RCCN Duct Corner Wiring Duct
PCB线路板其他相关中英文对照
PCB线路板其他相关中英文对照：1、主面：primary side2、辅面：secondary side3、支撑面：supporting plane4、信号：signal5、信号导线：signal conductor6、信号地线：signal ground7、信号速率：signal rate8、信号标准化：signal standardization9、信号层：signal layer10、寄生信号：spurious signal11、串扰：crosstalk12、电容：capacitance13、电容耦合：capacitive coupling14、电磁干扰：electromagnetic interference15、电磁屏蔽：electromangetic shielding16、噪音：noise17、电磁兼容性：electromagnetic compatbility18、特性阻抗：impedance19、阻抗匹配：impedance match20、电感：inductance21、延迟：delay22、微带线：microstrip23、带状线：stripline24、探测点：probe point25、开窗口：cross hatching26、跨距：span27、共面性（度）：coplanarity28、埋入电阻：buried resistance29、黄金板：golden board30、芯板：core board31、薄基芯：thin core32、非均衡传输线：unbalanced transmission line33、阀值：threshold34、极限值：threshold limit value(TLV)35、散热层：heat sink plane36、热隔离：heat sink plane37、导通孔堵塞：via filiing38、波动：surge39、卡板：card40、卡板盒/卡板柜：card cages/card racks41、薄型多层板：thin type multilayer board42、埋/盲孔多层板：43、模块：module44、单芯片模块：single chip module (SCM)45、多芯片模块：multichip module (MCM)46、多芯片模块层压基板：laminate substrate version of multi chip mod ule (MCM-L)47、多芯片模块陶瓷基数板：ceramic substrate version of multi chip mo dule (MCM-C)48、多芯片模块薄膜基板：deposition thin film substrate version of mu ltilayer module (MCM-D)49、嵌入凸块互连技术：buried bump interconnection technology (B2 it)50、自动测试技术：automatic test equipment (ATE)51、芯板导通孔堵塞：core board viafilling52、对准标记：alignment mark53、基准标记：fiducial mark54、拐角标记：corner mark55、剪切标记：crop mark56、铣切标记：routing mark57、对位标记：registration mark58、缩减标记：reduvtion mark59、层间重合度：layer to layer registration60、狗骨结构：dog hone61、热设计：thermal design62、热阻：thermal resistance。
单片机专业术语英汉互译文本
单片机专业术语英汉互译文本单片机是一种微型计算机，广泛应用于嵌入式系统和物联网领域。
在单片机的开发和应用中，涉及到大量的专业术语，下面是一些常用的英汉互译文本。
1. Microcontroller - 单片机2. Microprocessor - 微处理器3. Firmware - 固件4. Hardware - 硬件5. Embedded system - 嵌入式系统6. Interrupt - 中断7. Timer - 定时器9. Counter - 计数器10. Analog to digital converter (ADC) - 模数转换器11. Digital to analog converter (DAC) - 数模转换器12. Input/output (I/O) - 输入输出13. Port - 端口14. Pin - 引脚15. Memory - 存储器16. Flash memory - 闪存17. Random access memory (RAM) - 随机存取存储器18. Read only memory (ROM) - 只读存储器19. Electrically erasable programmable read only memory (EEPROM) - 可擦写可编程只读存储器21. Universal asynchronous receiver transmitter (UART) - 通用异步收发器22. Inter-integrated circuit (I2C) - 串行总线23. Serial peripheral interface (SPI) - 串行外设接口24. Pulse width modulation (PWM) - 脉宽调制25. Direct memory access (DMA) - 直接内存存取26. Debugging - 调试27. In-circuit debugging (ICD) - 端口调试28. Debugger - 调试器29. Integrated development environment (IDE) - 集成开发环境30. Bootloader - 引导程序32. System on chip (SoC) - 系统芯片33. Low power consumption - 低功耗34. Power management unit (PMU) - 电源管理单元35. Crystal oscillator - 晶振36. Clock cycle - 时钟周期37. Bit - 位38. Byte - 字节39. Word - 字40. Assembly language - 汇编语言41. C programming language - C语言42. High level language - 高级语言44. Integrated circuit (IC) - 集成电路45. Field programmable gate array (FPGA) - 现场可编程门阵列46. Printed circuit board (PCB) - 印制电路板47. Soldering - 焊接48. Surface mount technology (SMT) - 表面贴装技术49. Through-hole technology (THT) - 通孔技术。
电子专业英语翻译
电子专业词汇翻译1 backplane 背板2 Band gap voltage reference 带隙电压参考3 benchtop supply 工作台电源4 Block Diagram 方块图5 Bode Plot 波特图6 Bootstrap 自举7 Bottom FET Bottom FET8 bucket capcitor 桶形电容9 chassis 机架10 Combi-sense Combi-sense11 constant current source 恒流源12 Core Sataration 铁芯饱和13 crossover frequency 交叉频率14 current ripple 纹波电流15 Cycle by Cycle 逐周期16 cycle skipping 周期跳步17 Dead Time 死区时间18 DIE Temperature 核心温度19 Disable 非使能，无效，禁用，关断20 dominant pole 主极点21 Enable 使能，有效，启用22 ESD Rating ESD额定值23 Evaluation Board 评估板24 Exceeding the specifications below may result in permanent dam age to the device, or device malfunction. Operation outside of the parameters specified in the Electrical Characteristics section is not i mplied. 超过下面的规格使用可能引起永久的设备损害或设备故障。
建议不要工作在电特性表规定的参数范围以外。
25 Failling edge 下降沿26 figure of merit 品质因数27 float charge voltage 浮充电压28 flyback power stage 反驰式功率级29 forward voltage drop 前向压降30 free-running 自由运行31 Freewheel diode 续流二极管32 Full load 满负载33 gate drive 栅极驱动34 gate drive stage 栅极驱动级35 gerber plot Gerber 图36 ground plane 接地层37 Henry 电感单位：亨利38 Human Body Model 人体模式39 Hysteresis 滞回40 inrush current 涌入电流41 Inverting 反相42 jittery 抖动43 Junction 结点44 Kelvin connection 开尔文连接45 Lead Frame 引脚框架46 Lead Free 无铅47 level-shift 电平移动48 Line regulation 电源调整率49 load regulation 负载调整率50 Lot Number 批号51 Low Dropout 低压差52 Miller 密勒53 node 节点54 Non-Inverting 非反相55 novel 新颖的56 off state 关断状态57 Operating supply voltage 电源工作电压58 out drive stage 输出驱动级59 Out of Phase 异相60 Part Number 产品型号61 pass transistor pass transistor62 P-channel MOSFET P沟道MOSFET63 Phase margin 相位裕度64 Phase Node 开关节点65 portable electronics 便携式电子设备66 power down 掉电67 Power Good 电源正常68 Power Groud 功率地69 Power Save Mode 节电模式70 Power up 上电71 pull down 下拉72 pull up 上拉73 Pulse by Pulse 逐脉冲（Pulse by Pulse）74 push pull converter 推挽转换器75 ramp down 斜降76 ramp up 斜升77 redundant diode 冗余二极管78 resistive divider 电阻分压器79 ringing 振铃80 ripple current 纹波电流81 rising edge 上升沿82 sense resistor 检测电阻83 Sequenced Power Supplys 序列电源84 shoot-through 直通，同时导通85 stray inductances. 杂散电感86 sub-circuit 子电路87 substrate 基板88 Telecom 电信89 Thermal Information 热性能信息90 thermal slug 散热片91 Threshold 阈值92 timing resistor 振荡电阻93 Top FET Top FET94 Trace 线路，走线，引线95 Transfer function 传递函数96 Trip Point 跳变点97 turns ratio 匝数比，＝Np / Ns。
集成电路专业英语词汇
Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源（放大）区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium) 铝Aluminum – oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的，非晶体的Amplifier 功放扩音器放大器Analogue(Analog) comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS) 砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade 级联Case 管壳Cathode 阴极Center 中心Ceramic 陶瓷（的）Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP) 化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge) 导带(底) Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术（Cz法直拉晶体J）Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOS Depletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片（复数dice）Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package （DIP）双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship) 爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心Electron Volt (eV) 电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边（拥挤）效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取（编程）存储器Error function complement 余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程（扩散）Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁（变）噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs) 砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss（ian）高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge) 锗Graded 缓变的Graded (gradual) channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor（HBT）异质结双极型晶体High field property 高场特性High-performance MOS.( H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂志散射Incremental resistance 电阻增量（微分电阻）In-contact mask 接触式掩模Indium tin oxide (ITO) 铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current （泄）漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid－phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED) 发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型Majority carrier 多数载流子Mask 掩膜板，光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction梳状发射极结Mean time before failure (MTBF) 平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块Multiplication coefficient倍增因子Naked chip 未封装的芯片（裸片）Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发（易失）性Normally off/on 常闭/开Numerical analysis 数值分析Occupied band 满带Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子Optical quenching光猝灭Optical transition 光跃迁Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Passination 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo) resist （光敏）抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎（效应）Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor聚合物半导体Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB) 印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通Pulse triggering/modulating 脉冲触发/调制PulseWiden Modulator(PWM) 脉冲宽度调制Punchthrough 穿通Push-pull stage 推挽级Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi – Fermi－level准费米能级Quartz 石英Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器（管）Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可靠性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管（器）Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路Sapphire 蓝宝石（Al2O3）Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT) 热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关Tailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress) 晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing) 隧道（穿）Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间Ultraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原（元）胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关Vacancy 空位Vacuum 真空Valence(value) band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动Voltage 电压Wafer 晶片Wave equation 波动方程Wave guide 波导Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿Zone melting 区熔法。
芯片工艺中英文术语 corner
芯片工艺中英文术语 Corner 的深度解析 In the realm of semiconductor chip manufacturing, the term "corner" plays a pivotal role in the precision and reliability of the end product. It refers to theextremities or limiting conditions within a specified process window, encompassing a range of parameters such as temperature, voltage, and process variations. Understanding and mastering the concept of corners is crucial for ensuring the optimal performance and yield of semiconductor chips.The concept of corners in chip processing is akin to exploring the boundaries of a complex multi-dimensional space. Each dimension represents a different process parameter, and the corners are the extreme points where these parameters intersect. These corners often represent the most challenging conditions for the manufacturing process, as they push the limits of the technology and materials used.In English terminology, corners are typically referenced in the context of process characterization and optimization. For instance, the term "corner case" refersto the extreme or worst-case scenarios that must be accounted for in the design and manufacturing process. These corner cases are often identified through rigorous simulation and experimental validation, ensuring that the chip performs reliably under all conditions.Moreover, the concept of corners is closely related to the idea of "design for manufacturing" (DFM). In DFM, the goal is to optimize the design of the chip to minimize the impact of process variations and maximize yield. This involves careful consideration of the corners, ensuringthat the design can tolerate the widest range of process conditions without compromising performance.On the Chinese side, the term "corner" is translated as "角落" or "极限条件"，reflecting its dual meaning of both a physical extremity and an extreme condition. In the context of chip processing, this translation captures the essenceof the concept, emphasizing the need to consider the most challenging conditions in the manufacturing process.在芯片制造领域，"corner"这一术语对于最终产品的精度和可靠性起着至关重要的作用。
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电子工程专业英语词汇(整理版)
电子工程专业英语词汇(整理版)本文档旨在提供电子工程专业所涵盖的一些常用英语词汇，帮助读者增强在该领域的英语沟通能力。
以下是一些相关词汇的介绍和解释：1. Circuit（电路）2. Semiconductor（半导体）A semiconductor is a material that has a conductivity between that of an insulator and a conductor. It can control the flow of electric current and is widely used in electronic devices, such as diodes and transistors.3. Microcontroller（微控制器）4. Signal（信号）A signal refers to any form of information that can be transmitted, such as sound, light, or electron flow. In electronic engineering, signals are often manipulated and processed to carry information or control electronic devices.5. Amplifier（放大器）6. Integrated Circuit（集成电路）7. Digital Signal Processing（数字信号处理）Digital signal processing (DSP) refers to the manipulation of digital signals using algorithms and techniques. It involves converting an analog signal into a digital form, processing it using digital systems, and then converting it back to an analog signal if needed.以上是一些电子工程专业常用的英语词汇，希望对读者有所帮助。