Estonian Excellence Centre of Dependable Computing
香港留学英文面试自我介绍

香港留学英文面试自我介绍Good morning/afternoon, distinguished panel. Thank you for giving me this opportunity to introduce myself. My name is [Your Name], and I am deeply honored to be here for this interview, pursuing my aspiration to further my academic journey at [University/Program Name] in Hong Kong.Background and Education:I am currently in my final year of undergraduate studies at [Your Current University], majoring in [Your Major]. Throughout my academic career, I have consistently demonstrated a strong passion for [mention a specific area or skill related to your major, e.g., Economics with a focus on International Finance, or Computer Science with a special interest in Artificial Intelligence]. My GPA stands at [Your GPA], reflecting my dedication and hard work in achieving academic excellence.Research and Project Experience:To complement my theoretical knowledge, I have actively engaged in research and practical projects. Last summer, I had the privilege to intern at [Company/Research Institution Name], where I contributed to a project exploring [briefly describe the project and your role, e.g., "the development of a machine learning algorithm to optimize supply chain management"]. This experience not only honed my analytical and problem-solving skills but also instilled in me a deep appreciation for the practical applications of my field.Extracurricular Activities and Leadership Roles:Beyond academics, I am an avid participant in extracurricular activities. As the President of [Club/Society Name], I led a team of [number] members in organizing [briefly describe an event or initiative, e.g., "the annual International Culture Festival, which successfully attracted over 500 participants from diverse backgrounds"]. This role taught me invaluable skills in team management, event planning, and public speaking, all of which I believe will be highly beneficial in my future academic and professional endeavors.Why Hong Kong and This Program?Hong Kong has always fascinated me with its unique blend of Eastern and Western cultures, as well as its status as a global financial and technological hub. The [University/Program Name] offers a world-class education in [mention the specific area of study or research you're interested in], renowned for its innovative curriculum, state-of-the-art facilities, and diverse student body. I am particularly drawn to the program's emphasis on [mention a specific aspect, e.g., "interdisciplinary collaboration," "practical application of theories," or "research opportunities with industry partners"]. I am confident that this program will provide me with the platform to not only deepen my understanding of [your field] but also to broaden my horizons and prepare me for the challenges of the 21st century.Future Goals and Aspirations:Upon completion of my studies, I aspire to [briefly describe your career goals, e.g., "work as a financial analyst in a top multinational corporation, leveraging my skills in data analysis and problem-solving to drive business growth"] or [if pursuing further studies, "pursue a Ph.D. in [field], with the ultimate goal of contributing to groundbreaking research that can positively impact society"]. I believe that the knowledge and experiences I will gain from this program will be instrumental in helping me achieve these goals.In conclusion, I am excited about the prospect of joining the [University/Program Name] community and contributing to its vibrant academic life. Thank you again for considering my application. I look forward to the opportunity to discuss further how I can contribute to and benefit from this esteemed institution.。
爱因斯特(IAESTE)国际大学生实习交流项目2018-2020

爱因斯特(IAESTE)国际大学生实习交流项目2018-2020项目简介全称: “国际大学生技术经验交流协会”(The International Association for the Exchange of Students for T echnical Experience)。
1948年成立于英国伦敦帝国理工大学,是一个拥有70多年历史的国际大学生专业实习交流组织。
全球每年约有4000家企业、1300家高校和6000多名学生参与,累计交流总数超过30万人。
基于联合国组织架构,爱因斯特是由各成员国委员会组成的联合体。
所有中国同学在实习目的国的带薪实习岗位,都由爱因斯特所在国机构和当地团队负责安排,且所有实习岗位都只要求用英语沟通。
自2018年9月起,所有中国籍高校学生(包括本科生、研究生和博士生)及毕业生,无论你目前在中国境内大学就读,还是在国外大学留学,都可以通过网络平台,参与申请由爱因斯特中国与其它近90个爱因斯特成员国,在每年1月国际年会上交换获得的全球范围内不同专业的海外实习岗位Offer,其中大部分是理工科和商科类专业。
爱因斯特目前向中国籍学生开放申请的海外项目,有以下四大类别:IAESTE的使命:在成员国之间,建立起一个提供高品质且注重实用性的培训交流平台,从而加速技术和专业领域的发展,增进学生、教师、学校、雇主和社会之间的友好关系,拓展各方的国际化视野。
推动不同种族、肤色、性别或宗教信仰的群体间的交流和理解。
IAESTE的宗旨:致力于为高等院校的在读学生,提供与专业和研究领域相关的技术实践机会。
致力于为雇主方提供高质量且主观能动性高的学生培训生。
致力于促进不同国家的文化间的相互理解和共同繁荣。
项目网址:/项目官方微信:IAESTE-China选拔范围:●学历要求:在读大二及以上本科生(转专业至18级可申请);●专业范围:1.数学统计及计算机类专业;2.通讯工程及计算机类专业;3.电气与电子工程类;4.生态环境工程类;5.物理、化学、生物等理科类;6.商业管理等文商科类;7.机械工程及材料类;●语言要求:⏹工作语言均为英语,申请英语母语国家的要求是大学英语六级/雅思6.0;申请非英国家的要求是大学英语四级/雅思5.5。
阿博留学全面介绍格拉健康应用技术大学

格拉健康应用技术大学关键词:私立院校简介:格拉健康应用技术大学FACHHOCHSCHULE FUR GESUNDHEIT是德国一所以保健技术为主要专业方向的私立高等院校。
成立于2006年。
格拉健康应用技术大学的特点在于:学校提供接近于保健职业的,以实践为导向的专业教育。
课程内容的设置充分考虑职业技能和技术的发展变化。
该校所有的专业设置都针对日益学术化和科学化的保健职业。
该校的医药教育学和跨学科的早期干预专业,均为德国范围内首次设立。
历史发展:它成立于2006年,并于2007年春季得到国家认可。
格拉健康应用技术大学分别提供本科和硕士研究生教育,使从该校毕业的学生更为国际化,具有更强国际竞争力。
创立者:校训和校徽:官网:www.gesundheitshochschule.de/de办学条件综合排名:无办学理念:以实践为导向学术声誉:于2007年春季得到国家认可。
格拉健康应用技术大学分别提供本科和硕士研究生教育,使从该校毕业的学生更为国际化,具有更强国际竞争力。
知名人物:知名华人:特色学制:学校提供接近于保健职业的,以实践为导向的专业教育。
课程内容的设置充分考虑职业技能和技术的发展变化。
师资力量:优秀教师众多,已经培养了为数众多的优秀毕业生。
该校所有的专业设置都针对日益学术化和科学化的保健职业。
该校的医药教育学和跨学科的早期干预专业,均为德国范围内首次设立。
硬件设备:语言中心和新的资料中心极大地为语言学习的各方面提供了帮助。
学校体育设施优良。
校园生活(图文形式呈现)校园环境:该校所有的专业设置都针对日益学术化和科学化的保健职业。
该校的医药教育学和跨学科的早期干预专业,均为德国范围内首次设立。
气候状况:年平均气温8摄氏度,冬季气温在零下2摄氏度到2摄氏度之间,夏季气温在14摄氏度到24摄氏度之间。
年降雨量为500毫米本土生活:图林根除了富有魅力的自然景色外,它的许多中世纪的城镇称得上是名副其实的文化圣地。
英国游学留学国际语言学校之EF伊斯特本校区介绍

伊斯特本(Eastbourne),英国英格兰东南区域东萨塞克斯郡最大的镇、自治市镇。
当地自从石器时代已经有人类活动,但直到19世纪仍然是个由四个小村落合并成的小市镇。
籍著铁路的发展,伊斯特本成了一个原始维多利亚式的度假区。
伊斯特本的「阳光海岸」沙滩和它靠近伦敦的地理位置,使其成为英格兰最时髦的度假胜地之一。
悠闲的咖啡馆和热闹的俱乐部现场吸引着国游客,它也是帆船、帆板、骑马或在陡峭的海边悬崖间徒步旅行的理想目的地。
如果你不喜欢游客聚集的大城市,又想感受海滨英伦小镇的风情,那就来吧。
1.在伊斯特本国际语言学校体验语言环境与文化的多样性伊斯特本校区有来自五大洲的学生们,在这里你将和这些异国伙伴组成不多于17人的国际化小班,感受浓厚的多文化氛围,得到更多开口说英语的机会。
360度的全英语小班课堂相信学外语的你,肯定遭遇过这样的尴尬:听老师上课说着挺好,转头就忍不住和身边的小伙伴说起了中文...然而在我们的海外校区,你不会有这样「偷懒」的机会,因为你身边的小伙伴,几乎都是外国人!出发前和到达校区的第一天,你将接受全面的英语水平分班测试,然后进入最适合你水平的班级学习。
每个班的中国学生一般不超过两个,外教还会特意分开你和TA的座位,使你不得不与外国同学多说话。
在这个过程中你将逐渐提升外语自信度,并加强语言运用的能力。
课堂中使用的教材,由我们联合剑桥大学、语言专家们根据游学特性量身编制,不再是枯燥无趣的背单词、记语法,你会体验到形式多样的上课方式。
Presentation、Role Play、Questionaire Survey......甚至还会写剧本、编歌词,在和同学们玩各种游戏的过程中,身体力行地学习、运用外语。
课程结束时,通过再次测试,你将获得一份证明了你进步的结业证书。
不止是语言外语课程主要课程:每周26节课,将从课堂里学到的语言技能运用于海外生活,从而获得对语言能力的深入理解及掌握。
通过分组学习,互动性课堂,项目设计以及个性化课程,会逐步拥有扎实的,最大化的语言能力进步。
云南财经大学与新西兰商学院“3+1学分互认项目相关情况介绍

财经大学与新西兰X学院“31"学分互认项目相关情况介绍★项目进展情况:财经大学2021年10月派出首批新西兰X学院31学分互认项目学生3人,现已通过高级英语课程考试,进入专业课学习.预计在2021年12月获得新西兰X学院七级本科证书,免雅思直升新西兰林肯大学攻读硕士(15个月)。
2021年1月18至2月16日,财经大学派出首批赴新西兰X学院游学团。
游学团成员们在新西兰进行国际英语强化学习、参观企业和浏览新西兰南岛,收获颇多。
★NZCBinfo |2021新西兰X学院&林肯大学商学升本升硕学位手册://mp.weixin.。
/s?__biz=MzA3NT3NTgwNA==&mid=204342355&idx=1&sn=c99b369657d496bce5e55a8e8f9ea0bd&s cene=0#rd★圆梦新西兰――不用死磕雅思也能直升名校(NZCB)作为新西兰第五大出口,每年有8万多国际学生在新西兰留学,截止2021年前两个学期,国际教育的总产值已达28.5亿纽币.然而,一边是海外教育蓬勃,另外一边却是留学生们遭遇的困境。
毕竟,留学看似美好,语言关却难过—-对于不少怀揣着留学梦的学生们来说,语言是横亘在我们与理想学府之间的一道无法绕开的壁垒。
而在来到一个陌生的国度后,语言也是我们了解不同文化、融入当地的最重要“法宝”。
你曾经有过因为雅思差0.5分而被梦想的学校拦在门外的郁闷时刻吗?你知道,其实不用和雅思“殊死搏斗”也能进名校吗?我就是一个成功案例,我现在是坎特伯雷大学商学系主修金融会计专业的一名本科生,我很高兴与大家分享我的入学途径。
“新西兰X学院可以为留学生们提供最便捷有效的途径,帮助大家在最短的时间内提高英语水平,并打好专业基础,直升自己心中理想的大学."这就是我要告诉大家的途径!新西兰X学院是全新西兰唯一的IESOL考点。
这个考试被承认可入学专科、本科和研究生,可以让学生无需再考雅思,即可直升林肯大学、梅西大学、坎特伯雷大学等,这个考试备受留学生们欢迎。
上海市浦东新区2021届高三上学期一模英语试题含解析

18. A. His flight number and arrival time.
B. The cause of the flight's late arrival.
C. The number of his luggage check.
D. It can create smells and give them off to any scene.
15. A. It helps shoppers locate the right brand of perfume.
B. It helps shoppers check out the perfumes before they buy.
阅读下面短文,在空白处填入1个适当的单词或括号内单词的正确形式。
Since astronomers confirmed the presence of planets beyond our solar system, called exoplanets, humans_________1_________(wonder) how many could harbor life.
Our galaxy holds at least an______4______(estimate) 300 million of these potentially habitable worlds, based on even the most conservative interpretation of the results in a new study to be published in The Astronomical Journal.
德国哥廷根大学基本概况

德国哥廷根大学基本概况哥廷根大学成立于1737年,是启蒙运动批判精神的产物,目前在QS 世界大学排名中位列181位。
下面是整理并翻译的哥廷根大学基本概况,供大家参考。
一、关于哥廷根大学Georg-August University of Goettingen was founded in 1737. As aninstitution is resulted from the critical spirit of the Enlightenment. GeorgiaAugusta succeeded in producing or offering temporary scientific shelter toworld-class researchers throughout the ages who have contributed to theUniversity's international reputation in the natural sciences as well as in thearts. Goettingen is linked with over 40 Nobel Prize winners who researched andlived here during their times. The high standard of research and research-basedteaching provides continuing inspiration to expanding the University'sexcellence as it faces the challenges confronting universities in the 21stcentury. Reform projects in research, teaching and administration provide a firmbasis for the future.哥廷根大学成立于1737年,是启蒙运动批判精神的产物。
Espressif Systems (Shanghai) Co.,Ltd.产品说明书

EMITIDO POR / ISSUED BYLGAI TECHNOLOGICAL CENTER - No. 0370 (APPLUS)SOLICITANTE / APPLICANTEspressif Systems (Shanghai) Co.,Ltd.FABRICANTE (Nombre, Dirección)MANUFACTURER (Name, Address) Espressif Systems (Shanghai) Co.,Ltd.Suite 204, Block 2, 690 Bibo Road, Zhang Jiang Hi-Tech Park, Shanghai, China COMERCIALIZADO POR (marca)COMMERCIALISED BY (Brand) ESPRESSIFPRODUCTOPRODUCT Wi-Fi & Bluetooth Internet of Things Module TIPOSTYPESESP32-S3-MINI-1U Versión HW / FMWHW / FMW versionSW: V1.1.3.0HW: V1.0DIRECTIVA APLICABLEAPPLICABLE DIRECTIVEDIRECTIVA 2014/53/UE DEL PARLAMENTO EUROPEO Y DEL CONSEJO, DE 16 DE ABRIL DE 2014, RELATIVA A LA ARMONIZACIÓN DE LAS LEGISLACIONES DE LOS ESTADOS MIEMBROS SOBRE LA COMERCIALIZACIÓN DE EQUIPOS RADIOELÉCTRICOSDIRECTIVE 2014/53/EU OF THE EUROPEAN PARLIAMENT AND OF THE COUNCILOF 16 APRIL 2014 ON THE HARMONISATION OF THE LAWS OF THE MEMBER STATES RELATING TO THE MAKING AVAILABLE ON THE MARKET OF RADIO EQUIPMENTDESCRIPCIÓNDESCRIPTIONThe device is a Wi-Fi & Bluetooth Internet of Things Module with Wi-Fi 2.4G and Bluetooth.CUMPLE CON LOS REQUISITOS ESENCIALESMEET ESSENTIAL REQUIREMENTSArt.3.1a Salud y Seguridad / ☒Art.3.1a Health & SafetyArt. 3.2 Uso eficiente del espectro radioeléctrico / ☒Art.3.2 Efficient use of Radio spectrumArt.3.1b EMC / ☒Art.3.1b EMC Art 3.3 Características especiales / ☐Art.3.3 Special characteristicsEste documento carece de validez sin su anexo, cuyo número coincide con el del presente certificado. // This document in not valid without its technical annex, whosenumber coincides with the number of the certificate.La evaluación de la documentación técnica entregada se encuentran recogidos en el expediente técnico número: 22/36400865The evaluation of the technical documentation delivered is included in the technical file number: 22/36400865Restricciones (si aplican) / Restrictions (if apply):Bellaterra, 17 de marzo de 2022 // 17th March 2022José Luis Medina DirectorElectrical & Electronics - SpainEste Certificado es válido mientras no se produzcan cambios en el estado de la técnica que indiquen que el equipo radioeléctrico aprobado ya no puede cumplir los requisitos esenciales de la Directiva 2014/53/UE y no haya notificaciones en el tipo aprobado que puedan afectar a la conformidad con los requisitos esenciales de la Directiva 2014/53/UEThis Certificate is valid as long as there are no changes in the prior art indicating that the approved radio equipment can no longer meet the essential requirements of Directive 2014/53/EU and No.0370-RED-5007LGAI Technological Center, S.A. (APPLUS)Campus UAB - Ronda de la Font del Carme s/n 08193 Bellaterra (Barcelona) T +34 93 567 20 00 F +34 93 567 20 01 No.CERTIFICADO DE EXAMEN UE DE TIPOEU-TYPE EXAMINATION CERTIFICATEF +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492A. MODEL DESCRIPTIONA.1. GENERAL INFORMATION ON THE RADIO EQUIPMENT:Manufacturing country: China Brand: ESPRESSIFCommercial designation: ESPRESSIFCountry of commercialization: European UnionRadio service: Wi-Fi 2.4G and BluetoothApplication: Wi-Fi & Bluetooth Internet of Things ModuleA.1.1 TRADE VERSIONS/VARIANTS: ESP32-S3-MINI-1UA.2. FEATURES: Wi-Fi & Bluetooth Internet of Things ModuleA.3. SOFTWARE VERSION(S): V1.1.3.0A.4. HARDWARE VERSION(S): V1.0A.5. OTHER COMPONENTS- Disposable antenna YES ☐ NO ☒o Antenna gain (dBi)*:(*) only in case of YESF +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492A.6. OPERATING FREQUENCIES AND MAXIMUM POWER EMITTED BY BANDN/A: Not applicable N/D: Not defined* Conducted power for mobile technologies and EIRP for other technologies.A.7. OTHER PARAMETERS OF RADIO INTERFACE SPECIFICATIONS (RI)Requires license/Use authorization: YES ☐ NO ☒BAND SERVICEOPERATIONAL FREQUENCY(TX)MAX POWER* CNAF IR CNAF/ UN-XXX Band 1 BLE F_min: 2402MHz F_max: 2480MHz 9.25 dBm IR-163 UN-85 Band 2WiFi 2.4GHzF_min: 2412MHz F_max: 2472MHz19.95 dBmIR-163UN-85F +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492B. TEST PROTOCOLREQUIREMENT STANDARDLaboratory Report no. Health and Safety (Article 3.1a) EN IEC 62368-1:2020+A11:2020 TA Technology(Shanghai) Co., Ltd. R2112A1105-L1 EN 50665:2017 R2112A1105-M1 EN IEC 62311:2020 EMC (Article 3.1b) EN 301 489-1 V2.2.3 TA Technology(Shanghai) Co., Ltd.R2112A1105-E1EN 301 489-17 V3.2.4EN 55032:2015+A11:2020 EN 55035:2017+A11:2020 Radio Aspects (Article 3.2) EN 300 328 V2.2.2TA Technology(Shanghai) Co., Ltd.R2112A1105-R1C. RESTRICTIONSRestrictions: YES ☐ NO ☒ Describe restrictions: N/AF +34 93 567 20 01Anexo técnico Ed. 117/03/2022ANEXO TÉCNICOTECHNICAL ANNEX0370-RED-5007L G A I T e c h n o l o g i c a l C e n t e r , S .A . C .I .F A 63207492D. ACTIVITIES CARRIED OUT BY THE NBTechnical Documentation Review☐ Assembly drawings(s) ☒ Block diagram ☒ Circuit diagram/schematics ☒ External photographs ☒ Label drawing/location ☒ User manual ☒ Internal photographs ☒ Operational description ☒ Risk Assessment☒ Test set-up photographs☒ Test reports ☒ EU declaration of conformity ☒ Bill of materials☒ PCB layout☐ Installation diagrams and explanations☒ List of applied (harmonized and non-harmonized) standardsOther activities☒ RIS☒ EFIS/CNAF☒ Review Technical Justifications ☒ Analysis report☒ EU type certification issuedE.ADDITIONAL INFORMATION:Radio Equipment Directive 2014/53/EU, Article 10.4: Manufacturers shall keep the technical documentation and the EU declaration of conformity for 10 years after the radio equipment has been placed on the market.Radio Equipment Directive 2014/53/EU, Annex III, Module B.7: The manufacturer shall inform the notified body that holds the technical documentation relating to the EU-type examination certificate of all modifications to the approved type that may affect the conformity of the radio equipment with the essential requirements of this Directive or the conditions for validity of that certificate. Such modifications shall require additional approval in the form of an addition to the original EU-type examination certificate.This review includes draft standards, deviations from the standards and technical justification for compliance.。
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Estonian Excellence Centre of Dependable Computing(2003-2007)Research Team:Design and Test of Digital Systems (DT)EngineeringDepartmentComputerLeader of the research team:Raimund-Johannes Ubar, DSc, professor, Dept. of Computer Engineering, TTURaja 15, 12618 TallinnPhone: +372 620 2252Fax: +372 620 2253e-mail: raiub@pld.ttu.eehttp://www.pld.ttu.ee/~raiub/Senior staff of the team: P. Ellervee (assoc. prof., CE/TTU), M. Kruus (assoc. prof., CE/TTU), J. Raik (sen. res., CE/TTU), K. Tammemäe (assoc. prof., CE/TTU), A. Sudnitsõn (assoc. prof., CE/TTU), M. Tombak (prof., CS/UT), R.-J. Ubar (team leader, prof., CE/TTU).Research fields: The scientific goals of the DT research group are closely related to the most highly recognized guidelines for design and test solutions of “The MEDEA Design Automation Roadmap”. MEDEA (Micro-Electronics Development for European Applications) is a part of the pan-European EUREKA network for cooperative R&D in computer-aided design (CAD) and design automation. The team is involved in the following research fields: design and test of digital systems, self-testing and fault tolerance. The main target of the research is: to develop new efficient methods for modeling, design and test of digital systems to quarantee the efficiency, high quality and fault tolerance of systems in the conditions of continuously increasing complexities. To reach this target the team has competence, and is actively working with the following more specific problems: diagnostic models for digital systems, automatization of test program generation, fault simulation and fault diagnosis in digital systems, physical defect oriented fault analysis, decompositional design and design error diagnosis in digital systems, analysis and partitioning methods for hardware/software codesign, and development of unified representation of systems for control and memory intensive applications.Most important results of the recent years:Systems modeling and synthesis. Design/synthesis. Prototype high-level synthesis tool targeting control and memory intensive applications has been developed [1]. The tool makes efficient use of commercial logic synthesis tools thus allowing designers to start with design entry from higher abstraction levels [2]. In the field of emulation, an accelerator for fault simulation based on reconfigurable hardware (FPGAs) was developed with a novel method for fault injection [3-5]. The experimental research demonstrated very high speed in fault simulation of sequential circuits. Compared to software based solutions the speed increased more than 200 times. Experiments also showed that it is beneficial to use emulation for circuits/methods that require large numbers of test vectors, e.g. simulation-based test pattern generation or validation.Diagnostic modeling. The recent activities of the research group have been related to the fundamental research on mathematical models for diagnostic simulation of digital systems and application research in the field of hierarchical test generation and fault simulation of digital systems. In this field of basic research, the department had a pioneering position in the world with introducing the SSBDDs for the logic level, and generalizing the BDDs for using at higher level abstractions of digital systems [6-17].The main difference of SSBDDs compared to the traditional BDDs [18] is in the novelty of representing the structure along the functions [19,20]. A uniform multi-level model for digital systems based on DDs as an extension and generalization of the BDDs has been also developed by the group [19,21]. The DD model allowed us to develop efficient methods for simulating digital systems in a very fast way by uniform algorithms at different logic, RTL, ISA or behavioral levels [20-22]. Promising results have been obtained by SSBDDs in delay simulation [23], design error diagnosis [24,25], fault simulation [26,27], and in jointly using SSBDDs and high-level DDs for hierarchical ATPGs [28-30].Verification and debug. The research group has participated in verification related research in the framework of European 6th FP STREP project VERTIGO (2006-2008) and in the national Development Center programme (2004-2007). The international research partners include universities of Verona, Southampton and Linköping. As a result of these projects, High-level Decision Diagram (HLDD) based modeling forverification of register-transfer and system level digital systems has been developed [31]. Efficient methodsfor code coverage analysis and assertion checking [32] using HLDDs have been introduced. In the field of design error diagnosis, a new conception and method was developed, which allows to adopt in a straightforward way the methods and tools of fault diagnosis used in hardware testing for the use in design error diagnosis [33,34]. A new approach for design error diagnosis was developed that does not exploit error models [24,25].Test generation. A new approach to defect-oriented fault simulation has been developed, based on mapping the physical defects into higher level constraints [35,36]. The first time, a method and tool were created for proving redundancy of physical defects, which allows to evaluate the quality of tests more adequately compared to existing tools [36-39]. The new functional fault model creates a simple conception and basis for hierarchical defect oriented test [35,36].The results in testing SoC and NoC can be classified as: (1) solving the test application and fault detection problem in GALS structures [40] and (2) design of a reconfigurable embedded test generation solution that supports a trade-off between test speed and test quality and is designed for multi-layer on-chip interconnect structures [41]. Both methods target delay and crosstalk faults. A novel Boundary Scan-like BIST conceptionfor autonomous at-speed testing and diagnosis of interconnects was developed [42-44]. The new paradigm brings a never achieved before high level of universality, scalability, and configuration independence into theat-speed interconnect testing and diagnosis of interconnect.Most of the previously published NoC test methods are relying on scan-based approaches. In [45,46] the research group proposed an external well scalable test approach that is based on deriving test configurations from functional fault models for the crossbar switch. A new generalized approach to testability calculation was developed [29,47]. Based on the testability guidance, a very fast RT-level ATPG DECIDER [28] has been developed.Design for testability. In self-test, a close cooperation between TTU and Linköping University, Sweden has given several original results in the area of hybrid BIST. The results have been reported in many high-quality conferences, like DFT, ATS, ETS [48], and in 2 book chapters [55,56]. The new results achieved by the group can be formulated as follows: (1) A novel method for fast cost estimation for variations of test processes with complex structure [48,49]. (2) Based of the fast cost estimation method, very efficient iterative methods were developed for optimizing hybrid sequential and parallel test processes at different constraints [50-53]. A conception and implementation of a hybrid functional BIST was proposed that allows to reduce considerably the hardware cost compared to the traditional BIST methods [54].Efficient new methods were developed which allow to use BIST for embedded diagnosis purposes [57,58]. The main idea of the methods is based on bisectioning the fault lists instead of bisectioning the test patterns.A considerable increase of speed and resolution of diagnosis was achieved.Design for dependability. Research results have been published till now mainly in the field of fault injection with purposes of evaluation of the dependability of systems. New hierarchical multi-level techniques for malicious fault list generation for evaluating the fault tolerance is presented [59-61]. The methods are basedon using high and low level DDs. Malicious faults are found by top-down technique, keeping the complexityof candidate fault sets at each level as low as possible.Defended dissertations. Over the last ten years 14 dissertations have been defended in the project’s research field (which surpasses the number of people in the research staff): Tammemäe, Dushina, Ellervee, Raik, Brik, Astrova, Jutman, Vaarandi, Fomina, Jervan, Ivask, Lepmets, Listak, Orasson. Six of them was supervised by PI. In the proposed project 15 PhD students will be involved. Two of them (H.Kruus and S.Devadze) have planned to defend the thesis in 2008.References:1. P. Ellervee. xTractor: An Academic High-Level Synthesis Tool for Control and Memory IntensiveApplications. The 20th NORCHIP Conference, Copenhagen, Denmark, pp.253-258, Nov. 2002.2. P. Ellervee, E. Ivask, M. Kruus. Improved VHDL Input for High-Level Synthesis Tool xTractor. The 10thBiennial Baltic Electronic Conference (BEC'2006), Tallinn, Estonia, pp.87-90, Oct. 2006.3. P.Ellervee, J.Raik, V.Tihhomirov, R.Ubar. FPGA Based Fault Emulation of Synchronous Sequential Circuits.Proc. of the 22nd IEEE Norchip Conference, Oslo, November 8-9, 2004, pp.59-62.4. J.Raik, P.Ellervee, V.Tihhomirov, R.Ubar. Improved Fault Emulation for Synchronous Sequential Circuits.IEEE Proceedings of the 8th Euromicro conference on Digital Systems Design DSD2005. Porto, Aug.30 – Sept. 3, 2005, pp.72-78.5. P.Ellervee, J.Raik, K.Tammemäe, R.-J.Ubar. FPGA Based Fault Emulation of Synchronous SequentialCircuits. IET Computers & Digital Techniques, Volume 1, Issue 2, pp.70-76, March 2007.6. R.Ubar. Test Synthesis with Alternative Graphs. IEEE Design and Test of Computers. Spring, 1996, pp.48-59.7. R.Ubar. Multi-Valued Simulation of Digital Circuits with Structurally Synthesized Binary DecisionDiagrams. OPA (Overseas Publishers Assotiation) N.V. Gordon and Breach Publishers, J. of Multiple Valued Logic, Vol.4 pp. 141-157, 1998.8. R.Ubar, A.Moraviec, J.Raik. Cycle-based Simulation with Decision Diagrams. IEEE Proc. of DesignAutomation and Test in Europe - DATE. Munich, March 9-12, 1999, pp.454-458.9. R.Ubar, A.Morawiec, J.Raik. Back-Tracing and Event-Driven Techniques in High-Level Simulation withDecision Diagrams. Proc. of the IEEE ISCAS’2000 Conference, Geneva, May 28-31, 2000, Vol. 1, pp. 208-211.10. R.Ubar, D.Borrione. Design Error Diagnosis in Digital Circuits without Error Model. In VLSI: Systems onChip, Kluwer Academic Publishers, 2000, pp.281-292.11. J.Raik, R.Ubar. Fast Test Pattern Generation for Sequential Circuits Using Decision DiagramRepresentations. J. of Electronic Testing: Theory and Applications - JETTA. Kluwer Academic Publishers, Vol. 16, No. 3, pp. 213-226, 2000.12. A.Jutman, R.Ubar, Z.Peng. Algorithms for Speeding-Up Timing Simulation of Digital Circuits. DATE,Munich, March 13-16, 2001, pp.460-465.13. R.Ubar. Design Error Diagnosis with Resynthesis in Combinational Circuits. J. of Electronic Testing: Theoryand Applications - JETTA. Kluwer Academic Publishers, Vol.19, No.1, pp.73-82, 2003.14. J.Raik, R.Ubar, S.Devadze, A.Jutman. Efficient Single-Pattern Fault Simulation on Structurally SynthesizedBDDs. Lecture Notes in Computer Science, Vol. 3463, Springer Verlag, Berlin, Heidelberg, New York 2005, pp. 332-344.15. J.Raik, T.Nõmmeots, R.Ubar. A New Testability Calculation Method to Guide RTL Test Generation. Journalof Electronic Testing: Theory and Applications – JETTA. Springer Science + Business Media, Inc. 21, pp.73-84, 200516. J.Raik, R.Ubar, T.Viilukas. High-Level Decision Diagram based Fault Models for Targeting FSMs.Proceedings of the 9th IEEE Euromicro Conference on Digital Systems Design DSD2006, Cavtat, pp. 353-358, Aug. 31 - Sep. 2, 2006.17. R.Ubar, S.Devadze, J.Raik, A.Jutman. Ultra-Fast Parallel Fault Analysis on Structural BDDs. European TestSymposion, Freiburg, May 20-23, 2007.18. R.E.Bryant. Graph-based algorithms for Boolean function manipulation. IEEE Trans. on Computers,Vol.C-35, No8, 1986, pp.667-690.19. R.Ubar. Test Synthesis with Alternative Graphs. IEEE Design and Test of Computers. Spring, 1996, pp.48-59.20. R.Ubar. Multi-Valued Simulation of Digital Circuits with Structurally Synthesized Binary DecisionDiagrams. OPA (Overseas Publishers Assotiation) N.V. Gordon and Breach Publishers, J. of Multiple Valued Logic, Vol.4 pp. 141-157, 1998.21. R.Ubar, A.Moraviec, J.Raik. Cycle-based Simulation with Decision Diagrams. IEEE Proc. of DesignAutomation and Test in Europe - DATE. Munich, March 9-12, 1999, pp.454-458.22. R.Ubar, A.Morawiec, J.Raik. Back-Tracing and Event-Driven Techniques in High-Level Simulation withDecision Diagrams. Proc. of the IEEE ISCAS’2000 Conference, Geneva, May 28-31, 2000, Vol. 1, pp. 208-211.23. A.Jutman, R.Ubar, Z.Peng. Algorithms for Speeding-Up Timing Simulation of Digital Circuits. DATE,Munich, March 13-16, 2001, pp.460-465.24. R.Ubar, D.Borrione. Design Error Diagnosis in Digital Circuits without Error Model. In VLSI: Systems onChip, Kluwer Academic Publishers, 2000, pp.281-292.25. R.Ubar. Design Error Diagnosis with Resynthesis in Combinational Circuits. J. of Electronic Testing: Theoryand Applications - JETTA. Kluwer Academic Publishers, Vol.19, No.1, pp.73-82, 2003.26. J.Raik, R.Ubar, S.Devadze, A.Jutman. Efficient Single-Pattern Fault Simulation on Structurally SynthesizedBDDs. Lecture Notes in Computer Science, Vol. 3463, Springer Verlag, Berlin, Heidelberg, New York 2005, pp. 332-344.27. R.Ubar, S.Devadze, J.Raik, A.Jutman. Ultra-Fast Parallel Fault Analysis on Structural BDDs. European TestSymposion, Freiburg, May 20-23, 2007.28. J.Raik, R.Ubar. Fast Test Pattern Generation for Sequential Circuits Using Decision DiagramRepresentations. J. of Electronic Testing: Theory and Applications - JETTA. Kluwer Academic Publishers, Vol. 16, No. 3, pp. 213-226, 2000.29. J.Raik, T.Nõmmeots, R.Ubar. A New Testability Calculation Method to Guide RTL Test Generation. Journalof Electronic Testing: Theory and Applications – JETTA. Springer Science + Business Media, Inc. 21, pp.73-84, 200530. J.Raik, R.Ubar, T.Viilukas. High-Level Decision Diagram based Fault Models for Targeting FSMs.Proceedings of the 9th IEEE Euromicro Conference on Digital Systems Design DSD2006, Cavtat, pp. 353-358, Aug. 31 - Sep. 2, 2006.31. J.Raik, R.Ubar, T.Viilukas, M.Jenihhin. Mixed Hierarchical-Functional Fault Models for TargetingSequential Cores. Elsevier Journal of Systems Architecture (accepted for publication)32. M.Jenihhin J.Raik, A.Chepurov, R.Ubar. Assertion Checking with PSL and High-Level Decision Diagrams.Proceedings of the IEEE 8th Workshop on RTL and High Level Testing - WRTLT'07. IEEE Computer Society Press, 2007.33. R.Ubar, D.Borrione. Single Gate Design Error Diagnosis in Combinational Circuits. Proceedings of theEstonian Acad. of Sci. Engng, 1999, Vol. 5 , No 1, pp.3-21.34. R.Ubar, A.Jutman. Design Error Localization in Digital Circuits by Stuck-at Fault Test Patterns. IEEE 22ndInt. Conference on Microelectronics, Nis, Yugoslavia, May 14-17 2000, pp.723-726.35. R.Ubar, W.Kuzmicz, W.Pleskacz, J.Raik. Defect-Oriented Fault Simulation and Test Generation in DigitalCircuits. 2nd Int. Symp. on Quality of Electronic Design – ISQED, San Jose, California, March 26-28, 2001, pp.365-371.36. T.Cibáková, M.Fischerová, E.Gramatová, W.Kuzmicz, W.Pleskacz, J.Raik, R.Ubar. Hierarchical TestGeneration for Combinational Circuits with Real Defects Coverage. Pergamon Press. Journal ofMicroelectronics Reliability, Vol. 42, 2002, pp.1141-1149.37. J.Raik, R.Ubar, J.Sudbrock, W.Kuzmicz, W.Pleskacz. DOT: New Deterministic Defect-Oriented ATPG Tool.Proc. of 10th IEEE European Test Symposium, May 22-25, 2005, Tallinn, pp.96-101.38. J.Sudbrock, J.Raik, R.Ubar, W.Kuzmicz, W.Pleskacz. Defect-Oriented Test- and Layout-Generation forStandard-Cell ASIC Designs. Proceedings of the 8th Euromicro conference on Digital Systems DesignDSD2005. Porto, Aug.30 – Sept. 3, 2005, pp.79-82.39. R.Ubar, M.Aarna, H.Kruus, J.Raik. How to Generate High Quality Tests for Digital Systems. IEEEInternational Semiconductor Conference, CAS’2004, Sinaia, Romania, Oct. 4-6, 2004, pp.459-462.40. T.Bengtsson, A.Jutman, S.Kumar, R.Ubar. Delay Testing of Asynchronous NOC Interconnects. Proceedingsof the 12th International Conference Mixed Design of Integrated Circuits and Systems Kraków, 22-25 June 2005, pp.419-424.41. T.Bengtsson, A.Jutman, R.Ubar, S.Kumar. A method for crosstalk fault detection in on-chip Buses. IEEENORCHIP Conference, Oulu, Finland, Nov. 21-22, 2005.42. A.Jutman. Efficient At-Speed Interconnect BIST and Diagnosis Framework. Informal Digest of Papers of10th IEEE European Test Symposium (ETS’05), Tallinn, Estonia, May 22-25, 2005, pp. 257-258.43. A. Jutman, “At-Speed BIST for Board-Level Interconnect”, IEEE European Board Test Workshop, Tallinn,Estonia, 25–26 May, 2005.44. A.Jutman, R.Ubar, J.Raik. New Built-In Self-Test Scheme for SoC Interconnect. Proceedings of the 9thWorld Multi-Conference on Systemics, Cybernetics and Informatics. July 10-13, 2005, Orlando, Florida, USA, vol.4, pp.19-24.45. J.Raik, ind, R.Ubar. An External Test Approach for Network-on-a-Chip Switches. Proceedings of theIEEE Asian Test Symposium 2006, Fukuoka, Japan, pp. 437-442, Nov. 2006.46. J.Raik, R.Ubar, ind. Test Configurations for Diagnosing Faulty Links in NoC Switches. Proc. of the12th IEEE European Test Symposium, Freiburg, Germany, May 20-24, 2007.47. J.Raik, ind, R.Ubar. RT-Level Test Point Insertion for Sequential Circuits. Proc. of the IEEE 1stInternational Workshop on Testability Assessment – IWoTA-2004, Rennes, Nov.2, 2004, pp.34-40.48. R.Ubar, M.Jenihhin, G.Jervan, Z.Peng. Hybrid BIST Optimization for Core-Based Systems with Test PatternBroadcasting. 2nd IEEE Int. Workshop on Electronic Design, Test and Applications – DELTA’04, Perth, Australia, 28-30 January 2004, pp.3-8.49. G.Jervan, Z.Peng, R.Ubar, O.Korelina. An Improved Estimation Methodology for Hybrid BIST CostCalculation. Proc. of the 22nd IEEE Norchip Conference, Oslo, November 8-9, 2004, pp.297-300.50. G.Jervan, Z.Peng, T.Shchenova, R.Ubar. A Hybrid BIST Energy Minimization Technique for SoC Testing.IEE Proceedings on Computers & Digital Techniques, July 2006, Vol. 153, Issue 4, pp.208-216.51. G.Jervan, P.Eles, Z.Peng, R.Ubar, M.Jenihhin. Test Time Minimization for Hybrid BIST of Core-BasedSystems. J. of Computer Science and Technology. Nov. 2006, Vol. 21, No. 6, pp. 907-912.52. R.Ubar, T.Shchenova, G.Jervan, Z.Peng. Energy Minimization for Hybrid BIST in a System-on-Chip TestEnvironment. Proc. of 10th IEEE European Test Symposium, May 22-25, 2005, Tallinn, pp.2-7.53. G.Jervan, P.Eles, Z.Peng, R.Ubar, M.Jenihhin. Hybrid BIST Time Minimization for Core-Based Systemswith STUMPS Architecture. 18th Int. Symposium on Defect and Fault Tolerance in VLSI Systems.Cambridge, MA, USA, November 3-5, 2003.54. R.Ubar, N.Mazurova, J.Smahtina, E.Orasson, J.Raik. HyFBIST: Hybrid Functional Built-In Self-Test inMicroprogrammed Data-Paths of Digital Systems. Int. Conference MIXDES, Szczecin, June 24-26, 2004, pp.497-502.55. G.Jervan, R.Ubar, Z.Peng, P.Eles. Test Generation: A Hierarchical Approach. In “System-level Test andValidation of Hardware/Software Systems” by M.Sonza Reorda, Z.Peng, M.Violante. Springer Series in Advanced Microelectronics, Vol.17, 2005, pp. 63-77.56. G.Jervan, R.Ubar, Z.Peng, P.Eles. An Approach to System Level Design for Testability. In “System-levelTest and Validation of Hardware/Software Systems” by M.Sonza Reorda, Z.Peng, M.Violante. Springer Series in Advanced Microelectronics, Vol.17, 2005, pp. 91-118.57. R.Ubar, S.Kostin, J.Raik, T.Evartson, H.Lensen. Fault Diagnosis in Integrated Circuits with BIST. Proc. of10th EUROMICRO Conference on Digital System Design - DSD 2007, Lübeck, Germany, August 27 - 31, 2007.58. R.Ubar, S.Kostin, J.Raik, M.Kruus. Experimental Comparison of Different Diagnosis Algorithms in the BISTEnvironment. IASTED Conference on Applied Simulation and Modelling - ASM 2007. Palma de Mallorca, August 29-31, 2007.59. A. Benso, P.Prinetto, M.Rebaudengo, M.Sonza, R.Ubar. A New Approach to Build a Low-Level MaliciousFault List Starting from High-Level Description and Alternative Graphs. Proc. IEEE European Design & Test Conference, Paris, March 17-20, 1997, pp.560-565.60. A.Benso, P.Prinetto, M.Rebaudengo, M.Sonza Reorda, J.Raik, R.Ubar. Exploiting High-Level Descriptionsfor Circuits Fault Tolerance Assessments. 1997 IEEE International Symposium on Defect and FaultTolerance in VLSI Systems. Paris, October 20-22, 1997, pp. 212-216.61. R.Ubar, G.Jervan, J.Raik, M.Jenihhin, P.Ellervee. Dependability Evaluation in Fault-Tolerant Systems withHigh-Level Decision Diagrams. Proceedings of IWK, Ilmenau, September 10.13, 2007.。