软硬结合板简介及关键参数介绍

16“X19.685”
17“X19.685”
18“X19.685”
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Design Rule
Flex area Rigid Area
Rigid Area
Transition Zone
L1 L2 L3 L4
NF Prepreg NF Prepreg FCCL NF Prepreg
L5 L6
Байду номын сангаас
NF Prepreg
Chill roll
Vaccum Chamber
Plating Cu Sputter metal PI film
PI film
Target
壓合法 (Lamination)
PAA
Heater
Copper foil
Copper foil TPI PI film
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Material Introduction
B. Usable area , Border (A, B) and Routing Path (C)
Structure type PCB (1 press) PCB (2 press) HDI (1 press) HDI (2 press) HDI (≧3 press) MIN. A Inch 0.47 0.55 0.55 0.65 0.75 mm 11.43 13.97 13.97 16.51 19.05 MIN. B Inch 0.65 0.70 0.70 0.80 1.00 mm 16.51 17.78 17.78 20.32 25.4 0.1 0.1 0.1 0.1 0.1 Inch
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Design Rule
Terms & Definition:
Partial CVL Plus II- stack via
FCCL
Component on flex Squeeze out (from Low flow Prepreg)
FCCL: Flex Copper Clad Laminate
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Content:
Material Introduction Design rule Standard Process Flow Open Discussion
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Design Rule
A. Working Panel Size
Popular Working Panel Size
CVL: Cover layer
Stiffener: FR4/PI/Stainless base Reinforcement Low flow Prepreg: Resin scale flow lower than normal type BS: Bonding Sheet SF: Silver Foil (EMI shielding)
● 表量產
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● ● ● ● ● ● ● ●
◎ 表小量產、試產或送樣中 8 資料來源：JMS；工研院IEK-ITIS計劃(2004/3)
Material Introduction
CVL
Cover lay
Structure
Remark
1.Protect circuit
2.Isolation
PI film Adhesive Release paper
Width X MIN. C mm 2.54 2.54 2.54 2.54 2.54
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Optimized Panel Utilization
Design Rule
Optimized. Array Size
Panel type Panel size
4.4212“x4.6” (77%) 4.4212“x4.8” (76%) 4.4212“x5.1” (76%) 3.517“x4.6” (77%) 3.517“x4.8” (76%) 3.517“x5.1” (76%) 4.4212“x3.425” (77%) 4.4212“x3.675” (77%) 4.4212“x3.925” (78%) 3.517“x2.72” (76%) 3.517“x2.92” (76%) 3.517“x3.12” (77%)
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Design Rule
Mechanical design at transition zone:
UMT Standard 10 11 12 F G H Adhesive squeeze out Minimum flex width Flex outline radius Rigid/Flex Flex Flex 0.80mm 2.00mm 1000um UMT Advanced 0.50mm 1.00mm 500um
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I
Milling path
Rigid/Flex
1.00mm
0.80mm
H I Rigid PCB G
F
Flex area
Rigid PCB
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Design Rule
Mechanical design at transition zone:
Item Design Issue UMT Standard Guideline 1.00mm 2.00mm UMT Advanced Guideline 0.80mm 1.50mm
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Material Introduction
Bonding material 1.‧PP 1.‧BS
Prepreg Bonding sheet
Structure ◎PP
Epoxy & Glass fiber
Remark
Non-flow or Low-flow PP
◎BS
Thickness:15um, 25um, 40um
S1 S2
Minimum "S1" bending to board edge distance minimum flexible area (edge of FPC) to board edge spacing
Rigid area S1 S2 Flexible area
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Design Rule
聚亞醯胺樹脂(Polymide,PI)熱聚合後仍保一定柔軟與彈性，同時在很寬的操作範圍下有不 錯電氣特性故最常使用。
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Material Introduction
2.聚亞醯胺基材種類
依軟板結構分為兩大類 1.有接著劑三層軟板基材(3L FCCL) 2.無接著劑二層軟板基材(2L FCCL) 兩者分屬不同製造過程，製造方式與材料特性不同。3L應用在大宗軟板產品， 2L 用在較高階軟板製作上，例：軟硬複合板、COF。 ＊高尺寸安定需求 ＊高密度線路需求 ＊耐化性需求 ＊電氣特性需求 ＊耐燃性需求 ＊環保需求
Rigid-Flex Presentation
Content:
Material Introduction Design rule Standard Process Flow Open Discussion
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Material Introduction
1.軟板基材薄膜種類
聚脂樹脂(Polyester,PET)-尺寸熱安定性不如 PI Aramid纖維布-高吸水性，單價及使用性並不理想 強化型介電材料 –撓曲性較差且供應者與使用者不多 氟素樹脂膜-無法在高溫下維持尺寸的穩定
3.2L-FCCL製造方式與比較
方法 銅箔選擇性 銅箔厚度 雙面板製造性 接著特性 生產性 基板透明性 成本 生產廠商代表 塗佈法(Casting) ED,RA 薄銅(<9um) 有良率問題 較複雜與困難 優 優 尚可(有改善空間) 低 Nippon Steel （新日鐵） 濺鍍法(Sputtering) 限ED 可自由控制厚度 相對容易 尚可 差 優 高 Sumitomo Metal (住友） 壓合法(Laminate) ED,RA 薄銅(<9um) 有良率問題 相對容易 優 尚可 優 中 Ube (宇部興業)
Release paper Adhesive
PET film
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Material Introduction
EMI material 1.‧Silver film
Structure
Ex: SF-PC5000
Remark
SF-PC1000(32um) SF-PC5000(22um) SF-PC5500(22um)
18X20 inch 457.2 x 508 mm
B
PCB
PCB
C
Length Y C
A
PCB
PCB
* PCB with 1. G/F Design 2. Impedance coupon
MIN. C * Inch 0.3~1.0 0.3~1.0 0.3~1.0 0.3~1.0 0.3~1.0 mm 7.62~25.4 7.62~25.4 7.62~25.4 7.62~25.4 7.62~25.4
Mechanical design for flex radius:
Punch with hard die requirement, UMT suggest to place radius 0.50mm. (Change from right angle to radius. Only UV laser cutting can make it right angle.)
COPPER Adhesive PI 銅箔基板 (FCCL)
＊以單面板為例 3L-FCCL 2L-FCCL
COPPER
PI
銅箔基板 (FCCL)
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Material Introduction
2-1.聚亞醯胺薄膜簡介
聚亞醯胺薄膜(Polyimide,簡稱 PI)，外觀呈黃棕色，是由芳香族的雙酐類