DELL HALOGEN FREE SPECIFICATION
国际无卤要求
卤素 halogen 非金属元素，包括：氟(Fluorine)、氯(Chlorine)、溴 (Bromine)、碘(Iodine)、砹(Astatine)五种元素； 元素符号为F、Cl、Br、I、At,其中砹为放射性元素，因 此，常说的卤素指氟、氯、溴、碘 有机卤化合物燃烧后产生二恶英，危害人体健康 某些卤素化合物是臭氧层破坏物质ODS，或温室效应物质GHG 材 料 中 卤 素 塑性材料中卤素主要是BFRs、CFRs、氯系增塑剂，其他有机溴、有 机氯化合物如色素 制冷剂、灭火剂、清洁剂、发泡剂、蚀刻剂等主要是含F、Cl、BrБайду номын сангаас的卤素化合物
危害
卤素—限制
IEC61249-2-21 Br Cl Br+Cl 企业 要求（PCB板基材中） ≤900ppm ≤900ppm （0.09%w/w) （0.09%w/w)
≤1500ppm （0.15%w/w) 要求(塑性材料)
APPLE Br＜0.09%、Cl＜0.09%、Br +Cl＜0.15%,同时限制PVC的使用 DELL SONY Br＜0.09%、Cl＜0.09%、Br +Cl＜0.15%,同时限制PVC的使用 PBB、PBDE、PCB、PCT、PCN、SCCP 1级 其他有溴化合物、其他有机氯化合物 包装材料等PVC 1级；电线PVC 3级 3级
Halogen Free(无卤素)
有毒性，而係會持久的累積在生物體內，聯合國環境規劃總署並已列入持久性有 機污染物。而一般電子零件物品也會因為鹵酸的浸蝕而無法再次利用，減少零件 再使用的機會.而且含鹵素之 CFCs 也是破壞臭氧層的主要元兇之一。
無鹵素材料產品
『無鹵素材料產品』已經是目前最新的環保趨勢，國際大廠包括 ASUS、 Dell、HP、Apple、Intel、AMD 等公司聲明將自 2008 年開始導入無鹵素材料。 再者，2008 年即將開始實施的挪威 PoHS 法令中，已明確規範十八種必須排除 的有害物質，第一類群組即為溴系耐燃劑，包括六環溴十二烷(HBCDD)與印刷 電路板中最常用的四溴丙二酚(TBBPA)等。因此，繼歐盟的 RoHS 指令要求之 後，國際間將陸續掀起訂定無鹵素產品限制使用的相關法律，無鹵素材料的導入 已經成為國際間各大廠下一階段的綠化目標，並開始制定無鹵素電子產品的量產 時程表。而無鹵素材料的開發，以及進料後相關的品管檢測機制，將成為台灣電 子產業必須克服的新挑戰。
以JSX-3400R2做無鹵素材料的快速篩選分析
z XRF快速篩選測試一般來說XRF能在不破壞樣品的情形下，準確且快速進 行樣品測試(Br/Cr), ICQ or OCQ testing application.
z RoHS 與無鹵同時完成篩檢 z 偵側極限: Cl : 10 ppm, Br : 0.9 ppm z 優點：快速、方便、簡單 z 缺點：尚無標準法規可供Cl分析參照
*氯化合物的總含量小於 900 PPM
*溴化合物的總含量小於 900 PPM
*總鹵素(氯+溴)的化合物最大含量小於 1500 PPM
國際電工協會 IEC 61249-2-21 :2003 之無鹵素材料規格
綠色產品(Green Products)
大毅合金电阻规格书-RLP系列
High Temperature Exposure
IEC60115-1- 4.23.2
JIS-C5201-4.23.2
170℃, 1000hrs
< ±1%
Low Temperature Storage
EC60115-1- 4.23.4
JIS-C5201-4.23.4
-55℃, 1000hrs
Moisture no Load
Reference
standard
IEC60115-1-4.8
JIS-C5201-4.8
IEC60115-1-4.25.1
JIS-C5201-4.25.1
Condition of Test
+25℃ ~ +125℃
Test Limits
Refer 4.0
1000hours at rated power, 70℃,
3.2 Dimension:
R004
R010
Unit : mm
Style
L
W
C
T
Material
2.0±0.2(≦4mΩ)
RLP25
6.4±0.2
3.2±0.2
Strip： Alloy
0.7 ±0.20 Over Coating：molding
0.9±0.2(R>4mΩ)
Compound UL-94V-0 grade
< ±1%
1.5hours “ON”, 0.5hour “OFF”
IEC60115-1-4.13
JIS-C5201-4.13
5 X rated power for 5s
< ±0.5%
IEC60115-1- 4.24.2.1a)
Halogen Free(HF)无卤素资料
十一、大型企业无卤规范-SONY
环境管理物质名称一览表
物质名称
镉以及镉化合物
重金属
铅以及铅化合物 汞以及汞化合物
六价铬化合物
多氯联苯（ PCB ）
多氯化奈（ PCN ）
有机氯化合物
多氯三联苯（ PCT ）
短链型氯代烷烃（ SCCP ）
其它有机氯化合物
多溴联苯（PBB）
有机溴素系化合物
超声波清洗剂进行清洗，杜绝污染源产生，并对制程首件进行卤 素测试。 定期对产品进行卤素测试，必要时送第三方机构检测，以判定产 品中卤素是否在标准管控范围内。 建立无卤专用放置区，使用无卤专用标签。
品质部：林彰斌 2015-28
注：以上资料均为网上及同行业获得
七、卤素禁用的相关法律法规1
<<蒙特利尔议定书>>： 1987年9月16日﹐24个国家在加拿大蒙特利尔市签署 了<<关于消耗臭氧层物质的蒙特利尔议定书>>﹐目前加入<<蒙特利尔议定 书>>的国家已超过183个。 根据<<议定书>>的要求﹐发达国家已经于1996年 1月1日基本完成了主要ODS (国际上把对臭氧层有破坏作用的物质统称为 ODS(Ozone Depletion Substance)，主要成分为卤化烃，以氟、氯或溴取代烷类 (如甲烷、乙烷)中的氢原子，形成含氟、氯、溴、碳的化合物)的全部淘汰。 由于多边基金所提供的财务支持﹐在国家方案已获执委会批准的100个第5条 款国家(即发展中国家)中﹐有70多个承诺在2010年前提前实现主要ODS的淘汰 ﹐同时还有很多国家承诺对部分受控物质提前淘汰﹐这将大大减少对臭氧层 的损害。
无卤相关法规知识及测试讲解
FUJITSUSIEMENS
Acer
Apple
HP
Panasoni c
NO
2009 2008End 2007只提出替代計劃 淘汰內部電線時程表2009/3/31： 日本市場2011/3/31：國際市場外 部電線尚無淘汰時間表**
NO
2009 2008End 2007只提出替代計劃 2011： PC&mobile phone針對整個 產品尚無淘汰BFR時程
<1000
◎
◎
六溴環十二烷
◎如果最終客戶要求使用特定的測試方法, 需遵守最終客戶要求
1. If end customer asks to use a particular test method, the test method should be complied.
承豐無鹵產品管控時程計劃表
時間表 計劃內容
<<斯德哥爾摩公約>>
• ★ 2001年5月22—23日﹐在瑞典首都斯德哥爾 摩﹐包括中國在內的90多個國家和地區的代表共 同正式簽署了POPs (Persistent Organic Pollutants 持久性有機污染物)公約﹐可認為是繼 <<保護臭氧層維也納公約>>(1987)和<<氣候變化 框架公約>>(1992)后﹐人類為保護全球環境而采 取共同減排行動的第三個國際公約。
• 阻燃劑的分類
•
阻燃劑依其使用方式可以分為添加型阻燃劑和反應型阻燃劑。添加型阻
燃劑通常以添加的方式配合到基礎樹脂中，它們與樹脂之間僅僅是簡單的
物理混合；反應型阻燃劑一般為分子內包含阻燃元素和反應性基團的單體，
如鹵代酸酐、鹵代雙酚和含磷多元醇等，由於具有反應性，可以化學鍵合
戴尔商用笔记本说明书
Introducing the world’s most secure laptops designed for ultimate productivity and flexibility.Experience scalability in performance and flexibility all in one series ofcommercial laptops that will thrive in your work environment. Powered by the latest Intel ® processors, NVIDIA graphics and a range of storage options from HDD to PCIe NVMe to ignite your workforce productivity.New features to the series include optional Windows Hello and an infrared camera which facilitates logon using facial recognition. Docking is now also a breeze with multiple options including DisplayPort™ over USB Type C, Thunderbolt3™ and Dell Wireless dock.Relax knowing that this series of laptops is the world’s most secure featuring optional multi-factor authentication including touch finger print reader, contacted FIPS 201 Smart Card Reader, contactless smart card reader with Control Vault 2™ FIPS 140-2 Level 3 certification.For more information visit: High-powered. Impressively agile.Sharply TITUDE 5000 SERIES 5280 | 5480 | 5580Features & Technical SpecificationsFeature Technical SpecificationsModel Number¹528054805580Processor Options17th Gen Intel® Core Processors, UDual Core 7th Gen Intel® CoreProcessors, U DualCore7th Gen Intel® CoreProcessors, H QuadCore7th Gen Intel® CoreProcessors, U DualCore7th Gen Intel® CoreProcessors, H QuadCoreOperating System1Microsoft® Windows 10 Pro 64 bitMircosoft® Windows 10 Home 64 bitUbuntu 16.04 LTS 64 bitNeoKylin 6.0 64 bit Microsoft® Windows 10 Pro 64 bitMircosoft® Windows 10 Home 64 bitUbuntu 16.04 LTS 64 bitNeoKylin 6.0 64 bitMicrosoft® Windows 10 Pro 64 bitMircosoft® Windows 10 Home 64 bitUbuntu 16.04 LTS 64 bitNeoKylin 6.0 64 bitMemory Options1,2,3DDR4 2133 MHz; 2 slots supportingup to 32GB DDR4 2133 MHz; 2slots supporting upto 32GBDDR4 2400 MHz; 2slots supporting upto 32GBDDR4 2133 MHz; 2slots supporting upto 32GBDDR4 2400 MHz; 2slots supporting upto 32GBChipset1Integrated with the Processor Integrated with theProcessor CM238Integrated with theProcessorCM238IntelResponsivenessTechnologies1,7Intel® Rapid Storage Technology Intel® Rapid Storage Technology Intel® Rapid Storage TechnologyGraphics1,13Intel® HD Graphics 620Intel® HD Graphics620NVIDIA® GeForce930MX 64 Bit Intel® HD Graphics630NVIDIA® GeForce930MX 64 BitIntel® HD Graphics620NVIDIA® GeForce930MX 64 BitIntel® HD Graphics630NVIDIA® GeForce940MX 64 BitDisplay112.5” HD (1366 x 768) Anti-glare (16:9)WLED, 200 nits, Carbon Fiber ReinforcedPolymer LCD Back12.5” FHD WVA (1920 x 1080) Anti-glare(16:9) WLED, 300 nits, Carbon FiberReinforced Polymer LCD Back12.5” FHD WVA Anti-Reflective Touch withCorning® Gorilla® Glass (1920 x 1080), Anti-Finger Print, (16:9), 360 nits, Carbon FiberReinforced Polymer LCD Back 14.0” HD (1366 x 768) Anti-glare (16:9)WLED, 200 nits, Carbon Fiber ReinforcedPolymer LCD Back14.0” FHD WVA (1920 x 1080) Anti-glare(16:9) WLED, 220 nits, Carbon FiberReinforced Polymer LCD Back14.0” FHD WVA (1920 x 1080) On-cell TouchDisplay with Truelife, 220 nits, Carbon FiberReinforced Polymer LCD Back15.6” HD (1366 x 768) Anti-glare (16:9)WLED, 200 nits, Carbon Fiber ReinforcedPolymer LCD Back15.6” FHD WVA (1920 x 1080) Anti-glare(16:9) WLED, 220 nits, Carbon FiberReinforced Polymer LCD Back15.6” FHD WVA (1920 x 1080) On-cell TouchDisplay with Truelife, 220 nits, Carbon FiberReinforced Polymer LCD BackStorage Options1,3HDD: up to 1TB, Hybrid, OPAL SED optionsSSD M.2 2280 SATA: up to 512GB, OPALSED optionsSSD M.2 2280 PCIe/NVMe: up to 512GB,OPAL SED optionsSSD M.2 2242 64GB Cache (in WWAN slot)Dell Fast Response Free Fall Sensor andHDD Isolation (standard feature)HDD: up to 1TB, Hybrid, OPAL SED optionsSSD M.2 2280 SATA: up to 512GB, OPALSED optionsSSD M.2 2280 PCIe/NVMe: up to 512GB,OPAL SED optionsSSD M.2 64GB Cache (in WWAN slot)Dell Fast Response Free Fall Sensor andHDD Isolation (standard feature)HDD: up to 1TB, Hybrid, OPAL SED optionsSSD M.2 2280 SATA: up to 512GB, OPALSED optionsSSD M.2 2280 PCIe/NVMe: up to 512GB,OPAL SED optionsSSD M.2 64GB Cache (in WWAN slot)Dell Fast Response Free Fall Sensor andHDD Isolation (standard feature)Security¹TPM 2.0 FIPS 140-2 Certified, TCG CertifiedOptional Hardware Authentication Bundle 1:FIPS 201 Contacted Smart Card with ControlVault 2.0 Advanced Authentication with FIPS140-2 Level 3 CertificationOptional Hardware Authentication Bundle2: Touch Fingerprint Reader, FIPS 201Contacted Smart Card, ContactlessSmart Card, Control Vault 2.0 AdvancedAuthentication with FIPS 140-2 Level 3Certification TPM 2.0 FIPS 140-2 Certified, TCG CertifiedOptional Hardware Authentication Bundle 1:FIPS 201 Contacted Smart Card with ControlVault 2.0 Advanced Authentication with FIPS140-2 Level 3 CertificationOptional Hardware Authentication Bundle2: Touch Fingerprint Reader, FIPS 201Contacted Smart Card, ContactlessSmart Card, Control Vault 2.0 AdvancedAuthentication with FIPS 140-2 Level 3CertificationOptional Hardware Authentication Bundle 4:Touch Fingerprint Reader, Control Vault 2.0Advanced Authentication with FIPS 140-2Level 3 CertificationTPM 2.0 FIPS 140-2 Certified, TCGCertifiedOptional Hardware Authentication Bundle 1:FIPS 201 Contacted Smart Card with ControlVault 2.0 Advanced Authentication with FIPS140-2 Level 3 CertificationOptional Hardware Authentication Bundle2: Touch Fingerprint Reader, FIPS 201Contacted Smart Card, Contactless SmartCard, NFC, Control Vault 2.0 AdvancedAuthentication with FIPS 140-2 Level 3CertificationOptional Hardware Authentication Bundle 3:Touch FIPS 201 Fingerprint Reader, FIPS201 Contacted Smart Card, ContactlessSmart Card, NFC, Control Vault 2.0Advanced Authentication with FIPS 140-2Level 3 Certification (15” only)Dell Client Command SuiteOptional Dell Data Security and Management SoftwareDell Data Protection | Endpoint Security Suite EnterpriseDell Data Protection | Encryption (Enterprise or Personal Edition)MozyPro®, MozyEnterprise®Dell Data Protection | Threat DefenseDell Data Protection | Protected Workspace Dell Data Protection | Secure LifecycleRSA NetWitness® Endpoint17VMware Airwatch® 17Absolute Data & Device SecurityRSA SecurID Access17Dell Client Command SuiteOptional Dell Data Security andManagement SoftwareDell Data Protection | Endpoint SecuritySuite EnterpriseDell Data Protection | Encryption (Enterpriseor Personal Edition)MozyPro®, MozyEnterprise®Dell Data Protection | Threat DefenseDell Data Protection | Protected WorkspaceDell Data Protection | Secure LifecycleRSA NetWitness® Endpoint17VMware Airwatch® 17Absolute Data & Device SecurityRSA SecurID Access17Dell Client Command SuiteOptional Dell Data Security andManagement SoftwareDell Data Protection | Endpoint SecuritySuite EnterpriseDell Data Protection | Encryption (Enterpriseor Personal Edition)MozyPro®, MozyEnterprise®Dell Data Protection | Threat DefenseDell Data Protection | Protected WorkspaceDell Data Protection | Secure LifecycleRSA NetWitness® Endpoint17VMware Airwatch® 17Absolute Data & Device SecurityRSA SecurID Access17Docking¹Dell Dock WD15 (optional, soldseparately)Dell Wireless Dock WLD15 (Optional,sold separately, requires optionalinstalled Intel® Tri-Band Wireless-AC18265 WiGig + Wi-Fi + BT4.28)Dell Dock WD15 (optional, soldseparately)Dell Wireless Dock WLD15 (Optional,sold separately, requires optionalinstalled Intel® Tri-Band Wireless-AC18265 WiGig + Wi-Fi + BT4.28)Dell Thunderbolt™ Dock TB 16 (optional,sold separately)Dell Dock WD15 (optional, soldseparately)Dell Wireless Dock WLD15 (Optional,sold separately, requires optionalinstalled Intel® Tri-Band Wireless-AC18265 WiGig + Wi-Fi + BT4.28)Dell Thunderbolt™ Dock TB 16 (optional,sold separately)Optical DriveOptionsExternal Options Only External Options Only External Options OnlyMultimedia¹High Quality SpeakersHeadset/mic combo jackNoise reducing array microphonesOptional HD, IR or no camera High Quality SpeakersHeadset/mic combo jackNoise reducing array microphonesOptional HD, IR or no cameraHigh Quality SpeakersHeadset/mic combo jackNoise reducing array microphonesOptional HD, IR or no cameraBattery Options1,542 WHr Prismatic, ExpressCharge™capable51 WHr Polymer, ExpressCharge™capable68 WHr Polymer, ExpressCharge™capable68 WHr Long Life Cycle Polymer(Summer 2017)42 WHr Prismatic,ExpressCharge™capable51 WHr Polymer,ExpressCharge™capable68 WHr Polymer,ExpressCharge™capable68 WHr Long LifeCycle Polymer(Summer 2017)51 WHr Polymer,ExpressCharge™capable (UMAOnly)68 WHr Polymer,ExpressCharge™capable68 WHr Long LifeCycle Polymer(Summer 2017)42 WHr Prismatic,ExpressCharge™capable51 WHr Polymer,ExpressCharge™capable68 WHr Polymer,ExpressCharge™capable68 WHr Long LifeCycle Polymer(Summer 2017)51 WHr Polymer,ExpressCharge™capable (UMAOnly)68 WHr Polymer,ExpressCharge™capable68 WHr Long LifeCycle Polymer(Summer 2017)92 WHr Polymer,ExpressCharge™capablePower Options¹65W adapter, 7.4mm barrel65W BFR/PVC Halogen Free adapter,7.4mm barrel 65W adapter,7.4mm barrel65W BFR/PVCHalogen Freeadapter, 7.4mmbarrel65W adapter,7.4mm barrel65W BFR/PVCHalogen Freeadapter, 7.4mmbarrel90W adapter,7.4mm barrel65W adapter,7.4mm barrel65W BFR/PVCHalogen Freeadapter, 7.4mmbarrel65W adapter,7.4mm barrel65W BFR/PVCHalogen Freeadapter, 7.4mmbarrel90W adapter,7.4mm barrelConnectivity options1,1410/100/1000 EthernetWireless LAN Options:Qualcomm QCA61x4A 802.11ac DualBand (2x2) Wireless Adapter+ Bluetooth4.1Intel® Dual-Band Wireless-AC 8265 Wi-Fi + BT 4.2 Wireless Card (2x2).Bluetooth OptionalOptional Mobile Broadband Options:8, 10Qualcomm® Snapdragon™ X7 LTE-A(DW5811e) (EMEA/APJ/ROW)Qualcomm® Snapdragon™ X7 LTE-A(DW5811e) for AT&T, Verizon & Sprint,US (Spring 2017)Qualcomm® Snapdragon™ X7 HSPA+(DW5811e) (China/Indonesia/India)Dell Wireless™ Telit Intel Ln-930 AP LTECAT4 (DW5814e for Japan)Optional WiGig Option:⁸Intel® Tri-Band Wireless-AC 18265WiGig + Wi-Fi + BT4.2 Wireless Card10/100/1000 EthernetWireless LAN Options:Qualcomm QCA61x4A 802.11ac DualBand (2x2) Wireless Adapter+ Bluetooth4.1Intel® Dual-Band Wireless-AC 8265 Wi-Fi+ BT 4.1 Wireless Card (2x2). BluetoothOptionalOptional Mobile Broadband Options:8, 10Qualcomm® Snapdragon™ X7 LTE-A(DW5811e) (EMEA/APJ/ROW)Qualcomm® Snapdragon™ X7 LTE-A(DW5811e) for AT&T, Verizon & Sprint,US (Spring 2017)Qualcomm® Snapdragon™ X7 HSPA+(DW5811e) (China/Indonesia/India)Dell Wireless™ Telit Intel Ln-930 AP LTECAT4 (DW5814e for Japan)Optional WiGig Option:⁸Intel® Tri-Band Wireless-AC 18265 WiGig+ Wi-Fi + BT4.2 Wireless Card10/100/1000 EthernetWireless LAN Options:Qualcomm QCA61x4A 802.11ac DualBand (2x2) Wireless Adapter+ Bluetooth4.1Intel® Dual-Band Wireless-AC 8265 Wi-Fi+ BT 4.1 Wireless Card (2x2). BluetoothOptionalOptional Mobile Broadband Options:8, 10Qualcomm® Snapdragon™ X7 LTE-A(DW5811e) (EMEA/APJ/ROW)Qualcomm® Snapdragon™ X7 LTE-A(DW5811e) for AT&T, Verizon & Sprint,US (Spring 2017)Qualcomm® Snapdragon™ X7 HSPA+(DW5811e) (China/Indonesia/India)Dell Wireless™ Telit Intel Ln-930 AP LTECAT4 (DW5814e for Japan)Optional WiGig Option:⁸Intel® Tri-Band Wireless-AC 18265 WiGig+ Wi-Fi + BT4.2 Wireless CardPorts, Slots & Chassis¹2 USB 3.0 (one with PowerShare),HDMI, VGARJ-45, external uSIM card tray optionuSD 4.0 Memory card readerHeadset/mic combo jackOptional Contacted SmartCard Readerand touch Fingerprint ReaderDisplay Port over USB Type-C™Noble Wedge Lock slot3 USB 3.0 (one with PowerShare),HDMI, VGARJ-45, external uSIM card tray optionSD 4.0 Memory card readerHeadset/mic combo jackOptional Contacted SmartCard Readerand touch Fingerprint Reader3 USB 3.0 (one with PowerShare),HDMI, VGARJ-45, external uSIM card tray optionSD 4.0 Memory card readerHeadset/mic combo jackOptional Contacted SmartCard Readerand touch Fingerprint ReaderDisplay Port overUSB Type C™Display Port overUSB Type C™with optionalThunderbolt™ 3Display Port overUSB Type C™Display Port overUSB Type C™with optionalThunderbolt™ 3Noble Wedge Lock slot Noble Wedge Lock slotDimensions & Weight1,15Width: 12.0” / 305.1mmHeight (front): 0.8“ / 21.4mmDepth: 8.3” / 211.3mmStarting weight: 3.00 lbs. / 1.36 kgWidth: 13.1” /333.4mmHeight (front): 0.9“/ 22.45mmDepth: 9.0” /228.9mmStarting weight:3.52 lbs. / 1.60 kgWidth: 13.1” /333.4mmHeight (front): 0.9“/ 22.45mmDepth: 9.0” /228.9mmStarting weight:3.63 lbs. / 1.64 kgWidth: 14.8” /376.0mmHeight (front): 0.9“/ 23.25mmDepth: 9.9” /250.7mmStarting weight:4.19 lbs. / 1.90 kgWidth: 14.8” /376.0mmHeight (front): 1.0“/ 24.3mmDepth: 9.9” /250.7mmStarting weight:4.26 lbs. / 1.93 kg (42Whr battery, M.2 SSD, non touchFHD LCD, UMA)(42Whr battery,M.2 SSD, nontouch FHD LCD,UMA)(51Whr battery,M.2 SSD, nontouch, FHD LCD,UMA)(42Whr battery,M.2 SSD, nontouch FHD LCD,UMA)(51Whr battery,M.2 SSD, nontouch, FHD LCD,UMA)Regulatory and Environmental Compliance¹Regulatory Model: P72SRegulatory Type: P72S001ENERGY STAR 6.1¹EPEAT Gold Registered. For specificcountry participation and rating, pleasesee BFR/PVC free9TAA configurations availableRegulatory Model: P72GRegulatory Type: P72G001ENERGY STAR 6.1¹EPEAT Gold Registered. For specificcountry participation and rating, pleasesee BFR/PVC free9TAA configurations availableRegulatory Model: P60FRegulatory Type: P60F001ENERGY STAR 6.1¹EPEAT Gold Registered. For specificcountry participation and rating, pleasesee BFR/PVC free9TAA configurations availableInput¹Single Pointing non-backlit KeyboardSingle Pointing backlit KeyboardMulti-touch Touchpad Single Pointing non-backlit KeyboardDual Pointing backlit KeyboardMulti-touch TouchpadDual Pointing non-backlit KeyboardDual Pointing backlit KeyboardMulti-touch TouchpadSystems Management¹Intel® vPro™ Technology (iAMT 11.6)(optional, requires Intel WiFi® Link WLANand a vPro compatible processor),Dell Client Command Suite available(/command), Factory InstalledDell Client Command | Update, DellCommand | Power ManagerIntel® vPro™ Technology (iAMT 11.6)(optional, requires Intel WiFi® Link WLANand a vPro compatible processor),Dell Client Command Suite available(/command), Factory InstalledDell Client Command | Update, DellCommand | Power ManagerIntel® vPro™ Technology (iAMT 11.6)(optional, requires Intel WiFi® Link WLANand a vPro compatible processor),Dell Client Command Suite available(/command), Factory InstalledDell Client Command | Update, DellCommand | Power ManagerWarranty and Service¹Limited Hardware Warranty4 Standard1 year Mail-in Service after RemoteDiagnosis11 optional 3, 4 and 5 yearhardware warranty extensions and3-5 year Dell ProSupport contractsavailable12Limited Hardware Warranty4 Standard1 year Mail-in Service after RemoteDiagnosis11 optional 3, 4 and 5 yearhardware warranty extensions and3-5 year Dell ProSupport contractsavailable12Limited Hardware Warranty4 Standard1 year Mail-in Service after RemoteDiagnosis11 optional 3, 4 and 5 yearhardware warranty extensions and3-5 year Dell ProSupport contractsavailable12Peripheral Ecosystem¹Purpose built ecosystem to enableproductivity on the go or at the desk.Includes Dell Dock, Dell WirelessDock, Dell Power Companions, DellProfessional Briefcases, Dell 24” & 27”Monitors and Dell Wireless Keyboardand MousePurpose built ecosystem to enableproductivity on the go or at the desk.Includes Dell Dock, Dell WirelessDock, Dell Power Companions, DellProfessional Briefcases, Dell 24” & 27”Monitors and Dell Wireless Keyboardand MousePurpose built ecosystem to enableproductivity on the go or at the desk.Includes Dell Dock, Dell WirelessDock, Dell Power Companions, DellProfessional Briefcases, Dell 24” & 27”Monitors and Dell Wireless Keyboardand MouseA t T h e D e s kDell UltraSharp DellDock – WD15Dell Multimedia Dell UltraSharp 24 InfinityEdge Monitor –U2417H WOSTDell Hybrid Adapter +Power Bank - PH45W17-BA (12”, available spring 2017)Dell Wireless Mouse – WM3261 Offering may vary by country and by configuration2 A 64-bit operating system is required to support 4GB or more of system memory.3 GB means 1 billion bytes and TB equals 1 trillion bytes; actual capacity varies with preloaded material and operating environment and will be less.4 Limited Hardware Warranty: For copy of Limited Hardware Warranty, write Dell USA LP , Attn: Warranties, One Dell Way, Round Rock, TX 78682 or see www.dell com/warranty5 Battery support is dependent upon graphics support. Check technical guides for detailed support6 COMPUTRACE Not a Dell offer. Certain conditions apply. For full details, see terms and conditions at /en/about/legal/agreements.7 Intel Rapid Storage Technology requires a HDD, mSATA, or an SSD, as primary storage device and Windows OS required8 Wireless antenna available only at time of system purchase9 Dell Latitude 5000 Series are brominated flame retardant free (BFR-free) and polyvinyl chloride free (PVC-free); meeting the definition of BFR-/PVC-free as set forth in the iNEMI Position Statement on the ‘Definition of Low-Halogen Electronics (BFR-/CFR-/PVC-free)’. Plastic parts contain less than 1,000 ppm (0.1%) of bromine (if the Br source is from BFRs) and less than 1,000 ppm (0.1%) of chlorine (if the Cl source is from CFRs or PVC or PVC copolymers). All printed circuit board (PCB) and substrate laminates contain bromine/chlorine total less than 1,500 ppm (0.15%) with a maximum chlorine of 900 ppm (0.09%) and maximum bromine being 900 ppm (0.09%).10 Mobile Broadband Subject to service provider’s broadband subscription and coverage area; additional charges apply.11 Onsite Service after Remote Diagnosis: Remote Diagnosis is determination by online/phone technician of cause of issue; may involve customer access to inside of system and multiple or extended sessions. If issue is covered by Limited Hardware Warranty (/warranty) and not resolved remotely, technician and/or part will be dispatched, usually within 1 business day following completion of Remote Diagnosis. Availability varies. Other conditions apply. 12 Dell Services: Availability and terms of Dell Services vary by region. For more information, visit /servicedescriptions. 13 GB means 1 billion bytes and TB equals 1 trillion bytes; significant system memory may be used to support graphics, depending on system memory size and other factors.14 Miracast Wireless Technology: Requires a compatible media adapter (sold separately) and an HDMI-enabled display. 15 Weights vary depending on configuration and manufacturing variability.16 Intel 7th Gen Core 15W (U) CPUs support 2133MHz memory, Intel 7th Gen Core 35W (H) supports 2400MHz Memory 17US only. WW availability in 2017 High-powered. Impressively agile.Sharply dressed.LATITUDE 5000 SERIES LAPTOPS (5280 | 5480 | 5580)。
卤素(halogen)及化合物
介绍：提供卤素元素及其化合物的测试服务，并提供准确有效的测试报告，为您实现产品无卤化提供协助。
ⅦA 族元素包括氟（F ）、氯(Cl) 、溴（Br ）、碘（I ）、砹（At ），合称卤素。
其中砹（At ）为放射性元素，在产品中几乎不存在，前四种元素在产品中特别是在聚合物材料中以有机化合物形式存在。
目前应用于产品中的卤素化合物主要为阻燃剂：PBB ，PBDE ，TBBP-A ，PCB ，六溴十二烷，三溴苯酚，短链氯化石蜡；用于做冷冻剂、隔热材料的臭氧破坏物质：CFCs 、HCFCs 、HFCs 等。
危害：在塑料等聚合物产品中添加卤素（氟，氯，溴，碘）用以提高燃点，其优点是：燃点比普通聚合物材料高，燃点大约在300℃。
燃烧时，会散发出卤化气体（氟，氯，溴，碘），迅速吸收氧气，从而使火熄灭。
但其缺点是释放出的氯气浓度高时，引起的能见度下降会导致无法识别逃生路径，同时氯气具有很强的毒性，影响人的呼吸系统，此外，含卤聚合物燃烧释放出的卤素气在与水蒸汽结合时，会生成腐蚀性有害气体（卤化氢），对一些设备及建筑物造成腐蚀。
PBB ，PBDE ，TBBPA 等溴化阻燃剂是目前使用较多的阻燃剂，主要应用在电子电器行业，包括：电路板、电脑、燃料电池、电视机和打印机等等。
这些含卤阻燃剂材料在燃烧时产生二恶英，且在环境中能存在多年，甚至终身累积于生物体，无法排出。
因此，不少国际大公司在积极推动完全废止含卤素材料，如禁止在产品中使用卤素阻燃剂等。
目前对于无卤化的要求，不同的产品有不同的限量标准：如无卤化电线电缆其中卤素指标为：所有卤素的值≦50PPM(根据法规PREN 14582) ;燃烧后产生卤化氢气体的含量＜100PPM(根据法规EN 5067-2-1) ;燃烧后产生的卤化氢气体溶于水后的PH 值≧4.3( 弱酸性)(根据法规EN-5 0267-2-2);产品在密闭容器中燃烧后透过一束光线其透光率≧60%(根据法规EN-50268-2) 。
HF(无卤)知识培训
• 危害：a.氯乙烯单体是致癌物质，也可能 损害胎儿的成长；b.大量广泛使用铅或镉 系列的稳定剂； c.会使用对儿童生长发 育有影响的邻苯二甲酸酯类增塑剂
8
有机氯类—PCBs PCTs
• 介绍：PCBs—多氯联苯 PCTs—多氯三联苯
• 其它溴素阻燃剂具有类似危害 六溴环十二烷、三溴苯酚 等
13
4. 碘类
• 用途：在医学上用做消毒、造影剂等， 化合物中碘链相当稳定，不易形成碘离 子，对人体无生理作用
• 危害：当饮用水中的碘化物含量在0.02毫 克/升到0.05毫克/升时对人体有益，大于 0.05毫克/升时则会引发碘中毒
14
五 HF的限制标准
• 危害：导致肝脏病变。但禁令现在没有完全禁 止
6
氟氯化碳CFC和氢氟氯化碳HCFC
• CFC和HCFC是被《蒙特利尔建定书》定 为全面禁止使用的对象
• 应用：主要作为冷却应用与变压器，我 国用于冷媒部分占有70%以上（例如： 冰箱压缩机、空调、汽车等）
• 危害：破坏臭氧层
7
2.有机氯类—聚氯乙烯
1.业界的HF限制标准
Apple无卤素规范，069-1857-B号文件明确规定：
Substance 物质
Chlorine（氯）
Restriction 限制
≤ 900ppm
Bromine（溴）
≤ 900ppm
Chlorine+ Bromine
≤ 1500ppm
(ppm: parts per million,百万分之一比率。1ppm=1mg/kg)
5
四 卤化物的具体介绍
无卤产品
無鹵素產品簡介(Halogen-free)Kenny Su04-09-08何謂無鹵產品鹵元素化學週期表中的第化學週期表中的第ⅦⅦA 族元素氟、氯、溴、淟、砈五種物質五種物質，，常溫下常溫下，，氟、氯是氣體氯是氣體、、溴是液體溴是液體，，碘是固體有機鹵化合物有機鹵化合物：：目前被國際法規所規範常見的約有十種聚氯乙烯(PVC)全氟辛酸(PFOA)氯化石蠟(CPs)全氟辛烷硫磺酸鹽(PFOS)含氟化合物多氯三聯苯(PCTs)四溴雙酚-A (TBBA) 多氯化多氯化萘萘(PCN)多溴聯苯醚(PBDE)多氯聯苯（PCBs)有機氯化合物多溴聯苯(PBBs)有機溴化合物(BFR) 無鹵產品目前並無法規指定無鹵產品不得含有那些鹵元素或化合物目前並無法規指定無鹵產品不得含有那些鹵元素或化合物，，是由各廠商自行定義及宣告行定義及宣告；；而國際大廠目前以不含PVC 及BFR 之產品定義為無鹵產品鹵族物質之應用被鹵化的材料有高熱抵抗功能被鹵化的材料有高熱抵抗功能，，限制它被火燃燒和提供優良的防火安全表現優良的防火安全表現，，因此溴化阻燃劑被高度使用 鹵素被廣泛應用在電子設備及它的副件包括機器盒機器盒、、印製電路板印製電路板、、IC 封裝材質封裝材質、、纜繩導線纜繩導線、、塑料零件及包裝材料件及包裝材料、、電子零組件與材料電子零組件與材料、、電子產品的接著技術、產品外殼(Housing)、染料/顏料等國際法規要求目前並無獨立之指令可依循目前並無獨立之指令可依循，，而是散出於許多其他法規中RoHS 法令中規定的聚溴聯苯(PBB)與聚溴二苯醚(PBDE)挪威PoHS 法令中法令中，，已明確規範十八種必須排除的有害物質已明確規範十八種必須排除的有害物質，，第一類群組即為溴系難燃劑即為溴系難燃劑，，包括六環溴十二烷(HBCDD)與印刷電路板中最常用的四溴雙酚-A (TBBA) 其他國際法規對氯化合物及溴化合物之標準≤1500ppm≤1500ppm≤1500ppmTotal≤900ppm ≤900ppm ≤900ppm Br(溴)≤900ppm ≤900ppm ≤900ppm CI(氯)IPC4101JPCA-ES01IEC-61249-2-21標準國際法規要求相關無鹵法規(鹵化合物)2006/07/011000ppmPBB/PBDE/TBBA (多溴聯苯/多溴聯苯醚/四溴雙酚-A)2002/95/EC2004/01/06Intentionally Added (禁用)SCCP (CPs)(短鏈氯化石蠟)2002/45/EC 2008/06/271000ppm PFOS(全氟辛烷硫磺酸/鹽)2006/122/EC 1986/06/30Intentionally Added (禁用)PCB/PCT (多氯聯苯/多氯三聯苯)76/769/EEC國際大廠時程表LVD(PVC/BFR-free)、DVD 放映機放映機、、影音產品(BFR-free)20102010Sharp LCD 板(PVC-free)、行動電話行動電話、、話筒(不含電路板)(BFR-free)20102010Samsung NB 、Walkman 、攝錄影機攝錄影機、、相機(PVC free & partly free of BFR)20102010Sony NO20092009Acer部份型號NB 之主機板為Halogen-free20092009Toshiba 有一雷射印表機1320為Halogen-free 20092009Dell NO20092009HP IPod 、iMac20082008Apple 自2008年1月1日起所有產品01/20082006Sony Ericsson設計品質設計品質36%64%下列標準之產品禁止銷往歐盟市場 產品原料成分≤50ppm成品/半成品≤1000ppm產品範圍: 所有產品指令生效日：2006年12月27日 指令實施日：2008年06月27日PFOS 指令PFOS簡介解釋：PFOS的學名叫做全氟辛烷硫磺酸，是PerfluorooctaneSulfonate的簡稱。
大毅0.5%精度电阻RMD系列选型规格书
Halogen-Free 7. Marking
7.1 ±2% & ±5%(E24) : RMD06 / RMD10 / RMD12
Resistance value is expressed by 3 digits, the first two digits represent the significant figures of nominal resistance value inΩ, and the third digit represents exponent for base of 10. E.G. :, 100 = 10×10
ｗｗｗ．ｊｅｐｓｕｎ．ｃｏｍ
Document No. TRMD-XX0S001A Revise Date page number 2012/10/18 3/10
Alloy Film Chip Resistors
(Totally Lead Free for RMD series standard)
Halogen-Free
Sn Plating
Resistive Element Ceramic Substrate
Ni Plating
3. Type Designation:
RMD
Product Code RMD : Chip Resistor
10
Size Power Rating
J
Tolerance
T
Packaging
100
IEC60115-1-4.6 JIS-C5201-1-4.6
Applying voltage 100V for 1 minute.
≧1GΩ
Resistance to DryHeatIEC60115-1-4.23.2 JIS-C5201-1-4.23.2