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nxp的芯片

nxp的芯片

nxp的芯片NXP Semiconductors是一家总部位于荷兰的全球领先的半导体公司。

它专注于提供广泛的高性能芯片解决方案,用于汽车、物联网、新能源和工业等多个领域。

NXP的芯片具有卓越的性能、高度集成和可靠性。

首先,NXP的芯片在汽车电子领域具有很高的知名度和影响力。

它们被广泛应用于汽车的智能驾驶、车载娱乐、车身电子、车辆网络和安全系统等方面。

例如,NXP的车载电源管理芯片可以提供高效的能量转换,使车辆的能源供应更加可靠和节能。

此外,NXP的汽车雷达芯片能够实现更高精度的障碍物检测,提高自动驾驶系统的性能和安全性。

其次,NXP的芯片在物联网领域发挥着重要作用。

它们支持物联网设备之间的无线通信和数据传输,并在智能家居、智能城市和工业自动化等领域得到广泛应用。

例如,NXP的无线射频识别(RFID)芯片用于物流管理和供应链追踪,可以实现实时跟踪和管理物品的位置和状态。

此外,NXP的低功耗蓝牙芯片可实现智能家居设备的互联互通,提供更便捷和智能的生活体验。

此外,NXP的芯片在新能源领域也具有重要意义。

它们被广泛应用于电动汽车、光伏发电和智能电网等新能源系统中。

例如,NXP的电动汽车控制芯片可实现电动汽车的精确控制和高效能源管理,提高电动汽车的性能和里程。

此外,NXP的太阳能逆变器芯片可实现光伏发电系统的高效能量转换,提高太阳能发电的效率和可靠性。

最后,NXP的芯片在工业领域发挥着重要的作用。

它们用于工业控制系统、机器人和自动化设备中,提高生产效率和制造质量。

例如,NXP的工厂自动化控制芯片能够实现复杂的运动控制和精确的位置检测,提高机器人和自动化设备的精度和稳定性。

此外,NXP的无线传感器芯片可实现工厂设备的智能监控和预测性维护,提高设备的可靠性和生产效率。

综上所述,NXP的芯片在汽车、物联网、新能源和工业等领域具有很高的应用价值。

它们通过提供高性能、高集成度和可靠性的解决方案,推动了各个行业的技术创新和发展。

NXP - 微处理器和控制概览

NXP - 微处理器和控制概览
• Life cycles begin at the time of launch
• Includes NXP’s standard end-of-life notification policy
► For a complete list of participating products, visit, /productlongevity
Mainstream (USB FS/HS, CAN) & Performance 32KB – 2MB Flash 8KB – 256KB RAM
Kinetis K6x Series
Integration (ETH, USB FS/HS) & Performance
32KB – 2MB Flash 8KB – 256KB RAM
NFC
RFID
传感器 模拟
互联
边缘节点
安全互联
可信架构
MPU
MCU
NFC
RF
传感器 模拟
互联
网关
安全互联
可信架构
MPU 模拟

大数据 应用/行动
4 PUBLIC
MICR 微控制器业务部
为客户带来的价值
• 为 IOT 应用提供丰富的产品和方案组合 • 软硬件开发平台 • 领先的客户技术支持渠道,质量管控和供货保证 • 广泛的合作伙伴、完整的生态系统 • 针对中小客户的需求,构建易用型的系统级方案
5V, Robust
Kinetis E Series
CAN, Touch 16KB – 512KB Flash
2KB – 64KB RAM
Wireless Connectivity
Kinetis W Series

nxp_latest_power_for_automotive

nxp_latest_power_for_automotive

Portfolio Extension
54
2.4mΩ - 153mΩ
40V, 60V, 80V, 100V - LL & SL
NextPower
(10% - 15% RDSon reduction
Qual Samples
CONFIDENTIAL
19
双路LFPAK
Auxiliary Pumps
Hybrid DC-DC
LED Lighting
Mature Applications
Widely adopted across all manufacturers & vehicle categories. Growth coming from increased vehicle volumes, especially BRIC countries
7.16mm
LFPAK
DPAK
10.85mm
5.7mm
相对别的Power SO-8的封装的优越点
– – – – – – – Lowest and highest RDSon in every voltage 10% higher IDmax than nearest competitor (single) Twice the IDmax of nearest competitor (dual) Best in class short circuit capability Biggest portfolio of all suppliers Most reliable package design Easiest and most reliable for PCB assembly
CONFIDENTIAL
9

Allwinner R8 Datasheet

Allwinner R8 Datasheet

REVISION HISTORYDECLARATIONTABLE OF CONTENTS5.3. DC Electrical Characteristics2.6.Memory Subsystem&Touch G-SENSORSPI1_CLK UART3_RX42 DDR3_D743 VCC3_DRAM79 AGND80 VRPSDC0_CMD 111PF3PE9 CSI_D6LCD_D10 141PD10PC19 163 VCC4function 0);3)Type: signal directionPC7 Input PC8 InputPE4 Input PE5 InputSignal Name DescriptionOthersVRP Reference voltageV IH High-Level Input Voltage V IL Low-Level Input VoltageFigure 5-1. Power Up Sequence5.5.2.Power Up Reset Sequence RequirementsThe device has a system reset signal to reset the board. When asserted, the following steps give an example of power up reset sequence supported by the R8 device.•AVCC ,VDD_CPU and VCC_DRAM can be powered up simultaneously.•VDD_INT can be powered up after VDD_CPU is powered up, the time difference is T1ms.•VCC can be powered up after VDD_INT is powered up, the time difference is T2ms.Figure 5-2. Power Up Reset Sequence5.5.3.Resume Power Up Sequence from Super Standby ModeTo resume a power up sequence when the device is in Super Standby mode:•VCC_DRAM and AVCC remains powered up always.•VDD_CPU can be powered up firstly.•VDD_INT can be powered up after VDD_CPU is powered up, the time difference is T1ms.•VCC can be powered up after VDD_INT is powered up, the time difference is T2ms.Figure 5-3. Exit Super Standby and Resume Power Up Sequence5.5.4.Power Down Sequence RequirementsTo reduce power consumption,the R8 can be partially powered down.The section lists the power down requirements in each mode.In Super Standby mode,•VCC_DRAM and AVCC must be kept powered up.•VDD_CPU,VDD_INT and VCC are powered down simultaneously.•VCC voltage fall time is more longer than VDD_INT.VDD_CPUVDD_CPU6.PIN ASSIGNMENT6.2.PACKAGE DIMENSIONThe following diagram shows the package dimension of R8.。

nxp 芯片

nxp 芯片

nxp 芯片
NXP是一家全球领先的半导体解决方案供应商,提供广泛的
高性能、高可靠性的芯片产品和解决方案。

NXP的芯片广泛
应用于汽车、通信、家庭娱乐、工业控制等领域,为客户提供安全、智能、高效的解决方案。

NXP的芯片在汽车领域表现突出。

汽车是NXP的主要市场之一,NXP芯片在汽车电子控制单元(ECU)、车载娱乐系统、驾
驶员辅助系统等方面提供了高级解决方案。

例如,NXP的汽
车介电层嵌入式处理器(PoP)芯片是全球最先进的汽车电子芯
片之一,集成了高性能的处理器、内存、图形引擎和安全模块,支持车载娱乐、导航、车载通信等多种应用。

在通信领域,NXP的芯片被广泛应用于移动通信、无线通信
和卫星通信等领域。

例如,NXP的RFID芯片是全球领先的RFID技术之一,能够实现无线物联网应用。

此外,NXP还提
供高性能的射频功率放大器(PA)芯片,用于增强信号传输和接收性能。

在家庭娱乐领域,NXP的芯片提供了丰富的解决方案。

例如,NXP的音频处理芯片可以实现高保真音频输出和音频信号处理。

此外,NXP还提供了高性能的图形处理芯片,支持高清
视频播放和图形处理。

在工业控制领域,NXP的芯片应用于各种工业自动化设备和
控制系统中,支持实时控制、数据采集和通信。

例如,NXP
的工业控制芯片可以实现高性能的实时数据处理和精确控制。

总之,NXP的芯片在汽车、通信、家庭娱乐和工业控制等领域提供了广泛的解决方案。

通过不断创新和技术升级,NXP 始终致力于为客户提供安全、智能、高效的芯片产品和解决方案。

芯片nxp

芯片nxp

芯片nxp
NXP Semiconductors的一款芯片为NXP1000。

该芯片具有以下特性:
1. 低功耗:该芯片采用低功耗设计,能够节省电池能量,延长设备续航时间。

2. 高性能:NXP1000芯片具备强大的处理能力和高速数据处理能力,可以处理复杂的计算任务和大数据流。

3. 多功能性:该芯片支持多种通信接口,如蓝牙、Wi-Fi、NFC等,可以与其他设备进行无线通信和数据传输。

4. 安全性:NXP1000芯片采用先进的安全性能,包括数据加密、身份认证和漏洞防护等,保障设备和数据的安全。

5. 可靠性:该芯片具有高可靠性和稳定性,能够适应各种工作环境和应用场景。

总的来说,NXP1000芯片是一款具备低功耗、高性能、安全可靠的多功能芯片,适用于各种智能设备和物联网应用。

NXP i.MX 8M Plus Applications Processor Reference

NXP i.MX 8M Plus Applications Processor Reference

Preview of i.MX 8M Plus Applications Processor Reference ManualGet entire reference manual (7406 pages, PDF)Document Number: IMX8MPRMRev. 1, 06/2021ContentsSection number Title PageChapter 1Introduction1.1Product Overview (9)1.2Target Applications (9)1.3Acronyms and Abbreviations (9)1.4Architectural Overview (12)Chapter 2Memory Map2.1Memory system overview (23)2.2Cortex-A53 Memory Map (24)2.3Cortex-M7 Memory Map (26)2.4DMA memory maps (29)2.5AIPS Memory Maps (30)2.6DAP Memory Map (36)2.7Audio Processor Memory Map (38)2.8HDMI_TX Subsystem Memory Map (38)Chapter 3Security3.1System Security (41)3.2Resource Domain Controller (RDC) (44)Chapter 4Arm Platform and Debug4.1Arm Cortex A53 Platform (A53) (91)4.2Arm Cortex M7 Platform (CM7) (97)4.3Messaging Unit (MU) (99)4.4Semaphore (SEMA4) (143)4.5On-Chip RAM Memory Controller (OCRAM) (161)4.6Network Interconnect Bus System (NIC) (164)4.7AHB to IP Bridge (AIPSTZ) (165)4.8Shared Peripheral Bus Arbiter (SPBA) (188)4.9TrustZone Address Space Controller (TZASC) (201)4.10System Debug (203)4.11System Counter (SYS_CTR) (207)Chapter 5Clocks and Power Management5.1Clock Control Module (CCM) (227)5.2General Power Controller (GPC) (566)5.3Crystal Oscillator (XTALOSC) (718)5.4Thermal Monitoring Unit (TMU) (722)Chapter 6SNVS, Reset, Fuse, and Boot6.1System Boot (741)6.2Fusemap (808)6.3On-Chip OTP Controller (OCOTP_CTRL) (824)6.4Secure Non-Volatile Storage (SNVS) (868)6.5System Reset Controller (SRC) (897)6.6Watchdog Timer (WDOG) (968)Chapter 7Interrupts and DMA7.1Interrupts and DMA Events (987)7.2Smart Direct Memory Access Controller (SDMA) (1008)7.3Enhanced Direct Memory Access (eDMA) (1256)7.4Interrupt Request Steering (IRQ_STEER) (1318)Chapter 8Chip IO and Pinmux8.1External Signals and Pin Multiplexing (1329)8.2IOMUX Controller (IOMUXC) (1352)8.3General Purpose Input/Output (GPIO) (1982)Chapter 9External Memory9.1External Memory Overview (2001)9.2DDR Controller (DDRC) (2003)9.3DDR BLK_CTRL (2164)9.4DDR PHY (DDR_PHY) (2166)9.5AHB-to-APBH Bridge with DMA (APBH-Bridge-DMA) (2177)9.662BIT Correcting ECC Accelerator (BCH) (2217)9.7General Purpose Media Interface (GPMI) (2280)Chapter 10Mass Storage10.1Enhanced Configurable SPI (ECSPI) (2339)10.2FlexSPI Controller (FlexSPI) (2369)10.3Ultra Secured Digital Host Controller (uSDHC) (2500)Chapter 11Connectivity11.1HSIO BLK_CTRL (2659)11.2Universal Serial Bus Controller (USB) (2680)11.3Universal Serial Bus PHY (USB_PHY) (2993)11.4PCI Express (PCIe) (2997)11.5PCI Express PHY (PCIe_PHY) (3369)11.6Ethernet MAC (ENET) (3754)11.7Ethernet Quality Of Service (ENET_QOS) (3957)11.8FlexCAN (4980)Chapter 12Timers12.1General Purpose Timer (GPT) (5123)12.2Pulse Width Modulation (PWM) (5142)Chapter 13Display, Imaging, and Camera13.1Display, Imaging, and Camera Overview (5155)13.2MEDIA BLK_CTRL (5163)13.3LCD Interface (LCDIF) (5233)13.4Image Sensing Interface (ISI) (5265)13.5MIPI CSI Host Controller (MIPI_CSI) (5347)13.6MIPI DSI Host Controller (MIPI_DSI) (5396)13.7MIPI D-PHY (MIPI_DPHY) (5469)13.8LVDS Display Bridge (LDB) (5493)13.9HDMI TX Controller (5496)13.10HDMI TX PHY (5779)13.11HDMI TX BLK_CTRL (5828)13.12HDMI TX Parallel Audio Interface (HTX_PAI) (5859)13.13HDMI TX Parallel Video Interface (HTX_PVI) (5871)13.14Image Signal Processor (ISP) (5895)13.15DeWarp (5901)13.16Machine Learning Neural Processing Unit (NPU) (5907)Chapter 14Audio14.1Audio Overview (5943)14.2AUDIO BLK_CTRL (5947)14.3PDM Microphone Interface (MICFIL) (5977)14.4Synchronous Audio Interface (SAI) (6023)14.5Asynchronous Sample Rate Converter (ASRC) (6077)14.6Enhanced Audio Return Channel (eARC) (6162)14.7Audio DSP (HiFi 4 DSP) (6231)Chapter 15Graphics Processing Unit (GPU)15.1GPU Overview (6239)15.22D Graphics Processing Unit (GPU2D) (6240)15.33D Graphics Processing Unit (GPU3D) (6254)Chapter 16Video Processing Unit (VPU)16.1VPU G1 Decoder (6263)16.2VPU G2 Decoder (6429)16.3VPU VC8000E Encoder (6665)16.4VPU BLK_CTRL (7256)Chapter 17Low Speed Communication and Interconnects17.1I2C Controller (I2C) (7269)17.2Universal Asynchronous Receiver/Transmitter (UART) (7293)Chapter 1Introduction1.1Product OverviewThis chapter introduces the architecture of the i.MX 8M Plus Applications Processor. The i.MX 8M Plus family is a set of NXP products focused on machine learning applications, combining state-of-art multimedia features with high-performance processing optimized for low-power consumption.The i.MX 8M Plus Applications Processor relies on a powerful fully coherent core complex based on a quad Cortex-A53 cluster, a Cortex-M7 coprocessor, audio digital signal processor, machine learning and graphics accelerators.The i.MX 8M Plus provides additional computing resources and peripherals:•Advanced security modules for secure boot, cipher acceleration and DRM support •A wide range of audio interfaces•Large set of peripherals that are commonly used in consumer/industrial markets including USB , PCIe, Ethernet, and CAN1.2Target ApplicationsThe i.MX 8M Plus Media Applications Processor targets applications on:•Smart Homes, Buildings and Cities•Machine Learning and Industrial Automation•Consumer and Pro Audio/Voice Systems1.3Acronyms and AbbreviationsThe table below contains acronyms and abbreviations used in this document.Acronyms and AbbreviationsAcronyms and Abbreviated TermsTerm Meaning ADC Analog-to-Digital ConverterAHB Advanced High-performance BusAIPS Arm IP BusALU Arithmetic Logic UnitAMBA Advanced Microcontroller Bus ArchitectureAPB Advanced Peripheral BusASRC Asynchronous Sample Rate ConverterAXI Advanced eXtensible InterfaceCA/CM Arm Cortex-A/Cortex-MCAAM Cryptographic Acceleration and Assurance Module CA53Arm Cortex A53 CoreCAN Controller Area NetworkCM7Arm Cortex M7 CoreCPU Central Processing UnitCSI CMOS Sensor InterfaceCSU Central Security UnitCTI Cross Trigger InterfaceD-cache Data cacheDAP Debug Access PortDDR Double data rateDMA Direct memory accessDPLL Digital phase-locked loopDRAM Dynamic random access memoryECC Error correcting codesECSPI Enhanced Configurable SPILPSPI Low-power SPIEDMA Enhanced Direct Memory AccessEIM External Interface ModuleENET EthernetEPIT Enhanced Periodic Interrupt TimerEPROM Erasable Programmable Read-Only MemoryETF Embedded Trace FIFOETM Embedded Trace MacrocellFIFO First-In-First-OutGIC General Interrupt ControllerGPC General Power ControllerGPIO General-Purpose I/OGPR General-Purpose RegisterGPS Global Positioning SystemTable continues on the next page...Continue Reading This Reference ManualGet entire reference manual (7406 pages, PDF)Stay informed when design resources related to this product are updated.Go to i.MX 8M Plusi.MX 8M Plus Applications Processor Reference Manual, Rev. 1, 06/202111NXP Semiconductors。

CPES_Overview

CPES_Overview

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CPES Achievement Highlights
(1998-2008)
- 15 new power electronics courses developed - 27 distance delivery courses - 86 power electronics and related courses - 60 short courses to industry - Connectivity with 135 academic institutions worldwide
University of Puerto Rico Mayaguez
North Carolina A&T State University
• • •
Headquartered at Virginia Tech., ~ 1800m2 1998-2008 $30 million funding from NSF and $47 million from industry partners and other funding agencies in 10 years
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NXP SEMICONDUCTORS CORPORATE OVERVIEWDECEMBER 2015ACCELERATING TECHNOLOGY TRENDSDRIVE OPPORTUNITIES FOR NXPSecure Connections for a Smarter WorldEverythingConnected1B+ additionalconsumers online, 30B+ connected devicesEverythingSmart40B+ devices with intelligence shippedin 2020,EverythingSecurePotential savings toeconomy up tohalf trillion dollarsProcessingConnectivity Security#1Communications Processors #1RF Power Transistors#1Automotive Radar#1Automotive Safety2#2MCUs#1SECUREIDENTIFICATION#1AUTOMOTIVE#1RF POWERTRANSISTORS#1COMMUNICATIONSPROCESSORS#1SMALL SIGNALDISCRETES#1BROAD-BASEDMCUs1#1Secure Identification#1Car Entertainment#1In-Vehicle Networking#1Secure Car Access#1Smart Card MCUs#1Small Signal DiscretesEXPANDED SOLUTIONS FOR CUSTOMERSA NEW POSITION OF STRENGTH✓50+ year history ✓17,300 employees ✓$4.59b in revenue ✓$839m in R&D✓50+ year history✓28,000 employees✓$6.03b in revenue✓$723m in R&D>$10BIN ANNUALREVENUE11,000+ENGINEERS~45,000EMPLOYEES9,000+PATENTFAMILIES35+COUNTRIES4th LargestSEMICONDUCTORCOMPANYGLOBALLY1DEVELOPING SOLUTIONS CLOSE TO WHERE OUR CUSTOMERS AND PARTNERS OPERATEHEADQUARTERS EINDHOVEN, NETHERLANDS R&D EMEAAMERICASASIA PACFOCUSING NXP SOLUTIONS ON HIGH GROWTH MARKETSSecure, ConnectedVehicle •ADAS: Radar, V2X, Vision, Fusion, network processor •Car entertainment•In-vehicle networking •Secure car access •Secure car End-to-end Security & Privacy •Mobile transactions •E-Government •Smart bank cards •User authentication •Embedded security •Cloud & InfrastructureSecuritySmart,ConnectedSolutions•Smart home &buildings•Smart cities, smart grid•M2M, Industry 4.0•Intelligent logistics•4.5G/5G Networks •Mobile audio•High-speedInterfaces•Smartphone RF•Personal health& fitness•Healthcare IndustrialConsumerSMARTHOMEWEARABLESSMARTINDUSTRYSMARTHEALTHCAREEXPLOSIVE GROWTH OF SMART CONNECTED SOLUTIONSMCUMPUANALOGSENSORSRFNFCSTANDARDPRODUCTSMCUMPUSENSORSANALOGSTANDARDPRODUCTSMCUMPUANALOGSENSORSNFCSTANDARDPRODUCTSMCUMPUANALOGSENSORSRFNFCSTANDARDPRODUCTSSMARTINFRASTRUCTUREMPUAnalogRFSTANDARDPRODUCTSNXP UNIQUELY POSITIONED TO DELIVER SECURE SMART CONNECTED SOLUTIONSSecurity Technology Smart Connected ApplicationIdentificationDevice IdentificationCertification ComplianceCryptographyAccelerationNetwork SecurityNFC RFIDSecure Boot Secure KeysSecure Memory Secure UpdateTrusted Execution Environments Unique Chip IdentitySMARTHOMEWEARABLESSMARTINDUSTRYSMARTINFRASTRUCTURESMARTHEALTHCARESecurity Expertise E-Passport Mobile Transactions BankingIOT NEEDS A SECURE AND DYNAMIC NETWORK Trust Architecture Trust Architecture Trust ArchitectureSecureConnectionsSecureConnectionsApplication/ActionBig DataMPUsAnalogMPUsNFCSensorsConnectivityMCUsRFIDAnalogEdge Nodes Gateway CloudMPUsNFCSensorsConnectivityMCUsAnalogRFTHE ONLY SUPPLIER TO PROVIDE COMPLETE IOT SOLUTIONSDSPs, MCUs & CPUsSuite of SensorsWi-Fi, BT, Thread, ZigBeeWireless InterconnectsPower ManagementComplete HW/SW Security SuiteIoT Module Packaging✓✓✓✓✓✓TODAY: 90% OF AUTO INNOVATION VIA ELECTRONICS NXP IS #1#1 Auto Analog/ RF #1 Auto MCU (ex JPN)#1 Auto Merchant MEMS Sensors#1 INFOTAINMENTTUNERSSOFTWARE-DEFINED DIGITAL RADIO MULTIMEDIA PROCESSORSSOUND SYSTEM DSPs & AMPLIFIERS NFC BT PAIRINGWIRELESS POWER CHARGING POWER MANAGEMENT#1 SECURE CAR ACCESSIMMOBILIZER/ SECURITY REMOTE KEYLESS ENTRYPASSIVE KEYLESS ENTRY/ GO BI-DIRECTIONAL KEYS NFCULTRA WIDE BANDADAS & SECURITYPOWERTRAIN & CHASSIS MICROCONTOLLERSPRESSURE/ MOTION SENSORS BATTERY MANAGEMENT DRIVERSSTANDARD PRODUCTSLOGIC POWER DISCRETES#1 VEHICLE NETWORKINGCAN/LIN/ FLEXRAY ETHERNETCENTRAL GATEWAY CONTROLLER SECURITY RF#1 SAFETYMICROCONTROLLERS AIRBAG ANALOG AIRBAGMICROCONTROLLERS BRAKING ANALOG BRAKING SENSORS BRAKINGTIRE PRESSURE MONITORING#1 BODYMICROCONTROLLERSPOSITION/ ANGLE SENSORS SYSTEM BASIS CHIPSTOMORROW: ENABLING THE SECURE CONNECTED CARRadar Vision Secure V2XSENSEProcessing Sensor Fusion SecurityTHINKPowertrain Chassis BrakingACTDigital Networking Infrastructure SecurityBIG DATASecure NetworkSecure NetworkSurround ViewBlind Spot DetectionPark AssistRear Collision WarningPark Assistance/Surround ViewSurround ViewPark AssistCross Traffic AlertTraffic Sign RecognitionLane Departure WarningEmergency Braking Pedestrian Detection Collision Avoidance Adaptive Cruise ControlSecure Connected, Self-Driving Cars will Save >1,3M Road fatalities globallyNXP Offers Complete Secure ADAS System….…including Big Data InfrastructureWE OFFER A BROAD ECOSYSTEM OF SUPPORT -PROCESSORS-COMPREHENSIVEPARTNERECOSYSTEMSOFTWARE &SERVICESTRAININGHARDWAREGOVERNMENTS& INSTITUTIONSTOOLSWE OFFER A BROAD ECOSYSTEM OF SUPPORT -ID-COMPREHENSIVEPARTNERECOSYSTEMTRANSPORTOPERATORSGOVERNMENTS/ PRINTINGHOUSESFINANCIALINSTITUTIONSREADERMAKERSPARTNERSWE’RE CREATING SECURE CONNECTIONS FOR A SMARTER WORLDEnhanced security | Mesh Connectivity | Sensors | Smart LED lighting | Gateway & Cyber Security | AccessCar Entertainment | In-vehicle Networking| Car Access | Car2X and RadarSecure Bank Cards | Mobile Transactions | Loyalty-Reward | RFID Tags/Labels | Supply Chain Monitoring | NFC ReadersManufacturing Automation Temperature Monitoring | Machine Diagnosis & Control | Remote Asset Control | Fleet TrackingHospital & at-home Patient Monitoring | Fall Detection | Personal Health & Fitness MonitoringSmart Parking | Smart Roads | Traffic Congestion| Smart Lighting | Waste Managemente-passport | Smart eID | Health CardDistribution | Energy Consumption & Monitoring | Water Pressure MeasurementCloud Computing Gateways Routers & switches Security Appliances Wireless Base StationsSmartphonesSmart Watch | Activity Tracking | Smart Glass Contactless | Transport card | AccessSolutions | Micro-paymentsREADY NOW TO SUPPORT YOU TO ACHIEVE SUCCESS。

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