C8051F单片机选型列表
单片机课件11 C8051Fxxx系列单片机.
2019/7/16
20
11.8 中断系统
CIP-51包含一个扩展的中断系统，有22个中断源。 每个中断源有两个优先级。 每个中断源可以在一个SFR中有一个或多个中断
标志。 每个中断源都可以设置为允许或禁止中断，但是
必须首先置EA位（IE.7）为1 。 每个中断源都可以被独立地编程为低优先级或高
2019/7/16
9
11.5 振荡器
(1)内部振荡器
内部振荡器频率设置
2019/7/16
10
11.5 振荡器
(2)外部振荡器
外部振荡器控制寄存器OSCXCN的格式：
D7
D6
D5
D4
D3
XTLVLD XOSCMD2 XOSCMD1 XOSCMD0 －
D2
D1
D0
XFCN2 XFCN1 XFCN0
XTLVLD：晶体振荡器有效标志； XOSCMD2~0：外部振荡器方式设置位 ； XFCN2~0：外部振荡器频率控制位。
（2）定时器2
定时器T2的工作方 式
2019/7/16
27
11.10 可编程定时/计数器阵列
片内可编程定时/计数器阵列（Programmable Counter/Timer Array, PCA），包括：
（1）一个专用的16位计数器/定时器时间基准； （2）5个可编程的捕捉/比较模块。
时间基准的时钟可以是系统时钟的12分频、系统 时钟的4分频、定时器0溢出或外部时钟输入 （External Clock Input, ECI） 之一。
2019/7/16
优先权交叉 开关译码表
19
11.7 可编程I/O口
例1：如果XBR0 = 0x11，XBR1 = 0x00，XBR2 = 0x40： P0.0=SDA，P0.1=SCL，P0.2=CEX0，P0.3=CEX1， P0.4 – P2.7 分配给相应的端口I/O。
台湾笙泉8051系列单片机选型表 20130627
4.5V~5.5V 2.4V~3.6V
64KB 256B+1024B
3 37 / 41
10bit , 8-CH 无
MA807
4.5V~5.5V
16KB
3
MA808
2.4V~3.6V
256B+256B
41
24MHz *2
MA816
4.5V~5.5V
16KB
3
256B+256B
57
无
x1
UART
无
x1
MA82G5A64 *0 2.0V~5.5V
封装
PDIP 20 / 16 / 8 SOP 20 / 16 / 8
SOP 28 / 20
20 系列( 1T , MTP )
型号 MA20E/L809
工作电压
L:2.4V~3.6V E:4.5V~5.5V
Flash ROM Data RAM
4KB 256B+128B
最高主频 25MHz *1
定时器 (16-BIT) IO
*5
软件可调
ISP
IAP
4KB Max
15KB Max
4KB Max
15KB Max
4KB Max
63KB
*5
Max
封装
LQFP48
LQFP48 LQFP64
Low-Speed USB Microcontroller
64 系列 ( 6502 , USB LS )
型号
工作电压
MG64F236 *使用内置晶振
FAX:86-755-82877039 / 82877063
FAX:86-21-54314771
笙泉8051单片机选型表
I2C USB RTC PWM 1 1 4
ADC 8bit
LVD 1 1
封装
SOP8/16/20 DIP16/20 SOP16/20/28 DIP16/20/28
3.5K MAX 6/14/18 3.5K MAX 18/26
备注：该系列主频25M@1T；3种频率可选的高精度内部RC振荡器；带中继模式且支持IO切换的UART；E系列工作电压4.5~5.5，L系列工作电压2.4~3.6 84系列 型号 MG84FL54BD MG84FL54RBD MG84G564 Flash 16KB 16KB 64KB Sram 832B 256B 5376B IAP ISP 15.5K MAX 4K MAX 15.5K MAX 4K MAX 64K MAX 4K MAX IO 36 36 41/55 定时器 UART SPI 3 1 1 3 1 1 4 2 1 I2C USB I2S 1 1 1 1 1 1 1 PCA 6 ADC 12bit LVD 2 EBI 1 封装
笙泉8051选型表
89系列 型号 Flash Sram IAP ISP IO 定时器 UART SPI I2C USB I2S PWM MPC89E/L52 8KB 512B 单独7K 4K MAX 32/36 3 1 MPC89E/L53 16KB 512B 4K MAX 32/36 3 1 MPC89E/L54 16KB 1280B 单独47K 4K MAX 32/36 3 1 MPC89E/L58 32KB 1280B 单独31K 4K MAX 32/36 3 1 MPC89E/L515 64KB 1280B 4K MAX 32/36 3 1 备注：该系列主频48M@12T/24M@6T；E系列工作电压4.5~5.5，L系列工作电压2.4~3.6 87系列 型号 MG87FE/L04 MG87FE/L2051 MG87FE/L4051 MG87FE/L6051 87FE/L52 Flash 4KB 2KB 4KB 6KB 8KB Sram 256B 256B 256B 256B 256B IAP 单独2K 单独1K 单独1K 单独1K ISP IO 定时器 UART SPI 独立固定 7 2 1 3.5K MAX 15/17 2 1 3.5K MAX 15/17 2 1 3.5K MAX 15/17 2 1 3 1 I2C USB I2S PWM 1 1 1 1 ADC 比较器 EBI 1 1 1 1 1 封装
C8051单片机基础C8051F单片机结构及原理详解
2.2 C805lF单片机的结构与原理
2.2.1 C8051F02x单片机的组成与结构 C8051F020单片机以8051内核为中心，
通过SFR总线、外部数据存储器总线、系 统时钟线、复位线等与64KB闪存、4KB XRAM、数字功能模块(UART、SPI、定时器 等)、模拟功能模块(比较器、A/D、D/A 等)、片上时钟系统和JTAG逻辑电路等相 连。是一个完整的单片机片上系统，可以 用作为一个闭环测量控制系统。
2.1 C8051F的CIP-51内核
2.1.3 CIP-51内核的基本部件
5．流水线结构 CIP-51采用了流水线处理结构，用
于控制和管理取指令和执行指令的过程。 其已经没有机器周期时序，指令执行的最 小时序单位为系统时钟，大部分指令只要 1个～2个系统时钟即可完成。在流水线结 构中包括指令寄存器和指令译码器。
2.1 C8051F的CIP-51内核
2.1.3 CIP-51内核的基本部件
6．中断系统 中断系统的主要作用是对外部或内
部的中断请求进行管理与处理。C8051F系 列单片机的中断系统可以满足一般控制应 用的需要，C8051F系列单片机的中断源最 多可达22个。
2.1 C8051F的CIP-51内核
2.2 C805lF单片机的结构与原理
2.2.2 引脚定义及功能
下面对部分专用引脚的功能进一步说明。 (1)VDD和GND各为3个引脚，使用时建议全部
接上，这样可提高抗干扰能力。 (2)如果在系统中没有使用模拟部分，芯片的
模拟电源V+和模拟地AGND也要连接。 (3)VREF端也可以作为带隙电压基准输出驱动
d附录3：部分新型8051兼容单片机性能速查表
附录3：
部分新型8051兼容单片机性能速查表
在世界上8位单片机诞生后不久，8051的出现了，由于8051在当时8位单片机中的突出性能，它成为事实上的工业标准。
由于Intel公司的技术开放和8051的经典体系结构、良好的兼容性，众多的半导体厂商都热衷于8051及其兼容单片机的发展，特别是近几年来，随着微电子技术与计算机技术的迅猛发展，8051及其兼容单片机的发展日新月异、品种繁多，令人目不暇接。
8051及其兼容单片机的生产厂商各施绝技，生产出各具特色的8051及其兼容单片机，概括说来，新型的8051及其兼容单片机有如下的特点或功能：1．高速度；
2．混合(模拟与数字)信号处理；
3．低功耗；
4．多时钟和实时时钟；
5．大容量存储器；
6．大数量的I/O口和多功能、可配置I/O口；
7．基于串口或JTAG结构的在系统调试；
8．多种复位源；
9．片内可编程门阵列和系统可配置；
10．多种串口；
11．DMA功能；
12．USB接口；
13．视频（电视）信号处理与控制；
14．网络接口；
……
由于与8051兼容的单片机品种繁多，限于篇幅，要介绍所有新型的与8051兼容单片机是不可能的，而要重点介绍若干个品种，既有难以取舍的窘迫，又有挂一漏万之嫌。
即使是仅介绍这些新型的单片机的特点，恐怕也难在一本书中叙述清楚。
作者只好把所收集的与8051兼容的单片机及其特点整理成表格，作为附录供大家在开发选型时参考。
应该说明的是，该表格不可能把所有的与8051兼容的单片机都收入到，所列特点也仅仅是概括性的，不可能把所有的技术指标都给列出。
下表列出了与8051兼容的单片机的生产公司、信号及其特点与主要技术指标。
C8051FMCU之系列仿真器介绍
C8051F MCU 之系列仿真器介绍C8051F 单片机是完全集成的混合信号系统级芯片 （SoC ），具有与MCS-51完全兼容的指令内核。
该系列单片机采用流水线处理（pipe line ）技术，不再区分时钟周期和机器周期，能在执行指令期间预处理下一条指令， 从而提高了指令执行效率。
大部分C8051F 单片机具备控制系统所需的 模拟和数字外设，包括看门狗、 ADC 、DAC 、电压比较器、电压基准输出、 定时器、PWM 、定时器捕捉和方波输出等，并具备多种总线接口，包括UART 、 SPI 、SMBus （与I2C 兼容）总线以及CAN 总线。
C8051F 系列单片机采用 FLASH ROM 技术，集 成JTAG ，支持在线编程。
本文重点说明一下 C8051F 开发工具的选择及各版本之间的异同， 以方便开发者选购。
下面所说的开发工具，均以原厂Silicon Laboratories （2003 和Cygnal 兼并）公司为主，国内有兼容的开发工具，可以对号入座。
1、Serial Adapter EC2此产品属于Silabs 公司第一代产品，现在这个基本上属于停产的产品，市场上有的Hn # Description 13.3-to3.a VD 匚 hpLii 2 1 fl GlSD fGraund'i 4 TDK (C2D) 5 TMS 5TOO 7TDI (C2CK) aiol\ot Cannsrfad注資：1脚的电馬为输入Table 1. RS232 Sana! Adapter DEBUG Connector Pin DescnptionaDEBUG mnnacla-冋gure 1. RS232 Serial Adapter Connectors话，价格也相对偏高。
不合适！还有一个值得提醒大家的是（也是好多朋友问本空间的开发器为什么1脚为NC ,特做此声明），注意这个DEBUG 的调试接口的关系，在第一脚3.0 to 3.6 VDC In put ，搞过RS232接口的朋友都应该知道，串行口不能向设备提供大电流电源 的（通常的窃电电路也只是小电流方式 ），所以在官方的开发板上都有如下有这个关系。
改良创新后的51单片机-----C8051F
改良创新后的51单片机-----C8051FMCS-51单片机及其衍生产品在我国乃至世界范围获得了非常广泛的应用，尤其在我国，大部分大专院校都采用MCS-51单片机作为教学机型,大部分单片机系统工程师都熟悉MCS-51单片机。
随着一些髙集成度、髙性能的8位和16位RISC单片机的推出,基于8051内核的单片机正面临着退出市场的境地。
因此一些半导体公司开始对传统8051内核进行大的改造,主要是提高速度和增加片内模拟和数字外设,以期大幅度提高单片机的整体性能.Silabs集成产品公司推出的C8051F单片机是这类MCS-51单片机的典型代表,也是目前功能最全,速度最快的8051衍生单片机。
C8051F单片机的出现令业界人士耳目一新，使广大单片机系统设计人员看到了MCS-51单片机的曙光。
C8051F单片机简介C8051F单片机是完全集成混合信号系统级芯片（SoC），具有与8051兼容的高速CIP-51内核，于MCS－51指令集完全兼容，可以使用标准803×805X汇编器和编译器进行软件开发。
除了具有标准8051的数字外设部件之外，片内还集成了数据采集和控制系统中常用的模拟部件和其它数字外设及功能部件。
这些外设或功能部件包括模拟多路选择器、可编程增益放大器、ADC、DAC、电压比较器、电压基准、温度传感器、SMBUS、12C、UART、SPI、定时器、可编程计数器、定时器阵列(PCA) 、数字I/O端口、电源监视器、看门狗定时器(WDT)和时钟振荡器等。
所有器件都有内置的FLASH程序存储器和256字节的内部RAM，有些器件内部还有位于外部数据存储器空间的RAM，即XRAM。
C8051F单片机的主要特点C8051F单片机中有丰富的模拟和数字资源，并采用了一些在单片机中前所未有的新技术，在CPU内核的内部和外部有几项关键性的改进。
提高了整体性能，更易于在最终使用中使用。
下面对C8051F单片机的主要特点加以介绍。
Si licon Laboratories C8051F35x-DK8051F35x-DK C805
Rev. 0.4Copyright © 2014 by Silicon LaboratoriesC8051F35x-DKX EVELOPMENT IT SER S UIDE1. Kit ContentsThe C8051F35x-DK Development Kit contains the following items:⏹ C8051F350 Target Board⏹ C8051Fxxx Development Kit Quick-Start Guide ⏹ AC to DC Power Adapter⏹ USB Debug Adapter (USB to Debug Interface)⏹ USB Cable ⏹ CD-ROM2. Hardware Setup using a USB Debug AdapterThe target board is connected to a PC running the Simplicity Studio via the USB Debug Adapter as shown in Figure 1.1. Connect the USB Debug Adapter to the DEBUG connector on the target board with the 10-pin ribbon cable.2. Connect one end of the USB cable to the USB connector on the USB Debug Adapter.3. Connect the other end of the USB cable to a USB Port on the PC.4. Connect the ac/dc power adapter to power jack P1 on the target board.Notes:⏹ Use the Reset button in the IDE to reset the target when connected using a USB Debug Adapter.⏹ Remove power from the target board and the USB Debug Adapter before connecting or disconnecting theribbon cable from the target board. Connecting or disconnecting the cable when the devices have power can damage the device and/or the USB Debug Adapter.Figure 1.Hardware Setup using a USB Debug AdapterPWRP1.6C8051F35x-DK3. Software SetupSimplicity Studio greatly reduces development time and complexity with Silicon Labs EFM32 and 8051 MCU products by providing a high-powered IDE, tools for hardware configuration, and links to helpful resources, all in one place.Once Simplicity Studio is installed, the application itself can be used to install additional software and documentation components to aid in the development and evaluation process.Figure 2.Simplicity StudioThe following Simplicity Studio components are required for the C8051F350 Development Kit:⏹ 8051 Products Part Support ⏹ Simplicity Developer PlatformDownload and install Simplicity Studio from /8bit-software or /simplicity-studio .Once installed, run Simplicity Studio by selecting Start →Silicon Labs →Simplicity Studio →Simplicity Studio from the start menu or clicking the Simplicity Studio shortcut on the desktop. Follow the instructions to install the software and click Simplicity IDE to launch the IDE.The first time the project creation wizard runs, the Setup Environment wizard will guide the user through the process of configuring the build tools and SDK selection.In the Part Selection step of the wizard, select from the list of installed parts only the parts to use during development. Choosing parts and families in this step affects the displayed or filtered parts in the later device selection menus. Choose the C8051F35x family by checking the C8051F35x check box. Modify the part selection at any time by accessing thePart Management dialog from the Window →Preferences →Simplicity Studio →Part Management menu item.Simplicity Studio can detect if certain toolchains are not activated. If the Licensing Helper is displayed after completing the Setup Environment wizard, follow the instructions to activate the toolchain.C8051F35x-DK3.1. Running BlinkyEach project has its own source files, target configuration, SDK configuration, and build configurations such as the Debug and Release build configurations. The IDE can be used to manage multiple projects in a collection called a workspace. Workspace settings are applied globally to all projects within the workspace. This can include settings such as key bindings, window preferences, and code style and formatting options. Project actions, such as build and debug are context sensitive. For example, the user must select a project in the Project Explorer view in order to build that project.To create a project based on the Blinky example:1. Click the Software Examples tile from the Simplicity Studio home screen.2. In the Kit drop-down, select C8051F350 Development Kit, in the Part drop-down, select C8051F350, andin the SDK drop-down, select the desired SDK. Click Next.3. Under C8051F350 Development Kit, select F35x Blinky, click Next, and click Finish.4. Click on the project in the Project Explorer and click Build, the hammer icon in the top bar. Alternatively,go to Project→Build Project.5. Click Debug to download the project to the hardware and start a debug session.button to start the code running. The LED should blink.6. Press the Resume7. Press the Suspendbutton to stop the code.8. Press the Reset the device button to reset the target MCU.button to return to the development perspective.9. Press the Disconnect3.2. Simplicity Studio HelpSimplicity Studio includes detailed help information and device documentation within the tool. The help contains descriptions for each dialog window. To view the documentation for a dialog, click the question mark icon in thewindow:This will open a pane specific to the dialog with additional details.The documentation within the tool can also be viewed by going to Help→Help Contents or Help→Search.C8051F35x-DK4. Target BoardThe C8051F35x Development Kit includes a target board with a C8051F350 device pre-installed for evaluation and preliminary software development. Numerous input/output (I/O) connections are provided to facilitate prototyping using the target board. Refer to Figure3 for the locations of the various I/O connectors.P1Power connector (accepts input from 7 to 15 VDC unregulated power adapter)J122-pin Expansion I/O connectorJ3Port I/O Configuration Jumper BlockJ4DEBUG connector for Debug Adapter interfaceJ5DB-9 connector for UART0 RS232 interfaceJ6Analog I/O terminal blockJ7Connector for IDAC0 voltage circuitJ8USB Debug Adapter target board power connectorJ9, J10External crystal enable connectorsJ11Connector for IDAC1 voltage circuitJ12Connector block for Thermistor circuitryJ13, J14ADC external voltage reference connectorsFigure3.C8051F350 Target BoardC8051F35x-DK4.1. System Clock SourcesThe C8051F350 device installed on the target board features a calibrated programmable internal oscillator which is enabled as the system clock source on reset. After reset, the internal oscillator operates at a frequency of 3.0625MHz (±2%) by default but may be configured by software to operate at other frequencies. Therefore, in many applications an external oscillator is not required. However, if you wish to operate the C8051F350 device at a frequency not available with the internal oscillator, an external crystal may be used. Refer to the C8051F35x data sheet for more information on configuring the system clock source.The target board is designed to facilitate the installation of an external crystal. Remove shorting blocks at headers J9 and J10 and install the crystal at the pads marked Y1. Install a 10M resistor at R9 and install capacitors at C14 and C15 using values appropriate for the crystal you select. Refer to the C8051F35x data sheet for more information on the use of external oscillators.4.2. Switches and LEDsTwo switches are provided on the target board. Switch SW1 is connected to the RESET pin of the C8051F350. Pressing SW1 puts the device into its hardware-reset state. Switch SW2 is connected to the C8051F350’s general purpose I/O (GPIO) pin through headers. Pressing SW2 generates a logic low signal on the port pin. Remove the shorting block from the jumper to disconnect SW2 from the port pins. The port pin signal is also routed to a pin on the J1 I/O connector. See Table1 for the port pins and headers corresponding to each switch.Three LEDs are also provided on the target board. The red LED labeled PWR is used to indicate a power connection to the target board. The green LEDs labeled with port pin names are connected to the C8051F350’s GPIO pins through headers. Remove the shorting blocks from the headers to disconnect the LEDs from the port pins. The port pin signals are also routed to pins on the J1 I/O connector. See Table1 for the port pins and headers corresponding to each LED.Table 1. Target Board I/O DescriptionsDescription I/O JumperSW1Reset noneSW2P1.0J3[5–6]Green LED D2P0.6J3[1–2]Green LED D1P0.7J3[3–4]Red LED PWR noneC8051F35x-DK4.3. Expansion I/O Connector (J1)The 34-pin Expansion I/O connector J1 provides access to all signal pins of the C8051F350 device. Pins for V DD and GND as well as pins for VDDA and AGND are also available. A small through-hole prototyping area is also provided. All I/O signals routed to connector J1 are also routed to through-hole connection points between J1 and the prototyping area (see Figure3 on page4). Each connection point is labeled indicating the signal available at the connection point. See Table2 for a list of pin descriptions for J1.Table 2. J1 Pin DescriptionsPin #Description Pin #Description Pin #Description1V DD13P1.225AIN32GND14P1.326AIN43P0.015P1.427AIN54P0.116P1.528AIN65P0.217P1.6/IDAC029AIN76P0.318P1.7/IDAC130VREF+7P0.419P2.031/RST8P0.520AGND32VREF–9P0.621AGND33VDDA10P0.722AIN034AGND11P1.023AIN1--P1.124AIN2--4.4. Target Board DEBUG Interface (J4)The DEBUG connector (J4) provides access to the DEBUG (C2) pins of the C8051F350. It is used to connect the Serial Adapter or the USB Debug Adapter to the target board for in-circuit debugging and Flash programming. Table3 shows the DEBUG pin definitions.Table 3. DEBUG Connector Pin DescriptionsPin #Description1+3VD(+3.3VDC)2, 3, 9GND (Ground)4C2D5/RST(Reset)6P3.07C2CK8Not Connected10USB Power4.5. Serial Interface (J5)A RS232 transceiver circuit and DB-9 (J5) connector are provided on the target board to facilitate serial connections to UART0 of the C8051F350. The TX, RX, RTS and CTS signals of UART0 may be connected to the DB-9 connector and transceiver by installing shorting blocks on header J3.J3[7–8]- Install shorting block to connect UART0 TX (P0.4) to transceiver.J3[9–10]- Install shorting block to connect UART0 RX (P0.5) to transceiver.J3[11–12]- Install shorting block to connect UART0 RTS (P1.4) to transceiver.J3[13–14]- Install shorting block to connect UART0 CTS (P1.5) to transceiver.C8051F35x-DK4.6. Analog I/O (J6)Many of the C8051F350 target device’s port pins are connected to the J6 terminal block. Connections for VDDA, AGND, ADC external voltage references, IDAC outputs and ADC inputs are available. Refer to Table4 for the J6 terminal block connections.Table 4. J6 Terminal Block Pin DescriptionsPin #Description Pin #Description1IDAC08AIN32IDAC19AIN43VREF+10AIN54VREF–11AIN65AIN012AIN76AIN113AGND7AIN214VDDA4.7. IDAC Connectors (J7, J11)The C8051F350 target board also features two Current-to-Voltage 1K load resistors that may be connected to the 10-bit current-mode Digital-to-Analog Converters (IDACs) on port pins P1.6 and P1.7. Install a shorting block on J7 to connect the IDAC0/P1.6 pin of the target device to a load resistor. Install a second shorting block on J11 to connect the IDAC1/P1.7 pin of the target device to a load resistor. The IDAC signals are then routed to the J1 and J6 connectors.4.8. USB Debug Adapter Target Board Power Connector (J8)The USB Debug Adapter includes a connection to provide power to the target board. This connection is routed from J4[10] to J8[1]. Place a shorting block at header J8[2-3] to power the board directly from an ac/dc power adapter. Place a shorting block at header J8[1-2] to power the board from the USB Debug Adapter. Please note that the second option is not supported with either the EC1 or EC2 Serial Adapters.4.9. Thermistor Connector Block (J12)A thermistor circuit is included on the board which allows for a ratiometric measurement of the included thermistor. To use the circuit, remove the shorting blocks on the IDAC headers (J7, J11) and the External Voltage Reference headers (J13, J14). Next, connect all of the signals on the thermistor connector block (J12). Software on the chip can be written to use IDAC0 as a reference current source for the circuit. The current creates a voltage across R27 which is used as an external Voltage Reference input, while the voltage across the thermistor (R26) can be measured by connecting AIN0.0 to the AIN+ ADC input, and AIN0.1 to the AIN- ADC input.4.10. External Voltage Reference (J13, J14)A precision 2.5V voltage reference source is also included on the C8051F350 target board. To use this circuit as a reference source for the ADC, place shorting block on headers J13 and J14. Note that software on the device should be configured to use an external reference when using this configuration. When using the internal (on-chip) reference source, headers J13 and J14 should be left open.C8051F35x-DKC8051F35x-DKC8051F35x-DKD OCUMENT C HANGE L ISTRevision 0.1 to Revision 0.2⏹Section 1, added USB Debug Adapter and USBCable.⏹Section 2, changed name from "Hardware Setup" to"Hardware Setup using an EC2 Serial Adapter".⏹Section 2, added 2 Notes bullets.⏹Section 2, removed Note from bottom of page.⏹Added Section 3, "Hardware Setup using a USBDebug Adapter".⏹Section 5.4.2, changed step 2 to include newinstructions.⏹Section 7, J4, changed "Serial Adapter" to "DebugAdapter".⏹Target Board DEBUG Interface Section, added USBDebug Adapter.⏹DEBUG Connector Pin Descriptions Table, changedpin 4 to C2D.⏹Changed "jumper" to "header".⏹EC2 Serial Adapter section, added EC2 to thesection title, table title and figure title.⏹EC2 Serial Adapter section, changed "JTAG" to"DEBUG".⏹Added "USB Debug Adapter" section.⏹Section 7, J8, changed "Serial Adapter" to "USBDebug Adapter"⏹DEBUG Connector Pin Descriptions Table, changedpin 10 to USB Power⏹USB Debug Adapter Target Board Power Connector(J8) Section, changed "Serial" to "USB Debug" Revision 0.2 to Revision 0.3⏹Removed EC2 Serial Adapter from Kit Contents.⏹Removed Section 2. Hardware Setup using an EC2Serial Adapter. See RS232 Serial Adapter (EC2)User's Guide.⏹Removed Section 8. EC2 Serial Adapter. SeeRS232 Serial Adapter (EC2) User's Guide.⏹Removed Section 9. USB Debug Adapter. See USBDebug Adapter User's Guide.Revision 0.3 to Revision 0.4⏹Updated "Software Setup‚" on page 2.DisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders. Silicon Laboratories Inc.400 West Cesar ChavezAustin, TX 78701USAIoT Portfolio/IoT SW/HW /simplicity Quality /quality Support and Community 。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
200 ksps
32引
-
√ √ 2 - 脚,
9x9,
LQFP
28引
-
√ √ 2 - 脚,
5x5,
QFN
48引
-
√ √ 2 - 脚,
9x9,
TQFP
/Left_Column/detail/C8051F_51_Device.asp
1/31/2013
C8051F 51 单片机 选型列表
Page 1 of 3
C8051F 51 单片机 选型列表
Precision Mixed-Signal
型号 C8051F005 C8051F007 C8051F020 C8051F021 C8051F022 C8051F023 C8051F040 C8051F060
C8051F 51 单片机 选型列表
Page 3 of 3
C8051F410 50 32 kB 2304 -
UART, 24 SMBus, 4
SPI
6
±2%
12位, 24通 道,
-
32引
12位, √ 2通道
√
2
VREG, 脚, smaRTClock 9x9,
200
LQFP
ksps
USB MCUs
型号 C8051F320 C8051F321 C8051F340
100引
-
脚,
16x16,
TQFP
10位, 8位, ±20% 8通道, 8通道, 12位, √ √ 2
100 500 2通道
ksps ksps
64引
-
脚,
12x12,
TQFP
±2%
12位, 13通 道,
8位, 8通道,
500
12位, 2通道
√
√
100引
3
±60 V 脚, PGA 16x16,
100 ksps
5
±2% 道,
-
200
ksps
-
√-2
-
√-2
5 ±2% -
-
-
- -2
10位,
13通
5
±2% 道,
-
200
ksps
-
√-2
10位,
3
16通 ±2% 道,
-
10位, √ √ 1通道
1
200
ksps
其他 -
封装
48引 脚, 9x9, TQFP
48引 脚, 9x9, TQFP 11引 脚, 3x3, QFN 11引 脚, 3x3, QFN
5
5
SPI
25 64 kB 4352
25 64 kB 4352
MIPS Flash RAM (峰值) (bytes) (bytes)
CAN
2.0B,
√
64
2 UARTs,
5
SMBus,
SPI
CAN
2.0B,
√
59
2 UARTs,
5
SMBus,
SPI
外部 存储
器 接口
数字端 口
I/O 引 脚
串行 总线
1/31/2013
C8051F 51 单片机 选型列表
Page 2 of 3
C8051F130 100 128 kB 8448 √
C8051F350 50 8 kB 768
-
C8051F352 50 8 kB 768
-
SPI
2
64
UARTs, SMBus,
5
SPI
UART, 17 SMBus, 4
C8051F330 25 8 kB 768
-
UART, 29 SMBus, 4
SPI
UART, 25 SMBus, 4
SPI
UART, 29 SMBus, 4
SPI
UART, 21 SMBus, 4
SPI
UART, 17 SMBus, 4
SPI
10位,
21通
5
±2% 道,
-
200 ksps
10位,
17通
定时 器 (16 位)
6
6
PCA 通道
2
100 128 kB 8448 √
64
UARTs, SMBus,
5
6
SPI
2
100 128 kB 8448 √
32
UARTs, SMBus,
5
6
SPI
2
50 128 kB 8448 √
64
UARTs, SMBus,
56Biblioteka SPI内部 晶振温度
电 压
比较
ADC 1 ADC 2
MIPS (峰值)
Flash (bytes)
RAM (bytes)
外部存
数字端 口
储器 I/O 引
接口 脚
串行 总线
定时 器 (16 位)
USB 2.0,
25 16 kB 2304
-
25
UART, SMBus,
4
SPI
25 16 kB 2304
-
48 64 kB 4352
√
USB 2.0,
21
UART, SMBus,
TQFP
ksps
±2%
16位, 16位, 12位, 1通道, 1通道, 2通道
√
1 Msps 1 Msps
√
10位, 100引
3
8通道, 脚,
200 ksps, DMA
16x16, TQFP
内部 晶振
ADC 1 ADC 2
DAC
温度 传感
器
电 压 基
比较 器
准
其他
封装
12位, 8位,
100引
±2% 8通道, 8通道, 12位, √ 100 500 2通道
-
8
UART, SMBus
3
3 ±2% 8通道, 500
ksps
C8051F304 25 4 kB 256
-
8
UART, SMBus
3
3 ±20% -
-
-
√-1
-
- -1
C8051F310 25 16 kB 1280 -
C8051F311 25 16 kB 1280 C8051F314 25 8 kB 1280 C8051F316 25 16 kB 1280 -
4
SPI
USB 2.0, 2
40 UARTs, 4 SMBus, SPI
PCA 通道
5
5
5
内部 晶振
ADC 1 ADC 2
DAC
温度 电压 比较 传感 基准 器 其他 封装
器
10位,
17通
±1.5% 道,
-
200
ksps
10位,
13通
±1.5% 道,
-
200 ksps
10位,
17通
±1.5% 道,
-
PCA 通道
25
8 kB 1280
-
32
UART, SPI
3
-
内部 晶振
ADC 1 ADC 2 DAC
温度 传感
器
电 压 比较 基器 准
12位,
32通
±20% 道,
-
100 ksps
-
- -2
C8051F236 25
8 kB 1280
-
32
UART, SPI
3
- ±20% -
-
-
- -2
8位,
C8051F300 25 8 kB 256
ksps ksps
100引
-
脚,
16x16,
TQFP
12位, 8位, ±20% 8通道, 8通道, 12位, √ √ 2
100 500 2通道
ksps ksps
64引
-
脚,
12x12,
TQFP
10位, 8位, ±20% 8通道, 8通道, 12位, √ √ 2
100 500 2通道
ksps ksps
32引 脚, 9x9, LQFP
28引 脚, 5x5, QFN
32引 脚, 9x9, LQFP
24引 脚, 4x4, QFN
20引 脚, 4x4, QFN
/Left_Column/detail/C8051F_51_Device.asp
1/31/2013
SPI
UART, 17 SMBus, 4
SPI
100 500 2通道 ksps ksps
16x16, TQFP
10位,
6
±2% 8通道, -
100
ksps
100引
-
√
√
2
16x16 脚, MAC 16x16,
TQFP
3
24位, ±2% 8通道,
-
8位, √ 2通道
√
1
1 ksps
32引
-
脚,
9x9,
ksps ksps
100引
-
脚,
16x16,
TQFP
C8051F126 50 128 kB 8448
√
2 64 UARTs, 5
SMBus,
6
±2% 10位, 8位,
√√2
8通道, 8通道, 12位,
- 100引 脚,
/Left_Column/detail/C8051F_51_Device.asp
DAC
传感 器
基 准
器
其他
封装