Design reuse oriented partial retrieval of CAD model
2022年考研考博-考博英语-华南师范大学考试全真模拟易错、难点剖析AB卷(带答案)试题号:59

2022年考研考博-考博英语-华南师范大学考试全真模拟易错、难点剖析AB卷(带答案)一.综合题(共15题)1.单选题The theory put forward by a famous scholar at an international conference contradicts the () principles of the sphere of architecture.问题1选项A.particularB.preciseC.appropriateD.proper【答案】A【解析】考查形容词词义辨析。
A: particular “专指的,特指的” ;B: precise “清晰的;精确的;精细的”;C: appropriate “适当的”;D: proper “境界;限度;范围”。
句意:—位著名学者在一次国际会议上提出的理论与建筑领域的特定原则相矛盾。
被修饰的名词为“principles原理”,因此可知A为正确答案。
2.单选题The envelope arrived with the old address(), and the new one written alongside it.问题1选项A.left outB.crossed outC.cutoutD.fallen【答案】B【解析】考查词组。
A: left out“遗漏;忽略”;B: crossed out“勾掉,划掉”;C: cut out“停止;裁剪”;D: fallen“倒下”。
句意:信封上的旧地址划掉了,旁边写着新地址。
结合此处语境,B为正确答案。
3.单选题The American society is()an exceedingly shaky foundation of natural resources which is connected with the possibility of a worsening environment.问题1选项A.established onB.affiliated toC.originated fromD.incorporated with【答案】A【解析】考查固定搭配。
微电子专业英语词汇

Abrupt junction 突变结[?'br?pt] 突然的;Accelerated testing 加速实验[?k'sel?reitid]Acceptor 受主Acceptor atom 受主原子['?t?m] n. 原子Accumulation [?,kju:mju'lei??n]积累,堆积Accumulating contact(n. 接触,联系)积累接触Accumulation region['ri:d??n]地区积累区Accumulation layer['lei?] 层积累层Active region 有源区['?ktiv]积极的,有源的Active component [k?m'p?un?nt]元件有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance [?d'mit?ns]导纳Allowed band [b?nd]带允带Alloy-junction device ['?l??]合金结器件Aluminum(Aluminium) [?'lju:min?m]铝Aluminum – oxide ['?ksaid]铝氧化物Aluminum passivation [p?si'vei??n]钝化铝钝化Ambipolar [,?mbi'p?ul?]双极的Ambient temperature ['?mbi?nt]环境温度Amorphous [?'m?:f?s]无定形的,非晶体的Amplifier ['?mplifai?]功放扩音器放大器Analogue(Analog) ['?n?l?ɡ] comparator ['k?mp?reit?]模拟比较器Angstrom ['??str?m]埃Anneal [?'ni:l]退火Anisotropic [?n,ais?u'tr?pik]各向异性的Anode ['?n?ud]阳极Arsenic ['ɑ:s?nik (AS) 砷Auger ['?:ɡ?]俄歇Auger process 俄歇过程Avalanche ['?v?lɑ:nt?]雪崩Avalanche breakdown(击穿) 雪崩击穿Avalanche excitation [,eksi'tei??n](激发)雪崩激发Background(背景,本底,基底) carrier 本底载流子Background doping 本底掺杂Backward ['b?kw?d]反向Backward bias ['bai?s](偏置,)偏爱反向偏置Ballasting ['b?l?st] resistor 整流电阻Ball bond [b?nd](结合)球形键合Band 能带Band gap [ɡ?p](间隙)能带间隙Barrier 势垒Barrier layer 势垒层Barrier ['b?ri?] width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit(运输)time基区渡越时间Base transport efficiency [i'fi??nsi](效率)基区输运系数Base-width modulation [,m?dju'lei??n(?调制)基区宽度调制Basis vector ['vekt?]矢量基矢Bias 偏置Bilateral [,bai'l?t?r?l] switch 双向开关Binary ['bain?ri]code(代码)二进制代码Binary compound semiconductor二元化合物半导体Bipolar [bai'p?ul?]双极性的Bipolar Junction Transistor (晶体管)(BJT)双极晶体管Bloch [bl?k]布洛赫Blocking ['bl?ki?](截止,阻塞)band 阻挡能带Blocking contact 阻挡接触Body(身体,主题)- centered(居中的)体心立方Body-centred cubic ['kju:bik]立方体structure ['str?kt??]结构体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit ['s?:kit]电路自举电路Bootstrapped emitter [i'mit?]发射器follower(追随者)自举射极跟随器Boron ['b?:r?n]硼Borosilicate [,b?:r?u'silikit]硼硅酸盐glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk [b?lk]体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination [,ri:k?mbi'nei??n]体复合Burn - in 老化Burn out 烧毁Buried ['berid]埋葬的channel埋沟Buried diffusion扩散region 隐埋扩散区Can 外壳Capacitance[k?'p?s?t(?)ns]电容Capture俘获cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade [k?s'keid]级联,串联级联Case 管壳Cathode['k?θ?ud]阴极Center 中心Ceramic [si'r?mik]陶瓷(的)Channel['t??n?l] (频道)沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance[im'pi:d?ns]特征阻抗Charge (控告)电荷,充电Charge-compensation[,k?mpen'sei??n](补偿) effects 电荷补偿效应Charge conservation(保存,保持) 电荷守恒Charge neutrality[nju?'tr?l?t?](中性) condition电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching[nju?'tr?l?t?]化学腐蚀法Chemically-Polish['p?l??](磨光)化学抛光Chemmically-Mechanically [m?'k?n?k?l?](机械地)Polish (CMP) 化学机械抛光Chip 芯片Chip yield(产量)芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage['kli?v?d?] plane(平面)解理面Clock rate(比率)时钟频率Clock generator 时钟发生器Clock flip-flop(触发器)时钟触发器Close-packed structure(构造)密堆积结构Close-loop(环)gain(获利,增加)闭环增益Collector 集电极Collision[k?'l??(?)n](冲突)碰撞Compensated(补偿)OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection(抑制,拒绝)ratio (CMRR) 共模抑制比Compatibility[k?m,p?t?'b?l?t?]兼容性Compensation 补偿Compensated impurities(杂质)补偿杂质Compensated semiconductor 补偿半导体Complementary(补足的)Darlington circuit(电路,回路)互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(晶体管)(CMOS) 互补金属氧化物半导体场效应晶体管Complementary error function(功能,函数)余误差函数Computer-aided【辅助的】design (CAD)/test(CAT)/manufacture(CAM)Compound['k?mpa?nd] Semiconductor 化合物半导体Conductance[k?n'd?kt(?)ns]电导Conduction(传导band (edge) 导带(底) Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration(配置)组态Conlomb?['ku?l?m]库仑Conpled Configuration Devices 结构组态Constants(常量,常数)物理常数Constant energy surface 等能面Constant-source diffusion(扩散,传播)恒定源扩散Contact(联系,接触)接触Contamination[k?n,t?m?'ne???n]玷污Continuity[,k?nt?'nju??t?](连续性)equation(方程式,等式)连续性方程Contact hole孔接触孔Contact potential(潜能,潜在的)接触电势Continuity condition 连续性条件Contra['k?ntr?]相反doping 反掺杂Controlled 受控的Converter[k?n'v??t?](converter转变,转换)转换器Conveyer[k?n've?]传输器Copper(铜)interconnection[,?nt?k?'n?k??n](互联)system 铜互连系统Couping 耦合Covalent[k??'ve?l(?)nt](共价的)共阶的Crossover 跨交Critical (批评的)临界的Crossunder 穿交Crucible['kru?s?b(?)l]坩埚Crystal defect缺陷/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density(密度)电流密度Curvature'k??v?t??曲率Cut off 截止Current drift(漂移)/dirve/sharing电流漂移/驱动/共享Current Sense(感觉,检测)电流取样Curvature 弯曲Custom(风俗,习惯,定制的integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶crystal(晶体,单晶)Czochralski technique 切克劳斯基技术(Cz 法直拉晶体J)Dangling ['d??g(?)l??;bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel ['des?bel] (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor['d??n?(捐赠者level 深施主能级Deep impurity(杂质,不存,不洁)level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation?[,degr?'de??(?)n]退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOSDepletion region 耗尽区Deposited film(电影,薄膜) 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation(隔离。
低频活动漂浮潜水船声探测系统(LFATS)说明书

LOW-FREQUENCY ACTIVE TOWED SONAR (LFATS)LFATS is a full-feature, long-range,low-frequency variable depth sonarDeveloped for active sonar operation against modern dieselelectric submarines, LFATS has demonstrated consistent detection performance in shallow and deep water. LFATS also provides a passive mode and includes a full set of passive tools and features.COMPACT SIZELFATS is a small, lightweight, air-transportable, ruggedized system designed specifically for easy installation on small vessels. CONFIGURABLELFATS can operate in a stand-alone configuration or be easily integrated into the ship’s combat system.TACTICAL BISTATIC AND MULTISTATIC CAPABILITYA robust infrastructure permits interoperability with the HELRAS helicopter dipping sonar and all key sonobuoys.HIGHLY MANEUVERABLEOwn-ship noise reduction processing algorithms, coupled with compact twin line receivers, enable short-scope towing for efficient maneuvering, fast deployment and unencumbered operation in shallow water.COMPACT WINCH AND HANDLING SYSTEMAn ultrastable structure assures safe, reliable operation in heavy seas and permits manual or console-controlled deployment, retrieval and depth-keeping. FULL 360° COVERAGEA dual parallel array configuration and advanced signal processing achieve instantaneous, unambiguous left/right target discrimination.SPACE-SAVING TRANSMITTERTOW-BODY CONFIGURATIONInnovative technology achievesomnidirectional, large aperture acousticperformance in a compact, sleek tow-body assembly.REVERBERATION SUPRESSIONThe unique transmitter design enablesforward, aft, port and starboarddirectional transmission. This capabilitydiverts energy concentration away fromshorelines and landmasses, minimizingreverb and optimizing target detection.SONAR PERFORMANCE PREDICTIONA key ingredient to mission planning,LFATS computes and displays systemdetection capability based on modeled ormeasured environmental data.Key Features>Wide-area search>Target detection, localization andclassification>T racking and attack>Embedded trainingSonar Processing>Active processing: State-of-the-art signal processing offers acomprehensive range of single- andmulti-pulse, FM and CW processingfor detection and tracking. Targetdetection, localization andclassification>P assive processing: LFATS featuresfull 100-to-2,000 Hz continuouswideband coverage. Broadband,DEMON and narrowband analyzers,torpedo alert and extendedtracking functions constitute asuite of passive tools to track andanalyze targets.>Playback mode: Playback isseamlessly integrated intopassive and active operation,enabling postanalysis of pre-recorded mission data and is a keycomponent to operator training.>Built-in test: Power-up, continuousbackground and operator-initiatedtest modes combine to boostsystem availability and accelerateoperational readiness.UNIQUE EXTENSION/RETRACTIONMECHANISM TRANSFORMS COMPACTTOW-BODY CONFIGURATION TO ALARGE-APERTURE MULTIDIRECTIONALTRANSMITTERDISPLAYS AND OPERATOR INTERFACES>State-of-the-art workstation-based operator machineinterface: Trackball, point-and-click control, pull-down menu function and parameter selection allows easy access to key information. >Displays: A strategic balance of multifunction displays,built on a modern OpenGL framework, offer flexible search, classification and geographic formats. Ground-stabilized, high-resolution color monitors capture details in the real-time processed sonar data. > B uilt-in operator aids: To simplify operation, LFATS provides recommended mode/parameter settings, automated range-of-day estimation and data history recall. >COTS hardware: LFATS incorporates a modular, expandable open architecture to accommodate future technology.L3Harrissellsht_LFATS© 2022 L3Harris Technologies, Inc. | 09/2022NON-EXPORT CONTROLLED - These item(s)/data have been reviewed in accordance with the InternationalTraffic in Arms Regulations (ITAR), 22 CFR part 120.33, and the Export Administration Regulations (EAR), 15 CFR 734(3)(b)(3), and may be released without export restrictions.L3Harris Technologies is an agile global aerospace and defense technology innovator, delivering end-to-endsolutions that meet customers’ mission-critical needs. The company provides advanced defense and commercial technologies across air, land, sea, space and cyber domains.t 818 367 0111 | f 818 364 2491 *******************WINCH AND HANDLINGSYSTEMSHIP ELECTRONICSTOWED SUBSYSTEMSONAR OPERATORCONSOLETRANSMIT POWERAMPLIFIER 1025 W. NASA Boulevard Melbourne, FL 32919SPECIFICATIONSOperating Modes Active, passive, test, playback, multi-staticSource Level 219 dB Omnidirectional, 222 dB Sector Steered Projector Elements 16 in 4 stavesTransmission Omnidirectional or by sector Operating Depth 15-to-300 m Survival Speed 30 knotsSize Winch & Handling Subsystem:180 in. x 138 in. x 84 in.(4.5 m x 3.5 m x 2.2 m)Sonar Operator Console:60 in. x 26 in. x 68 in.(1.52 m x 0.66 m x 1.73 m)Transmit Power Amplifier:42 in. x 28 in. x 68 in.(1.07 m x 0.71 m x 1.73 m)Weight Winch & Handling: 3,954 kg (8,717 lb.)Towed Subsystem: 678 kg (1,495 lb.)Ship Electronics: 928 kg (2,045 lb.)Platforms Frigates, corvettes, small patrol boats Receive ArrayConfiguration: Twin-lineNumber of channels: 48 per lineLength: 26.5 m (86.9 ft.)Array directivity: >18 dB @ 1,380 HzLFATS PROCESSINGActiveActive Band 1,200-to-1,00 HzProcessing CW, FM, wavetrain, multi-pulse matched filtering Pulse Lengths Range-dependent, .039 to 10 sec. max.FM Bandwidth 50, 100 and 300 HzTracking 20 auto and operator-initiated Displays PPI, bearing range, Doppler range, FM A-scan, geographic overlayRange Scale5, 10, 20, 40, and 80 kyd PassivePassive Band Continuous 100-to-2,000 HzProcessing Broadband, narrowband, ALI, DEMON and tracking Displays BTR, BFI, NALI, DEMON and LOFAR Tracking 20 auto and operator-initiatedCommonOwn-ship noise reduction, doppler nullification, directional audio。
Mechanical Engineering Reuse (continued)

Mechanical Engineering Reuse (continued) The concept of reuse in mechanical engineering is not merely a trend but a fundamental shift in design philosophy, driven by economic, environmental, and social imperatives. This approach challenges traditional linear models of production and consumption, advocating for a circular economy where resources are used and reused efficiently. The benefits of reuse extend far beyond mere cost savings, encompassing a range of advantages that contribute to a more sustainable and resilient future. One of the most compelling arguments for reuse is its potential to significantly reduce the environmental impact of manufacturing. By extending the life cycle of components and materials, we lessen the demand for virgin resources and mitigate the energy-intensive processes associated with their extraction and processing. This, in turn, contributes to a reduction in greenhouse gas emissions and minimizes the strain on our planet's ecosystems. Furthermore, embracing reuse encourages innovation in design and manufacturing processes. Engineers are challenged to develop components that are durable, easily disassembled, and adaptable for multiple applications. This shift in mindset fosters a culture of resourcefulness and encourages the exploration of novel approaches to product design and development. The economic benefits of reuse are equally significant. Reusing components can lead to substantial cost savings compared to manufacturing new parts. This is particularly advantageous in industries where high-value components are involved, such as aerospace or automotive manufacturing. Moreover, the reuse sector has the potential to create new jobs and stimulate economic growth in areas related to refurbishment, repair, and remanufacturing. However, the transition to a reuse-centric model in mechanical engineering is not without its challenges. Standardization of components and interfaces is crucial to ensure compatibility andinterchangeability across different products and applications. Additionally, robust systems for tracking, testing, and certifying reused components are necessary to guarantee their quality and reliability. Overcoming these hurdles requires collaborative efforts between industry stakeholders, policymakers, and research institutions. In conclusion, the increasing adoption of reuse in mechanical engineering signifies a paradigm shift towards a more sustainable andresource-efficient future. The benefits are multifaceted, ranging from environmental protection and economic advantages to fostering innovation and creating new employment opportunities. While challenges exist, concerted efforts to overcome them will pave the way for a circular economy where resources are valued and utilized to their fullest potential, ultimately contributing to a more resilient and sustainable future for all.。
Allegro层次原理图(模块reuse)设计流程

Module reuse1.在orcad中画好模块的原理图,设定好封装,做好drc,做好元件编号。
2.在annotate-->allegro reuse中,选中generate reuse module, renumber design forusing modules不选,选中unconditional,其它不选。
3.生成netlist.4.将netlist导入到allegro,布线,布局,若无rename等需要与orcad交互的动作,,选tools-->create modules生成mdd文件.mdd文件的文件名一定要定义为:DSN NAME_ROOT SCHEMATIC NAME.mdd。
DSN NAME为你定义的orcad中的dsn文件名,ROOT SCHEMATIC NAME是这个文件中的页名字。
这里若定义不对,在reuse时找不到mdd文件。
之后跳到第6步。
5.在orcad中back annotate,之后回到第2步。
6.模块制作完成。
使用生成的模块1.在新的orcad设计中,选place-->herarhical block,reference中填入BLK?(注意,这里不能用BLK是为了与原理图中的U?R?C?区别,保证BLK这个名字专用于moduel,不然在做完allegro后,rename 时,导回到orcad中出问题。
)在implementation type中选schematic view,在implementtation name中填入先前模块的页名称ROOT SCHEMATIC NAME,在path and file name中选择相应的dsn文件,之后在你的原理图中出现一个block.2.继续其它设计(包括放入其它block),当你双击任一个BLOCK时会发现都将进入到模块原理图中,注意每个模块位号现在还是一样的。
之后开始控制位号,为了区别各个模块的位号,可以控制其各个模块的REF区间在annotate-->allegro reuse中,选中,renumber design for using modules,选中incremental,选中do not change the page number,选中select modules to mark for框里的内容。
e501

skid depth of 0.385in.(9.8mm)maximum and shall have anunder-tread thickness of 0.10in.(2.5mm).6.1.4Wear Indicators —There shall be six rows of treadwear indicators spaced uniformly around the tire circumference and directly across the full tread width in all six grooves.These tread wear indicators shall be 0.063in.(1.6mm)deepand approximately 0.50in.(12.7mm)long.A visual wear guideline shall be located on the shoulder of the tire 0.22in.(5.6mm)Marking on TireG 78–15Standard Pavement Test Tire—Not for General Highway UseASTM Designation:E 501Manufacturer’s Name or TrademarkRim:15x6JJFIG.1TestTireFIG.2Tire Section,Including Inflated TireDimensionsfrom the tread surface as shown in Fig.2.7.Workmanship 7.1Tires shall be free of defects in workmanship and material.8.Test Methods 8.1Tensile Sheet Cure —Practice D 3182.8.2Modulus (300%)—Test Methods D 412.8.3Tensile Sheet Durometer —Test Method D 2240,using a Type A Shore durometer.8.4Restored Energy (Rebound or Resilience)—Test Method D 1054.8.5Specific Gravity —Test Methods D 297.8.6Tensile Strength —Test Methods D 412.8.7Elongation —Test Methods D 412.8.8Tire Tread Durometer —Test Method D 2240,in addi-tion to the following specific procedures:8.8.1Use a Type A durometer.(A 0.5-in.(12.7-mm)diam-eter presser foot,Shore,code XAHAF is recommended.)8.8.2The durometer shall be calibrated at a reading of 60hardness.8.8.3Condition the tire and durometer to equilibrium at 73.463.6°F (2362°C)before determining tread hardness.8.8.4The tire tread hardness is to be determined by aver-aging at least one set of six readings.A set is one reading taken in the center of each rib,excluding the center rib.It is recommended that additional sets of readings be taken around the tread circumference.8.8.5Apply presser foot to the tire tread as rapidly as possible without shock,keeping the foot parallel to the tread surface.Apply just sufficient pressure to obtain firm contact between presser foot and tire tread surface.Read the durometer scale within 1s after presser foot is in contact with the tire tread,but after initial maximum transient which may occur immediately after contact is made.9.Certification 9.1Tires are to be inflated and measured prior to shipment.Upon request,the manufacturer shall furnish the purchasercertification that the test tire meets this specification.9.2All tires under certification shall be subject to themanufacturer’s normal variation.10.Packaging and Preservation10.1The tires should be kept dry under ordinary atmo-spheric conditions in subdued light,70625°F (21613.8°C).Tires should not be stored near electric motors,welders,orother ozone generating equipment.11.Recommendations for Tire Use and OperationalRequirements11.1The tire is for skid testing only and is not designed forgeneral highway service.Necessary transport of test equipmentshould be on commercial tires.11.2A new tire break-in of 200miles (320km)minimumshould be made on tires by the purchaser before using the tirefor testing.11.3The tire shall be operated with not less than 24psi (165kPa)inflation.11.4The recommended static test load on the tire shall be1085lbf (4826N),with loading to a maximum of 1380lbf(6138N)permissible,at 24psi (165kPa)inflation.11.5When irregular wear or damage results from tests orwhen the remaining groove depth in any groove is 0.165in.(4.2mm)or less,the use of the tire as a standard test tire shallbe discontinued.11.6Caution —Measured friction force and skid number(SN)may be influenced by tire groove depth,or tread hardness,or both.The magnitude of this dependence is a function of thewater depth,pavement characteristics,test speed,and tireaging effects.The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this ers of this standard are expressly advised that determination of the validity of any such patent rights,and the risk of infringement of such rights,are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every five years and if not revised,either reapproved or withdrawn.Your comments are invited either for revision of this standard or for additional standards and should be addressed to ASTM Headquarters.Your comments will receive careful consideration at a meeting of the responsible technical committee,which you may attend.If you feel that your comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,at the address shown below.TABLE 1Compounding of Oil-Extended Styrene-ButadieneBlend Rubber (SBR)TreadCompoundParts by Mass SBR 1712A89.38CB1J252B48.12N347C75.00Highly aromatic oil9.00Zinc oxide3.00Stearic acid2.00Santoflex 13D2.00Paraffinic wax2.00Santocure NS E1.10DPG F0.10Sulfur1.80AStyrene-butadiene rubber (23.5%styrene)37.5parts of high-aromatic oil.B Cis-polybutadiene with 37.5parts of high-aromatic oil.(CB441has beendetermined to be equivalent).C N347Carbon Black,see ClassificationD 1765.D Santoflex 13,dimethyl butylphenyl phenylenediamine.E Santocure NS,butyl benzothiazole sulfenamide.F DPG,diphenyl guanidine.TABLE 2Physical Requirements of Tread Compound Tensile sheet cure,min at 300°F (149°C)30300%modulus,psi (MPa)8006200(5.561.4)Tensile sheet durometer 5862Restored energy (rebound or resilience)4662Specific gravity 1.136.02Tensile strength,min,psi (MPa)2000(13.8)Elongation,min,%500Tire tread durometer 5862This standard is copyrighted by ASTM,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA19428-2959,United States. Individual reprints(single or multiple copies)of this standard may be obtained by contacting ASTM at the above address or at610-832-9585(phone),610-832-9555(fax),or service@(e-mail);or through the ASTM website().。
测绘专业英语考试试题
滁州学院2010 /2011学年度第2学期期末考试试卷测绘工程专业(本科) 2008 级《测绘专业英语》试卷(时间90分钟)一、 词汇或短语翻译(英译汉)(每小题1分,共20分) 1. settlement observation 沉陷观测2. deflection observation 挠度观测3. property line survey 建筑红线放样4. cross-section survey 横断面测量5. geoid undulation 大地水准面差距 或 大地水准面高6. orthometric height 正高7. very long baseline interferometry 甚长基线干涉测量 8. least-squares adjustment 最小二乘平差9. variance-covariance matrix 方差-协方差矩阵 10. normal distribution 正态分布11. index error of vertical circle 竖盘指标差 12. optical plummet 光学对中器 13. connecting traverse 附合导线 14. grid bearing 坐标方位角 15. zenith distance 天顶距16. hydrographic survey 水道测量17. Geodetic Reference System 1980 1980大地测量参考系统二、词汇或短语翻译(汉译英)(每小题1分,共20分)1. 工程测量 engineering survey2. 施工放样 construction layout or setting-out survey3. 竣工测量 as-built survey4. 大地高 geodetic survey5. 参考椭球 reference ellipsoid 参考椭球6. 卫星激光测距 satellite laser ranging(SLR)7. 重力场 gravity field8. 测量平差 adjustment of observation or survey adjustment 9. 多余观测 redundant observation10. 点位中误差 mean square error of a point11. 粗差检验 gross error detection12. 自动目标识别 automatic target recognition(ATR) 13. 几何水准测量 direct leveling or spirit leveling 14. 水准尺 level rod15. 平面控制网 horizontal control network 16. 控制测量 control survey17. 地籍测量 cadastral surveying or property survey三、句子翻译(每小题×分,共×分)1. Surveying is the art of making such measurements of the relative positions of points on the surface of the earth that, on drawing them to scale, natural and artificial features may be exhibited in their correct horizontal or vertical relationships.测量是测定地面上各点的相对位置,以便根据它们之间正确的水平或竖直关系,按比例展示出天然地物和人工地物的一种技术。
post-disciplinary design -回复
post-disciplinary design -回复Postdisciplinary design refers to an approach in design thinking that goes beyond the traditional disciplinary boundaries and embraces cross-disciplinary collaboration. It encourages designers to explore new ways of problem-solving and promotes innovation through the integration of various knowledge areas. In this article, we will delve into the concept of postdisciplinary design and discuss its significance in today's complex and interconnected world.First and foremost, it is essential to understand the context in which postdisciplinary design emerges. We are living in an era of rapid change and increasing complexity, with global challenges requiring multifaceted solutions. The traditional disciplinary approach has its merits, but it often falls short in addressing complex problems that require a comprehensive understanding of multiple perspectives. Therefore, postdisciplinary design offers an alternative framework that encourages designers to collaborate across disciplines, building on each other's expertise to tackle these challenges effectively.The key principle of postdisciplinary design is the integration ofdiverse knowledge areas. By involving individuals from different backgrounds, such as design, engineering, anthropology, psychology, and sociology, a broader range of expertise and perspectives can be brought to the table. This collaborative approach helps in generating innovative solutions that are not limited by a single discipline's conventional thinking. For example, when designing a new product, a postdisciplinary design team may include engineers for technical expertise, designers for aesthetics, anthropologists for understanding cultural context, and psychologists for user experience considerations. By combining these various perspectives, the team can create a product that is both functional and meaningful to its intended users.Another significant aspect of postdisciplinary design is the breaking down of silos and fostering interdisciplinary communication. Traditionally, disciplines have operated independently with limited interaction with other fields. Postdisciplinary design challenges this conventional approach by encouraging a free flow of ideas and knowledge exchange between disciplines. Through open dialogue and collaboration, designers can gain a deeper understanding of the interconnectedness of different knowledge areas and their potential for synergy. Thiscollaborative environment allows for creativity and innovation to flourish as diverse perspectives come together to explore new possibilities.Furthermore, postdisciplinary design promotes a holistic view of problem-solving. By considering the broader context and systems in which a problem exists, designers can identify and address underlying causes rather than merely treating symptoms. This holistic approach aims to create lasting and sustainable solutions that go beyond surface-level fixes. For instance, a postdisciplinary design team working on urban planning may consider not only the physical infrastructure but also sociocultural factors, environmental impact, and economic considerations to develop a comprehensive and integrated plan for urban development.Additionally, postdisciplinary design enables designers to navigate the complexity of the modern world. The interconnected nature of today's challenges necessitates a multidimensional understanding that cannot be achieved through isolated disciplinary approaches. Postdisciplinary design equips designers with a broader perspective, enabling them to identify patterns, connections, and interdependencies that may have otherwise been overlooked. Thiscomprehensive understanding allows for the development of innovative and effective solutions that address the root causes of complex problems.In conclusion, postdisciplinary design offers a fresh and innovative approach to problem-solving in an increasingly complex world. By embracing cross-disciplinary collaboration, integrating diverse knowledge areas, fostering interdisciplinary communication, promoting holistic thinking, and navigating complexity, postdisciplinary design enables designers to overcome the limitations of traditional disciplinary boundaries. In doing so, designers can develop more comprehensive, sustainable, and impactful solutions that address the interconnected challenges we face today. Embracing postdisciplinary design is essential for driving meaningful innovation and tackling the complex problems of our time.。
ipd集成产品开发常用名词解释
ipd集成产品开发常用名词解释下载提示:该文档是本店铺精心编制而成的,希望大家下载后,能够帮助大家解决实际问题。
文档下载后可定制修改,请根据实际需要进行调整和使用,谢谢!本店铺为大家提供各种类型的实用资料,如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等,想了解不同资料格式和写法,敬请关注!Download tips: This document is carefully compiled by this editor. I hope that after you download it, it can help you solve practical problems. The document can be customized and modified after downloading, please adjust and use it according to actual needs, thank you! In addition, this shop provides you with various types of practical materials, such as educational essays, diary appreciation, sentence excerpts, ancient poems, classic articles, topic composition, work summary, word parsing, copy excerpts, other materials and so on, want to know different data formats and writing methods, please pay attention!IPD集成产品开发常用名词解释在集成产品开发(IPD)过程中,常常会涉及到许多专业术语。
集成电路设计专业名词解释汇总英文版
集成电路设计专业名词解释汇总英文版English:"Integrated Circuit (IC) Design: The process of creating a blueprint for the manufacturing of integrated circuits, such as microchips, using specialized software and tools. IC design involves several stages, including architectural design, logic design, circuit design, physical design, and verification. Architectural design establishes the high-level functionality and organization of the circuit, determining the overall structure and major components. Logic design involves the translation of the architectural design into a set of logic equations and functional blocks, specifying the logical operation of the circuit. Circuit design focuses on the actual implementation of the logic design, defining the electrical connections and components needed to achieve the desired functionality. Physical design, also known as layout design, involves the placement and routing of the components to ensure proper functioning and optimal performance, considering factors such as power consumption, signal integrity, and manufacturing constraints. Verification is the process of ensuring that the designed circuit meets the specified requirements and functions correctly under various conditions. Field-ProgrammableGate Array (FPGA): An integrated circuit that can be configured by the user after manufacturing. FPGAs contain an array of programmable logic blocks and interconnects, allowing for the implementation of various digital circuits. Hardware Description Language (HDL): A specialized programming language used to describe the behavior and structure of electronic circuits, facilitating the design and simulation of digital systems. Common HDLs include Verilog and VHDL. Electronic Design Automation (EDA) Tools: Software tools used in the design of electronic systems, including integrated circuits. EDA tools automate various stages of the design process, from schematic capture and simulation to layout and verification. Some popular EDA tools include Cadence Virtuoso, Synopsys Design Compiler, and Mentor Graphics Calibre. Very-Large-Scale Integration (VLSI): The process of integrating thousands or millions of transistors into a single chip. VLSI technology enables the creation of complex, high-performance integrated circuits, such as microprocessors and memory chips, by packing a large number of transistors into a small area. Application-Specific Integrated Circuit (ASIC): An integrated circuit customized for a particular application or purpose. Unlike FPGAs, ASICs are manufactured to perform a specific function, offering advantages in terms of performance,power consumption, and cost for mass production. ASIC design involves the development of custom circuitry optimized for a particular application, often using standard cell libraries and specialized design methodologies."中文翻译:"集成电路(IC)设计:是指利用专业软件和工具创建集成电路(如微芯片)制造的蓝图的过程。
- 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。
Corresponding author. Tel.: +86 571 88206681x524; fax: +86 571 88206680. E-mail addresses: baijing@ (J. Bai), smgao@ (S. Gao), tangweihua@ (W. Tang), ysliu@ (Y. Liu), guosong@ (S. Guo). 0010-4485/$ – see front matter © 2010 Elsevier Ltd. All rights reserved. doi:10.1016/j.cad.2010.07.002
Jing Bai a,b , Shuming Gao a,∗ , Weihua Tang a , Yusheng Liu a , Song Guo a
a b
State Key Lab. of CAD&CG, Zhejiang University, 388 Yuhangtang Road, Hangzhou 310058, China Department of Computer Science and Engineering, North University for Ethnics, Yinchuan 750021, China
articl huge number of 3D CAD models is generated each year, retrieval of 3D CAD models is becoming more and more important for achieving design reuse. However, the existing methods for partial retrieval of 3D CAD models are very few and far from the requirements of design reuse. In this paper, we present an approach to partial retrieval of 3D CAD models for design reuse. The criteria for determining whether a subpart of 3D CAD models is reusable for design is defined first. Based on the criteria defined, all the design reusable subparts involved in the 3D CAD models in the library are automatically extracted and stored in the library as reference models. Moreover, each design reusable subpart in the library is represented by all its local matching regions in a hierarchical way so as to support multi-mode partial retrieval. In our approach, three partial retrieval modes including normal retrieval, exact retrieval and relaxed retrieval are defined to meet various partial retrieval requirements of design reuse such as the incomplete and vague queries during the early design stage. And the multi-mode partial retrieval is achieved by performing multi-mode matching and similarity assessment between the query and the design reusable subparts in the library indexed by bitmap. Experimental results are presented to demonstrate the effectiveness of the approach. © 2010 Elsevier Ltd. All rights reserved.
Computer-Aided Design 42 (2010) 1069–1084
Contents lists available at ScienceDirect
Computer-Aided Design
journal homepage: /locate/cad
Design reuse oriented partial retrieval of CAD models
∗
model (Fig. 1(d)) searched out by an incomplete query (Fig. 1(b)) and completed the design. In recent years, the research on PR of geometric models has been paid more and more attention, and several methods have been proposed. However, most of them cannot meet the requirements of design reuse. One reason is that, the retrieval mechanisms of these methods find all models with similar subparts to the query but do not check whether these subparts are reusable for designs or not. In this way, the retrieved CAD models are usually not available for reuse. In fact, as pointed out by [3], one of the big challenges for reuse oriented retrieval is how to make sure the retrieved CAD models are reusable. Another reason is that, since current methods normally perform rigid matching between subparts, they cannot effectively support the PR with incomplete (not complete in structure) and vague (not accurate in geometry) queries that is crucial to design reuse. As pointed out by [4], the designer in the early design stage often has just an incomplete and fuzzy idea, making it difficult to formulate a complete and concise query. Therefore, the PR for design reuse should allow incomplete and vague queries. Based on the solid modeling theory, graph theory and information retrieval theory, this paper presents a design reuse oriented PR method for feature-based CAD models, which is intended to solve the difficulties described above. The method extracts reusable subparts of CAD models as reference subparts, making sure that the retrieved subparts are not only similar to
Article history: Received 14 September 2009 Accepted 13 July 2010 Keywords: Partial retrieval CAD model Design reuse Multi-mode Reusable subpart
1. Introduction Wide applications of 3D CAD systems in industries have generated a huge number of digital 3D CAD models. Reuse of these models and the knowledge embedded is becoming an important way to facilitate new designs [1]. Many methods for 3D CAD models retrieval have been proposed to help users efficiently locate the desired models for reuse. However, most of these methods focus only on global retrieval instead of partial retrieval (PR). In fact, PR is very important, especially for design reuse [2]. For engineering applications, many common subparts of different 3D CAD models are likely to be reusable for design. Here, a subpart of a 3D CAD model refers to a part of the model that does not cover the whole model but has certain semantics. And we define the subpart that consists of a set of simple features and may appear in different 3D CAD models as a reusable subpart in this work. Reuse of them or the knowledge embedded could effectively inspire designs and speed up the design process. Fig. 1 shows an exemplar process of design reuse based on PR: to design a door (Fig. 1(e)), the designer started with a simple base (Fig. 1(a)), reused the desired hinge