Top-quark pair + 1-jet production at next-to-leading order QCD
杜克物理

ResearchAccelerator PhysicsTom Katsouleas: use of plasmas as novel particle accelerators and light sources Ying Wu: nonlinear dynamics of charged particle beams, coherent radiation sources, and the development of novel accelerators and light sourcesBiological PhysicsNick Buchler: Molecular mechanisms and the evolution of switches and oscillators in gene networks; systems biology; comparative genomicsGlenn Edwards: Interests include 1) the transduction of light to vibrations to heat and pressure in biological systems and 2) how biology harnesses physical mechanisms during pattern formation in early Drosophila development.Gleb Finkelstein: Electronic transport in carbon nanotubes and graphene; Inorganic nanostructures based on self-assembled DNA scaffolds.Henry Greenside: Theoretical neurobiology in collaboration with Dr. Richard Mooney's experimental group on birdsong.Calvin Howell: Measurement of the neutron-neutron scattering length, carbon and nitrogen accumulation and translocation in plants.Joshua Socolar: Organization and function of complex dynamical networks, especially biological networks, including electronic circuits and social interaction networksWarren Warren: novel pulsed techniques, using controlled radiation fields to alter dynamics; ultrafast laser spectroscopy or nuclear magnetic resonanceCondensed Matter PhysicsHarold Baranger: Theory of quantum phenomena at the nanometer scale;many-body effects in quantum dots and wires; conduction through single molecules; quantum computing; quantum phase transitionsRobert Behringer: Experiments on instabilities and pattern formation in fluids; flow, jamming, and stress patterns in granular materials.David Beratan: molecular underpinnings of energy harvesting and charge transport in biology; the mechanism of solar energy capture and conversion in man-made structuresShailesh Chandrasekharan: Theoretical studies of quantum phase transitions using quantum Monte Carlo methods; lattice QCDAlbert Chang: Experiments on quantum transport at low temperature;one-dimensional superconductivity; dilute magnetic semiconductor quantum dots; Hall probe scanning.Patrick Charbonneau: in- and out-of-equilibrium dynamical properties ofself-assembly. Important phenomena, such as colloidal microphase formation, protein aggregation.Stefano Curtarolo: Nanoscale/microscale computing systems & Quantum Information.Gleb Finkelstein: Experiments on quantum transport at low temperature; carbon nanotubes; Kondo effect; cryogenic scanning microscopy; self-assembled DNA templates.Jianfeng Lu: Mathematical analysis and algorithm development for problems from computational physics, theoretical chemistry, material sciences and others. Maiken H. Mikkelsen: Experiments in Nanophysics & Condensed Matter Physics Richard Palmer: Theoretical models of learning and memory in neural networks; glassy dynamics in random systems with frustrated interactions.Joshua Socolar: Theory of dynamics of complex networks; Modeling of gene regulatory networks; Structure formation in colloidal systems; Tiling theory and nonperiodic long-range order.David Smith: theory, simulation and characterization of unique electromagnetic structures, including photonic crystals and metamaterialsStephen Teitsworth: Experiments on nonlinear dynamics of currents in semiconductors.Weitao Yang: developing methods for quantum mechanical calculations of large systems and carrying out quantum mechanical simulations of biological systems and nanostructuresHigh Energy PhysicsAyana Arce: Searches for top quarks produced in massive particle decays, Jet substructure observable reconstruction, ATLAS detector simulation software frameworkAlfred T. Goshaw: Study of Nature's most massive particles, the W and Z bosons (carriers of the weak force) and the top quark.Ashutosh Kotwal: Experimental elementary particle physics; instrumentation, Precisely measure the mass of the W boson, which is sensitive to the quant um mechanical effects of new particles or forces.Mark Kruse: Higgs boson, production of vector boson pairs, andmodel-independent analysis techniques for new particle searches.Seog Oh: High mass di-lepton search, WW and WZ resonance search, A SUSY particle search, HEP detector R&DKate Scholberg: Experimental particle physics and particle astrophysics; neutrino physics with beam, atmospheric and supernova neutrinos (Super-K, T2K, LBNE, HALO, SNEWS)Chris Walter: Experimental Particle Physics, Neutrino Physics,Particle-Astrophysics, Unification and CP ViolationImaging and Medical PhysicsJames T. Dobbins III: advanced imaging applications to improve diagnostic accuracy in clinical imaging, scientific assessment of image quality, developing lower cost imaging for the developing worldBastian Driehuy: developing and applying hyperpolarized gases to enable fundamentally new applications in MRIAlan Johnson: engineering physics required to extend the resolution of MR imaging and in a broad range of applications in the basic sciencesEhsan Samei: design and utilization of advanced imaging techniques aimed to achieve optimum interpretive, quantitative, and molecular performanceWarren Warren: novel pulsed techniques, using controlled radiation fields to alter dynamics; ultrafast laser spectroscopy or nuclear magnetic resonanceNonlinear and Complex SystemsThe Center for Nonlinear and Complex Systems (CNCS) is an interdisciplinar y University-wide organization that fosters research and teaching of nonlinear dynamics, chaos, pattern formation and complex nonlinear systems with many degrees of freedom.Robert Behringer: Experiments on instabilities and pattern formation in fluids; flow, jamming, and stress patterns in granular materials.Patrick Charbonneau: in- and out-of-equilibrium dynamical properties ofself-assembly. Important phenomena, such as colloidal microphase formation, protein aggregation.Henry Greenside: Theory and simulations of spatiotemporal patterns in fluids; synchronization and correlations in neuronal activity associated with bird song. Daniel Gauthier: Experiments on networks of chaotic elements; generation and control of high speed chaos in electronic and optical systems; electrodynamics of cardiac tissue and the onset of fibrillation.Jian-Guo Liu: Applied mathematics, nonlinear dynamics, complex system, fluid dynamics, computational sciencesRichard Palmer: Theoretical models of learning and memory in neural networks; glassy dynamics in random systems with frustrated interactions.Joshua Socolar: Theory of dynamics of random networks with applications to gene regulation; stress patterns in granular materials; stabilization of periodic orbits in chaotic systems.Stephen Teitsworth: Experiments on nonlinear dynamics of currents in semiconductors.Ying Wu: nonlinear dynamics of charged particle beams, coherent radiation sources, and the development of novel accelerators and light sourcesTom Katsouleas: use of plasmas as novel particle accelerators and light sourcesExperimental Nuclear PhysicsThe Duke physics department is the host of the Triangle Universities Nuclear Laboratory consisting of three experimental facilities: LENA, FN tandem Van de Graff, and The High Intensity Gamma Source (HIGS) at the Free Electron Laser Laboratory.Mohammad Ahmed: Study of few nucleon systems with hadronic and gamma-ray probes.Phillip Barbeau: Experimental Nuclear & Particle Astro-Physics, Double Beta Decay, Neutrinos and Dark MatterHaiyan Gao: Neutron EDM, Precision measurement of proton charge radius, Polarized Compton scattering, neutron and proton transversity, search for phi-N bound state, polarized photodisintegration of 3HeCalvin Howell: quantum chromodynamics (QCD) description of structure and reactions of few-nucleon systems, Big Bang and explosive nucleosynthesis, and applications of nuclear physics in biology, medicine and national security Werner Tornow: weak-interaction physics, especially in double-beta decay studies and in neutrino oscillation physics using large scale detectors at the Kamland project in Japan.Henry Weller: Using radiative capture reactions induced by polarized beams of protons and deuterons to study nuclear systemsYing Wu: nonlinear dynamics of charged particle beams, coherent radiation sources, and the development of novel accelerators and light sourcesTheoretical Nuclear and Particle PhysicsSteffen A. Bass: Physics of the Quark-Gluon-Plasma (QGP) and ultra-relativistic heavy-ion collisions used to create such a QGP under controlled laboratory conditions.Shailesh Chandrasekharan: Quantum Critical Behavior in Fermion Systems, Using the generalized fermion bag algorithm, Applications to Graphene and Unitary Fermi Gas.Thomas Mehen: Quantum Chromodynamics (QCD) and the application of effective field theory to hadronic physics.Berndt Müller: Nuclear matter at extreme energy density; Quantum chromodynamics.Roxanne P. Springer: Weak interactions (the force responsible for nuclear beta decay) and quantum chromodynamics (QCD, the force that binds quarks into hadrons).Geometry and Theoretical PhysicsPaul Aspinwall: String theory is hoped to provide a theory of all fundamental physics encompassing both quantum mechanics and general relativity.Hubert Bray: geometric analysis with applications to general relativity and the large-scale geometry of spacetimes.Ronen Plesser: String Theory, the most ambitious attempt yet at a comprehensive theo ry of the fundamental structure of the universe.Arlie Petters: problems connected to the interplay of gravity and light (gravitational lensing, general relativity, astrophysics, cosmology)Quantum Optics/Ultra-cold atomsDaniel Gauthier: Topics in the fields of nonlinear and quantum optics, and nonlinear dynamical systems.Jungsang Kim: Quantum Information & Integrated Nanoscale SystemsMaiken H. Mikkelsen: Experiments in Nanophysics & Condensed Matter Physics∙Duke University Department of Physics∙Physics Bldg., Science Dr.∙Box 90305∙Durham, NC 27708∙Phone: 919-660-2500∙Fax: 919-660-2525NetID LoginE-Newsletter Sign UpSign up to receive a monthly E-Newsletter or an Annual print Newsletter and keep up with the Physics Department’s scholarly activities∙∙∙∙∙DUKE UNIVERSITY∙GIVING @ DUKE∙WORKING ENVIRONMENT POLICY。
Navien 无底热水器商品说明书

T emperature rise (maximum output)T emprise (°F)NEW 150S GPM 180 series GPM 210 series GPM 240 series GPM 35 6.88.410.111.240 5.97.48.89.845 5.3 6.57.88.750 4.8 5.97.17.855 4.3 5.3 6.47.160 4.0 4.9 5.9 6.565 3.7 4.5 5.4 6.070 3.4 4.2 5.0 5.675 3.2 3.9 4.7 5.280 3.0 3.7 4.4 4.985 2.8 3.5 4.2 4.690 2.6 3.3 3.9 4.4100 2.4 2.9 3.5 3.9110 2.2 2.7 3.2 3.6120 2.0 2.5 2.9 3.3130 1.8 2.3 2.7 3.01401.72.12.52.8DHW capacityModels Natural gas (BTU/H)Propane gas (BTU/H)NEW NPE-150S18,000–120,00018,000–120,000NPE-180 A/S series 15,000–150,00015,000–150,000NPE-210 A/S series 19,900–180,00019,900–180,000NPE-240 A/S series 19,900–199,90019,900–199,900Operating costNavien tankless 175 therms $191*Other tankless 209 therms $228*50 gallon tank269 therms$293** B ased on Energy Guide cost estimates using$1.09 per therm of natural gas. Cost is in US dollars.WarrantyApplicationLabor Parts Heat exchanger ResidentialStandard or controlled recirculation 21 year 5 years 15 years Uncontrolled recirculation 31 year 3 years 5 years Commercial or Combi 1Standard or controlled recirculation2 for units produced on or after Jan. 1, 20161 year5 years8 yearsStandard or controlled recirculation 2 for unitsproduced before Jan. 1, 2016 1 year 3 years 10 years Uncontrolled recirculation 31 year3 years3 years1Combi refers to a combination potable water and space heating application. Water heaters cannot be used in space heating only applications.2Controlled-Recirculation: Recirculation through the water heater is controlled by either the water heater or an external aquastat.3Uncontrolled-Recirculation: External pumps configured to circulate continuously through the water heater are subject to the uncontrolled recirculation warranty terms. An aquastat is the minimum pump control requirement for DHW or storage tank recirculation in order to maintain the full controlled recirculation warranty.For complete details please refer to the full warranty at .Product featuresTankless Water HeatersNavien certification summary Note: all NPE Models are field convertible from NG to LP gas.Product ApprovalsEfficiency Ratings*Annual Energy Consumption*(Residential)Model CSA NSF (Standard 5)Low Lead (<0.25%)SCAQMD 1146.2 (NOx, <20ppm)AHRI NumberEnergyStar Energy Factor (EF)Uniform Energy Factor(UEF)Max GPM (67°F Rise)Natural Gas (Therms/Year)Propane (Gallons/Year)Estimated OperatingCost**NPE-180A-NG Yes Yes Yes Yes 6678380Yes 0.970.96 4.3176$192NPE-180A-LPG Yes Yes Yes Yes 6678380Yes 0.970.96 4.3193$465NPE-210A-NG Yes Yes Yes Yes 6678381Yes 0.970.96 5.0176$192NPE-210A-LPG Yes Yes Yes Yes 6678381Yes 0.970.96 5.0193$465NPE-240A-NG Yes Yes Yes Yes 6678382Yes 0.970.96 5.6176$192NPE-240A-LPG Yes Yes Yes Yes 6678382Yes 0.970.96 5.6193$465NPE-150S-NG Yes Yes Yes Yes 8235610Yes 0.970.96 3.2115$125NPE-150S-LPG Yes Yes Yes Yes 8235610Yes 0.970.96 3.2126$304NPE-180S-NG Yes Yes Yes Yes 6478771Yes 0.990.97 4.2175$191NPE-180S-LPG Yes Yes Yes Yes 6478771Yes 0.990.97 4.2192$463NPE-210S-NG Yes Yes Yes Yes 6478772Yes 0.990.97 5.2175$191NPE-210S-LPG Yes Yes Yes Yes 6478772Yes 0.990.97 5.2192$463NPE-240S-NG Yes Yes Yes Yes 6478773Yes 0.990.97 5.7175$191NPE-240S-LPGYesYesYesYes6478773Yes0.990.975.7192$463*Based on U.S. Department of Energy (DOE) test procedures. **Based on a national average natural gas cost of $1.09/therm, propane cost of $2.41/gallon.COMFORT FLOWPUMP BUFFER TANK&NG LPFIELD GAS ORCONVERTIBLEDUAL HEAT EXCHANGERSSTAINLESSSTEEL CASCADE 16GAS 24 FT12CAPABILITYUP TO2”PVC 60 F TVENTINGUP TO2" PVC venting up to 60'1/2" gas pipe capabilityup to 24' (subject to local code)Cascade up to 16 units without external control boxDual stainless steel heat exchangersField gas convertibilityComfort Flo Exclusive recirculationmode available on“A ” ModelsU.S. Green Building Council LEED PointsWater heaterLocation Recirculation 1 Point2 Points3 PointsLower HERS home index scoreQuick FactsNavien Inc.20 Goodyear, Irvine, CA 92618800-519-8794, ItemModelNPE-150S NPE-180ANPE-180SNPE-210ANPE-210SNPE-240ANPE-240SHeat capacity (input)Natural gas 18,000–120,000 (BTU/H)15,000–150,000 (BTU/H)19,900–180,000 (BTU/H)19,900–199,900 (BTU/H)Propane gasEfficiency ratingsUEF (NG & LP)0.960.960.970.960.970.960.97EF (Canada NG & LP)0.970.970.990.970.990.970.99Flow rate (DHW)35°F (19°C) temp rise 6.8 GPM(26 L/m)8.4 GPM (32 L/m)10.1 GPM (38 L/m)11.2 GPM (42 L/m)45°F (25°C) temp rise 5.3 GPM(20 L/m)6.5 GPM (25 L/m)7.8 GPM (30 L/m)8.7 GPM (33 L/m)67°F (36°C) temp rise3.2 GPM (12 L/m)4.3 GPM (16 L/m) 4.2 GPM (16 L/m)5.0 GPM (19 L/m) 5.2 GPM (20 L/m) 5.6 GPM (21 L/m) 5.7 GPM(22 L/m)Dimensions 17.3"W x 27.4"H x 13.2"D Weight 55lbs (25kg)75lbs (34kg)67lbs (30kg)82lbs (37kg)75lbs (34kg)82lbs (37kg)75lbs (34kg)Installation type Indoor or outdoor wall-hung Venting type Forced draft direct vent Ignition Electronic ignition Water pressure 15–150 PSI Natural gas supply pressure(from source)3.5"–10.5" WCPropane gas supply pressure(from source)8"–13" WCNatural gas manifold pressure (min-max)-0.04" WC to-0.38" WC -0.04" WC to -0.84" WC -0.05" WC to -0.36" WC -0.05" WC to -0.58" WCPropane gas manifold pressure (min-max)-0.04" WC to-0.42" WC -0.05" WC to -0.50" WC -0.10" WC to -0.66" WC -0.10" WC to -0.78" WCMinimum flow rate 0.5 GPM (1.9 L/m), < 0.01 GPM (0.04 L/m) option for “A ” models*ConnectionsizesCold water inlet 3/4" NPTHot water outlet 3/4" NPTGas inlet 3/4" NPT Powersupply Main supply 120V AC, 60 HzMaximum power consumption 200W (max 2A), 350W (max 4A) with external pump connected MaterialsCasing Cold rolled carbon steelHeat exchangers Primary heat exchangers: stainless steel, secondary heat exchangers: stainless steel Venting Exhaust 2" or 3" PVC, CPVC, PP , SS / 2" or 3" special gas vent type BH 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MediaGXXX001329Plumb Easy Valve 3/4” with Relief Valve Designed to work with pipe cover 30012581APipe Cover NPE Series 30012634A Use withIsolation Valves 30012581AHotButton ™ Control KitPZZZ-00046Wall Plate GXXX001427Push Button GXXX001426Ready-Link ® Rack Base (V2)GFFM-KDIZUS-003Ready-Link ® Rack Add-on (V2)GFFM-KDIZUS-004DimensionsAccessoriesSpecifications274" (695m m )288" (731m m )3" (77m m )6.7" (170mm)4.5" (115mm)04" (10m m )1.5" (38mm)14.3" (364mm)26" (67m m )132" (336m m ) (N P E -210A /240A )12" (306m m ) (N P E -180A )2.3"(60mm)3.0"(77mm)8.3"(212mm)17.3" (440mm )24" (61m m )24" (61m m )A B C F D GE Air IntakeΦ 2"Exhaust Gas VentΦ 2"Φ 3/4"Hot Water OutletΦ 3/4"Recirculation Inlet (A model)Φ 3/4"Cold Water Inlet Φ 3/4"Gas InletΦ 1/2"Condensate OutletConnection SizeConnection SizeABCF DG ENPE-QF002-1810©2018 Navien Inc.*Available for “A ” models configured in an optional ComfortFlow recirculation mode. 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探索新物质形态——夸克胶子等离子体

● regeneration rate is determined by the detailed balance 21
RHIC的实验结果验证了我们的理论预言
QM2011 France
RHIC
QM2011
LHC
LHC将测量我们预言的非零椭圆流 (ALICE很快将有结果)
最深层次的物质状态-夸克物质
庄鹏飞(zhuangpf@)
● 物质的第五态 ● QCD超导与超流 ● 相对论重离子碰撞
中国科学技术大学,2012,06,08
物质科学包含物质的结构和状态
最深层次的结构:夸克 2004 诺贝尔物理奖
David J. Gross H. David Politzer Frank Wilczek
标时是反对称的,吸引相互作用。在单胶
子交换的层次就使得两个夸克可以配对,
有Diquark凝聚,形成色超导 (高温超导) 。
由于色对称性自发破缺,胶子获得质量。
色电中性的无能隙色超导态
黄梅,何联毅,金猛,赵维勤,庄:2003-2012
稳定的超导态必须是(电,色)荷中性的:
Qie Nie 0,
最深层次的物质状态夸克物质最深层次的物质状态夸克物质庄鹏飞庄鹏飞zhuangpfmailtsinghuaeducnzhuangpfmailtsinghuaeducn物质的第五态物质的第五态qcdqcd超导与超流超导与超流相对论重离子碰撞相对论重离子碰撞中国科学技术大学中国科学技术大学2012060820120608物质科学包含物质的结构和状态物质科学包含物质的结构和状态最深层次的结构最深层次的结构
高密强耦合夸克物质理论:QCD有效模型
有限重子数密度时Lattice QCD有技术困难,尚无精确结果。
Top Quark Mass Measurements at the Tevatron

a r X i v :h e p -e x /0506030v 1 12 J u n 2005TOP QUARK MASS MEASUREMENTS AT THE TEV ATRONMARTIJN MULDERS(on behalf of the CDF and DØcollaborations)Fermi National Accelerator Laboratory,Batavia,IL 60510,USAIn the year 2004several milestones in the measurement of the top quark mass were reached.The DØcollaboration published a significant improvement of their Run I measurement of the top quark mass,and both Tevatron experiments released preliminary measurements based on Run II data sets collected in the period 2002-2004.The preliminary Run II results presented here do not yet surpass the current world average in precision,but this is expected to change soon.With larger data sets ready to be analyzed,a better understanding of the Run II detectors and improved analysis methods,2005promises to be a remarkable year for Top physics.1IntroductionThe recent publication of the improved Run I measurement of the top mass by DØ1was exciting for two reasons.First of all it demonstrated how much improvement in measurement precision could be achieved using a more advanced analysis technique like the Matrix Element method.Secondly,it was a reminder of how little we yet know about the properties of the top quark and that new experimental information about the top quark can have big implications for electroweak fits in the Standard Model.The current (Run I only)world average value for the top quark mass is 178.0±4.3GeV /c 2.In the coming years the measurements of CDF and DØcombined should lead to a precision of about 2GeV.Together with expected improvements in the measurement of the W boson mass this will allow to further constrain the Higgs boson mass to a relative precision of approximately 30%,as discussed elsewhere in these proceedings 2.Since the start of Run II both CDF and DØhave recorded more than 600pb −1of data,already 5times the Run I luminosity.The preliminary results presented here are based on fraction of the recorded data ranging from 160to 230pb −1.Figure1:Reconstructed mass distributions for the CDF di-lepton neutrino weighting analysis(left),and the DØTemplate method with b-tagging(right).2Run II Top mass resultsIn p¯p collisions with √Table1:Overview of preliminary Run II top mass resultstop mass(GeV/c2)CDF neutrino-weighting168.1+11−9.8(stat)±8.6(sys)CDF M reco Template+t¯t p z176.5+17.2−16.0(stat)±6.9(sys)CDF M reco Template+φofν1andν2170.0±16.6(stat)±7.4(sys) DØDalitz and Goldstein155+14−13(stat)±7(sys)CDF Template with b-tagging177.2+4.9−4.7(stat)±6.6(sys)CDF Multi-Variate Template179.6+6.4−6.3(stat)±6.8(sys)CDF Dynamic Likelihood177.8+4.5−5.0(stat)±6.2(sys)DØIdeogram177.5±5.8(stat)±7.1(sys)DØTemplate topological169.9±5.8(stat)+7.8−7.1(sys)DØTemplate with b-tagging170.6±4.2(stat)±6.0(sys)2.2Final states with one lepton plus jetsWhile the lepton+jets channel benefits from a higher branching ratio,it suffers from significant backgrounds from W+jets and non-W multi-jet events.Since only one neutrino is present thefinal state can be fully reconstructed.Some analyses use a constrained kinematicfit to further improve the measurement of lepton and jets beyond detector resolution.The CDF Dynamic Likelihood Method(DLM)follows a different approach, similar to the DØMatrix Element method1;transfer functions are derived from Monte Carlo simulation describing the jet energy resolution.These functions are subsequently used in a multi-dimensional integration over phase space calculating the likelihood that the event is compatible with matrix elements describing top pair production and decay.In order to reconstruct the invariant mass of the top decay products,a choice has to be made to assign jets and lepton to the corresponding top or anti-top quark.In a lepton+jets event12ways exist to do this assignment.Some analyses take only one jet assignment per event in consideration.The CDF Dynamic Likelihood Method and the DØIdeogram analysis include all possible jet assignments in thefit.The CDF and DØtemplate methods use an overallfit of Monte Carlo templates to the data in order to extract the mass.The CDF Dynamic Likelihood Method and DØIdeogram analysis derive an event-by-event likelihood to maximize the statistical information extracted from each event.The Ideogram method also includes the hypothesis that the event could be background, weighted according to an estimated event purity.Both experiments apply b-tagging in some of the top mass analyses.One advantage of b-tagging is to strongly reduce the backgrounds.A second advantage of b-tagging for the top mass measurement in the lepton+jets channel is the reduction of the number of possible jet assignments in the case that one or two jets are b-tagged.The CDF Template analysis combines the0-tag,1-tag and double tagged event samples in thefit to optimize the statistical precision. DØ’sfirst top mass analysis with b-tagging uses events with at least one tag,which applied to a data set of230pb−1leads to the most precise preliminary Run II top mass result presented so far.Figure1shows thefitted mass for the lowest-χ2solution for the b-tagged DØTemplateanalysis,compared to the Monte Carlo prediction.An overview of the current preliminary results is shown in Table1.3Prospects for the Top mass measurementIn all results reported here the dominant component of the systematic uncertainty is the uncer-tainties related to the jet energy scale.In the last year a lot of work has been done to improve the calibration of the reconstructed jet energies.CDF reports an improvement of a factor two or more in jet energy scale uncertainties compared to a year ago.Similar improvements are expected in DØ.This will have a direct effect on the systematic uncertainties quoted.Further improvements in understanding the Jet Energy Scale can come from performing an in-situ calibration of the light-jet energy scale using the jets from the hadronic decay of the W in the same t¯t events used to measure the top mass,and from studies in progress aimed at determining the b-jet energy scale from data.Other systematics that are being studied are the modeling of initial state andfinal state gluon radiation in the t¯t Monte Carlo.Very soon both experiments hope to present preliminary results with updated jet energy scale and an integrated luminosity of more than300pb−1.All together the prospects are very good for having new top mass results this year with a precision comparable to or better than the current world average for each of the Tevatron experiments.This will open the door to an exciting new area of top physics to be further explored in the coming years at the Tevatron.References1.DØCollaboration,Nature429(2004)p638.2.C.Hays,these proceedings,hep-ex/0505064.3.J.Nielsen,these proceedings,hep-ex/0505051.4.CDF Collaboration,/physics/new/top/top.html5.DØCollaboration,/Run2Physics/WWW/results/top.htm。
Search for a new state of matter – the Quark-Gluon Plasma一个物质–夸克胶子等离子体的新状态搜索 43

-- multi-parton dynamics (recombination or coalescence or …)
-- Hydrodynamics (constituent quarks ? parton dynamics from gluons to constituent quarks? )
Nucleus-Nucleus Collisions and Volcanic Eruption
Volcanic high pT -- Strombolian eruption
Volcanic mediate pT – Spatter (clumps)
6
Volcanic low pT – Bulk matter flows
Evidence for Multi-parton Dynamics in Hadronization of Bulk Partonic Matter at RHIC
Huan Zhong Huang (黄焕中) Department of Physics and Astronomy
University of California Los Angeles
Rafelski+Danos, Molnar+Voloshin …..) Quark Recombination – (R.J. Fries et al, R. Hwa et al)
13
Constituent Quark Scaling
Constituent (n) Quark Scaling -- Meson n=2 and Baryon n=3 grouping
p td d td p N y d 2 1 π p td dtd p N 1 y i 12ic vo s ψ R () i)1( 0
SiLabs CP2101单芯片USB到UART桥数据手册说明书

Single-Chip USB to UART BridgeCP2101Single-Chip USB to UART Data Transfer-Integrated USB Transceiver; No External Resistors Required-Integrated Clock; No External Crystal Required -Integrated 512-Byte EEPROM for Vendor ID, Product ID, Serial Number, Power Descriptor, Release Number and Product Description Strings -On-Chip Power-On Reset Circuit-On-Chip Voltage Regulator: 3.3 V OutputUSB Function Controller-USB Specification 2.0 Compliant; Full Speed (12 Mbps)-USB suspend states supported via SUSPEND pinsAsynchronous Serial Data BUS (UART)-All Handshaking and Modem Interface Signals -Data Formats Supported:•Data Bits: 8•Stop Bits: 1•Parity: Odd, Even, No Parity -Baud Rates: 300 bps to 921.6 kbps-512 Byte Receive Buffer; 512 Byte Transmit Buffer -Hardware or X-On / X-Off Handshaking Supported -Event Character SupportVirtual COM Port Device Drivers-Works with Existing COM Port PC Applications -Royalty-Free Distribution License -Windows 98/2000/XP -MAC OS-9-MAC OS-X -Windows CE*-Linux 2.40 and greater* (Contact factory for availability)Example Applications-Upgrade of RS-232 Legacy Devices to USB -Cellular Phone USB Interface Cable -PDA USB Interface Cable -USB to RS-232 Serial Adapter Supply Voltage-Self-powered: 3.0 to 3.6 V-USB Bus Powered: 4.0 to 5.25 V Package-28-pin MLP (5 x 5 mm)Temperature Range: -40 to +85 °CCP2101Table of Contents1.System Overview (4)2.Absolute Maximum Ratings (4)Table 2.1. Absolute Maximum Ratings (4)3.Global DC Electrical Characteristics (5)Table 3.1. Global DC Electrical Characteristics (5)Table 3.2. UART and Suspend I/O DC Electrical Characteristics (5)4.Pinout and Package Definitions (6)Table 4.1. Pin Definitions for the CP2101 (6)Figure 4.1. MLP-28 Pinout Diagram (Top View) (7)Figure 4.2. MLP-28 Package Drawing (8)Table 4.2. MLP-28 Package Dimensions (8)Figure 4.3. Typical MLP-28 Landing Diagram (9)Figure 4.4. Typical MLP-28 Solder Mask (10)B Function Controller and Transceiver (11)Figure 5.1. Typical Connection Diagram (11)6.Asynchronous Serial Data Bus (UART) Interface (12)Table 6.1. Data Formats and Baud Rates (12)7.Internal EEPROM (12)Table 7.1. Default USB Configuration Data (12)8.Virtual Com Port Device Drivers (13)9.Voltage Regulator (14)Table 9.1. Voltage Regulator Electrical Specifications (14)Figure 9.1. Configuration 1: USB Bus-Powered (14)Figure 9.2. Configuration 2: USB Self-Powered (15)Figure 9.3. Configuration 3: USB Self-Powered, Regulator Bypassed (15)1.System OverviewThe CP2101 is a highly-integrated USB-to-UART Bridge Controller providing a simple solution for updating RS-232 designs to USB using a minimum of components and PCB space. The CP2101 includes a USB 2.0 full-speed function controller, USB transceiver, oscillator, EEPROM and asynchronous serial data bus (UART) with full modem control signals in a compact 5 x 5 mm MLP-28 package. No other external USB components are required.The on-chip EEPROM may be used to customize the USB Vendor ID, Product ID, Product Description String, Power Descriptor, Device Release Number and Device Serial Number as desired for OEM applications. The EEPROM is programmed on-board via the USB allowing the programming step to be easily integrated into the product manufacturing and testing process.Royalty-free Virtual COM Port (VCP) device drivers provided by Silicon Laboratories allow a CP2101-based product to appear as a COM port to PC applications. The CP2101 UART interface implements all RS-232 signals, including control and handshaking signals, so existing system firmware does not need to be modified. In many existing RS-232 designs, all that is required to update the design from RS-232 to USB is to replace the RS-232 level-translator with the CP2101.An evaluation kit for the CP2101 (Part Number: CP2101EK) is available. It includes a CP2101-based USB-to-UART/RS-232 evaluation board, a complete set of VCP device drivers, USB and RS-232 cables, and full documentation. Contact a Silicon Labs’ sales representatives or go to to order the CP2101 Evaluation Kit.2.Absolute Maximum RatingsTable 2.1. Absolute Maximum RatingsParameter Conditions Min Typ Max Units Ambient temperature under bias–55—125°C Storage Temperature–65—150°C Voltage on any I/O Pin or RST with respect to–0.3— 5.8V GNDVoltage on V DD with respect to GND–0.3— 4.2V Maximum Total current through V DD and GND——500mA——100mA Maximum output current sunk by RST or anyI/O pinNote: stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the devices at those or any other condi-tions above those indicated in the operation listings of this specification is not implied. Exposure to maxi-mum rating conditions for extended periods may affect device reliability.CP21013.Global DC Electrical CharacteristicsTable 3.1. Global DC Electrical CharacteristicsV DD = 2.7 to 3.6 V, –40 to +85 °C unless otherwise specifiedParameter Conditions Min Typ Max Units Supply Voltage 3.0 3.3 3.6V Supply Current V DD = 3.3 V—25—mA Supply Current in Suspend V DD = 3.3 V—325—µA Specified Operating Temperature Range–40—+85°CTable 3.2. UART and Suspend I/O DC Electrical CharacteristicsV DD = 2.7 to 3.6 V, -40 to +85 °C unless otherwise specifiedParameters Conditions Min Typ Max UNITSOutput High Voltage I OH = -3mAI OH = -10µAI OH = -10mAVDD-0.7VDD-0.1VDD-0.8VOutput Low Voltage I OL = 8.5mAI OL = 10µAI OL = 25mA 1.00.60.1VInput High Voltage 2.0V Input Low Voltage0.8V Input Leakage Current2550µACP21014.Pinout and Package DefinitionsTable 4.1. Pin Definitions for the CP2101Name Pin #Type DescriptionV DD6Power InPowerOut3.0–3.6 V Power Supply Voltage Input.3.3 V Voltage Regulator Output. See Section 9.GND3GroundRST9 D I/O Device Reset. Open-drain output of internal POR or V DD monitor. An external source can initiate a system reset by driving this pin low for at least 15 µs.REGIN7Power In 5 V Regulator Input. This pin is the input to the on-chip voltage regu-lator.VBUS8 D In VBUS Sense Input. This pin should be connected to the VBUS signal of a USB network. A 5 V signal on this pin indicates a USB network connection.D+4 D I/O USB D+D–5 D I/O USB D–TXD26 D Out Asynchronous data output (UART Transmit) RXD25 D In Asynchronous data input (UART Receive) CTS23* D In Clear To Send control input (active low)RTS24* D Out Ready to Send control output (active low)DSR27* D in Data Set Ready control input (active low)DTR28* D Out Data Terminal Ready control output (active low) DCD1* D In Data Carrier Detect control input (active low)RI2* D In Ring Indicator control input (active low)SUSPEND12* D Out This pin is driven high when the CP2101 enters the USB suspend state.SUSPEND11* D Out This pin is driven low when the CP2101 enters the USB suspend state.NC10, 13–22These pins should be left unconnected or tied to V DD. *Note: Pins can be left unconnected when not used.CP2101Figure 4.1. MLP-28 Pinout Diagram (Top View)CP2101Figure 4.2. MLP-28 Package DrawingTable 0.1. MLP-28 Package DimensionsMM MIN TYP MAX A 0.800.90 1.00A100.020.05A200.65 1.00A3—0.25—b 0.180.230.30D — 5.00—D2 2.90 3.15 3.35E — 5.00—E2 2.90 3.15 3.35e —0.5—L 0.450.550.65N —28—ND —7—NE —7—R 0.09——AA —0.435—BB —0.435—CC —0.18—DD—0.18—CP2101Figure 4.3. Typical MLP-28 Landing DiagramCP2101Figure 4.4. Typical MLP-28 Solder Mask11Rev. 1.5B Function Controller and TransceiverThe Universal Serial Bus function controller in the CP2101 is a USB 2.0 compliant full-speed device with integrated transceiver and on-chip matching and pull-up resistors. The USB function controller manages all data transfers between the USB and the UART as well as command requests generated by the USB host controller and commands for controlling the function of the UART.The USB Suspend and Resume signals are supported for power management of both the CP2101 device as well as external circuitry. The CP2101 will enter Suspend mode when Suspend signaling is detected on the bus. On entering Suspend mode, the CP2101 asserts the SUSPEND and SUSPEND signals. SUSPEND and SUSPEND are also asserted after a CP2101 reset until device configuration during USB Enumeration is completeThe CP2101 exits the Suspend mode when any of the following occur: (1) Resume signaling is detected or generated, (2) a USB Reset signal is detected, or (3) a device reset occurs. On exit of Suspend mode, the SUSPEND and SUSPEND signals are de-asserted.Both SUSPEND and SUSPEND temporarily float high during a CP2101 reset. If this behavior is undesirable, a strong pulldown (10 kΩ) can be used to ensure SUSPEND remains low during reset. See Figure 5.1 for other recommended options.Figure 5.1. Typical Connection DiagramRev. 1.5126.Asynchronous Serial Data Bus (UART) InterfaceThe CP2101 UART interface consists of the TX (transmit) and RX (receive) data signals as well as the RTS, CTS, DSR, DTR, DCD and RI control signals. The UART supports RTS/CTS, DSR/DTR and X-On/X-Off handshaking.The UART is programmable to support a variety of data formats and baud rates. The data format and baud rate programmed into the UART is set during COM port configuration on the PC. The data formats and baud rates available are listed in Table 6.1.7.Internal EEPROMThe CP2101 includes an internal EEPROM that may be used to customize the USB Vendor ID, Product ID, Product Description String, Power Descriptor, Device Release Number and Device Serial Number as desired for OEM applications. Customization of the USB configuration data is optional. If the EEPROM is not programmed with OEM data, the default configuration data shown in Table 7.1 is used. However, a unique serial number is required for OEM applications in which it is possible for multiple CP2101-based devices to be connected to the same PC.The internal EEPROM is programmed via the USB. This allows the OEM's USB configuration data and serial number to be written to the CP2101 on-board during the manufacturing and testing process. A stand-alone utility for programming the internal EEPROM is available from Silicon Laboratories. A library of routines provided in the form of a Windows ® DLL is also available. This library can be used to integrate the EEPROM programming step into custom software used by the OEM to streamline testing and serial number management during manufacturing. The EEPROM has a typical endurance of 100,000 write cycles with a data retention of 100 years.Table 6.1. Data Formats and Baud RatesData Bits 8Stop Bits 1Parity Type None, Even, OddBaud Rates300, 600, 1200, 1800, 2400, 4800, 7200, 9600, 14400, 19200, 28800, 38400, 56000, 57600, 115200, 128000, 230400, 460800, 921600Table 7.1. Default USB Configuration DataName Value Vendor ID 10C4h Product IDEA60h Power Descriptor (Attributes)80hPower Descriptor (Max. Power)32h Release Number 0100hSerial Number0001 (63 characters maximum)Product Description String“CP2101 USB to UART Bridge Controller” (126 characters maximum)13Rev. 1.58.Virtual Com Port Device DriversThe CP2101 Virtual COM Port (VCP) device drivers allow a CP2101-based device to appear to the PC's application software as an additional COM port (in addition to any existing hardware COM ports). Application software running on the PC accesses the CP2101-based device as it would access a standard hardware COM port. However, actual data transfer between the PC and the CP2101 device is performed over the USB. Therefore, existing COM port applications may be used to transfer data via the USB to the CP2101-based device without modifying the application. Contact Silicon Laboratories for the latest list of supported operating systems.Note:The Silicon Laboratories VCP device drivers are required for device operation and are only distributed as part of the CP2101 Evaluation Kit (Part Number: CP2101EK). Contact any of Silicon Lab’s sales representatives or go to to order the CP2101 Evaluation Kit. The CP2101 drivers and programming utilities are subject to change without notice. Subscription to the website "Auto Email Alert" system for automatic notification of updates and the use of the "Product Update Registration" service is recommended.Rev. 1.5149.Voltage RegulatorThe CP2101 includes an on-chip 5-to-3 V voltage regulator. This allows the CP2101 to be configured as either a USB bus-powered device or a USB self-powered device. These configurations are shown in Figure 9.1 and Figure 9.2. When enabled, the 3 V voltage regulator output appears on the V DD pin and can be used to power external 3V devices. See Table 9.1 for the voltage regulator electrical characteristics.Alternatively, if 3 V power is supplied to the V DD pin, the CP2101 can function as a USB self-powered device with the voltage regulator disabled. For this configuration, it is recommended that the REGIN input be tied to the 3 V net to disable the voltage regulator. This configuration is shown in Figure 9.3.The USB max power and power attributes descriptor must match the device power usage and configuration. See application note “AN144: CP2101 Customization Guide” for information on how to customize USB descriptors for the CP2101.Note:It is recommended that additional decoupling capacitance (e.g., 0.1 µF in parallel with 1.0 µF) be provided on the REGIN input.Figure 9.1. Configuration 1: USB Bus-PoweredTable 9.1. Voltage Regulator Electrical Specifications–40 to +85 °C unless otherwise specifiedParameterConditionsMin Typ Max Units Input Voltage Range 4.0— 5.25V Output VoltageOutput Current = 1 to 100 mA*3.0 3.3 3.6V VBUS Detection Input Threshold 1.0 1.84.0V Bias Current—90TBDµA* The maximum regulator supply current is 100 mA.15Rev. 1.5Figure 9.2. Configuration 2: USB Self-PoweredFigure 9.3. Configuration 3: USB Self-Powered, Regulator BypassedRev. 1.516Document Change ListRevision 1.4 to Revision 1.5Updated Example System Diagram on page 1.Updated Table 3.1, “Global DC Electrical Characteristics,” on page 5.Added Table 3.2, “UART and Suspend I/O DC Electrical Characteristics,” on page 5 Added Table note to Table 4.1, “Pin Definitions for the CP2101,” on page 6 Added Figure 5.1. , "Typical Connection Diagram" on page 11Removed asterisk from the “Linux 2.40 and greater” bullet on page 117Rev. 1.5NotesRev. 1.518Contact InformationSilicon Laboratories Inc.4635 Boston Lane Austin, TX 78735Tel: 1+(512) 416-8500 Fax: 1+(512) 416-9669 Toll Free: 1+(877) 444-3032Email:********************** Internet: Silicon Laboratories and Silicon Labs are trademarks of Silicon Laboratories Inc.Other products or brandnames mentioned herein are trademarks or registered trademarks of their respective holdersThe information in this document is believed to be accurate in all respects at the time of publication but is subject to change without notice. Silicon Laboratories assumes no responsibility for errors and omissions, and disclaims responsibility for any consequences resulting from the use of information included herein. Additionally, Silicon Laboratories assumes no responsibility for the function-ing of undescribed features or parameters. Silicon Laboratories reserves the right to make changes without further notice. Silicon Laboratories makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Silicon Laboratories assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Silicon Laboratories products are not designed, intended, or authorized for use in applications intended to support or sustain life, or for any other application in which the failure of the Silicon Laboratories product could create a situation where personal injury or death may occur. Should Buyer purchase or use Silicon Laboratories products for any such unintended or unauthorized application, Buyer shall indemnify and hold Silicon Laboratories harmless against all claims and damages.。
Quark PFT使用手册1118
Quark PFT系列多功能肺测试仪`使用操作手册没有COSMED Srl公司的许可,不得制造或以其他形式转移该仪器的任意零件本公司不保证翻译的完全正确性,由于使用本手册而造成的间接损失,概不负责。
COSED软件只使用于该仪器该手册的整理依照Adobe PageMaker 6.5,Microsoft Word.Freehand 8.0和Cad程序Word ,Excel已经注册Microsoft公司Lotrus 123已经注册Lotus Development 公司Pagemaker已经注册Adobe 公司Freehand 已经注册Macromedia 公司Quark PFT 肺功能测试使用操作手册2003年新版本版权所有c 1998 COSMEDCOSMED Srl-Italyhttp:/www.cosmed.it目录起始篇 4 安装篇12 校准篇14 数据库管理篇16 肺量计测试篇19 肺容量测试篇28 肺弥散量测试篇31 训练测试篇34 系统维护45 附录49起始篇重要通告使用范围Quark PFT是一种用来进行肺功能测试的医疗设施,它的使用要由医务人员或被培训的专业人员的指导下进行,依美国联邦法例,此系统只能售与或由专业医生使用。
这种设备被界定为一种辅助仪器用来:●阐明肺功能和病理学的诊断●执行有关人类生理学的研究●在运动训练中得到生理的信息在以下情况下,若发生任何事故,COMSED Srl公司概不负责:●由于没有被训练或不合格的人使用●设备不在正确情况下使用●没有按照使用手册中所列事的范围和指令下使用注意事项:该设备,测量数据的计算程序和表达乃根据ATS(美国胸病协会)和ERS(欧洲呼吸病协会)之指导和建议下而进行。
若当一些数据无法与这些协会提供的做比较时,便会使用其他国际协会提供的数据比较法做参考和遵循。
所有可参考的文献已经列于本手册(附录)部分。
本手册的编写及阐述乃依据欧洲医学设备的指示和要求,按COSMED设备分类为(第I类别测量功能医用设备),请认真阅读本手册后再开始使用该设备。
Cascade 45E-PLS-255 Model Serialize Number操作说明书
Parts Manual cFor Technical Assistance call: 800-227-2233, Fax: 888-329-8207 To Order Parts call: 888-227-2233, Fax: 888-329-023445E Push-Pull45E-PLS-255ModelSerial Number cascadeாcorporationPublicationsPART NO.DESCRIPTIONParts Manual686455Service Manual684945Operators Guide685531Operators Pocket Guide684944Installation Instructions680664Servicing Cascade Cylinders-VHS 679929Tool Catalog673964Literature Index Order FormDecalsREF QTY PART NO.DESCRIPTION6027882Frame Group 116027883Frame21364109Accumulator32364099U-Bolt446288Lockwasher546230Washer61205855Fitting, 12-6722680Fitting, 6-6REF QTY PART NO.DESCRIPTION 832453Fitting, 6-6912375Fitting, 6-6101394504Tube111611329Fitting, 6-6121686509Tube131369046Tube142682850Stop45ES/S Mounting Group ITA II35E/45EREFQTYPART NO.DESCRIPTIONREF QTY PART NO.DESCRIPTION102675550Washer1147403s Grease Fitting 121211757Tube 131211758Tube1422451Fitting, 4-41513007887Hose, 6 - 21.00 in.161388297Hose, 6 - 20.00 in.172688387Jam Nut1813007888Hose, 4 - 27.50 in.1913007889Hose, 4 - 21.50 in.s Included in Bearing Service Kit 671423.q See Cylinder page for parts breakdown.PP0303.ill3007890Mounting Group11682554Anchor Bracket 22671165s Bearing Segment 32768759Setscrew 426517Cotter Pin 526234Washer 62214036Clevis Pin 71675548q Cylinder 82682814Bearing 92666984Fitting, 4-6Sideshift CylinderITA Class III45EREF QTY PART NO.DESCRIPTION675548Cylinder Assembly 11553857Nut21662452s Seal31553501Piston41636851s Wiper51638247s Back-up Ring61675550Washer (orifice .085 in.) 71675549Shell81553449Rod912785s O-Ring101615128s Back-up Ring 111553500Retainer121553856Retaining Ring1317202Snap Ring141641835s Seal553861Service Kits Included in Service Kit 553861.Bolt-On Lower Hook Group ITA IIREF QTY PART NO.DESCRIPTION683178Lower Hook Group ITA II12679360Hook24667225Washer34779010Capscrew35E/45EREF QTY PART NO.DESCRIPTION224510Mechanism Group 11224516Arm-Inner Secondary R. H.21204692Arm-Secondary Outer R. H.34683154s Bushing4q683161Shim (.030)5q683162Shim (.060)64205070Roller7q683163Shim (.030)8q683164Shim (.060)94683155s Bushing101682821Pin11156229Washer122685661Capscrew1315689954Eye-Pin142682822Pin-Head152205065Pin166683153s Bushing17q204532Shim (.12)182204694Arm-Outer Primary 194204533Pin-Frame204204535s Bushing214204695Pin221224512Arm-Inner Primary 231204693Arm-Secondary Outer L. H. 241224514Arm-Inner Secondary L. H. 252204696Pin-Outer262682823Pin-Rod272683165Spacer2813767961Capscrewq Quantity as required.s Included in Bushing Service Kit 205075.Cylinder35E/45EREF QTY PART NO.DESCRIPTION200988Cylinder Assembly 11685381Spacer21562553Seal s317348Snap Ring41562333Piston51562717Shell61558626Rod71559705Seal s812787O–Ring s91615130Back–up Ring s 101558628Retainer111636853Wiper s124559697Bearing131559698Spacer141678019Nut151671048Seal Loader Kit ss Included in Service Kit 562339.Reference:S-3424.Hydraulic Group45EREF QTY PART NO.DESCRIPTION6028817Hydraulic Group 11200649Tube22683173Hose312375Fitting, 6-641688384Valve◆52768524Capscrew, M8 x 3562685978Hose74605235Fitting, 5-685604511Fitting, 6-691200647Tube102604510Plug, 6111200648Tube122353621Spacer131605230Fitting, 6-6141611302Fitting, 6-6◆See Valve page for parts breakdown. Reference:Hydraulic Components 6028818.ValveLoad Push35E/45EREF QTY PART NO.DESCRIPTION688384Valve Assembly 11688385Body21687224Relief Valve32663694Fitting, 3Platen Group45EREF QTY PART NO.DESCRIPTION6027861Platen Group116027862Platen – RH216027863Platen – LH32685533Upper Hook44685677Capscrew, M16 x 455◆688379Shim (.06)62682851Lower Hook74667225Washer, .62584209016Capscrew, M16 x 35926014136Shim (.06)1026014137Shim (.03)118769577Capscrew, M16 x 50 1226019260Shim (.06)1326019261Shim (.03)◆As required, 2 maximum per platen.45EREF QTY PART NO.DESCRIPTION6027762Faceplate Group116027763Faceplate, 40 x 42◆◆Width x Height.Faceplate GroupP A R T S O R D E R I N G L O GP U R C H A S E S E R I A L R E F C A S C A D E C U S T O M E R D A T EO R D E R N U M B E RP A G E N O .Q T Y P A R T N O .P A R T N O .D E S C R I P T I O N P R I C EDo you have questions you need answered right now? Call your nearest Cascade Parts Department. Visit us online at Cascade (UK) Ltd.15, Orgreave Crescent Dore House Industrial Estate HandsworthSheffield S13 9NQ EnglandTel: 742-697524FAX: 742-695121Cascade Scandinavia AB Box 124Hammarvägen 10567 23 Vaggeryd SwedenTel: 42-0-393-36950 FAX: 46-0-393-36959Cascade N.V. European Headquarters P.O. Box 30091300 El Almere Damsluisweg 561332 ED AlmereThe NetherlandsTel: 31-36-5492911 FAX: 31-36-5492964Cascade Norway Østerliveien 37A 1153 Oslo NorwayTel: 47-22-743160 FAX: 47-22-743157Cascade France S.A.R.L.1D Rue De CharaintruBP 18, 91360 Epinay-Sur-OrgeMorangis Cedex, FranceTel: 33-1- 64547500FAX: 33-1-64547501Cascade Hispania S.A.Carrer 5 Sector CZona Franca DuaneraPoligono de la Zon Franca08040 Barcelona, SpainOffice No. 256Tel: 93-264-07-30FAX: 93-264-07-31Cascade Canada Inc.5570 Timberlea Blvd.Mississauga, OntarioCanada L4W-4M6Tel: 905-629-7777FAX: 905-629-7785Cascade GmbHD-41199 MonchengladbachKlosterhofweg 52GermanyTel: 49-216-668230FAX: 49-216-6682323Cascade N.V.Benelux Sales and ServiceP.O. Box 30091300 El AlmereDamsluisweg 561332 ED AlmereThe NetherlandsTel: 31-36-5492950FAX: 31-36-5492974Cascade FinlandAlbert Petreliuksenkatu 301370 VantaaFinlandTel: 358-9-836-1925FAX: 358-9-836-1935Cascade Corporation2501 Sheridan AvenueSpringfield, OH 45505Tel:888-CASCADE (227-2233)FAX: 888-329-0234Cascade Japan Ltd.5-5-41,Torikai KamiSettsu, OsakaJapan, 566Tel: 81-726-53-3490FAX: 81-726-53-3497Cascade Korea108B, Namdong Ind Complex 658-3 Gojan-Dong Namdong-GuInchon, 405-310 KoreaTel: 82-32-821-2051FAX: 82-32-821-2055Cascade Australia1445 Ipswich RoadRocklea, QLD 4106AustraliaTel: 1-800227-223FAX: (07) 3373-7333Cascade New Zealand15 Ra Ora DriveEast Tamaki, AucklandNew ZealandTel: 9-273-9136FAX: 9-273-9137Cascade (Africa) Pty. Ltd.P.O. Box 625, Isando 160060A Steel RoadSparton, Kempton ParkSouth AfricaTel: 27-11-975-9240FAX: 27-11-394-1147Cascade-XiamenNo. 668 Yangguang Rd. Xinyang Industrial Zone Haicang, Xiamen City Fujian ProvinceP.R. China 361026 Tel: 86-592-651-2500 FAX: 86-592-651-2571Cascade (Singapore) Trading Co.Four Seasons Park Autumn Block - Apt. 1802 12 Cuscaden Walk SingaporeTel: 65-834-1935FAX: 65-834-1936c。
Infoprint 250 導入と計画の手引き 第 7 章ホスト
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赛普拉斯 CAT4201 350mA 高效率降压LED驱动器 用户手册说明书
CAT4201350 mA High Efficiency Step Down LED DriverDescriptionThe CA T4201 is a high efficiency step−down converter optimized to drive high current LEDs. A patented switching control algorithm allows highly efficient and accurate LED current regulation. A single RSET resistor sets the full scale LED string current up to 350mA from supplies as high as 36 V .The switching architecture of the CA T4201 results in extremely low internal power dissipation allowing the device to be housed in a tiny package without the need for dedicated heat sinking. The device is compatible with switching frequencies of up to 1 MHz, making it ideal for applications requiring small footprint and low value external inductors.Analog dimming and LED shutdown control is provided via a single input pin, CTRL. Additional features include overload current protection and thermal shutdown. The device is available in the low profile 5−lead thin SOT23 package ideal for space constrained applications.Features•LED Drive Current up to 350 mA•Compatible with 12 V and 24 V Standard Systems •Handles Transients up to 40 V•Single Pin Control and Dimming Function •Power Efficiency up to 94%•Drives LED Strings of up to 32 V •Open and Short LED Protection•Parallel Configuration for Higher Output Current •TSOT−23 5−lead Package•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS CompliantApplications•12 V and 24 V Lighting Systems •Automotive and Aircraft Lighting•General Lighting, High Brightness 350 mA LEDsFigure 1. Typical Application CircuitSee Table 4 on page 6 for external component selection.TSOT−23TD SUFFIX CASE 419AEPIN CONNECTIONS AND MARKING DIAGRAMS (Top Views)TFYMDevice Package Shipping ORDERING INFORMATIONCAT4201TD−GT3TSOT−23(Pb−Free)3,000/Tape & ReelTF = Specific Device CodeY = Production Year (Last Digit)M = Production Month: (1−9, O, N, D)VBATSWCTRLGND RSET* Plated Finish: NiPdAu1TSOT−23Table 1. ABSOLUTE MAXIMUM RATINGSParameters Ratings UnitsVBAT, SW, CTRL−0.3 to +40VRSET−0.3 to +5VSwitch SW peak current1AStorage Temperature Range−65 to +160_CJunction Temperature Range−40 to +150_CLead Temperature300_CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.Table 2. RECOMMENDED OPERATING CONDITIONSParameters Ratings UnitsVBAT voltage (Notes 1, 2) 6.5 to 36 (Note 1)VSW voltage0 to 36VAmbient Temperature Range−40 to +125_CLED Current50 to 350mA Switching Frequency50 to 1000kHz Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.1.The VBAT pin voltage should be at least 3 V greater than the total sum of the LED forward voltages in order to operate at nominal LED current.2.During power−up, the slew rate of the input supply should be greater than 1 m s for every 5 V increase of VBAT.Table 3. ELECTRICAL CHARACTERISTICS(V IN = 13 V, ambient temperature of 25°C (over recommended operating conditions unless otherwise specified)) Symbol Parameter Conditions Min Typ Max UnitsI Q Operating Supply Current on VBAT pin0.41mAI SD Idle Mode Supply Current on VBAT pin CTRL= GND90m AV FB RSET Pin Voltage 2 LEDs with I LED = 300 mA 1.15 1.2 1.25VI LED Programmed LED Current R1 = 33 k WR1 = 10 k W R1 = 8.25 k W 270100300350330mAV CTRL−FULL CTRL Voltage for 100% Brightness 2.6 3.1V V CTRL−EN CTRL Voltage to Enable LEDs LED enable voltage threshold0.9 1.2V V CTRL−SD CTRL Voltage to Shutdown LEDs LED disable voltage threshold0.40.9VI CTRL CTRL pin input bias V CTRL= 3 VV CTRL= 12 V4020080m AR SW Switch “On” Resistance I SW = 300 mA0.9 1.5W T SD Thermal Shutdown150°C T HYST Thermal Hysteresis20°Ch Efficiency Typical Application Circuit86% Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.Figure 2. Input Operating Supply CurrentFigure 3. Idle Mode Supply Current(CTRL = 0 V)INPUT VOLTAGE (V)INPUT VOLTAGE (V)2220181614121080.20.40.60.81.02420161284050100150200Figure 4. CTRL Input Bias CurrentFigure 5. RSET Voltage vs. TemperatureCTRL VOLTAGE (V)TEMPERATURE (°C)12108642050100150200250 1.101.151.201.251.30Figure 6. RSET Voltage vs. CTRL Voltage Figure 7. LED Current vs. RSETCTRL VOLTAGE (V)RSET (k W )00.20.40.60.81.01.21.435302520151050100200300400Q U I E S C E N T C U R R E N T (m A )I D L E C U R R E N T (m A )C T R L B I A S C U R R E N T (m A )R S E T V O L T A G E (V )R S E T V O L T A G E (V )L E D C U R R E N T (m A )24Figure 8. Switching Frequency vs. InputVoltage (1 LED)Figure 9. Switching Frequency vs. InputVoltage (2 LEDs)INPUT VOLTAGE (V)INPUT VOLTAGE (V)10020030040050028242016128100200300400500600700Figure 10. Switching Frequency vs.TemperatureFigure 11. Switch ON Resistance vs. InputVoltageTEMPERATURE (°C)INPUT VOLTAGE (V)10020030040050024201816141210800.40.81.21.62.0Figure 12. Efficiency vs. Input Voltage (1 LED)Figure 13. Efficiency vs. Input Voltage(2 LEDs)INPUT VOLTAGE (V)INPUT VOLTAGE (V)7075808590951007075809095100S W I T C H I N G F R E Q U E N C Y (k H z )S W I T C H I N G F R E Q U E N C Y (k H z )S W I T C H I N G F R E Q U E N C Y (k H z )S W R E S I S T A N C E (W )E F F I C I E N C Y (%)E F F I C I E N C Y (%)2285Figure 14. Efficiency vs. LED CurrentFigure 15. LED Current Regulation vs.TemperatureLED CURRENT (mA)TEMPERATURE (°C)35030025020015010070758085909510012080400−40−10−8−4−224810Figure 16. LED Current vs. Input Voltage(1 LED)Figure 17. LED Current vs. Input Voltage(2 LEDs)INPUT VOLTAGE (V)INPUT VOLTAGE (V)2428201612840501001502002503003502428201612840050100150200250300350Figure 18. Switching Waveforms Figure 19. CTRL Power−up2 m s/div40 m s/divE F F I C I E N C Y (%)L E D C U R R E N T V A R I A T I O N (%)L E D C U R R E N T (m A )L E D C U R R E N T (m A )SW 5V/divInductor Current 200mA/divCTRL 5V/divLED Current 200mA/div−606Figure 20. RSET Transient ResponseFigure 21. Line Transient Response(10 V to 13 V)External Component SelectionTable 4 provides the recommended external components L and C2 that offer the best performance relative to the LED current accuracy, LED ripple current, switching frequency and component size.Table 4. EXTERNAL COMPONENT SELECTION1 LED2 LEDsLED Current (mA)L Inductor (m H)C2 Capacitor (m F)L Inductor (m H)C2 Capacitor (m F)≥15022 4.722 4.7< 15033 4.7472.24710NOTE:Larger C2 capacitor values allow to reduce further the LED ripple current if needed.Table 5. INDUCTOR SELECTION DEPENDING ON VBAT SUPPLY VOLTAGEVBAT Supply Voltage (V)Minimum Inductor L (m H)< 2622≥ 2633Table 6. PIN DESCRIPTIONPin Name Function1CTRL Analog dimming control and shutdown pin.2GND Ground reference.3RSET RSET pin. A resistor connected between the pin and ground sets the average LED current.4SW Interface to the inductor.5VBAT Supply voltage for the device.Pin FunctionVBAT is the supply input to the device. Typical current conduction into this pin is less than 1 mA and voltage transients of up to 40 V can be applied. To ensure accurate LED current regulation, the VBAT voltage should be 3V higher than the total forward voltage of the LED string. A bypass capacitor of 4.7 m F or larger is recommended between VBAT and GND.CTRL is the analog dimming and control input. An internal pull−down current of 20 m A allows the LEDs to shutdown if CTRL is left floating. V oltages of up to 40 V can be safely handled by the CTRL input pin.When the CTRL voltage is less than 0.9 V (typ), the LEDs will shutdown to zero current. When the CTRL voltage is greater than about 2.6 V, full scale brightness is applied to the LED output. At voltages of less than around 2.6 V, the LED current is progressively dimmed until shutdown.For lamp replacement applications, or applications where operation in dropout mode is expected, it is recommended that the CTRL pin voltage be derived from the LED cathode terminal.GND is the ground reference pin. This pin should be connected directly to the ground plane on the PCB.SW pin is the drain terminal of the internal low resistance high−voltage power MOSFET. The inductor and the Schottky diode anode should be connected to the SW pin. V oltages of up to 40 V can be safely handled on the SW pin. Traces going to the SW pin should be as short as possible with minimum loop area. The device can handle safely “open−LED” or “shorted−LED” fault conditions.RSET pin is regulated at 1.2 V. A resistor connected between the RSET pin and ground sets the LED full−scale brightness current. The external resistance value and the CTRL pin voltage determine the LED current during analog dimming. The RSET pin must not be left floating. The highest recommended resistor value between RSET and ground is 90 k W.Simplified Block DiagramFigure 22. CAT4201 Simplified Block DiagramCTRLBasic OperationThe CAT4201 is a high efficiency step−down regulator designed to drive series connected high−power LEDs. LED strings with total forward voltages of up to 32 V can be driven with bias currents of up to 350 mA.During the first switching phase, an integrated high voltage power MOSFET allows the inductor current to charge linearly until the peak maximum level is reached, at which point the MOSFET is switched off and the second phase commences, allowing the inductor current to then flow through the Schottky diode circuit and discharge linearly back to zero current.The switching architecture ensures the device will always operate at the cross−over point between Continuous Conduction Mode (CCM) and Discontinuous Conduction Mode (DCM). This operating mode results in an average LED current which is equal to half of the peak switching current.LED Pin CurrentThe LED current is set by the external RSET resistor connected to the regulated output of the RSET pin. An overall current gain ratio of approximately 2.5 A/mA exists between the average LED current and the RSET current,hence the following equation can be used to calculate the LED current.LED Current (A)^2.5V RSET (V)R SET (k W )Table 7 lists the various LED currents and the associated RSET resistors.Table 7. RSET RESISTOR SELECTIONLED Current (A)RSET (k W )0.10330.15210.20150.25120.30100.358.25APPLICATION INFORMATIONInput Voltage RangeThe minimum supply voltage required to maintain adequate regulation is set by the cathode terminal voltage of the LED string (i.e., the VBA T voltage minus the LED string voltage). When the LED cathode terminal falls below 3V ,a loss of regulation occurs.For applications which may occasionally need to experience supply “dropout” conditions, it is recommended that the CTRL input be used to sense the LED cathode voltage. The CTRL pin can either be tied directly to the cathode terminal (for Lamp Replacement) or connected via a pass−transistor for PWM lighting applications.Figure 23 shows the regulation performance obtained in dropout, when the CTRL pin is configured to sense the LED cathode voltage.123456CTRL VOLTAGE [V]L E D C U R R E N T [m A ]Figure 23. “Dropout” Configured LED Current(as shown in Typical Application on page 1)Inductor SelectionA 22 m H minimum inductor value is required to provide suitable switching frequency across a wide range of input supply values. For LED current of 150 mA or less, a 33 m H or 47 m H inductor is more suitable. Inductor values below 22m H should not be used.An inductor with at least 700 mA current rating must be used. Minor improvements in efficiency can be achieved by selecting inductors with lower series resistance.Table 8. SUMIDA INDUCTORSPart NumberL (m H)I Rated (A)LED Current (A)CDRH6D26−22022 1.00.35CDRH6D28−330330.920.35CDRH6D28−470470.80.35CDRH6D28−560560.730.35Capacitor SelectionA 10 m F ceramic capacitor C2 across the LED(s) keeps the LED ripple current within ±15% of nominal for most applications. If needed, a larger capacitor can be used to further reduce the LED current ripple. Any resistance in series with the LED (0.5 W or more) contributes to reduce the ripple current. The capacitor voltage rating should be equivalent to the maximum expected supply voltage so as to allow for “Open−LED” fault conditions. The capacitor value is independent of the switching frequency or the overall efficiency.A 4.7 m F ceramic input capacitor C1 is recommended to minimize the input current ripple generated on the ing a larger capacitor value further reduces the ripple noise appearing on the supply rail.If a constant capacitance is needed across temperature and voltage, X5R or X7R dielectric capacitors are recommended.Schottky DiodeThe peak repetitive current rating of the Schottky diode must be greater than the peak current flowing through the inductor. Also the continuous current rating of the Schottky must be greater than the average LED current. The voltage rating of the diode should be greater than the peak supply voltage transient preventing any breakdown or leakage.ON Semiconductor Schottky diode MBR0540 (40V ,500mA rated) is recommended. Schottky diodes rated at 400mA (or higher) continuous current are fine for most applications.NOTE:Schottky diodes with extremely low forward voltages (V F ) are not recommended, as they may cause an increase in the LED current.Dimming MethodsTwo methods for PWM dimming control on the LEDs are described below. The first method is to PWM on the control pin, the other method is to turn on and off a second resistor connected to the RSET pin and connected in parallel with R1.PWM on CTRL PinA PWM signal from a microprocessor can be used for dimming the LEDs when tied to the CTRL pin. The duty cycle which is the ratio between the On time and the total cycle time sets the dimming factor. The recommended PWM frequency on the CTRL pin is between 100Hz and 2kHz.Figure 24. PWM at 1 kHz on CTRL PinFigure 25. LED Current vs. Duty Cycle50100150200250300020406080100DUTY CYCLE [%]L E D C U R R E N T [m A ]Figure 26. Circuit for PWM on CTRLPWM on RSET PinAnother dimming method is to place in parallel to R1another resistor with a FET in series, as shown on Figure 27.R1 sets the minimum LED current corresponding to 0% duty cycle. The combined resistor of R1 and Rmax sets the maximum LED current corresponding to 100% duty cycle.Figure 27. Circuit for PWM on RSETA resistor value for R1 of less than 90 k W is recommended to provide better accuracy.Operation from High Supply Voltage Above 14 VFor operation from a supply voltage above 14 V , it is recommended to have a slew rate of 1 m s or more for every 5V increase in VBAT supply. When using a high supply voltage of 24 V , a 1 W or 2 W resistor in series with the supply,as shown on Figure 28, is recommended to limit the slew rate of the supply voltage. A 4.7 m F minimum ceramic capacitor is placed between the VBAT pin and ground. The combination of the series resistor R3 and input capacitor C1acts as a low pass filter limiting the excessive in−rush currents and overvoltage transients which would otherwise occur during “hot−plug” conditions, thereby protecting the CAT4201 driver.1 k WFigure 28. 24 V Application with 5 LEDsOperation from High Supply Voltage of 36 VWhen powering from a high supply voltage of 36 V , a 2W resistor in series with the supply is recommended, as shownon Figure 29, to limit the slew rate of the supply voltage.Inductor value should be 33 m H or higher.1 k WFigure 29. 36 V Application with 6 LEDsParallel Configuration for Driving LEDs Beyond 350mASeveral CA T4201 devices can be connected in parallel for driving LEDs with current in excess of 350 mA. The CAT4201 driver circuits are connected to the same LED cathode. Figure 30 shows the application schematic for driving 1 A into one LED with three CA T4201 connected in parallel. Each CA T4201 is driving the LED with a current set by its RSET resistor. The resulting LED current is equal to the sum of each driver current.CAT420111Figure 30. Three CAT4201 in Parallel for 1 A LEDOpen LED BehaviorIf the LEDs are not connected, the CAT4201 stops switching and draws very little current.At power−up with no load connected, the capacitor C2 is charged−up by the CA T4201. As soon as the bottom side of the capacitor (C2−) reaches 0 volt, as shown on Figure 31,the CA T4201 stops switching and remains in the idle mode only drawing about 0.4 mA current from the supply.Figure 31. Open LED ModeBoard LayoutIn order to minimize EMI and switching noise, the Schottky diode, the inductor and the output capacitor C2should all be located close to the driver IC. The input capacitor C1 should be located close to the VBA T pin and the Schottky diode cathode. The CA T4201 ground pin should be connected directly to the ground plane on the PCB. A recommended PCB layout with component location is shown on Figure 32. The LEDs are connected by two wires tied to both sides of the output capacitor C2. The LEDs can be located away from the driver if needed.Figure 32. Recommended PCB LayoutIn order to further reduce the ripple on the supply rail, an optional Pi style filter (C−L−C) can be used. A 10m H inductor rated to the maximum supply current can be used.TSOT −23, 5 LEAD CASE 419AE −01ISSUE ODATE 19 DEC 2008TOP VIEWSIDE VIEWEND VIEWNotes:(1) All dimensions are in millimeters. Angles in degrees.(2) Complies with JEDEC MO-193.SYMBOLθMINNOMMAXA A1A2b c DE E1e L 0º8ºL1L20.010.800.300.120.300.050.870.152.90 BSC 2.80 BSC 1.60 BSC 0.95 TYP0.400.60 REF 0.25 BSC1.000.100.900.450.200.50MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the rights of others.© Semiconductor Components Industries, LLC, 2019PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************onsemi Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales Representative◊。
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a r X i v :0807.1223v 1 [h e p -p h ] 8 J u l 2008Top-quark pair +1-jet production at next-to-leading order QCDMPP-2008-75MZ-TH/08-21SFB/CPP-08-45S.Dittmaier a ∗,P.Uwer b†,S.Weinzierl ca Max-Planck-Institut f¨u r Physik (Werner-Heisenberg-Institut),D-80805M¨u nchen,Germanyb Institutf¨u r Theoretische Teilchenphysik,Universit¨a t Karlsruhe,D-76128Karlsruhe,Germanyc Universit¨a tMainz,D-55099Mainz,GermanyTop-quark pair production with an additional jet is an important signal and background process at the LHC.We present the next-to-leading order QCD calculation for this process and show results for integrated as well as differential cross sections.1.IntroductionWith a mass of 172.6GeV the top-quark is by far the heaviest elementary fermion in the Stan-dard Model (SM).Its mass is more than 30times larger than the mass of the next heaviest fermion,the bottom-quark.The large mass has lead to vari-ous speculations whether the top-quark behaves as a normal quark or whether it plays a special role.In particular,the fact that the top-quark mass is close to the scale of electroweak symmety breaking—or equivalently,that the Yukawa coupling to the Higgs is very close to one—has motivated different scenarios in which the top-quark drives the electroweak symme-try breaking.For a recent overview we refer the inter-ested reader to Refs.[1,2].In the context of the SM the top-quark interactions are completely determined through the gauge structure.The only free param-eter appearing in top-quark physics is the top-quark mass.Once this parameter is measured all remain-ing properties are predicted.An important task for the ongoing Tevatron collider and the upcoming LHC is the precise measurement of the top-quark proper-ties.In this context the production of a top-quark pair togehter with an additional jet is an important reac-tion.This becomes already clear from the simple ob-servation that a substantial number of events in the2P.Uwer(LO)in the coupling constant of QCD are plagued by large uncertainties.In many cases the LO predictions in QCD give only a rough estimate.Only by includ-ing NLO corrections a quantitative reliable prediction can be obtained.Given that the conceptual problems of doing such calculations are solved since quite some time,one might think that doing the required calcula-tions should be a straightforward task.Unfortunately it turns out that this is not the case.The calcula-tion of QCD corrections for2→3and2→4reac-tions is still a highly non-trivial task—not speaking about reactions with an even higher multiplicity.In general the problem can be attributed to the fact that the corrsponding matrix elements are complex func-tions of many variables so that an analytic treatment is no longer feasible due to the large size of the ex-pressions.A solution to this problem is to resort to numerical methods.While in principlefine one is in many cases plagued by numerical instabilities and the long runtime.In particular,the reduction of one-loop tensor integrals to scalar one-loop integrals is in gen-eral difficult to do in a numerically stable way.In that context the calculation of the one-loop corrections to top-quark pair production with an additional jet is also interesting as a benchmark process for the develope-ment of new methods.In the present article we will briefly comment on the calculation of the NLO cor-rections.In addition we will show results for inte-grated quantities as well as for differential distribu-tions.2.Calculation2.1.Born approximationIn Born approximation the partonic reactions are gg→t¯t g,q¯q→t¯t g,qg→t¯t q,and g¯q→t¯t¯q.The last three reactions are related by crossing.In Born approximation various well-tested approaches to cal-culate the required matrix elements exist.We used recurrence relation`a la Berends and Giele[9]and a Feynman-diagram-based approach.In both cases four-dimensional helicity methods were employed.In addition we also used Madgraph[10]for checking. We found complete agreement of the different meth-ods.The explicit LO calculation shows indeed the large scale dependence as expected.Without going into details we just mention that in LO the importance of the individual partonic channels does not follow the pattern known from inclusive top-quark pair pro-duction.While at the Tevatron the situation t¯t+1-jet production is similar to the inclusive reaction,that is the total cross section is dominated by the quark–anti-quark channel followed by the gluon-fusion process, the situation at the LHC is different from inclusive production.The most important channel is gluon fu-sion,but in contrast to inclusive production the sec-ond important channel is the qg-channel.This is due to the large parton luminosity for this channel and due to a sizeable partonic cross section.2.2.Virtual correctionsThe virtual corrections consist of the one-loop cor-rections to the LO reactions.One can classify the cor-rections into self-energy corrections,vertex correc-tions,box-type corrections,and pentagon-type cor-rections where all the external legs are connected to one loop thus forming a pentagon.The latter are the most complicated ones owing to their complexity and the involved tensor integrals.The challenging step in this context is the numerically fast and stable re-duction of the tensor integrals to scalar one-loop in-tegrals.To ensure the correctness of our results we did two independent calculations of the virtual cor-rections using as far as possible different methods and also different tools.In one calculation the virtual cor-rections are essentially obtained following the proce-dure described in Ref.[11],where t¯t+H production at hadron colliders was considered.Feynman dia-grams and amplitudes have been generated with the FeynArts package[12,13]and further processed with in-house Mathematica routines,which automatically create an output in Fortran.The IR(soft and collinear) singularities are analytically separated from thefinite remainder as described in Refs.[11,14].The tensor integrals appearing in the pentagon diagrams are di-rectly reduced to box integrals following Ref.[15]. This method does not introduce inverse Gram deter-minants in this step,thereby avoiding notorious nu-merical instabilities in regions where these determi-nants become small.Box and lower-point integrals are reduced`a la Passarino–Veltman[16]to scalar inte-grals,which are either calculated analytically or using the results of Refs.[17,18,19].Sufficient numerical stability is already achieved in this way.Nevertheless the integral evaluation is currently further refined by employing the more sophisticated methods describedTop-quark pair +1-jet production at next-to-leading order QCD3in Ref.[20]in order to numerically stabilize the tensor integrals in exceptional phase-space regions.In thesecondcalculation the evaluationof loop diagrams starts with the generation of diagrams and amplitudes via QGRAF [21],which are then further manipulated with Form [22]and automatically trans-lated into C++code.The reduction of the 5-point tensor integrals to scalar integrals is performed with an extension of the method described in Ref.[23].In this procedure also inverse Gram determinants of four four-momenta are avoided.The lower-point ten-sor integrals are reduced using an independent imple-mentation of the Passarino–Veltman procedure.The IR-finite scalar integrals are evaluated using the FF package [24,25].2.3.Real correctionsThe matrix elements for the real corrections are given by 0→t ¯t gggg ,0→t ¯t q ¯qgg ,0→t ¯t q ¯qq ′¯q ′and 0→t ¯t q ¯qq ¯q .The various partonic processes are ob-tained from these matrix elements by all possible crossings of light particles into the initial state.The evaluation of the real-emission amplitudes is again performed in two independent ways.Both evaluations employ the dipole subtraction formalism [26,27,28]for the extraction of IR singularities and for their combination with the virtual corrections.One calculation of the real corrections results from a fully automated calculation based on helicity ampli-tudes,as described in Ref.[29].Individual helicity amplitudes are computed with the help of Berends–Giele recurrence relations [9].The evaluation of color factors and the generation of subtraction terms is au-tomated.For the channel gg →t ¯t gg a dedicated soft-insertion routine [30]is used for the generation of the phase space.The second calculation uses for the LO 2→3processes and the gg →t ¯t gg process optimized code obtained from a Feynman diagram-matic approach.As in the calculation described be-fore standard techniques like color decomposition and the use of helicity amplitudes are employed.For the 2→4processes including light quarks,Madgraph [10]has been used.The subtraction terms accord-ing to Ref.[28]are obtained in a semi-automatized manner based on an in-house library written in C++.3.ResultsIn the following we consistently use the CTEQ6[31,32]set of parton distribution functions (PDFs).In detail,we take CTEQ6L1PDFs with a 1-loop run-ning αs in LO and CTEQ6M PDFs with a 2-loop running αs in NLO.The number of active flavours is N F =5,and the respective QCD parameters are ΛLO 5=165MeV and Λσ+LO,σ±LO =σLO (y t >0)±σLO (y t <0),(1)where y t denotes the rapidity of the top-quark.Cross-4P.Uwerµ/m tσ[pb]1010.1654321µ/m tσ[pb]1010.115001000500Figure 1.Scale dependence of the LO and NLO cross sections for t ¯t +1-jet production at the Tevatron (left)and the LHC (right)as taken from Ref.[34],with the renormalization scale (µr )and the factorization scale (µf )set to µ.section contributions σ(y t ><0)correspond to top-quarks in the forward or backward hemispheres,re-spectively,where incoming protons fly into the for-ward direction by definition.Denoting the corre-sponding NLO contributions to the cross sections by δσ±NLO ,we define the asymmetry at NLO by A t FB ,NLO=σ−LOσ−LO−δσ+NLOTop-quark pair+1-jet production at next-to-leading order QCD5 Table1Cross section and forward-backward charge asymmetry at the Tevatron for different values of p cut T used to define the minimal transverse momentum p T of the additional jet(µ=µf=µr=m t).The upper and lower indices are the shifts towardsµ=m t/2andµ=2m t.20 1.791(1)+0.16−0.30−0.31−1.77(5)+0.5830 1.1194(8)+0.11−0.20−2.27(4)+0.31−0.51 400.7504(5)+0.072−0.49−0.14−2.73(4)+0.35 500.5244(4)+0.049−0.39−0.096−3.05(4)+0.496P.Uwerp T ,t [GeV]70060050040030020010002.01.51.00.5d σT ,tfb GeV100010010Figure 4.Same as Fig.3for the p T -distribution of the top-quark at LHC.addition we have studied the p cut T -dependence of the asymmetry in NLO.Further refinements of the pre-cise definition of the charge asymmetry are required to stabilize the predictions with respect to higher-order corrections.First results for differential distri-butions have been presented.The corrections are well under control over a large phase-space region and the scale uncertainty is again improved compared to the LO results.REFERENCES 1.W.Bernreuther,J.Phys.G35(2008)083001.2.T.Han,(2008),arXiv 0804.3178.3.S.Moch and P.Uwer,(2008),arXiv 0804.1476.4.M.Cacciari et al.,(2008),arXiv 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