MIKM9-7PL1中文资料

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MICRF007使用说明

关断模式逻辑电平控制输入端
工作(此时芯片内部上拉为 VDD) 外接自动增益控制电容 AGC 外接参考振荡器外接元件/输入内部调谐的时钟基准通过晶振接 VSS 或用 AC 耦合方式输入为 0.5VPP 的时钟信号外接元件实现在片自动增益控制
1.3 技术参数极限工作条件
电源电压最大结温焊接温度
见说明 1
……………..…+7V …Vss-0.3 ~VDD+0.3 ………….…+150 …..…-65 ~+150 ………….…+260
额定工作条件(见说明 2)
电源电压环境温度射频范围 VDD TA ….…+4.75~+5.5V ….…-40 ~+85 .…300M~440MHz
VDDRF VDDBB TJ TS 焊接时间 10s
FREFOSC MHz × 4.90MHz对应参数值 4.90MHz
例如参考振荡器频率 fT 6.00MHz 时
6.00MHz对应参数 =
6.00 × 4.90MHz对应参数值 4.90
当参考频率不是 4.90MHz 时该参数可由下式计算
8. 该参数与参考振荡器频率 fT 成反比
4.90MHz × 3.36MHz对应参数值 FREFOSC MHz
KHz A V V s
数据/控制部分 IOUT VOUT VOUT tR,tF
high low
输出电流输出高电平输出低电平输出上升 / 下降时间
DO 引脚 CLOAD 15pF
86-755-83867700
Aug 2003

说明
1. 超出极限工作条件可能会损坏器件 2. 超出额定工作条件时器件性能不能保证 3. 本产品属静电敏感器件请采取合理的静电防护措施适用 Class1 ESD 要求人体放电模型 HBM 符合 MIL-STD-883C 之 3015 测试标准不要在强静电场附近使用和贮存 4. 灵敏度定义为在误码率 BER 10-2 时输入端测得的信号平均值输入信号为平均占空比 50% 数据速率为 300bps 的归零 RZ 波形曼彻斯特编码 ANT 射频输入采用 50 阻抗匹配 5. 寄生背向隔离表征在射频输入引脚用 50 阻抗匹配网络测试时显示的寄生元件参数背景噪声源于

先锋M9

先锋M9基本信息本文章来源：主题名品网。

先锋M9是由中国北方先锋工业生产，在1998年开始为美国一家军品贸易公司生产D80刺刀，所有产品销往美国后由美国再销售到其它非美国国家。

刀身用不锈钢制造，经锻压加工，厚实坚固。

表面呈暗灰色。

刃口部位经局部热处理，刀口锋利，能砍树枝木棒，切割绳索。

发展历程1961年：美军开始装备M7式刺刀。

由于该刺刀只能作枪刺和匕首，功能较少，且刀颈部易锈蚀，被认为是世界上最差的刺刀之一，故在前苏联、英国等国军队采用多用途刺刀之后，美军提出了装备新刺刀的要求。

1985年12月：美陆军部正式提出对新刺刀的战术技术要求。

1986年初：五角大楼提出招标后，有3家美国公司和3家外国公司参加竞争。

经过对6家公司55把刺刀的野战试验，美国弗罗比斯公司的刺刀获胜中选，被命名为M9式多用刺刀。

此后在本宁堡美国步兵学校进行的步枪突击连刺刀突击科目训练中，又对M7式和M9式刺刀进行了广泛的对比试验。

试验结果，在损坏率等方面，M9式刺刀比M7式刺刀有明显的优越性。

1986年：美国陆军正式采用此型军用刺刀，并订其制式为M9系列多功能刺刀，简称M9MPBS。

1986年10月2日：由当时位于加州圣地牙哥郡Carsbad市的Phrobis Ltd·获得首批承包合约（合约批号：DAAA21-87-C0001）。

1986年10月：美国陆军部批准了一项价值1560万美元的合同，购买315600把M9式刺刀。

1987年2月：首批合约的部分刺刀开始交货，经由美国陆军验收后，拨交驻于本宁堡（Fort Bening）的美国陆军第75游骑兵营使用。

第一个主要配备部队则为美国陆军第七轻步兵师。

该型刺刀当时仅配发于美陆军步兵、游骑兵、特种部队及战斗工兵等部队。

1987年3月：M9式刺刀开始装备美陆军和少数特种部队。

1989年9月：Phrobis Ltd完成美陆军M9式刺刀第一个合约，产量为315,600把。

该批刺刀刀身标识为：M9 PHROBIS III U.S.A PAT PEND。

K7i说明书-售价198元的ARM7_LPC2148学习板_USB供电_USB烧写_…

K7I 说明书K7I 是一款极高性价比，极其方便实用的ARM7-LPC2148学习板、开发板。

K7I 特别适用于ARM初学者。

K7I采用LPC2148主芯片。

片内资源：:512K Flash+32K SRAM 。

用户可以自行焊接管脚pin对pin兼容的LPC214x芯片。

K7I可以通过USB(USB转串口技术)在线烧写(ISP)芯片内置FLASH，也可以通过JTAG烧写和在线调试。

K7I特点USB供电。

客户不需要配置额外的电源适配器。

USB烧写。

客户不需要配置额外的编程器。

USB接口。

适用于所有具有USB接口的电脑，客户不需要额外配置串口线或USB转串口电缆。

众多的资源。

接口全部开放。

先进的工艺。

双面板贴片设计。

提供全部设计资料。

包括原理图(orcad/pdf格式)，原理图(PowerPCB格式)。

K7I 彩图K7I K7I标准套件标准套件标准套件K7I 主板 1块 165元(可单卖)USB 数据线 1根 2元(不单卖)Wiggler 兼容JTAG 板 1套 18元(不单卖)液晶 1602带背光 1片 15元(不单卖)K7I 价格价格K7I 主板(送USB 数据线) 165元K7I 标准套件全国统一零售价198元三件以上团购三件以上团购，，送快递费送快递费！！K7I 快递服务快递服务K7I 一般采用顺丰快递，全国大部分地区38小时送货上门。

也可以由客户指定快递方式。

K7I K7I 购买办法购买办法购买办法1淘宝店 /店铺名字 K92 汇款工商银行卡号：9558 8040 0015 8957 742姓名：沈丽珍开户行：中国工商银行深圳高新产业园支行K7I 硬件资源LPC2148USB转串口LPC2148_USB 2.0 从接口1602液晶全modem接口SD卡数码管IIC EEPROMADDA4 KEY4 LED蜂鸣器温度传感器红外接收器(未焊)REALTIMEWatchDogJTAG全部引脚可供扩展使用K7I软件资源K7I提供测试用途的最终BIN码。

LM78M12中文资料

LM78M12中⽂资料LM341/LM78MXX Series3-Terminal Positive Voltage RegulatorsGeneral DescriptionThe LM341and LM78MXX series of three-terminal positive voltage regulators employ built-in current limiting,thermal shutdown,and safe-operating area protection which makes them virtually immune to damage from output overloads.With adequate heatsinking,they can deliver in excess of 0.5A output current.Typical applications would include local (on-card)regulators which can eliminate the noise and de-graded performance associated with single-point regulation.Featuresn Output current in excess of 0.5A n No external componentsn Internal thermal overload protection n Internal short circuit current-limitingn Output transistor safe-area compensationnAvailable in TO-220,TO-39,and TO-252D-PAK packagesn Output voltages of 5V,12V,and 15VConnection DiagramsTO-39Metal Can Package (H)DS010484-5Bottom ViewOrder Number LM78M05CH,LM78M12CH or LM78M15CHSee NS Package Number H03ATO-220Power Package (T)DS010484-6Top ViewOrder Number LM341T-5.0,LM341T-12,LM341T-15,LM78M05CT,LM78M12CT or LM78M15CTSee NS Package Number T03BTO-252DS010484-19Top ViewOrder Number LM78M05CDT See NS Package Number TD03BJuly 1999LM341/LM78MXX Series 3-Terminal Positive Voltage Regulators1999National Semiconductor Corporation /doc/96ef4d46852458fb770b5641.htmlAbsolute Maximum Ratings(Note1)If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications.Lead Temperature(Soldering,10seconds)TO-39Package(H)300?C TO-220Package(T)260?C Storage Temperature Range?65?C to+150?C Operating Junction TemperatureRange?40?C to+125?C Power Dissipation(Note2)Internally Limited Input Voltage5V≤V O≤15V35V ESD Susceptibility TBDElectrical CharacteristicsLimits in standard typeface are for T J=25?C,and limits in boldface type apply over the?40?C to+125?C operating temperature range.Limits are guaranteed by production testing or correlation techniques using standard Statistical Quality Control(SQC) methods.LM341-5.0,LM78M05CUnless otherwise specified:V IN=10V,C IN=0.33µF,C O=0.1µFSymbol Parameter Conditions Min Typ Max Units V O Output Voltage I L=500mA 4.8 5.0 5.2V5mA≤I L≤500mA 4.75 5.0 5.25P D≤7.5W,7.5V≤V IN≤20VV R LINE Line Regulation7.2V≤V IN≤25V I L=100mA50mVI L=500mA100V R LOAD Load Regulation5mA≤I L≤500mA100I Q Quiescent Current I L=500mA410.0mA ?I Q Quiescent Current Change5mA≤I L≤500mA0.57.5V≤V IN≤25V,I L=500mA 1.0V n Output Noise Voltage f=10Hz to100kHz40µVElectrical CharacteristicsLimits in standard typeface are for T J=25?C,and limits in boldface type apply over the?40?C to+125?C operating temperature range.Limits are guaranteed by production testing or correlation techniques using standard Statistical Quality Control(SQC) methods.(Continued)LM341-12,LM78M12CUnless otherwise specified:V IN=19V,C IN=0.33µF,C O=0.1µFSymbol Parameter Conditions Min Typ Max UnitsV O Output Voltage I L=500mA11.51212.5V5mA≤I L≤500mA11.41212.6P D≤7.5W,14.8V≤V IN≤27VV R LINE Line Regulation14.5V≤V IN≤30V I L=100mA120mVI L=500mA240V R LOAD Load Regulation5mA≤I L≤500mA240I Q Quiescent Current I L=500mA410.0mAI Q Quiescent Current Change5mA≤I L≤500mA0.514.8V≤V IN≤30V,I L=500mA 1.0V n Output Noise Voltage f=10Hz to100kHz75µVRipple Rejection f=120Hz,I L=500mA69dBV IN Input Voltage Required I L=500mA17.6V to Maintain Line RegulationV O Long Term Stability I L=500mA60mV/khrs Note1:Absolute maximum ratings indicate limits beyond which damage to the component may occur.Electrical specifications do not apply when operating the de-vice outside of its rated operating conditions.Note2:The typical thermal resistance of the three package types is:T(TO-220)package:θ(JA)=60?C/W,θ(JC)=5?C/WH(TO-39)package:θ(JA)=120?C/W,θ(JC)=18?C/WDT(TO-252)package:θ(JA)=92?C/W,θ(JC)=10?C/W3/doc/96ef4d46852458fb770b5641.htmlSchematic DiagramDS010484-1 /doc/96ef4d46852458fb770b5641.html 4 Typical Performance CharacteristicsPeak Output CurrentDS010484-10Ripple RejectionDS010484-11Ripple RejectionDS010484-12Dropout VoltageDS010484-13Output Voltage(Normalizedto1V at T J=25?C)DS010484-14Quiescent CurrentDS010484-15/doc/96ef4d46852458fb770b5641.html 5Typical Performance Characteristics(Continued)Design ConsiderationsThe LM78MXX/LM341XX fixed voltage regulator series has built-in thermal overload protection which prevents the de-vice from being damaged due to excessive junction tem-perature.The regulators also contain internal short-circuit protection which limits the maximum output current,and safe-area pro-tection for the pass transistor which reduces the short-circuit current as the voltage across the pass transistor is in-creased.Although the internal power dissipation is automatically lim-ited,the maximum junction temperature of the device must be kept below +125?C in order to meet data sheet specifica-tions.An adequate heatsink should be provided to assure this limit is not exceeded under worst-case operating condi-tions (maximum input voltage and load current)if reliable performance is to be obtained).1.0Heatsink ConsiderationsWhen an integrated circuit operates with appreciable cur-rent,its junction temperature is elevated.It is important to quantify its thermal limits in order to achieve acceptable per-formance and reliability.This limit is determined by summing the individual parts consisting of a series of temperature rises from the semiconductor junction to the operating envi-ronment.A one-dimension steady-state model of conduction heat transfer is demonstrated in The heat generated at thedevice junction flows through the die to the die attach pad,through the lead frame to the surrounding case material,to the printed circuit board,and eventually to the ambient envi-ronment.Below is a list of variables that may affect the ther-mal resistance and in turn the need for a heatsink.R θJC (Component Variables)R θCA (Application Variables)Leadframe Size &Material Mounting Pad Size,Material,&LocationNo.of Conduction Pins Placement of Mounting Pad Die SizePCB Size &Material Die Attach MaterialTraces Length &WidthMolding Compound Size and MaterialAdjacent Heat Sources Volume of Air Air FlowAmbient Temperature Shape of Mounting PadQuiescent CurrentDS010484-16Output ImpedanceDS010484-17Line Transient Response DS010484-7Load Transient ResponseDS010484-8/doc/96ef4d46852458fb770b5641.html6Design Considerations(Continued)The LM78MXX/LM341XX regulators have internal thermal shutdown to protect the device from over-heating.Under all possible operating conditions,the junction temperature of the LM78MXX/LM341XX must be within the range of 0?C to 125?C.A heatsink may be required depending on the maxi-mum power dissipation and maximum ambient temperature of the application.To determine if a heatsink is needed,the power dissipated by the regulator,P D ,must be calculated:I IN =I L +I GP D =(V IN ?V OUT )I L +V IN I Gshows the voltages and currents which are present in the circuit.The next parameter which must be calculated is the maxi-mum allowable temperature rise,T R (max):θJA =TR (max)/P D If the maximum allowable value for θJA ?C/w is found to be ≥60?C/W for TO-220package or ≥92?C/W for TO-252pack-age,no heatsink is needed since the package alone will dis-sipate enough heat to satisfy these requirements.If the cal-culated value for θJA fall below these limits,a heatsink is required.As a design aid,Table 1shows the value of the θJA of TO-252for different heatsink area.The copper patterns that we used to measure these θJA are shown at the end of the Application Note Section.reflects the same test results as what are in the Table 1shows the maximum allowable power dissipation vs.ambi-ent temperature for theTO-252device.shows the maximum allowable power dissipation vs.copper area (in 2)for the TO-252device.Please see AN1028for power enhancement techniques to be used with TO-252package.TABLE 1.θJA Different Heatsink AreaLayoutCopper AreaThermal Resistance Top Sice (in 2)*Bottom Side (in 2)(θJA ,?C/W)TO-25210.0123010320.06608730.306040.5305450.7605261047700.284800.470900.6631000.857110157120.0660.06689130.1750.17572140.2840.28461150.3920.39255160.50.553*Tab of device attached to topside copperDS010484-23FIGURE 1.Cross-sectional view of Integrated Circuit Mounted on a printed circuit board.Note that the case temperature is measured at the point where the leadscontact with the mounting pad surface DS010484-24FIGURE 2.Power Dissipation Diagram/doc/96ef4d46852458fb770b5641.html 7Design Considerations(Continued)Typical ApplicationDS010484-20FIGURE 3.θJA vs.2oz Copper Area for TO-252DS010484-22FIGURE 4.Maximum Allowable Power Dissipation vs.Ambient Temperature for TO-252DS010484-21FIGURE 5.Maximum Allowable Power Dissipation vs.2oz.Copper Area for TO-252DS010484-9*Required if regulator input is more than 4inches from input filter capacitor (or if no input filter capacitor is used).**Optional for improved transient response./doc/96ef4d46852458fb770b5641.html 8 Physical Dimensions inches(millimeters)unless otherwise notedTO-39Metal Can Package(H)Order Number LM78M05CH,LM78M12CH or LM78M15CHNS Package Number H03A9/doc/96ef4d46852458fb770b5641.htmlPhysical Dimensions inches(millimeters)unless otherwise noted(Continued)TO-220Power Package(T)Order Number LM341T-5.0,LM341T-12,LM341T-15,LM78M05CT,LM78M12CT or LM78M15CT NS Package Number T03B/doc/96ef4d46852458fb770b5641.html 10Physical Dimensionsinches (millimeters)unless otherwise noted (Continued)LIFE SUPPORT POLICYNATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR CORPORATION.As used herein:1.Life support devices or systems are devices or systems which,(a)are intended for surgical implant into the body,or (b)support or sustain life,and whose failure to perform when properly used in accordance with instructions for use provided in the labeling,can be reasonably expected to result in a significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system,or to affect its safety or effectiveness.National Semiconductor Corporation AmericasTel:1-800-272-9959Fax:1-800-737-7018Email:support@/doc/96ef4d46852458fb770b5641.htmlNational Semiconductor EuropeFax:+49(0)180-5308586Email:europe.support@/doc/96ef4d46852458fb770b5641.htmlDeutsch Tel:+49(0)180-5308585English Tel:+49(0)180-5327832Fran?ais Tel:+49(0)180-5329358Italiano Tel:+49(0)180-5341680National Semiconductor Asia Pacific Customer Response Group Tel:65-2544466Fax:65-2504466Email:sea.support@/doc/96ef4d46852458fb770b5641.htmlNational Semiconductor Japan Ltd.Tel:81-3-5639-7560Fax:81-3-5639-7507/doc/96ef4d46852458fb770b5641.htmlTO-252Order Number LM78M05CDT NS Package Number TD03BLM341/LM78MXX Series 3-Terminal Positive Voltage RegulatorsNational does not assume any responsibility for use of any circuitry described,no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry andspecifications.。

AT91SAM7X512-CU资料

Features•Incorporates the ARM7TDMI ® ARM ® Thumb ® Processor–High-performance 32-bit RISC Architecture –High-density 16-bit Instruction Set – Leader in MIPS/Watt–EmbeddedICE ™ In-circuit Emulation, Debug Communication Channel Support •Internal High-speed Flash–512 Kbytes (AT91SAM7X512) Organized in Two Banks of 1024 Pages of 256 Bytes (Dual Plane)–256 Kbytes (AT91SAM7X256) Organized in 1024 Pages of 256 Bytes (Single Plane)–128 Kbytes (AT91SAM7X128) Organized in 512 Pages of 256 Bytes (Single Plane)– Single Cycle Access at Up to 30 MHz in Worst Case Conditions– Prefetch Buffer Optimizing Thumb Instruction Execution at Maximum Speed – Page Programming Time: 6 ms, Including Page Auto-erase,Full Erase Time: 15 ms– 10,000 Write Cycles, 10-year Data Retention Capability,Sector Lock Capabilities, Flash Security Bit– Fast Flash Programming Interface for High Volume Production •Internal High-speed SRAM, Single-cycle Access at Maximum Speed –128 Kbytes (AT91SAM7X512)–64 Kbytes (AT91SAM7X256)–32 Kbytes (AT91SAM7X128)•Memory Controller (MC)–Embedded Flash Controller, Abort Status and Misalignment Detection •Reset Controller (RSTC)–Based on Power-on Reset Cells and Low-power Factory-calibrated Brownout Detector–Provides External Reset Signal Shaping and Reset Source Status •Clock Generator (CKGR)–Low-power RC Oscillator, 3 to 20 MHz On-chip Oscillator and one PLL •Power Management Controller (PMC)–Power Optimization Capabilities, Including Slow Clock Mode (Down to 500 Hz) and Idle Mode–Four Programmable External Clock Signals •Advanced Interrupt Controller (AIC)–Individually Maskable, Eight-level Priority, Vectored Interrupt Sources–Two External Interrupt Sources and One Fast Interrupt Source, Spurious Interrupt Protected•Debug Unit (DBGU)–2-wire UART and Support for Debug Communication Channel interrupt, Programmable ICE Access Prevention •Periodic Interval Timer (PIT)–20-bit Programmable Counter plus 12-bit Interval Counter •Windowed Watchdog (WDT)–12-bit key-protected Programmable Counter–Provides Reset or Interrupt Signals to the System–Counter May Be Stopped While the Processor is in Debug State or in Idle Mode •Real-time Timer (RTT)–32-bit Free-running Counter with Alarm –Runs Off the Internal RC Oscillator26120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary•Two Parallel Input/Output Controllers (PIO)–Sixty-two Programmable I/O Lines Multiplexed with up to Two Peripheral I/Os –Input Change Interrupt Capability on Each I/O Line–Individually Programmable Open-drain, Pull-up Resistor and Synchronous Output •Thirteen Peripheral DMA Controller (PDC) Channels•One USB 2.0 Full Speed (12 Mbits per second) Device Port–On-chip Transceiver, 1352-byte Configurable Integrated FIFOs •One Ethernet MAC 10/100 base-T–Media Independent Interface (MII) or Reduced Media Independent Interface (RMII)–Integrated 28-byte FIFOs and Dedicated DMA Channels for Transmit and Receive •One Part 2.0A and Part 2.0B Compliant CAN Controller–Eight Fully-programmable Message Object Mailboxes, 16-bit Time Stamp Counter •One Synchronous Serial Controller (SSC)–Independent Clock and Frame Sync Signals for Each Receiver and Transmitter –I²S Analog Interface Support, Time Division Multiplex Support–High-speed Continuous Data Stream Capabilities with 32-bit Data Transfer •Two Universal Synchronous/Asynchronous Receiver Transmitters (USART)–Individual Baud Rate Generator, IrDA ® Infrared Modulation/Demodulation–Support for ISO7816 T0/T1 Smart Card, Hardware Handshaking, RS485 Support –Full Modem Line Support on USART1•Two Master/Slave Serial Peripheral Interfaces (SPI)–8- to 16-bit Programmable Data Length, Four External Peripheral Chip Selects •One Three-channel 16-bit Timer/Counter (TC)–Three External Clock Inputs, Two Multi-purpose I/O Pins per Channel –Double PWM Generation, Capture/Waveform Mode, Up/Down Capability •One Four-channel 16-bit Power Width Modulation Controller (PWMC)•One Two-wire Interface (TWI)–Master Mode Support Only, All Two-wire Atmel EEPROMs Supported•One 8-channel 10-bit Analog-to-Digital Converter, Four Channels Multiplexed with Digital I/Os •SAM-BA ™ Boot Assistance –Default Boot program–Interface with SAM-BA Graphic User Interface •IEEE ® 1149.1 JTAG Boundary Scan on All Digital Pins•5V-tolerant I/Os, Including Four High-current Drive I/O lines, Up to 16 mA Each •Power Supplies–Embedded 1.8V Regulator, Drawing up to 100 mA for the Core and External Components –3.3V VDDIO I/O Lines Power Supply, Independent 3.3V VDDFLASH Flash Power Supply –1.8V VDDCORE Core Power Supply with Brownout Detector•Fully Static Operation: Up to 55 MHz at 1.65V and 85°C Worst Case Conditions •Available in 100-lead LQFP Green and 100-ball TFBGA Green Packages36120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary1.DescriptionAtmel's AT91SAM7X512/256/128 is a member of a series of highly integrated Flash microcon-trollers based on the 32-bit ARM RISC processor. It features 512/256/128 Kbyte high-speed Flash and 128/64/32 Kbyte SRAM, a large set of peripherals, including an 802.3 Ethernet MAC and a CAN controller. A complete set of system functions minimizes the number of external components.The embedded Flash memory can be programmed in-system via the JTAG-ICE interface or via a parallel interface on a production programmer prior to mounting. Built-in lock bits and a secu-rity bit protect the firmware from accidental overwrite and preserve its confidentiality.The AT91SAM7X512/256/128 system controller includes a reset controller capable of managing the power-on sequence of the microcontroller and the complete system. Correct device opera-tion can be monitored by a built-in brownout detector and a watchdog running off an integrated RC oscillator.By combining the ARM7TDMI processor with on-chip Flash and SRAM, and a wide range of peripheral functions, including USART, SPI, CAN Controller, Ethernet MAC, Timer Counter, RTT and Analog-to-Digital Converters on a monolithic chip, the AT91SAM7X512/256/128 is a power-ful device that provides a flexible, cost-effective solution to many embedded control applications requiring communication over, for example, Ethernet, CAN wired and Zigbee ™ wireless networks.1.1Configuration Summary of the AT91SAM7X512/256/128The AT91SAM7X512, AT91SAM7X256 and AT91SAM7X128 differ only in memory sizes. Table 1-1 summarizes the configurations of the three devices.Table 1-1.Configuration SummaryDeviceFlash FlashOrganization SRAM A T91SAM7X512512 Kbytes dual plane 128 Kbytes A T91SAM7X256256 Kbytes single plane 64 Kbytes A T91SAM7X128128 Kbytessingle plane32 Kbytes46120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary2.AT91SAM7X512/256/128 Block DiagramFigure 2-1.AT91SAM7X512/256/128 Block Diagram56120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary3.Signal DescriptionTable 3-1.Signal Description ListSignal NameFunctionTypeActive LevelCommentsPowerVDDIN Voltage Regulator and ADC Power Supply InputPower 3V to 3.6V VDDOUT Voltage Regulator Output Power 1.85V VDDFLASH Flash and USB Power Supply Power 3V to 3.6V VDDIO I/O Lines Power Supply Power 3V to 3.6V VDDCORE Core Power Supply Power 1.65V to 1.95V VDDPLL PLL Power 1.65V to 1.95VGND GroundGroundClocks, Oscillators and PLLsXIN Main Oscillator Input Input XOUT Main Oscillator Output Output PLLRC PLL FilterInput PCK0 - PCK3Programmable Clock Output OutputICE and JTAGTCK Test Clock Input No pull-up resistor TDI Test Data In Input No pull-up resistor.TDO Test Data Out Output TMS Test Mode Select Input No pull-up resistor.JT AGSELJTAG SelectionInputPull-down resistor.Flash MemoryERASEFlash and NVM Configuration Bits Erase CommandInputHighPull-down resistor Reset/TestNRST Microcontroller Reset I/O Low Pull-up resistor, Open Drain OutputTST Test Mode SelectInput HighPull-down resistorDebug UnitDRXD Debug Receive Data Input DTXD Debug Transmit DataOutput AICIRQ0 - IRQ1External Interrupt Inputs Input FIQ Fast Interrupt InputInput PIOP A0 - P A30Parallel IO Controller A I/O Pulled-up input at reset PB0 - PB30Parallel IO Controller BI/OPulled-up input at reset66120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary SummaryUSB Device PortDDM USB Device Port Data - Analog DDP USB Device Port Data +AnalogUSARTSCK0 - SCK1Serial Clock I/O TXD0 - TXD1Transmit Data I/O RXD0 - RXD1 Receive Data Input RTS0 - RTS1Request T o Send Output CTS0 - CTS1Clear T o Send Input DCD1Data Carrier Detect Input DTR1Data Terminal Ready Output DSR1Data Set Ready Input RI1Ring Indicator InputSynchronous Serial ControllerTD Transmit Data Output RD Receive Data Input TK Transmit Clock I/O RK Receive Clock I/O TF Transmit Frame Sync I/O RFReceive Frame SyncI/O Timer/CounterTCLK0 - TCLK2External Clock Inputs Input TIOA0 - TIOA2I/O Line A I/O TIOB0 - TIOB2I/O Line B I/OPWM ControllerPWM0 - PWM3PWM Channels OutputSerial Peripheral Interface - SPIxSPIx_MISO Master In Slave Out I/O SPIx_MOSI Master Out Slave In I/O SPIx_SPCK SPI Serial ClockI/O SPIx_NPCS0SPI Peripheral Chip Select 0I/O Low SPIx_NPCS1-NPCS3SPI Peripheral Chip Select 1 to 3Output LowTwo-wire InterfaceTWD Two-wire Serial Data I/O TWCKTwo-wire Serial ClockI/OTable 3-1.Signal Description List (Continued)Signal Name FunctionTypeActive LevelComments76120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary SummaryAnalog-to-Digital ConverterAD0-AD3Analog Inputs Analog Digital pulled-up inputs at reset AD4-AD7Analog Inputs Analog Analog InputsADTRG ADC Trigger Input ADVREFADC Reference AnalogFast Flash Programming InterfacePGMEN0-PGMEN1Programming Enabling Input PGMM0-PGMM3Programming Mode Input PGMD0-PGMD15Programming Data I/O PGMRDY Programming Ready Output High PGMNVALID Data Direction Output Low PGMNOE Programming Read Input LowPGMCK Programming Clock Input PGMNCMD Programming Command InputLow CAN ControllerCANRX CAN Input Input CANTX CAN Output OutputEthernet MAC 10/100EREFCK Reference Clock Input RMII only ETXCK Transmit Clock Input MII only ERXCK Receive Clock Input MII onlyETXEN Transmit Enable Output ETX0 - ETX3Transmit Data Output ETX0 - ETX1 only in RMII ETXER Transmit Coding Error Output MII only ERXDV Receive Data ValidInput MII only ECRSDV Carrier Sense and Data Valid Input RMII onlyERX0 - ERX3Receive Data Input ERX0 - ERX1 only in RMII ERXER Receive Error Input ECRS Carrier Sense Input MII only ECOL Collision Detected Input MII onlyEMDC Management Data Clock Output EMDIO Management Data Input/Output I/O EF100Force 100 Mbits/sec.OutputHighRMII only Table 3-1.Signal Description List (Continued)Signal Name Function TypeActive LevelComments86120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary4.PackageThe AT91SAM7X512/256/128 is available in 100-lead LQFP Green and 100-ball TFBGA RoHS-compliant packages.4.1100-lead LQFP Package OutlineFigure 4-1 shows the orientation of the 100-lead LQFP package. A detailed mechanical descrip-tion is given in the Mechanical Characteristics section.Figure 4-1.100-lead LQFP Package Outline (Top View)96120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary4.2100-lead LQFP PinoutTable 4-1.Pinout in 100-lead LQFP Package1ADVREF 26P A18/PGMD651TDI 76TDO 2GND 27PB952GND 77JTAGSEL 3AD428PB853PB1678TMS 4AD529PB1454PB479TCK 5AD630PB1355P A23/PGMD1180P A306AD731PB656P A24/PGMD1281P A0/PGMEN07VDDOUT 32GND 57NRST 82P A1/PGMEN18VDDIN 33VDDIO 58TST83GND 9PB27/AD034PB559P A25/PGMD1384VDDIO 10PB28/AD135PB1560P A26/PGMD1485P A311PB29/AD236PB1761VDDIO 86P A212PB30/AD337VDDCORE62VDDCORE 87VDDCORE 13P A8/PGMM038PB763PB1888P A4/PGMNCMD 14P A9/PGMM139PB1264PB1989P A5/PGMRDY 15VDDCORE 40PB065PB2090P A6/PGMNOE 16GND 41PB166PB2191P A7/PGMNVALID17VDDIO 42PB267PB2292ERASE 18P A10/PGMM243PB368GND 93DDM 19P A11/PGMM344PB1069PB2394DDP 20P A12/PGMD045PB1170PB2495VDDFLASH21P A13/PGMD146P A19/PGMD771PB2596GND 22P A14/PGMD247P A20/PGMD872PB2697XIN/PGMCK 23P A15/PGMD348VDDIO 73P A27/PGMD1598XOUT 24P A16/PGMD449P A21/PGMD974P A2899PLLRC 25P A17/PGMD550P A22/PGMD1075P A29100VDDPLL106120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary4.3100-ball TFBGA Package OutlineFigure 4-2 shows the orientation of the 100-ball TFBGA package. A detailed mechanical description is given in the Mechanical Characteristics section of the full datasheet.Figure 4-2.100-ball TFBGA Package Outline (Top View)4.4100-ball TFBGA PinoutPinout in 100-ball TFBGA PackagePinSignal NamePinSignal NamePinSignal NamePinSignal NameA1P A22/PGMD10C6PB17F1PB21H6P A7/PGMNVALID A2P A21/PGMD9C7PB13F2PB23H7P A9/PGMM1A3P A20/PGMD8C8P A13/PGMD1F3PB25H8P A8/PGMM0A4PB1C9P A12/PGMD0F4PB26H9PB29/AD2A5PB7C10P A15/PGMD3F5TCKH10PLLRC A6PB5D1P A23/PGMD11F6P A6/PGMNOEJ1P A29A7PB8D2P A24/PGMD12F7ERASE J2P A30A8PB9D3NRST F8VDDCORE J3P A0/PGMEN0A9P A18/PGMD6D4TST F9GND J4P A1/PGMEN1A10VDDIO D5PB19F10VDDIN J5VDDFLASHB1TDID6PB6G1PB22J6GND B2P A19/PGMD7D7P A10/PGMM2G2PB24J7XIN/PGMCK B3PB11D8VDDIO G3P A27/PGMD15J8XOUT B4PB2D9PB27/AD0G4TDO J9GND B5PB12D10P A11/PGMM3G5P A2J10VDDPLL B6PB15E1P A25/PGMD13G6P A5/PGMRDY K1VDDCORE B7PB14E2P A26/PGMD14G7VDDCORE K2VDDCORE B8P A14/PGMD2E3PB18G8GND K3DDP B9P A16/PGMD4E4PB20G9PB30/AD3K4DDM B10P A17/PGMD5E5TMS G10VDDOUT K5GND C1PB16E6GND H1VDDCORE K6AD7C2PB4E7VDDIO H2P A28K7AD6C3PB10E8PB28/AD1H3JTAGSEL K8AD5C4PB3E9VDDIO H4P A3K9AD4C5PB0E10GNDH5P A4/PGMNCMDK10ADVREF116120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary5.Power Considerations5.1Power SuppliesThe AT91SAM7X512/256/128 has six types of power supply pins and integrates a voltage regu-lator, allowing the device to be supplied with only one voltage. The six power supply pin types are:•VDDIN pin. It powers the voltage regulator and the ADC; voltage ranges from 3.0V to 3.6V , 3.3V nominal. In order to decrease current consumption, if the voltage regulator and the ADC are not used, VDDIN, ADVREF , AD4, AD5, AD6 and AD7 should be connected to GND. In this case, VDDOUT should be left unconnected.•VDDOUT pin. It is the output of the 1.8V voltage regulator.•VDDIO pin. It powers the I/O lines; voltage ranges from 3.0V to 3.6V, 3.3V nominal.•VDDFLASH pin. It powers the USB transceivers and a part of the Flash and is required for the Flash to operate correctly; voltage ranges from 3.0V to 3.6V , 3.3V nominal.•VDDCORE pins. They power the logic of the device; voltage ranges from 1.65V to 1.95V, 1.8V typical. It can be connected to the VDDOUT pin with decoupling capacitor. VDDCORE is required for the device, including its embedded Flash, to operate correctly.•VDDPLL pin. It powers the oscillator and the PLL. It can be connected directly to the VDDOUT pin.No separate ground pins are provided for the different power supplies. Only GND pins are pro-vided and should be connected as shortly as possible to the system ground plane.5.2Power ConsumptionThe AT91SAM7X512/256/128 has a static current of less than 60 µA on VDDCORE at 25°C,including the RC oscillator, the voltage regulator and the power-on reset when the brownout detector is deactivated. Activating the brownout detector adds 28 µA static current.The dynamic power consumption on VDDCORE is less than 90 mA at full speed when running out of the Flash. Under the same conditions, the power consumption on VDDFLASH does not exceed 10 mA.5.3Voltage RegulatorThe AT91SAM7X512/256/128 embeds a voltage regulator that is managed by the System Controller.In Normal Mode, the voltage regulator consumes less than 100 µA static current and draws 100mA of output current.The voltage regulator also has a Low-power Mode. In this mode, it consumes less than 25 µA static current and draws 1 mA of output current.Adequate output supply decoupling is mandatory for VDDOUT to reduce ripple and avoid oscil-lations. The best way to achieve this is to use two capacitors in parallel: one external 470 pF (or 1 nF) NPO capacitor should be connected between VDDOUT and GND as close to the chip as possible. One external 2.2 µF (or 3.3 µF) X7R capacitor should be connected between VDDOUT and GND.126120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary SummaryAdequate input supply decoupling is mandatory for VDDIN in order to improve startup stability and reduce source voltage drop. The input decoupling capacitor should be placed close to the chip. For example, two capacitors can be used in parallel: 100 nF NPO and 4.7 µF X7R.5.4Typical Powering SchematicsThe AT91SAM7X512/256/128 supports a 3.3V single supply mode. The internal regulator input connected to the 3.3V source and its output feeds VDDCORE and the VDDPLL. Figure 5-1shows the power schematics to be used for USB bus-powered systems.Figure 5-1.3.3V System Single Power Supply Schematic136120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary6.I/O Lines Considerations6.1JTAG Port PinsTMS, TDI and TCK are schmitt trigger inputs and are not 5-V tolerant. TMS, TDI and TCK do not integrate a pull-up resistor.TDO is an output, driven at up to VDDIO, and has no pull-up resistor.The JTAGSEL pin is used to select the JTAG boundary scan when asserted at a high level. The JTAGSEL pin integrates a permanent pull-down resistor of about 15 k Ω to GND, so that it can be left unconnected for normal operations.6.2Test PinThe TST pin is used for manufacturing test or fast programming mode of the AT91SAM7X512/256/128 when asserted high. The TST pin integrates a permanent pull-down resistor of about 15 k Ω to GND, so that it can be left unconnected for normal operations. To enter fast programming mode, the TST pin and the PA0 and PA1 pins should be tied high and PA2 tied to low.Driving the TST pin at a high level while PA0 or PA1 is driven at 0 leads to unpredictable results.6.3Reset PinThe NRST pin is bidirectional with an open drain output buffer. It is handled by the on-chip reset controller and can be driven low to provide a reset signal to the external components or asserted low externally to reset the microcontroller. There is no constraint on the length of the reset pulse,and the reset controller can guarantee a minimum pulse length. This allows connection of a sim-ple push-button on the NRST pin as system user reset, and the use of the signal NRST to reset all the components of the system.The NRST pin integrates a permanent pull-up resistor to VDDIO .6.4ERASE PinThe ERASE pin is used to re-initialize the Flash content and some of its NVM bits. It integrates a permanent pull-down resistor of about 15 k Ω to GND, so that it can be left unconnected for nor-mal operations.This pin is debounced by the RC oscillator to improve the glitch tolerance. When the pin is tied to high during less than 100 ms, ERASE pin is not taken into account. The pin must be tied high during more than 220 ms to perform the re-initialization of the Flash.6.5PIO Controller LinesAll the I/O lines, PA0 to PA30 and PB0 to PB30, are 5V-tolerant and all integrate a programma-ble pull-up resistor. Programming of this pull-up resistor is performed independently for each I/O line through the PIO controllers.5V-tolerant means that the I/O lines can drive voltage level according to VDDIO, but can be driven with a voltage of up to 5.5V. However, driving an I/O line with a voltage over VDDIO while the programmable pull-up resistor is enabled will create a current path through the pull-up resis-146120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summarytor from the I/O line to VDDIO. Care should be taken, in particular at reset, as all the I/O lines default to input with pull-up resistor enabled at reset.6.6I/O Lines Current DrawingThe PIO lines PA0 to PA3 are high-drive current capable. Each of these I/O lines can drive up to 16 mA permanently.The remaining I/O lines can draw only 8 mA.However, the total current drawn by all the I/O lines cannot exceed 200 mA.156120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary7.Processor and Architecture7.1ARM7TDMI Processor•RISC processor based on ARMv4T Von Neumann architecture–Runs at up to 55 MHz, providing 0.9 MIPS/MHz •Two instruction sets–ARM high-performance 32-bit instruction set –Thumb high code density 16-bit instruction set •Three-stage pipeline architecture–Instruction Fetch (F)–Instruction Decode (D)–Execute (E)7.2Debug and Test Features•Integrated embedded in-circuit emulator–Two watchpoint units–Test access port accessible through a JTAG protocol –Debug communication channel •Debug Unit–Two-pinUART–Debug communication channel interrupt handling –Chip ID Register•IEEE1149.1 JT AG Boundary-scan on all digital pins7.3Memory Controller•Programmable Bus Arbiter–Handles requests from the ARM7TDMI, the Ethernet MAC and the Peripheral DMA Controller•Address decoder provides selection signals for–Three internal 1 Mbyte memory areas –One 256 Mbyte embedded peripheral area •Abort Status Registers–Source, Type and all parameters of the access leading to an abort are saved –Facilitates debug by detection of bad pointers •Misalignment Detector–Alignment checking of all data accesses –Abort generation in case of misalignment •Remap Command–Remaps the SRAM in place of the embedded non-volatile memory –Allows handling of dynamic exception vectors166120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary•Embedded Flash Controller–Embedded Flash interface, up to three programmable wait states–Prefetch buffer, buffering and anticipating the 16-bit requests, reducing the required wait states–Key-protected program, erase and lock/unlock sequencer –Single command for erasing, programming and locking operations –Interrupt generation in case of forbidden operation7.4Peripheral DMA Controller•Handles data transfer between peripherals and memories •Thirteen channels–Two for each USART –Two for the Debug Unit–Two for the Serial Synchronous Controller –Two for each Serial Peripheral Interface –One for the Analog-to-digital Converter •Low bus arbitration overhead–One Master Clock cycle needed for a transfer from memory to peripheral –Two Master Clock cycles needed for a transfer from peripheral to memory •Next Pointer management for reducing interrupt latency requirements176120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary8.Memories8.1AT91SAM7X512•512 Kbytes of dual-plane Flash Memory–2 contiguous banks of 1024 pages of 256 bytes–Fast access time, 30 MHz single-cycle access in Worst Case conditions –Page programming time: 6 ms, including page auto-erase –Page programming without auto-erase: 3 ms –Full chip erase time: 15 ms–10,000 write cycles, 10-year data retention capability –32 lock bits, protecting 32 sectors of 64 pages –Protection Mode to secure contents of the Flash •128 Kbytes of Fast SRAM–Single-cycle access at full speed8.2AT91SAM7X256•256 Kbytes of Flash Memory–1024 pages of 256 bytes–Fast access time, 30 MHz single-cycle access in Worst Case conditions –Page programming time: 6 ms, including page auto-erase –Page programming without auto-erase: 3 ms –Full chip erase time: 15 ms–10,000 write cycles, 10-year data retention capability –16 lock bits, each protecting 16 sectors of 64 pages –Protection Mode to secure contents of the Flash •64 Kbytes of Fast SRAM–Single-cycle access at full speed8.3AT91SAM7X128•128 Kbytes of Flash Memory–512 pages of 256 bytes–Fast access time, 30 MHz single-cycle access in Worst Case conditions –Page programming time: 6 ms, including page auto-erase –Page programming without auto-erase: 3 ms –Full chip erase time: 15 ms–10,000 write cycles, 10-year data retention capability –8 lock bits, each protecting 8 sectors of 64 pages –Protection Mode to secure contents of the Flash •32 Kbytes of Fast SRAM–Single-cycle access at full speed186120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary SummaryFigure 8-1.AT91SAM7X512/256/128 Memory Mapping196120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary Summary8.4Memory Mapping8.4.1Internal SRAM•The AT91SAM7X512 embeds a high-speed 128 Kbyte SRAM bank.•The AT91SAM7X256 embeds a high-speed 64 Kbyte SRAM bank.•The AT91SAM7X128 embeds a high-speed 32 Kbyte SRAM bank.After reset and until the Remap Command is performed, the SRAM is only accessible at address 0x0020 0000. After Remap, the SRAM also becomes available at address 0x0.8.4.2Internal ROMThe AT91SAM7X512/256/128 embeds an Internal ROM. At any time, the ROM is mapped at address 0x30 0000. The ROM contains the FFPI and the SAM-BA program.8.4.3Internal Flash•The AT91SAM7X512 features two banks (dual plane) of 256 Kbytes of Flash.•The AT91SAM7X256 features one bank (single plane) of 256 Kbytes of Flash. •The AT91SAM7X128 features one bank (single plane) of 128 Kbytes of Flash.At any time, the Flash is mapped to address 0x0010 0000. It is also accessible at address 0x0after the reset, if GPNVM bit 2 is cleared and before the Remap Command.A general purpose NVM (GPNVM) bit is used to boot either on the ROM (default) or from the Flash.This GPNVM bit can be cleared or set respectively through the commands “Clear General-pur-pose NVM Bit” and “Set General-purpose NVM Bit” of the EFC User Interface.Setting the GPNVM Bit 2 selects the boot from the Flash. Asserting ERASE clears the GPNVM Bit 2 and thus selects the boot from the ROM by default.Figure 8-2.Internal Memory Mapping with GPNVM Bit 2 = 0 (default)206120DS–ATARM–03-Oct-06AT91SAM7X512/256/128 Preliminary SummaryFigure 8-3.Internal Memory Mapping with GPNVM Bit 2 = 18.5Embedded Flash8.5.1Flash Overview•The Flash of the AT91SAM7X512 is organized in two banks (dual plane) of 1024 pages of 256 bytes. The 524,288 bytes are organized in 32-bit words.•The Flash of the AT91SAM7X256 is organized in 1024 pages of 256 bytes (single plane). It reads as 65,536 32-bit words.•The Flash of the AT91SAM7X128 is organized in 512 pages of 256 bytes (single plane). It reads as 32,768 32-bit words.The Flash contains a 256-byte write buffer, accessible through a 32-bit interface.The Flash benefits from the integration of a power reset cell and from the brownout detector.This prevents code corruption during power supply changes, even in the worst conditions.When Flash is not used (read or write access), it is automatically placed into standby mode.8.5.2Embedded Flash ControllerThe Embedded Flash Controller (EFC) manages accesses performed by the masters of the sys-tem. It enables reading the Flash and writing the write buffer. It also contains a User Interface,mapped within the Memory Controller on the APB. The User Interface allows:•programming of the access parameters of the Flash (number of wait states, timings, etc.)•starting commands such as full erase, page erase, page program, NVM bit set, NVM bit clear, etc.•getting the end status of the last command •getting error status•programming interrupts on the end of the last commands or on errorsThe Embedded Flash Controller also provides a dual 32-bit Prefetch Buffer that optimizes 16-bit access to the Flash. This is particularly efficient when the processor is running in Thumb mode.Two EFCs are embedded in the AT91SAM7X512 to control each bank of 256 KBytes. Dual-plane organization allows concurrent read and program functionality. Read from one memory。

MIK9-37PL1中文资料

MICRO-K microminiature circular connectors are rugged yet lightweight - and meet or exceed the applicable requirements of MIL-DTL-83513. Applications include biomedical,instrumentation and miniature black boxes.MIK:Accommodate up to 55 contacts on .050(1.27) centers (equivalent to 420 contacts per square inch). Five keyway polarization prevents cross plugging. The threaded coupling nuts provide strong, reliable coupling. MIK recepta-cles can be either front or back panel mounted;in back mounting applications, panel thickness of up to 3/32" can be used on the larger sizes.Maximum temperature range - 55˚C to + 125˚C.Standard MIK connectors are available in two shell sizes accommodating two contact arrangements pre-wired to your specific requirements.MIKM:Similar to our MIK, except has a steel shell and receptacle for improved ruggedness and RFI resistance. It accommodates up to 85twist pin contacts. Maximum temperature range - 55˚C to + 125˚ C.MIKQ:A quick disconnect metal shell and receptacle version that can be instantaneously disconnected yet provides a solid lock when engaged. Applications include commercial TV cameras, portableradios, military gun sights, airborne landing systems and medical equipment. Maximum temperature range - 55˚C to +125˚C.SpecificationsSTANDARD MATERIAL AND FINISHESELECTRO/MECHANICAL FEATURES*For plug onlyElectrodeposited for receptacle.MIKThermoplastic Stainless Steel Passivated Glass-reinforced Thermoplastic 50Microinch Gold Plated Copper AlloyStainless Steel Stainless Steel Passivated Glass-reinforced Thermoplastic 50Microinch Gold Plated Copper AlloyBrass Brass, Electroless Nickel Plated*Glass-reinforced Thermoplastic 50Microinch Gold Plated Copper AlloyNo. of Contacts Wire SizeContact Termination Contact Rating Couping Polarization Contact Spacing Shell Styles 7,55#24 AWG thru #32 AWGCrimp 3Amps Threaded Keyways .050 (1.27)Centers0-Wall Mtg.6-Straight Plug7,55, 85#24 AWG thru #32 AWGCrimp 3Amps Threaded Keyways .050 (1.27)Centers 0-Wall Mtg.6-Straight Plug7,19, 37#24 AWG thru #32 AWGCrimp 3Amps Push/Pull Keyways .050 (1.27)Centers 7-Jam Nut 6-Straight Plug 9-Rear Panel Mtg. ReceptacleShellCoupling Nut Insulator ContactsMIKM MIKQ MIKMIKMMIKQ How to OrderSERIESMIK M 6-55P** ** * *SERIESMIK: Microminiature Circular7, 19, 37, 55, 85(H) 001 -18", 7/34 strand, #26 AWG,MIL-W-16878/4, Type E Teflon,yellow.18",7/34 strand, #26 AWG,MIL-W-16878/4, Type E Teflon,color coded to MIL-STD-681System I.1/2" uninsulated solid #25AWG gold plated copper.1" uninsulated solid #25 AWG gold plated copper.(H) 003 -(L)1-(L)2-G -Cable nut and grip (MIKQ plug only)N -Nut only (MIKQ plug only)NOTE: Contact types cannot be interchanged between shell styles.P -Pin S -SocketH -Insulated round hook-up wire L -Uninsulated round solid wireNo Letter - Screw couping, plastic shell M -Screw coupling, metal shell Q -Push/Pull, metal shell 0-Wall mounting receptacle (MIK and MIKM only)6-Straight plug (MIK, MIKM and MIKQ)7-Jam nut mount (MIKQ only)9-Rear panel mounted receptacle (MIKQ)CONNECTOR TYPESSHELL STYLESCONNECTOR TYPE SHELL STYLECONTACT ARRANGEMENT CONTACT ARRANGEMENTS CONTACT TYPE CONTACT TYPE TERMINATION TYPETERMINATION TYPESTERMINATION LENGTH CODE TERMINATION LENGTH CODE (STANDARDS)HARDWAREHARDWARERoHS COMPLIANCE RStandard Wire Termination CodesThe following termination codes are listed for your information. For additional codes please refer to Appendix on page 79 and 81. All wire lengths are minimum.HARNESS TYPES (H)#26 A WG per MIL-W-16878Type E,Teflon S tranded L ength020019026029028001038009010011013017042027016034025002003023004005006048046041 3(76.2)6(152.4)8(203.2)10(254.0)12(304.8)18(457.2)20(508.0)24(609.6)30(762.0)36(914.4)48(1219.2)72(1828.8)120(3048.0)-All Yell o w Co l o r Cod e dContact ArrangementsFace View, Pin Side-(Male Twist Pin Contacts)MIK/MIKM/MIKQ7Contacts394857473831535512MIKQ19 ContactsMIKQ37 ContactsMIK/MIKM55 ContactsMIKM85 ContactsCavity identification numbers are for reference only, they do not appear on connectors.Shell Dimensions.335 (8.51)Max.MIK (Rear Panel Mount Thickness - see Tabulation "T")Weight given is 1/2" uninsulated, solid #25 AWG gold plated copper pigtailsPlu g Rece p tacleS hell S i z e7onl yRece p tacleS hell S i z e55 onl yPlu gPlugPart Numberby Shell SizeMIK6-7PMIK6-55PAThreadDMax.LMax.Avg. Weightoz. (gm.) ±5%5/16-24UNF-2B9/16-24UNF-2A.375 (9.52).755 (19.18).315 (8.00).460 (11.68).054 (1.54).202 (5.72)Part Numberby Shell SizeMIK0-7SMIK0-55SAThreadD±.010 (0.25)FMax.H±.003 (0.08)K±.010 (0.25)LMax.R±.005 (0.13)SMax.TMax.Avg. Weightoz. (gm.) ± 5% 5/16-24UNF-2B9/16-24UNF-2A.325 (8.26).625 (15.88).315 (8.00).440 (11.18).078 (1.98).089 (2.26).062 (1.57).100 (2.54).355 (9.02).495 (12.57).460 (11.68).580 (14.73).630 (16.00).760 (19.30).032 (0.81).062 (1.57).022 (.635).134 (3.81) ReceptacleShell Dimensions (Continued)MIKM (Rear Panel Mount Thickness .335 (8.51) max. - see Tabulation "T")D ..335 (8M a D.PlugReceptacleShell Size 7 onlyReceptacle Receptacle Shell Size 55 & 85PlugPlugMIKM6-7P 5/16-24UNF-2A.375(9.52) .315 (8.00) .054 (1.54)MIKM6-55P 5/8-24UNEF-2B.775(19.18) .440 (11.18) .333 (9.44) MIKM6-85P 11/16-24UNEF-2B .860 (21.84).460 (11.68).419 (11.88)MIKM0-7S 5/16-24UNF-2A .325 (8.26).320 (8.13) .078 (1.98) .062 (1.57) .400 (10.16) .460 (11.68).630 (16.00) .032 (0.81) .051 (1.45) MIKM0-55S 5/8-24UNEF-2A .625 (15.88).440 (11.18) .091 (2.31) .062 (1.57) .490 (12.45) .580 (14.73) .760 (19.30) .125 (3.18) .269 (7.62)MIKM0-85S 11/16-24UNEF-2A .745 (18.92) .440 (11.18).091 (2.31).062 (1.57).490 (12.45) .674 (17.12) .845 (21.46) .125 (3.18) .346 (9.80)Part Numberby Shell SizePart Number by Shell SizeA ThreadD Max.L Max.Avg. Weightoz. (gm.)+_5%A ThreadDF Max.H +_.003 (0.08)K L Max.R +_.005 (0.13)SMax.T Max.Avg. Weight oz. (gm.)+_5%MIKQ6-7S .385(9.78) .305 (7.75) .180 (4.57) .214 (6.08)MIKQ6-19S .515(13.08) .405 (10.29) .260 (6.60) .376 (10.70)MIKQ6-37S.760 (19.30).635 (16.13).350 (8.89).714 (20.23)MIKQ6-7S .510(12.95) .245 (6.22) .359 (9.12) 3/8-32UNEF-2A .128 (3.63)MIKQ7-37P.855(21.71).520 (13.20).740 (18.80)3/4-20UNEF-2A.300 (8.52)MIKQ (Front Panel Mounting Type Shown-.093 (2.36) Thickness)C .043±.005 C DIM.ACROSS FLA TPlugPlugReceptacle Receptacle*Std. Conn. not supplied with Cable Nut & Grip, See Mod Codes. Lanyard Relase Is Available. Consult factory.Part Number by Shell Size A MAX.B MAX.C Ref.Avg. Weight oz. (gm.)±5%Part Number by Shell Size A MAX.B MAX.C MAX.D Thread Avg. Weightoz. (gm.)±5%Front Panel Mounting-MIKQ7MIKQ Front Panel MountingMIKQ7-7P .364(9.24) .390 (9.91)MIKQ7-19P .475(12.06) .515 (13.08)MIKQ7-37P .740(18.78) .755 (19.17)Shell SizeA ±.005 (0.13)BDIA.Shell Dimensions (Continued)MIKQ9-7P (Back Panel Mounting)MIKQ9-19P (Back Panel Mounting)MIKQ9-37P (Back Panel Mounting)MIKQ Rear Panel MountingReceptacleReceptacleReceptacleRear Panel Mounting-MIKQ9Shell SizeMIKQ9-7PMIKQ9-19PMIKQ9-37P.425 (10.76).535 (13.58).740 (18.78).485 (12.32)MAX..250 ± .010WIREEXTENSIONLENGTH.250 ± .010 (6.35 ± 0.25).485 (12.32) MAX..440 (11.18).564 (14.33).755 (19.17)A±.005 (0.13)BDia.。

Leica M9 Titan - Auszug aus Storybook

LEICA M9 TITAn: dEr dEsIgnProzEssLEICA M9 TITAnIuM: ThE dEsIgn ProCEss I LEICA M9 TITAnIuM:そのデザインプロセスWalter de’Silva ist autodesigner. Das macht ihn frei in der art und Weise der annäherung an die tradition der leica m.Er ergründet ihre Ergonomie und ihren charakter und erkundet die möglichkeiten, die dem Ensemble aus Funktion, Form und material innewohnen. Dann macht es klick. Die Gedanken ordnen sich, die vision wird konkret, und der Weg zu einer atemberaubenden Interpretration der leica m9 ist geebnet. Eine rekonstruktion der Stationen des kreativen Prozesses. Walter de’Silva is an automobile designer. this gives him complete freedom in his approach to the tradition of the leica m. he gets to the roots of its ergonomics and character, and investigates the inherent opportunities of this ensemble of form, function and materiality. Suddenly, it clicks. his thoughts fall into line, the vision becomes an envisaged reality, and the way is paved to a breathtaking reinterpretation of the leica m9. a reiteration of the phases of the creative process.Walter de’Silvaはカーデザイナー。

中星9号接收机各厂家芯片资料大全和升级接口针脚定义 - NEC等专区 - 卫星技术专版

中星9号接收机各厂家芯片资料大全和升级接口针脚定义品牌产品型号芯片配置海尔2晶10芯IC:HI2023E+1108+5812海尔高清OST-666 2晶6芯IC:M88VS2000+241674K.1+M88TS2020海尔高清OST-666 3晶12芯IC:High032E+His121+M88TS2020海尔 3晶10芯 (9针接口) IC:HI2023E+1108+5812+ESMTM12L64164A-GNR1T80AB海尔高清OST-666 2晶6芯IC:Hi2023E+3160+TS2020欧视达ABS-209B 3晶10芯IC:GX3001+GX1121+LW37欧视达ABS-209B 3晶11芯IC:GX3001+5037+8211欧视达ABS-309B 3晶11芯IC:GX3001+GX1121+MGCE5037欧视达AS-900S 1晶11芯IC:GX6121+25L80+LW37城市之宝BEX868 Y32S-93A T 2晶10芯IC:HTV903F+A VL1108+TS2020通达Y35S-8BA T/Y35S-8CA T 2晶10芯IC:HTV903+A VL1108+5812通达Y30S-01BT 2晶12芯IC:HTV903+A VL1108+2020皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812小霸王TDX-668E ABS-S1 1晶6芯IC:Hi2023+Hi3102+FT8211+HT1117天地星小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810天地星小霸王TDX-668A(9针接口) IC:HI2023+1108+夏普头天地星小霸王TDX-668B 2晶振IC:HTV903+A VL1108EGA+RDA5812+25L8005天地星小霸王(三星数码王)TDX-668B 单晶6芯.针脚定义①-TXD ②-RXD ③VCC ④-GND ⑤-BLIC:Hi2023E+RDA5812+A VL1108E+MXT8211a+25L8005天地星（原大盒中星九号）3晶IC:Hi2023+1108+5037天地星TDX-668B 2晶10芯IC:Hi2023+A VL1108+5812天地星小霸王TDX-668C 2晶6芯IC:HTV903+A VL1108EGA+RDK5812+25F80小霸王TDX-328B 1晶10芯IC:ALi M3328F+5810小霸王TDX-668B 6芯IC:Hi2023+RDA5812+A VL1108E小霸王TDX-668B 2晶6芯IC:HTV903+1108+5812小霸王TDX-668E 1晶6芯IC:Hi2023EC+Hi3121+5812小霸王TDX-668E 2晶6芯IC:HTV903+1108+5812小霰王XC-B298 1晶12芯IC:HTV903-RDA5812-A VL1108小霸王ABS-1388 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3121+A V2020小霸王ABS-1688 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812小霸王GF902 IC:A VL1118a+A V2020+EN25F80索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812索尼高清ABS-S 258 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi3102E+Hi2023EC+A V2020太阳红TYH-279ABS/289ABS/299ABS 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3121+A V2020松下科技星TDX-668B1/松下科技星-668E IC:Hi3102E+Hi2023EC+5812松下科技星TDX-668B 2晶6芯IC:HTV903FH42+A VL1108EGA+RGK5812松下科技星668B 2晶6芯Hi2023(E0908)+EVl1108EG2+5812松下科技星-668C 2晶6芯针脚定义①-RX .②-TX .③-GND .④VCC. ⑤-BL IC:A VL1108EG+HTV903F+5812松下科技星668E 2晶6芯IC:HV903+A VL1108E+5812松下科技星/海尔数码/海信数码单双晶6芯IC:Hi2023E+Hi3102(Hi3121)+5812松下科技星TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL IC:Hi2023+A VL1108+5812+25L8005松下高清SX168 3晶6芯IC:HTV903F+A VL1108+A V2020松下数码王P-269A 2晶6芯IC:Hi2023E+Hi3122+A V2020松下高清OST168 2晶10芯IC:Hi2023E+Hi3121+A V2020松下科技PS-228 11芯IC:Hi2023+Hi3122+5812松下科技PS-228 2晶6芯IC:M88VS2000+M88TS2020+ES261474K松下科技PS-228 1晶12芯N88VS2000+ES261344K+M88TS2020高频头+T25P80+S163816STS松下科技PS-228 2晶IC:HTV903+1108+2020松下科技PS-228 2晶10芯IC:GX3001+GX1211+5812松下数码王OST-266 10芯(4针)针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023E+Hi3106+2020松下数码王OST-266 2晶6芯IC:M88VS2000+M88TS2020+261414k+25F80松下数码王OST-266 2晶6芯IC:Hi2023E+Hi3102E+ M88TS2020+MXT8211松下高清OST-466 2晶10芯IC:Hi2023e+Hi3121+MBBTS2020+MBDA80CG松下科技星3晶6芯IC:Hi2023+A VL1108+WGCE5037松下科技星.海尔数码.海信数码单双晶+6芯IC:Hi2023E+Hi3102(3121)+5812中星科技单晶14芯IC:Hi2023E+1108+5812+25L8单晶14芯中星科技ZG-N02 12芯IC:GX3001+A V2020中星科技2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3102E+5812+M12L64164A中兴科技ABS-S323 2晶 10芯IC:Hi2023EC+HI3102E+5812+M12L64164A村村通ABS-S323- 2晶10芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:Hi2023EC+Hi3122E+5812村村通 2晶6芯IC:HN4+0001+5812村村通ZL5188 1晶13芯IC:HTV903+1108+SHARP高频头村村通ZL-5188A 2晶11芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶13芯IC:HTV903+A VL1108+RDK5812村村通ZL-5188B 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL5188B 1晶13芯IC:HTV903+A V1108+SHARP6306村村通ZJ-11 IC:HTV903+1108+夏普头S7ZH6306村村通wx-666 3晶10芯IC:GX3001+GX1121+RDK5812村村通ZL-6188 2晶10芯IC:HTV903+A VL1108EGA+5812村村通ZL-6188C 10芯IC:GX3001+GX1121+RDK5812村村通DTH(铁壳) 3晶12芯IC:A VL1108EG+HTV903F+A V2020村村通001 3晶10芯IC:GX3001+GX1121+RDK5812村村通ABS-S GD-1008 3晶10芯IC:Hi2023E+A VL1108E+ZL10037+F16-100HIP村村通ABS-S888A IC:Hi2023EC+Hi3121+ET8211+RDA5812+25X80视美人ABS-S PS-1288 2晶10芯IC:Hi3102E+Hi2023EC+A V2020视美人PS-1288 ICM88VS2000+ES256454K+M88TS2020视美人2晶10芯IC:Hi2023+3106+A V2020太平鸟HJ321 3晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC IC:GX3001+GX1121+TS2020太平鸟HJ321 3晶11芯IC:GX3001+GX1121+5812焦点yj5888 2晶10芯IC:HTV903+A VL1108+RDA5812幸运之星YJ5988 2晶10芯IC:HTV903F+A VL1108EGa+A V2020克莱尔HT701 1晶10芯IC:A VL1108EG+HTV903F+M88TS2000中电电子J-6288 ABS-S 3晶12芯IC:GX3001+GX1121+5812小福星 3晶11芯针脚定义①-GND .②-(空) .③-RXD .④-TXD (）IC:GX3001+GX1121+5812东仕DIS-2000K 单晶10芯IC:HTV903F+A VL1108E+A V2020Souy Ericsson英文机2晶10芯IC:GX3001+GX1121+A V2020高斯贝尔/歌德威尔ABS-208F 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812高斯贝尔ABS-208 1晶14芯(5针).针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EG+Hi2023+5812歌德威尔ABS-208H/高斯贝尔208P 3晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:M3330E+A VL1108EG+A V2020+M12L64164高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:A VL1108EGi+Hi2023+5812高斯贝尔ABS-208P/歌德威尔208H 1晶14芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:M3330E+A VL1108EG+A V2020+M12L64164A高斯贝尔ABS—208F IC:Hi2023+A VL1108EGA+M88TS2020高斯贝尔ABS—208 2晶14芯IC:HTV903+1108+5812吉祥ABS-208C IC:Hi2023+A VL1108EGa+GST GAIM-18R ABS-STUNER吉祥ABS-2009B 3晶14芯IC:GX3001+GX1121+RDK5812吉祥ABS-2009大铁壳 2晶IC:GX3001+GX1121+夏普高频头ABS-2009 2晶12芯IC:HTV903+1108+GAIM-18R歌德威尔ABS-208 3晶6芯IC61216GJ+1108+5812歌德威尔ABS-208 3晶14芯 (9针接口) IC:M3330+1108+5812高斯贝尔ABS-208 3晶 (9针母串口) IC:A VL1108+Hi2023+GAIM-18RIC61216GJ100+A VL1108EG+S29AL016D70TF102+ISSI高斯贝尔ABS-208N 铁壳(9针母串口) IC42s16400F高斯贝尔ABS-208 IC61216GJ+A V1108+29AL016D+5812高斯贝尔ABS-208S 1晶IC:NEC D61216GJ+A VL1108EGa+高频头高斯贝尔ABS-208Q 1晶14芯IC:A VL1108EGA+M3330E+M12L64164A+A V2020ABS-S LX-3688A 1晶12芯IC:GX3001+GX1121+5812现代V4、V5 3晶9芯IC:GX3001+GX1121+5812+EN25D80+HY57V641620ETP-6集信科技V6铁壳(海尔机芯) 3晶9芯针脚定义①VCC .②-TXD .③-RXD .④-GND IC:1108EG(Hi3121)+Hi2023+5812.集信科技V4.V6(铁壳) 2晶9芯 ( B型)针脚定义①VCC .②-RXD .③-TXD .④-GND IC:0001(GX3001)+HN4F74+5812集信科技V4 .V6(铁壳) 2晶10芯针脚定义①VCC. ②-RXD .③-TXD .④-GND IC:00001(GX3001)+HN4LSW+S6416AHTA+5812集信科技V4.V6(铁壳) IC:HN4LSW+S6416AHTA-6BZH+EN25F80-1000CP+5812集信科技V4.V6(铁壳) IC:0002P1M43700ta06+5812+EN25F80+TM8211+POL4558集信科技V4.V5 1晶10芯 (A型)针脚定义①VCC .②-RXD .③-TXD .④-GND IC:0002(GX6121)+5812+M12L64164A艾雷特 2晶10芯IC:M88VS2000+ES256454K+M88TS2020艾雷特V5 IC:HN4F910931M2EE+0001G1K729-1TA060932+5812艾雷特ALT5812 IC:GX3001+GX1121+5812艾雷特ALT600A 2晶11芯IC:M3330E+A VL108的+夏普高频头艾雷特ALT600A/吉祥ABS-2009 2晶IC:GX3001+GX1121-ES29L160FB+SHARP高频头艾雷特ALT600G IC:HTV903+A VL1108+25L160+ST2020(Y32S-8BA T 081113)艾雷特ALT6812 1晶10芯IC:GX6121+RDA5812+ZB-1A艾雷特ALT6815 1晶10芯IC:GX6121-RDA5812-2B-1A艾雷特ALT7815 3晶 10芯IC:GX3001+1121+TS2020艾雷特1000 黑珍珠V4.V5 1晶10芯IC:0002(GX6121)+EEPLDA+5812+M12L64164A 艾雷特alt 7812 3晶10芯IC:GX3001+GX1121+5812艾雷特ALT7812 3晶11芯针脚定义①VCC .②-RXD .③-TXD .④-GND IC:GX3001+GX1121+5812艾雷特ALT600c 2晶10芯IC:GX3001+GX1121+5812艾雷特ALT600c 2晶11芯IC:GX3001+GX1121+5812艾雷特ALT600c 1晶11芯IC:CH216H+A VL1108+C6XS-8CA深圳亿通DVB-V5 10芯IC:HN4N46+EN25F80+G1N540-1TA06+IS42S16400-7T+5812亿通电子WS-3688ZL 1晶10芯IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC IC:Hi2023EC+Hi3102E+A V2020中大WS-3688ZJ (铁壳) 2晶10芯IC:Hi2023+A VL1108EG+夏普高频头皇视HSR-208A 2晶10芯IC:Hi2023E+A VL1108EG+A V2020皇视HSR-208B 2晶10芯IC:Hi2023+1108+2020皇视HSR-208B 单晶10芯IC:3330+1108+2020皇视HSR-208B 单晶10芯针脚定义①-GND ②-TXD ③-RXD ④-VCC IC:Hi2023EC+Hi3102+A V2020皇视HSR-2090 2晶11芯IC:Hi2023+1108EGa+夏普头++EN29LV160皇视HSR-210A单晶6芯IC:Hi2023ec+Hi3122e+A V2020皇视HSR-260A铁盒2晶10芯IC:Hi+1108+SHARP夏普头皇视HRS-268 3晶10芯IC:Hi2023EC+Hi3102E+A V2020皇视HRS-268 2晶10芯IC:Hi2023EC+Hi3121+5812皇视HSR-268 单晶10线IC:HTV903+A VL1108+5812皇视HSR-268 单晶10线IC:Hi2023+Hi3121+A V2020皇视HRS-268 3晶10芯IC:Hi2023EC+A VL1108+5812皇视HSR-260B 3晶10芯IC:Hi2023+1108+2020皇视HSR-260B/索尼高清258 1晶10芯IC:2023E+3121+A V2020皇视HSR-260B 3晶10芯IC:HI2023+1108+5812皇朝HSR-268 10芯IC:Hi2023+A VL1108+5812凯恩斯KES-2066S 6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi3122E+Hi2023ECE+N25F80 凯恩斯KES-2077Z 1晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+3122E+5812凯恩斯2077ABS 2晶10芯IC:M3330+A VL1108+5812凯恩斯2077ABS 2晶10芯IC:Hi2023+1108E+5812+25L800凯恩斯KES-2088S 2晶6芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶10芯IC:Hi2023EC+HI3102E+RDA5812凯恩斯KES-2088S 2晶6芯针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3122E+RDA5812 凯恩斯KES-2088Z (5针).针脚定义①-TXD .②-RXD .③VCC .④-GND .⑤-BL IC:Hi2023EC+HI3102E+RDA5812 凯恩斯KES-2099S 2晶6芯IC:Hi2023EC+Hi3102E+5812+25L80凯恩斯KES-2188T 3晶10芯IC:Hi2023+1108+5812凯恩斯KES-2188T 3晶12芯IC:Hi2023+1108E+5037凯恩斯KES-2288S 3晶10芯IC:M3330E+A VL1108+RDA5812+M12L64164A凯恩斯KES-2688b 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2688S 2晶10芯IC:Hi2023e+1108e+5812凯恩斯KES-2788S 3晶10芯IC:Hi2023E+A VL1108EGa+5812凯恩斯KES-2788S 2晶6芯IC:Hi2023EC+Hi3122E+5812凯恩斯KES-5188 11芯IC:HTV903+A VL1108EGA+A V2020凯恩斯KES-5188A铁盒 2晶10芯IC:HTV903F+A VL1108+RDK5812+F80+PT8211凯恩斯KES-5188B 2晶13芯IC:HTV903+RDA5812+A VL1108+8211+F80美路3晶13芯IC:Hi2023E+1108+2119美路2晶12芯IC:GX3003+GX1121+5812美路MR-1809 IC:Hi2023E+A VL1108E+高频头MAX2119C美路MR-5598铁壳 3晶12芯IC:GX3003+GX1121+5812美路MR-5598 3晶12芯针脚定义①VCC. ②-RXD .③-TXD .④-GND IC:Hi2023E+1108+2119C美路-5798 IC:Hi2023E+1108+2119C美路-5598 IC:Hi2023+1108+GAIM-18R+29lv160ZY 5518A 2晶10芯IC:Hi2023E+3102E+5812万利达ZY-5518A 1晶6芯((5针)) IC:Hi2023E+Hi3102E+5812万利达ZY-5518A 2晶10芯IC:CX3001+GX1121+5812万利达ZY-5518A 3晶10芯 (9针接口) IC:Hi2023+1108+5812长虹新一代 3晶10芯IC:HI2023E+1108E+FL016ALF长虹新一代，海尔数码、海信数码单双晶体 6芯IC:HI2023E+3102(3121)+5812长虹数码CH930 3晶12芯IC:HTV903F+1108+A V2020+M80长虹精品TC-6688ABS 2晶10芯IC:HTV903+A VL1108EG+5812长虹精工YJ5978 1晶10芯IC:HTV903F+1108EGa+2000+F80-100+8211长虹KES-2099S 2晶5芯IC:Hi2023+Hi3102E+5812长虹KES 2晶6芯IC:Hi2023+Hi3102+5812长虹CH920 3晶6芯IC:HTV903F+1108EGa+A V2020+25L80航天天信WTD198J 2晶12芯(9针接口) IC:GX3001+GX1121+5812+ES29LV160FB-70TG 航天珠江WTD-198J 2晶12芯IC:GX3001+GX1121+5812航天珠江ABS-209B IC:GX3001+GX1121++WGSE5037航天数码ABS-3809 2晶12芯IC:GX3001+GX1121+5812航天直播HT-168 3晶12芯IC:Hi2023+1108+夏普头航天高清王-HS-166 2晶12芯IC:Hi2023EC+Hi3102E+RDA5812航天高清王HS-169 2晶12芯针脚定义①-GND .②-TX .③-RX .④-VCC IC:Hi2023EC+3122+5812天诚TCD-219 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-219ABS 2晶10芯IC:M3330E+A VL1108EGA+5812天诚TCD-299Z 2晶10芯IC:Hi2023+3206+5812天诚TD-299Z 2晶5芯IC:Hi2023+3206+5812天诚TD-2992 2晶6芯IC:Hi3122E+Hi2023E+5812+F80+MXT8211天诚539 2晶10芯IC:HTV903+A V1108+5812天诚519型2晶10芯IC:HTV903+1108E+5812天诚TCD-239ABS 3晶10芯IC:M3330+1108+5812天诚TCD-239ABS 2晶10芯IC:Hi2023+1108E+5812天诚TCD-239 2晶10芯IC:M3330E+1108E+5812天诚TCD-279 2晶10芯IC:Hi2023EC+Hi3102E+5812天诚TCD-299ABS 2晶10芯IC:Hi2023EC+Hi3121+5812天诚TCD-319ABS 3晶10芯IC:Hi2023E0914+A VL1108EGa+RDA5812天诚TCD-319ABS 3晶12芯IC:Hi2302+A VL1108+5037天诚TCD-369ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-369ABS 3晶10芯IC:M3330E+1108+5812天诚TCD-369ABS 3晶5芯IC:Hi2023+1108+WCGE5037天诚TCD-509ABS 3晶10芯IC:M3330E-A VL1108EGa-5812天诚TCD-509ABS 10芯 (5针) IC:Hi2023+A VL1108+5812+M12L6416A天诚TCD-539ABS 2晶10芯 (5针)针脚定义①-RX .②-TX .③VCC .④-GND .⑤-BL IC:M3330E+A VL1108+25L80+5812天诚TCD-579ABS 2晶10芯IC:Hi2023+Hi1108+5812天诚TCD-579ABS 3晶10芯IC:HiM3330+A VL1108EGa+RDA5812天诚TCD-589ABS 3晶10芯IC:Hi2023+1108+5812天诚TCD-689ABS铁壳机2晶12芯(9针接口) IC:Hi2023+A VL1108+夏普头天诚TC-ABS1108A11芯IC:Hi2023EC+A VL1108+5812TCD--239ABS 2晶10芯IC:M3330E+A VL1108E+5812TCD-339ABS 3晶10芯 (9针接口) IC:Hi2023+1108+5812TCD-509ABS 3晶10芯IC:Hi2023E0915+A VL1108EGa+RDA5812TCD-509ABS 2晶10芯 (5针) IC:Hi2023EC+HI3121+5812TCD-519ABS 2晶10芯IC:Hi2023+A VL1108+5812TCD-599 2晶10芯IC:M3330+A VL1008+5812TCD-219ABS 2晶振10芯针脚定义①-TXD .②-RXD .③-VCC .④-GND .⑤-BL IC:Hi2023EC+Hi3121+5812爱普思DVB-2568 3晶10芯IC:HTV903+1121+2020卓异5518A 3晶10芯IC:Hi2023E+1108+5812卓异5518A(铁壳)3晶11芯IC:Hi2023E+1108+5812卓异5518A(铁壳)2晶11芯(9针接口) IC:Hi2023+1108+夏普独立高频头卓异5518A G 1晶10芯爱百信针脚定义①-GND .②-TXD .③-RXD .④VCC IC:HTV903+A VL1108+5812卓异ZY-5518A G 驰骋天下针脚定义①-GND .②-RXD .③-TXD .④VCC IC:HTV903+A VL1108+5812+F80卓异5518AG 2晶11芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023E+1108+5812卓异ZY-5518A H 春 1晶6芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:GX3001+5812+25L8005卓异ZY-5518A H 春 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:Hi2023E+HI3121+5812+F25L008A卓异ZY-5518A H 秋针脚定义①-GND .②-RXD .③-TXD .④VCC 升级接口在内部PCB上IC:GX6121+5812+F80卓异ZY-5518A H 秋 1晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC ⑤-BL IC:Hi2023EC+Hi3102E+5812+F80-100卓异ZY-5518A H至尊王牌2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:GX3001+GX1121+5812+25L8005卓异ZY-5518A H 财富 2晶6 芯针脚定义①-GND .②-TXD .③-RXD .④VCC .⑤-BL IC:芯片掩磨+5812+80L100绿达PS-1288 3晶12芯IC:Hi2023E+ABS090520+M88TS2020绿达PS-1288 2晶12芯IC:Hi2023+Hi3021+A V2020绿达视美人\卓异 1晶10芯IC:Hi2023EC+Hi3121+2020绿达金统帅 3晶10芯IC:M3330+1108+5812三星DQ88/DQ66 IC:HTV903F+A VL1108+A V2020三星高清王2晶12芯IC:GX3001+GX1121+5812三星高清DQ88 3晶12芯IC:HTV903F+A VL1108+A V2020三星数码王TDX668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL IC:Hi2023+1108+5812三星数码王TDX668B 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王668C 2晶6芯IC:HTV903F+A VL1108E+5812三星数码王TDX668E 1晶6芯IC:Hi2023EC+3102C+5812三星HSR-208C 1晶10芯IC:Hi2023E+Hi3102+MXT8211+A V2020+F25L08pA三星小霸王ABS-S 2009 2晶10芯IC:CX3001+CX1121+5812三星小霸王2900 (9针接口) IC:Hi2023E+A VL1108+MAX2119三星王国-KL6350 1晶11芯IC:HTV903+A VL1108EGa+EDA5812开门红KSP638 2晶10芯IC:HTV903F+A VL1108E+A V2020开门红KSP638 1晶10芯IC:CT216H+A VL1108EGa+A V2020日立创新TDX-668B 2晶6芯针脚定义①-RXD .②-TXD .③-GND .④VCC. ⑤-BL IC:Hi2023+A VL1108+5812志高之星HS166 2晶12芯IC:Hi3102+Hi2023+5812志高之星HS169 2晶12芯IC:Hi2023EC+Hi3012E+RDA5812A+EM638165TS-6G金牛ABS-1108 3晶10芯IC:Hi2023+1108+5812小灵通 2晶6线IC:Hi2023+1108+5812福临门ABS-S 3晶9线IC:GX1121+GX3001+5812C60S-93A T 单晶10芯IC:CT216H+A VL1108EGa+A V2020ABS-2301 单晶10芯针脚定义①-GND.②-TXD.③-RX .④VCC IC:Hi2023EC+Hi3211E+5812+25L8005其乐达CT216 2晶10芯IC:CT216+1108+A V2020科海6228 1晶11芯IC:HTV903+A VL1108EGa+RDa5812+25X16A VSIG科海6228-CT216H 1晶11芯IC:CT216H+1108EGa+M88TS2020科海C623S-91A T 单晶10芯IC:CT210H+A VL1108+2020科海炫彩6888 IC:HTV903+A VL1108EGa+RDa5812科海2888（小天使）2晶10芯IC:HTV903+A VL1108EGa+RDa5812大旗920 3晶12芯IC:HTV903+A VL1108+A V2020大旗DQ920 3晶12芯IC:GX3001+GX1121+5812+25X16大旗930 3晶12芯IC:HTV903+A VL1108+A V2020众昌电子ABS--2088 2晶10芯IC:Hi2023+A VL1108+5812众昌电子ABS-2087 2晶10芯IC:M3330+A VL1108+5812创维S600 3晶IC:M3330E+A VL1108E+5812创维新一代3晶10芯IC:Hi2023E+1108+5037+FL016A中广通XC-B188 3晶12芯IC:GX3001+GX1121+5812深圳知音ABSTAR KT-2309 3晶10芯IC:Hi2023+A VL1108E+5812知音科技ABSTAR KT1028H 2晶振10芯IC:Hi2023+A VL1108+GST GAIM-18R铁壳ABS-2009 2晶11芯IC:Hi2023+1108+夏普头王牌数码OST-366 2晶6芯针脚定义①-GND ②-RXD .③-TXD .④VCC IC:Hi3102+Hi2023EC+A V2020王牌数码王GM-ABS1108A 2晶10芯针脚定义①-GND .②-TXD .③-RXD .④VCC IC:GX3001+GX1121+5812+25L8005王牌数码王GM-ABS1108A 10芯IC:Hi2023+A VL1108+5812JIXIANG ABS-208 2晶14芯 (9针接口) IC:Hi2023+1108+GST GAIM-18R ABS TUNER 夏普头JIXIANG-ABS208 2晶IC:D6121+1108+GST高频头East Star 2晶10芯IC:M3330-1108-GST GAIM-18R高频头小福星abs 2008 3晶12芯IC:GX3001+GX1211+5812通达C60S-93A T/C62S-91A T 1晶10芯IC:CT216H+A VL1108E+2020威特斯ZL-5188A 2晶 13芯IC:HTV903+A VL1108+RDK5812威特斯ZL-5188B 2晶 11芯IC:GX3001+GX1121+5812迷你星 3晶13芯IC:GX3001+GX1121+5812+F16-100HIP高星HS-312 3晶 12芯IC:GX3001+GX1121+5812北大高科 3晶 9芯IC:GX3001+GX1211+5812思达科ABS-S 801型2晶 10芯IC:GX3001+GX1121+5810思达科ABS-S 802G 2晶10芯IC:GX3001+GX1211+5812思达科ABS-S 803A 1晶10芯IC:A VL1118+A V2020+25D80V思达科ABS-S 803G IC:GX3001+GX1211+5812思达科ABS-S 806H IC:GX3001+GX1211+5812思达科ABS-S 806H IC:A VL1118+A V2020+DSD4M16G思达科ABS-S 806H IC:HN4J7G+G2A954+5812+25X80思达科ABS-S807 1晶5芯IC:A VL1118a+A V2020+806H金霸王JBW-6688 2晶11芯IC:HTV903F+A VL1108EGa+A V2020+8211金霸王JBW-6688 IC:GX3001+GX1211+5812阿德尔ADE-168 IC:HY903+A VL1108EG+A V2020阿德尔ADE131金刚IC:HTV903F+A VL1108E+M88TS2020海西小霸王TD299Z 2晶6芯IC:Hi2023E+Hi3122+5812同洲CY-668S 1晶12芯IC:HM1512+1108+5812喜旺ABS5398 IC:Hi2023+1108E+MAX2119C喜旺ABS-5798 12芯IC:GX3001+GX1211+5812喜旺ABS-3809 2晶12芯IC:GX3001+GX1121+RDA5812希旺598 2晶12芯 (9针接口) IC:Hi2023+1108+SHRP高频头彩虹视霸CY84 1晶10芯IC:HTV903F+A VL1108+M88TS2020彩虹视霸A10S-9AA T 1晶10芯IC:A VL1118+SM42S16400B1-7+F80九洲村村通DVS-398F IC:CT216H+ALV1108+SHRP高频头金星ABS-208 1晶14芯IC:Hi2023+A VL1108+铁壳高频头威克 2晶6芯 (5针) IC:HTV903+1108+5812华尔HR731A1 3晶12芯IC:CX3001+CX1121+SHARP高频头爱普斯 3晶9芯IC:HTV903+A V2020+A VL1108EG爱普斯2568 3晶10芯IC:HTV903+A V2020+A VL1108EG爱普斯IC:GX3001+GX1211+A V2020+2J10X未来视佳ADEI88 3晶9芯IC:HTV903F+A V2020+A VL1108EG黑金刚TRT006 1晶10芯IC:A VL1118+A V2020+4558+F80-100DX-668 2晶10芯针脚定义①-RXD .②-TXD .③VCC .④-GND .⑤-BL IC:Hi2023EC_Hi3102E+5812+F80-100傲天海-吉祥2晶12芯针脚定义①-GND ②-RXD ③-TXD ④VCC IC:GX3001+GX1121+RDA5812高频头+P8075火星漫步LJ6008 1晶10芯IC:HTV903F+A VL1108+M88TS2020+F80-100王牌新一代TD-299Z针脚定义①- . ②-TXD .③-RXD .④-GND ⑤- IC:Hi2023E+Hi3122+5812王牌HJ360 3晶10芯IC:GX1120+GX3001+TS2020TVWALKER ABS-2008 1晶6芯IC:D61216GJ+1108E+SHARP头吉祥988 (ZJ-111) 1晶11芯IC:HTV903 +1108+高频头北京北电科林 3晶12芯IC:Hi2023+A VL1108EGa+SHARP高频头家家福BEX811 1晶10芯IC:24645K2+M88VS2000+M88TS2020家家福ADE158 IC:HTV903+A VL1108+M88TS2020华星科技2晶IC:Hi2023+A VL1108+5812亚视达ABR-S(H11) 2晶10芯IC:HTV903+1108E+A V2020HSTAR 3晶10芯IC:Hi2023+A VL1108EGa+M88IS2020长江电讯ABS-2008型铁壳 (9针接口) IC:D61216GJ+A VL1108EG+夏普头全家福 3晶IC:Hi2023E+A VL1108EG+M88TS2020畅想BEX818 1晶10芯IC:HTV903+A VL1108+A V2020必佳GF-901 2晶10芯针脚定义①-GND .②-RXD .③-TXD .④VCC IC:HTV903+1108+A V2020KSP600G 飓风(华亚) 2晶10芯针脚定义①-GND ②-TXD ③-RXD ④VCC IC:HTV903+1108+M88TS2020+25D80万家乐TB002 (5针) IC:Hi2023EC+Hi3102E+M88TS2020+25X80A V万家乐2晶6芯IC:M3330+ALi1108+5812+F80-75奥伟科技ABS-800 3晶 (9针接口) IC:GX3001+GX1121+5812奥伟科技ABS-900E 2晶12芯IC:CT216+A VL1108+独立高频头GAIR-08R天眼HSTER3晶10芯IC:Hi2023E+A VL1108+5812飞翔ADE351 2晶10芯IC:HTV903F+A VL1108EG+M88TS2000星视通XC-B268 1晶10芯IC:HTV903+A VL1108+5812星视通XC-C268 1晶11芯IC:HTV903 A VL1108 5812奥维科技ABS-600 3晶12芯IC:GX3001+GX1121+A V2020GM-210825A 3晶10芯IC:Hi2023+A V1108+5812GM-210825A 2晶10芯IC:GX3001+GX1121+5812中国结TRT005 1晶10芯IC:M88VS2000+256454K+M88TS2020万视达118S 3晶10芯IC:Hi2023EC+Hi3121E+5812足球王国ADE266 1晶10芯IC:HTV903F+A VL1108Ga+M88T52000摩托罗拉IC:HM1521+A VL1108+5812现代数码TDX-668B 2晶6芯IC:A VL1108EG+HI2023EC+5812国科广电GKA800 ( 9孔串口) IC:GX3001+A VL1108+EN29LV160AB+夏普头心语BEX838 10芯IC:HTV903F+A VL1108+5812心语BEX838 2晶10芯IC:HTV903F+A VL1108+m88ts2020+GH8211美万嘉MJ-518S 3晶10芯IC:GX3001+GX1121+RDK5812SV A CH-6788 2晶IC:M88VS2000+ES255624K+M88TS2020+EN25F80+AMS1117数码新一代HT702 2晶10芯IC:HTV903F+1108+M88TS2020飓风KSP600G 2晶10芯IC:HTV903+A VL1108+2020板号CH-ABS-S-VS2000-V1.1 2晶6芯IC:2000+2020+255624K斯威特ZL-5188A 1晶13芯IC:2HTV903+A VL1108EGA+夏普高频头中国星2晶6芯IC:ALI3330+ALi1108+5812+F80-75Ji Xiang 208版号ABS-A005B.M 3晶6芯IC:D61216GJ100+A VL1108+S29AL016070TF102+MAXIM2119C欧士达209B 10芯IC:GX1121+GX3001+5037。

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