to increase steadily with increase in period of reactor operation and reached a value of 8100 mg/L on day 38. From then onwards, MLSS concentration was maintained in the range of 7500 mg/L by withdrawing excess sludge produced and called run I. The observed yields (Yobs) for experiments without sludge digestion (run I) and with sludge digestion were calculated and given in Fig. 1. The Yobs for run I was found to be 0.12 gMLSS/g COD. It was comparatively lower than a value of 0.4 gMLSS/g CODreported for the conventional activated sludge processes (Tchoba-noglous et al., 2003). The difference in observed yield of these two systems is attributed to their working MLSS concentration. At high MLSS concentration the yield observed was found to be low (Visva-nathan et al., 2000). As a result of that MBR generated less sludge.The presently used MLSS ranges (7.5一10.5 g/L) are selected on the basis of the recommendation by Rosenberger et al. (2002). In their study, they reported that the general trend of MLSS increase on fouling in municipal applications seems to result in no impact at medium MLSS concentrations (7一12 g/L).It is evident from the data that the COD removal efficiency of A2O system remains unaffected before and after the introduction of sludge digestion practices. A test analysis showed that the differences between the period without sludge digestion (run I) and with sludge digestion (run II and III) are not statistically significant.However, it has been reported that, in wastewater treatment processes including disintegration-induced sludge degradation, the effluent water quality is slightly detonated due to the release of nondegradable substances such as soluble microbial products (Ya-sui and Shibata, 1994; Salcai et al., 1997; Yoon et al., 2004). During the study period, COD concentration in the aerobic basin of MBR was in the range of 18-38 mg/L and corresponding organic concentration in the effluent was varied from 4 to 12 mg/L. From this data it can be concluded that the membrane separation played an important role in providing the excellent and stable effluent quality.Phosphorus is the primary nutrient responsible for algal bloom and it is necessary to reduce the concentration of phosphorus in treated wastewater to prevent the algal bloom. Fortunately its growth can be inhibited at the levels of TP well below 1 mg/L (Mer-vat and Logan, 1996).Fig. 2 depicts TP removal efficiency of the A2O-MBR system during the period of study. It is clearly evident from the figure that the TP removal efficiency of A/O system was remains unaffected after the introduction of sludge reduction. In the present study, the solubilised phosphorous was recovered in the form of calcium phosphate before it enters into main stream. So, the possibility of phosphorus increase in the effluent due to sludge reduction practices has been eliminated. The influent TP concentration was in the range of 5.5 mg/L. During thefirst four weeks of operation the TP removal efficiency of the system was not efficient as the TP concentration in the effluent exceeds over 2.5 mg/L. The lower TP removal efficiency during the initial period was due to the slow growing nature of PAO organisms and other operational factors such as anaerobic condition and internal recycling. After the initial period, the TP removal efficiency in the effluent starts to increase with increase in period of operation. TP removal in A2O process is mainly through PAO organisms. These organisms are slow growing in nature and susceptible to various physicochemical factors (Carlos et al., 2008). During the study period TP removal efficiency of the system remains unaffected and was in the range of 74-82%.。

锅炉水处理

锅炉水处理

锅炉水处理1.锅炉水处理分为三个步骤:1) 原水(raw water)处理——将大部分不纯物除去2) 炉前(preboiler)处理,外处理(external)或预处理(pretreatment)——将少量的残余不纯物加以处理3) 内(internal)处理——在锅炉本体内直接处理炉水2.天然水中不纯物包括:1) 溶解固体(碳酸盐,氯化物,钙盐)2) 悬浮物(砂,泥渣等)3) 气体(氧,二氧化碳等)3.水处理的目的在于防止:1) 泥渣和结垢沉积(多为钙和镁的盐类)2) 腐蚀和点蚀(溶解气体和酸)3) 脆化(embrittlement)(高碱度的存在)4) 挟带(carryover)(起泡)一、水处理的目的锅炉用水处理有四个目的:1.防止结垢和泥渣堆积1) 硬度:溶解的钙和镁的盐类称为硬度。

当水蒸发产生蒸汽时硬度在管子表面沉积。

此因钙和镁化合物在水中的溶解度比较低而容易沉淀出来,此结垢物降低热传导且引起管子金属过热。

天然水的硬度有几ppm到超过500ppm的差异,高压锅炉只能容许0~2ppm。

可使用沸石和/或藉化学方法除去硬度。

2) 硫酸盐和硅:硫酸盐和硅酸盐常在锅炉金属上沉淀而不形成泥渣,较难防止沉淀。

3) 铁和钠:溶解或悬浮的铁也会沉积在金属表面。

由于钠化合物的溶解度很高,通常只在水近乎蒸干时才会沉积。

A鉴别锅炉沉积物1) 碳酸盐——溶解的钙和镁的碳酸氢盐在锅炉内的高热下分解,放出二氧化碳并形成不溶解的碳酸盐。

当酸溶液滴在碳酸盐沉积物上时,会产生二氧化碳气泡。

2) 硫酸盐——硫酸盐坚硬许多,质脆,酸不会使之冒泡。

3) 硅——此为一种非常坚硬的沉积物,质地很脆,和瓷器相似,不溶解于盐酸。

4) 铁——此为深色,通常具有磁性,且溶于热酸。

5) 磷酸盐——此为容易去除的泥渣,是磷酸盐水处理的结果,通常为松软、褐色或灰色的沉积物。

B沉积物和泥渣产生的问题:沉积物和泥渣会引起堵塞或部分管子闭塞,导致管子过热和破损。

流程中金属离子除去方法总结

流程中金属离子除去方法总结

流程中金属离子除去方法总结Metal ion removal is an important process in various industries, including wastewater treatment, mining, and metal finishing. There are several methods for removing metal ions from solution, including chemical precipitation, ion exchange, membrane filtration, and adsorption. Each method has its own advantages and disadvantages, and the choice of method depends on the specific requirements of the application.金属离子的去除是各种行业中的重要过程,包括废水处理、矿业和金属精加工。

存在几种方法可以从溶液中去除金属离子,包括化学沉淀、离子交换、膜过滤和吸附。

每种方法都有其优缺点,方法的选择取决于具体应用的要求。

Chemical precipitation is a commonly used method for metal ion removal, in which a chemical reagent is added to the solution toform an insoluble precipitate with the metal ion. This method is effective for removing a wide range of metal ions, but it can be expensive and produce a large amount of sludge, which requires proper disposal. Additionally, the pH of the solution needs to be carefully controlled to ensure the formation of a precipitate.化学沉淀是一种常用的去除金属离子的方法,其中向溶液中加入化学试剂,与金属离子形成不溶沉淀。

《水泥窑协同处置污泥工程设计规范》(征求意见稿)

《水泥窑协同处置污泥工程设计规范》(征求意见稿)

UDCP GB 50XXX—20XX 中华人民共和国国家标准水泥窑协同处置污泥工程设计规范Code for design of sludge composition in cement kiln(征求意见稿)(本稿完成日期:2011年03月)20××-××-××发布20××-××-××实施中华人民共和国住房和城乡建设部中华人民共和国国家质量监督检验检疫总局联合发布前言本规范是根据住房和城乡建设部《关于印发<2010年工程建设标准规范制订、修订计划>的通知》(建标[2010]43号)的要求,由天津水泥工业设计研究院有限公司会同有关单位共同编制完成的。

本规范共分10章,主要内容包括:总则,术语,设计原则,总体设计,污泥接收和分析鉴别,预处理系统,焚烧处置系统,烟气净化系统,污水处理系统,环境保护与职业安全卫生。

本规范中以黑体字标志的条文为强制性条文,必须严格执行。

本规范由住房和城乡建设部负责管理和对强制性条文的解释,国家建筑材料工业标准定额总站负责日常管理,天津水泥工业设计研究院有限公司负责技术内容的解释。

各有关单位在执行本规范过程中,请结合工程实际情况,注意积累资料、总结经验,如发现需要修改和补充之处,请将意见和有关资料寄至天津水泥工业设计研究院有限公司(地址:天津市北辰区引河里北道1号,邮编:300400),以供今后修订时参考。

本规范主编单位、参编单位、主要起草人和主要审查人:主编单位:天津水泥工业设计研究院有限公司参编单位:中国中材国际工程股份有限公司参加单位:广州市越堡水泥有限公司北京金隅集团上海建筑材料集团水泥有限公司河南同力水泥有限公司拉法基瑞安水泥有限公司主要起草人:宋寿顺隋明洁胡芝娟李惠吴涛…主要审查人:目次1 总则 (1)2 术语 (2)3 设计原则 (3)4 总体设计 (4)4.1 规模划分 (4)4.2 厂址选择 (4)4.3 总图设计 (4)4.4 厂区道路 (4)5 污泥接收和分析鉴别 (5)5.1 一般要求 (5)5.2 污泥运输与接收 (5)5.3 污泥分析鉴别 (5)6 预处理系统 (7)6.1 一般要求 (7)6.2 污泥储存及输送 (7)6.3 直接入窑系统 (7)6.4 干化脱水系统 (7)6.5 热能利用系统 (8)7 焚烧处置系统 (9)7.1 一般要求 (9)7.2 进料系统 (9)8 烟气净化系统 (10)8.1 一般要求 (10)8.2 除尘 (10)8.3 恶臭污染物的去除 (10)9 污水处理系统 (11)10 环境保护与职业安全卫生 (12)本规范用词说明 (13)引用标准名录 (14)附:条文说明 (15)CONTENTS1 General provisions (1)2 Terms (2)3 Design principles (3)4 Overall design (4)4.1 Division of the scale (4)4.2 Site selection (4)4.3 Design of general layout in the site (4)4.4 Design requirements of road in the site (4)5 Reception,analyze & identification of the Sludge (5)5.1 General requirement (5)5.2 Reception and transportation of the sludge (5)5.3 Identification of the sludge (5)6 Pretreatment of the sludge (7)6.1 General requirement (7)6.2 Storage and convey of the ssludge (7)6.3 Directly-enter-into-kiln system (7)6.4 Drying and dehydration system (7)6.5 Heat energy system (8)7 Incinerator of the sludge (9)7.1 General requirement (9)7.2 Feeding system (9)8 Flue gas cleaning system (10)8.1 General requirement (10)8.2 dust abatement (10)8.3 removal of odor pollutants (10)9 Sewage disposal system (11)10 Environmental protection and occupational safety & health (12)Explanation of wording in this code (13)List of quoted standards (14)Addition: Explanation of provisions (15)1 总则1.0.1为规范水泥窑协同处置污泥的设计标准,使水泥窑协同处置污泥工程实现减量化、无害化和资源化目标,制定本设计规范。

超声萃取—气相色谱法测定活性污泥中的苯系物

超声萃取—气相色谱法测定活性污泥中的苯系物

超声萃取一气相色谱法测定活性污泥中的苯系物钱赘峰姚文冲刘攀(杭州造品科技有限公司,浙江杭州310018)摘要:介绍了活性污泥中苯系物的分析检测方法,利用超声提取技术提取污泥中的苯系物,对活性污泥进行测定。

在萃取剂二氯甲烷:丙酮二1:1条件下,萃取工艺为萃取温度35七、萃取时间15min.超声频率100kHz、超声功率200W时,经过无水硫酸钠净化柱净化,经旋转蒸发浓缩至一定体积后,再用氧化铝(中性)柱净化,在室温下用氮吹仪浓缩后,取1.0jxL注入气相色谱中,用气相色谱进行检测。

测得活性污泥中苯系物苯、甲苯、乙基苯、间二甲苯的含量分别为8.65,404.08,84.77, 70.58mg/Lo此方法的检出限均在0.01-0.2憾/kg,定量限6.0-10.0ag/kg,对苯系物的检测回收率在85%〜100%。

该方法操作简便,分离效果好,灵敏度高,有利于监测污泥中的苯系物。

关键词:超声提取技术;苯系物;GC;活性污泥Abstract:This paper introduces the analysis and detection method of benzene series in activated sludge,using ul­trasonic extraction technology to extract the benzene series in sludge,and to determine the active sludge.Under the condition of dichloromethane:acetone=1*,the extraction temperature is35°C,the extraction time is15min, the ultrasonic frequency is100kHz,and the ultrasonic power is200W.After the purification of anhydrous sodi­um sulfate purification column,the concentration is carried out by rotary evaporation to a certain volume,then the purification is carried out by alumina(neutral)column,and then the concentration is carried out by nitrogen blower at room temperature.Then 1.0|ju L is taken and injected into gas chromatography,the test was performed by HPLC.The contents of benzene series(benzene,toluene,ethylbenzene,m-xylene)in activated sludge were 8.65,404.08,84.77,70.58mg/L,respectively.The detection limit of this method is0.01~0.2jxg/kg,and the quantitative limit is6.0~10.0|xg/kg.The recovery of benzene series was85%〜100%.This method is easy to oper­ate,has good separation effect and high sensitivity7and is conducive to the monitoring of benzene series in sludge.Key words:ultrasonic extraction technology;benzene series;GC;activated sludge中图分类号:X715文献标识码:A文章编号:1674-1021(2020)02-0071-041引言随着我国城市化的发展,城市污水处理量逐年提高,污水厂规模不断增加,由于污水厂的工艺大部分都会采用活性污泥法,如此导致二次污染物污泥也急剧增加,成为环境污染的一个重要来源。

pcb中英文术语对照

pcb中英文术语对照

pcb中英文术语对照A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查Void 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率电路板门户网,商机无限,资讯最新,问答圈子,社区平台 jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:32:00第3楼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具) flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金)immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位) kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)线路板流程术语中英文对照流程简介:开料--钻孔--干膜制程--压合--减铜--电镀--塞孔--防焊(绿漆/绿油)--镀金--喷锡--成型--开短路测试--终检--雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )专业线路板厂CAM及MI工程师培训,热线报名:05廖小姐jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:35:00第5楼PCB综合词汇中英文对照:1、印制电路:printed circuit2、印制线路:printed wiring3、印制板:printed board4、印制板电路:printed circuit board (pcb)5、印制线路板:printed wiring board(pwb)6、印制元件:printed component7、印制接点:printed contact8、印制板装配:printed board assembly9、板:board10、单面印制板:single-sided printed board(ssb)11、双面印制板:double-sided printed board(dsb)12、多层印制板:mulitlayer printed board(mlb)13、多层印制电路板:mulitlayer printed circuit board14、多层印制线路板:mulitlayer prited wiring board15、刚性印制板:rigid printed board16、刚性单面印制板:rigid single-sided printed borad17、刚性双面印制板:rigid double-sided printed borad18、刚性多层印制板:rigid multilayer printed board19、挠性多层印制板:flexible multilayer printed board20、挠性印制板:flexible printed board21、挠性单面印制板:flexible single-sided printed board22、挠性双面印制板:flexible double-sided printed board23、挠性印制电路:flexible printed circuit (fpc)24、挠性印制线路:flexible printed wiring25、刚性印制板:flex-rigid printed board, rigid-flex printed board26、刚性双面印制板:flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板:flex-rigid multilayer printed board, rigid-flex multilayer print ed board28、齐平印制板:flush printed board29、金属芯印制板:metal core printed board30、金属基印制板:metal base printed board31、多重布线印制板:mulit-wiring printed board32、瓷印制板:ceramic substrate printed board33、导电胶印制板:electroconductive paste printed board34、模塑电路板:molded circuit board35、模压印制板:stamped printed wiring board36、顺序层压多层印制板:sequentially-laminated mulitlayer37、散线印制板:discrete wiring board38、微线印制板:micro wire board39、积层印制板:buile-up printed board40、积层多层印制板:build-up mulitlayer printed board (bum)41、积层挠印制板:build-up flexible printed board42、表面层合电路板:surface laminar circuit (slc)43、埋入凸块连印制板:b2it printed board44、多层膜基板:multi-layered film substrate(mfs)45、层间全导通多层印制板:alivh multilayer printed board46、载芯片板:chip on board (cob)47、埋电阻板:buried resistance board48、母板:mother board49、子板:daughter board50、背板:backplane51、裸板:bare board52、键盘板夹心板:copper-invar-copper board53、动态挠性板:dynamic flex board54、静态挠性板:static flex board55、可断拼板:break-away planel56、电缆:cable57、挠性扁平电缆:flexible flat cable (ffc)58、薄膜开关:membrane switch59、混合电路:hybrid circuit60、厚膜:thick film61、厚膜电路:thick film circuit62、薄膜:thin film63、薄膜混合电路:thin film hybrid circuit64、互连:interconnection65、导线:conductor trace line66、齐平导线:flush conductor67、传输线:transmission line68、跨交:crossover69、板边插头:edge-board contact70、增强板:stiffener71、基底:substrate72、基板面:real estate73、导线面:conductor side74、元件面:component side75、焊接面:solder side76、印制:printing77、网格:grid78、图形:pattern79、导电图形:conductive pattern80、非导电图形:non-conductive pattern81、字符:legend82、标志:mark中国新柳电子开发专业PCB线路设计:02(设计基地)() Email: jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:35:00第6楼1、基材:base material2、层压板:laminate3、覆金属箔基材:metal-clad bade material4、覆铜箔层压板:copper-clad laminate (ccl)5、单面覆铜箔层压板:single-sided copper-clad laminate6、双面覆铜箔层压板:double-sided copper-clad laminate7、复合层压板:composite laminate8、薄层压板:thin laminate9、金属芯覆铜箔层压板:metal core copper-clad laminate10、金属基覆铜层压板:metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film12、基体材料:basis material13、预浸材料:prepreg14、粘结片:bonding sheet15、预浸粘结片:preimpregnated bonding sheer16、环氧玻璃基板:epoxy glass substrate17、加成法用层压板:laminate for additive process18、预制层覆箔板:mass lamination panel19、层芯板:core material20、催化板材:catalyzed board ,coated catalyzed laminate21、涂胶催化层压板:adhesive-coated catalyzed laminate22、涂胶无催层压板:adhesive-coated uncatalyzed laminate23、粘结层:bonding layer24、粘结膜:film adhesive25、涂胶粘剂绝缘薄膜:adhesive coated dielectric film26、无支撑胶粘剂膜:unsupported adhesive film27、覆盖层:cover layer (cover lay)28、增强板材:stiffener material29、铜箔面:copper-clad surface30、去铜箔面:foil removal surface31、层压板面:unclad laminate surface32、基膜面:base film surface33、胶粘剂面:adhesive faec34、原始光洁面:plate finish35、粗面:matt finish36、纵向:length wise direction37、模向:cross wise direction38、剪切板:cut to size panel39、酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/pa per ccl)40、环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/pape r ccl)41、环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates49、超薄型层压板:ultra thin laminate50、瓷基覆铜箔板:ceramics base copper-clad laminates51、紫外专业线路板厂CAM及MI工程师培训,热线报名:05廖小姐jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:36:00第7楼PCB原材料化学用语中英文对照:1、a阶树脂:a-stage resin2、b阶树脂:b-stage resin3、c阶树脂:c-stage resin4、环氧树脂:epoxy resin5、酚醛树脂:phenolic resin6、聚酯树脂:polyester resin7、聚酰亚胺树脂:polyimide resin8、双马来酰亚胺三嗪树脂:bismaleimide-triazine resin9、丙烯酸树脂:acrylic resin10、三聚氰胺甲醛树脂:melamine formaldehyde resin11、多官能环氧树脂:polyfunctional epoxy resin12、溴化环氧树脂:brominated epoxy resin13、环氧酚醛:epoxy novolac14、氟树脂:fluroresin15、硅树脂:silicone resin16、硅烷:silane17、聚合物:polymer18、无定形聚合物:amorphous polymer19、结晶现象:crystalline polamer20、双晶现象:dimorphism21、共聚物:copolymer22、合成树脂:synthetic23、热固性树脂:thermosetting resin24、热塑性树脂:thermoplastic resin25、感光性树脂:photosensitive resin26、环氧当量:weight per epoxy equivalent (wpe)27、环氧值:epoxy value28、双氰胺:dicyandiamide29、粘结剂:binder30、胶粘剂:adesive31、固化剂:curing agent32、阻燃剂:flame retardant33、遮光剂:opaquer34、增塑剂:plasticizers35、不饱和聚酯:unsatuiated polyester36、聚酯薄膜:polyester37、聚酰亚胺薄膜:polyimide film (pi)38、聚四氟乙烯:polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜:perfluorinated ethylene-propylene copolymer film (fep)40、增强材料:reinforcing material41、玻璃纤维:glass fiber42、e玻璃纤维:e-glass fibre43、d玻璃纤维:d-glass fibre44、s玻璃纤维:s-glass fibre45、玻璃布:glass fabric46、非织布:non-woven fabric47、玻璃纤维垫:glass mats48、纱线:yarn49、单丝:filament50、绞股:strand51、纬纱:weft yarn52、经纱:warp yarn53、但尼尔:denier54、经向:warp-wise55、纬向:weft-wise, filling-wise56、织物经纬密度:thread count57、织物组织:weave structure58、平纹组织:plain structure59、坏布:grey fabric60、稀松织物:woven scrim61、弓纬:bow of weave62、断经:end missing63、缺纬:mis-picks64、纬斜:bias65、折痕:crease66、云织:waviness67、鱼眼:fish eye68、毛圈长:feather length69、厚薄段:mark70、裂缝:split71、捻度:twist of yarn72、浸润剂含量:size content73、浸润剂残留量:size residue74、处理剂含量:finish level75、浸润剂:size76、偶联剂:couplint agent77、处理织物:finished fabric78、聚酰胺纤维:polyarmide fiber79、聚酯纤维非织布:non-woven polyester fabric80、浸渍绝缘纵纸:impregnating insulation paper81、聚芳酰胺纤维纸:aromatic polyamide paper82、断裂长:breaking length83、吸水高度:height of capillary rise84、湿强度保留率:wet strength retention85、白度:whitenness86、瓷:ceramics87、导电箔:conductive foil88、铜箔:copper foil89、电解铜箔:electrodeposited copper foil (ed copper foil)90、压延铜箔:rolled copper foil91、退火铜箔:annealed copper foil92、压延退火铜箔:rolled annealed copper foil (ra copper foil)93、薄铜箔:thin copper foil94、涂胶铜箔:adhesive coated foil95、涂胶脂铜箔:resin coated copper foil (rcc)96、复合金属箔:composite metallic material97、载体箔:carrier foil98、殷瓦:invar99、箔(剖面)轮廓:foil profile100、光面:shiny side101、粗糙面:matte side102、处理面:treated side103、防锈处理:stain proofing104、双面处理铜箔:double treated foil中国PCB人才网,提供最全面的PCB专业人才信息,.pcbjob.jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:36:00第8楼PCB线路设计词汇中英文对照:1、原理图:shematic diagram2、逻辑图:logic diagram3、印制线路布设:printed wire layout4、布设总图:master drawing5、可制造性设计:design-for-manufacturability6、计算机辅助设计:computer-aided design.(cad)7、计算机辅助制造:computer-aided manufacturing.(cam)8、计算机集成制造:computer integrat manufacturing.(cim)9、计算机辅助工程:computer-aided engineering.(cae)10、计算机辅助测试:computer-aided test.(cat)11、电子设计自动化:electric design automation .(eda)12、工程设计自动化:engineering design automaton .(eda2)13、组装设计自动化:assembly aided architectural design. (aaad)14、计算机辅助制图:computer aided drawing15、计算机控制显示:computer controlled display .(ccd)16、布局:placement17、布线:routing18、布图设计:layout19、重布:rerouting20、模拟:simulation21、逻辑模拟:logic simulation22、电路模拟:circit simulation23、时序模拟:timing simulation24、模块化:modularization25、布线完成率:layout effeciency26、机器描述格式:machine descriptionm format .(mdf)27、机器描述格式数据库:mdf databse28、设计数据库:design database29、设计原点:design origin30、优化(设计):optimization (design)31、供设计优化坐标轴:predominant axis32、表格原点:table origin33、镜像:mirroring34、驱动文件:drive file35、中间文件:intermediate file36、制造文件:manufacturing documentation37、队列支撑数据库:queue support database38、元件安置:component positioning39、图形显示:graphics dispaly40、比例因子:scaling factor41、扫描填充:scan filling42、矩形填充:rectangle filling43、填充域:region filling44、实体设计:physical design45、逻辑设计:logic design46、逻辑电路:logic circuit47、层次设计:hierarchical design48、自顶向下设计:top-down design49、自底向上设计:bottom-up design50、线网:net51、数字化:digitzing52、设计规则检查:design rule checking53、走(布)线器:router (cad)54、网络表:net list55、计算机辅助电路分析:computer-aided circuit analysis56、子线网:subnet57、目标函数:objective function58、设计后处理:post design processing (pdp)59、交互式制图设计:interactive drawing design60、费用矩阵:cost metrix61、工程图:engineering drawing62、方块框图:block diagram63、迷宫:moze64、元件密度:component density65、巡回售货员问题:traveling salesman problem66、自由度:degrees freedom67、入度:out going degree68、出度:incoming degree69、曼哈顿距离:manhatton distance70、欧几里德距离:euclidean distance71、网络:network72、阵列:array73、段:segment74、逻辑:logic75、逻辑设计自动化:logic design automation76、分线:separated time77、分层:separated layer78、定顺序:definite sequence中国PCB人才网,提供最全面的PCB专业人才信息,.pcbjob.jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:37:00第9楼PCB线路板其他相关中英文对照:1、主面:primary side2、辅面:secondary side3、支撑面:supporting plane4、信号:signal5、信号导线:signal conductor6、信号地线:signal ground7、信号速率:signal rate8、信号标准化:signal standardization9、信号层:signal layer10、寄生信号:spurious signal11、串扰:crosstalk12、电容:capacitance13、电容耦合:capacitive coupling14、电磁干扰:electromagnetic interference15、电磁屏蔽:electromangetic shielding17、电磁兼容性:electromagnetic compatbility18、特性阻抗:impedance19、阻抗匹配:impedance match20、电感:inductance21、延迟:delay22、微带线:microstrip23、带状线:stripline24、探测点:probe point25、开窗口:cross hatching26、跨距:span27、共面性(度):coplanarity28、埋入电阻:buried resistance29、黄金板:golden board30、芯板:core board31、薄基芯:thin core32、非均衡传输线:unbalanced transmission line33、阀值:threshold34、极限值:threshold limit value(TLV)35、散热层:heat sink plane36、热隔离:heat sink plane37、导通孔堵塞:via filiing39、卡板:card40、卡板盒/卡板柜:card cages/card racks41、薄型多层板:thin type multilayer board42、埋/盲孔多层板:43、模块:module44、单芯片模块:single chip module (SCM)45、多芯片模块:multichip module (MCM)46、多芯片模块层压基板:laminate substrate version of multichip module (MCM-L)47、多芯片模块瓷基数板:ceramic substrate version o fmultichip module (MCM-C)48、多芯片模块薄膜基板:deposition thin film substrate version of multilayer mod ule (MCM-D)49、嵌入凸块互连技术:buried bump interconnection technology (B2 it)50、自动测试技术:automatic test equipment (ATE)51、芯板导通孔堵塞:core board viafilling52、对准标记:alignment mark53、基准标记:fiducial mark54、拐角标记:corner mark55、剪切标记:crop mark56、铣切标记:routing mark57、对位标记:registration mark58、缩减标记:reduvtion mark59、层间重合度:layer to layer registration60、狗骨结构:dog hone61、热设计:thermal design62、热阻:thermal resistance翱世电子科技,为您提供芯片采购、PCB设计、打样贴片一体化服务!jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:38:00第10楼线路板(PCB)常用度量衡单位术语换算1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin(有些公司称微英寸为麦,其实是微英寸)1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重(克/立方厘米)=145/(145-波美度)翱世电子科技,为您提供芯片采购、PCB设计、打样贴片一体化服务!jewwww等级:一级普工文章:46积分:419注册:2006年9月20日发表于2006-9-21 21:38:00第11楼PCB外观及功能性测试相关术语1.综合词汇1.1 as received 验收态提交验收的产品尚未经受任何条件处理,在正常大气条件下机械试验时阿状态1.2 production board 成品板符合设计图纸,有关规和采购要求的,并按一个生产批生产出来的任何一块印制板1.3 test board 测试板用相同工艺生产的,用来确定一批印制板可接受性的一种印制板.它能代表该批印制板的质量1.4 test pattern 测试图形用来完成一种测试用的导电图形.图形可以是生产板上的一部分导电图形或特殊设计的专用测试图形,这种测试图形可以放在附连测试板上液可以放在单独的测试板上(coupon)1.5 composite test pattern 综合测试图形两种或两种以上不同测试图形的结合,通常放在测试板上1.6 quality conformance test circuit 质量一致性检验电路在制板包含的一套完整的测试图形,用来确定在制板上的印制板质量的可接受性1.7 test coupon 附连测试板质量一致性检验电路的一部分图形,用于规定的验收检验或一组相关的试验1.8storage life 储存期2外观和尺寸2.1 visual examination 目检用肉眼或按规定的放大倍数对物理特征进行的检查2.2 blister 起泡基材的层间或基材与导电箔之间,基材与保护性涂层间产生局部膨胀而引起局部分离的现象.它是分层的一种形式2.3 blow hole 气孔由于排气而产生的孔洞2.4 bulge 凸起由于部分层或纤维与树脂分离而造成印制板或覆箔板表面隆起的现象2.5 circumferential separation 环形断裂一种裂缝或空洞.它存在于围绕镀覆孔四周的镀层,或围绕引线的焊点,或围绕空心铆钉的焊点,或在焊点和连接盘的界面处2.6 cracking 裂缝金属或非金属层的一种破损现象,它可能一直延伸到底面.2.7 crazing 微裂纹存在于基材的一种现象,在织物交织处,玻璃纤维与树脂分离的现象.表现为基材表面下出现相连的白色斑点或十字纹,通常与机械应力有关2.8 measling 白斑发生在基材部的,在织物交织处,玻璃纤维与树脂分离的现象,表现位在基材表面下出现分散的白色斑点或十字纹,通常与热应力有关2.9 crazing of conformal coating 敷形涂层微裂纹敷形涂层表面和部呈现的细微网状裂纹2.10 delamination 分层绝缘基材的层间,绝缘基材与导电箔或多层板任何层间分离的现象。

氨氮的测定(英文版)

氨氮的测定(英文版)

Experiment Ⅷthe determination of NH3-NThe purpose and requirements of the experiment1.Master the method determination methods of NH3-N: reagent colorimetricmethod.2.Know preserving method of NH3-N and its necessity.3.Preview where the error of colorimetric method from.4.Know the GB of NH3-N and relative with TN.Experimental program1.Experimental instruments and drugsMore than 10 clear 50ml colorimetric tubesSpectrophotometerBeaker, pipette, filter paper and funnelNessler's reagentPotassium sodium tartrate solutionAmmonium standard solutionZinc sulfate solutionSodium hydroxide2.Experimental stepsThe preparation of sewage:take 100mL sewage and add 0.5mL Zinc sulfate solution and 0.5mL Sodium hydroxide to flocculate the seston and colorful impurity in sewage. After wait for an minute to still standing, we filter the sewage and take lastly 80mL for samples.The preparation of different concentration standard solution and sample water: take 10ml standard solution (100mg/L) into 100ml colorimetric tubes and dilute to 100ml standard line, shake up. Then respectively take 0ml, 1ml, 3ml, 5ml, 7ml, 10ml, standard solution and two parts 10mL and two parts 5mL sample water into 10 clear 50ml colorimetric tubes from tube by pipette, and dilute to 50ml standard line, shake up. Then add respectively 1mL Potassium sodium tartrate solution and 1.5mL Nessler's reagent into 10 colorimetric tubes, shake up, and let them stand at least 10 min.Determining Abs and draw up the graph: set the wavelength of Spectrophotometer in 420nm and clearly wash 4 dishes of 20mm. The first, we determine 4 dishes difference and mark which dish every solution in, then determine each tubes and writ every data down table when the number isn’t down. Let the Abs be the ordinate and the concentration of NH3-N be theabscissa and draw up the graph. Through the graph, calculate the concentration of NH3-N in sewage.Experimental result and data handlingin coordinate system.Fig. 1 Abs-the concentration of NH3-N in 50ml colorimetric tube According to fig. 1 and the following formula we can calculate the concentration of NH3-N in sewage.)/(3341.71229.)-(3LmgyHNH-=ρNotes: y refers to the Abs of NH3-N in sewage.c refers to The concentration of NH3-N in tube (mg/L).The data of detainment and calculate about sewageConclusion1. Data reliability analysisFrom the formula we can see R 2 which mean the requirement quite well995.09879.02≤=R The average of the concentration38.32)93.3130.3091.3475.32(411x 1=+++==∑=ni i x nThe standard deviation of the concentration908.13199.0335.4390.6140.01)(σn1i 2=+++=--=∑=n x x iThe relative standard deviation of data%89.5%10038.32908.1%100s1=⨯=⨯=xCV From the data, we can see that our R 2 is lower standard data which mean that the standard solution data have fewer errors when we diluted and determinated. Similarly the relative standard deviation (CV 1=5.89%) is very bad which mean the data have a lot of fluctuation. It is obvious that the second data is higher than other data. In my opinion, the experimental error mainly comes from the imprecise operations, such as adding more Nessler's reagent and taking more sewage dilute . We should pay attention to the attitude about this experiment. Although regression coefficient (R²=0.9879) and the relative standard deviation (CV 1=5.89%) is bad, the standard deviation (σ=1.908) is well.2. Some standard specifications of total chromium andhexavalent chromium in GBNH3-N emission limit in < Integrated Wastewater Discharge Standard> (GBThe standard limited value of NH3-N in <Surface Water Environment QualityStandard> (GB3838-2002)My data compared with <Surface Water Environment Quality Standard>, we can see that it just exceeds V water standard value more than 19 times. No wonder the ditch is very smelly; maybe stink is also discharged by the sludge in bed. Compared with < Integrated Wastewater Discharge Standard>, the data also exceeds the worst standard value a half time. School should make some measure to treat the sewage, not just for emission limit, but also students complaining.3.Treatment technologiesThere are mainly two treatment methods to treat NH3-N in sewage: physico-chemical methods and biological treatment.Physico-chemical methods: including Steamed ammonia method, adsorption method,catalytic wet air oxidation, flue gas harnessing method and chemical precipitation. These treatments are mainly used in pretreatment of sewage, because the most of them cost more time and money and operation hard and more, it is just addition technology for biological treatment.Biological treatment: A2/O is usually used in sewage treatment plant which is a new technology and better than A/O. A2/O can treat BOD, COD and NH3-N, and it can also treat wastewater contain high concentration NH3-N.Questions and discussion1.By looking for materials, state that we should take care for which technicalessentials in the course of determinate NH3-N, and explain the reason. Answer:We must pay attention to two technical essentials in the coursePretreatment of sewage: the sample water is from everywhere, thereby there may be some colorful substance in sewage which would affect the result of experiment. So we must pretreat sewage that has more colorful substance to eliminate the error.Avoid introducing ammonia from other where: ammonia is easily dissolved in water, so we must prepare non-ammonia water for using in experiment. And it’s also introducing other ammonia in all courses which will make a big error.2.According to relative professional knowledge we have learned, explain how totreat sewage contain high concentration NH3-N.Answer:We can use A2/O to treat wastewater contain high concentration NH3-N. and we should pretreat the sewage contain high concentration NH3-N by Physico-chemical methods which is good at the treatment of A2/O by creating a suitable environment for the grow microorganism.Advises and opinions1.If experiment is easily to complete, we shouldn’t put off our start timeespecially in the night because we don’t want to be too late to completeexperiment.2.Although this experiment is too easy and the same as the experiment wehave done, we can preview such a experiment method again.。

产品常用英语

产品常用英语

压铸新产品工模及样板制作计划进度表常用语工模排位图(Die location layout)平面/实体图(2D/3D drawing)水口设计(gate design) 工模设计(mold design)订料(purchase of die steel) CNC铜公(electrode made by CNC) 模加工(die fabrication) 热处理(heat treatment)磨床加工(grinding by precision grinding machine)淬火后CNC锣(CNC milling after quenching)线切割加工(machining by CNC wire-cut machine)电蚀火花加工[machining by electric discharge machine(EDM) ]省模(Die polished)试模(Die trial) 压铸(die casting)磨夹口(Removing parting line flash)磨光(polishing)(水)震机(water/vibrating)喷油(painting) 电镀(E-plating)扫尼龙(brushed to satin surface)包装(packaging)样板入仓(sample stored in warehouse)锌合金压铸工艺常用语原材料入厂(incoming in warehouse) 来料检验(IQC)压铸(die casting) 冲水口(degating)刮项针位批锋(removing burrs round pads of ejector pin )挤牙(rolled threads) 磨夹口(removing parting line flash)磨/抛光(polishing/buffing) 外发电镀(to e-plating subcontractor)外观全检(appearance full-inspection) 包装(packaging)不合格(NG) 检查报告(inspection report)退回供应商(return to supplier) 选用或回炉报废(selection or remelting)自检(self-inspection)铝合金压铸工艺常用语(中英文双语)原材料入厂(incoming in warehouse) 来料抽检(IQC)压铸(die casting) 冲水口(degating)两侧/上下/曲面磨#320砂(abrasive belt grinding on both sides/top and bottom/curved surface: #320 grit)手磨边角(manual sanding at edge/corner) 全检(full-inspection)QC抽检(QC sampling inspection) 上挂(racking)超声波除腊(ultrasonic clean) 过水(rinsing)热浸除油(soak cleaning) 阴极电解除油(electro clean)巡检(tour-inspection) 沉锌(zinc deposit)活化(activation) 半光镍(semi-bright nickel)回收(collection) 哑镍(matte nickel-plating)光铬(bright chromium-plating) 后处理过水(rinsing after finishing)烘干(baking)镁合金压铸工艺常用语压铸(die casting)铜丝刷磨面(brushed surface by brass brush wheels)QC巡检(QC tour-inspection)剪水口(degating) 冲内窗口(internal frame trimming)磨四边批锋(removing flash around external frame)刮顶针批锋(removing burrs round pads of ejector pin)锉内窗四边(filing internal frame)内窗四边磨砂纸(abrading internal frame by abrasive paper)刮四按钮孔(removing burrs in 4 button holes) 全检(full-inspection) 钻孔(drilling) 攻牙(tapping) 钝化(passivating)喷油前全检(full-inspection prior to painting)抹天那水(wiping with toluene)背面喷面油(applying top coat to bottom surface)表面喷底油(applying primer coat to top surface)烘干(baking) 表面喷面油(applying top coat to top surface)移印/丝印(PAD printing/silk screening) 抽检(sampling inspection) 全检(full-inspection) 包装(packaging)锌镁铝合金压铸件钝化工艺常用语1. 水震除油(water vibratory cleaning)2. 过清水(rinsing)3.酸洗(acid dip/pickling)4. 钝化(passivating)5. 除油(degreasing)6.除油缸温度(temperature in degreasing tank )7. 除油时间(degreasing time)8. 除油粉浓度(degreasant concentration) 9. 浸渍(dipping)10. 浸渍缸温度(temperature in dipping tank)11. 钝化缸温度(temperature in passivating tank)12. 钝化液浓度(passivating agent concentration) 13. 脱脂(degreasing)14. 刻蚀(descaling) 15. 碱洗(alkali cleaning)16. 表调(surface conditioning) 17. 化成(chemical pretreatment) 18. 热水洗(hot water rinsing) 19. 烘干(baking)锌镁铝合金压铸件电镀喷涂工艺常用语1.电珍珠铬工艺常用语(Commonly used terminology in process for pearl chrome plating)硫酸清洗sulfuric acid clean 超声波除蜡ultrasonic clean除油degreasing 电解除油electro clean 酸浸acid dip预镀碱铜alkali copper 焦铜pyrophosphate copper 酸铜acid copper半光叻semi-bright nickel 氯化叻nickel chloride 珍珠叻pearl nickel电铬chromium plated 热水洗hot water rinsing 烘干baking2. 电光铬工艺常用语(Commonly used terminology in process for bright chrome plating)三氯乙烯清洗trichloroethylene clean 上挂具racking除蜡水洗ultrasonic clean 电解缸electro clean酸水acid dip 预红铜电镀copper strike 电红铜copper酸水acid 焦铜pyrophosphate copper 酸铜acid copper半光叻semi-bright nickel 氯化叻nickel chloride 打底叻primer nickel镍色bright nickel 电铬chromium plated 烘干baking3.静电喷涂工艺常用语(Commonly used terminology in process for electrostatic coating)合格件上挂racking 加热脱脂hot degreasing水洗rinsing 酸洗acid dip 中和neutralization表调surface conditioning 磷化phosphating 水洗二次rinsing x2烘干baking 检查inspection 上挂racking 除尘dedusting喷涂spray painting 固化curing 下挂taking down 包装packaging4.静电喷粉工艺常用语(Commonly used terminology in process for electrostatic powder)合格件上挂racking加热脱脂hot degreasing 水洗rinsing 中和neutralization表调surface conditioning 钝化passivating 水洗二次rinsing x2烘干baking 检查inspection 上挂racking 除尘dedusting喷涂spray powder 固化curing 下挂taking down 包装packaging补充词汇(Additional words)闪镀flash/falsh plate光亮电镀bright plating 合金电镀alloy plating 多层电镀multilayer plating金属喷镀metal spraying 刷镀brush plating 挂镀rack plating脉冲电镀pulse plating 真空镀vacuum deposition热浸镀hot dipping 离子镀ion plating 滚镀barrel plating装饰性镀铬electroplating adom-chrome 镀硬铬electroplating hard chrome钢铁发蓝/钢铁化学氧化blueing (chemical oxide)退镀stripping 预镀strike 化学抛光chemical polishing浸亮bright dipping 活化activation 机械抛光mechanical polishing粗化roughtening 机械/化学粗化machine/chemistry coarsening敏化处理sensitization压铸机和模具常用语冷/热室压铸机cold/hot chamber pressure die-casting machine司筒shot sleeve 鎚头piston 料壶melting pot sleeve射咀nozzle 流道/浇口runner/gate 直浇道sprue浇道套sprue bush 鹅颈gooseneck 压射缸injection cylinder压射冲头injection plunger 钢呤steel piston ring 排气vent中央熔炉center furnace 熔化金属molten metal 注料口filling port顶针ejector pin 顶针痕ejector pad 哥林柱/导柱tie bar前(定)机板/后(动)机板machine platen (moving/fixed)前(定)模/后(动)模cover die half(stationary half)/ ejector die half (moveable half) 冷却水通道water cooling channel样板模prototype die 生产模production die成套模unit die 组合模sectional die 冲模trim die模胚/模肉standardized main die frame/ replaceable cavity units行位/柯(型芯)core slides/core镶件casting insert 模具钢热处理die steel heatment模具排位图die layout 夹具jig/fixture 模具寿命die life浇注系统gating/running system 浇注系统设计design of gating system铸件凝固数值模拟numerical simulation of casting solidification铸件工艺计算机辅助设计computer-aided design (CAD) of the casting process浇口杯pouring cup 芯头斜度core taper直浇道spure 直浇道窝sprue base 横浇道runner 内浇道ingate冒口riser/feeder head 留型时间/开型时间opening time 抽芯机构core puller 溢流槽overflow 顶针ejector pin 垃圾位/余料biscuit /slug锁模力locking force 模板尺寸size of die platen 回炉料foundry returns废金属料scrap 熔/炉渣slag 沉/浮渣sludge/dross 重熔remelting哥林柱间距/直径space between tie bars/tie bar diameter开模行位die stroke最大/最小压模厚度maximum/minimum die height干燥周期dry cycle 射料力injection force压射位置shot position 压射行程injection stroke鎚头直径plunger diameter 坩埚容积melting pot专用射料压力specific injection pressure 最大压铸面积casting area射料量casting weight 顶出力ejector force顶出行程ejector stroke 最大压力clamp force max.夹具行程clamp stroke 工作压力normal pressure液压系统工作液体gydraulic fluid 油箱容积oil tank capacity泵流量/型号pump capacity/type 蓄压器型号accumulator type氮气压力nitrogen pressure 燃烧装置burning units煤气炉gas furnace 燃气炉型号burner type 最大输入量Max. input电流强度current 电压voltage 马达型号/功率motor type/capacity质量缺陷常用语质量缺陷常用语(Commonly used terminology in quality defects)缺料incomplete filling顶针位凹凸ejector marks raised or depressed未磨透ungrained down砂孔porosity 变形distortion/deformation 面麻pits多料filling to excess 划痕/刮伤scratches电镀起泡blister/pimple/bubble 冷纹cold shut 碰伤bumps发黄yellowing 崩料partial breakage of a casting露底exposed base 露铜copper exposed 烂料thermal shrinkage crack 牙不到位uncompleted tapping 色不对板color difference from samples蚀模die corrosion 尺寸不符out of size 缩水shrinkage油渍oil marks 漏牙miss tapping 电镀脱皮peeling牙紧tight thread 脱油degreasing 氧化oxidation滑牙loose thread 尘点dirt pits 发黑blacking流痕/波纹flow mark 污渍stain (抗)粘模(anti-)soldering to die喷油面的整饰touch-up针孔pinhole 变色discoloration 狗牙caniniform/dentate砂眼/气孔void 粗糙roughness 扣模die hooked 缩痕shrinkage紧固件常用英语紧固件常用英语(Commonly used terminology in fasteners)1. 机械螺丝Machine screws粗牙机械螺丝Coarse machine screws 幼牙机械螺丝Fine machine screws 2. 自攻螺丝Self tapping screws三角机牙螺丝Taptite-S Type 三角自攻B型Taptite-B Type三角自攻C型Taptite-C Type 三角自攻P型Taptite-P Type木牙螺丝Wood screws 高低纹螺丝Hi-Lo screws3. 螺丝头型Screw Heads切六角头Hexagonal head 打六角头Indented hexagonal head四方头Square head 盆头Pan head 圆头Round head沉头Flat/Countersunk head 扁圆沉头Oval head扁圆头Truss head 盆圆头Binding head 圆顶平头Fillister head4. 螺丝槽型Screw inserts十字槽Cross recessed drives/Philips recess 米字槽PZ Drives一字槽Slotted Drives 一字/十字槽slotted & Philip combination内六角扁圆头Hexagonal socket button cap内六角杯头Hexagonal socket head cap方插口Square socket 凹穴六角Indented hexagon梅花及梅花针槽Torx and TX tamper resistant5. 螺母Nuts 六角螺母Hexagonal nuts四方螺母Square nuts高扭力六角螺母Prevailing torque hex..nuts圆顶螺母cap nuts 法兰螺母Flange nuts 蝶形螺母Wing nuts 6. 锅钉Rivets尾孔锅钉Semi-tubular rivets 冷间锻造锅钉Cold headed rivets 拉钉Pop/blind rivets7. 垫圈/介子Washers平面介子Plain washers 定位介子(内) Retaining rings (Internal) 定位介子(外) Retaining rings(External)弧形介子Curved washers 波浪介子Wave washers轴用定位介子/外用自锁介子Self locking external rings轻形轴用定位介子Circular external rings菊花齿介子Toothed lock washers菊花内外齿介子(Int/Ext)Tooth lock washers螺纹中英文术语螺纹线helix 螺纹screw thread圆柱螺纹parallel screw thread 圆锥螺纹taper screw thread外螺纹external thread 内螺纹internal thread螺纹副screw thread pair 单线螺纹single-start thread多线螺纹multi-start thread 右旋螺纹right-hand thread左旋螺纹left-hand thread 完整螺纹complete thread不完整螺纹incomplete thread 螺尾washout thread; vanish thread有效螺纹useful thread 螺纹牙形form of thread原始三角形fundamental triangle 原始三角形高度fundamental triangle height 基本牙形basic profile 削平高度depth of truncation设计牙型design profile最大实体牙型maximum material profile最小实体牙型minimum material profile牙顶crest 牙底root 牙侧flank承载牙侧load flank 非承载牙侧clearance flank引导牙侧leading flank 跟随牙侧following flank牙顶高addendum 牙底高dedendum牙型高度thread height 牙型角thread angle牙型半角half of thread angle 牙侧角flank angle牙顶圆弧半径radius of rounded crest 牙底圆弧半径radius of rounded roof 公称直径nominal diameter 大径major diameter小径minor diameter 顶径crest diameter底径root diameter 中径pitch diameter单一中径simple pitch diameter 作用中径virtual pitch diameter基准直径gauge diameter 螺纹轴线axis of thread中径线pitch line 螺距pitch 导程lead螺纹升角(导程角)lead angle 螺纹牙厚thread ridge thickness螺纹槽宽thread groove width 螺纹接触高度depth of thread engagement大径间隙major clearance 小径间隙minor clearance螺纹旋合长度length of thread engagement基准平面gauge plane 基准距离gauge length装配余量fitting allowance 旋紧余量wrenching allowance行程stroke 螺纹精度tolerance quality螺距偏差deviation in pitch 螺距累积误差cumulative error in pitch导程偏差deviation in lead 导程累积误差cumulative error in lead螺旋线轴向误差helix error in the axis 牙侧角偏差deviation of flank angle 螺距误差中径当量pitch diameter equivalent of error in pitch牙侧角误差中径当量pitch diameter equivalent of error in flank angle基准距离偏差deviation of gauge length基准平面的轴向位移偏差deviation of datum axial drift行程偏差deviation of stroke压铸缺陷和压铸参数的关系------镁合金压铸。

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ReviewUltrasonic pretreatment of sludge:A reviewSridhar Pilli a ,Puspendu Bhunia b ,Song Yan a ,R.J.LeBlanc c ,R.D.Tyagi a,*,R.Y.Surampalli daINRS Eau,Terre,Environnement,490,rue de la Couronne,Québec,Canada G1K 9A9bDept.of Civil Engineering,Indian Institute of Technology,Bhubaneswar 751013,India cGMSC,355Hillsborough Road,Riverview,NB,Canada E1B 1S5dUS Environmental Protection Agency,P.O.Box 17-2141,Kansas City,KS 66117,USAa r t i c l e i n f o Article history:Received 15June 2009Received in revised form 24December 2009Accepted 1February 2010Available online 18April 2010Keywords:Anaerobic digestionBiological wastewater treatment CavitationWaste activated sludge Ultrasonicationa b s t r a c tUltrasonication is an emerging and very effective mechanical pretreatment method to enhance the bio-degradability of the sludge,and it would be very useful to all wastewater treatment plants in treating and disposing sewage sludge.Ultrasonication enhances the sludge digestibility by disrupting the physical,chemical and biological properties of the sludge.The degree of disintegration depends on the sonication parameters and also on sludge characteristics,therefore the evaluation of the optimum parameters varies with the type of sonicater and sludge to be treated.The full-scale installations of ultrasonication have demonstrated that there is 50%increase in the biogas generation,and in addition evaluation of energy balance showed that the average ratio of the net energy gain to electric consumed by the ultrasound device is 2.5.This review article summarizes the benefits of ultrasonication of sludge,the effect of son-ication parameters,impact of sludge characteristics on sludge disintegration,and thereby the increase in biogas production in anaerobic digester.Due to uncertainty in the unit representation by many research-ers and nonavailability of the data,comparison of these results is parison of ultrason-ication with other pretreatment options is necessary to evaluate the best economical and environmental pretreatment technology for sludge treatment and disposal.The optimum parameters for the ultrasoni-cation vary with sludge characteristics.Ó2010Elsevier B.V.All rights reserved.1.IntroductionThe rapid growth of industrialization and urbanization in the 21st century has resulted in production of unmanageable quantity of sludge from wastewater treatment plants (WWTPs).The sludge management is the major issue of wastewater treatment plant,as it costs 60%of the total plant capital cost [1]and the laws for sludge disposal are becoming increasingly stringent.With increase in global warming and climate change,the greenhouse gases (GHGs)emissions from the waste sector are of increasing concern.In Canada,GHGs from the waste sector have increased by 15%from 1990to 2006[2].The existing WWTPs in Canada are producing 670,000Mg/y of dry sludge [3],and the production rate is expected to increase further in the future.Incineration,ocean discharge,land application and composting are the common sludge disposal meth-ods used over the years.These common sludge disposal methods are no longer reliable due to the economical constraints and the negative impacts on environment.Due to environmental and eco-nomical constraints,there is a need for affordable and sustainable technologies for sludge treatment and disposal.With extensive re-search on sludge treatment,many researchers have proposedanaerobic digestion (AD)of sludge as the efficient and sustainable technology for sludge treatment.The benefits associated with AD technology are huge,which include mass reduction,odour re-moval,pathogen reduction,less energy use,and more significantly,the energy recovery in the form of methane.The AD of sludge is a complex process that converts degradable organic compounds to methane (CH 4)and carbon dioxide (CO 2)in the absence of elemental oxygen with a series of microbiological process.The conversion pathway of the substrate to biogas (mainly CH 4and CO 2)occurs in four stages,namely,hydrolysis,acidogene-sis,acetogenesis and methanogenesis by three different groups of bacteria.The first group involves hydrolytic and acidogenic bacte-ria,which hydrolyze the complex substrates (carbohydrates,lipids,proteins,etc.)to dissolved monomers (sugars,fatty acids,amino acids,etc.)and further to CO 2,H 2,organic acids and alcohols.The second metabolic group of bacteria is hydrogen producing aceto-gens that convert the simple monomers and fatty acids to acetate,H 2,and CO 2.The third group is methanogenic bacteria that utilize the H 2,CO 2and acetate to produce CH 4and CO 2.This complete microbial digestion process of the substrate to CH 4and CO 2is a slow process and requires high retention time.In particular,intra-cellular biopolymers solubilisation and conversion to the lower molecular weight compounds of solid degradable organics such as sludge through hydrolysis is a rate limiting step [4,5].The1350-4177/$-see front matter Ó2010Elsevier B.V.All rights reserved.doi:10.1016/j.ultsonch.2010.02.014*Corresponding author.Tel.:+14186542617;fax:+14186542600.E-mail address:tyagi@ete.inrs.ca (R.D.Tyagi).conventional anaerobic digestion process with four stages is pre-sented in Fig.1.The lower microbial conversion rates during conventional AD process results in high hydraulic retention time in the digester and larger digester volume,which are the prime drawbacks of the conventional AD technology.The nonavailability of the readily biodegradable soluble and organic matters and lower digestion rate constant(i.e.,first order digestion rate constant0.15dayÀ1 for sludge)[6]necessitates the pretreatment of sludge.Pretreat-ment of sludge is required to rupture the cell wall and to facilitate the release of intracellular matter into the aqueous phase to in-crease biodegradability and to enhance the anaerobic digestionwith lower retention time and with higher biogas production[7–9].With the advancements in various sludge pretreatment tech-niques like thermal,chemical,mechanical,biological and physical and several combinations such as physicochemical,biological–physicochemical,mechanical–chemical and thermal–chemical, biodegradability of sludge can be enhanced by several orders; however,economical constraints of these technologies have lim-ited their scale-up and lab-to-field implementation.Extensive research has been carried throughout the world to establish the best economically feasible pretreatment technology to enhance the digestibility of sludge.The ultrasonication is an emerging and promising mechanical disruption technique for sludge disintegration due to several inherent merits like efficient sludge disintegration(>95%,[10]),improvement in biodegradabil-ity[9],improved biosolids quality[9],increase in methane per-centage in biogas[9,11],no chemical addition[12],less retention time[13],sludge reduction[14]and energy recovery(1kW)of ultrasound energy generates7kW of electrical energy including losses[11].The order of pretreatment efficiency for enhancement of methane generation is:ultrasonic lysis(20W,9kHz, 30min)>thermal pretreatment by autoclave(120°C,30min)> thermal pretreatment with hot water(60°C,30min)>freezing (À10°C,15h)[15].This paper presents an extensive review of the ultrasonic pretreatment of sludge to enhance the AD,and to compare the results of the full-scale and lab-scale implementation.2.UltrasonicationIn early days of sonar,the sound waves are used for anti-sub-marine warfare,results in the killing offish by the sound waves, has given the birth of ultrasound method of destroying or inacti-vating biological cells.Hughes and Nyborg[16]and Alliger[17] have studied the mechanism of ultrasound interaction with micro-bial cells and observed that the brief exposure to ultrasound can cause thinning of cell wall attributed to releasing of the cytoplasm membrane from the cell wall.The ultrasound is cyclic sound pres-sure(compression and expansion)with a frequency greater than 20kHz.The ultrasound range diagram with various applications at different frequency is shown in Fig.2.Depending on the frequency,it is divided into three regions: power ultrasound(20–100kHz),high frequency ultrasound (100kHz–1MHz),and diagnostic ultrasound(1–500MHz).Ultra-sound application in medicine started during the Second World War as ultrasound massage to substitute for hands of the masseur in patients who has suffered from fractures[18].With advance-ments in technology and sophistication,ultrasound(>20kHz)is used in severalfields.Ultrasound ranging from20kHz to 100kHz is used in chemically important systems in which chemi-cal and physical changes are desired[19,20].The ultrasound rang-ing from1MHz to10MHz is used in differentfields,like animal navigation and communication,detection of cracks orflaws in sol-ids and under water echo location,fetal scanning,detection of pel-vic abnormalities,treating benign and malignant tumors,etc. [19,21,22].Biological cell disruption for the recovery of intracellu-lar materials is achieved by ultrasonication[22–24],and further full-scale application for municipal sludge disintegration was eval-uated by Hogan et al.[25].The acoustic waves between20Hz and 20kHz are the audible range,while hearing varies with the indi-vidual and the age.The acoustic waves less than20Hz down to 0.001Hz is used in seismology[26],medical application[27][bal-listocardiography and seismocardiography to study the mechanics of the heart],and also in charting rock and petroleum formations below the earth[26].2.1.Cavitation phenomena induced by ultrasoundThe basic goal of ultrasound technique is to spiflicate bacterial cell walls and to facilitate intracellular matter available for subse-quent degradation to CH4and CO2in AD.When the ultrasound wave propagates in sludge medium,it generates compressions and rarefactions,the compression cycles exert a positive pressure on the liquid by pushing the molecules together and the rarefac-tion cycle exerts a negative pressure by pulling the molecules from one another.Because of this excessively large negative pressure, microbubbles(cavitation bubbles)are formed in the rarefaction re-gions.These microbubbles grow in successive cycles and reaches to an unstable diameter that collapse violently producing shock waves(temperature of around5000°C and pressure of500atmo-spheres at a lifetime of few microseconds)[14,28,29–34].This pro-cess by which the bubbles form,grow and undergo violent collapse is known as cavitation.Representation of development and col-lapse of the cavitation bubble is shown in Fig.3.20 Hz 2 MHz 200 MHz 2S.Pilli et al./Ultrasonics Sonochemistry18(2011)1–182.2.Factors influencing the cavitation phenomenaThe sludge disintegration efficiency is essentially based on the cavitation phenomena and the factors influencing the cavitation that influence the efficiency of disintegration are shown in Table1.2.3.Ultrasound generation and disintegration mechanismUltrasound is generated by two techniques magnetostrictive and piezoelectric.In magnetostrictive technique,the electrical en-ergy is converted to mechanical energy(or vibration)with a mag-netic coil attached to vibrating piece like nickel and Terfenol-D [44].In the piezoelectric technique,the electrical energy is con-verted to high frequency electric energy with piezoelectric crystals (rely to material strain)attached to the vibrating piece(sonotrode, probe or horn).The transducer(converter)converts the electrical or mechanical energy to sound waves and the booster is a mechan-ical amplifier that increases the vibration(amplitude)generated by transducer[9,45].The horn delivers the ultrasound waves into the liquid.Therefore transducer,booster and horn are the major com-ponents in ultrasound equipment.Ultrasonication of sludge with temperature control and sonication components is shown in Fig.4.Holding or affixing the transducer,booster and horn together is called as stack assembly and the stack is clamped at nodal points as shown in Fig.4.The two most common places to clamp or to hold the total system is at the transducer or at the booster nodal ring. Similar to the booster,the horn which delivers the motion to the sludge often amplifies the motion even further.In addition,the horn is usually half a wavelength long,but full wavelength designs are also common depending upon the application.The intensity of sonication can be controlled by altering the power input and is based on the probe design.This is a very important parameter in ultrasonication and will determine the magnitude of the gain or mechanical amplification of the vibration.The conversion effi-ciency of sound energy to thermal energy can be calculated as shown in Eqs.(1)–(3)[46].Table1Factors influencing the cavitation phenomena.No.Factors Influence on cavitation phenomena1Gas and particulate matter Presence of gas/air in the liquid will lower the cavitational threshold and reduces the intensity of the shock wave released,as much of the shock wave will be utilized to collapse the gas bubbles.Particulate matters,especially like trapped vapour gas nuclei in their crevices and recesses,will reduce the cavitation effect[18]2External appliedpressureIncreasing the external pressure raises the rarefaction pressure,which increases the cavitation collapse intensity[35,36]3Solvent viscosity If the natural cohesive forces acting in the liquid are lower,then they will suppress[37]the negative pressure in the expansion or rarefaction cycle.Therefore to increase the cavitation threshold the natural cohesive forces need to be increased by increasing theviscosity of liquid4Solvent surface tension The addition of surfactant to an aqueous solution certainly facilitates the cavitation.Increase in solvent viscosity and surface tension, reduces the rate of microbubble formation but increases the intensity of bubble collapse.With addition of surfactants will reduces thesolvent surface tension and facilities bubble nucleation(i.e.,fewer microbubbles are formed)[35,38]5Solvent vapourpressure If the vapour pressure of the liquid is low,then it is difficult to induce cavitation in the liquid.Because,low vapour will enter into the bubble and results in low cavitation[37]6Applied frequency The rarefaction phase is shortened by increasing the frequency of irradiation,but to maintain an equivalent amount of cavitational energy into the system the power should be increased.That is at higher frequency more power is required to maintain samecavitational effect[35,39,40]7Temperature The cavitation threshold increases with decrease in temperature of bulk solution.With increase in temperature,the solvent reaches the solvent boiling point and produces larger number of cavitation bubbles concurrently,which acts as barrier to sound transmission andnullify the effectivity of ultrasound energy[38]8Sonication density Increase in sonication density increases the sonication effects on the sludge as given by the equation,PA ¼ffiffiffi2pI q C,[41];whereP A=acoustic pressure,I=intensity,q=density,C=velocity of sound in the medium9Acoustic intensity Increasing the sonication intensity increases the sonication effects,and it is directly proportional to the square root of the amplitude (P A)of the acoustic wave divided by the density of the liquid(q)and the speed of sound in the liquid(c).I¼P2A2q c[36,42]10Types of ultrasound cavitation The collapse of the cavitation bubbles produces high velocity waves and temperature,causing inter-particle collision and the rupture of cell wall.Depending on bubble types,the ultrasound cavitation is classified as transient or stable(non-inertial cavitation).Transient is believed to occur at10W/cm2and the later at1–3W/cm2[37];the stable bubbles bound to have significant long term effect.The transient and stable bubble growth is explained by bubble growth time by Abramov[43];s g=0.75T+(iÀ1)T;T=1/f,where s g is the bubble growth time,‘f’is the ultrasound frequency,‘T’is the period of ultrasound wave and‘i’is number of acoustic cycles the bubble experienced11Attenuation The intensity of the ultrasound is attenuated as it progress through the medium.The attenuation is inversely proportional to the frequency of the ultrasound(i.e.,energy is dissipated in form of heat which is not considered in the bulk medium).High power andhigh frequency is required to have the same intensity at the lower depth for a given sample12Field type The standing wavefield is pronounced with more acoustic cavitation than a progressivefield[37]S.Pilli et al./Ultrasonics Sonochemistry18(2011)1–183Q w ¼Cm ðT ÀT 0Þð1ÞQ u ¼Ptð2Þg ð%Þ¼Q wuÃ100ð3ÞT 0=temperature of fresh sludge;T =temperature after ultrasonica-tion;Q w =total energy;m =mass of water;C =specific heat of water (4.2kJ/kg C);Q u =actual energy produced;P =ultrasound power;t =ultrasound duration;g =efficiency.2.3.1.Sludge disintegrationThe applied power/energy supplied for sludge disintegration is expressed in many ways,(a)specific energy input,(b)ultrasonic dose,(c)ultrasonic density and (d)ultrasonic intensity and the expressions are given in Table 2.The expected disintegration mechanisms during ultrasonic dis-integration of sludge are as follows [9,33,49]:(a)Hydro-mechanical shear forces(b)Oxidising effect of ÅOH,ÅH,ÅN,and ÅO produced under theultrasound radiation(c)Thermal decomposition of volatile hydrophobic substancesin the sludge(d)Increase of temperature during ultrasonic activated sludgedisintegration The induce cavitation that occurs during ultrasonication results in sudden and violent collapse of huge number of microbubbles,which generates powerful hydro-mechanical shear forces in the bulk liquid surrounding the bubbles [9,34,49–51].The high tem-perature produced during the bubble collapse (implosion)decom-poses water (H 2O)into extremely reactive hydrogen atoms (H +),and hydroxyl radicals (ÅOH)and in the cooling phase these radicals will recombine to form hydrogen peroxide and molecular hydro-gen [9,33,49,52–56].The oxidising effect of ÅH,ÅN and ÅO is less than ÅOH [49,53,54,57];therefore the effect of ÅH,ÅN and ÅO is neglected during the ultrasonication.The effect of the volatile hydrophobic substances is neglected as their quantity is very low in the sludge [49].Considering the temperature effect on solubilisation,at high-er temperature the sludge solubilisation is very low and needs longer time to attain the solubilisation of sludge (temperature raised to 80°C in 1h produces low solubilisation and a low degree of disintegration in the sludge,where the sonication is a short per-iod of time).Therefore,sludge disintegration is expected to occur in two ways,mainly by hydro-mechanical shear forces and the oxi-dising effect of ÅOH.Wang et al.[49]have evaluated the effect of ÅOH and hydro-mechanical shear forces on sludge disintegration.The effect of hydroxide radical was evaluated by addition of the NaHCO 3to the sludge prior to sonication.The oxidation effect of hydroxide ion on sludge solubilisation was slightly higher by the addition of NaHCO 3,but the slight enhancement was due to the increase in the pH of the sludge.This shows that the oxidation effect of the hydroxide radical on sludge solubilisation is negligible.Therefore,the disintegration of the sludge occurs mainly by hydro-mechani-cal shear forces produced by cavitation bubbles.The sludge disin-tegration by hydro-mechanical shear forces and hydroxide radical follows a first order reaction.The total reaction constant ‘‘u ”is cal-culated as follows (Eq.(4))[49].u ¼u ÅOH þu HSF ð4Þwhere u ÅOH is the reaction constant under oxidising effect;u HSF is the reaction constant under effect of hydro-mechanical shear forces.Neglecting the effect of hydroxide radical oxidation effect,then the reaction constant is u =u HSF .The reaction rate constant of hydroxide radical increases with increase in ultrasonic density;for example,the contribution of the oxidising effect of hydroxide radical in-creased from 19.15%to 25.86%,with increase in ultrasonication density from 0.384to 0.72W/mL [49].2.4.Evaluation of ultrasound disintegrationThe ultrasound de-agglomerates the biological flocs and dis-rupts the large organic particles into smaller size particles.The shear force produced by high pressure wave breaks down bacterial cell wall and releases the intracellular substances into aqueous phase.This changes the physical,chemical and biological proper-ties of sludge during pretreatment by ultrasonication.Therefore,the degree of sludge disintegration is to be evaluated based on the changes in physical (particle size distribution,turbidity,sett-leability,mass composition and microscopic examination),chemi-cal (increase in SCOD,protein concentration,polysaccharide content of the supernatant,nitrate nitrogen and release of NH 3)Table 2Expressions for sludge disintegration.No.Parameter ExpressionUnitReference 1Specific energy inputE s ¼P ÃtV ÃT ÃS kJ/kg TS or kW s/kg TS [46]2Ultrasound dose UD o ¼P Ãt V J/L [33]3Ultrasound density UD ¼PVW/L [33]4Ultrasound intensityUI ¼PAW/cm2[48]E s :specific energy in kW s/kg TS (kJ/kg TS);P :power input (kW);T :sonication time (s);V :volume of sludge (L);TS:total solids concentration (kg/L);A :surface area of the probe in cm 2.18(2011)1–18and biological(heterotrophic count and specific oxygen uptake rate)properties.2.4.1.Physical changesThe physical parameters of the sludge have a significant effect on AD,so the evaluation of the physical parameters after sonication is essential for operation of AD.Further,physical evaluation is used as qualitative measurement of sludge disintegration.Particle size analysis,sludge settleability,mass composition,microscopic image, turbidity,and sludge dewaterability are some of the techniques used to judge the degree of ultrasonic disintegration.Particle size is analysed by various techniques depending upon size of particles. The different techniques are sieves,sedimentation,electrozone sensing,microscopy,laser diffraction[58,59].Ultrasonication disin-tegrates sludge particles to a very smaller size,and laser diffraction is usually used for particle size analysis.The turbidity of sludge changes with increase in sonication parameters(ultrasound den-sity,ultrasound intensity,and sonication time)and it is measured by using a turbidity meter,with NTU units.The sludge dewaterabil-ity is measured based on the capillary suction time(CST)and spe-cific resistance offiltration(SRF)[13,60–65].2.4.1.1.Particle size.The particle solubilisation rate is governed by the size of particles in the waste,and methane production in the mature digester is proportional to the net rate of particle size sol-ubilisation[5,51,66].Ultrasound pretreatment is very effective in reducing the particle size of sludge and the efficiency of size reduc-tion is dependent upon the sonication duration[13,67–70],ultra-sonication density[12,41,61,64,71–75],sonication power[41,59, 62,73],sludge volume and sludge characteristics[12,47,66,69, 72,73].With increase in sonication time the particle size reduces gradually;for example,the particle size reduces from165l m to 135l m and85l m with a sonication time of0.49min and1.6min,respectively[13].Similarly,Biggs and Lant[68]observeda particle size reduction of125–10mm after5min sonication (50W,100ml).Gonze et al.[69]observed a similar reduction trend initially but beyond a sonication of10min the particle size has in-creased gradually with further increase in sonication time.At 0.5min@3.9kJ/L,1min@7.8kJ/L,3min@23.4kJ/L and6min @46.8kJ/L,the particle size was reduced from66.9l m to55.1l m,42.6l m,24.2l m and18.1l m,respectively,but beyonda sonication time of10min the particle was increased gradually to19.5l m,20.6l m and31.9l m at10min@78kJ/L,20min@ 156kJ/L and60@468kJ/L min,respectively.The increase in the particle size at higher sonication time is due to re-flocculation of the particles.Initially theflocs are reduced but increase in sonication time further causes more release of intracel-lular polymers due to cell lysis that are favourable for re-floccula-tion[64,67,69,76,77].The biopolymers released are thought to be the glue that holds bioflocs together and they form functional groups such as hydroxyl and negatively charged carboxy groups [78].The mean particle size reduction also increases with increase in sonication densities.At densities of0.52W/mL,the mean parti-cle is reduced from51l m to15l m and51l m to19l m at 0.33W/mL,respectively[72].Low power level has no effect onfloc size reduction by sonication.With increase in power level,thefloc size reduction increases with increase in ultrasonication density and sonication time.For example,thefloc size reduces from 94l m to less than3l m with a sonication density of0.22W/mL and0.44W/mL,respectively[61].At constant power level of 0.33W/mL,with increase in sonication time reduces thefloc size to22l m and10l m with a sonication time of20min and 40min,respectively[61].At constant sonication time of60min, the particle size reduction was less than3l m at0.33W/mL and 0.44W/mL.Microscopic examination reveals that structural integ-rity offloc will be destroyed completely after60min of sonication,so further increase in sonication time or power level cannot disin-tegrate thefloc.There thus exist an optimum power level and son-ication time for sludge disintegration[61].Chu et al.[71]has studied the effect of sonication on the raw sludge andflocculated sludge.The size reduction in AD of thefloc-culated sludge after sonication was more than50%of the sonicated raw sludge.The average surface charge of the sludge reduces due to sonication.The sonication will split thefloc particles into several small particles with negatively charged surfaces.For example,due toflocculation,the f-potential of sludge has been increased from À14mV to18mV,following sonication has reduced the f-potential to+4mV,while in the original sample the f-potential wasÀ14mV [71].Mao et al.[12]evaluated the effect of sonication on particle size reduction in primary and secondary sludge;the sludge disin-tegration was more in the secondary sludge compared to primary sludge.A reduction of85%particle size has been observed in sec-ondary and71%in primary within20min of sonication.The higher reduction in the secondary sludge is expected,as it contains mostly the biomass(microbial cells),but the primary sludge consists pre-dominantly readily settleable solids comprisingfibres and less degradable cellulosic material.The increase in sonication density has also increased the disintegration efficiency;more particles are disintegrated at higher sonication densities(73%at4W/mL and60%at2W/mL)[12].Bou-grier et al.[47]evaluated the effect of ultrasonic treatment on par-ticle size distribution ranging from0.4l m to1000l m of waste activated sludge(WAS)using20kHz frequency at different specific energy inputs.Particle sizes less than1l m have been observed to increase with increase in specific energy supplied.For example, E s=14,550kJ/kg TS,particles of1l m occupied1.5%of the whole volume,whereas they occupied0.1%in the untreated sample. However,the volume occupied by larger particle greater than 100l m has also been increased due to re-flocculation[69].Akin et al.[66]studied the effect of sonication on particle size at differ-ent total solids concentration(TS)in the sludge.The size reduction was more for the lower TS sludge(2%TS content decreased by6.5-fold at0.67W/mL,240min sonication),and a similar degree of reduction requires more ultrasonication density in the higher TS sludge(4%needs1.03W/mL and6%needs0.83W/mL).The effect of sonication on particle size is compared using the uniformity coefficient(dp60n dp10),and dp10.Ultrasonication has been reported to increase uniformity coefficient of sludge by5-fold and decreases in particle size gradually with increase in specific energy[33,69].For example,the uniformity coefficient and dp10 of sludge changed from3.3to17and30.5l m to1.2l m,respec-tively,at E s=7200kJ/L[63].The micro-flocs(<4.4l m)shows less susceptibility to sonication than macro-flocs(>4.4l m),as macro-flocs have the larger surface area exposed to sonication than the micro-flocs which have more binding forces,such as cells[41]. El-Hadj et al.[64]observed that with an increase in specific energy (E s)input,the volume occupied by the smaller particles size (628l m)was more than90%.A particle with a size larger than 4.4l m(including,4.4<d650l m,50<d6125l m and d P125 l m)exhibited more disruption than micro-flocs(<4.4l m)[41]. The effect of particle size distribution on CST(capillary suction time)and SRF(specific resistance tofiltration)was observed by Jin et al.[79]and Feng et al.[65]and they derived a strong corre-lation between the particle size and CST/SRF.The correlation coef-ficient between dp90and CST was in the range of0.8248[79]to 0.9436[46].The ultrasonication breaks up small particles more effectively than larger one[46,63,64]and the particle size and en-ergy dose were inversely related with a correlation coefficient of 0.996at the significance level0.01[46].2.4.1.2.Dewaterability of sludge.Ultrasonication has both positive and negative effects on sludge dewaterability.Lower power levelS.Pilli et al./Ultrasonics Sonochemistry18(2011)1–185。

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