Lead-Free Wave Solder processing
波峰焊锡过程
5.傳送Finger變形 6.機器/Nozzle/傳送帶不水準 7. 傳送帶速度太快 8.進板方向不恰當
換Finger 調水準 降低速度 改變進板方向 90，180，270
5.焊盤上有阻焊膜 6.焊盤/元件的可焊性不好 7.焊盤和其他元件靠得太近 8.焊盤超出元件的部分太少
9.助焊劑活性太低
換助焊劑
超聲波 Flux
Preheat Station
•預熱的作用
• 作用於助焊劑
–揮發溶劑 –激活活性物質 –與保護層混合於
• 作用於板面
–減少熱衝擊 –減少熱應力作用
預熱
•預熱溫度（PCB 頂面溫度） –預熱溫度通常為
•單面板：80 -90 ºc •雙面板：90-110 ºc •多層板：100-120 ºc •對松香型助焊劑可稍高一些
4.傳送Finger變形
換Finger
4.焊盤上有阻焊膜
換PCB板 換材料
5.機器/Nozzle/傳送帶不水準
調水準
5.焊盤/元件的可焊性不好
6. 傳送帶速度太慢
提高速度
6.焊盤和其他焊盤靠得太近
修改PCB板設計,修改夾具 設計使PCB板45度焊接。 調整貼裝程式 加一個拉錫的焊盤
7.進板方向不恰當
Profile 的 制 作
Step 1>> 準備階段
需要的專案： 需要的專案 已裝有SMT &PTH 零件之 PCBA 熱電偶( K type) 高溫焊錫絲 310oC (5Sn/95Pb) 280oC (10Sn/90Pb) 高溫膠帶 Solder Iron station with high heat setting 定義 Thermo Couple wire on the PCB的位置
117142-4资料
117142-4 Product DetailsHome | Customer Support | Suppliers | Site Map | Privacy Policy | Browser Support© 2008 Tyco Electronics Corporation All Rights Reserved Searc hProducts Documentation Resources My Account Customer Support Home > Products > By Type > Product Feature Selector > Product Details117142-4Active .100, .125, .150, .156 Centerline Press-FitConnectors (AMP PACE and AMPECONOMATE)Not reviewed for RoHS ComplianceProduct Highlights:l Keying BushingView all Features | Find SimilarProductsCheck Pricing &AvailabilitySearch for ToolingProduct FeatureSelectorContact Us AboutThis ProductQuick LinksDocumentation & Additional InformationProduct Drawings:l CONNECTOR, PCB ECONOMATE II BUSHING, KEYING(PDF,English)Catalog Pages/Data Sheets:l None AvailableProduct Specifications:l Connector, ECONOMATE II, Receptacle and Blade Heade...(PDF, English)Application Specifications:l None AvailableInstruction Sheets:l INSTALLATION PROCEDURES FOR AMP* ECONOMATE* II ANDV...(PDF, English)CAD Files:l None AvailableList all Documents Additional Information:l Product Line InformationRelated Products:l ToolingProduct Features (Please use the Product Drawing for all design activity)Product Type Features:l Product Type = Keying Bushingl Style = Xl Comment = See customer drawing forapplication instructionsBody Related Features:l Flammability Rating = UL 94V-0l Bushing Material = Glass Filled ThermoplasticPolyesterl Bushing Color = Black Industry Standards:l RoHS/ELV Compliance = Not reviewed forELV/RoHS compliancel Lead Free Solder Processes = Wave soldercapable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°COther:l Brand = AMPProvide Website Feedback | Contact Customer Support。
无铅制程导入面临问题及解决方案
无铅制程导入面临问题及解决方案史建卫1，王乐1,2，徐波1,2，梁永君11.日东电子科技（深圳）有限公司，广东，深圳，5181032.哈尔滨工业大学现代焊接生产技术国家重点试验室，黑龙江，哈尔滨 150001摘要：无铅化是国际电子整机业发展的必然趋势，无铅制程的导入给企业带来新的挑战与机遇。
本文针对无铅化电子组装带来的问题给出了相应的解决方案，其中包括无铅化生产实施步骤，物料与设备的选择，工艺的制定，有毒有害物质的检测，运行成本等。
关键词：无铅钎料，波峰焊，再流焊，浸焊，手工焊中图分类号：TN305.94 文献标识号：A 文章编号：1004-4507(2006)05-0046-10 Problem and Solution in Lead-free Electronics AssemblyShi Jianwei1, Wang Le1,2, Xu Bo1,2, Liang Yongjun11.Sun East Electronic Technology Company Lt.d, Shenzhen, 518103 China2.Harbin Institute of Technology, Harbin, 150001, ChinaAbstract: Lead-free is the trend of international electronics assembly, and lead-free process induces many new problems. This article gives solutions to problems including implement process, choice of equipments and materials and setup of parameters, along with inspection and test of productions for elements with toxin, cost of run as well.Key words: Lead-free Solder; Wave Soldering; Reflow Soldering; Dipping Soldering; Handing SolderingDocument Code: A Article ID: 1004-4507(2006)05-0046-101.引言实施无铅化电子组装，许多企业并不主动，而是在各种压力下才转为无铅化生产的。
Samtec TCMD-120-SR 应用说明书
Supplemental – Cable Bend up to 25,000 Cycles
±35° Pendulum Mode --------------------------------------------- First Failure at 5638 ±35° Pendulum Mode --------------------------------------------- Last Failure at 24,118 ±90°Flex Mode ------------------------------------------------------ First Failure at 341 ±90°Flex Mode ------------------------------------------------------ Last Failure at 1,032
0°----------------------------------------------------------------------- 20.00 lbs min 90° --------------------------------------------------------------------- 20.50 lbs min
Project Number: Requested by: John Reid Part #: TCMD-120-SR Part description: TCMD Test Start: 05/05/2008
1-282817-1中文资料
Product Details for 1-282817-1Languages: English | Deutsch | Español | Português (do Brasil) | ??????? | Italiano | ????(??) | ?? (??) | ???Country Sites : China | JapanHome | Customer Support | Supplier | Site Map | Privacy Policy| Browser Support© 2006 Tyco Electronics Corporation All Rights ReservedHome > Products > By Type > Terminals & Splices > Product Feature Selector > Product Details1-282817-1ActiveTerminal Block ConnectorsRoHS Compliant(Statement of Compliance)Product Highlights:?Connector?Housing Color = Green ?Not Stacked?Without Threaded Flange ?Without Screw Flange View all FeaturesCheck Pricing &AvailabilitySearch for Tooling Product Feature SelectorContact Us About This ProductQuick LinksDocumentation & Additional InformationProduct Drawings:?TERMINAL BLOCK HEADER ASSEMBLY 90 Degree OPEN ENDS 1...(PDF, English)Catalog Pages/Data Sheets:?None Available Product Specifications:?None AvailableApplication Specifications:?Terminal Block Stacking Connectors (PDF, English)Instruction Sheets:?None Available CAD Files:?None AvailableList all DocumentsAdditional Information:?Product Line Information Related Products:?ToolingProduct Features(Please use the Product Drawing for all design activity)Product Type Features:?Product Type = Connector ?Stacked = No?Number of Positions = 11 ?Connector Type = Header ?Shrouded = Yes?Mount Angle = Right Angle?Comment = Mates with 10.0mm AMP TERMI -BLOK plugs, Basic Part Number 282808. Electrical Characteristics:?Voltage (VAC) = 750Body Related Features:?Number of Rows = Single ?Centerline (mm [in]) = 10.00 [0.394] ?Closed End = Without ?Interlock = Without?Flammability Rating = UL 94V -0Contact Related Features:?Threaded Flange = Without ?Screw Flange = Without?Contact Material = Phosphor Bronze ?Contact Mating Area Plating = Tin Housing Related Features:?Housing Color = Green?Housing Material = Polyamide 6.6Industry Standards:?RoHS/ELV Compliance = RoHS compliant, ELV compliant?Lead Free Solder Processes = Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C?RoHS/ELV Compliance History = Always was RoHS compliant Other:?Brand = BuchananSearch By:Part NumberText Tips nm l k j i nm l k j Enter a complete or partial part number...GoSign InProducts Documentation Resources My Account Customer Support About Us元器件交易网。
CKS RTE系列低Profile旋转DIP开关说明书
SpecificationsCONTACT RATING: Gold: 100 mA max. 10µ A min. 30 V DC max. 20 mVDC min.MECHANICAL LIFE: 20,000 indexations CONTACT RESISTANCE: 100 mΩ max. initial; 150 mΩ after lifeINSULATION RESISTANCE: 1010 Ω min. initial DIELECTRIC STRENGTH: 300 Vrms 1 mn OPERATING TEMPERATURE: -25°C to 85°C.STORAGE TEMPERATURE: -55°C to 85°C.PACKAGING: MaterialsCOVER: Brass, nickel plated (black or silver)BASE: PPSACTUATOR: LCPMOVABLE CONTACTS: Copper alloy, gold plated.STATIONARY CONTACTS: Brass, gold plated.TERMINALS: See page I-28 to I-29O-RING: SiliconeSOLDERING PROCESS:- Surface Mount Terminals: Infrared Reflow Soldering in accor-dance with IEC 61760-1.- Non Reverse Thru-Hole Terminals: Lead free single or doublewave soldering process according to C&K Procedure PS-LF-001- Reverse Thru-Hole Terminals: Manual soldering: 3 sec / 350°C.Lead free single wave soldering process can be used but validation of the process must be done by customerQuantitiesTerminationsActuatorTubeBox (in bulk)Carrier tape Standard Package G Flush, screwdriver slot 12501250 (1 reel)Shaft for button 750750 (1 reel)NAll versions 651950 (30 tubes)V All versions1501500 (10 boxes)RFlush, screwdriver slot 651950 (30 tubes)Shaft for button1501500 (10 boxes)Note : Specifications and materials listed above are forswitches with standard options. For information on specific and custom switches, consult Customer Service Center.DIPH–28Dimensions are shown: Inch (mm)Specifications and dimensions subject to changeNUMBER OF POSITIONSRTE04RTE1010 POSITIONS RTE1616 POSITIONS36˚0'22˚30' PC Mount-Terminal Option NRight Angle Mount-Terminal Option VSurface Mount-Terminal Option G15 Sep 22DIP1D I PH–30Dimensions are shown: Inch (mm)Specifications and dimensions subject to change2,542,540,80,103,85,05,00,67,47,28THRU-HOLEN15 Sep 22GSURFACE MOUNTDIPH–31Specifications and dimensions subject to change 1BCD CODESINGLE POLE4HEXADECIMAL CODEC&KCRD10R532C&KCRD10R5323GRAY CODE ( for RTE10 only )7GRAY CODE (for RTE04 only)CONTACT MATERIAL15 Sep 22OPTION CODECONTACT MATERIALTERMINAL PLATING4Gold: 0.5 µm Lead Free Tin7Gold: 1 µmGoldD I PH–32Dimensions are shown: Inch (mm)Specifications and dimensions subject to changeTape and reel for RTExx02Gxx 750 pieces per reel.Tape and reel for RTExx00Gxx 1,250 pieces per reel.15 Sep 22。
Lead-free wave soldering process
With the development of fine pitch devices, the assembly density is getting higher and higher, the solder joints are getting smaller and smaller, and the mechanical, electrical, and thermal loads they carry are getting heavier and heavier, but the reliability requirements are increasing, but the traditional The Sn/Pb alloy has poor creep resistance and cannot meet the reliability requirements of the modern electronics industry.Therefore, the development and application of wave soldering lead-free solder is not only beneficial to environmental protection, but also an important task to improve the quality of electronic products.1, preheating temperatureThe role of preheating is to fully volatilize the solvent in the flux, so as to prevent the soldering of the printed board and the formation of solder joints when the printed board passes the solder; the printed board is cooled to a certain temperature before soldering to avoid thermal shock. Warp deformation occurs. The preheating temperature is controlled at 180~200°C, and the preheating time is 1-3 minutes.3, wave heightThe height of the wave will change somewhat due to the welding work time. It should be properly corrected during the welding process to ensure the ideal height for welding. The tin depth is 1/2 - 1/3 of the PCB thickness.2. Orbital inclinationThe effect of the track inclination on the wave soldering effect is more pronounced, especially when soldering high density SMT devices. When the inclination angle is too small, bridging is more likely to occur, especially in the welding, the shielding area of the SMT device is more likely to be bridged; and the inclination angle is too large, although it is advantageous for the elimination of the bridge, the soldering point of the soldering point is too small, and the soldering is easy to occur. Therefore, the orbital inclination should be controlled between 5°and 7°.4, welding temperatureWelding temperature is an important process parameter that affects the quality of welding. When the soldering temperature is too low, the solder's expansion ratio and wettability deteriorate, and the solder or solder joints cannot be sufficiently wetted, resulting in defects such as soldering, pulling, bridging, etc.; when the soldering temperature is too high, This accelerates the oxidation of the pads, component leads, and solder, and is prone to solder joints. The soldering temperature should be controlled at 250+5°C.。
1-1393656-4中文资料
1-1393656-4 Product DetailsHome | Customer Support | Suppliers | Site Map | Privacy Policy | Browser Support© 2008 Tyco Electronics Corporation All Rights Reserved SearchProducts Documentation Resources My Account Customer Support Home > Products > By Type > Eurocard Connectors > Product Feature Selector > Product Details1-1393656-4 (V42254B2200Q200) TE Part Number: 1-1393656-4ActiveAdd to Part List Eurocard Type QConverted to EU RoHS/ELV Compliant (Statement ofCompliance)Product Highlights:?Mating Type = Receptacle?Number of Positions = 20?Size = Third?PCB Mount Angle = Right Angle?Post Type = Solder PostView all Features | Find SimilarProductsCheck Pricing &AvailabilitySearch for ToolingProduct FeatureSelectorContact Us AboutThis ProductRequest SamplesQuick LinksDocumentation & Additional InformationProduct Drawings:?Receptacle Assembly Eurocard(PDF, English)?Customer Drawing(PDF, English)Catalog Pages/Data Sheets:?None AvailableProduct Specifications:?None AvailableApplication Specifications:?None AvailableInstruction Sheets:?None AvailableCAD Files:?None AvailableList all Documents Additional Information:?Product Line InformationRelated Products:?ToolingProduct Features (Please use the Product Drawing for all design activity)Product Type Features:?Mating Type = Receptacle?Number of Positions = 20?Size = Third?PCB Mount Angle = Right Angle?Post Type = Solder Post?Make First / Break Last = No?DIN Level = II?PCB Retention Feature = No?Color = GrayTermination Related Features:?Termination (Solder) Post Length (mm [in]) =3.00 [0.118]Body Related Features:?Rows Loaded = A, B Contact Related Features:?Contact Material = Copper AlloyHousing Related Features:?Housing Material = Polyester GF 30%?Housing Flammability Rating = UL 94V-0Industry Standards:?RoHS/ELV Compliance = RoHS compliant, ELVcompliant?Lead Free Solder Processes = Wave soldercapable to 240°C?RoHS/ELV Compliance History = Converted tocomply with RoHS directiveOther:?Brand = AMPProvide Website Feedback | Need Help?。
7-1415025-1资料
7-1415025-1 Product DetailsHome | Customer Support | Suppliers | Site Map | Privacy Policy | Browser Support© 2008 Tyco Electronics Corporation All Rights Reserved SearchProducts Documentation Resources My Account Customer Support Home > Products > By Type > Relays > Product Feature Selector > Product Details7-1415025-1 TE Internal Number: 7-1415025-1ActiveAdd to Part List Industrial Relays (General Purpose)Converted to EU RoHS/ELV Compliant (Statement ofCompliance)Product Highlights:?RTH Series?Contact Arrangement = 1 Form C,SPDT, 1 C/O?Contact Current Rating = 16 Amps.?Monostable Coil Magnetic System?Without Coil Suppression DiodeView all Features | Find SimilarProductsCheck Pricing &AvailabilitySearch for ToolingProduct FeatureSelectorContact Us AboutThis ProductRequest SamplesQuick LinksDocumentation & Additional InformationProduct Drawings:?None AvailableCatalog Pages/Data Sheets:?Power PCB Relay RTH 105C 16A(PDF, English)Product Specifications:?None AvailableApplication Specifications:?None AvailableInstruction Sheets:?None AvailableCAD Files:?None AvailableList all Documents Additional Information:?Product Line InformationRelated Products:?ToolingProduct Features (Please use the Product Drawing for all design activity)Product Type Features:?Termination Type = Through Hole?Comment = High Ambient Temperature 105°CElectrical Characteristics:?Contact Current Rating (Amps.) = 16?Coil Resistance (?) = 1440?Coil Power, Nominal (mW) = 400?Actuating System = DC?Coil Power, Nominal (W) = 0.40?Input Voltage (VDC) = 24?Dielectric Strength -Coil Contacts (V rms) =5000?Tracking Resistance of Relay Base = PTI250?Coil Rating = SensitiveBody Related Features:?Series = RTH?Polarized = No?Enclosure Color = OrangeContact Related Features:?Mounting Options = PC Board, Socket?Enclosure = Flux-Tight?FCC Part 68 Isolation = No?Relay Type = PCB?Contact Material = Silver Nickel 90/10?Approx. Dimensions (L x W x H) (mm [in]) =29.00 x 12.70 x 15.70 [1.142 x .500 x .618]?Contact Type = Single?Pin Configuration = Industry Standard 5mm?Wiring Diagram = 1 Form C?Approved Standards = VDE Component Mark,UL Recognized for Canada and US?Number of Poles = 1 Housing Related Features:?Version = High Ambient Temperature 105°C?Pick-Up (V) = 16.8?Drop-Out (V) = 2.4Configuration Related Features:?Contact Arrangement = 1 Form C, SPDT, 1 C/O ?Coil Magnetic System = Monostable?Coil Suppression Diode = Without?Coil Selection Criteria = Nominal Voltage?Coil Latching = Without?LED Indicator = Without?Number of Coils = 1Industry Standards:?RoHS/ELV Compliance = RoHS compliant, ELVcompliant?Lead Free Solder Processes = Wave soldercapable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C?RoHS/ELV Compliance History = Converted tocomply with RoHS directive?Coil Insulation Classification = UL Class F Packaging Related Features:?Packaging Method = Carton BarOther:?Electrical Spacing = 10.0mm Clearance 10.0mmCreepage?Brand = SchrackProvide Website Feedback | Need Help?。
5-447717-1资料
5-447717-1 Product DetailsHome | Customer Support | Suppliers | Site Map | Privacy Policy | Browser Support© 2008 Tyco Electronics Corporation All Rights Reserved SearchProducts Documentation Resources My Account Customer SupportHome > Products > By Type > Pin & Socket Connectors > Product Feature Selector > Product Details5-447717-1TE Part Number: 5-447717-1ActiveAdd to Part List Subminiature D Pin/Socket Connectors forMIL-C-24308 and MIL-C-39029Always EU RoHS/ELV Compliant (Statement of Compliance)Product Highlights:?Connector?Product Series = 109?Density = Standard?Terminate To Coaxial Cable?Insert Arrangement = 3C3View all Features | Find SimilarProductsCheck Pricing &AvailabilitySearch for ToolingProduct FeatureSelectorContact Us AboutThis ProductQuick LinksDocumentation & Additional InformationProduct Drawings:?None AvailableCatalog Pages/Data Sheets: ?None AvailableProduct Specifications:?None AvailableApplication Specifications: ?None AvailableInstruction Sheets:?None AvailableCAD Files:?None Available Additional Information:?Product Line InformationRelated Products:?ToolingProduct Features (Please use the Product Drawing for all design activity)Product Type Features:?Product Type = Connector?Product Series = 109?Gender = Plug?Shell Size = 2?Shell Material = Aluminum Alloy, Steel?Front Shell Material = Aluminum Alloy?Mounting Hole Diameter (mm [in]) = 3.05[.120]?Comment = Cable clamp/strain relief hardwarecannot be used with these arrangements. Mechanical Attachment:?Rear Shell Material = SteelBody Related Features:?Insert Arrangement = 3C3?Blindmate = Yes?Non-Magnetic = No?Pins = Without?Rear Grommet = No?Power/Signal/Coax Combination = Yes?Shell Plating = Zinc?Mount Style = Mounting Holes?Front Shell Plating = Zinc with yellow chromate ?Rear Shell Plating = Zinc?Retention Clip Material = Stainless Steel Contact Related Features:?Contact Size = 20Configuration Related Features:?Density = StandardIndustry Standards:?Government/Industry Qualification = No?RoHS/ELV Compliance = RoHS compliant, ELVcompliant?Lead Free Solder Processes = Wave soldercapable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C?RoHS/ELV Compliance History = Always wasRoHS compliant?NASA Qualification = NoConditions for Usage:?Terminate To = Coaxial CableOther:?Brand = AMPProvide Website Feedback | Contact Customer Support。
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CPS Lead-Free Study CPS Lead-Free Study
Thermal Profiles
500 400
Alloy: SAC405 Flux: 615-25 Size: 0.062" Environment: Air
• The Binary & Ternary Tin, Silver & Copper alloys generally produced the fastest wetting times and maximum wetting forces. • 520°F (271°C) appears to be an appropriate solder pot temperature for these alloys when the flux used is a low solids, no-clean type. • 500°F (260°C) appears to be an appropriate solder pot temperature for these alloys with high solids content, non-activated rosin flux (Control Flux).
T top-side (ave) = 251 °C T bottom-side = 266 °C ∆ T = 15 F
Temperature (°F)
300
200 top-side TC #3 100 top-side TC #2 top-side TC #1 bottom-side TC 0 50 60 70 80 90 100 110 120 130 140 150 160 170 180 190 200
Sn63/Pb37 Sn95.5/Ag4/Cu0.5 Sn96.5/Ag3.5 Sn96/Ag2.5/Bi1/Cu0.5 Sn99.3/Cu0.7 Sn96.2/Ag2.5/Sb0.5/Cu0.8
Solder Temperature (°C)
4.5
Wetting Time (sec.)
232
238
243
%
0 0
F F
ft/min
0 0
F F
ft/min
NR330 RF800 Water Alc. (Rosin) 4.0% 4.1% 210 - 235 190 - 230 0 to +40 0 to +65 3.5 - 6.5 4.0 - 6.0 218 - 230 216 - 235 7 - 19 9 - 27 5.0 - 6.0 5.0 - 6.5
CPS Lead-Free Study CPS Lead-Free Study
Wave Machine Configuration
• • • • • Air Environment Spray Fluxer (“Accuspray”) Three bottom forced convection heaters (for water-based fluxes) Two bottom forced convection heaters (for alcohol-based fluxes) Dual wave with Air Knife – Rotary Chip Wave – Lambda Wave – Hot air knife (“Accuknife”) • Finger conveyor Electrovert Vectra Oven
(615-25 Alcohol Based)
4% solids
( NR330 Water Based)
11% solids
(5280E Water Based)
Indicates High Solids not absolutely necessary for Lead-Free.
CPS Lead-Free Study CPS Lead-Free Study
– DATA NOT SHOWN
CPS Lead-Free Study CPS Lead-Free Study
Alloy Run Order – Pot Temp.
• • • • • Sn63-Pb37 (Sn-Pb) Sn99.3-Cu0.7 (Sn-Cu) Sn96.5-Ag3.0-Cu0.5 (SAC305) Sn95.5-Ag4.0-Cu0.5 (SAC405) Sn96.5-Ag3.5 (Sn-Ag) 500º F / 260º C 530º F / 276º C 520º F / 270º C 530º F / 276º C 530º F / 276º C
To Determine Lead-Free Solder Pot Temperature
• Laboratory test designed to determine the best temperature to wave solder an alloy with.
– Data not relevant to SM0
265
271
277
280 210 140 70 0 450
460
470
480
490
500
510
520
530
Solder Temperature (°F)
CPS Lead-Free Study CPS Lead-Free Study
Wetting Balance Observations & Discussions
Time (seconds)
CPS Lead-Free Study CPS Lead-Free Study
Thermal Impact on Chemistry
• Lead-Free processing will require higher preheats to thermally pre-condition the boards prior to their contact with the higher pot temperatures.
- degreased in boiling IPA - Cleaned in Alpha 922 copper cleaner for 15 seconds - Two DI water rinses: 5 & 10 seconds - Two IPA rinses: 5 seconds each
Lead-Free Wave Solder Processing
CPS Study Phase I
Initial Lessons Learned from Cookson Performance Solutions L-F Wave Solder Study
Wetting Balance Testing
Alloy Comparison – OSP Finish/RF800 Flux
530 ºF (276 ºC) 530 ºF (276 ºC)
Indications are that Lower Temp yieldedSn-Ag Alloy higher defects for SAC.
SAC405 Alloy
For statistical data: Once a set of processing parameters was set for a given flux/alloy, all the boards in the experiment were run without further changes.
530 ºF (276 ºC)
For Air Environment applicationsInertmayEnvironment certain Sn/Cu N2 (N2) be required!
CPS Lead-Free Study CPS Lead-Free Study
CPS L-F Study Bottom of Test Vehicle
“Designed for Defects”
Note that TH Components are for position reference only and board is prior to solder.
SLS65C 5280E 615-25 Alcohol Water Alc. (RMA) 2.2% 11.0% 25.0% 210 - 250 220 - 240 180-200 0 to +65 0 to +65 not spec. 3.5 - 6.5 4.5 - 6.0 not spec. 207 - 229 230 - 256 241 - 258 9 - 25 7 - 16 9 - 24 5.0 - 6.5 5.0 - 6.0 3.0 - 6.0
• Test Conditions
– Preheat after flux immersion: Test coupon held 0.1” pot for 5 seconds – Dwell time in solder: 5 seconds – 15 test coupons per test
• Cleaned as follows:
– Higher pre-heats, ambient temp over the pot and pot temperatures, volatize off more of the flux material prior to the wave. – Fluxes need to be engineered to handle these higher temperatures.
249
254
260