Dell常用专有名词

合集下载

DELL 名词说明

DELL 名词说明

4.定义说明: 4.定义说明: 定义说明 MRB:负责审查不合格品之材料/在制品/加工品/成品及 负责审查不合格品之材料/在制品/加工品/ 负责审查不合格品之材料 客户退回之产品,是一个跨部门组织. 客户退回之产品,是一个跨部门组织. 不合格品:当材料/半成品/成品离开原有可识别状态, 不合格品:当材料/半成品/成品离开原有可识别状态,移动 至另外区域后无法识别,即为可疑材料/半成品/ 至另外区域后无法识别,即为可疑材料/半成品/ 成品,全部视为不合格品. 成品,全部视为不合格品.
Page :17
Dell 名词说明
1.英文缩写: 1.英文缩写:ESD 英文缩写 2.英文全文 2.英文全文:Electrostatic Discharge 英文全文 3.中 3.中 文:静电气排出
4.定义说明: 4.定义说明: 定义说明 4.1无线静电腕不允许使用. 4.1无线静电腕不允许使用. 无线静电腕不允许使用 4.2所有半导体材料在制作/运送/ 4.2所有半导体材料在制作/运送/包装过程中要防止静 所有半导体材料在制作 电破坏. 电破坏. 4.3半导体的材料/设备/仪器/工具/ 4.3半导体的材料/设备/仪器/工具/治具及工作桌皆接 半导体的材料 之规定) 地(量测频度依QPA中ESD之规定) . 量测频度依 中 之规定
Page :11
Dell 名词说明
1.英文缩写: 1.英文缩写:GR&R 英文缩写 2.英文全文: 2.英文全文:Gauge Repeatability and Reproducibility 英文全文 3.中 3.中 文:量具的再现性与再生性
4.定义说明: 4.定义说明: 定义说明
精密性(Precision) 精密性(Precision) 量测系统中之总变异 再现性 (repeatability;简称 rpt) (repeatability;简称 再生性 (reproducibility;简称 rpd) (reproducibility;简称

DELLVisor知识点

DELLVisor知识点

DELL Visor知识点几个视觉技术的区分VR:进入一个完全虚拟的世界AR:利用虚拟信息增强现实世界MR:虚拟与现实的深度融合什么是虚拟现实(VR)虚拟现实技术——利用电脑或其他智能计算设备模拟产生一个三维空间的虚拟世界,提供用户关于视觉、听觉、触觉等感官的模拟,让用户如同身历其境一般的奇妙体验。

什么是混合现实(MR)MR是数字化现实加上虚拟数字画面,并且可以进行互动,在技术上结合了VR与AR的优势,而且仅需连接一个头显和一个遥控手柄即可体验MR,在便携性和体验上最到最佳平衡。

MR包含AR和VR,一副MR的眼镜可以做AR和VR的事情,而AR和VR显然做不到MR的好体验。

1、易于穿戴和摘下的“上掀式”镜头可以帮助您在虚拟世界和现实之间快速切换2、采用Inside-out 追踪定位技术的摄像头传感器不再需要外部摄像头和定位3、良好的衬垫和耐用的头带舒适地贴合在您的前额上4、精良的面部衬垫使得眼镜佩戴者也能够舒适地体验5、重量平衡头带能够避免鼻子和面颊承受的压力6、线缆管理夹能够确保线缆始终置于头带后方以利于佩戴者更好地移动7、拨轮的设计能方便快捷地按照头部尺寸调节舒适度卓越的视觉效果1、DELL Visor具有单眼1440 x 1440的分辨率和90Hz的刷新率,360度全方位观看画面不失帧2、两块SHARP 2.89英寸LCD 液晶显示屏和菲涅尔透镜组通过锐利的聚焦和出色的景深,能够呈现清晰透亮的画面效果。

符合人体工程学1、有效的平衡重量,避免鼻子和面颊承重,同时还方便掌握重心,移动自如2、上掀式MR镜头可以翻转90度,可以在虚拟世界和现实之间快速切换材质优良前后两侧的头部绑带海绵采用高密度材料制成,可有效减少摩擦,任意行动感觉依然舒适到位,佩戴头盔时,头带可以舒适地贴合在额头上,同时橡胶鼻垫可以避免光线射入。

高度集成根据具体需求,可自由调整头显松紧度,利用拇指操纵杆、触发按钮和触摸板能更加自由舒适地控制头显,在游戏过程中行动自如,例如:前行、后退、爬高、下降、左转、右转,符合人体工学设计,每种体验都更加真实。

Dell 常用专有名词

Dell 常用专有名词

Acronyms for SEQ SSM Class General Acronyms4MEP – Machines, Materials, Measurements, Methods, Environment, People. General cause categories. Also known as 5M’s or 6M’s.AIAG – Automotive Industry Action Group.AMF – (Dell) Americas Manufacturing Facility. Includes factories located in Austin, Nashville, and North CarolinaAPCC – (Dell) Asia-Pacific Customer Center. Factory located in Penang, MalaysiaAVL – Approved Vendor List. Sometimes ASL (Approved Suppliers List). Some interchange with BOM (Build of Materials or Bill of Materials), but BOM is different than AVL/ASL.BC – Business Contract.BPI –Business Process Improvement. Dell’s Quality philosophy, which includes Six Sigma tools and practices, Lean Technology principles, and other aspects of Quality Improvement. BST – Business Strategy Team.CA – Corrective Action.CCC – (Dell) China Customer Center. Factory located in Xiamen, ChinaCE – Customer Experience.CIP – Continual (or Continuous) Improvement Process.COC – Center of Competency.COS – Continuity of Supply.CTQ – Critical to Quality, usually referring to characteristics of the product or process.CLCA – Closed Loop Corrective Action. A methodology of characterizing, containing, resolving and reporting special cause events in a process.DES/DID – Design-Induced Damage.DFSS – Design for Six Sigma.DFX (or DFx) –Design for X, often called “Design for Everything.” Types of X’es include: Cost, Quality, Reliability, Manufacturing, Test, Service, Six SigmaDVT – Design Validation Testing.E2E – End to End, referring to a type of process flowchart or map.EBST – Executive Business Strategy Team.ECN – Engineering Change Notification.ECO – Engineering Change Order.EICC – Electronics Industry Code of Conduct.EMF – (Dell) Europe Manufacturing Center. Factory located in Limerick, Ireland. Will include new factory in Poland in the near future.EOL – End of Life. The end of warranty obligations (typically the same as EOSL).EOPL – End of Production Life. Dell factory stops manufacturing.EOS – Electrical Over Stress.EOSL – End of Service Life. Dell stops servicing (typically when warranty period complete). ESD – Electro Static Discharge.EVT – Engineering Validation Testing.FA – Failure Analysis.FAI – First Article Inspection.FIFO – First In First Out.FMEA – Failure Mode Effects Analysis.FPM – Functional Process Manual.GB/BB – Green Belt / Black Belt. Levels of skill and knowledge attainment within Six Sigma; often refers to specific certifications.GR&R – Gage Repeatability & Reproducibility.HALT – Highly Accelerated Life Test.HASS – Highly Accelerated Stress Screen.IQA – Incoming Quality Assurance.IQC – Incoming Quality Control.JMP – Name of a powerful statistical program used in data analysis. Began as “Jon’s Mac Project” in 1989.LOB – Line of Business.MARCOM – Marketing Communication.MQT – Manufacturing Quality and Test, another title for the QMP.MRB – Material Review Board.MSA – Measurement System Analysis.MSE – Measurement System Error.MTBF – Mean Time Between Failures.NPI – New Product Introduction.NPO – New Product Operations.NPP – New Product Process; also used for New Product Plan.NPRR – New Product Readiness Review. A review sequence that is mostly replaced by Safe Launch.OBA – Out of Box Audit.OHSAS – Occupational Health and Safety Assessment Series. A pair of standards, OHSAS 18001 and 18002, on OHS Management Systems (OHSMS).OPEX – Operating Expenses. Including headcount, travel expense, administrative expense, etc. OQC – Outgoing Quality Control.ODM – Original Design Manufacturer.ORT – Ongoing Reliability Test(ing).OSV – On-site Verification.PCN – Process Change Notification. Sometimes Product Change Notification, but not often. PDCA – Plan Do Check Act. An improvement methodology.PFG – Product Features Guide.PID – Process-Induced Damage, usually implying Dell process (but also widely used in industry). PG – (Dell) Product Group.PM – Program Manager.PMT – Process Maturity Testing.PO – Purchase Order.PRP – Phase Review Process.PWB – Printed Wiring Board. Also called PCB (Printed Circuit Board)QBR – Quarterly Business Review.QDS – Quality Data System.QMP – Quality Management Plan.QMS – Quality Management System.QPA – Quality Process Audit. Commodity specific tool/checklist at Dell.QS – Quality System.QSA – Quality Systems Audit. Standard (same for all commodities) tool/checklist at Dell. RACI – Responsible, Accountable, Consulted, Informed. Four categories of job responsibility involvement.R&R – Roles and Responsibilities.RFI – Request for Information.RFQ/RFP – Request for Quote / Request for Proposal. No significant difference within the Dell WWP system, but may mean different things in other companies.RTS – Ready to Ship. Some places use Release to Ship.SCAR – Supplier Corrective Action Request. Typical supplier response is done through 5C Process; some suppliers use 8D Process.SEQ – Supplier Engineering and Quality. A department inside a company; Dell SEQ is part of WWP (Worldwide Procurement). Many other companies in the industry use SQE (Supplier Quality Engineering).SOW – Statement of Work.SPC – Statistical Process Control. Often interchangeable with SQC (Statistical Quality Control) in Dell SEQ documentation.SPRT – Sequential Probability Ratio Test.SSM – Supplier Selection and Management. A training class, and a key business process. STSM – Sub-tier Supplier Management. Used to refer to a Dell initiative, and also used to label a specific quality conformance audit & checklist. Standard (same for all commodities)tool/checklist at DellTGT – Target.VOC – Voice of Customer.VID – Vendor-Induced Damage.WW – Worldwide, or World Wide.WWP – Worldwide Procurement.Quality Metrics90FIR – FIR in the first 90 days after product shipment from Dell factory.AFR – Annualized Failure Rate.ARR – Annualized Return Rate.CND – Can Not Duplicate.DPPM – Defective Parts Per Million.FIR – Field Incident Rate. Field Failures. Typically measured in dppm.IFIR – Initial Field Incident Rate. FIR in the first 30 days after product shipment from Dell factoryLRR – Line Reject Rate. Failure rate in the Dell factory. Typically measured in dppm. MDR – Manufacturing Defect Rate; also seen as Materials Defect Rate. Obsolete metric; no longer used in Dell.NFF – No Fault Found.NTF – No Trouble Found.SVLRR – Sub-tier VLRR. Component failure rate in the 1st tier supplier factory.VIFIR – Verified IFIR.VFIR – Verified FIR.VLRR – Verified LRR.Quality StandardsISO-9000 – A family of standards which define the requirements for a Quality Management System. These standards are owned and maintained by ISO (International Standards Organization).QS-9000 – Quality System 9000. A quality systems standard specific to the automotive industry. Covers supplier requirements for production parts, materials, and services. Built on ISO9001:1994, with additional requirements.TL-9000 – Telecom 9000. A quality systems standard based on ISO 9000, with additional requirements for the telecommunications industry.TS-16949 – Technical Specification 16949. Built by the IATF (International Automotive Task Force) in collaboration with ISO. Originally designed to align the quality system requirementsof the U.S. automotive industry with the German, French, and Italian automotive industries.Job Titles and RolesFAE/FAS – Failure Analysis Engineer / Failure Analysis Support. A supplier role at a Dell site. GCM – Global Commodity Manager. A Dell role. Business role managing contractual and commercial relationship with suppliers.GCQM – Global Commodity Quality Manager. A Dell role with global quality responsibilities within a commodity.GQAM – Global Quality Account Manager. A supplier role with global quality responsibilities within a commodity.GSQE – See SQE.GSQM – Global Supplier Quality Manager. A Dell Role with global quality responsibilities. JQE/JQM – Joint Quality Engineer / Joint Quality Manager. A supplier role, dedicated to supporting Dell quality performance, at a supplier site.SEQ (previously SQE and may still exist in older documents) – Supplier Engineering & Quality (Supplier Quality Engineering). A Dell field engineering role, collaborating with suppliers. GCT – Global Commodity Team. A cross-functional team within Dell that manages a commodity’s business.。

电脑专业术语(全版)

电脑专业术语(全版)

本文由纷飞的温柔贡献 ******************************* <计算机专业术语大全(中 ̄英文版)> ******************************* AGP(Accelerated Graphics Port) -图形加速接口 Access Time-存取时间 Address-地址 ANSI (American National Standards Institute) 美国国家标准协会 ASCII (American Standard Code for Information Interchange) Async SRAM-异步静态内存 BSB (Backside Bus) Bandwidth-带宽 Bank -内存库 Bank Schema -存储体规划 Base Rambus -初级的Rambus内存 Baud -波特 BGA (Ball Grid Array)-球状引脚栅格阵列封装技术 Binary -二进制 BIOS (Basic Input-Output System) -基本输入/输出系统 Bit-位、比特 BLP-底部引出塑封技术 Buffer-缓冲区 Buffered Memory-带缓冲的内存 BEDO (Burst EDO RAM) -突发模式EDO随机存储器 Burst Mode-突发模式 Bus-总线 Bus Cycle-总线周期 Byte-字节 Cacheability-高速缓存能力 Cache Memory-高速缓存存储器 CAS (Column Address Strobe)-列地址选通脉冲 CL(CAS Latency )-列地址选通脉冲时间延迟 CDRAM (Cache DRAM)-快取动态随机存储器 Checksum-检验和,校验和 Chipset-芯片组 Chip-Scale Package (CSP)-芯片级封装 Compact Flash-紧凑式闪存 Concurrent Rambus-并发式总线式内存 Continuity RIMM (C-RIMM)-连续性总线式内存模组 CMOS(Complementary Metal-Oxide-Semicomductor)-互补金属氧化物半导体用于晶体管 CPU (Central Processing Unit)-中央处理单元 Credit Card Memory -信用卡内存 DDR(Double Data Rate SDRAM)- 双数据输出同步动态存储器。

DELL常用名词缩写

DELL常用名词缩写

Service Tag服务编号 下两个工作日安排上门(周一 NBD(8*5) 派单,周三上门) 显示器内置监测 SALE PPID(Product UEFI BIOS中的硬件检测 Part Identification) 预装在电脑中的检测程序 Clear RTC Jumper 从官网点击运行的检测程序 显卡交火 4096*2160分辨率 格式化键盘的命令 安全问题 电池健康管理 有备件,有包装盒,说明书 等,全新的(专用工具包) 快速存储/启动(英特尔快速存 储技术) DELL Backup and Recovery(戴尔备份与恢复) 网卡物理地址 显示器上门 亚太区 上门工程师 客户关怀(非技术) 意外保险 主板加密芯片 处理媒体case部门 自动选part 4HR(24*7) PIOW4 CIS (carry in service) 6HR PSU PPG Rapod Dispatch SNP Quickset 3包客户 Spare Part CCC RUN Q CSR=CRU P/N SR TT
直接内存存取 芯片(可擦写/不可擦写) 中断 下三个工作日安排工程师上门服务(周一派单,周四上门) 实时时钟 加时上门服务(用户要求晚上和周末时间上门更换) 主机前面开关控制面板 子板 触控板两侧的区域 直流电源输入孔 系统过热 系统蓝屏 备件号 win8Home&Pro64位(系统备件号) win8单语言,英文版 Direct USB Key恢复U盘 标注 戴尔品质翻新机 整机更换 开箱物损 旧版录入系统 贸易管制 预装系统恢复U盘 快递
邮寄服务(பைடு நூலகம்保修部分零 件,提供送修服务) 上门
DMA(Directional Memory Access) ROM
意外保修服务 IRQ 下一工作日上门服务(节假 TBD(8*5) 日和双休不属于工作日) 销售 RTC(Real-Time Clock) 品编号(20位,英文+数字) N&WS 台式机 跳线 Cintrol Panel 四小时内安排工程师上门维 Daughter Board 修 4小时内邮寄给客户 Palm rest 用户自行送修 拨打电话后6小时内工程师上 门 背后电源诊断灯 完美屏的保修服务 不带备件,工程师直接上门 检测,现场来电申请备件 周边产品 快速设置 指个人用户 只有一个备件,不一定是全 新 中国地区 电话转接 用户自己更换备件 Part Number 整个case 提交给IT DC-IN System Overheat System Unstable Issue P/N win8H/P64 W8EM64,ENG DUSB Key Remark ARB WUR MWD DCS TCO DPK DLP

计算机术语大全(很好的哦)

计算机术语大全(很好的哦)

计算机术语大全1、CPU3DNow!(3D no waiting,无须等待的3D处理)AAM(AMD Analyst Meeting,AMD分析家会议)ABP(Advanced Branch Prediction,高级分支预测)ACG(Aggressive Clock Gating,主动时钟选择)AIS(Alternate Instruction Set,交替指令集)ALAT(advanced load table,高级载入表)ALU(Arithmetic Logic Unit,算术逻辑单元)Aluminum(铝)AGU(Address Generation Units,地址产成单元)APC(Advanced Power Control,高级能源控制)APIC(Advanced rogrammable Interrupt Controller,高级可编程中断控制器)APS(Alternate Phase Shifting,交替相位跳转)ASB(Advanced System Buffering,高级系统缓冲)ATC(Advanced Transfer Cache,高级转移缓存)ATD(Assembly Technology Development,装配技术发展)BBUL(Bumpless Build-Up Layer,内建非凹凸层)BGA(Ball Grid Array,球状网阵排列)BHT(branch prediction table,分支预测表)Bops(Billion Operations Per Second,10亿操作秒)BPU(Branch Processing Unit,分支处理单元)BP(Brach Pediction,分支预测)BSP(Boot Strap Processor,启动捆绑处理器)BTAC(Branch Target Address Calculator,分支目标寻址计算器)CBGA (Ceramic Ball Grid Array,陶瓷球状网阵排列)CDIP (Ceramic Dual-In-Line,陶瓷双重直线)Center Processing Unit Utilization,中央处理器占用率CFM(cubic feet per minute,立方英尺秒)CMT(course-grained multithreading,过程消除多线程)CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)CMOV(conditional move instruction,条件移动指令)CISC(Complex Instruction Set Computing,复杂指令集计算机)CLK(Clock Cycle,时钟周期)CMP(on-chip multiprocessor,片内多重处理)CMS(Code Morphing Software,代码变形软件)co-CPU(cooperative CPU,协处理器)COB(Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))COD(Cache on Die,芯片内核集成缓存)Copper(铜)CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)CPI(cycles per instruction,周期指令)CPLD(Complex Programmable Logic Device,複雜可程式化邏輯元件)CPU(Center Processing Unit,中央处理器)CRT(Cooperative Redundant Threads,协同多余线程)CSP(Chip Scale Package,芯片比例封装)CXT(Chooper eXTend,增强形K6-2内核,即K6-3)Data Forwarding(数据前送)dB(decibel,分贝)DCLK(Dot Clock,点时钟)DCT(DRAM Controller,DRAM控制器)DDT(Dynamic Deferred Transaction,动态延期处理)Decode(指令解码)DIB(Dual Independent Bus,双重独立总线)DMT(Dynamic Multithreading Architecture,动态多线程结构)DP(Dual Processor,双处理器)DSM(Dedicated Stack Manager,专门堆栈管理)DSMT(Dynamic Simultaneous Multithreading,动态同步多线程)DST(Depleted Substrate Transistor,衰竭型底层晶体管)DTV(Dual Threshold Voltage,双重极限电压)DUV(Deep Ultra-Violet,纵深紫外光)EBGA(Enhanced Ball Grid Array,增强形球状网阵排列)EBL(electron beam lithography,电子束平版印刷)EC(Embedded Controller,嵌入式控制器)EDB(Execute Disable Bit,执行禁止位)EDEC(Early Decode,早期解码)Embedded Chips(嵌入式)EM64T(Extended Memory 64 Technology,扩展内存64技术)EPA(edge pin array,边缘针脚阵列)EPF(Embedded Processor Forum,嵌入式处理器论坛)EPL(electron projection lithography,电子发射平版印刷)EPM(Enhanced Power Management,增强形能源管理)EPIC(explicitly parallel instruction code,并行指令代码)EUV(Extreme Ultra Violet,紫外光)EUV(extreme ultraviolet lithography,极端紫外平版印刷)FADD(Floationg Point Addition,浮点加)FBGA(Fine-Pitch Ball Grid Array,精细倾斜球状网阵包装)FBGA(flipchip BGA,轻型芯片BGA)FC-BGA(Flip-Chip Ball Grid Array,翻转芯片球形网阵包装)FC-LGA(Flip-Chip Land Grid Array,翻转接点网阵包装)FC-PGA(Flip-Chip Pin Grid Array,翻转芯片球状网阵包装)FDIV(Floationg Point Divide,浮点除)FEMMS:Fast EntryExit Multimedia State,快速进入退出多媒体状态FFT(fast Fourier transform,快速热欧姆转换)FGM(Fine-Grained Multithreading,高级多线程)FID(FID:Frequency identify,频率鉴别号码)FIFO(First Input First Output,先入先出队列)FISC(Fast Instruction Set Computer,快速指令集计算机)flip-chip(芯片反转)FLOPs(Floating Point Operations Per Second,浮点操作秒)FMT(fine-grained multithreading,纯消除多线程)FMUL(Floationg Point Multiplication,浮点乘)FPRs(floating-point registers,浮点寄存器)FPU(Float Point Unit,浮点运算单元)FSUB(Floationg Point Subtraction,浮点减)GFD(Gold finger Device,金手指超频设备)GHC(Global History Counter,通用历史计数器)GTL(Gunning Transceiver Logic,射电收发逻辑电路)GVPP(Generic Visual Perception Processor,常规视觉处理器)HL-PBGA 表面黏著,高耐热、轻薄型塑胶球状网阵封装HTT(Hyper-Threading Technology,超级线程技术)Hz(hertz,赫兹,频率单位)IA(Intel Architecture,英特尔架构)IAA(Intel Application Accelerator,英特尔应用程序加速器)IATM(Intel Advanced Thermal Manager,英特尔高级热量管理指令集)ICU(Instruction Control Unit,指令控制单元)ID(identify,鉴别号码)IDF(Intel Developer Forum,英特尔开发者论坛)IDMB(Intel Digital Media Boost,英特尔数字媒体推进指令集)IDPC(Intel Dynamic Power Coordination,英特尔动态能源调和指令集)IEU(Integer Execution Units,整数执行单元)IHS(Integrated Heat Spreader,完整热量扩展)ILP(Instruction Level Parallelism,指令级平行运算)IMM Intel Mobile Module, 英特尔移动模块Instructions Cache,指令缓存Instruction Coloring(指令分类)IOPs(Integer Operations Per Second,整数操作秒)IPC(Instructions Per Clock Cycle,指令时钟周期)ISA(instruction set architecture,指令集架构)ISD(inbuilt speed-throttling device,内藏速度控制设备)ITC(Instruction Trace Cache,指令追踪缓存)ITRS(International Technology Roadmap for Semiconductors,国际半导体技术发展蓝图)KNI(Katmai New Instructions,Katmai新指令集,即SSE)Latency(潜伏期)LDT(Lightning Data Transport,闪电数据传输总线)LFU(Legacy Function Unit,传统功能单元)LGA(land grid array,接点栅格阵列)LN2(Liquid Nitrogen,液氮)Local Interconnect(局域互连)MAC(multiply-accumulate,累积乘法)mBGA (Micro Ball Grid Array,微型球状网阵排列)nm(namometer,十亿分之一米毫微米)MCA(Machine Check Architecture,机器检查架构)MCU(Micro-Controller Unit,微控制器单元)MCT(Memory Controller,内存控制器)MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)MF(MicroOps Fusion,微指令合并)mm(micron metric,微米)MMX(MultiMedia Extensions,多媒体扩展指令集)MMU(Multimedia Unit,多媒体单元)MMU(Memory Management Unit,内存管理单元)MN(model numbers,型号数字)MFLOPS(Million Floationg PointSecond,每秒百万个浮点操作)MHz(megahertz,兆赫)mil(PCB 或晶片佈局的長度單位,1 mil = 千分之一英寸)MIMD(Multi Instruction Multiple Data,多指令多数据流)MIPS(Million Instruction Per Second,百万条指令秒)MOESI(Modified, Owned, Exclusive, Shared or Invalid,修改、自有、排除、共享或无效)MOF(Micro Ops Fusion,微操作熔合)Mops(Million Operations Per Second,百万次操作秒)MP(Multi-Processing,多重处理器架构)MPF(Micro processor Forum,微处理器论坛)MPU(Microprocessor Unit,微处理器)MPS(MultiProcessor Specification,多重处理器规范)MSRs(Model-Specific Registers,特别模块寄存器)MSV(Multiprocessor Specification Version,多处理器规范版本)MVP(Mobile Voltage Positioning,移动电压定位)IVNAOC(no-account OverClock,无效超频)NI(Non-Intel,非英特尔)NOP(no operation,非操作指令)NRE(Non-Recurring Engineering charge,非重複性工程費用)OBGA(Organic Ball Grid Arral,有机球状网阵排列)OCPL(Off Center Parting Line,远离中心部分线队列)OLGA(Organic Land Grid Array,有机平面网阵包装)OoO(Out of Order,乱序执行)OPC(Optical Proximity Correction,光学临近修正)OPGA(Organic Pin Grid Array,有机塑料针型栅格阵列)OPN(Ordering Part Number,分类零件号码)PAT(Performance Acceleration Technology,性能加速技术)PBGA(Plastic Pin Ball Grid Array,塑胶球状网阵排列)PDIP (Plastic Dual-In-Line,塑料双重直线)PDP(Parallel Data Processing,并行数据处理)PGA(Pin-Grid Array,引脚网格阵列),耗电大PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)Post-RISC(加速RISC,或后RISC)PPE(Power Processor Element,Power处理器元件)PPU(Physics Processing Unit,物理处理单元)PR(Performance Rate,性能比率)PIB(Processor In a Box,盒装处理器)PM(Pseudo-Multithreading,假多线程)PPGA(Plastic Pin Grid Array,塑胶针状网阵封装)PQFP(Plastic Quad Flat Package,塑料方块平面封装)PSN(Processor Serial numbers,处理器序列号)QFP(Quad Flat Package,方块平面封装)QSPS(Quick Start Power State,快速启动能源状态)RAS(Return Address Stack,返回地址堆栈)RAW(Read after Write,写后读)REE(Rapid Execution Engine,快速执行引擎)Register Contention(抢占寄存器)Register Pressure(寄存器不足)Register Renaming(寄存器重命名)Remark(芯片频率重标识)Resource contention(资源冲突)Retirement(指令引退)RISC(Reduced Instruction Set Computing,精简指令集计算机)ROB(Re-Order Buffer,重排序缓冲区)RSE(register stack engine,寄存器堆栈引擎)RTL(Register Transfer Level,暫存器轉換層。

常用的计算机专业术语

常用的计算机专业术语

常用的计算机专业术语+解释1、计算机网络:是利用通信设备和线路将地理位置不同的、功能独立的多个计算机系统互连起来,以功能完善的网总软件实现网络中资源共享和信息传递的系统。

2、联机系统:是由一台中央计算机连接大量的地理位置分散的终端而构成的计算机系统3、PDN:是公用数据网。

网中传输的是数字化的数据,属于通信子网的一种。

4、OSI:是开放系统互连参考模型。

为ISO(国际标准化组织)制订的七层网络模型。

5、数据通信:是一种通过计算机或其他数据装置与通信线路,完成数据编码信号的传输、转接、存储和处理的通信技术。

6、数据传输率:每秒能传输的二进制信息位数,单位为B/S.7、信道容量:是信息传输数据能力的极限,是信息的最大数据传输速率。

8、自同步法:是指接收方能从数据信号波形中提取同步信号的方法。

9、PCM:称脉码调制,是将模拟数据换成数字信号编码的最常用方法。

10、FDM:又称时分多路复用技术,是在信道带宽超过原始信号所需带宽情况下,将物理停产的总带宽分成若干个与传输单个信号带宽相同的子停产,每个子信息传输一路信号。

11、同步传输:是以一批字符为传输单位,仅在开始和结尾加同步标志,字符间和比特间均要求同步。

12、差错控制:是指在数据通信过程中能发现或纠正差错,把差错限制在尽可能小的允许范围内的技术和方法。

13、信号:是数据的电子或电磁编码。

14、MODEM:又称调制解调器。

其作用是完成数字数据和模拟信号之间的转换,使传输模拟信号的媒体能传输数字数据。

发送端MODEM将数字数据调制转换为模拟信号,接收端MODEM再把模拟信号解调还原为原来的数字数据。

15、信号传输速率:也称码元率、调制速率或波特率,表示单位时间内通过信道传输的码元个数,单位记做BAND.16、基带传输:是在线路中直接传送数字信号的电脉冲,是一种最简单的传输方式,适用于近距离通信的局域网。

17、串行通信:数据是逐位地在一条通信线上传输的,较之并行通信速度慢,传输距离远。

DELL专用术语解析

DELL专用术语解析

持续精进优化系统品质
品保总处 系统品质
DELL专用术语解析
缩写 QPA QSA SPC SQE 英文全称 Quality Process Audit Quality System Audit Supplier Quality Engineer 中文解析 品质过程稽核 品质体系稽核 协辅工程师 品质持续改善计划
DELL专用术语解析
—体系DELL化宣导文宣一
持续精进优化系统品质
品保总处 系统品质
DELL专用术语解析
缩写 AFR ARR 英文全称 Annualized Failure Rate Annualized Return Rate 中文解析 年度不良率 年度返品率
DPP M
DVT
ECO EVT
Defective Per Million
FMEA Failure Mode Effect Analysis
GQA M
Global Quality Account Manager
全球品质经理
持续精进优化系统品质
品保总处 系统品质
DELL专用术语解析
缩写 英文全称 中文解析 量具重复性和 再现性 进料品质管制 GR&R Gauge Repeatability and Reproducibility IQC Incoming Quality Control
Statistical Process Control 统计制程管制
IPQC In Process Quality Control 制程品质管制 QCIP Quality Continuous Improvement Plan
持续精进优化系统品质
品保总处 系统品质
Design Validation Testing
  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

Acronyms for SEQ SSM ClassGeneral Acronyms4MEP – Machines, Materials, Measurements, Methods, Environment, People. General cause categories. Also known as 5M’s or 6M’s.AIAG – Automotive Industry Action Group.AMF – (Dell) Americas Manufacturing Facility. Includes factories located in Austin, Nashville, and North CarolinaAPCC – (Dell) Asia-Pacific Customer Center. Factory located in Penang, MalaysiaAVL – Approved Vendor List. Sometimes ASL (Approved Suppliers List). Some interchange with BOM (Build of Materials or Bill of Materials), but BOM is different than AVL/ASL.BC – Business Contract.BPI –Business Process Improvement. Dell’s Quality philosophy, which includes Six Sigma tools and practices, Lean Technology principles, and other aspects of Quality Improvement. BST – Business Strategy Team.CA – Corrective Action.CCC – (Dell) China Customer Center. Factory located in Xiamen, ChinaCE – Customer Experience.CIP – Continual (or Continuous) Improvement Process.COC – Center of Competency.COS – Continuity of Supply.CTQ – Critical to Quality, usually referring to characteristics of the product or process.CLCA – Closed Loop Corrective Action. A methodology of characterizing, containing, resolving and reporting special cause events in a process.DES/DID – Design-Induced Damage.DFSS – Design for Six Sigma.DFX (or DFx) –Design for X, often called “Design for Everything.” Types of X’es include: Cost, Quality, Reliability, Manufacturing, Test, Service, Six SigmaDVT – Design Validation Testing.E2E – End to End, referring to a type of process flowchart or map.EBST – Executive Business Strategy Team.ECN – Engineering Change Notification.ECO – Engineering Change Order.EICC – Electronics Industry Code of Conduct.EMF – (Dell) Europe Manufacturing Center. Factory located in Limerick, Ireland. Will include new factory in Poland in the near future.EOL – End of Life. The end of warranty obligations (typically the same as EOSL).EOPL – End of Production Life. Dell factory stops manufacturing.EOS – Electrical Over Stress.EOSL – End of Service Life. Dell stops servicing (typically when warranty period complete). ESD – Electro Static Discharge.EVT – Engineering Validation Testing.FA – Failure Analysis.FAI – First Article Inspection.FIFO – First In First Out.FMEA – Failure Mode Effects Analysis.FPM – Functional Process Manual.GB/BB – Green Belt / Black Belt. Levels of skill and knowledge attainment within Six Sigma; often refers to specific certifications.GR&R – Gage Repeatability & Reproducibility.HALT – Highly Accelerated Life Test.HASS – Highly Accelerated Stress Screen.IQA – Incoming Quality Assurance.IQC – Incoming Quality Control.JMP – Name of a powerful statistical program used in data analysis. Began as “Jon’s Mac Project” in 1989.LOB – Line of Business.MARCOM – Marketing Communication.MQT – Manufacturing Quality and Test, another title for the QMP.MRB – Material Review Board.MSA – Measurement System Analysis.MSE – Measurement System Error.MTBF – Mean Time Between Failures.NPI – New Product Introduction.NPO – New Product Operations.NPP – New Product Process; also used for New Product Plan.NPRR – New Product Readiness Review. A review sequence that is mostly replaced by Safe Launch.OBA – Out of Box Audit.OHSAS – Occupational Health and Safety Assessment Series. A pair of standards, OHSAS 18001 and 18002, on OHS Management Systems (OHSMS).OPEX – Operating Expenses. Including headcount, travel expense, administrative expense, etc. OQC – Outgoing Quality Control.ODM – Original Design Manufacturer.ORT – Ongoing Reliability Test(ing).OSV – On-site Verification.PCN – Process Change Notification. Sometimes Product Change Notification, but not often. PDCA – Plan Do Check Act. An improvement methodology.PFG – Product Features Guide.PID – Process-Induced Damage, usually implying Dell process (but also widely used in industry). PG – (Dell) Product Group.PM – Program Manager.PMT – Process Maturity Testing.PO – Purchase Order.PRP – Phase Review Process.PWB – Printed Wiring Board. Also called PCB (Printed Circuit Board)QBR – Quarterly Business Review.QDS – Quality Data System.QMP – Quality Management Plan.QMS – Quality Management System.QPA – Quality Process Audit. Commodity specific tool/checklist at Dell.QS – Quality System.QSA – Quality Systems Audit. Standard (same for all commodities) tool/checklist at Dell. RACI – Responsible, Accountable, Consulted, Informed. Four categories of job responsibility involvement.R&R – Roles and Responsibilities.RFI – Request for Information.RFQ/RFP – Request for Quote / Request for Proposal. No significant difference within the Dell WWP system, but may mean different things in other companies.RTS – Ready to Ship. Some places use Release to Ship.SCAR – Supplier Corrective Action Request. Typical supplier response is done through 5C Process; some suppliers use 8D Process.SEQ – Supplier Engineering and Quality. A department inside a company; Dell SEQ is part of WWP (Worldwide Procurement). Many other companies in the industry use SQE (Supplier Quality Engineering).SOW – Statement of Work.SPC – Statistical Process Control. Often interchangeable with SQC (Statistical Quality Control) in Dell SEQ documentation.SPRT – Sequential Probability Ratio Test.SSM – Supplier Selection and Management. A training class, and a key business process. STSM – Sub-tier Supplier Management. Used to refer to a Dell initiative, and also used to label a specific quality conformance audit & checklist. Standard (same for all commodities)tool/checklist at DellTGT – Target.VOC – Voice of Customer.VID – Vendor-Induced Damage.WW – Worldwide, or World Wide.WWP – Worldwide Procurement.Quality Metrics90FIR – FIR in the first 90 days after product shipment from Dell factory.AFR – Annualized Failure Rate.ARR – Annualized Return Rate.CND – Can Not Duplicate.DPPM – Defective Parts Per Million.FIR – Field Incident Rate. Field Failures. Typically measured in dppm.IFIR – Initial Field Incident Rate. FIR in the first 30 days after product shipment from Dell factoryLRR – Line Reject Rate. Failure rate in the Dell factory. Typically measured in dppm. MDR – Manufacturing Defect Rate; also seen as Materials Defect Rate. Obsolete metric; no longer used in Dell.NFF – No Fault Found.NTF – No Trouble Found.SVLRR – Sub-tier VLRR. Component failure rate in the 1st tier supplier factory.VIFIR – Verified IFIR.VFIR – Verified FIR.VLRR – Verified LRR.Quality StandardsISO-9000 – A family of standards which define the requirements for a Quality Management System. These standards are owned and maintained by ISO (International Standards Organization).QS-9000 – Quality System 9000. A quality systems standard specific to the automotive industry. Covers supplier requirements for production parts, materials, and services. Built on ISO9001:1994, with additional requirements.TL-9000 – Telecom 9000. A quality systems standard based on ISO 9000, with additional requirements for the telecommunications industry.TS-16949 – Technical Specification 16949. Built by the IATF (International Automotive Task Force) in collaboration with ISO. Originally designed to align the quality system requirementsof the U.S. automotive industry with the German, French, and Italian automotive industries.Job Titles and RolesFAE/FAS – Failure Analysis Engineer / Failure Analysis Support. A supplier role at a Dell site. GCM – Global Commodity Manager. A Dell role. Business role managing contractual and commercial relationship with suppliers.GCQM – Global Commodity Quality Manager. A Dell role with global quality responsibilities within a commodity.GQAM – Global Quality Account Manager. A supplier role with global quality responsibilities within a commodity.GSQE – See SQE.GSQM – Global Supplier Quality Manager. A Dell Role with global quality responsibilities. JQE/JQM – Joint Quality Engineer / Joint Quality Manager. A supplier role, dedicated to supporting Dell quality performance, at a supplier site.SEQ (previously SQE and may still exist in older documents) – Supplier Engineering & Quality (Supplier Quality Engineering). A Dell field engineering role, collaborating with suppliers. GCT – Global Commodity Team. A cross-functional team within Dell that manages a commodity’s business.。

相关文档
最新文档