PCB常用英语汇总
PCB基本英语
PCB基本英语基本英文词汇流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜 HAL(hot air leveling)喷锡AOI（Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣，去钻污E-Test 电性测试PTH 镀通孔，沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QATin stripping 退锡IPQC(In-process quality control) 流程QC EQC（QC after etching）蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center 文件控制中心2nd Drilling 二钻Routing 锣板，铣板Brown oxidation 棕化Waste water treatment 污水处理V-cut V坑WIP（work in process）半成品Store/stock 仓库(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双面板IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate 燃性等级Characteristic impedance 特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination 离子性污染Acceptance Quality Level (AQL) 允收水平HDI（High density interconnecting）高密度互连板Base Material 基材Radius 半径Capacity 生产能力Diameter 直径Capability 工艺能力PPM(Parts Per Million) 百万分之几CAM（computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格，规范Via 导通孔Dimension 尺寸Buried /blind via 埋/盲孔Tolerance 公差T ooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松香Deburring 去毛刺（沉铜前磨板） Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀，漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径比Water rinsing 水洗Etch Factor 蚀刻因子Transportation 行车Back Light Test 背光测试Rack 挂架Pink ring 粉红圈Maintenance 保养干流程Hole location 孔位Annular ring 孔环Image Transfer 图象转移Component Side(C/S) 元件面Artwork 底片Solder Side(S/S) 焊接面Mylar 胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout 破孔Fiducial mark 基点，对光点 Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PADPre-preg PP片Resin content 树脂含量Kraft Paper 牛皮纸Brown oxidation 棕化Lay up 排版Black Oxidation 黑化Registration 对位Base material 板材Delamination 分层其它Wicking 灯芯效应Hole size 孔径(尺寸) Yield 良品率T ouch Up 修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅比例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)=Printed Circuit Board 电路板=Computer aided manufacture 计算机辅助焊盘ring 焊环=automatic optical inspection 自动光学检测of free 免费=work in process 在线板=document control center 文控中心字符=Component Side =Top Side （顶层）元件面=Solder Side =Bottom Side （底层）焊锡面Plated 电金，镀金Plated 电镍，镀镍Gold 沉金=沉镍金Ink Print 印碳油Report 切片报告，横切面报告=Cross-out 打"X"报告（客户称）拼板，（生产线称）工作板标记，UL 标记code 生产周期单元，单位外形，轮廓By Routing 锣(铣)外形Film 湿菲林,湿绿油,湿膜槽,方坑Material=Base Laminate 基材,板料 =V-score V形槽成品市场部File GERBER文件LOGO UL标记=Electric Open/Short Test 电子测试=Purchase Order 订单公差,Flexible Board 刚性,软性板cut 开料baking 焗板钻孔=Plated Through Hole 镀通孔,沉铜 plating 板面电镀,全板电镀Image 图象,线路图形plating 线路电镀蚀板,蚀刻=Solder Mask 防焊,阻焊,绿油=Solder Resist 防焊,阻焊,绿油finger 金手指丝印字符=HASL=Hot air(Solder)leveling 热风整平喷锡锣板,铣板冲板,啤板=final quality checking 终检,最后检查=final quality audit 最后稽查(抽查)出货松香金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金 free 无铅=compliance of certificate 材料证明书=cross section 微切片,横切片gold 沉镍金=punch die 模具,啤模=manufacture instruction 制作批示=quality assurance 品质保证=computer aided design 计算机辅助设计bit size钻咀直径and twist 板弯和板曲击打,孔数邦定,点焊coupon 测试模块(科邦)copper 抢电流铜皮tab 工艺边away tab 工艺边=ground 地线,大铜皮edge 孔边,孔内hole 邮票孔天坯,型板,钻孔样板(首板)film 干菲林,干膜=liquid photo image 液态感光=湿绿油多层板=surface mouted device 贴片,表面贴装器件=surface mouted technology 表面贴装技术mask=blue gel 蓝胶hole 工艺孔,管位,定位孔,工具孔mask 测光点,光学对位点,对光点,电眼foil 铜箔尺寸负的,positive正的gold 闪镀金,镀薄金department 工程部date 交货期斜边=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
PCB基本英语.
流程Board cut 开料Carbon printing 碳油印刷Inner dry film 内层干膜Peelable blue mask 蓝胶Inner etching 内层蚀刻ENIG(Electroless nickel immersion gold) 沉镍金Inner dry film stripping 内层干膜退膜HAL(hot air leveling) 喷锡AOI（Automatic Optical Inspection）自动光学检测OSP（Organic solderability preservative）有机保焊Pressing 压板Punching 啤板Drilling 钻孔Profiling 外形加工Desmear 除胶渣，去钻污 E-Test 电性测试PTH 镀通孔，沉铜FQC(final quality control) 最终品质控制Panel plating 整板电镀FQA(Final quality audit) 最终品质保证Outer dry film 外层干膜Packing 包装Etching 蚀刻IPQA(In-process quality audit) 流程QA Tin stripping 退锡IPQC(In-process quality control) 流程QC EQC（QC after etching）蚀检QCIQC(Incoming quality control) 来料检查Solder mask 感阻MRB(material review board) 材料评审委员会Component mark 字符QA(Quality assurance) 品质保证Physical Laboratory 物理实验室QC(Quality control) 品质控制Chemistry Laboratory 化学实验室Document control center 文件控制中心2nd Drilling 二钻Routing 锣板，铣板Brown oxidation 棕化Waste water treatment 污水处理V-cut V坑WIP（work in process）半成品Store/stock 仓库 F.G(Finished goods) 成品概述Printed Circuit Board 印制电路板Flexible Printed Circuit, FPC 软板Double-Side Printed Board 双面板IPC（The Institute for Interconnecting and Packing Electronic Circuits）电子电路互连与封装协会CPAR（Corrective & Preventive Action Request）要求纠正预防措施Flammability Rate燃性等级Characteristic impedance 特性阻抗BUM（Build-up multilayer）积层多层板Date Code周期代码CCL（Copper-clad laminate）覆铜板Ionic contamination 离子性污染Acceptance Quality Level (AQL)允收水平HDI（High density interconnecting）高密度互连板Base Material基材Radius 半径Capacity 生产能力Diameter 直径Capability 工艺能力PPM(Parts Per Million) 百万分之几CAM（computer-aided manufacturing) 计算机辅助制造Underwriters Laboratories Inc. 美国保险商实验所CAD (computer-aided design) 计算机辅助设计Statistical Process Control 统计过程控制Specification 规格，规范Via 导通孔Dimension 尺寸Buried /blind via 埋/盲孔Tolerance 公差Tooling hole 定位孔Oven 焗炉Output/throughput 产量湿流程PTH（plated through hole）镀通孔（俗称沉铜）Acid cleaning 酸性除油PP(Panel Plating) 板电Acid dip 酸洗Pattern plating 图电Pre-dip 预浸Line width 线宽Alkaline cleaning 碱性除油Spacing 线隙Flux 松香Deburring 去毛刺（沉铜前磨板）Hot air leveling 喷锡Carbon treatment 碳处理Skip plating 跳镀，漏镀Track/conductor 导线Undercut 侧蚀Aspect ratio深径比Water rinsing水洗Etch Factor 蚀刻因子Transportation 行车Back Light Test背光测试Rack挂架Pink ring粉红圈Maintenance 保养干流程Hole location孔位Annular ring 孔环Image Transfer图象转移Component Side(C/S) 元件面Artwork 底片Solder Side(S/S) 焊接面Mylar 胶片Matte Solder Mask 哑绿油Silkscreen/legend/Component Mark文字Hole breakout 破孔Fiducial mark 基点，对光点Scrubbing 磨板Expose 曝光Developing 显影内层制作Core material 内层芯板Thermal pad 散热PAD Pre-preg PP片Resin content 树脂含量Kraft Paper牛皮纸Brown oxidation 棕化Lay up 排版Black Oxidation 黑化Registration 对位Base material 板材Delamination 分层其它Wicking灯芯效应Hole size 孔径(尺寸) Yield良品率Touch Up修理Warp and Twist 板曲度Solvent Test 溶剂测试Peel off 剥离Company Logo 公司标识Tape Test 胶纸试验UL Mark UL 标记Cosmetic 外观Function 功能Tin/Lead Ratio 锡/铅比例Reliability Tests 可靠性试验Hole Wall Roughness 孔壁粗糙度Base Copper Thickness 底铜厚度PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打"X"报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
PCB专业英译术语
PCB专业英译术语PCB（Printed Circuit Board，印刷电路板）是现代电子产品中最常用的一种重要的电路载体，其设计、生产和维修需要大量的技术术语支持。
本文将重点介绍PCB专业英译术语。
一、PCB基础术语1. PCB（Printed Circuit Board）：印刷电路板2. SMT（Surface Mount Technology）：表面贴装技术3. Through-hole Technology：通孔技术4. PTH（Plated Through Hole）：贯穿电解孔5. FR4：一种常用的印刷电路板基材材料，即玻璃纤维材料，通常由环氧树脂和玻璃纤维材料构成6. Pad：焊盘7. Trace：线路8. Via：垂直插孔9. Gerber file：Gerber文件格式，一种电路板设计文件格式10. BOM（Bill of Materials）：物料清单11. NC（Numerical Control）：数控12. DFM（Design for Manufacturability）：可制造性设计二、PCB制造过程相关术语1. CAM（Computer Aided Manufacturing）：计算机辅助制造2. Etch：蚀刻3. Silkscreen：丝网印刷4. Solder mask：焊盘油墨5. Plating：电镀6. HASL（Hot Air Solder Leveling）：热风焊盘处理7. OSP（Organic Solderability Preservatives）：有机可焊保护剂8. Gold Fingers：金手指，指电子产品中可进行插拔操作的特殊金属触点9. DIP（Dual In-line Package）：双列直插封装10. SOP（Small Outline Package）：小封装11. QFN（Quad Flat Package）：四角平封12. BGA（Ball Grid Array）：球网阵列13. PCBA（Printed Circuit Board Assembly）：印刷电路板装配三、PCB测试和维修相关术语1. AOI（Automated Optical Inspection）：自动光学检测2. X-ray Inspection：X光检测3. ICT（In-Circuit Test）：在线测试4. FCT（Functional Circuit Test）：功能测试5. Test point：测试点6. Defect：缺陷7. Repair：修复8. Rework：返工9. Troubleshooting：故障排除四、PCB设计相关术语1. EDA（Electronic Design Automation）：电子设计自动化2. Netlist：网表3. DRC（Design Rule Check）：设计规则检查4. DFM（Design for Manufacturing）：可制造性设计5. Gerber data：Gerber数据6. Simulation：仿真7. Library：元件库8. Footprint：封装9. Copper pour：铜质填充10. Via tenting：垂直插孔塞堵11. Blind vias：盲孔12. Buried vias：穿过孔五、总结本文介绍了PCB专业英译术语中的基础术语、PCB制造过程相关术语、PCB测试和维修相关术语以及PCB设计相关术语。
PCB工程部专业英语词汇
PCB工程部专业英文词汇31.小于3millessthan3mil32.高于3milmorethan3mil词汇33.压合结构stackingstructure或者stack_up1.板料:material34.附件：attachedfile2.最低限度:minimum或者min.35.样品：sample3.最大限度:maximum或者max.36.文档：Document4.基准点(零点)datumpoint37.答复：answer;reply5.周期Datecode38.规格：spec6.V-cut余厚V-cutremainthickness39.与...同样的：thesameas7.抢电铜皮（假铜）dummycopper40.前版本：previousversion(oldversion)8.实物板actualboard41.生产：production9.外形及尺寸错误dimensionerror42.确认：confirm10.异常情形errordatafile43.再次确认：confirmagain11.焊锡面与零件面对位偏差misregistration44.工程问题：engineeringquery（EQ）12.孔塞plughole45.尽快：assoonaspossible13.要求requirement46.生产文件：productionGerber14.缺少miss47.联系某人：contactsomebody15.偏公差uneventolerance48.提交样板：submitsample16.补偿compensation49.交货期：deliverydate17.表面处理surfacetreatment50.电测成本：ET（electricaltest）cost18.无铅喷锡LeadfreeHAL51.通断测试：Openandshorttesting19.金手指斜边bevelofG/F52.参考：referto20.制程能力processcapability53.IPC标准：IPCstandard21.建议,暗示suggest54.IPC二级：IPCclass222.确保ensure55.可接受的：acceptable23.满足,达到meet56.允许：permit24.为了inorderto57.制造：manufacture或者fabricate25.交货期deliverydate58.修改：revision26.绿油桥soldermaskbridge或者soldermaskdam59.公差：tolerance27.根据accordingto60.忽略：ignore28.单边3milperside3mil61.工具孔：toolinghole29.直径diameter62.安装孔：mountinghole30.半径radius63.元件孔：componenthole133.槽孔：slothole97.单面开窗：singlesidemaskopening34.邮票孔：snapoffhole或者stamphole98.补油：touchupsoldermask35.导通孔：viahole99.补线：trackwelds36.盲孔：blindviahole100.毛刺：burrs37.埋孔：buriedviahole101.去毛刺：deburr38.金属化孔：PTH(platedthroughhole)102.镀层厚度：platingthickness39.非金属化孔：NPTH(noplatedthroughhole)103.清洁度：cleanliness40.孔位：holelocation104.离子污染：ioniccontamination41.避免：avoid105.阻燃性等级：flammabilityretardantrating42.原设计：originaldesign106.黑化：blackoxidation43.修改：modify107.棕化：brownoxidation44.按原设计：followuporiginaldesign108.红化：redoxidation45.附边：wastetab,wastearea或者breakawaytab109.可焊性不良：poorsolderability46.铜条：copperstrip110.焊料：solder47.拼板：paneldrawing111.包装：packaging48.板厚：boardthickness112.角标：cornermark49.删除：remove(delete)113.特性阻抗：characteristicimpedance50.削铜：shavethecopper114.正像：positive51.露铜：copperexposure或者exposedcopper115.负片：negative52.光标点:fiducialmark116.镜像：mirror53.不同：bedifferentfrom(differfrom)117.线宽：linewidth或者tracewidth54.内弧：insideradius118.线距：linespacing或者tracespacing55.焊环：annularring119.做样：buildsample56.单板尺寸：singlesize120.按照：accordingto57.拼板尺寸：panelsize121.成品：finished58.铣,锣：routing122.做变更：makethechange59.铣刀：router或者Routingbit123.相类似：similarto60.楔形掏槽V-cut或者Vscoring124.规格：specification92.哑光：matt125.下移：shiftdown26.光亮的：glossy126.垂直地：vertically27.锡珠：solderball(solderplugs)127.水平的：horizontally28.阻焊：soldermask(solderresist)128.增大：increase29.阻焊开窗：soldermaskopening129.缩小：decrease2WORD格式61.表面处理：SurfaceFinishing163.刚性板：rigidboard62.波峰焊：wavesolder164.挠性板：flexibleboard63.钻孔数据：drillingdata165.刚挠板：flex-rigidboard64.标记：Logo166.铣：CNC(mill,routing)65.Ul标记：ULlogo,或者UlMarking167.冲：punching66.蚀刻标记：etchedmarking168.倒角：beveling67.周期：datecode169.斜面：chamfer68.翘曲：bowandtwist170.倒圆角：fillet69.外层：outerlayer或者externallayer171.尺寸：dimension70.内层：innerlayer或者internallayer172.材料：material71.顶层：toplayer173.介电常数：Dielectricconstant72.底层：bottomlayer174.菲林：film73.元件面：componentside175.成像：Imaging74.焊接面：solderside176.板镀：PanelPlating75.阻焊层：soldermasklayer177.图镀：PatternPlating76.字符层：legendlayer(silkscreenlayeroroverlayer)178.后清洗：FinalCleaning77.兰胶层：peelableSMlayer179.叠层：stackingstructure(stack-up)78.贴片层：pastemasklayer180.污染焊盘：contaminatepad79.碳油层：carbonlayer181.分孔图：drillchart或者drillmap80.外形层：outlinelayer(profilelayer)182.度数：degree81.白油：whiteink183.被⋯覆盖：becoveredwith82.绿油：greenink184.负公差：minustolerance83.喷锡：hotairleveling(HAL)185.标靶盘：targetpad84.电金,水金：flashgold186.外形公差：routingtolerance85.插头镀金：platedgoldedge-boardcontacts187.芯板：core86.金手指：Gold-finger188.半固化片Prepreg87.防氧化：Entek(OSP)189.阻抗线：impedancetrace88.沉金：Immersiongold(chem.Gold)190.评估e stimate89.沉锡：ImmersionTin(chem.Tin)191.玻纤显露FiberExposure90.沉银：ImmersionSilver(chem.silver)192.底铜b asecopper91.单面板：singlesidedboard193.工作搞workingGerber92.双面板：doublesidedboard194.原稿originalartwork93.多层板：multilayerboard195.放宽r elaxWORD格式94.挖空blanking或者cut-out229.树脂含量resincontent95.一般性阻焊油墨generalresistink230.排列电阻resistornetwork96.孔位错误misholelocation231.锣刀（铣刀）routingbit97.压合周期presscycle232.孔内沾文字S/Lonhole98.毛边serratededges233.孔内绿漆S/Monhole99.跳印skipprinting234.线路沾锡solderontrace100.气泡blistering235.金手指沾锡solderonG/F101.隔离焊盘isolatedpad236.废框scrap102.泪滴teardrops237.封孔处理sealing103.箭头arrows238.间距不足spacingnon-enough104.加大Enlarge239.靶位孔targethole105.压合周期presscycle240.测试线路testcircuit106.毛边serratededges241.热应力试验thermalstress107.跳印,漏印skipprinting242.厚度分布thicknessdistribution108.宽度与厚度的比值width-to-thicknessratio243.薄基板,内层板thincore109.调整adjust244.线路缺口及针孔tracknick&pinhole110.铜箔基板coppercladedlaminates245.裁切线trimline111.线路露铜copperexposure246.真平整trueleveling112.孔内异物dirtyhole247.真正位置的孔trueposition113.椭圆形ellipticalset248.万用型universal114.纤维突出fiberprotrusion249.气化室vaporizer115.填充料filler250.仓库warehouse116.互相连通interconnection251.契尖角wedgeangle117.改善方案implementation252.线细widthreduce118.板料使用率materialusefactor253.良率yield119.回路,网络network254.渗铜,渗入,灯芯效应wicking120.缺口nick255.允收acceptable121.氧化oxidation256.试样点couponlocation122.剥离(剥落)peelingoff257.经核准的，被认可的approved123.补线不良poortouch-up258.超越胜过,超过其他exceed124.品质等级qualityclassification259.牛皮纸kraftpaper125.对位孔registration260.孔壁破铜Holevoid126.拒收rejectable261.孔位破出HolebreakoutWORD格式PCB生产—经典流程—英文培训教程d-8铣靶(spotface)d-9去溢胶(resinflushremoval)E.减铜(CopperReduction)A.开料(CutLamination)e-1薄化铜(CopperReduction)a-1裁板(SheetsCutting)F.电镀(HorizontalElectrolyticPlating)a-2原物料发料(Panel)(ShearmaterialtoSize)f-1水平电镀(HorizontalElectro-Plating)(PanelPlating) B.钻孔(Drilling)f-2锡铅电镀(Tin-LeadPlating)(PatternPlating)b-1内钻(InnerLayerDrilling)f-3低于1mil(Lessthan1milThickness)b-2一次孔(OuterLayerDrilling)f-4高于1mil(Morethan1milThickness)b-3二次孔(2ndDrilling)f-5砂带研磨(BeltSanding)b-4雷射钻孔(LaserDrilling)(LaserAblation)f-6剥锡铅(Tin-LeadStripping)b-5盲(埋)孔钻孔(Blind&BuriedHoleDrilling)f-7微切片(Microsection)C.干膜制程(PhotoProcess(D/F))G.塞孔(PlugHole)c-1前处理(Pretreatment)g-1印刷(InkPrint)c-2压膜(DryFilmLamination)g-2预烤(Precure)c-3曝光(Exposure)g-3表面刷磨(Scrub)c-4显影(Developing)g-4后烘烤(Postcure)c-5蚀铜(Etching)H.防焊(绿漆/绿油):(SolderMask)c-6去膜(Stripping)h-1C面印刷(PrintingTopSide)c-7初检(Touch-up)h-2S面印刷(PrintingBottomSide)c-8化学前处理,化学研磨(ChemicalMilling)h-3静电喷涂(SprayCoating)WORD格式h-4前处理(Pretreatment)c-10显影(Developing)h-5预烤(Precure)c-11去膜(Stripping)h-6曝光(Exposure)Developing,Etching&Stripping(DES)h-7显影(Develop)D.压合Laminationh-8后烘烤(Postcure)d-1黑化(BlackOxideTreatment)h-9UV烘烤(UVCure)d-2微蚀(Microetching)h-10文字印刷(PrintingofLegend)d-3铆钉组合(eyelet)h-11喷砂(Pumice)(WetBlasting)d-4叠板(Layup)h-12印可剥离防焊(PeelableSolderMask)d-5压合(Lamination)I.镀金Goldplatingd-6后处理(PostTreatment)i-1金手指镀镍金(GoldFinger)d-7黑氧化(BlackOxideRemoval)i-2电镀软金(SoftNi/AuPlating)5WORD格式i-3浸镍金(ImmersionNi/Au)(ElectrolessNi/Au)N-5AOI检查及VRS(AOIInspection&Verified&Repaired) J.喷锡(HotAirSolderLeveling)N-6BlaserAOI(afterDesmearandMicroetching)j-1水平喷锡(HorizontalHotAirSolderLeveling)N-7除胶渣(Desmear)j-2垂直喷锡(VerticalHotAirSolderLeveling)N-8微蚀(Microetching)j-3超级焊锡(SuperSolder)j-4.印焊锡突点(SolderBump)K.成型(Profile)(Form)k-1捞型(N/CRouting)(Milling)k-2模具冲(Punch)k-3板面清洗烘烤(Cleaning&Backing)k-4V型槽(V-Cut)(V-Scoring)k-5金手指斜边(BevelingofG/F)L.开短路测试(ElectricalTesting)(Continuity&InsulationTesting)l-1AOI光学检查(AOIInspection)l-2VRS目检(Verified&Repaired)l-3泛用型治具测试(UniversalTester)l-4专用治具测试(DedicatedTester)l-5飞针测试(FlyingProbe)M.终检(FinalVisualInspection)m-1压板翘(WarpageRemove)m-2X-OUT印刷(X-OutMarking)m-3包装及出货(Packing&shipping)m-4目检(VisualInspection)m-5清洗及烘烤(FinalClean&Baking)m-6护铜剂(ENTEKCu-106A)(OSP)m-7离子残余量测试(IonicContaminationTest)(CleanlinessTest)m-8冷热冲击试验(ThermalcyclingTesting)m-9焊锡性试验(SolderabilityTesting)N.雷射钻孔(LaserAblation)N-1雷射钻Tooling孔(LaserablationToolingHole)N-2雷射曝光对位孔(LaserAblationRegistrationHole)N-3雷射Mask制作(LaserMask)N-4雷射钻孔(LaserAblation)。
pcb常用英语
是指用以制造电路板的基材板,简称基板.基板的构造是 由树脂,玻纤布,玻纤席,或白牛皮纸所组成的胶片(Prepreg) 做为黏合剂层.即将多张胶片与外覆铜箔先经叠合,再於高 温高压中压合而成的复合板材.其正式学名称为铜 箔基板 CCL(Copper Claded Laminates). y Up 叠合 多层板或基板在压合前,需将内层板,胶片与铜皮等各种 散材与钢板,牛皮纸垫料等,完成上下对准,落齐,或套准之 工作,以备便能小心送入压合机进行热压.这种事前的准备 工作称为 Lay Up. 39.Legend 文字标记,符号 指电路板成品表面所加印的文字符号或数字,是用以指 示组装或换修各种零件的位置. 40.Measling 白点 按 IPC-T-50E 的解释是指电路板基材的玻纤布中,其经 纬纱交纤点处,与树脂间发生局部性的分离.其发生的原因 可能是板材遭遇高温,而出现应力拉扯所致.不过 FR-4 的板 材一旦被游离氟的化学品(如氟硼酸)渗入,而使玻璃受到较 严重的攻击时,将会在各交织上呈现规则性的白点,皆称为 Measling.
成分母,所得百分比即为尺度安定性的表徵,俗称"尺寸安 定性". 25.Drum Side 铜箔光面 电镀铜箔是在硫酸铜液中以高电流密度(约 1000ASF),於 不锈钢阴极轮(Drum)光滑的"钛质胴面"上镀出铜箔,经撕 下后的铜箔会有面向镀液的粗糙毛面,及紧贴轮体的光滑胴 面,后者即称为"Drum Side". 26.Dry Film 干膜 是一种做为电路板影像转移用的乾性感光薄膜阻剂,另 有 PE 及 PET 两层皮膜将之夹心保护.现场施工时可将 PE 的 隔离层撕掉,让中间的感光阻剂膜压贴在板子的铜面上,在 经过底片感光后即可再撕掉 PET 的表护膜,进行冲洗显像而 形成线路图形的局部阻剂,进而可再执行蚀刻(内层)或电镀 (外层)制程,最后在蚀铜及剥膜后,即得到有裸铜线路的板 面. 27.Electrodeposition 电镀 在含金属离子的电镀液中施加直流电,使在阴极上可镀 出金属来.此词另有同义字 Electroplating,或简称为 plating.更正式的说法则是 electrol ytic plating.是一种 经验多於学理的加工技术.
PCB常用英语汇总
PCB及PCBA常用英语汇总(4)1 内层开路 Inner open2 内层断路 Inner short3 外层开路 Outer open4 外层断路 Outer short5 内层蚀刻过度 Inner over ecthing6 外层蚀刻过度 Outer over ecthing7 内层树脂气泡 Resin void8 内层杂物 Foreign material9 内层图形移位 Inner pattern mis-registration10 层与层移位 Layer to layer mis-registration11 打孔不良 Improper targeting12 内层蚀刻不净 Inner under etching13 露布纹 Weave texture/exposure14 檫花（氧化膜面） Scratch(Oxide surface)15 板损坏 Damaged board16 分层（物料） Delamination (Raw material)17 内层不配套 Excessive inner core18 板过厚 Over thickness19 白点（压板） Measling (Pressing)20 白点（喷锡） Measling (HSAL)21 板曲 Warpage22 板焦黄 Burnt23 起皱 Wrinkle24 起泡（压板） Blistering (Pressing)25 镀层起泡 Blistering (Cu plating)26 喷锡起泡 Blistering (HSAL)27 板面凹痕 DENT (Pressing profilling G/F)28 白斑 Crazing29 胶渣 Gum residue30 孔未穿 Incomplete drilling31 披锋 Burr32 多孔 Extra hole33 偏孔 Hole shift34 孔径大 Hole oversize35 孔径小 Hole undersize36 少孔 Missing Hole37 塞孔 Block hole38 崩孔 Hole breakout39 孔粗糙(镀铜） Hole roughness（Cu plating)40 孔粗糙（机械钻孔） Hole roughness(mechanicaldrill)41 崩线、线路缺口 Nick / void on trace42 缺口 Nick / void on pad43 曝光过度 Over-exposure44 曝光不良 Under exposure45 显影不足 Under develop46 干膜脱落 D/F Peel off47 干膜碎 D/F Rdsidue48 干膜移位 D/F Mis-registration49 标志不清（曝光） Illegible marking (exposure)50 错菲林 Wrong A/W51 非镀铜孔有铜 Copper in NPTH52 镀铜孔内无铜 No copper in PTH53 渗镀 Nickel smear54 电镀粗糙 Rough plating。
PCB英文术语整理
b/電路板朮語總整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗. Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應. Accelerator 加速劑,速化劑. Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔. Accuracy准確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂). Actinic Light (or Intensity, or Ra有效光.Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑. Adhesive膠類或接著劑.Admittance導納(阻抗的倒數). Aerosol噴霧劑,氣熔膠,氣懸體. Aging老化.Air Inclusion氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑. Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度. Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的. Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗. Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準. Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器. Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備. Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳. Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角. Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝). Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝. Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則 Be=145-(1凡液體比重比水輕則 Be=140÷(Sp.Gr-13*Sp.Gr 為比重即同體勣物質對"純水"1g/ Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射.Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖 .Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條).在425℃~870℃下進行熔接的方式). Break Point顯像點.Break-away Panel可斷開板.Breakdown Voltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stage B階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process击塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar勤電杆.Butter Coat 外表樹脂層.*****C*****C4 Chip Joint C4晶片焊接. Cable電纜.CAD電腦輔助設計. Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法. Capacitance電容.Capacitive Coupling電容耦合. Capillary Action毛細作用. Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理. Card卡板.Card Cages/Card Racks電路板搆裝箱. Carlson Pin卡氏定位稍. Carrier載體.Cartridge濾心. Castallation堡型勣體電路器. Catalyzed Board, Catalyzed Subs催化板材. Catalyzing催化.Cathode陰極.Cation陰向離子, 陽离子. Caul Plate隔板.Cavitation空泡化 半真空. Center-to-Center Spacing中心間距. Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物. Chamfer倒角. Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨. Chemical Resistance抗化性. Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG). Chisel鑽針的尖部. Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室. Cleanliness清潔度.Clearance余地,余環. Clinched Lead Terminal緊箝式引腳. Clinched-wire Through Connecti通孔彎線連接法 . Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線. Coefficient of Thermal Expansion熱膨脹系數.Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM-1,CEM-3)復合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性. Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠. Controlled Depth Drilling定深鑽孔.Conversion Coating 轉化皮膜.Coplanarity共面性.Copolymer共聚物. Copper Foil銅皮.Copper Mirror Test銅鏡試驗. Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材. Corner Crack 通孔斷角. Corner Mark板角標記. Counterboring方型擴孔. Countersinking錐型擴孔. Coupling Agent 偶合劑. Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變. Crossection Area截面積. Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交. Crosstalk雜訊, 串訊. Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化. Current Density電流密度. Current-Carrying Capability載流能力.Curtain Coating濂塗法.*****D*****Daisy Chained Design菊瓣設計.Datum Reference基准參考.Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單定義9000米紗束所具有的重量(以克米計Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像 .Deviation偏差.Device電子元件.Dewetting縮錫.D-glass D玻璃.Diaze Film偶氮棕片. Dichromate重鉻 酸鹽.Dicing晶片分割. Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown Voltage介質崩潰電壓. Dielectric Constant介質常數.Dielectric Strength介質強度.微差掃瞄熱卡分析法. Differential Scanning CalorimetryDiffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角. Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體. Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜. Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板. Dish Down碟型下陷.Dispersant分散劑. Dissipation Factor散失因素. Disspation Factor散逸因子. Disturbed Joint受擾焊點. Doctor Blade修平刀,刮平刀. Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔. Drag In / Drag Out帶[進/帶出. Drag Soldering拖焊. Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削面. Drill Pointer鑽針重磨機. Drilled Blank已鑽孔的裸板. Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接. Ductility展性.Dummy Land假焊墊. Dummy, Dummying假鍍(片). Durometer橡膠硬度計. DYCOstrate電漿蝕孔增層法. Dynamic Flex(FPC)動態軟板.*****E*****E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器. Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試. EDTA乙二胺四乙酸. Effluent排放物.E-glass電子級玻璃. Elastomer彈性體.Electric Strength(耐)電性強度. Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅.. Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動, 電滲. Electro-tinning鍍錫.Electro-Winning電解冶煉. Elongation 延伸性, 延伸率. Embossing击出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interferenc電磁干擾. Emulsion乳化.Emulsion Side藥膜面. Encapsulating膠囊. Encroachment沾污,侵犯.End Tap封頭.Entek有機護銅處理. Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液). Etchback回蝕.Etching Indicator蝕刻指標.Etching Resist蝕刻阻劑.Eutetic Composition共融組成. Exotherm放熱(曲線). Exposure曝光.Eyelet鉚眼.*****F*****Fabric綱布.Face Bonding反面朝下結合. Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線. Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基准記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細線.Fine Pitch密腳距,密線距,密墊距. Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法.First Article首產品.First Pass-Yield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件). Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數, 抗撓性模數 . Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering (Wave Soldering流焊.Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 , 貼平式 導體. Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所復合成的材料. Gage, Gauge量規.Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線圖形與孔位,所發展一系列完整的軟體檔Ghost Image陰影.Gilding鍍金 (現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, 玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標准格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環.Guide Pin導針.Gull /Wing Lead鷗翼引腳.*****H*****Halation環暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名. Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air F高效空氣塵粒過瀘機.Hipot Test 高壓電測.Hi-Rel高度靠度.Hit 擊(鑽孔時鑽針每一次"刺下"的動作). Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔准備.Hole Pull Strength孔壁強度.Hole Void破洞.Hook 切削刀緣外击.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongati高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.H ydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*****I*****I.C. Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.InterFace介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內應力.Interposer互邊導電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization Voltage (Corona Leve電離化電壓(電纜內部狹縫空氣中,引起電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.*****J*****JEDEC(Joint Electronic Device 聯合電子元件工程委員會. Engineering Council)J-Lead J型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*****K*****Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結搆.Laminate Void板材空洞. Laminate(s)基板.Lamination Void壓合空洞. Laminator壓膜機.Land孔環焊墊,表面焊墊. Landless Hole無環通孔.Laser Direct Imaging (LDI)雷射直接成像. Laser Maching雷射加工法.雷射曝光機.Laser Photogenerator(LPG), LaseLaser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出. Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起. Ligand錯離子附屬體. Light Emitting Diodes (LED)發光二極體.Light Integrator光能累積器.Light Intensity光強度.Limiting Current Density極限電流密度. Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態介質.液態感光防焊綠漆.Liquid Photoimagible Solder MasLocal Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*****M*****Macro-Throwing Power巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面). Mealing泡點.Mean Time To Failure (MTTF)故障前可用之平均時數.Measling白點.Mechanical Stretcher機械式張網機.Mechanical Warp機械式纏繞. Mechanism機理.Membrane Switch薄膜開關. Meniscograph Test弧面狀沾錫試驗. Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈. Metallization金屬 化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子. Microetching微蝕. Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線. Microthrowing Power微分布力. Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向. Misregistration 對不准度.Mixed Componmt Mounting Tec混合零件之組裝技術. Modem調變及解調器.Modification修改.Module模組.Modulus of Elasticity彈性系數.溼氣與絕緣電阻試驗.Moisture and Insulation ResistancMold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口). Multi-Chip-Module(MCM)多晶片芯片模組.復線板.Multiwiring Board (or Discrete W*****N*****N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄. Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤. Nomencleature標示文字符號. Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊. Non-flammable非燃性.Non-wetting不沾錫.標準濃度,當量濃度. Normal Concentration (Strength)Normal Distribution常態分布.Novolac酯醛樹脂. Nucleation , Nucleating核化.Numerical Control數值控制.Nylon尼龍.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均. OFHC(Oxyen Free High Conduc無氧高導電銅. Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合. Oligomer寡聚物.Omega Meter離子污染檢測儀. Omega Wave振盪波.On-Contact Printing密貼式印刷. Opaquer不透明劑,遮光劑. Open Circuits斷線.Optical Comparater光學對比器(光學放大器.) Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservativ有機保焊劑.Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離. Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.Pads Only Board唯墊板.Palladium鈀.Panel制程板.Panel Plating全板鍍銅.Panel Process全板電鍍法.Paper Phenolic紙質酚醛樹脂(板材). Parting Agent脫膜劑.Passivation鈍化 ,鈍化外理.Passive Device (Component)被動元件(零件)Paste膏,糊.Pattern板面圖形.Pattern Plating線路電鍍.Pattern Process線路電鍍法.Peak Voltage峰值電壓.Peel Strength抗撕強度.Periodic Reverse (PR) Current周期性反電流. Peripheral周邊附屬設備. Permeability透氣性,導磁率. Permittivity誘電率,透電率.pH Value酸堿值.Phase相.Phase Diagram相圖.Phenolic酚醛樹脂. Photofugitive感光褪色. Photographic film感光成像之底片. Photoinitiator感光啟始劑. Photomask光罩.Photoplotter, Plotter光學繪圖機. Photoresist光阻.光阻式化學(銑刻)加工. Photoresist Chemical MachinningPhototool底片.Pick and Place拾取與放置. Piezoelectric壓電性.Pin 插腳,插梢,插針.Pin Grid Array (PGA)矩陣式針腳對裝. Pinhole針孔.Pink Ring粉紅圈.Pitch跨距,腳距,墊距,線距.Pits凹點.Plain Weave平織.Plasma電漿.Plasticizers可塑劑,增塑劑.Plated Through Hole鍍通孔.Platen熱盤.Plating鍍.Plotting標繪.Plowing犁溝.Plug插腳,塞柱.Ply層,股.Pneumatic Stretcher氣動拉伸器.Pogo Pin伸縮探針.Point 鑽尖.Point Angle鑽尖面.Point Source Light點狀光源.Poise泊."粘滯度"單位=1dyne*sec/cm2. Polar Solvent極性溶劑.Polarity電極性.Polarization分極,極化.Polarizing Slot偏槽.Polyester Films聚酯類薄片.Polymer Thick Film (PTF)厚膜糊.Polymerization聚合.Polymide(PI)聚亞醯胺.Popcorn Effect爆米花效應.Porcelain瓷材,瓷面.Porosity Test疏孔度試驗.Positive Acting Resist正性光阻劑.Post Cure后續硬化,后烤.Post Separation后期分離,事后公離.Pot Life運用期,鍋中壽命.Potting鑄封,模封.Power Supply電源供應器.Preform 預制品.Preheat預熱.Prepreg膠片,樹脂片.Press Plate鋼板.Press-Fit Contact擠入式接觸.Pressure Foot 壓力腳.Pre-tinning預先沾錫.Primary Image線路成像.Print Through壓透,過度擠壓..Probe探針.Process Camera制程用照像機.Process Window操作范圍.Production Master生產底片.Profile輪廓,部面圖,升溫曲線圖稜線. Propagation傳播.Propagation Delay傳播延遲.Puddle Effect水坑效應.Pull Away拉離.Pulse Plating脈沖電鍍法.Pumice Powder 浮石粉.Punch沖切.Purge, Purging淨空,淨洗.Purple Plague紫疫(金與鋁的共化物層). Pyrolysis熱裂解,高溫分解.*****Q*****Quad Flat Pack (QFP)方扁形封裝體. Qualification Agency資格認証機搆. Qualification Inspection資格檢驗.Qualified Products List合格產品(供應者)名單. Qualitative Analysis定性分析.品質符合之試驗線路(樣板). Quality Conformance Test CircuiQuantitative Analysis定量分析.Quench 淬火,驟冷.Quick Disconnect快速接頭.Quill緯紗繞軸.*****R*****Rack 挂架.Radial Lead放射狀引腳.Radio Frequency Interference (RF射頻干擾.Rake Angle摳角,耙角.Rated Temperature, Voltage額定溫度,額定電壓. Reactance電抗.Real Estate底材面,基板面.Real Time System 即時系統.Reclaiming再生,再制.Rediometer輻射計,光度計.Reel to Reel卷輪(盤)式操作. Reference Dimension參考尺度.Reference Edge參考邊緣. Reflection反射.Reflow Soldering重熔焊接,熔焊. Refraction折射.Refractive Index折射率.Register Mark對准用標記. Registration對准度. Reinforcement補強物.Rejection剔退,拒收. Relamination(Re-Lam)多層板壓合. Relaxation松弛.緩和.Relay繼電器.Release Agent, Release Sheets脫模劑,離模劑. Reliability可靠度,可信度. Relief Angle浮角.Repair修理.Resin Coated Copper Foil背膠銅箔.Resin Content膠含量,樹脂含量. Resin Flow膠流量,樹脂流量. Resin Recession樹脂下陷.Resin Rich Area 多膠區,樹脂丰富區. Resin Smear膠(糊)渣.Resin Starve Area缺膠區,樹脂缺乏區. Resist阻膜,阻劑. Resistivity電阻系數,電阻率. Resistor電阻器,電阻. Resistor Drift電阻漂移.Resistor Paste電阻印膏.Resolution解像,解像度,解析度.Resolving Power解析(像)力,分辨力.Reverse Current Cleaning反電流(電解)清洗.Reverse Etchback反回蝕.Reverse Image負片影像(阻劑).Reverse Osmosis (RO)反(逆滲透).Reversion反轉,還原.Revision修正版.改訂版.Rework(ing)重工,再加工.Rhology流變學,流變性質.Ribbon Cable圓線纜帶.Rigid-Flex Printed Board硬軟合板.Ring 套環.Rinsing水洗,沖洗.Ripple紋波(指整流器所輸出電流中不穩定成分Rise Time上升時間.Roadmap 線路與零件之布局圖.Robber輔助陰極.Roller Coating輥輪塗布.Roller Coating滾動塗布法.Roller Cutter輥切機.Roller Tinning輥錫法,滾錫法.Rosin松香.Rotary Dip Test擺動沾錫試驗.Routing切外型.Runout偏轉,累勣距差.Rupture迸裂.*****S*****Sacrificial Protection犧牲性保護層. Salt Spray Test鹽霧試驗. Sand Blast噴砂. Saponification皂化作用. Saponifier皂化劑.Satin Finish緞面處理. Scaled Flow Test比例流量實驗. Schemetic Diagram電路概略圖. Scoring V型刻槽. Scratch刮痕.Screen Printing綱版印刷. Screenability綱印能力. Scrubber磨刷機,磨刷器. Scum透明殘膜. Sealing封孔. Secondary Side第二面 . Seeding下種. Selective Plating選擇性電鍍. Self-Extinguishing自熄性. Selvage布邊.Semi-Additive Process半加成制程. Semi-Conductor半導體. Sensitizing敏化. Separable Component Part可分離式零件. Separator Plate隔板, 鋼板. Sequential Lamination接續性壓合法. Sequestering Agent螯合劑. Shadowing陰影,回蝕死角.Shank鑽針柄部.Shear Strength 抗剪強度.Shelf Life儲齡.Shield遮蔽.Shore Hardness蕭氏硬度.Short短路.Shoulder Angle肩斜角.Shunt分路.Side Wall側壁.Siemens電阻值.Sigma (Standard Deviation)標准差.Signal訊號.Silane硅烷.Silica Gel硅膠砂.Silicon硅.Silicone硅銅.Silk Screen綱版印刷,絲綱印刷.Silver Migration銀遷移.Silver Paste 銀膏.Single-In-Line Package(SIP)單邊插腳封裝體.Sintering燒結.Sizing上膠,上漿.Sizing上漿處理.Skin Effect集膚效應 (高頻下,電流在傳遞時多集中表面,使得道線內部通過電流甚少, 造成浪費,并也使得表面導體部分電阻升高. Skip Printing, Skip Plating漏印,漏鍍.Skip Solder 缺錫, 漏焊.Slashing漿經.Sleeve Jint套接.Sliver邊絲,邊余.Slot, Slotting槽口.Sludge於泥.Slump塌散.Slurry稠漿,懸浮漿. Small Hole小孔.Smear膠渣.Smudging錫點沾污.Snap-off彈回高度.Socket插座.Soft Contact輕觸.Soft Glass 軟質玻璃(鉛玻璃). Solder焊錫.Solder Ball錫球.Solder Bridging錫橋.Solder Bump 焊錫击塊.Solder Column Package錫柱腳封裝法. Solder Connection焊接.Solder Cost焊錫著層.Solder Dam錫堤.Solder Fillet填錫.Solder Levelling噴錫,熱風整平. Solder Masking(S/M)防焊膜綠漆. Solder Paste錫膏.Solder Plug錫塞(柱).Solder Preforms預焊料.Solder Projection焊錫突點.Solder Sag 焊錫垂流物.Solder Side焊錫面.Solder Spatter濺錫.Solder Splash賤錫.Solder Spread Test散錫試驗.Solder Webbing錫綱.Solder Webbing錫綱.Solder Wicking滲錫,焊錫之燈芯效應. Solderability可焊性.Soldering軟焊,焊接.Soldering Fluid, Soldering Oil助焊液,護焊油.Solid Content固體含量,固形分. Solidus Line固相線.Spacing間距.Span跨距.Spark Over閃絡.Specific Heat 比熱.Specification (Spec)規范,規格. Specimen樣品,試樣. Spectrophotometry分光光度計檢測法. Spindle主軸,鑽軸.Spinning Coating自轉塗布.Splay斜鑽孔.Spray Coating噴著塗裝.Spur底片圖形邊緣突出. Sputtering濺射.Squeege刮刀.Stagger Grid蹣跚格點.Stalagometer滴管式表面張力計.Stand-off Terminals直立型端子.Starvation缺膠.Static Eliminator靜電消除器.Steel Rule Die(鋼)刀模.Stencil版膜.Step and Repeat逐次重覆曝光.Step Plating梯階式鍍層.Step Tablet階段式曝光表.Stiffener補強條(板).Stop Off防鍍膜, 阻劑.Strain變形,應變.Strand絞(指由許多股單絲集束并旋扭而成的絲Stray Current迷走電流, 散雜電流(在電鍍槽系統中,其由整流器所提供,應在陽極板與被鍍件之電杆與槽體液體中流通,但有時少部分電從槽體本身或加熱器上迷走,漏失). Stress Corrosion應力腐蝕.Stress Relief消除應力.Strike預鍍.Stringing拖尾.Stripline條線.Stripper剝除液(器).Substractive Process減成法.Substrate底材.Supper Solder超級焊錫.Supported Hole(金屬)支助通孔.Surface Energy表面能.Surface Insulation Resistance表面絕緣電阻. Surface Mount Device 表面粘裝元件. Surface Mounting Technology (S表面粘裝技術. Surface Resistivity表面電阻率. Surface Speed鑽針表面速度. Surface Tension表面張力. Surfactant表面潤溼劑.Surge突流,突壓. Swaged Lead壓扁式引腳. Swelling Agents, Sweller膨松劑. Swimming 線路滑離. Synthetic Resin合成樹脂.*****T*****Tab接點,金手指. Taber Abraser泰伯磨試器. Tackiness粘著性, 粘手性. Tape Automatic Bonding (TAB)卷帶自動結合. Tape Casting 帶狀鑄材.Tape Test撕膠帶試驗.Tape Up Master原始手貼片. Taped Components卷帶式連載元件. Taper Pin Gauge錐狀孔規.Tarnish污化.Tarnish 污化, 污著.Teflon鐵氟龍(聚4氟乙烯). Telegraphing浮印,隱印. Temperature Profile溫度曲線.Template模板.Tensile Strength抗拉強度. Tensiomenter張力計.Tenting蓋孔法. Terminal端子.Terminal Clearance端子空環.Tetra-Etch氟樹脂蝕粗劑. Tetrafunctional Resin四功能樹脂. Thermal Coefficient of Expansion熱膨脹系數. Thermal Conductivity導熱率. Thermal Cycling熱循環,熱震盪. Thermal Mismstch感熱失諧. Thermal Relief散熱式鏤空. Thermal Via導熱孔. Thermal Zone感熱區. Thermocompression Bonding熱壓結合. Thermocouple熱電偶. Thermode發熱體. Thermode Soldering熱模焊接法.熱重分析法. Thermogravimetric Analysis, (TG熱機分析法. Thermomechanical Analysis (TM Thermoplastic熱塑性. Thermosetting熱固性. Thermosonic Bonding熱超音波結合. Thermount聚醯胺短纖蓆材. Thermo-Via導熱孔.Thick Film Circuit厚膜電路.Thief輔助陽極.Thin Copper Foil薄銅箔.Thin Core薄基板.Thin Film Technology薄膜技術.Thin Small Outline Package(TSO薄小型勣體電路器.Thinner調薄劑.Thixotropy抗垂流性,搖變性.Three Point Bending三點壓彎試驗.Three-Layer Carrier三層式載體.Threshold Limit Value (TLV)極限值.Through Hole Mounting通孔插裝.Through Put物流量,物料通過量.Throwing Power分布力.Tie Bar分流條.Tin Drift錫量漂飄失.Tin Immersion浸鍍錫.Tin Pest錫疫(常見白色金屬錫為"β錫",當溫度低時則β錫將逐漸轉變成粉末狀灰色"α錫Tin Whishers錫須.Tinning熱沾焊錫.Tolerance公差.Tombstoning墓碑效應.Tooling Feature工具標示物.Topography表面地形.Torsion Strength抗扭強度.Touch Up觸修,簡修.Trace 線路,導線.Traceability追溯性,可溯性.Transducer轉能器.Transfer Bump移用式突塊. Transfer Laminatied Circuit轉壓式線路. Transfer Soldering移焊法. Transistor電晶體. Translucency半透性. Transmission Line傳輸線. Transmittance透光率. Treament, Treating含浸處理.Treeing枝狀鍍物,鍍須. Trim修整, 精修.Trim Line裁切線.Trimming修整,修邊.True Position真位.Tungsten鎢Tungsten Carbide碳化鎢.Turnkey System包辦式系統. Turret Solder Terminal塔立式焊接端子. Twill Weave斜織法.Twist板扭.Two Layer Carrier兩層式載体.*****U*****保儉業試驗所標志. UL Symbol(UL.為Under-Writers Laboratories,INC)Ultimate Tensile Strength (UTS)極限抗拉強度. Ultra High Frequency (UHF)超高頻率.Ultra Violet Curing (UV Curing)紫外線硬化. Ultrasonic Bonding超音波結合. Ultrasonic Cleaning超音波清洗.Ultrasonic Soldering超音波焊接.Unbalanced Transmission Line非平衡式傳輸線.Undercut, Undercutting側蝕.Underplate底鍍層.Universal Tester汛用型電測機.Unsupported Hole非鍍通孔.Urea尿素.Urethane胺基甲酸乙脂.*****V*****Vacuoles焊洞.Vacuum Evaporation(or Depositi真空蒸鍍法.Vacuum Lamination真空壓合.Van Der Waals Force凡得華力.Vapor Blasting蒸汽噴砂.Vapor Degreasing蒸汽除油法.Vapor Phase Soldering氣相焊接.Varnish凡力水,清漆(樹脂之液態單體). V-cut V型切槽.Very Large-Scale Integration(VL極大勣體電路器.Via Hole 導通孔.Vickers Hardness維氏硬度.Viscosity粘滯度,粘度.Vision Systems視覺系統.Visual Examination目視檢驗.Void 破洞,空洞.Volatile Content揮發份含量.Voltage電壓.Voltage Breakdown崩潰電壓.Voltage Drop 電壓降落.Voltage Efficiency電壓效率.Voltage Plane電壓層.Voltage Plane Clearance電壓層的空環. Volume Resistivity體勣電阻率. Volume Resistivity體勣電阻率. Volumetric Analysis容量分析法. Vulcanization交聯,硫化.*****W*****Wafer晶圓.Waive暫准過關,暫不檢查. Warp Size 漿經處理.Warp, Warpage板彎.Washer墊圈.Waste Treatment廢棄處理.Water Absorption吸水性.Water Break水膜破散,水破. Water Mark水印.Watt瓦特.Watts Bath瓦玆鍍鎳液.Wave Guide導波管.Wave Soldering波焊.Waviness 波紋,波度.Wear Resistance耐磨性,耐磨度. Weatherability耐候性.Weave Eposure織紋顯露.Weave Texture織紋隱現.Web蹼部.Wedge Bond 楔形結合點.Wedge Void楔形缺口(破口).Weft Yarn緯紗.Welding熔接.Wet Blasting溼噴砂.Wet Lamination溼壓膜法.Wet Process溼式制程.Wetting Agent潤溼劑.Wetting Balance沾錫天平.Wetting Balance沾錫,沾溼.Whirl Brush旋渦式磨刷法.Whirl Coating旋渦塗布法.Whisker晶須.White Residue白色殘渣.White Spot白點.Wicking燈蕊效應.Window操作范圍,傳動齒孔. Wiping Action 滑動接觸(導電).Wire Bonding打線結合.Wire Gauge線規.Wire Lead金屬線腳.Wire Pattern布線圖形.Wire Wrap繞線互連.Working Master工作母片.Working Time (Life)堪用時間. Workmanship 手藝,工藝水平,制作水準. Woven Cable扁平編線.Wrinkle皺折, 皺紋.Wrought Foil鍛碾金屬箔.*****X*****X Axis X軸.X-Ray X光.X-Ray Fluorescence X螢光.*****Y*****Yarn紗線.Y-Axis Y軸.Yield良品率,良率,產率. Yield Point屈服點.*****Z*****Z-Axis Z軸.Zero Centering中心不變(疊合法). Zig-Zag In-Line Package (ZIP)鍊齒狀雙排腳封裝件.145-(145÷Sp.Gr)÷(Sp.Gr-130)水"1g/cm的比值).。
PCB专业英语和层定义
PCB专业英语(PCB SPECIAL ENGLISH)1.PCB=Printed Circuit Board 电路板2.CAM=Computer aided manufacture 计算机辅助3.Pad 焊盘4.Annular ring 焊环5.AOI=automatic optical inspection 自动光学检测6.Charge of free 免费7.WIP=work in process 在线板8.DCC=document control center 文控中心9.Legend 字符10.CS=Component Side =Top Side （顶层）元件面11.SS=Solder Side =Bottom Side （底层）焊锡面12.Gold Plated 电金，镀金13.Nickel Plated 电镍，镀镍14.Immersion Gold 沉金=沉镍金15.Carbon Ink Print 印碳油16.Microsection Report 切片报告，横切面报告17.X-out=Cross-out 打“X”报告18.Panel （客户称）拼板，（生产线称）工作板19.Marking 标记，UL 标记20.Date code 生产周期21.Unit 单元，单位22.Profile 外形，轮廓<outline>23.Profile By Routing 锣(铣)外形24.Wet Film 湿菲林,湿绿油,湿膜25.Slot 槽,方坑26.Base Material=Base Laminate 基材,板料27.V-out =V-score V形槽28.Finished 成品29.Marketing 市场部30.Gerber File GERBER文件31.UL LOGO UL标记32.E-Test=Electric Open/Short Test 电子测试33.PO=Purchase Order 订单34.Tolerance 公差35.Rigid,Flexible Board 刚性,软性板36.Board cut 开料37.Board baking 焗板38.Drill 钻孔39.PTH=Plated Through Hole 镀通孔,沉铜40.Panel plating 板面电镀,全板电镀41.Photo Image 图象,线路图形42.Pattern plating 线路电镀43.Etching 蚀板,蚀刻44.SM=Solder Mask 防焊,阻焊,绿油45.SR=Solder Resist 防焊,阻焊,绿油46.Gold finger 金手指47.Silkscreen 丝印字符48.HAL=HASL=Hot air(Solder)leveling 热风整平喷锡49.Routing 锣板,铣板50.Punching 冲板,啤板51.FOC=final quality checking 终检,最后检查52.FOA=final quality audit 最后稽查(抽查)53.Shippment 出货54.Flux 松香55.Au金,Cu铜,Ni镍,Pb铅,Tn锡,Tin-lead锡铅合金56.Lead free 无铅57.COC=compliance of certificate 材料证明书58.Microsection=cross section 微切片,横切片59.Chamical gold 沉镍金60.Mould=punch die 模具,啤模61.MI=manufacture instruction 制作批示62.QA=quality assurance 品质保证63.CAD=computer aided design 计算机辅助设计64.Drill bit size钻咀直径<diameter>65.Bow and twist 板弯和板曲66.Hit 击打,孔数67.Bonding 邦定,点焊68.Test coupon 测试模块(科邦)69.Thieving copper 抢电流铜皮70.Rail-web71.Break-up tab 工艺边72.Break away tab 工艺边73.GND=ground 地线,大铜皮74.Hole edge 孔边,孔内75.Stamp hole 邮票孔76.Template 天坯,型板,钻孔样板(首板)77.Dry film 干菲林,干膜78.LPI=liquid photo image 液态感光=湿绿油79.Multilayer 多层板80.SMD=surface mouted device 贴片,表面贴装器件81.SMT=surface mouted technology 表面贴装技术82.Peelable mask=blue gel 蓝胶83.Tooling hole 工艺孔,管位,定位孔,工具孔84.Fiducial mask 测光点,光学对位点,对光点,电眼85.Copper foil 铜箔86.Dimension 尺寸87.Nagative负的,positive正的88.Flash gold 闪镀金,镀薄金89.Engineering department 工程部90.Delivery date 交货期91.Bevelling 斜边92.Spacing=gap 间隙,气隙,线隙PCB的各层定义及描述为了方便与印制板厂家的技术沟通，提高对PCB的技术认知一致度，特在此将我司常用PCB的有关板层特性做简单说明，请爱好者参考此说明进行设计和制造。
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PCB及PCBA常用英语汇总(4)
1 内层开路 Inner open
2 内层断路 Inner short
3 外层开路 Outer open
4 外层断路 Outer short
5 内层蚀刻过度 Inner over ecthing
6 外层蚀刻过度 Outer over ecthing
7 内层树脂气泡 Resin void
8 内层杂物 Foreign material
9 内层图形移位 Inner pattern mis-registration
10 层与层移位 Layer to layer mis-registration
11 打孔不良 Improper targeting
12 内层蚀刻不净 Inner under etching
13 露布纹 Weave texture/exposure
14 檫花（氧化膜面） Scratch(Oxide surface)
15 板损坏 Damaged board
16 分层（物料） Delamination (Raw material)
17 内层不配套 Excessive inner core
18 板过厚 Over thickness
19 白点（压板） Measling (Pressing)
20 白点（喷锡） Measling (HSAL)
21 板曲 Warpage
22 板焦黄 Burnt
23 起皱 Wrinkle
24 起泡（压板） Blistering (Pressing)
25 镀层起泡 Blistering (Cu plating)
26 喷锡起泡 Blistering (HSAL)
27 板面凹痕 DENT (Pressing profilling G/F)
28 白斑 Crazing
29 胶渣 Gum residue
30 孔未穿 Incomplete drilling
31 披锋 Burr
32 多孔 Extra hole
33 偏孔 Hole shift
34 孔径大 Hole oversize
35 孔径小 Hole undersize
36 少孔 Missing Hole
37 塞孔 Block hole
38 崩孔 Hole breakout
39 孔粗糙(镀铜） Hole roughness（Cu plating)
40 孔粗糙（机械钻孔） Hole roughness(mechanical
drill)
41 崩线、线路缺口 Nick / void on trace
42 缺口 Nick / void on pad
43 曝光过度 Over-exposure
44 曝光不良 Under exposure
45 显影不足 Under develop
46 干膜脱落 D/F Peel off
47 干膜碎 D/F Rdsidue
48 干膜移位 D/F Mis-registration
49 标志不清（曝光） Illegible marking (exposure)
50 错菲林 Wrong A/W
51 非镀铜孔有铜 Copper in NPTH
52 镀铜孔内无铜 No copper in PTH
53 渗镀 Nickel smear
54 电镀粗糙 Rough plating。