0.5间距2.0高抽拉式上接FPC连接器规格书
摩雷克易连接FFC FPC连接器说明书
Solder Process Data Duration at Max. Process Temperature (seconds) Lead-freeProcess Capability
Documents: 3D Model (PDF) Drawing (PDF) 3D Model Product Specification PS-503480-001-001 (PDF) Packaging Specification SPK-503480-001-001 (PDF)
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This document was generated on 01/04/2023
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5034801000 Active
Easy-On FFC FPC Connectors Easy-On FFC/FPC Connector, 0.50mm Pitch, FBH1 Series, Right-Angle, Dual Contact, 1.00mm Height, 10 Circuits, Gold over Nickel Plating
E29179
FFC/FPC Connectors 503480 Black Actuator Easy-On FFC FPC Connectors Easy-On FBH1 FFC / FPC Connectors 884982040854
FPC设计规范完整版样本
1.1目的规范本公司FPC( 柔性线路板) 设计标准, 提高设计员的设计水平, 及工作效率。
1.2 范围适用于本公司FPC( 柔性线路板) 设计1.3 职责研发部: 学习和应用FPC( 柔性线路板) 设计规范于开发新产品中。
1.4 定义无FPC设计规范与注意事项1 FPC机构设计规范1.1 LCD与FPC压合处要求如上图所示A: 表示FPC成型边到LCD PIN顶端要差0.10mm.B: 表示FPC PIN要比LCD压合PIN长0.10-0.20mm.C: 此处只给正负0.10mm的公差.D: 对位PIN到FPC两侧边不小于0.5mm.E: FPC PIN反面的PI覆盖膜距FPC PIN不小于0.3mm.F: 此处只给正负0.20mm的公差.G: 如果是FPC 需要从玻璃处弯折或是弯折距离<0.8mm , FPC的CVL需上玻璃0.10-0.20如上图所示: A: 双面胶要耐高温,长度最好能和FPC相等.T= 0.05mm.最好是3M厂商生产的,可靠性较好.B: 宽度用2.50正负0.30mm的即可.C: FPC出PIN要用月牙边,便于焊接.D: FPC出PIN要有漏锡过孔,孔单边焊盘不小于0.15mm,便于焊接.E: FPC PIN正反面不能相等,要正反面相差0.20-0.30mm,正反面不能出阻焊层.注:此连接方式最终要符合客户要求.1.3 FPC与主板插拔处要求(以HIROSE为例)如上图所示: A: 此处公差一定要控制在正负0.07mm以内, 重点尺寸.B: 此处公差一定控制在正负0.20mm以内.C: 此处只给正负0.10mm的公差.D: 此处公差一定控制在正负0.20mm以内.E: 倒角非常重要,一定要有,否则可能接触不良.F: 补强材料要硬,一般用宇部厂商生产的.较软的补强装配时金指会断裂.G: 此处厚度在0.19-0.21较好,重点尺寸.注: 以上是以HIROSE的连接器为例,具体项目要参考客户连接器规格书.1.4 FPC与主板以公母座连接器连接如上图所示: A: 焊盘设计以连接器规格说明为准, 辅助焊盘不能少。
FPC连接器基础知识简介.
端子是FPC/FFC连接器的接触部件，为了达到连接器高密度的排列和更稳定的接触性 能，FPC/FFC连接器端子采用窄片式的接触方式，材质选用导电性能和机械强度较好 的磷青铜。
通常，端子结构的设计会有两种方式，一种是冲压平面下料端子（简称：下料端子）， 另一种是冲压后折弯成形端子（简称：成形端子）。由于窄片型的母端子需要有足够 的弹性和相对复杂的形状，如果采用冲压成形的方式，会给冲压加工造成困难，且成 形尺寸和精度不易控制。所以通常母端子都采用成形方式。
FPC连接器基础知识简介 工程部: Cai jiang
当前，随着SMT技术的普及，表面贴装连接器的应用也越来越广泛，各种类型的PCB 都随之有相应的表面贴装连接器出现。从穿孔式（T/H）焊接工艺到表面贴片（SMT） 焊接工艺，使得连接器的端子排列间距（Pitch）逐渐减小到0.8mm和0.5mm，而且 应用SMT工艺允许在PCB的双面都焊接电子元器件，大大增加了PCB上的元器件密度。ຫໍສະໝຸດ 端子功能：电子信号之导体传输.
制程：冲压＋电镀(镀金或锡,提升产品的焊接能力) 材质:磷青铜C5191
接地片
功能：元件定位，固定，增加强度等
制程：冲压＋电镀(镀金或锡,提升产品的焊接能力) 材质:青铜C2680
塑胶体内部是等间距的片状隔栏结构，使端子装配后保持小间距的排列和提供一定的 保持力。根据产品的使用要求，塑胶体要有足够的强度和韧性，且在SMT焊接前后都 不能有翘曲变形。
以很好的保护产品不受损伤，而且在SMT制程中可 以和其他电子元器件一样进行自动贴片焊接制程，
而无须多余的工序和设备，提高了PCB组装的生产 效率。
1.依产品的pin距(端子与端子的间距)分类 0.5pitch,1.0pitch,1.25pitch,0.3pitch,0.4pitch 2.依产品的高度分类 1.3H ,1.5H,2.0H,2.3H,2.45H 3.依产品的接地片结构分类 半包,全包 4.以产品在客户端的使用方式分类 DIP型(插板焊接),SMT型(表面贴装焊接) 5.以产品接触点与FFC组合的关系分类 上接,下接,单接,双面触点
FPC连接器规格说明及测试条件和方法
耐电压
在规定的时间内无击穿、闪烁或电弧
相临两端子之间加电压
500V AC，保持1分钟
8
温度急变
没有影响连接器的正常使用
的损伤，接触电阻≤0.04Ω
参照MIL-STD-202-210方法。在
-55±3℃(30min)25±3℃(5min)85±3℃(30min)25±3℃(5min)- 55±3℃(30min)
额定电流：0.5A
额定电压：50V AC，DC
温度范围：-40℃~ +85℃
耐压：200V/min
接触电阻：≤0.06Ω
绝缘电阻：≥500MΩ
适用FPC/FFC尺寸：
导体间距：0.5mm
导体宽度：0.3mm
配合部分厚度：0.3mm
配合部分长度：3.0mm
4.外观形状、寸法（参照产品图）、材质：
名称
材质
温度：245±5℃
时间：3±0.5S
14
耐焊接热
连接器无变形、损伤，机械性能无影响
温度：260±5℃
时间：10±0.5S
15
燃烧性
连接器的绝缘材料应符合
UL94V-0级要求
垂直燃烧实验法
6.
:
循环10次
9
耐高温
外观无变色起泡变形的现象；尺寸在管控范围内
参照MIL-STD-202-210方法，产品过260±5℃的高温
10
耐低温
外观无变色起泡，没有影响连接器的正常使用的损伤
参照MIL-STD-202-210方法,连接器在插合状态下，放置在-40±2℃的恒温恒湿机中96小时
11
恒定湿热
接触电阻：≤0.04Ω
绝缘电阻：≥500MΩ
连接器在插合状态下进行测试：
FPC连接器,0.5间距2.0高掀盖下接触规格书
FPC 05 20 01 n L T1.SCOPEThis specification covers the FPC CONNECTOR.2.ORDERING INFORMA TION3.CONNECTOR DIMENSIONSSee attached drawings.4.MA TERIALHousing :LCPColor :WhiteFlammability Rating (UL94V-0)Actuator :LCPColor :BrownFlammability Rating (UL94V-0)Terminal :Phosphor Bronze Peg :BrassPlating :See Ordering Information5.ACCOMMODA TED P YOUTSee attached drawings.2.0mm04-60PIN0.5 mmL:Low Contact SMT Type / U:Upper Contact SMT Type1 FPC Connector234567 PART NO.： 1 2 3 4 5 6 7Number of terminals High Pitch Series name Assembly style PlatingModeG:Gold flash over Nickel / T:Tin OVER NickelD:Double-Face Contact SMT Type03:Clamshell FFC T=0.2mm / 04:Drawer FFC T=0.2mm 01:Clamshell FFC T=0.3mm / 02:Drawer FFC T=0.3mm6.RA TINGITEMSTANDARDOperating Voltage (Max.)50V AC/DC Current Rating (Max.)0.4A AC/DC Operating T emperature7.PERFORMANCEITEMTEST CONDITIONREQUIRMENTELECTRICAL PERFORMANCEContact ResistanceMate applicable FPC/FFC and measure by drycircuit,20mV Max,10mA.(JIS C54025.4)20mMax.Insulation ResistanceMate applicable FPC/FFC and apply 500V DCbetween adjacent terminal or ground.(JIS C54025.2/MIL-STD-202Method 302)500MMin.Dielectric Strength Mate applicable FPC/FFC;apply 200V AC (rms)for 1minute between adjacent terminal and ground.(JIS C54025.1/MIL-STD-202Method 301)No BreakdownMECHANICAL PERFORMANCEFPC/FFC Retention ForcePull out force at a speed rate of 253mm per minute.Pos.X0.04kgf (0.4N)Min.Contact RetentionForceApply axial pull out force at the rate of 253mm/minute on the terminal assembled in the housing.Pos.X0.08kgf (0.8N)Min.ENVIRONMENTAL PERFORMANCE AND OTHERSTemperature RiseMateapplicableFPC/FFCandmeasurethetemperature rise of contact when the maximum AC rated current is passed.(UL498)Temperature rise 30C Max.-25~+85(Including terminal temperature rise)ITEMTEST CONDITIONREQUIRMENTAppearance Contact Resistance 40m Max.VibrationMate connectors and subject to the following vibration conditions,for period of 2hours in each of 3mutually perpendicular axes,passing DC 1mA during the test.Amplitude :1.5mm P-PFrequency:10~55~10Hz in 1minute.Duration:2hours in each of X,Y ,Z axes.(MIL-STD-202Method 201)Discontinuity1sec Max.Appearance Contact Resistance ShockMate applicable FPC/FFC and subject to the following shock conditions.3times of shocks shall be applied for each 6directions along 3mutuallyperpendicular axes,passing DC 1mA current during the test.(Total of 18shocks)Peak value :490m/s{50G}(JIS C0041/MIL-STD-202Method 213)Discontinuity1sec Max.2Appearance Heat ResistanceMate applicable FPC/FFC and expose to 85for 96hours.Upon completion of the exposure period,the test specimens shall be conditioned atambient room conditions for 1to 2hours,after which the specified measurements shall be performed.(JIS C0021/MIL-STD-202Method 108)Contact ResistanceAppearance Cold ResistanceMate applicable FPC/FFC and expose to -402for 2hours.Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1to 2hours,after which the specified measurements shall be performed.(JIS C0020)Contact Resistance Contact Resistance Dielectric Strength No BreakdownInsulation Resistance 250M Min.HumidityMate applicable FPC/FFC and expose to 402relative humidity 90to 95%for 96hours.Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1to 2hours,after which the specified measurements shall be performed.(JIS C0022/MIL-STD-202Method 103)AppearanceNo DamageNo DamageNo DamageNo Damage40m Max.40m Max.40m Max.40m Max.No Damageb)+8530minutesITEMTEST CONDITIONREQUIRMENTContact ResistanceTemperature CyclingMate applicable FPC/FFC and subject to thefollowing conditions for 5cycles.Upon completion of the exposure period,the test specimens shall be conditioned at ambient room conditions for 1to 2hours,after which the specified measurements shall be performed.1cycle a)-5530minutes(Transit time shall be with in 3minutes)(JIS C0025)AppearanceContact ResistanceSalt SprayMate applicable FPC/FFC and expose to thefollowing salt mist conditions.Upon completion of the exposure period,salt deposits shall beremoved by a gentle wash or dip in running water ,after which the specified measurements shall be performed.NaCl solutionConcentration :51%Spray time :484hours Ambient temperature :352(JIS C0023/MIL-STD-202Method 101)AppearanceNo DamageResistance to Soldering HeatWhen reflowingRefer to paragraph 8.Soldering iron methodSoldering time:30.5seconds Max.Solder temperature :3805AppearanceSolder abilitySolder Temperature:245Immersion Period:50.5secThe test area shall be covered more than 95%of immersed area with fresh solder .40m Max.No DamageNo Damage40m Max.Export CartonLayer 3Layers Carton Size 350x350x350mm04~18 24.48.INFRARED REFLOW CONDITIONTimesecondsTEMPERATURE CONDITION GRAPH (TEMPERA TURE ON BOARD PA TTERN SIDE)9.T APE AND REEL PACKAGE SPECIFICA TION9-1.T ape and Reel Dimensions:See attached drawings.9-2.SpecificationNo of Contacts.Width19~252426~483249~6044?PcsReelReels Carton2K12K 12K 12K1121917151。
0.5mm翻盖FPC座子规格书
completion of the exposure period,
the test specimens shall be
conditioned at ambient room 接触阻抗
conditions for 1 to 2 hours, after which the specified measurements shall be performed.
shall be performed.
目视外观无任 何损坏异状 NoDamage
60mΩ 最大. 60mΩ Max.
第4页共7页
项目 ITEM 耐湿性 Humidity
冷热冲击 Temperature Cycling
盐水喷雾 Salt Spray
REV. A
测试条件
规格
TEST CONDITION
period of 2 hours in each of 3 Contact
mutually perpendicular axes, passing Resistance
DC 1mA during the test. Amplitude : 1.5mm P-P Frequency : 10∼55∼10
60mΩ 最大. 60mΩ Max.
1μsec 最大 1μsec Max.
耐热性 Heat Resistance
将样品与适合之FPC连接，置于环
境温度85±2°C测试时间96小时，再
置放于室温下1∼2小时。
外观
Mate applicable FPC and expose to Appearance
85±2°C for 96 hours. Upon
Hz in 1 minute. Duration : 2 hours in
FPC连接器,0.5间距,1.5mm高。4-60PIN,下接触
FPC连接器,0.5间距,1.5mm⾼。
4-60PIN,下接触1 of 6Document No:LZR-RD062 Product Name:FPC CONN.04-68PINFPC 05 15 01 XX L X1.5mm2 of 61. SCOPE1.1. ContentsThis specification covers the performance, tests and quality requirements for the (With Cover), R/A,SMT, 0.5 mm Pitch, 1.50 mm H, Connector. 1.2. QualificationWhen tests are performed on the subject product line, the procedures specified in FPC 0.5mm Pitch series specifications shall be used. All inspections shall be performed using the applicable inspection plan and product drawing.2. ORDERING INFORMATION3. CONNECTOR DIMENSIONSSee attached drawings.4. MATERIALHousing :Hight-Temp plastic Color : WhiteFlammability Rating (UL94V-0) Actuator Hight-Temp plastic Color : Black. Flammability Rating (UL94V-0) Contact : Copper alloy Peg : Copper alloy Contact Plating See Ordering Information Peg Plating: Tin over Nickel5. ACCOMMODATED P .C.B. LAYOUT See attached drawings.Document No:LZR-RD062 Product Name:FPC CONN.0.5 mmL:Low Contact SMT Type / U:Upper Contact SMT Type1 FPC Connector234567 PART NO.： 1 2 3 4 5 6 7Number of terminals High Pitch Series name Assembly style Plating ModeG:Gold flash over Nickel / T:Tin OVER NickelD:Double-Face Contact SMT Type03:Clamshell FFC T=0.2mm / 04:Drawer FFC T=0.2mm 01:Clamshell FFC T=0.3mm / 02:Drawer FFC T=0.3mm3 of 66. RATING.ITEMSTANDARDOperating Voltage (Max.) 25 V AC/DC Current Rating (Max.) 0.3 A AC/DCOperating Temperature-25°C ~ +85°C (Including terminal temperature rise)7. PERFORMANCETEST ITEM REQUIREMENT PROCEDURE1 Examination of Product Meets requirements of productdrawing. No physical damage.Visual inspection.ELECTRICAL REQUIREMENT2Contact Resistance [ 30 ] m Ohm Max(Initial)Subject mated contacts assembled in housing to 20mV Max open circuit at 10mA Max. Refer to Fig.33Dielectric withstanding Voltage No creeping discharge or flashover shall occur. Current leakage: 0.5 mA MAX [ 500 ]VAC for 1minuteTest between adjacent circuits of unmated connector. 4 Insulation Resistance [ 500 ] M Ohm Min.(Initial) Impressed voltage 500 VDC. Test between adjacent circuits of unmated connector.5 Temperature Rising30℃ Max. Under loaded ratingcurrentContact series-wired, apply test currentof loaded rating current to the circuit, and measure the temperature rising byprobing on soldered areas of contacts, aftethe temperature becomes stabilized deduc ambient temperature from the measured value.MECHANICAL REQUIREMENT6 Contact / Peg Retention Force0.100 kgf Min. Apply axial pull out force at the rate of[ 25.4±3 ] mm/min on the terminal assembled in the housing.7 FPC/FFC Retention Force 0.030 kgf/Pin Min.(PIN>=17) 0.500 kgf/ Min. (PIN<17)Operation Speed ：[ 25.4±3 ] mm/minMeasure the force required to unmate connector.8 DurabilityContact Resistance: [ 50 ] m Ohm Max(Final) Operation Speed ：[ 10 ] cycle-max./min Durability Cycles ：50 Cycles9 VibrationNo electrical discontinuitygreater than 0.1 or 1µsec shall occur. See Note.Subject mated connectors to 10-55-10Hz traversed in 1minutes at 1.52mm amplitude 2 Hours each of 3 mutually perpendicular planes. 100mA Max. Applied.10 Mechanical ShockNo electrical discontinuitygreater than 0.1 or 1µsec shall occur. See Note.Accelerate Velocity ：490m/s2 （50G ） Waveform ：Half-sine shock plus Duration ：11msecNo. of Drops ：3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops, passing DC 100mA max. Current during the test.Document No:LZR-RD062 Product Name:FPC CONN.4 of 6Figure 1（End ）NOTE ：Shall meet visual requirements, show no physical damage, and meet requirement of additional tests asspecified in the test sequence in Figures 2TEST ITEM REQUIREMENTPROCEDUREMECHANICAL REQUIREMENT11 Solder abilityThe inspected area of each lead must have 95% solder coverage minimum.Steam Aging Preconditioning ：Intended for no-tin lead and no-tin lead -alloy finished for 93+3/-5℃、8hrs.Solder pot temperature: 245 ±5℃ ,3~5secENVIRONMENTAL REQUIREMENTS12Resistance to Reflow Soldering HeatNo physical damage shall occur.（Lead-Free ） Pre Heat ：150~180℃, 90±30sec. Heat ：230℃ Min., 30±10sec.Peak Temp.：260+0/-5℃, 10sec. or less Duration ：3 cycles Refer to Fig.413 Thermal ShockContact Resistance: [ 50 ] m Ohm Max(Final)Mated Connector-55+/-3℃(30 min.), +85+/-2℃(30 min) Perform this a cycle, repeat 5 cycles 14Humidity-Temperature Cycle Contact Resistance: [ 50 ] m Ohm Max(Final)Mated Connector25~65℃, 90~95% RH, 10 Cycles 15 Temperature Life (Heat Aging)Contact Resistance: [ 50 ] m Ohm Max(Final)Mated Connector 85℃, 250 hours,16 Salt SprayNo detrimental corrosionallowed in contact area and base metal exposed. Contact Resistance: [ 40 ] m Ohm Max(Final) Subject mated connectors to 35+/-2℃ and 5+/-1% salt condition for 48hours. After test, rinse the sample with water and recondition the room temperature for 1 hour. EIA-364-26B, Condition BDocument No:LZR-RD062 Product Name:FPC CONN.5 of 67.1. PRODUCT QUALIFICATION AND REQUALIFICATION TESTTest Group A B C D E F G H I JTest or ExaminationTest Sequence （a ）Examination of Product 1, 71, 91, 61, 51, 51, 51, 5 1, 3 1, 3 1, 3Contact Resistance2, 82, 52, 42, 42, 42, 4Dielectric withstanding Voltage 3, 6 Insulation Resistance 2, 5Temperature Rising2Contact/ Peg Retention Force 3, 7 FPC/FFC Retention Force 4, 6 Durability 5 Vibration 3 Mechanical Shock 4Solder ability2 Resistance to Soldering Heat2Thermal Shock3Humidity Temperature Cycling 43Temperature Life 3Salt Spray3Figure 2NOTE ：（a ）Numbers indicate sequence in which tests are performed.（b ）Discontinuities shall not take place in this test group, during tests. Figure 3. Contact ResistanceDocument No:LZR-RD062 Product Name:FPC CONN.6 of 68. INFRARED REFLOW CONDITIONNOTE: Please check the re-flow soldering condition by your own devices beforehand . Because the condition changes by the soldering devices, p.c. boards, and so on.9. TAPE AND REEL PACKAGE SPECIFICATION9-1.Tape and Reel Dimensions ：See attached drawings. 9-2.SpecificationNo. of Contacts Width ? Pcs ／Reel ? Reels ／Carton04～08 16 4 K ／1 14／1 09～24 24 4 K ／110／1 25～3632 4 K ／18／1 37～40444 K ／16／1Export Carton Layer ：3 LayersCarton Size ：350x350x300mm0 50 100 150 200 230 °C 60 Sec.6090 Sec.30 Sec.Time(sec.)Document No:LZR-RD062 Product Name:FPC CONN.。
0.5mm 间距的fpc座子 特征阻抗
特征阻抗是指柔性印刷电路板（FPC）座子上导线传输电信号时的阻抗特性。
0.5mm 间距的FPC座子是一种常见的连接器，它具有一定的特征阻抗要求。
下面将从多个角度来探讨0.5mm 间距的FPC座子特征阻抗的相关知识。
一、0.5mm 间距的FPC座子的概述0.5mm 间距的FPC座子是一种用于连接FPC的组件，它通常用于手机、平板电脑、数码相机等电子产品中，用于连接主板与显示屏、摄像头模组等组件。
它具有小巧轻便、插拔方便的特点，因此在电子产品中得到了广泛的应用。
二、0.5mm 间距的FPC座子的特征阻抗要求在实际的电子产品设计中，由于0.5mm 间距的FPC座子所连接的线路长度较短，因此对于其特征阻抗的要求相较于大尺寸的PCB来说更为严格。
一般来说，0.5mm 间距的FPC座子的特征阻抗要求在50欧姆左右。
这是为了保证信号在传输过程中的稳定性和可靠性，避免信号的反射和损耗。
因此在设计和生产过程中，需要特别关注0.5mm 间距的FPC座子的特征阻抗。
三、影响0.5mm 间距的FPC座子特征阻抗的因素1. FPC板材料FPC座子所连接的柔性印刷电路板的材料对于特征阻抗有着重要的影响。
FPC板材料的介电常数、介电损耗、厚度等参数会直接影响到FPC座子的特征阻抗。
因此在选择FPC板材料时需要特别注意这些参数。
2. FPC线路形状FPC线路的宽度、厚度、层间距等参数都会对其特征阻抗产生影响。
设计人员在设计FPC线路时需要根据特征阻抗的要求来合理确定这些参数。
3. FPC座子结构FPC座子本身的结构也会对特征阻抗产生影响。
插针的设计、接触面积等都需要在设计和制造过程中进行充分考虑。
四、提高0.5mm 间距的FPC座子特征阻抗的方法1. 优化FPC板材料的选择选择具有稳定特性的FPC板材料是提高特征阻抗的关键。
通常来说，聚酰亚胺（PI）材料是一种常见的FPC板材料，具有较好的介电性能和稳定性。
2. 精确的线路设计和制造精确的线路设计和制造是保证特征阻抗的关键。
FPC 连接器选择指南说明书
Housing Material
LCP resin
LCP resin
LCP resin
PA
LCP resin
LCP resin
LCP resin
Contact Material (Finish)
Copper Alloy (Au plating)
Copper Alloy (Au plating)
Copper Alloy (Au plating)
Degree of Protection
IP67 (IEC60529)
IP67 (IEC60529)
IP67 (IEC60529)
* Depends on specific part number; please consult catalog pages for detailed, accurate information.
1.0 A
Sockets, Semi-Covers, Hood Covers,
IDC Tools
3.0A
Digital, Digital & Analog
1.5A
Open-Frame, Closed-Frame, Single-Row, Double-Row, ZIP (Zigzag), Terminals
IDC Connectors
DVI Connectors
IC Connector
Circuit Board
for Discrete
Sockets
Connectors
Wires
Available Versions Rated Current
Connectors, Sockets, Strain Reliefs, Plugs
fpc设计规范
fpc设计规范FPC分类FPC类产品共同设计要点滑盖FPC 翻盖FPC 按键FPC 摄像头FPC 1.材质：基材为聚酰亚氨或聚酯，铜线为压延铜或沉积铜；2.线径线距：目前技术一般为3.5或4mil，即0.08或0.1mm；3.板边间距：一般为0.5mm以上；4.与壳体间隙：至少0.3～0.5mm；5.最小倒圆角：0.5mm；6.宽度大致计算方式：（线径＋线距）×PIN数＋2～3mm；7.厚度设计：单层板单层走线为0.07mm，以此类推；局部补强位置除外，需在2D上标明厚度要求；8.补强板设计：connector和金手指背面一定要补强，金手指补强后总厚度请参考FPC connector的详细SPEC，需在2D上标明总厚度和补强板尺寸，另外需注意补强区域X方向上最好不要有无需补强的接地片存在；9.补强板材质:一般为PI，特殊情况可用不锈钢或其它补强材料；10.接地：fpc连接的地方要保证接地区域，接地点要避开折弯处，接地焊盘最小为2*3mm，一般要求正反两面露铜；11.折弯要求：如需折弯，则在折弯处印刷白线或标明折弯区域；注意：3D如有折弯，则出2D必须展平；12.尺寸标注：2D图需标注详细的外形、连接器中心定位位置、焊盘、定位孔、补强板和印刷位置尺寸；13.公差设定：金手指处公差为＋/-0.03mm，外形尺寸为＋/-0.1mm,其它非重点尺寸为＋/-0.3mm；14.注释要求：2D图上需注明层数、top和bottom面、金手指位置、补强板位置、印刷位置及折弯线或区域；15.屏蔽要求：需要屏蔽，则印刷银浆，银浆外面印刷绝缘漆，同时需要指出具体的印刷区域；16.长度设计：FPC长度需在3D上模拟出来，以免过长或过短；17.PIN脚定义：需要在2D上注明。
F侧键FPC 其它FPCFPC设计规范各类FPC不同设计要点1.目前技术下只能用单层板单层走线，而且只能用FPC连接器；2.滑盖机的FPC必须要有足够宽的地,至少左右各1mm；3.滑盖机上的上板和主板的连接器旁边要有接地区域，在fpc的两端增加一个漏铜的小尾巴(至少2mm*3mm)以便将上板和主板导通；4.需在2D上注明滑盖测试寿命要求，一般为10万次；1.翻盖机主fpc连接的主板和lcm上的连接器旁边要有接地区域, 至少2mm*3mm，fpc加强板上面留有漏铜区域以便加导电泡棉来和壳体的地相连；2.FPC在转轴孔内部分做成5度斜线(非水平)，FLIP与BASE交点为FPC斜线起点(目的：减小FPC与hinge孔摩擦的可能性)；3.FPC在hinge孔内的扭曲部分宽度要求≥8,越大越好；4.FPC两个连接器的X方向距离等同于FLIP PCB与MAIN PCB两连接器的X方向距离；5.FPC flip部分Y方向长度计算办法：连接器边距hinge中心孔的直线距离+0.2(具体加多少视实际情况而定，0.2是个参考值)；6.FPC过渡尽量圆滑，内侧圆角设计成R1到R1.5；7.壳体上FPC过孔位置不要利角分模线（如壳体上无法避免，FPC对应位置加贴泡棉）；8.在有壳体的情况下，FPC在发数据前要剪1比1手工样品装配试验，CHECK没问题后发出；9.flip穿FPC槽原始设计宽度开通到中心线，方便FPC加宽；10.2D图必须就厚度有每层的尺寸要求(单层FPC可做到0.05厚），并实物测量。