微电子专业专业英语翻译
Practical Applications of Semiconductor Reliability ModelingLori E. Bechtold, Boeing Commercial AirplanesFlorian Molière, PhD, Airbus Group InnovationsDavid A. Sunderland, PhD, Boeing Space & Intelligence SystemsBahig Tawfellos, Honeywell AerospaceKey Words: Physics-of-Failure, Predictions, Semiconductor ReliabilitySUMMARY & CO CLUSIO SA practical methodology for modeling the reliability of deep submicron (<90 nm) semiconductor microcircuits provides timely and needed information for the integration of commercial off the shelf (COTS) electronics in airborne and high reliability applications.（1）Designing and assuring customer confidence in airborne high reliability applications becomes more challenging as electronics technologies develop rapidly and commercial application demands drive the increasing use of faster, more integrated, higher density commercial off the shelf (COTS) electronics. （2）Use of COTS electronics provides advantages of greater computational power, with higher manufacturing volumes driving better quality control. COTS also introduce the new problem of life-limited semiconductors [1]. Outdated adequately support reliable aerospace system design [2].The Semiconductor Reliability project, that launched in April 2013 by the Aerospace Vehicle Systems Institute (A VSI) under the Authority for Expenditure (AFE) 83, （3）developed a practical approach to modeling the random and wearout failure mechanisms of deep sub-micron (<90nm) microcircuits. Unlike prior physics of failure approaches, the methodology was kept simple and was implemented in a spreadsheet. （4）This spreadsheet is provided free of charge to R&M practitioners to help promote understanding and common usage of the methodology. （5）Recipients of the spreadsheet are expected to provide feedback to the A VSI team in return. The project also encourages microcircuit device suppliers to provide reliability information in some form, （6）either by using the spreadsheet or directly providing the cumulative defect fraction (CDF) of their product in theapplication environments.When microcircuit device suppliers provide test data results for their products, the spreadsheet is used to scale the results from test to usage environments.（7）The methodology developed by A VSI differs from traditional Arrhenius methods in that scaling is not only based on temperature but also on voltage, current and frequency. （8）Models of time dependent dielectric breakdown (TDDB), hot carrier injection (HCI), negative bias temperature instability (NBTI) and electromigration (EM) are used to gain an accurate reliability assessment for technologies sensitive to these mechanisms.（9）This paper describes the A VSI reliability research project,the semiconductor microcircuit reliability models, andcommercial and provides examples of the application of these models to support reliable avionics systems design.I TRODUCTIO（10）COTS microcircuit wearout has become a major concern for both military/aerospace (mil/aero) integrators and avionics equipment manufacturer companies (OEMs) . （11）By contrast with packaging reliability issues, microcircuit wearoutelectronics degradations cannot be easily addressed and revealed by means of the typical qualification tests performed on equipment. （12）This is because equipment qualification tests mainly accelerate environmental tresses (thermal cycle vibration, moisture) without the necessary functional constraints required to bring to light the life limited semiconductor issues. In this sense, wearout concerns have to be addressed in an early design phase at the sub-assembly level (Figure 1) through component selection methodologies like the one proposed in this paper.（13）Designing for high reliability applications is a challenge that requires multi-level collaboration to assure vertical integration of the requirements and information flow necessary for design. （14）Figure 2 illustrates the flow of information between members of the supply chain, showing generally the downward flow of requirements and upward flow of analysis and test data needed to design systems to meet the requirements.（15）Mil/aero integrators design aircraft and other platforms for commercial and military applications. （16）All companies in this market segment face the common need to use the best available COTS electronics in high reliability applications. （17）Airborne high reliability mil/aero applications generally experience greater environmental stresses than ground based commercial applications. （18）They drive reliability requirements in the context of thermal profiles, thermal cycling and vibration environments down to their suppliers, the avionics OEMs.（19）Avionics OEMs must find architecture solutions and trade multiple and often conflicting requirements.The avionics OEMs procure electronics devices from the microcircuit device suppliers and must understand how the device will operate in the required environments. （20）Mitigation measures at the avionics OEM level include adequately derating the device in the context of thermal profiles, thermal cycling, vibration, voltage and frequency, and assuring adequate architecture redundancy to guarantee reliability and safety requirements are met throughout the unit life.The microcircuit device suppliers must provide avionics OEMs with enough information and substantiating data so the OEM can make good design decisions while using their devices in electronics modules. The avionics OEM must provide the mil/aero integrators with enough information and substantiating data for them to use the modules in an airborne platform that meets their customer requirements for high functionality, safety and reliability over the operational lifetimes of the equipment.（21）The AFE 83 project aims to break down communication barriers betweenthese market segments to improve practical semiconductor reliability assessments. （22）AFE 83 is working in collaboration with 与...合作microcircuit device suppliers to develop a practicable methodology for predicting the reliability of integrated circuit semiconductors for high reliability applications. It is developing a simple reliability prediction methodology for random failure rate and the time to intrinsic.（23）The random failure rate portion of the model is similar to MIL-HDBK-217 models [3], because it is scaled with device complexity复杂性and use conditions. （24）The physics of failure semiconductor wearout models developed in prior A VSI projects [4] are used as a starting point and will be modified based on the inputs from semiconductor suppliers.2 A VSIA VSI is a research cooperative that addresses issues impacting the aerospace community through international collaborative research conducted by industry, government and academia.（25）（翻译）Members combine their resources and talents to organize and conduct research projects directly benefiting the member organizations and often benefiting the aerospace industry as a whole.（26）A VSI provides a voice for their membership to jointly influence standards, processes and technologies related to aerospace industry.A VSI has invested over a decade of research into electronics reliability, including deep sub-micron (<130nm) semiconductor wearout mechanisms, atmospheric radiation effects and the integration of physics of failure methods into reliability predictions. In 2010, A VSI reliability roadmap project, AFE 74, engaged a broad community of reliability subject matter experts to develop a consensus based Reliability Prediction Technology Roadmap. The Roadmap identified many gaps in reliability prediction capability to support the application needs identified by the stakeholders.（27）The stakeholders require a methodology that results in timely,accurate and necessary information to support design engineering processes that build customer confidence in product reliability. Semiconductor reliability modeling was identified as a high priority by the roadmap project[5].3 APPLICATIO SAerospace applications often require a 20-30 year service life, while COTS electronics usually are designed for shorter market cycles. while COTS electronics usually are designed for high performance and low cost, consequently long termreliability is less of a concern. This leaves less incentive for COTS suppliers to address the need for extended life by applying mitigation measures for these failure mechanisms. If “design for reliability”measures have been applied within the microcircuit, these may be proprietary or not fully understood by the user, so will not figure in the user’s reliability modeling. By focusing at the part level, the AFE 83 spreadsheet allows these mitigation measures to be included by the supplierAvionics systems are designed to rigorous high standards of safety and reliability, with growing processing demands of advanced navigation, guidance and communication systems. High functional density and high speed processing to support the growing avionics systems requirements is enabled through the use of COTS electronics with deep sub-micron (<90 nm) integrated circuit (IC) technologies.Airborne environments are generally harsher than ground based applications. Each flight cycle induces vibration combined with a thermal cycle in many electronics, especially those in partially protected areas such as the electronics bay.（28）Flight environments are harsh on electronics and electronic packaging, due to extremes of temperature, frequent thermal cycling, moisture, vibration, pressure, and atmospheric radiation. （29）In aviation applications, reliability needs can be higher as application conditions become worse.The effect of temperature on reliability may be seen in Fig.3. （30）This chart, provided by Xilinx, is an example of one type of result that could come out of the spreadsheet. Here Xilinx has used an internal tool, described in [6], to compute time to an acceptable percent failure for each of three distinct intrinsic wearout failure mechanisms, as well as the net lifetime value considering all three. They then plotted the result versus use temperature.（31）（翻译）.The AFE 83 spreadsheet similarly can provide the user with calculations of reliability at multiple temperatures, which can be convolved with the application’s temperature vs. time profile (e.g., Fig. 4 for commercial avionics) to enable mission analysis or decisions on whether to provide a more protected environment for the electronics. [7]（32）The results of such reliability calculations are intended to provide reasonable inputs to estimates of system-level reliability. （33）Aggregated, part-level reliability parametric data can be used to compute a reliability estimate at the circuit board, line replaceable unit, or subsystem level. This is based on the system designer’s understanding of the intended operation of the system and the environment in which it is intended to operate.While the proposed methodology is more involved than traditional reliability estimation methods, it may not be necessary to analyze every device in a given unit. （34）For many,conservative estimates will be adequate to meet random failure rate targets, and combination of older technology and limited stress will suggest that wearout life is adequate. The practical understanding of the inner relationship between the effects of the wearout failure mechanisms within a part may be controversial. The source of controversy is whether such effects can be treated as competing effects or if it is more accurate to model them as enhancing each other. （35）Asimplifying assumption in the spreadsheet is that the mechanisms are independent, and that the cumulative failure fractions may be combined numerically without correcting for an interaction between them.Figure 5 shows a sample flow diagram of the decision process an equipment manufacturer may use to determine the application of these analyses or equivalent. （36）It is important to note that if a component is expected to experience early wearout it must have the dominant wearout mechanisms accounted for in a prediction or the results will be misleading.（37）Figure 6 shows another approach to system level analysis where the traditional random failure reliability prediction (Mean Time Between Failures) is normalized to a Mean Life,so that it can be compared with the Geometric Mean Life the wearout of each small geometry part over the usage profile.[8] The Avionics OEM can then understand whether the small geometry part will be a key driver in their ability to meet the MTBF requirement.EM, TDDB, HCI and NBTI have been identified as dominant failure mechanisms for complementary metal-oxide semiconductors (CMOS) [9]. Models for these mechanisms were developed by various researchers and studied during the A VSI projects AFE 17, 71 and 71s1 and validated [10]. They have also been presented in detail in a previous RAMS paper [11], and are summarized here.The AFE 83 spreadsheet offers models for all four mechanisms, based on equations (1)-(4).T2 is the test temperature in K.These equations differ in some ways from traditional forms [12] to make the independent variables those directly controllable by the IC user, (e.g. for EM we use voltage as a proxy for current density.) （38）In addition, alternate forms of voltage acceleration models are provided in the spreadsheet,for different technologies.The failure mechanism AF models for TDDB, EM, HCI and NBTI provide an assessment at the feature level within the logic circuitry of an IC. The effects of these mechanisms become more pronounced as feature sizes shrink and functional density increases. （39）A recent study of field failures of communications technology semiconductors found that failures due to these effects are increasing, in a way similar to Moore’s Law [13] [14]. （40）Models have been developed for NBTI; however as semiconductor feature sizes continue to reduce Positive Bias Temperature Instability (PBTI) may become an issue and models will need to be developed.A traditional approach is to use the Arrhenius model to scale test data to usageenvironments using empirically derived activation energy factors. （41）It does not consider the relying on a generalized temperaturewere developed by various researchers and studied during the related failure rate model. [15] The models provided in the spreadsheet offer a more detailed failure characterization, the ability to consider multiple failure mechanisms and to directly model voltage and frequency effects as well as thermal effects.5 RELIABILITY PREDICTIO OF SEMICO DUCTORSIn any practical reliability analysis the best data available is used, and this is also true for use of the AFE 83 spreadsheet.Due to budget and time constraints and possibly the limited availability of COTS vendor data, analyses are sometimes performed with less than ideal data precision. The ideal strategy is to seek the best data first then fall back on other sources. The following is the prioritized order for finding data and analyzing semiconductor microcircuits:1. Ideal–Supplier provides all the necessary reliability in the usage environments and considering operational stresses2. Second best –Supplier provides some test information, and the user adjusts it to usage conditions using AFE 83 spreadsheet3. Third best –If no test data is available, the user runsIn (1)-(4), their own set of tests and uses AFE 83 spreadsheet to are the acceleration perform prediction4.Fourth option –When no information is available, a factors for T DDB, EM, HCI and NBTI, respectively, prediction can be performed using AFE 83 spreadsheet defaults .The AFE 83 spreadsheet PoF models are used to start the conversation with semiconductor supplier companies about what is needed for the analysis. A potential approach is to have semiconductor manufacturers take the spreadsheet develop it to accurately model their particular product line, and provide it on a webpage for use by reliability engineers applying their product in an electronic system.The prototype spreadsheet has assumed numerical values in places where the device-specific parameters are unknown.The spreadsheet is a starting point and not the final solution is used as a basis for how semiconductors are modeled.Participants and partners in this project will need to describe the methodology for estimating reliability with key objectives of identifying the data needed from device manufacturers and thatdefining the method for integrating the data into a usable result. This is accomplished through guidelines which are to be published as a deliverable of AFE83.The AFE 83 spreadsheet includes a wearout prediction model and assessment based on the four mechanisms from AFE 71s1. An initial slope factor 2 provides an example of how a Weibull analysis may characterize wearout. Although initial parametric model input values are offered in the spreadsheet, the actual parameters of the model will be provided by semiconductor suppliers, or used by them to perform wearout reliability assessment for their customers.一语言点（1）designing 和assuring 都是动词的ing形式作形容词来修饰customer。
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Engineering环境科学Environmental Science环境工程Environmental Engineering生物医学工程Biomedical Engineering食品科学与工程Food Science and Engineering食品科学Food Science粮食、油脂及植物蛋白工程Cereals, Oils and Vegetable Protein Engineering农产品加工及贮藏工程Processing and Storage of Agriculture Products水产品加工及贮藏工程Processing and Storage of Aquatic Products农学Agriculture作物学Crop Science作物栽培学与耕作学Crop Cultivation and Farming System作物遗传育种学Crop Genetics and Breeding园艺学Horticulture果树学Pomology蔬菜学Olericulture茶学Tea Science农业资源利用学Utilization Science of Agricultural Resources土壤学Soil Science植物营养学Plant Nutrition植物保护学Plant Protection植物病理学Plant Pathology农业昆虫与害虫防治Agricultural Entomology and Pest Control农药学Pesticide Science畜牧学Animal Science动物遗传育种与繁殖Animal Genetics, Breeding and ReproductionScience动物营养与饲料科学Animal Nutrition and Feed Science草业科学Practaculture Science特种经济动物饲养学（含蚕、蜂等）The Rearing of Special-type Economic Animals (including Silkworm, Honeybees, etc.)兽医学Veterinary Medicine基础兽医学Basic Veterinary Medicine预防兽医学Preventive Veterinary Medicine临床兽医学Clinical Veterinary Medicine林学Forestry林木遗传育种学Forest Tree Genetics and Breeding森林培育学Silviculture森林保护学Forest Protection森林经理学Forest Management野生动植物保护与利用Wildlife Conservation and Utilization园林植物与观赏园艺Ornamental Plants and Horticulture水土保持与荒漠化防治Soil and Water Conservation and Desertification Combating 水产学Fisheries Science水产养殖学Aquaculture Science捕捞学Fishing Science渔业资源学Science of Fisheries Resources医学Medicine基础医学Basic Medicine人体解剖与组织胚胎学Human Anatomy, Histology and Embryology免疫学Immunology病原生物学Pathogenic Organisms病理学与病理生理学Pathology and Pathophysiology法医学Forensic Medicine放射医学Radiation Medicine航空航天与航海医学Aerospace and Nautical medicine临床医学Clinical Medicine内科学（含心血管病学、血液病学、呼吸系病学、消化系病学、内分泌与代谢病学、肾脏病学、风湿病学、传染病学）Internal medicine (including Cardiology, Hematology, Respiratory, Gastroenterology, Endocrinology and Metabolism, Nephrology, Rheuma-tology, Infectious Diseases)儿科学Pediatrics老年医学Geriatrics神经病学Neurology精神病与精神卫生学Psychiatry and Mental Health皮肤病与性病学Dermatology and Venereology影像医学与核医学Imaging and Nuclear Medicine临床检验诊断学Clinical Laboratory Diagnostics护理学Nursing外科学（含普通外科学、骨外科学、泌尿外科学、胸心血管外科学、神经外科学、整形外科学、烧伤外科学、野战外科学）Surgery (General Surgery, Orthopedics, Urology, Cardiothoracic Surgery, Neurosurgery, Plastic Surgery, Burn Surgery, Field Surgery)妇产科学Obstetrics and Gynecology眼科学Ophthalmic Specialty耳鼻咽喉科学Otolaryngology肿瘤学Oncology康复医学与理疗学Rehabilitation Medicine & Physical Therapy运动医学Sports Medicine麻醉学Anesthesiology急诊医学Emergency Medicine口腔医学Stomatology口腔基础医学Basic Science of Stomatology口腔临床医学Clinical Science of Stomatology公共卫生与预防医学Public Health and Preventive Medicine流行病与卫生统计学Epidemiology and Health Statistics劳动卫生与环境卫生学Occupational and Environmental Health营养与食品卫生学Nutrition and Food Hygiene儿少卫生与妇幼保健学Maternal, Child and Adolescent Health卫生毒理学Hygiene Toxicology军事预防医学Military Preventive Medicine中医学Chinese Medicine中医基础理论Basic Theories of Chinese Medicine中医临床基础Clinical Foundation of Chinese Medicine中医医史文献History and Literature of Chinese Medicine方剂学Formulas of Chinese Medicine中医诊断学Diagnostics of Chinese Medicine中医内科学Chinese Internal Medicine中医外科学Surgery of Chinese Medicine中医骨伤科学Orthopedics of Chinese Medicine中医妇科学Gynecology of Chinese Medicine中医儿科学Pediatrics of Chinese Medicine中医五官科学Ophthalmology and Otolaryngoloy of Chinese Medicine针灸推拿学Acupuncture and Moxibustion and Tuina of Chinese medicine民族医学Ethnomedicine中西医结合医学Chinese and Western Integrative Medicine中西医结合基础医学Basic Discipline of Chinese and Western Integrative中西医结合临床医学Clinical Discipline of Chinese and Western Integrative Medicine 药学Pharmaceutical Science药物化学Medicinal Chemistry药剂学Pharmaceutics生药学Pharmacognosy药物分析学Pharmaceutical Analysis微生物与生化药学Microbial and Biochemical Pharmacy药理学Pharmacology中药学Science of Chinese Pharmacology军事学Military Science军事思想学及军事历史学Military Thought and Military History军事思想学Military Thought军事历史学Military History战略学Science of Strategy军事战略学Military Strategy战争动员学War Mobilization战役学Science of Operations联合战役学Joint Operation军种战役学（含第二炮兵战役学）Armed Service Operation (including Operation of Strategic Missile Force)战术学Science of Tactics合同战术学Combined-Arms Tactics兵种战术学Branch Tactics军队指挥学Science of Command作战指挥学Combat Command军事运筹学Military Operation Research军事通信学Military Communication军事情报学Military Intelligence密码学Cryptography军事教育训练学（含军事体育学）Military Education and Training (including Military Physical Training)军制学Science of Military System军事组织编制学Military Organizational System军队管理学Military Management军队政治工作学Science of Military Political Work军事后勤学与军事装备学Science of Military Logistics and Military Equipment军事后勤学Military Logistics后方专业勤务Rear Special Service军事装备学Military Equipment管理学Management Science管理科学与工程Management Science and Engineering工商管理学Science of Business Administration会计学Accounting企业管理学（含财务管理、市场营销学、人力资源管理学）Corporate Management (including Financial Management, Marketing, and Human Resources Management)旅游管理学Tourist Management技术经济及管理学Technology Economy and Management农林经济管理学Agricultural and Forestry Economics & Management农业经济管理学Agricultural Economics & Management林业经济管理学Forestry Economics & Management公共管理学Science of Public Management行政管理学Administration Management社会医学与卫生事业管理学Social Medicine and Health Management教育经济与管理学Educational Economy and Management社会保障学Social Security土地资源管理学Land Resource Management图书馆、情报与档案学Science of Library, Information and Archival 图书馆学Library Science情报学Information Science档案学Archival Science。
毕业证明用学科专业的中英文翻译对照表
050107
中国少数民族语言
CHINESE ETHNIC LANGUAGE AND LITERATURE
85
050108
比较文学与世界文
COMPARATIVE LITERATURE AND WORLD LITERATURE
86
0501Z1
中国文学思想史
HISTORY OF CHINESE LITERARY THOUGHT
物流学
LOGISTICS
33
020224
计算金融学
COMPUTIONAL FINANCE
34
03
法学
LAW
35
0301
法学
LAW
36
030101
法学理论
JURISPRUDENCE
37
030102
法律史
LEGAL HISTORY
38
030103
宪法学与行政法学
CONSTITUTIONAL AND ADMINISTRATIVE LAW
050122
比较语言学
COMPARATIVE LINGUISTICS
91
0502
外国语言文学
FOREIGN LANGUAGES AND LITERATURE
92
050201
英语语言文学
ENGLISH LANGUAGE AND LITERATURE
93
050202
俄语语言文学
RUSSIAN LANGUAGE AND LITERATURE
119
0603Z2
世界上古中古史
ANCIENT AND MEDIEVAL WORLD HISTORY
120
0603Z3
计算机专业英语
计算机基础知识computer n.电脑，电子计算机arithmetic logic unit算术逻辑部件manipulate vt.操纵，操作keyboard n.键盘information n.消息，知识printer n.打印机hand-hold a.使携，手拿的skitter n.磁盘calculator n.计算器statistical a统计的system n.系统，体系joystick n.游戏棒，操纵杆scientific a.科学的，系统的software n.软件electronic a.电子的category n.种类machinery a.机器，机关，simulate n.模拟，模仿equipment n.装备，设备handle vt.控制dull a.单调的，呆滞的interpret vt.解释network n.网络feedback n.反馈circuit n.电路，一圈，巡回instrument n.工具switch n.开关，电闸manufacture vt.制造level n.水平，标准CAD计算机辅助设计status n.状态engineer n.工程师binary a.二进位的draft n.草稿store vt.储存，储藏graphics n.图形process n.程序，过程video n.影像character n.字符robotic a./n机器人学sound n.声音automation n.自动化image n.影像，图像word processing字处理programme n.程序，计划text n.文衣logic inference逻辑推理communication n.通讯aid vt.帮助，援助electronic-mail电子邮件instruction n.指令teleconferencing电话会议convert vt.转变telccommunicating远程通讯originality n.创造力database n.数据库operate vt.操作，运转CAI计算机辅助教学ENIAC电子数值积分计算机transistor n.晶体管vacuum真空DOS磁盘操作系统resistor n.电阻器RAM随机存取存储器capacitor n.电容器mouse n.鼠标interference n.干预intense妙n.强烈，紧张technology n.技术floppy a.松软的internal a.内部的fix a.牢固的symbolic n.代号write-protect写保护language n.语言drive n.驱动器span vt.跨越mechanics n.机械学reliable a.可靠的access vt.访问efficient a一有效率的byte n.比特magnetic a.一有磁性的、mega n.兆Auxiliary a./n.附加的，辅助物decimal n.十进制media n.媒体octal n.八进制storage n.存储器headecimal n.十六进制punched card tape n.磁带weight n.权memory n.记忆，存储code n.代码silicon n.硅，硅元素ASCII美国信息交换标准代chip n.芯片extended a.扩充的，长期的terminal n.终端机，终点，总站voltage n.伏特，device n.设备integer n.整数innovation n.改革，创新negative a.负的external a.外部的absence a.缺席feature n.特征convenience n.便利component n.元件，组件waveform n.波形combination n.联合，合并zone n.区microprocessor n.微处理器vendor n.厂商，自动售货机packed a.包装的implement n.工具，器具package n.包裹，套装软件quantity n.数量digital a.数字的rigid n.硬的analog a.模拟的fragile a.易脆的hybrid a.混合的susceptible a.易受影响的discrete a.离散的medium n.媒体Vital a.重要的，关键的shutter n.快门monitor n.显示器general-purpose通用overwhelm v.制服theory proving定理证明application n.应用information retrieval 信息检索wire n.电线，电报persona computer个人计算机model n.模型time-consuming a.费时的Versatility n.多种变化，变通routine task日常工作lump vt.使成块logical decision逻辑判断hardware n.硬件programmable a.可编程的stream n.流rewire vt.重新接线resource n.资源generation n.代desktop n.桌面unreliable a.不可靠的cabinet n.文件柜auxiliary storge 辅助存储器supercomputer n.超级计算机minicomputer n.小型计算机I/0 device输入／输出设备system unit系统部件cell n.单元floppy disk软盘consecutively a.连续的，连贯的fix disk硬盘CPU中央处理器transmission n.传送，传输程序设计Program Design程序设计creep vi.爬，潜行writing program编写程序standardize vt.使标准化coding the program编程simplify vt.单一化，简单化programming程序revision n.校订，修正programmer n.程序员occupy vt.占领，住进logic n.逻辑，逻辑学BASIC初学者通用符号指令代码machine code机器代码teaching language教学语言debug n.DOS命令，调试simplicity n.单纯，简朴compactness a.紧凑的，紧密的timesharing system分时系统description n.描述，说明interactive language交互式语言break n.中断manufacturer n.制造业者structure chart结构图dialect n.方言，语调the program flow程序流expense n.费用，代价manager module管理模块uniformity n.同样，划一worder module工作模块archaic a.己废的，古老的mainmodule主模块sufficient a.充分的，足够的submodule子模块data processing数据处理modify v.修正，修改business application商业应用outline n.轮廓，概要scientific application科学应用compose分解lexical a.字典的，词汇的code 代码non-programmer n.非编程人员node vt改为密码notation n.记号法，表示法，注释pseudocode n.伪代码verbosity n.唠叨，冗长commas n.逗点逗号record n.记录documentation文档subrecord n.子记录flowchart/flow程表／流程data division数据部visual a.视觉的procedure division过程部represent vt.表现，表示，代表comprise vt.包含构成structured techniques结构化技术operator n.运算符，算子straightforward a.笔直的，率直的commercial package商业软件包subroutine n.子程序generator n.产生器，生产者driver module驱动模块mathematician n.专家line by line逐行operator n.作符translate vt.翻译，解释forerunner n.先驱modular摸块化ancestor n.祖宗cumbersome a.讨厌的，麻烦的teaching programming编程教学lengthy a.冗长的，漫长的alter vi./vt.改变flaw n.缺点裂纹devclop vt.发达separate a.各别的recompile v.编译assist n.帮助cycle n.循环technician n.技师remove vt.移动，除去straight line直线category n.种类，类项rectangle n.长方形,矩形P-code p代码virtrally ad.事实上symology n.象征学象征的使用register n.寄存器to summaries总之，总而言之by convention按照惯例cyptic n.含义模糊的，隐藏的diamond-shaped a,菱形的bracket n.括号decision n判断obviate除去，排除terminal n. a终端机，终端的keyword n.关键字card reader阅读器underline vt.下划线translator program译程序monadic a. monad(单位)的Programming程序设计dec/binary n.二进制source language源语shift变化，转移，移位machine language机器overflow n.溢出machine instruction机器指令arithmetic n.算术，算法computer language计算机语composite symbol复合型符号．assembly language汇编语assignment n.赋值floating point number浮点数proliferation n.增服high-level language高级语pointer n.指针natural language自然语言array n.数组矩阵，source text源文本subscript n.下标intermediate language中间语言type conversion类型转换software development软件开发address arithmetic地址运算map vt.映射，计划denote vt.指示，表示maintenance cost维护费用subprogram n.子程序legibility n.易读性，易识别separate compilation分离式编泽amend vt.修正，改善alphabetic a.照字母次序的consumer n.消费者digit n.数字位数enormous a.巨大的，庞大的numeric expression数值表达式reliability n.可信赖性，可信度tap n.轻打，轻敲，选择safety n.安全，安全设备print zone打印区property n.财产，所有权column n.列correctness n.正确，functionality n.机能semicolon n.分号portable a.叮携带的，可搬运的survey n.概观．altoggle n.肘节开关task n.作，任务declaration n.宣告说明source program源程序mufti-dimension array多维数组object program目标程序数据库transaction n.交易，办理，执行query n.查询license n.执照，许可证，特许subschemas n.子模式criminal a.犯了罪的，有罪的individual n.个体，个人conviction n.定罪，信服，坚信employee n.职员，受雇人员bureaus n.局，办公处integrity n.完整，正直insurance n.保险，保险业，保险费duplicate a.复制的，二重的retrieval n.取回，恢复，修补interactive n.交谈式security n.安全，安全性audit n.查帐，稽核integrity n.完整，正直，廉正trail n.痕迹，踪迹consume Vt.消耗multiuse n.多用户manually ad.用手full-fledged a.喂养tedious a.沉闷的，冗长乏味的compound document复合文件DBMS数据库管理系统recognizant a.认识的，意识的consensus n一致，交感user manual用户手册semantics n.语义学bug n.缺陷，错误impediment n.妨碍，阻碍，阻止encrypt v.加密，译成密码intuitively a直觉的malicious a.环恶意的，恶毒的module n.模块，组件bottleneck n,瓶颈schema n.轮廓，概要，图解mainstream n主流proposal n建议spatial a.空间的，空间性的tailor Vi.定制，制作，缝制relevant a.有关联的，中肯的plausible a.似真实的，似合理的urgency n.紧急，催促virtually ad.事实上optimization n.最佳化impracticably ad.不能实validation n.确认flaw n.缺点，裂纹，瑕疵typically a.典型的，象征性的assumption n.假定，视为当然之事index n.索引Yi.做索引duration n.持续时间，为期component n.组件，成分intolerably ad.难耐的程度temporal n.当时的，现世的abort vi.流产，失败semantics n.语义学rigorous a.严厉的，严酷的，苛刻的interval n．时间间隔criterion n.标准，准据，轨范catalogue n.目录V.编入目录consistency n.一致性，坚固性，浓度cabinet n.橱柜，内阁adopt Vt.采用，收养illustration n.例证，插图serialization n.连载长篇efficient a有效率的，能干的log n.日志，记录clerical a.事务上的，抄写员的focus n.焦点，焦距access n.进入．进入twin n.双胞胎中人warehouse n.大商店．仓库protocol n.协议wholesale n.批发conflict n神突，矛盾chore n.零工，家务negotiate vi.商议，谈判，谈妥mode n.模式，模态drag vi.拖拉，拖累long-duration长期architects n.建筑师short-duration短期partition n.分割，隔离物ascend V.上升，追溯，登高．inherent a.固有的，与生俱来的descend vi.下降，传下necessitate Vt.迫使，使成为必需dimensional a.空间的versa a.反physical organization物理组织operator n.操作员硬件基础microelectronics n.微电子学adaptively a.适合的，适应的actuator n.主动器compensate偿还，补偿integrated a.集成的parasitic a.寄生的arithmetic n.算术,算法wobble n.摆动，不稳定crossroads n.交又路focal a.焦点的，在焦点上的ROM n.只读存储器eliminate Vt.排除，除去RAM n.随机存取存储器cornstalk n.串音permanently ad.永久的，不变的affinity n.密切关系，强烈的吸引Volatile a.可变的，不稳定的stem n．柄，堵塞物notepad n.记事本introspection n.内省，反省microprocessor n.微处理器mechanism n.机械，机理gateway n.门，通路portability n.一携带，轻便coprocessor n.协处理器configuration n.配置floating-point浮点flexibility n.适应性，弹性upgrade V.使升级algorithms n.运算法则optional a.选择的，随意的channel n．通道，频道bi-directional a.双向性keystroke n.键击simultaneous a.同时发生的typematic a.重复击键的cache n.高速缓冲存储器comprise Vi.包含，构成percentage n.百分比,部分precommendation n.预补偿controller n.控制器track n.磁轨intercept n.截取，妨碍boot v.启动significantly ad.重要地，有效地benchmark n.基准，评效migration n.移往，移动merit n.优点，价值compact a.紧凑的，紧密的restriction n.限制，限定，约束digitally n.数位intrinsic a.本质的，原有的dip n.双排直插封装Boolean n.布尔逻辑，布尔值distortion n.扭曲，变形imperative a.命令式的playback n.重现，录音再生nontrivial a.不平常的robustness a.健康的，强健的circumvent v.绕行，陷害reliability n.可靠性，可信赖性decentralize vt.使分散，排除集中resolvability n.可移动性intelligent a.智能的，聪明的counterpart n.副本，配对物automatically a.自动地，机械地archival a.关于档案的innovation n.改革，创新magneto n.磁发电机synonym n.同义字cylinder n.柱面prototype n.原型photodetector n.光感测器paradigm n.范例，模范predefined n.预先确定microchip n.微处理器split a.分散的core n.争论的核心tradeoff n.交换，协定extended memory扩充内存bootdevice引导设备picture processing图像处理reside vi.住，居留，属于sensor n.传感器optical disk光盘WS1晶片规模集成laser n.激光VLSI超大规模集成storage densities存储密度hiss n.嘶嘶声modulate vi.调整，调制unveil vt.揭开,揭幕multiassociative processing多关联处理技术workload n.工作负荷操作系统与DOS指令storage space存储空间Timer n.计时器subdirectory n.子目录Available a.可用的structure n.结构characteristic n.特征,特性hierarchical a.分层的Sophistication n.复杂性issue vt.发行，放出Standard n.标准backslash n.反斜杠Online n.联机the root directory根目录Job Management 作业管理perform vt.执行Sequence n.次序conjunction n.联合Assess vt.评估procedure n.过程Resource Management资源管理tree n.目录树Oversee vt.监督term n.术语Control of I/0 Operation I/0 操作控制startup vi.启动Allocation n. 分配TSRs内存驻留程序Undergo vt.经历，经受locate vt.定位Error Recovery错误恢复sector n.扇区Memory Management存储器管理partition n.分区interface n.界面booting n.自举streamlined a.流线型的cluster n.簇unleash vt.释放CMOS互补金属氧化物体unhamperer vt.解脱emergency disk应急磁盘spreadsheet n.电子表格partition table分区表Accessory n.附件FAT文件分配表Notepad n.记事薄GUI图形用户接口Macro Recorder n.宏记录器command line命令行Write n.书写器icon n.图标Paint-brush n.画笔manual n.手册modem n.调制解调器dialog boxes对话框Solitaire n.接龙mechanism n.机构，机械，结丰Reverse n.挖地雷clipboard n.剪贴板module n.模块DDE动态数据交换acronym n.缩写字clumsy a.笨拙的version n.版本hot linked映射的update vt.洲一级，更新real-mode n.实模式internal command 内部命令standard mode标准模式external command外部命令directory n.目录Pentium n.俗称586，奔腾芯片sign-on a.提示framework n.框架，结构extension name扩展名precedence n.优先document n.文档uppercase letter大写字母workspace n.工作lowercase letter小写字母File Manager文件管理volume label卷标menu n.菜单prompt n.提示符Program Manager程序管理器default n.缺省值，默认值folder n.卷宗symbol n.符号divider n.分配者cursor n.光标subdivide n.子分配者built-in a.内置的tutorial n.教程。
合肥工业大学各学院、专业名称及其英文翻译
合肥工业大学各学院、专业名称及其英文翻译仪器科学与光电工程学院 School of Instrument Science and Opto-electronic Engineering1、测控技术与仪器 Measurement & Control Technology and Instrument2、光信息科学与技术 Optic Information Science & Technology机械与汽车工程学院 School of Machinery and Automobile Engineering3、车辆工程 Vehicles Engineering4、工业工程 Industrial Engineering5、工业设计 Industry Design6、过程装备与控制工程 Process Equipment & Control Engineering7、机械设计制造及其自动化 Machine Design & Manufacture & Its Automation8、交通工程 Transportation Engineering9、热能与动力工程 Thermal Energy & Power Engineering材料科学与工程学院 School of Material Science and Engineering10、金属材料工程 Metal Materials Engineering11、材料物理 Materials Physics12、无机非金属材料工程 Inorganic Non-metallic Materials Engineering13、材料成型及控制工程 Material Forming & Control Engineering电气与自动化工程学院 School of Electric Engineering and Automation14、电气工程及其自动化 Electric Engineering and Automation15、生物医学工程 Biomedical Engineering16、自动化 Automation计算机与信息学院 School of Computer and Information17、计算机科学与技术 Computer Science & Technology18、电子信息工程 Electronic Information Engineering19、电子信息科学与技术 Electronic Information Science & Technology20、通信工程 Communications Engineering21、信息安全Information Security化学工程学院 School of Chemical Engineering22、高分子材料与工程 Macromolecule Material and Engineering23、化学工程与工艺 Chemical Engineering and Technics24、制药工程 Pharmacy Engineering25、应用化学 Applied Chemistry土木建筑工程学院 School of Civil Engineering26、给排水工程 Water Supply & Drainage Engineering27、工程力学 Engineering Mechanics28、水利水电工程 Hydraulic and Hydro-Power Engineering29、土木工程 Civil Engineering30、建筑环境与设备工程 Architectural Environment & Equipment Engineering建筑与艺术学院 School of Architecture and Arts31、城市规划 Urban Planning32、建筑学 Architecture33、艺术设计 Artistic Design资源与环境学院 School of Resources and Environment34、地理信息系统 Geographic Information System35、环境工程 Environment Engineering36、勘查技术与工程 Exploration Technology & Engineering37、资源勘查工程 Resources Exploration Engineering理学院 School of Sciences38、电子科学与技术 Electronic Science & Technology39、数学与应用数学 Applied Mathematics40、微电子学 Microelectronics41、信息与计算科学 Science of Information & Computation42、应用物理学 Applied Physics管理学院 School of Management43、电子商务 Electronic Commerce44、会计学 Accounting45、工商管理 Business Management46、劳动与社会保障 Labour and Social Security47、信息管理与信息系统 Information Management & System48、旅游管理 Tourism Management49、市场营销 Marketing人文经济学院 School of Humanities and Economics50、财政学 Finance51、广告学 Advertisement52、国际经济与贸易 International Economy & Trade53、经济学 Economics54、思想政治教育 Education in Ideology and Politics55、英语 English56、法学 Law57、社会工作 Social Work生物与食品工程学院 School of Biotechnology and Food Engineering58、生物工程 Bioengineering59、生物技术 Biotechnology60、食品科学与工程 Food Science and Engineering。
本科研究生各专业名称英文翻译
果树学 Pomology
蔬菜学 Olericulture
茶学 Tea Science
农业资源利用学 Utilization Science of Agricultural Resources
土壤学 Soil Science
植物营养学 Plant Nutrition
儿科学 Pediatrics
老年医学 Geriatrics
神经病学 Neurology
精神病与精神卫生学 Psychiatry and Mental Health
皮肤病与性病学 Dermatology and Venereology
影像医学与核医学 Imaging and Nuclear Medicine
森林培育学 Silviculture
森林保护学 Forest Protection
森林经理学 Forest Management
野生动植物保护与利用 Wildlife Conservation and Utilization
园林植物与观赏园艺 Ornamental Plants and Horticulture
生物化学与分子生物学 Biochemistry and Molecular Biology
生物物理学 Biophysics
生态学 Ecology
系统科学 Systems Science
系统理论 Systems Theory
系统分析与集成 Systems Analysis and Integration
中医医史文献 History and Literature of Chinese Medicine
方剂学 Formulas of Chinese Medicine
电子信息工程专业英语英译汉翻译
1 The transistor is what started the evolution of the modern computer industry in motion.晶体管开启了现代电脑工业的革命2 The storage cell only requires one capacitor and one transistor, whereas a flip-flop connected in an array requires 6 transistors.存储单元仅需要一个电容和晶体管，并而不像触发器整列那样需要6个晶体管3 There has been a never ending series of new op amps released each year since then, and their performance and reliability has improved to the point where present day op amps can be used for analog applications by anybody.从此以后每年都有新系列的运放发布，他们的性能和可靠性得到了提升，如今任何人都能用运放来设计模拟电路。
4 This is capable of very high speed conversion and thus can accommodate high sampling rates, but in its basic form is very power hungry.它具有高速转换能力，从而能适应高速采样速率，但它的基本形式非常耗电。
5 During the “on” period , energy is being stored within the core material of the inductor in the form of flux.在”on”阶段，能量以涌浪形式存储在电感的核芯材料里面6 The design goal of frequency synthesizers is to replace multiple oscillators in a system, and hence reduce board space and cost.频率合成器的设计目标是取代系统中多个振荡器，从而减小板卡面积和成本。
电子专业英语词汇
Microelectronics微电子学Capacitor电容器Field Effect Transistors场效应晶体管Integrated Circuit集成电路Operational amplifier运算放大器Monolithic IC单片式集成电路Conductor导体Impedance阻抗Digital IC数字集成电路Complementary Metal-Oxide Semiconductor互补型金属氧化物半导体N-channel Metal Oxide Semiconductor N沟道金属氧化物半导体Logic gate逻辑门电路Drain electrode漏极Base electrode基极Alternative Current交流Voltage regulator稳压器Multiplier乘法器Differentiator微分器Flip-flop触发器Boolean algebra布尔代数Combinational logic circuit组合逻辑电路p-n junction PN结Inverter反相器Demodulator解调器Video frequency视频Volt-ampere characteristic伏安特性Open-loop开环Very-Large-Scale Integrated circuit超大规模集成电路Large Scale Integrated circuit大规模集成电路Common-base connection共基极连接Common-source connection共源极连接Erasable Programmable Read Only Memory (EPROM)可擦除只读存储器Decibel分贝Minority carriers少数载流子Extrinsic semiconductor掺杂半导体Matching匹配Peak voltage峰值电压Photo diode光电二极管Bipolar transistor双极型晶体管Resistor电阻器Diode二极管Silicon硅Discrete circuit分立电路Substrate基片，衬底Thick film IC厚膜集成电路Insulator绝缘体Gain增益Metal-Oxide Semiconductor Field-Effect Transistor金属氧化物半导体场效应管P-channel Metal Oxide Semiconductor P沟道金属氧化物半导体Grid electrode栅极Channel region沟道区域Collecting electrode集电极Rectifier整流器Adder加法器Divider除法器Register寄存器Oscillator振荡器Counter计数器Sequential logical circuit时序逻辑电路DC-coupled直流耦合的Mixer混频器Amplifier放大器Radio frequency射频Anode阳极Closed-loop闭环Small Scale Integrated circuit小规模集成电路Common-collector connection共集电极连接Common-gate connection共栅极连接Electronic Design Automation电子设计自动化Electric Erase Programmable Read Only Memory (E2PROM)电可擦除只读存储器Floating-point calculation浮点计算Computer Aided Design计算机辅助设计Leakage current漏电流Passive device无源器件Average voltage平均电压Pin管脚Unipolar transistor单极型晶体管Inductor电感器Transistor晶体管Germanium锗Discrete component分立元件Semiconductor半导体Thin film IC薄膜集成电路Analog IC模拟集成电路Power dissipation功耗Transistor-Transistor Logic晶体管-晶体管逻辑电路Application Specific Integrated Circuit专用集成电路Source electrode源极Emitting electrode发射极Direct Current直流Filter滤波器Subtracter减法器Integrator积分器Trigger触发器Quartz crystal石英晶体Comparator比较器Clock generator时钟发生器AC-coupled交流耦合的Modulator调制器Audio frequency音频电子专业词汇表_多媒体技术、人工智能、模式识别、人工神经网络等Animation动画Aspect ratio屏幕宽高比Automatic program designing自动程序设计Bitmap位图Button按钮Chrome色度Color depth颜色深度Consumer electronics消费电子Computer vision计算机视觉Data cloth数据服装Decompression解压缩Digital Video Disc数字视频光盘Electronic game电子游戏Expert system shell专家系统外壳Feature extraction特征提取Forward reasoning正向推理Game playing博弈Helmet-mounted display头盔式显示器High Definition TeleVision高清晰度电视Information processing信息处理Intelligent search智能搜索Knowledge acquisition知识获取Knowledge based coding基于知识的编码Knowledge engineering知识工程Logical inference逻辑推理Machine learning机器学习Microphone麦克风Multimedia data多媒体数据Multimedia database多媒体数据库Musical Instrument Digital Interface乐器数字接口Pattern recognition模式识别Predicate calculus谓词演算Quality Of Service服务质量Radio button单选按钮Robotic机器人学Scanner扫描仪Sonar signal classification声纳信号分类Structured coding结构化编码Theorem proving定理证明Training process训练过程True color真彩色Artificial Intelligence人工智能Audio recording音频唱片Back projection network反向投影网络Brightness亮度Character recognition字符识别Classification decision分类决策Compact Disc CD光盘，激光唱盘Computer Integrated Manufacturing计算机集成制造Data glove数据手套Desktop conferencing system桌面会议系统Driver驱动程序Entropy coding熵编码Face recognition人脸识别Fingerprint recognition指纹识别Fuzzy control模糊控制Genetic algorithm遗传算法Heuristic method启发式方法Hypermedia超媒体Input layer输入层Joystick游戏杆Knowledge base知识库Knowledge discovering知识发现Knowledge representation知识表示Lossless compression无损压缩Machine translation机器翻译Moving Pictures Experts Group运动图像专家组Multimedia network多媒体网络Office automation办公自动化Natural language understanding自然语言理解Predictive coding预测编码Quantization coding量化编码Redundancy冗余度Saturation饱和度Script language脚本语言Speaker扬声器Supervised learning network监督式学习网络Three dimensional mouse三维鼠标Transform coding变换编码Turing test图灵测试Artificial Neural Network人工神经网络Audio track音轨Backward reasoning逆向推理Browser浏览器Checkbox复选框Clipboard剪贴板Compression数据压缩Contrast对比度Data acquisition数据采集Data mining数据挖掘Dialog box对话框Electronic classroom电子教室Expert system专家系统Factory automation生产自动化Formal language形式化语言Fuzzy logic模糊逻辑Graphical User Interface图形化用户界面Hidden layer隐含层Inference engine推理机Intelligent agent智能体。
电子科学与技术专业英语(微电子技术分册)第一章译文
——电材专业英语课文翻译Semiconductor Materials• 1.1 Energy Bands and Carrier Concentration• 1.1.1 Semiconductor Materials•Solid-state materials can be grouped into three classes—insulators(绝缘体）, semiconductors, and conductors. Figure 1-1 shows the electrical conductivities δ(and the corresponding resistivities ρ≡1/δ)associated with(相关）some important materials in each of three classes. Insulators such as fused（熔融）quartz and glass have very low conductivities, in the order of 1E-18 to 1E-8 S/cm;固态材料可分为三种：绝缘体、半导体和导体。
图1－1 给出了在三种材料中一些重要材料相关的电阻值（相应电导率ρ≡1/δ)。
绝缘体如熔融石英和玻璃具有很低电导率，在10-18 到10-8 S/cm;and conductors such as aluminum and silver have high conductivities, typically from 104 to 106 S/cm. Semiconductors have conductivities between those of insulators and those of conductors. The conductivity of a semiconductor is generally sensitive to temperature, illumination（照射）, magnetic field, and minute amount of impurity atoms. This sensitivity in conductivity makes the semiconductor one of the most important materials for electronic applications.导体如铝和银有高的电导率，典型值从104到106S/cm;而半导体具有的电导率介乎于两者之间。
电子行业微电子专业词汇
电子行业微电子专业词汇1. 微电子微电子是指电子学中研究和制造尺寸较小的电子元件和系统的学科。
其研究对象主要包括集成电路、微处理器、传感器等微小尺寸的电子设备。
微电子技术的应用领域包括计算机、通信、医疗、能源等众多领域。
以下是一些微电子领域常见的专业词汇。
2. 专业词汇2.1. 集成电路（Integrated Circuit, IC）集成电路是将数千甚至数百万个电子元件（如晶体管、电容等）集成在一个芯片上的电路。
根据使用的材料和工艺，集成电路可以分为光电子集成电路（Optoelectronic Integrated Circuit, OEIC）、模拟集成电路（Analog Integrated Circuit）和数字集成电路（Digital Integrated Circuit）等多种类型。
2.2. 硅晶圆（Silicon Wafer）硅晶圆是制造集成电路的基础材料，通常由纯度很高的单晶硅制成。
硅晶圆形状类似于圆盘，通过化学加工和光刻技术，在圆盘表面制造出大量微小电子元件。
2.3. MOSFET（金属氧化物半导体场效应晶体管）MOSFET是一种常见的场效应晶体管，也是数字集成电路的关键元件之一。
MOSFET结构由金属栅极、氧化物绝缘层和半导体材料构成，通过对栅极电压的控制，可以实现对电流的精确控制。
2.4. CMOS（互补金属氧化物半导体）CMOS是一种常用的数字集成电路技术，它通过同时使用N型金属氧化物半导体（NMOS）和P型金属氧化物半导体（PMOS）构成逻辑门电路。
CMOS技术具有低功耗、高集成度和抗干扰能力强的优势。
2.5. MEMS（微电子机械系统）MEMS是一种将微机械系统与集成电路技术相结合的技术，它利用微小尺寸的机械结构和传感器，实现对物理环境的感知和控制。
MEMS技术广泛应用于加速度计、陀螺仪、压力传感器等微小尺寸传感器的制造。
2.6. LSI（大规模集成电路）LSI是一种集成度较高的集成电路，其中包含数千至数十亿个晶体管和电子元件。
微电子专业英语翻译
当超量载流子被导入一个直接禁带半导体时，电子与空穴直接复合的几率 较高，这是因为导带的底部与价带的顶端位于同一线上，因此在禁带间跃 迁时，无需额外的动量。直接复合率R应正比于导带中含有的电子数目及 价带中含有的空穴数目。也就是 R=βnp 。其中β为比例常数。
As discussed previously, in thermal equilibrium the recombination rate must be balanced by the generation rate . Therefore , for an n-type semiconductor, we have Gth=Rth=βn no p no where nno and pno represent electron and hole densities in an n-type semiconductor at thermal equilibrium. When we shine a light on the semiconductor to produce electron-hole pairs at a rate GL(Fig.2.11(b)), the carrier concentrations are above their equilibrium values.
当超量载流子被导入一个直接禁带半导体时电子与空穴直接复合的几率较高这是因为导带的底部与价带的顶端位于同一线上因此在禁带间跃迁时无需额外的动量
2.5 Generation and Recombination Processes 载流子产生与复合过程
3. Characteristics of Diodes二极管特性 3.1 Introduction介绍
当电子从导带向下移到价带， 一个电子 - 空穴对消失。这 种反向过程称为复合，并以 复 合 率 Rth 表 示 ， 如 图 2.11 （ a ）所示。在热平衡状态 下，产生速率 Gth 必定等于 复合率 Rth ，所以载流子浓 度维持常数，且维持 pn=ni2 的状况。