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Gen3i
GEN series GEN3iTransient Recorder and Data Acquisition System Special features-PC integrated mainframe-Robust and portable-Three slots for acquisition cards -Accepts any mix of GEN DAQ acquisition cards-Up to 96 analog channels-200 MB/s continuous streaming -Synchronized recording using two GEN3i or GEN2i mainframes -Remote use from external PC -Perception Standard software with Windows based userinterface for advanced reviewand analysisThe GEN3i is a versatile portable data recorder. In addition, it provides all the features expected from a transient recorder. The hardware combines a full-featured, low-power, Intel Core™ i5 3rd generation Windows® PC with a large, high-resolution, touch screen and a robust three-slot acquisition unit. The GEN3i has the same form factor as its predecessor GEN2i, now offering more channels and more processing power. The GEN3i comes with five different Windows® languages and eight different Perception languages pre-installed.Designed for operation in the field as well as inthe laboratory the GEN3i features a unique, Instrument Panel touch interface, with one-touch access to all features for daily operation.In addition, the GEN3i includes PerceptionStandard for post-processing. With a singletouch the data recorder turns into a dedicated instrument for analysis and sophisticatedreporting using the extra software options.DatasheetB3762-2.0 enGEN3i Block DiagramFigure 1.1: Block Diagram GEN3i Portable RecorderWindows® PCMemory8 GB; DDR3 RAMProcessor Intel 3610ME, Core™ i5 3rd generation; 2 Core, 4 threads; 2.7 GHz, 3.3 GHz turbo Ethernet 3 * RJ45 Ethernet connection; 1 Gbit/s1 * RJ45 Ethernet connection with IEEE588 (PTP) support; 1 Gbit/s1 * SFP based optical Ethernet connection with IEEE588 (PTP) support; 1 Gbit/s; supports850 and 1310 nm SFP modules.Wake on LAN Supported on all Ethernet portsWireless LAN Embedded 801.11b/g/n; 54, 100 and 300 Mbit/s; Wireless LAN can be hardware disabled USB connectors USB 2.0, 2 on back + 2 on frontUSB 3.0, 4 on back (Using selective SSD > 100 MB/s continuous streaming)Internal storage PC disk Solid State Drive (SSD), unformatted size 480 GB, 200 MB/s continuous streaming Display TFT SXGA touch screen, 17” / 1280x1024 resolutionVideo connection 2 * Display port and 1 * DVI-D connector; CRT 2048 x 1536 and DVI-D 1600 x 1200 Multiple monitors support3; clone mode and extended modeSpeaker/Speaker Out Internal speaker/jack plug 3.5 mmMicrophone Jack plug 3.5 mmAccessories USB Keyboard and USB optical mouseFront panel controls4; Direct recording control Start/Stop/Pause/TriggerSoftwareInstrument panel / Touch interface (Fully touch-optimized)Setup of instrument, Acquisition control, Display data: live / review, Basic measurements, Export and archiving, Basic reportingDAQ software Perception Standard package. Refer to Perception specification sheet for details.DAQ software options Analysis, Advanced Report, Video Playback, Multi Workbooks, Information, Basic FFT,Sensor Database and moreDAQ Software and Instrument panel languages English, German, French, Chinese, Japanese, Korean, Russian, Portuguese (Brazilian) Operating system Microsoft Windows® 7 UltimateOperating system installed languages English, German, French, Chinese, JapaneseOther languages can be downloaded and installed using "Windows® Update"HBM2B3762-2.0 enApplication Programmers Interfaces (API)PNRF reader (free of charge)Functions Read PNRF, NRF and LRF recording files directly in your own applicationCOM interface The PNRF reader comes as COM interface and can be used from any application orprogramming language which supports COM automationPNRF Software Development Kit (SDK)Installs PNRF dll’s and supplies Visual Basic, C# and C++ getting started examples Matlab® integration Matlab® PNRF reader install and example available within the PNRF SDKLabVIEW™ integration Available directly from National InstrumentsDCE/RPC (Distributed Computing Environment/Remote Procedure Calls)Functions Control Perception software from an external computer/application on Windows®, Linux,Unix, Mac OS XCOM interface All RPC commands have a COM wrapper for easier Windows® software integration Available basic commands Load and Save Perception setup files, Setup Recording, set and review Hardware Settings,Start/Stop/Pause/Trigger, monitor Live dataExamples (free of charge)C++ and C# getting started example programs supplied for Windows®, source codeincluded. Unsupported Linux getting started example on request only.LabVIEW™ integration (free of charge)LabVIEW™ getting started example using RPC/COM availableCSI (Customer Software Interface)Functions Create software extension inside the Perception software by adding CSI user sheets,custom automation and extended analysis functions. Basic Windows C# sheet templateincluded. Available for all Microsoft .NET® 4 supporting languages.Available basic controls & commands Access to every Perception part: Start/Stop/Pause and Trigger, Start Manager, AcquisitionSystem, Hardware Settings, Displays, Meters, User Tables, Formulas, Calculations, DataManager, Data Sources, User variables, Notifications, Logging, Conversion Functions,Automation Actions, Sheet Manager and more, to create a dedicated application GUI thathides the entire Perception standard GUIExamples (free of charge)C# getting started example programs supplied, source code includedTraining/Support ProgramHBM offers paid professional training and support programs on all API interfaces (PNRF reader, RPC and CSI). Training program will be C# based, on-site or at central HBM location. On-site training can be customer specific. Support can be the development of a full custom software application or answering questions of software engineers.Acquisition SystemSystem Timebase and synchronizationCentral timebase for all acquisition cardsAccuracy± 3.5 ppm; aging after 10 years ± 10 ppmBase Binary, Decimal or ExternalSynchronization sources IEEE1588:2008 (PTP V2: Precision Time Protocol; using 2 step master protocol)Master/Slave synchronization; Slave or single Master modeMultiple Master mode scheduled for Q3 2014IRIG and GPS scheduled for Q3 2014PTP synchronization accuracy Synchronization accuracy reduces as network traffic increases on Ethernet port used forPTP synchronization± 150 ns; < 10% load no Ethernet switch used± 500 ns; < 50% load no Ethernet switch used± 5 μs; < 80% load no Ethernet switch usedTo avoid excessive network traffic blocking the PTP synchronization, separate thecommunication and PTP synchronization on two independent networks.Use 2 step master PTP aware switches to obtain best results across switches. Actualaccuracy depends on switch used. The use of switches without PTP support will create anunpredictable accuracy.Acquisition SlotsUnused slots must be covered using the GEN DAQ blank panel. This closes the mainframe front panels for EMC/EMI and safety compliance but also regulates the internal airflow for correct cooling of the acquisition system.Maximum slots3Acquisition boards All slots support any combination of GEN DAQ Acquisition boardsDigital Event/Timer/Counter connector1; Connected to slot A and BB3762-2.0 en3HBMAcquisition SystemThermal control Every acquisition board and the acquisition system monitors its own temperatures andstatus. This is used to regulate fan speeds and reduce noise while optimizing airflow andpower consumption.Calibration Any changes to the acquisition system configuration may change its internal thermalgradients. As accurate calibration relies on a steady and repeatable thermal environment,calibration will be void if changes are made in the configuration. See the individual cardspecifications for calibration impact.GEN3i Connection OverviewFigure 1.2: GEN3i Connection OverviewHBM4B3762-2.0 enMaster/Slave SynchronizationMainframe to mainframe phase shift± 100 nsLED signaling Optical link synchronized, not connected, function disabledMaster mode Basic and extended synchronization supported; 1 Slave maximum. Multiple slave supportedby Multi Slave option (Available Q3 2014)Slave mode Basic and extended synchronization supportedBasic synchronizationFirst sample Synchronizes the first sample in the recording for each mainframeSynchronized timebase Prevents frequency drift of the sample rates within each mainframeChannel trigger exchange Synchronously exchanges every channel trigger connected to the Master/Slave trigger busto/from each connected mainframeExtended synchronizationMaximum number of mainframes 2 (Can be used in mix with GEN2i, GEN3i and GEN3t mainframes)Synchronous recording actions Start/Stop and Pause of a recording across multiple mainframes each controlled by aseparate Perception. Stop recording is a non synchronous actionSynchronous manual trigger User action within Perception to trigger all mainframes synchronouslyCompatibility Basic synchronization features are backward compatible with GEN Series Master/Slavecard option for both Master and Slave modes. Extended synchronization features are notsupported by the Master/Slave card option. When using a mixed setup the system willautomatically work with basic synchronization onlyProbe CalibrationPins2; Signal and groundSignal~1 kHz square waveSignal amplitude0 V to 2 V using 1 MΩ load0 V to 1 V using 50 Ω loadB3762-2.0 en5HBMFigure 1.3: Pin assignment I/O ConnectorConnector type Tyco: 2-5747706-0 (D-sub, 9 pin female)Mating connector type Tyco: 5-747904-5Breakout cable (included)Cable type CoaxConnector type6; BNC femaleLength0.5 m (1.6 feet)External Timebase In TTL compatible, Low -30 V to 0.7 V, High 2 V to 30 VPulse width100 ns min.Maximum frequency 5 MHzActive edge RisingRounding resolution 4.01 µs; 250 kS/s and 20 kS/s acquisition cards1.01 µs; 1 MS/s and 200 kS/s acquisition cards510 ns; 2 MS/s and 200 kS/s (GN611) acquisition cards60 ns; 100 MS/s and 25 MS/s acquisition cardsInput to sample moment delay350 – 400 ns, plus maximum 1 full "rounding resolution"Input overvoltage protection± 30 V DCExternal Trigger In TTL compatible, Low -30 V to 0.7 V, High 2 V to 30 VResolution50 nsMinimum pulse width500 nsActive edge Selectable rising or fallingInput overvoltage protection± 30 V DCDelay(1)± 1 μs + maximum 1 sample period (for decimal and binary time base)Send to External Trigger Out User can select to forward External Trigger In to the External Trigger Out BNC Top Dead Center Rotational input Used to indicate top dead center in rotational external timebaseExternal Trigger Out TTL compatible; 0 V < Low < 0.6 V; 2 V < High < 5 VActive level Selectable High/Low/Hold HighPulse width High or Low selected: 12.8 µsHold High selected : Active from first trigger to end of recordingOutput impedance49.9 Ω ± 1 %Short circuit protected ContinuousDelay(1)516 ± 1 μs + maximum 1 sample period when Clock base: decimal, Filter: wideband(2)504 ± 1 μs + maximum 1 sample period when Clock base: binary, Filter: wideband(2)(1)Delays are equal for all acquisition cards.(2)If analog and/or digital filter is used extra delay will be added depending on type of filter and signal frequency.HBM6B3762-2.0 enExternal Event Out TTL compatible; 0 V < Low < 0.6 V; 2 V < High < 5 VFunction Selectable Alarm or Recording Active outputActive level Selectable High/Low for Alarm outputRecording active High outputPulse width Alarm: Active from start of alarm condition until condition endsRecording: Active until recording stopsOutput impedance49.9 Ω ± 1 %Short circuit protected ContinuousDelay(1)515 ± 1 μs + maximum 1 sample period when Clock base: decimal, Filter: wideband(2)503 ± 1 μs + maximum 1 sample period when Clock base: binary, Filter: wideband(2) External Start In TTL compatible, Low -30 V to 0.7 V, High 2 V to 30 VMinimum Pulse width200 nsActive edge Rising/falling edge; software selectableStart response time Typically 1 s when system is completely idleInput overvoltage protection± 30 V DCExternal Stop In TTL compatible, Low -30 V to 0.7 V, High 2 V to 30 VMinimum Pulse width200 nsActive edge Rising/falling edge; software selectableStop response time Typically 1 s when system is recording without automationInput overvoltage protection± 30 V DC(1)Delays are equal for all acquisition cards.(2)If analog and/or digital filter is used extra delay will be added depending on type of filter and signal frequency.Digital Event/Timer/CounterFigure 1.4: Digital Event/Timer/Counter block diagramSupported Cards See specifications of acquisition cardsNumber of Connectors1Connector Type44 pin, female D-type connector, AMP HD-22 series (Tyco: 5748482-5)Cable Connector Type44 pin, male D-type connector, HDP-22 series (Tyco: 1658680-1)Output PowerVoltage 5 ± 0.5 V DCMaximum current0.5 AEvent InputsNumber of events16 per card, 2 cards per connectorLevels TTL Compatible, Low -30 V to 0.7 V, High 2 V to 30 VB3762-2.0 en7HBMDigital Event/Timer/CounterFigure 1.5: Logic threshold voltage levelsOvervoltage protection± 30 V DCTimer/CounterNumber of channels Two per card, two cards per connectorFunctions See specifications of acquisition cards that support these inputsOutputsNumber of outputs Two per card, two cards per connectorFunctions See specifications of acquisition cards that support these outputsOutput levels TTL compatible; 0 V < Low < 0.6V; 2 V < High < 5 VOutput resistance49.9 Ω ± 1 %Output current20 mA, short circuit protectedDigital Event/Timer/Counter Connector Pin AssignmentFigure 1.6: Pin diagram for Digital Event/Timer/Counter connectorQuantumX Power SupplyConnector type ODU, G81L0C-P08LFG0-0000Mating connector type ODU, SX1LOC−P08MFG0−0000Connector pinning Only GND and PWR signal connectedOutput Power15 WattOutput Voltage> 11 V; Typical 11.5 V to 12 VMaximum Output Current 1.4 A; Current limited and short circuit protectedHBM8B3762-2.0 enPowerPower Inlet47-63 Hz, 100-240 V ACTotal Power of unit (maximum)250 VA, 300 VA peakPhysical, Weight and DimensionsWeightMainframe9 kg (20.9 lbs), add ≈ 1 kg (2.2 lbs) per acquisition board installedDimensionsHeight/Height with handle34.2 cm/39.2 cm (13.5"/15.4")Width43.6 cm (17.2")Depth18.6 cm (7.3")Acoustic Noise The total A-weighted SPL 55 dBA @ 0.6 m maximumTemperature Sensors Temperature for monitoring and air flow controlCooling Fans2Handle One carrying handle, also used for higher tilt anglesTilting Feet Two retractable feet for small tilt anglesGrounding 4 mm Banana plugCasing Aluminum/Plastic coverAccessories Soft carry case with strap for transportation included with hardened front and back forprotection, and storage pouches for mouse and keyboardFigure 1.7: GEN3i DimensionsB3762-2.0 en9HBMEnvironmental SpecificationsTemperature RangeOperational0 °C to +40 °C (+32 °F to +104 °F)Non-operational (Storage)-25 °C to +70 °C (-13 °F to +158 °F)Thermal protection Automatic thermal shutdown at 85 °C (+185 °F) internal temperatureUser warning notifications at 75 °C (+167 °F)Relative humidity0 % to 80 %; non-condensing; operationalProtection class IP20Altitude Maximum 2000 m (6562 feet); operationalShock: IEC 60068-2-27Operational Half-sine 10 g/11 ms; 3-axis, 1000 shocks in positive and negative directionNon-operational Half-sine 25 g/6 ms; 3-axis, 3 shocks in positive and negative direction Vibration: IEC 60068-2-34Operational 1 g RMS, ½ h; 3-axis, random 5 to 500 HzNon-operational 2 g RMS, 1 h; 3-axis, random 5 to 500 HzOperational Environmental TestsCold test IEC60068-2-1 Test Ad-5 °C (+23 °F) for 2 hoursDry heat test IEC-60068-2-2 Test Bd+40 °C (+104 °F) for 2 hoursDamp heat test IEC60068-2-3 Test Ca+40 °C (+104 °F), humidity >93 % RH for 4 daysNon-Operational (Storage) Environmental TestsCold test IEC-60068-2-1 Test Ab-25 °C (-13 °F) for 72 hoursDry heat test IEC-60068-2-2 Test Bb+70 °C (+158 °F) humidity <50 % RH for 96 hoursChange of temperature test IEC60068-2-14 Test Na -25 °C to +70 °C (-13 °F to +158 °F)5 cycles, rate 2 to 3 minutes, dwell time 3 hoursDamp heat cyclic test IEC60068-2-30 Test Db variant 1+25 °C/+40 °C (+77 °F/+104 °F), humidity >95/90 % RH 6 Cycles, cycle duration 24 hoursHarmonized Standards for CE Compliance, according to the following directivesLow voltage directive (LVD): 2006/95/ECElectromagnetic compatibility directive (EMC): 2004/108/ECElectrical SafetyEN 61010-1 (2010)Safety requirements for electrical equipment for measurement, control, and laboratory use - General requirements EN 61010-2-030 (2010)Particular requirements for testing and measuring circuitsElectromagnetic CompatibilityEN 61326-1 (2006)Electrical equipment for measurement, control and laboratory use - EMC requirements - Part 1: General requirements EMISSIONEN 55011Industrial, scientific and medical equipment - Radio-frequency disturbance characteristics - Limits and methods of measurementConducted disturbance: class B; Radiated disturbance: class AEN 61000-3-2Limits for harmonic current emissions: class DEN 61000-3-3Limitation of voltage changes, voltage fluctuations and flicker in public low-voltage supply systemsIMMUNITYEN 61000-4-2Electrostatic discharge immunity test (ESD);contact discharge ± 4 kV/air discharge ± 8 kV: performance criteria BEN 61000-4-3Radiated, radio-frequency, electromagnetic field immunity test;80 to 2700 MHz using 10 V/m, 1000 Hz AM: performance criteria AEN 61000-4-4Electrical fast transient/burst immunity testMains ± 2 kV using coupling network. Channel ± 2 kV using capacitive clamp: performance criteria BEN 61000-4-5Surge immunity testMains ± 0.5 kV/± 1 kV Line-Line and ± 0.5 kV/± 1 kV/± 2 kV Line-earth Channel ± 0.5 kV/± 1 kV using couplingnetwork: performance criteria BEN 61000-4-6Immunity to conducted disturbances, induced by radio-frequency fields0.15 to 80 MHz, 1000 Hz AM; 10 V RMS @ mains, 3 V RMS @ channel, both using clamp: performance criteria A EN 61000-4-11Voltage dips, short interruptions and voltage variations immunity testsDips: performance criteria A; Interruptions: performance criteria CHBM10B3762-2.0 enIRIG, IRIG/GPS (options, to be ordered separately; available Q2 2014)IRIG(1)Supported by IRIG and IRG/GPS optionTime Code Translator (Input)Time Code formats IRIG A and IRIG B, IEEE 1344 compliantAM Modulated or DC level shift (DCLS)Modulation ratio3:1 to 6:1Input amplitude500 mV to 5 V Peak-to-PeakInput impedance>10 kΩTime Code OutputTime Code format IRIG B, IEEE 1344 compliantModulation ratio3:1Output amplitude 4 V Peak-to-Peak (fixed) into 50 ΩDC level shift TTL/CMOSAM modulated input/output connectors 2 SMB sockets; one for input and one for outputDCLS connector Micro DP, 15-pin; some signals internally linked to Interface/Controller ModuleTime synchronization accuracy<5 µs modulated, <1 µs (DCLS)GEN DAQ series functions Capture start of recording timeSynchronize Master Time Base oscillator frequencyTime required to full synchronization after IRIG signal detectedNo recording active 1 to 5 minutesRecording or pause active 1 to 5 minutes plus 25 s per ms recording time deviation from IRIG timeUser notifications while recording Time marks on IRIG signal lost/restored and IRIG time synchronizedShort term tracking stability 5.0 E-8Long term tracking “Fly-wheeling” 5.0 E-7GPS(1)Only supported by IRG/GPS optionGPS connector Micro DP, 9-pinGPS antenna1; includedGPS antenna cable50 m (164 feet); includedTime synchronization accuracy<1 µsGEN DAQ series functions Capture start of recording timeSynchronize Master Time Base oscillator frequencyGPS localization time 2 to 15 minutesTime required to full synchronization after GPS localization completedNo recording active 1 to 10 minutesRecording or pause active 1 to 10 minutes plus 25 s per ms recording time deviation from IRIG timeUser notifications while recording Time marks on GPS satellites lost/restored and GPS time synchronizedShort term tracking stability 5.0 E-8Long term tracking “Fly-wheeling” 5.0 E-7(1)Requires factory installationMultiple Slave Card (option, available Q3 2014)In Master mode enables the synchronization of 2 or more Slaves. Single Slave control and Slave mode supported by mainframe Synchronization connector. Specifications to be determinedB3762-2.0 en11HBMShipping Case (option, to be ordered separately)Figure 1.8: Hardcover reusable shipment case with wheels and transport handleOutside Dimensions60.0 cm (23.6") x 32.5 cm (12.8") x 67.5 cm (26.5") (H x W x D)Weight Empty Case16.5 kg (36.3 lbs)System Storage Area Special area for system, slides in from the top for easy storage and removal from theshipment case. Protects the system for impact during drop, shock and vibrations Accessories Area Separate area for keyboard, mouse, power cable and some cablesReliable Case Transport Wheels and extendable handle constructed for stable transportation with low gravitationpoint to avoid tumbling of case in any direction during roll transportCase Extras Two lift handles and locks on side of the case for easy transportShock and Vibration Tested with system inside case according to ASTM D4728 EDrop Test Tested with system inside case according to ASTM D4169-04 Level IRack Mount Kit (option, to be ordered separately)Figure 1.9: GEN3i Rack Mount KitRack Mount Kit Mounting GEN3i mainframe in a standard 19” rack. Does not support the mouse andkeyboard delivered with the GEN3i. Requires no additional mounting materials. Userinstalled option.HBM12B3762-2.0 enFigure 1.10: Txx adapter block diagramTxx ConnectionNumber of Txx Torque transducers2Torque interface support Torque and ShuntSpeed interface support RPM and DirectionTxx signalsLevels Differential RS422Termination100 ΩB3762-2.0 en13HBMConnectorsGEN series interface HD22 sub-D 44 pin male (connecting cable included)Loop through event input44 pin, female D-type connector, AMP HD-22 series (Tyco: 5748482-5)Torque interface15 pin, female sub-D type (matches 1-KAB149-6)Speed/RPM interface15pin, female sub-D type (matches 1-KAB163-6)CablesTxx adapter to GEN2i/GEN3i/GEN3t0.5 m (1.64 Feet), included with Txx adapterTxx adapter to Txx Torque1-KAB149-6 (other lengths available), to be ordered separatelyTxx adapter to Txx Speed/RPM1-KAB163-6 (other lengths available), to be ordered separatelyPowerAdapter Power by GEN2i/GEN3i/GEN3tTxx Torque transducers Requires separate power supplyOutside dimensions 2.15 (54.60”) x 171.6 (6.76”) x 123.6 (4.86) (H x W x D)Figure 1.11: Txx adapter dimensionsHBM14B3762-2.0 enAcquisition CardsModel Type Isolation Max. SR(1)Resolution Memory(2)Channels Event, T/C(3) Basic200k Single Ended no200 kS/s16 bit128 MB80, 0Basic200k XT ISO Unbalanced Differential yes200 kS/s16 bit128 MB80, 0Basic1M Single Ended no 1 MS/s16 bit256 MB80, 0Basic1M ISO Unbalanced Differential yes 1 MS/s16 bit512 MB80, 0Basic1M XT ISO Unbalanced Differential yes 1 MS/s16 bit512 MB80, 0Bridge200k ISO Bridge/Differential yes200 kS/s16 bit128 MB40, 0Bridge1M ISO Bridge/Differential yes 1 MS/s16 bit512 MB40, 0Uni200k ISO Differential/IEPE/Shunt yes200 kS/s16 bit128 MB40, 0Uni1M ISO Differential/IEPE/Shunt yes 1 MS/s16 bit512 MB40, 0Basic20k-16Differential no20 kS/s16 bit200 MB1616, 0Basic20k-32Differential no20 kS/s16 bit200 MB3216, 0HiRes250k-16Differential/IEPE/Charge no250 kS/s16/24 bit1800 MB1616, 2HiRes250k-32Differential/IEPE/Charge no250 kS/s16/24 bit1800 MB3216, 2HiSpeed 25M Differential/Single Ended no25 MS/s15 bit128 MB40, 0HiSpeed 100M Differential/Single Ended no100 MS/s14 bit1800 MB40, 0Fiber100M 6600Optical Fiber yes100 MS/s--(4)1800 MB4(4)0, 0Fiber100M 7600Optical Fiber yes100 MS/s--(4)1800 MB4(4)0, 0Iso1kV200k Balanced Differential yes200 kS/s16/18 bit200 MB616, 2Iso1kV2M Balanced Differential yes 2 MS/s16/18 bit1800 MB616, 2Marker1M Binary no 1 MS/s 1 bit512 MB640, 0Marker1M HV Optical/Binary yes & no 1 MS/s 1 bit512 MB8 & 320, 0(1)Maximum Sample Rate/channel (not multiplexed).(2)Total recording memory/card.(3)Digital Events, Timer/Counter channels (Supported by GEN3i and GEN2i Digital Event/Timer/Counter connector only).(4)This card supports maximum four optical fiber transmitter channels.Optical Fiber Transmitter ChannelsTransmitterEvery transmitter is a single channel unit. Every unit has an unbalanced differential input, amplifier, analog anti alias filter and ADC with an optical data and control link to the receiver card. The receiver card has the recording logic, sample rate selection and memory.Model Receiver Card Power Sample rate Resolution IsolationHV6600 100M Fiber100M 6600Battery100 MS/s14 bit User application definedHV6600 25M Fiber100M 6600Battery25 MS/s15 bit User application definedMV6600 100M Fiber100M 6600120/240 V AC100 MS/s14 bit1800 V RMSMV6600 25M Fiber100M 6600120/240 V AC25 MS/s15 bit1800 V RMS7600 100M Fiber100M 7600External 12 V DC100 MS/s14 bit User application definedSpecial Function Cards5B Carrier Uses one GEN DAQ slot, holds up to six 5B modules. 5B modules, I/O connectors andcabling not included. An acquisition card is required for actual recording.The 5B Series signal conditioning modules provide a low cost method of connecting analogsignals with data acquisition systems. They are designed to convert thermocouples, RTD's,strain gages, frequencies, potentiometers, slide wires and other signals into standardized,isolated analog outputs.B3762-2.0 en15HBMOrdering Information (1)ArticleDescriptionOrder No.GEN3iGEN3i rugged, portable data recorder.(2)Integrated Instrument, with three acquisitions slots, 200 MB/s streaming rate, one Master/Slave connector, integrated PC, Windows ® 7 Ultimate,64 bit version. 17 inch touch screen TFT,480 GB Solid State Disk, Mouse, Keyboard,carrying bag with integrated protective front cover. Includes Perception Standard software package.1-GEN3i-2GEN3i plus one Iso1kV200k cardGEN3i - 6 channel Iso1kV200k package.Same as GEN3i plus one 1-GN611-2; 6 channel,1 kV isolated balanced differential inputs,200 kS/s, 128 MB RAM cards.1-GEN3i6-2GEN3i plus two Iso1kV200k cardsGEN3i - 12 channel Iso1kV200k package.Same as GEN3i plus two 1-GN611-2; 6 channel,1 kV isolated balanced differential inputs,200 kS/s, 128 MB RAM cards. (12 channels total).1-GEN3i12-2GEN3i plus three Iso1kV200k cardsGEN3i - 18 channel Iso1kV200k package.Same as GEN3i plus three 1-GN611-2; 6channel, 1 kV isolated balanced differential inputs, 200 kS/s, 128 MB RAM cards. (18channels total).1-GEN3i18-2(1)All GEN series systems are intended for exclusive professional and industrial use.(2)GEN3i ships with keyboard layout in English, German, French, Chinese or Japanese. Specify on order.HBM 16B3762-2.0 en。
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高性能计算技术、方案和行业解析(HPC)
目录1 HPC行业和市场概述 (9)1.1 传统计算面临的挑战 (10)1.2 HPC主要场景和分类 (11)1.2.1 CAE场景简介 (11)1.2.2 石油勘探简介 (13)1.2.3 数值气象预报简介 (14)1.2.4 科研领域介绍 (15)1.2.5 生命科学介绍 (17)1.2.6 动漫渲染介绍 (18)1.3 HPC系统主要组成 (19)1.3.1 HPC软件架构堆栈 (19)1.3.2 HPC软件并行环境 (20)1.3.3 HPC集群系统组成 (23)1.3.4 HPC系统典型部署 (25)1.4 HPC IO业务模型 (27)1.5 HPC系统架构演变 (28)1.6 HPC存储玩家介绍 (29)1.6.1 HPC存储厂商分类 (29)1.6.2 Burst Buffer介绍 (30)1.6.3 Panasas和Seagate介绍 (30)1.6.4 主流并行文件系统 (31)1.6 HPC对存储的主要诉求 (33)1.7 HPC系统的衡量标准 (33)1.8 HPC未来的技术趋势 (34)2 HPC场景的存储形态 (35)2.1 HPC为什么需要文件存储 (35)2.2 本地存储引入的问题 (35)2.3 HPC主要的存储形态 (36)2.4 HPC场景NFS存在的问题 (37)2.4.1 存储节点负载不均 (37)2.4.2 存储节点间数据转发严重 (38)2.4.3 并发访问数据一致性 (38)3 并行处理IO相关知识 (39)3.1 并行处理一般性概念 (39)3.2 MPI并行编程消息机制 (41)3.3 MPI场景和他计算框架 (41)3.4 MPI-IO数据处理介绍 (42)4 Lustre文件系统解析 (45)4.1 Lustre文件系统概述 (45)4.2 Lustre开源/商业软件策略 (45)4.3 Lustre文件系统架构 (46)4.4 Lustre Stripe切片技术 (52)4.5 Lustre 的IO性能特征 (54)4.5.1 写性能优于读性能 (54)4.5.2 大文件性能表现好 (54)4.5.3 小文件性能表现差 (55)4.6 Lustre小文件优化 (55)4.7 Lustre性能优化最佳实践 (56)5 GPFS文件系统解析 (57)5.5 GPFS文件系统概述 (57)5.5.1 GPFS文件系统架构 (58)5.5.2 GPFS文件系统逻辑架构 (59)5.6 GPFS文件系统对象 (64)5.6.1 网络共享磁盘NSD (64)5.6.2 集群节点及客户端节点 (64)5.6.3 仲裁Node和Tiebreaker磁盘 (64)5.7 GPFS集群仲裁机制 (65)5.7.1 仲裁节点机制 (65)5.7.2 仲裁磁盘机制 (65)5.8 GPFS Failure Group失效组 (65)5.9 GPFS文件系统伸缩性 (65)5.10 GPFS文件系统负载均衡 (66)6 Spectrum Scale架构详解 (66)6.5 Spectrum Scale云集成 (68)6.6 Spectrum Scale存储服务 (69)6.7 Spectrum Scale交付模型 (69)6.8 Spectrum Scale架构分类 (70)6.9 Spectrum Scale企业存储特性 (71)6.9.1 Spectrum Scale数据分级至云 (71)6.9.2 Spectrum Scale RAID技术 (72)6.9.3 Spectrum Scale Active文件管理 (72)6.9.4 Spectrum Scale快照技术 (72)6.9.5 Spectrum Scale Cache加速 (73)6.9.6 Spectrum Scale分级存储管理 (73)6.9.7 Spectrum Scale文件和对象访问 (74)6.9.8 Spectrum Scale加密和销毁 (75)6.10 Spectrum Scale虚拟化部署 (75)6.11 Spectrum Scale LTFS带库技术 (76)6.12 Elastic Storage Server (78)7 BeeGFS文件系统解析 (79)7.5 ThinkParQ介绍 (79)7.6 BeeGFS操作系统兼容性 (80)7.7 BeeGFS系统架构 (80)7.7.1 管理服务器介绍 (81)7.7.2 元数据服务器介绍 (82)7.7.3 对象存储服务介绍 (82)7.7.4 文件系统客户端 (83)7.8 BeeGFS安装和设置 (83)7.9 BeeGFS调优和配置 (84)7.10 BeeOND Burst Buffer (84)7.11 BeeGFS配额特性 (85)7.12 BeeGFS的Buddy镜像 (86)7.13 BeeGFS支持API概述 (87)7.14 BeeGFS系统配置要求 (88)7.14.1 存储服务器配置 (88)7.14.2 元数据服务器配置 (89)7.14.3 客户端服务器配置 (89)7.14.4 管理守护进程配置 (89)7.15 BeeGFS支持的网络类型 (89)7.16 BeeGFS导出NFS/CIFS (90)7.17 BeeGFS生态合作 (90)8 主流HPC产品和解决方案 (92)8.5 DDN存储解决方案和产品 (92)8.5.1 DDN S2A平台和产品 (93)8.5.2 DDN SFA平台和产品 (94)8.5.3 DDN WOS平台和产品 (96)8.5.4 DDN Scaler系列网关产品 (96)8.5.5 Burst Buffer加速产品 (102)8.5.6 FlashScale全闪存产品 (103)8.6 曙光存储解决方案和产品 (105)8.6.1 曙光解决方案系统概况介绍 (108)8.6.2 硅立方液体相变冷却计算机 (109)8.6.3 曙光6000软硬一体化产品 (109)8.6.4 ParaStor300系列存储系统 (110)8.6.5 集群管理业调度和监控管理 (111)8.7 希捷存储解决方案和产品 (112)8.7.1 ClusterStor产品架构 (113)8.7.2 ClusterStor Manager介绍 (115)8.7.3 ClusterStor配置扩展方式 (115)8.7.4 ClusterStor存储软件集成架构 (118)8.8 Dell EMC存储解决方案和产品 (120)8.8.1 Dell EMC NFS存储解决方案 (120)8.8.2 Dell EMC BeeGFS高性能存储方案 (121)8.8.3 Dell EMC BeeGFS大容量存储解决方案 (130)8.8.4 Dell EMC Lustre存储解决方案 (138)8.8.5 Dell EMC PixStor存储解决方案 (147)8.8.6 Dell EMC 分布式Isilon存储解决方案 (156)9 Burst Buffer技术和产品分析 (159)9.5 Cray DataWarp技术和产品 (159)9.5.1 Burst Buffer场景匹配 (160)9.5.2 Burst Buffer技术架构 (161)9.5.3 Cray技术演进蓝图 (163)9.5.4 Cray HPC方案和产品 (164)9.6 DDN Burst Buffer产品 (166)9.6.1 IME产品架构 (166)9.6.2 IME14KX产品介绍 (169)9.6.3 IME240产品介绍 (169)9.7 EMC Burst Buffer产品 (170)9.7.1 aBBa产品架构 (171)9.7.2 aBBa软件堆栈 (172)10 HPC主流网络和技术分析 (173)10.5 InfiniBand技术和基础知识 (173)10.5.1 IB技术的发展 (173)10.5.2 IB技术的优势 (174)10.5.3 IB网络重要概念 (176)10.5.4 IB协议堆栈分析 (177)10.5.5 IB应用场景分析 (179)10.6 InfiniBand技术和架构 (180)10.6.1 IB网络和拓扑组成 (180)10.6.2 软件协议栈OFED (183)10.6.3 InfiniBand网络管理 (185)10.6.4 并行计算集群能力 (186)10.6.5 基于socket网络应用 (187)10.6.6 IB对存储协议支持 (187)10.6.7 RDMA技术介绍 (187)10.7 Mellanox产品分析 (188)10.7.1 Infiniband交换机 (189)10.7.2 InfiniBand适配器 (192)10.7.3 Infiniband路由器和网关设备 (193)10.7.4 Infiniband线缆和收发器 (194)10.8 InfiniBand和Omni-Path之争 (195)10.8.1 Intel True Scale Fabric软件架构 (196)10.8.2 Intel InfiniBand产品家族 (198)10.8.3 Intel Omni-Path产品介绍 (199)10.8.4 Omni-Path和InfiniBand对比 (200)11 HPC超算系统排名和评估 (203)11.1 TOP500榜单刷新和ARM挑战 (203)11.2 TOP500基准介绍和排名规则 (206)11.3 Green500基准介绍和排名规则 (209)11.4 HPC超算系统其他评估基准 (211)11.4.1 GTC-P应用基准 (216)11.4.2 Meraculous测试基准 (216)11.4.3 MILC测试基准 (216)11.4.4 MiniDFT测试基准 (216)11.4.5 MiniPIC测试基准 (217)11.4.6 PENNANT测试基准 (217)11.4.7 SNAP测试基准 (217)11.4.8 UMT测试基准 (217)11.4.9 Crossroads/N9 DGEMM基准 (217)11.4.10 IOR BenchMark基准 (218)11.4.11 Mdtest测试基准 (218)11.4.12 STREAM测试基准 (218)1HPC行业和市场概述在传统的HPC（High performance computing）环境中，由于技术的局限和业务的单一，计算环境中的每个业务系统使用独立的硬件建立计算环境；随着高性能计算的技术的发展，运算平台的并行化程度提高以及业务涵盖的应用领域迅速延伸，使得传统计算环境中多个独立的环境出现资源利用不足或者性能瓶颈的问题。
IBM刀片InfiniBand解决方案介绍
Ma Song
InfiniBand Technology Leadership
Industry Standard – Hardware, software, cabling, management – Design for clustering and storage interconnect Price and Performance – 40Gb/s node-to-node – 120Gb/s switch-to-switch – 1us application latency – Most aggressive roadmap in the industry Reliable with congestion management Efficient – RDMA and Transport Offload – Kernel bypass – CPU focuses on application processing Scalable for Petascale computing & beyond End-to-end quality of service Virtualization acceleration I/O consolidation Including storage
Benefit
4x 20x True Application Scale-out Maximum Reliability Intelligent Reliability Matching performance to requirements
Aggregate Bandwidth per Chassis Price/Gbps Power/Gbps
RDMA技术调研
RDMA技术调研一、RDMA介绍1.2 RDMA介绍传统网络中的转发过程：传统网络协议栈的过程下，无论是发送端还是接收端，都需要CPU的指挥和控制，包括网卡的控制，中断的处理，报文的封装和解析等等。
使用了RDMA技术之后网络的转发过程：在使用了RDMA技术时，两端的CPU几乎不用参与数据传输过程（只参与控制面）。
本端的网卡直接从内存的用户空间DMA拷贝数据到内部存储空间，然后硬件进行各层报文的组装后，通过物理链路发送到对端网卡。
对端的RDMA网卡收到数据后，剥离各层报文头和校验码，通过DMA将数据直接拷贝到用户空间内存中。
1.2 RDMA相较于传统网络的核心优势RDMA是现代高速网络的具体实现方案，现主要用于数据中心内部的存储服务器之间的数据交互，相较于传统网络，主要有三大核心优势∶0拷贝∶应用程序可以在没有网络软件堆栈参与的情况下执行数据传输，并且数据被直接发送到缓冲区，而无需在网络层之间进行复制。
内核旁路∶应用程序可以真接从用户空间执行数据传输，而无需执行上下文切换。
CPU卸载∶应用程序可以访问远程内存而不会消耗远程机器中的任何CPU。
远程内存机器将在没有任何远程进程（或处理器）干预的情况下被读取。
远程 CPU 中的缓存不会被访问的内存内容填满。
1.3 什么样的业务场景需要用到RDMA可以在至少需要以下一项的场景中找到RDMA∶低延迟-例如∶ HPC、金融服务、web 3.0高带宽-例如∶HPC、医疗设备、存储和备份系统、云计算CPU占用空间小-例如∶ HPC、云计算1.4 三种RDMA协议介绍RDMA本身指的是一种技术，具体协议层面，包含Infiniband（IB），RDMA over Converged Ethernet （RoCE）和internet Wide Area RDMA Protocol （WARP）。
三种协议都符合RDMA标准，使用相同的上层接口，在不同层次上有一些差别。
Infiniband：从一开始就原生支持 RDMA 的新一代网络协议。
Voltaire公司介绍
Accelrys、WOMBAT、ESI、Paradigm
© 2009 Voltaire Inc.
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Voltaire的用户
LIFE SCIENCES
ENTERTAINMENT
FINANCIAL
TELECOM
GOVERNMENT
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© 2009 Voltaire Inc.
Latency Profile Up to 450K updates/sec Voltaire Infiniband vs. Ethernet
Run Time (hours) 5 4
Mean Latency (ms) 1.800 1.600 1.400 5.000 4.000 3.000 2.000 1.000 .800 .600 .400 .200 0 0
► 遍布全球的行销支持体系；
• 营销总部：波士顿； • 研发总部：Herzeliya，以色列； • 洛杉矶、纽约、伦敦、北京、东京、首尔、法兰克福
► 研发以及技术人员超过雇员总数60%；
© 2009 Voltaire Inc.
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Voltaire合作伙伴
OEM 合作伙伴
IBM、HP、SUN SGI、Rackable、NEC
10台配有216端口的 ISR2012导向器级交 换机以及36台FC-IB 存储路由器，全光纤 线缆！
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© 2009 Voltaire Inc.
Voltaire中国成功案例之 --中科院计算机网络信息中心 联想深腾7000
#19
中科院计算机网络信息中心 12,216 Cores 102.8 TFlops
Los Alamos, Roadrunner
超算中心InfiniBand网络光互连解决方案
超算中心InfiniBand网络光互连解决方案高性能计算(High Performance Computing，以下简称HPC)，即超算中心HPC市场正在朝着使用异质计算系统和提高能效比的方向发展：GPU、DSP和ARM处理器同时运行，以实现用更少的能耗带来更高的Petaflop(1千万亿次浮点计算/秒)值。
IDC预测，HPC服务器市场要实现在2017年达到150亿美元销售额的目标，每年的增速就必须要保持在7.3%左右。
超级计算(Supercomputing)的应用范围非常广泛，包括汽车制造模拟、天气预报、分子生物学研究、地球物理学等，在这些领域中往往需要并行计算和处理大量的数据、进行复杂的运算。
最近经常被讨论的大数据分析，也会用到超级计算。
高性能模拟需要最高效的计算平台。
计算集群（Cluster）技术平台由于其出色的生产力和灵活性，现已成为 HPC 模拟最常用的硬件解决方案。
而计算集群Cluster技术平台通常采用以下高速互联技术进行沟通，如：InfiniBand、高性能Ethernet(精简过的帧结构)、BlueGene、Gray等互联技术，其中41.2%的超算中心采用了infiniBand互连技术。
超算中心Top500中还有不少系统采用了以太网或者Cray的互连技术，但正是这些独特的优势让infiniband在超算中大行其道，据统计，全球超算中心Top500榜单中，有41.2%的系统采用了infiniband互连技术。
InfiniBand诞生的缘由：InfiniBand是一种输入输出（I/O）宽带结构，可以提高服务器各设备之间、网络子系统之间的通信速度，为将来的计算机系统提高更高性能和无限扩展性的宽带服务。
InfiniBand 技术不是用于一般网络连接的，它的主要设计目的是针对服务器端的连接问题的。
因此，InfiniBand技术将会被应用于服务器与服务器（比如复制，分布式工作等），服务器和存储设备（比如SAN和直接存储附件）以及服务器和网络之间（比如LAN， WANs和the Internet）的通信。
VSAN性能剖析及HCIBench测试
VSAN性能剖析及HCIBench测试剖析：VSAN如何达到740万IOPS？在混合、全闪存配置下，条带宽度、磁盘组等对性能有何影响？为何说HCIBench是HCI或分布式存储性能测试的最佳工具？NVMe SSD(PCIe形式)和NVDIMM SSD(内存条形式)性能有多猛吗？你知道，国内用户ESX Server正常运行有高达多少年的吗？有不少朋友询问从哪可以下载这个工具，文章末尾会提供下载方式，并且提供9月7日交流文档的全文。
不过呢，考虑到有大部分人比较懒: ) 【其实我也比较懒:) 】，不会跳转到下载地址那。
所以，下面把比较重要的几页，摘取出来，这样通过浏览微信文章就能知道个大概。
目录1、VSAN的高可靠性和高可用性2、VSAN性能剖析i.VSAN混合存储ii.VSAN全闪存存储iii.其他测试工具iv.用户实际环境3、超融合架构或分布式存储性能测试的最佳工具i.HCIBench简介做为数据安生之地，存储其实最重的是：高可靠性和高可用性。
VSAN的高可靠性和高可用性至少体现在6个方面。
方面一：VSAN内嵌于业界最成熟最稳定的Hypervisor - ESXi备注：Hypervisor走向成熟需要很多年的磨合、积累；前些天看到同事朋友圈里发的下图，刷新了此前国内某运营商，ESX Server正常运行2453天（6年半）的记录。
国内某金融行业用户ESX Server正常运行2868天（7年10个月）！同事表示很伤感，我好奇的问为何？他回答说：“因为今天把这两台机器关机了，腾地方给新服务器。
这个纪录就不会往上加了”。
欢迎读者在后台私信截图给我，看看是否还有刷新这个记录的用户。
如果不方便，我们可以隐藏用户名。
顺便做下广告，超融合架构（HCI）可以节省机柜空间: )详情请看阿明在2016-09-22，在微信公众号IT大嘴巴发表的文章《2U空间干之前16倍工作，精简之道！》，可直接打开如下网址，看看采用VMware Virtual SAN Ready Nodes的全闪存系列中，FX2这种模块化的融合架构，如何达到这一惊人的效果的：另外五个方面：这个性能的分析，主要基于VMware在官网上公开发布的白皮书《VMware Virtual SAN 6.0 Performance: Scalability and Best Practices》进行解读的。
Dell EMC PowerEdge R450 技术指南说明书
Dell EMC PowerEdge R450技术指南12 2021注意、小心和警告:“注意”表示帮助您更好地使用该产品的重要信息。
:“小心”表示可能会损坏硬件或导致数据丢失，并告诉您如何避免此类问题。
:“警告”表示可能会导致财产损失、人身伤害甚至死亡。
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章 1: 系统概览 (5)关键工作负载 (5)新技术 (5)章 2: 系统功能和代际比较 (6)章 3: 机箱视图和功能部件 (8)机箱视图 (8)系统的前视图 (8)系统的后视图 (8)系统内部 (9)快速资源定位器 (10)章 4: 处理器 (11)处理器特性 (11)支持的处理器 (11)章 5: 内存子系统 (12)支持的内存 (12)内存速度 (13)章 6: 存储 (14)存储控制器 (14)支持的驱动器 (14)外部存储器 (15)章 7: 联网 (16)概览 (16)支持的 OCP 卡 (16)OCP 外形规格 (17)OCP NIC 3.0 与机架网络子卡比较 (17)章 8: 扩展卡和扩展卡转接卡 (18)扩展卡安装原则 (18)章 9: 功率、散热和声音 (22)功率 (22)散热设计 (22)PowerEdge R450 声音 (23)声音性能 (23)章 10: 机架、导轨和线缆管理 (26)导轨信息 (26)目录3滑动导轨 (26)固定导轨 (26)线缆固定臂 (27)防变形条 (27)章 11: 支持的操作系统 (28)章 12: Dell EMC OpenManage 系统管理 (29)服务器和机箱管理器 (29)Dell EMC 控制台 (30)自动化启用程序 (30)集成第三方控制台 (30)连接第三方控制台的接口 (30)Dell EMC 更新公用程序 (30)戴尔资源 (30)章 13: Dell Technologies 服务 (32)Dell EMC ProDeploy Enterprise Suite (32)Dell EMC ProDeploy Plus (33)Dell EMC ProDeploy (33)基本部署 (33)面向 HPC 的 Dell EMC ProDeploy (33)Dell EMC 服务器配置服务 (34)Dell EMC 派驻服务 (34)Dell EMC 数据迁移服务 (34)Dell EMC ProSupport Enterprise Suite (34)面向企业的 Dell EMC ProSupport Plus (34)面向企业的 Dell EMC ProSupport (35)Dell EMC ProSupport One for Data Center (35)ProSupport for HPC (36)支持技术 (36)数据安全服务 (37)Dell Technologies Education Services (37)Dell Technologies 咨询服务 (37)Dell EMC 远程咨询服务 (38)Dell EMC 托管服务 (38)章 14: 附录 A.其他规格 (39)机箱尺寸 (39)机箱重量 (40)视频规格 (40)USB 端口 (41)PSU 评级 (41)环境规格 (42)散热限制 (43)章 15: 附录 B.标准遵从性 (45)章 16: 附录 C 其他资源 (46)4目录系统概览Dell™ PowerEdge™ R450 是戴尔最新的双路 1U 机架服务器，旨在使用可高度扩展的内存、I/O 和网络选项，运行复杂的工作负载。
Mellanox ConnectX-3 适配器和 Ethernet 交换机的 Hadoop 部署指南
WHITE PAPER® with Mellanox End-to-End 10/40Gb Ethernet SolutionsBackground (1)Hardware (1)Software Requirements (4)Installation (4)Scalling the Cluster Size (9)High Availability (10)Appendix A: Setup Scripts (10)1. Hadoop Background: /2. The described configurations and settings are used in the following CDH (Cloudera’sDistribution, including Apache™ Hadoop®)A. Rev: CDH3u4B. Rev: CDH3u5To implement and test the technology, you will need:• At least one Master Node (NameNode, Job Tracker)• At least three Slave Nodes (DataNode, Task Tracker)• Four or more Mellanox ConnectX®-3 adapter cards• One or more 10GbE or 40GbE Ethernet switches with the Priority Flow Control (PFC) capability• Four or more cables required for the ConnectX®-3 card (typically using SFP+ connectors for 10GbE orQSFP connectors for 40GbE)There are many options in terms of adapters, cables and switches. Refer to Mellanox’s website, whereyou can find more information about these RoCE adapters, /content/pages.php?pg=products_dyn&product_family=127&menu_section=28, and Ethernet switches, http://www./content/pages.php?pg=ethernet_switch_overview&menu_section=71.In this article we will review a 5 node cluster configuration. Scaling the deployment is easily done byadding more Slave Nodes to the deployment. When scaling the deployment, take into consideration theamount of RAM you have in the Master Node as well as the disk space.High availability features are discussed within the above Apache™ Hadoop® framework link. Werecommend deploying two Master Nodes in master and secondary name node configuration.Figure 5: Mellanox MCX314A-BCBT,ConnectX-3 40GbE AdapterFigure 7: Example: Scaling to 120 nodes©2012 Mellanox Technologies. All rights reserved.©2012 Mellanox Technologies. All rights reserved.350 Oakmead Parkway, Suite 100, Sunnyvale, CA 94085Tel: 408-970-3400 • Fax: 408-970-3403© Copyright 2012. Mellanox Technologies. All rights reserved.Mellanox, Mellanox logo, BridgeX, ConnectX, CORE-Direct, InfiniBridge, InfiniHost, InfiniScale, PhyX, SwitchX, Virtual Protocol Interconnect, and Voltaire are registered trademarks of Mellanox Technologies, Ltd.Connect-IB, CoolBox, FabricIT, MetroX, MLNX-OS, ScalableHPC, Unbreakable-Link, UFM and Unified Fabric Manager are trademarks of Mellanox Technologies, Ltd. All other trademarks are property of their respective owners. 4102WP Rev 1.0。
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HPC-X
完整 HPC 软件包 – MPI, SHMEM/PGAS, UPC
© 2016 Mellanox Technologies
- Mellanox Confidential -
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Mellanox HPC-X™ HPC 软件包
完整 MPI, PGAS OpenSHMEM 与 UPC 软件包 最大化应用性能 基于 UCX (Unified Communication – X Framework) 可于Mellanox官网下载
- Mellanox Confidential -
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GPUDirect RDMA 技术
加速GPU应用
© 2016 Mellanox Technologies
- Mellanox Confidential -
MiniFE - 有限元应用
© 2016 Mellanox Technologies
Allreduce MPI Collective
性能提升 10 to 25 倍
- Mellanox Confidential -
10
SHArP 加速 Intel Xeon Phi – KNL 性能
Time Time
4
Switch-IB 2 EDR 100G 优势
© 2016 Mellanox Technologies
SHArP 使得 Switch-IB 2交换机能够在网络中 即可执行MPI操作
Switch-IB 2 使得交换机成为协处理器
实现MPI与SHMEM/PGAS性能 10倍 提升
- Mellanox Confidential -
OSU - OSU MPI benchmark; IMB – Intel MPI Benchmark
Lower is better
最大化 KNL 性能 – 运行时间缩短50% (客户测试结果)
© 2016 Mellanox Technologies
- Mellanox Confidential -
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全球超算排名TOP500已经演变成为HPC与云计算 / 互联网系统的混合排名
© 2016 Mellanox Technologies
- Mellanox Confidential -
2
智能网络加速实现百亿亿次计算
CPU为核心
Co-Design
受限于主机CPU 造成性能局限性
必须等待数据 造成性能瓶颈
高级动态路由
6
ConnectX-5 EDR 100G 架构
X86
Open POWER
GPU
ARM
FPGPCIe Switch
PCIe Gen4
性能的又一次突破 性价比的进一步提升！
卸载引擎
内存
RDMA
数据传输
eSwitch & 路由
InfiniBand / Ethernet 10,20,40,50,56,100G
VCSELs, 硅光与铜线
- Mellanox Confidential -
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EDR 100G InfiniBand 提升应用性能 (28-80%)
28%
© 2016 Mellanox Technologies
- Mellanox Confidential -
9
Switch-IB 2 SHArP 性能优势
5
ConnectX-5 EDR 100G 优势
© 2016 Mellanox Technologies
- Mellanox Confidential -
100Gb/s 吞吐量 0.6usec 延迟 (端到端)
2亿消息/秒
硬件执行MPI集群操作 硬件执行MPI Tag Matching
网卡内置内存
支持 PCIe Gen3 与 Gen4 网卡内集成 PCIe 交换机
HPC-X
时间 (s) 368 998
优势 37% 61%
实现最高应用性能与可扩展性
© 2016 Mellanox Technologies
- Mellanox Confidential -
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UM – 天气应用
不用HPC-X系统需要500节点实现性能要求 采用HPC-X – 只需412 节点!
© 2016 Mellanox Technologies
© 2016 Mellanox Technologies
建立协同关系 实现更高性能和扩展性
数据移动中同步处理 实现更高性能和扩展
- Mellanox Confidential -
3
6月德国国际超算大会: 发布 ConnectX-5 智能网卡
© 2016 Mellanox Technologies
- Mellanox Confidential -
36 EDR (100Gb/s) 端口, <90ns 延迟 吞吐量7.2Tb/秒 70.2 亿次消息/秒 (每端口195M 消息/秒)
32 100GbE 端口, 64 25/50GbE 端口 (10 / 25 / 40 / 50 / 100GbE) 吞吐量 6.4Tb/s
收发器 光纤与铜缆 (10 / 25 / 40 / 50 / 56 / 100Gb/s)
© 2016 Mellanox Technologies
- Mellanox Confidential -
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Mellanox 提供最高应用性能 (HPC-X)
Quantum Espresso 应用
Quantum Espresso
算例 A B
# 节点 43 196
Intel MPI
时间 (s) 584 2592
智能网络，互连未来
迈向百亿亿次计算
刘通，Mellanox 亚太及中国区高级市场开发总监
2016年6月
Mellanox网络继续保持在高性能计算领域的优势
在高性能计算系统中使用最多的网 络依然是Mellanox InfiniBand
Mellanox 互连Top500中70.4%的HPC系统 Mellanox 互连Top500近50%千万亿次系统(Petascale)
© 2016 Mellanox Technologies
- Mellanox Confidential -
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最高性能 100Gb/s 网络解决方案
© 2016 Mellanox Technologies
100Gb/s 网卡, 0.6us 延迟 2亿消息/秒 (10 / 25 / 40 / 50 / 56 / 100Gb/s)