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Texas Instruments SLUU068C 用户指南说明书

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third−party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Mailing Address:Texas InstrumentsPost Office Box 655303Dallas, Texas 75265Copyright 2001, Texas Instruments IncorporatedEVM IMPORTANT NOTICETexas Instruments (TI) provides the enclosed product(s) under the following conditions:This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective considerations, including product safety measures typically found in the end product incorporating the goods. As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic compatibility and therefore may not meet the technical requirements of the directive.Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein.Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM User’s Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For further safety concerns, please contact the TI application engineer.Persons handling the product must have electronics training and observe good laboratory practice standards. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used.Mailing Address:Texas InstrumentsPost Office Box 655303Dallas, Texas 75265Copyright 2001, Texas Instruments IncorporatedEVM WARNINGS AND RESTRICTIONSIt is important to operate this EVM within the input voltage range of 85 V to 265 V and the output voltage of 12 V +/− 5%.Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM. If there are questions concerning the input range, please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, some circuit components may have case temperatures greater than 50°C. The EVM is designed to operate properly with certain components above 50°C as long as the input and output ranges are maintained. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors. These types of devices can be identified using the EVM schematic located in the EVM User’s Guide. When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch.Mailing Address:Texas InstrumentsPost Office Box 655303Dallas, Texas 75265Copyright 2001, Texas Instruments IncorporatedContentsContents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1General Information1-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.1Features1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.2Description1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.3Operating Guidelines1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.3.1Step 1. Load Connections1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.3.2Step2. Applying Input Power1-3. . . . . . . . . . . . .1.3.3Step 3. Evaluating the Demonstration’s Boards Performance.1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.3.4Additional Information1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4DM38500 EVM Performance1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2Reference2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.1DM38500 EVM Part Descriptions2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2.2DM38500 Board Layouts2-4Figures. . . . . . . . . . . . . . . . . . . . . . . . . . . .1−1.DM38500 Evaluation Module Application Schematic1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1−2.DM38500 EVM Response, VCC = +15 V1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1−3.DM38500 Response, VCC = +15 V1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1−4.DM38500 Response, VCC = +15 V1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2−1.DM38500 EVM PC Board: Top Assembly2-4Chapter 1GeneralInformationThis chapter details the Texas Instruments (TI) DM38500 PFC/PWM Combination Controller 100W Power Factor Correction Preregulator Evaluation Module (EVM) SLUU068. It includes a list of EVM features, a brief description of the module illustrated with a pictorial, schematic diagrams, and EVM specifications.Topic Page . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.1Features1−2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.2Description1−2 1.3Operating Guidelines1−3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.4DM38500 EVM Performance1−5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .General Information1-1Features1.1FeaturesUCC38500 PFC/PWM Combination Controller 100W Power Factor Correc-tion Preregulator include:J Combines PFC and 2nd Stage Down Converter ControlsJ Controls Boost Preregulator to Near-unity Power FactorJ Accurate Power LimitingJ Improved Feedforward Line RegulationJ Peak Current Mode Control in Second StageJ Programmable OscillatorJ Leading Edge/Trailing Edge Modulation for Reduced Output RippleJ Low Startup Supply CurrentJ Synchronized Second Stage with Programmable Soft-startJ Programmable Second Stage Shut-down1.2DescriptionThe UCC38500 provides all the functions necessary for active power factorcorrection and a second stage dc-to-dc converter all in one integrated circuit.The control IC uses leading edge modulation for the boost stage and trailingedge modulation for the step down converter to reduce the RMS current in theboost capacitor. The dc-to-dc controller uses peak current mode control foreasy loop compensation.The UCC38500 evaluation board is designed to illustrate the performance ofthe IC in a complete off-line 100W two-stage power converter using power fac-tor correction. The demonstration board was designed to operate with a uni-versal input voltage range (i.e. 85−265 Vac) with a regulated 12V dc output.CautionHigh-voltage levels are present on the evaluation module whenever it isenergized. Proper precautions must be taken when working with theEVM. The output capacitor has high levels of energy storage and it mustbe discharged before the load is removed. Serious injury can occur ifproper safety precautions are not followed.1-2Description1-3General Information 1.3Operating GuidelinesThe operating guidelines for the evaluation board are provided with reference to the schematic in Figure 1−1 and the component layout in Figure 2−1.1.3.1Step 1. Load ConnectionsA resistive or electronic load can be applied to the output terminals labeled OUT− and OUT+.Note: For safety reasons the load should be connected before power is sup-plied to the demonstration board.1.3.2Step2. Applying Input PowerA 60 Hz AC power source not exceeding 265 V RMS needs be applied across terminals AC−N and AC−L for proper operation.1.3.3Step 3. Evaluating the Demonstration’s Boards Performance.With the AC source set between 85−265 V RMS the output voltage should be regulated and the input current should track the input voltage shape with near unity power factor. The operation of the circuit is verified over the line and load range and shows efficiency as high as 85%. At lighter loads, there may be some distortion in the line current due to Discontinuous Conduction Mode (DCM) operation. Please refer to Figures 1−2, 1−3 and 1−4 for typical EVM performance.1.3.4Additional InformationFor more information, pin description and specifications for the UCC38500PFC/PWM Combination Controller, please refer to the datasheet or contact the Texas Instruments Semiconductor Product Information Center at 1-800-336-5236 or 1-972-644-5580. Product Information can also be found on the World Wide Web at .Description1-4Figure 1−1.DM38500 Evaluation Module Application SchematicUDG−000941210952611137843116171518191420O V P /E N B L V S E N S E V A O U T I S E N S E M O U TC A O U T I A C V F FP K L I M I T V R E F G T 1G T 2V C C C T R T G N D P W R G N D S S 2V E R R I S E N S E 2U C C 38500V R E FQ 5R 25V C CR 7R 6G T 1G T 2D 10D 9C 27P K L I M I TC 28R 17C 19C 22R 28C 25R 23R 34R 21R 22R 33R 20C 2R 15R 5L 1D 3D 1G T 1R 14R 29P K L I M I TR 19C 26V R E F R 18R 24C 29C 30I S E N S E 2G T 2R 13R 2C 5P W R G N D G T 212 V 100 W +−L 2T 1Q 2Q 1Q 3D 11V A C 85−265V R M SD 6D 4T 2D 8U 4C 7S G N DS G N D S G N DP G N D 2P G N DP G N DP G N DP G N DS G N D P G N D D 5D 7C 12C 20L 1V C C B I A S C I R C U I TV C CV C C B I A S C I R C U I TP G N D C 23P G N D 2P G N D 2R 26D 14R 36R 16C 14R 35R 32R 27D 13R 31C 8R 30R 10R 12R 11C 21C 16C 3P G N D C 24D 2R 1C 4C 18R 4D 15D 12D 16A C −NA C −LO U T +O U T −V R E FR 3R 39C 13I S E N S E 2C 17H 11A V 1321456U 3S G N D C 6C 38H I G H V O L T A G E −S E E E V M W A R N I N G S A N D R E S T R I C T I O N SH I G H T E M P E R A T U R E −S E E E V M W A R N I N G S A N D R E S T R I C T I O N SH I G H V O L T A G E −S E E E V M W A R N I N G S A N D R E S T R I C T I O N S H I G H T E M P E R A T U R E −S E E E V M W A R N I N G S A N D R E S T R I C T I O N S Note: High-Voltage component. See EVM Warnings and Restrictions at the back of this document. Note: High-T emperature component. See EVM Warnings and Restrictions at the back of this document.DM38500 EVM Performance1-5General Information 1.4DM38500 EVM PerformanceFigure 1−2 through 1−4 shows the typical evaluation module performance.Figure 1−2.DM38500 EVM EfficiencyUCC38500 EFFICIENCYvsOUTPUT POWER 505560657075808590201040306050807090100V IN = 85 VV IN = 175 VV IN = 265 VP OUT − WE f f i c i e n c y −%Figure 1−3.DM38500 Power FactorUCC38500 PFvsOUTPUT POWERP OUT − WP o w e r F a c t o r0.852010403060508070901000.900.951.00V IN = 85 V V IN = 175 VV IN = 265 VDM38500 EVM Performance1-6Figure 1−4.DM38500 Total Harmonic Distortion5101520253020104030605080709010035UCC38500 TOTAL HARMONIC DISTORTIONvsOUTPUT POWERP OUT − WT o t a l H a r m o n i c D i s t o r t i o nV IN = 85 VV IN = 175 VV IN = 265 V2-1ReferenceReferenceThis chapter includes a parts list and PCB layout illustrations for the DM38500EVM.TopicPage2.1DM38500 EVM Part Descriptions 2−2. . . . . . . . . . . . . . . . . . . . . . . . . . . 2.2DM38500 Board Layouts 2−4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Chapter 2DM38500 EVM Part Descriptions2-22.1DM38500 EVM Part DescriptionsTable 2−1.DM38500 Part DescriptionsDescriptionReference Qty Value/Type Number Manufacturer Part Number C12, C20,C293 1 µF, 50 V, polypropylene Panasonic ECQ−V1H105JL C13147 pF, 50 V, ceramic Panasonic ECU−S2A470JCA C7, C16,C14310 nF, 50 V, ceramic Panasonic ECU−S1H103JCB C17, C382100 pF, 50 V, ceramic Panasonic ECU−S1H101JCA C191 2.2 nF, 50 V, ceramic Panasonic ECU−S1H222JCB C21470 nF, 400 V, polypropylenePanasonic ECQ−E4474KZ C211680 pF, 50 V, ceramic Panasonic ECU−S1H681JCB CapacitorsC221390 pF, 50 V, ceramic Panasonic ECU−S1H391JCA C241100 pF, 50 V, ceramic Panasonic ECU−S1H101JCA C251150 nF, 50 V, ceramicPanasonic ECU−S1H154KBB C26147 nF, 600 V, polypropylene Panasonic ECQ−E6473KF C27, C182100 pF, 50 V, ceramic Panasonic ECU−S1H105KBB C28, C232 2.2 µF, 50 V, ceramicPanasonic ECU−S1H225MEB C31100 µF, 450 V, electrolytic Panasonic ECO−S2WB101BA C3011800 µF, 25 V, electrolytic Panasonic ECA−IEFQ182C4, C5, C830.1 µF, 50 V, ceramic Panasonic ECU−S1H104KBB C61100 µF, 25 V, electrolytic Panasonic EEU−FCIE101S D11 6 A, 600 V, GI756CTGeneral Inst.GI756CT D111 6 A, 600 V, bridge rectifier,PB66Diodes Inc.PB66D121 1 A, 40 V, Shottky SR103CT D131TL431CLPTITL431C D14110 V, 1 W, Zener 1N4740D15, D2218 V, 1 W, Zener 1N4746DiodesD31 6 A, 600 V, ultra fast IR HFA08TB60−ND D4, D62 1 A, 600 V, fast recovery PhilipsBYV26C D5,D7,D9,D10, D165 1 A, 40 V, Shottky 1N5819D81 6 A, 600 V, full wave rectifierIRHBR2045FH1, FH223AG Fuse clip Fuses F11 6 A, 250 V HS31For Q3Aavid 513201HS4, HS52For D3 and D8Aavid 579302 B 0 00 00Heat sinks HS1, HS22For Q1 and Q2Avid 593002 B 0 34 00L11 1.7 mH, 2.5 A, coupled Cooper CTX08−14730Inductors L2135 µH, 8.3 ACooper CTX08−14279Q1,Q228 A, 500 V, n−channel IR IRF840Q3114 A, 500 V, n−channel IRIRFP450MOSFETsQ51NPN transistor MJE13005Not usedQ4, R8, R9,C9, C15,C106Not usedDM38500 EVM Part Descriptions2-3Reference DescriptionReference Qty Value/Type Number ManufacturerPart Number R1, R122ShortR10, R362200 Ω, ¼ W R25, R29,R27310 k Ω, ¼ WR131 2 k Ω, ¼ W R141 1.5 k Ω, ¼ W R15, R192 3.92 k Ω, ¼ W R161750 Ω, ¼ W R1717.5 k Ω, ¼ W R18, R242392 k Ω, ¼ W R2, R112 1 k Ω, ¼ W R20122.1 k Ω, ¼ W R2118.25 k Ω, ¼ W R22, R332562 k Ω, ¼ W ResistorsR231200 k Ω, ¼ W R261100 Ω, ¼ WR281100 k Ω, ¼ W R30130.1 k Ω, ¼ W R31133.2 k Ω, ¼ W R321 4.75 k Ω, ¼ W R341221 k Ω, ¼ W R35116.2 k Ω, ¼ W R391 1 k Ω, 1 W R41 1 Ω, 1 W, ±5%R510.33 Ω, 3 W, ±5%R6, R7220 Ω, ¼ WR3151 k Ω, 2 W, 400 VT118 mH, 10 A, 10.8:1Cooper CTX08−14226Transformers T21560−990 µH, 1:1 gate drive Cooper CTX08−14225U41BiCMOS PFC/PWM combination controller TexasInstrumentsUCC38500N ICsU31Opto-isolator4N36X13Thermal pad TO−220(@ Q1, Q2, D8)X21Thermal pad TO−247(@ Q3)MiscellaneousX34Screw pan head #4−40 X 7/16 (@Q1, Q2, Q3, D8)X44Nut #4x40X53Nylon shoulder washer #4(@Q1, Q2, D8)X61Bevel washer #4 (@Q3)PCBPCB1Bare boardUCC38500 PCBNotes:1)The values of these components are to be determined by the user in accordance with the applica-tion requirements.2)Unless otherwise specified, all resistors have a tolerance of ±1%.3)Capacitor C38 is located at reference designator R38 on the PCB.。

Test Structures for Benchmarking the Electrostatic Discharge (ESD) Robustness of CMOS Technologies

3 IMPLEMENTATION STRATEGY ......................................................................................... 3 3.1 Structure Strategy.............................................................................................................. 3 3.2 ESD Metrics...................................................................................................................... 4 3.3 Scaling .............................................................................................................................. 4 3.4 Testing .............................................................................................................................. 4 3.5 ESD Module Configuration Philosophy ........................................................................... 4 3.6 Assumptions...................................................................................................................... 4 3.7 Definitions and Conventions Used in This Document ..................................................... 5

Bresle 试验、电导测试器产品文件说明书

Innovative ... n No adhesive residue n Automatic air removal n No sharps, no needles!Measures the concentration ofsoluble salts on metal surfacesFor use with all Bresle patch types includingPosiPatchPosiSoft®FREE SOLUTIONS for viewing,analyzing and reporting data:Soluble Salt TesterTest durationtemperature Soluble salt conductivityFill the syringe with DI water. Take background reading.Inject water into patch.Start timer.Withdraw, inject into PosiTector SST.Reference...Sample...Record...Adjustable test volumeSurface density of soluble salts g/cm 2)1Easy 1-2-3 Bresle TestStandard ModelsAdvanced ModelsIncludes ALL features as shown above plus...n Storage of 250 readings—stored readings can be viewed or downloadedIncludes ALL features as shown above plus...n Storage of 100,000 readings in up to 1,000 batches n Batch annotation—add notes and change batch names with onscreen QWERTY keyboardn WiFi technology wirelessly synchronizes with and downloads software updatesn Data transfer via USB to a PC or via Wireless Technology to a mobile device, PC or printern Store thickness, profile, environmental, wall thickness,hardness and salt contamination measurements in individual batchesSelect Standard or Advanced FeaturesSimplenConductivity probe specifically designed for ISO 8502-6,9n Displays test duration, sample temperature, conductivity (µS/cm ) and surface density (mg/m 2or µg/cm 2)n Onscreen interface guides users through the Bresle test methodn Automatic storage of a background (blank) measurement — handy when performing multiple testsDurablenSolvent, acid, oil, water and dust resistant—weatherproof n Shock-absorbing, protective rubber holster with belt clip n Two year warranty on gage body AND probeAccuratenLong Form Certificate of Calibration showing traceability to NIST included n Includes certified conductivity standard (calibration solution) to verify probe accuracy. Certificate included.n Automatic temperature normalization and sample temperature reportingn Conforms to national and international standards including ISO, NACE, SSPC, IMO and US NavyVersatilenPosiTector body accepts all PosiTector SST, 6000, 200, RTR, SPG, DPM, SHD and UTG probes easily converting from a soluble salt tester to a coating thickness gage, surface profile gage, dew point meter, Shore hardness durometer or ultrasonic wall thickness gagen Ideal for determination of water-soluble contaminants in non-metallic blast media n A selection of kits include everything needed to retrieve and analyze the concentration of soluble salts on surfaces n Adjustable for various patch volumes n Selectable display languagesn High contrast reversible color LCD with backlit display n Uses alkaline or rechargeable batteries (built-in charger)PowerfulnTracks test duration in accordance with ISO 8502-6n Screen Capture—save screen images for record keeping and reviewn USB port for fast, simple connection to a PC and to supply continuous power n Every stored measurement is date, time and temperature stamped n Software updates via internet keep your gage currentn PosiSoft USB Drive—stored readings and graphs can be accessed using universal PC/Mac web browsers or file explorers. No software required.n Includes PosiSoft suite of software for viewing and reporting data23DeFelsko PatchSelf-adhesive, polyurethane patchesnFor measuring salt contamination in accordance with ISO 8502-6,9n Low-tack adhesive for easy patch removal with no residue to clean n Works on nearly any material or surface geometry n Latex -freen Lower cost than latex patch nEasy-to-use in any orientationBresle Method Patch OptionsSpecificationsSpecificationsSpecificationsLatex PatchISO 8502-6 conforming latex patch with easy-open tabs and low-tack adhesive for easy removalPosiPatchReusable patch with Standard or Flexible magnetic ringnFor measuring salt contamination in accordance wi th ISO 8502-6,9n Magnetic ring attaches PosiPatch to steel with no residue to clean l Standard magnetic ring for flat surfaces and diameters >1m (40 in.) l Flexible magnetic ring for ID/OD diameters >10 cm (4 in.)†n Automatic air removal through a watertight, air permeable membrane n No sharps, no needles! Safe, flexible dispensing tip mates with PosiPatch n Comparable price to latex patchesn Reusable patent-pending PosiPatch saves time and money nEasy-to-use in any orientationInnovative ...Advantage...Magnetic ring –no adhesive residue to clean Reusable PosiPatch saves time and money Automatic air removal through a watertight,air permeable membrane No sharps!Safe, flexible dispensing tipPosiPatch attaches to steel surfaces using a unique magnetic ring*Certificate includedSIZE:165 x 61 x 28 mm (6.5" x 2.4" x 1.1")WEIGHT:140 g (4.9 oz.)without batteries©DeFelsko Corporation USA 2018. All Rights Reserved. Technical Data subject to change without notice. • Printed in USA • PSST.v.LW/W1807PosiTector SSTKITP1 shownConforms to ISO 8502-6/8502-9, US Navy NSI 009-32, US Navy PPI 63101-000, AS 3894.6, IMO MSC.215(82), IMO MSC.244(83), SSPC Guide 15, ISO 11127-6, ASTM D4940Replacement PatchesDeFelsko Corporation •800 Proctor Ave.•Ogdensburg, New York 13669-2205 USA Toll Free 1-800-448-3835•Tel: +1-315-393-4450•Fax: +1-315-393-8471*********************•ConsumablesPlastic Dispensing Tips (10 pack) — for use with the PosiPatch Needles (10 pack) — for use with adhesive patches3 ml syringes (10 pack) — for use with dispensing tips and/or needles30 ml Cups (10 pack) — sterile, single-use cups ensure measurement accuracy Certified Conductivity Standard (60 ml, 2 oz.) — to verify probe accuracy Deionized Water (250 ml [8 oz.] or 1L [33.8 oz.]) — purified, ion-free water Foam Swabs (5 pack)— for cleaning the probe’s test cellCircle Filters (100 pack)— 125 mm for use with Abrasives Test KitAbrasives Test Kit (SSTABRKIT)Measure the concentration of soluble salts in blast cleaning abrasives in accordance with ASTM D4940 and ISO 11127-6.Includes: 600 ml glass beaker, 100 ml glass beaker, plastic funnel,600 ml plastic mixing beaker, 60 ml (2 oz.) Certified Conductivity Standard, 1 liter deionized water (type II), 100 circle filters (125 mm),stainless steel mixing rod, instruction card and certificate of analysisPosiPatch Starter Kit (SSTKITPATCHP)For use with existing conductivity meters. Try the revolutionary,reusable PosiPatch with a low cost trial pack.Includes:PosiPatch (5), syringe (2), dispensing tip (2),and standard magnetic ring.。

ROHM P04SCT4018KE-EVK-001 第4代SiC MOSFET半桥评估板双脉冲测试模

2022. Sep65UG040E Rev.001 Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model<Getting Started>Table of Contents•Outlines•Simulation Circuit•Simulation Settings •Component List•PCB Pattern Parasitic Inductors •Analytical ToolsPlease visit ROHM Solution Simulator page•Hands-On User’s Manual Link•Tutorial Short Videos availableHow to use ROHM Solution Simulator(https:///solution-simulator)2022. Sep65UG040E Rev.001Figure 1. P04SCT4018KE-EVK-001This simulation circuit provides the double pulse test simulation environment of P04SCT4018KE-EVK-001, ROHM’s 4th Generation SiC MOSFET Half Bridge Evaluation Board“. The simulation circuit is composed of the detailed simulation model with the circuit board parasitic inductance to achieve higher switching waveform simulation accuracy.Features•Double pulse test circuit (High-side switching)•4th generation SiC MOSFET SCT4018KE + gate driver IC BM61S41RFV-C.•Device equivalent circuit model of the components are used for simulation accuracy. •Parasitic inductors of PCB patterns are modelled and applied to the simulation circuit.•Vgs, VDC, snubber circuit constants, etc. can be modified.•Approx. simulation elapsed time is 2min30s.Applications•By simulating and verifying the operating conditions and circuit constants of drive circuits, etc., the workload of hardware evaluation can be reduced.•By extracting the parasitic L of the pattern from the PCB layout and adding it to the circuit for simulation, it is possible to improve the problem before prototyping.•Simulation with the EVK detailed model may help to analyze the cause of noise surge surges observed in the hardware evaluation.Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model <Outlines>Note) For more details of P04SCT4018KE-EVK-001, please refer to the following documents.4th Generation SiC MOSFET Evaluation Board Product Specifications.pdf4th Generation SiC MOSFET Evaluation Board User’s Manual.pdf2022. Sep65UG040E Rev.001ParametersDescriptionsDefaultSimulationSetting RangeVDC DC Voltage 800 V HS_VCC2, LS_VCC2Gate drive positive voltage18 V 0 to 25 V HS_VEE, LS_VEE Gate drive negative voltage0 V 0 to 4 VTjQ51, Q151 Device Junction Temperature 25 °C HS_VPULSEHigh-side pulse period 10 μs Fixed High-side pulse width4.9 μsLS_VPULSE “L” (DC)Table 1. Parameter SettingsFigure 2. Simulation CircuitDouble Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model <Simulation Circuit>VDCD53VS1C66U2Q51C65HS_VPULSED54D57D58R74R75R76C302C303R307R308C301L1C64ep2q3ep2q4i2q1U102LS_VPULSEVS2HS_VCC2HS_VEEC59LVDD153R173D154C164LS_VCC2LS_VEEC159Q151C165D157D158R174R175R176i2q2C51C151P04SCT4018KE-EVK-001Simulation ModelLP2LLSVCC2LHSVCC2LP1LP3LP4R55R56LP5LP6LP7LP8LP9LP10R73LP11LP12LP13LP14C166LP15R155R156LP16LP17LP18LP19LP20LP21LP22LP23LP24LP25LP26LP27LP28LP29R321LP30LP31LP322022. Sep65UG040E Rev.001 Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model<Simulation Settings>Figure 3. Simplified Gate Drive Circuit (common for high-side and low-side)Figure 4. SiC MOSFET Vgs VoltageSiC MOSFETGate voltageSiC MOSFETDS voltageGDICGND2 voltage VEE = 2VVCC2 = 18VGDICVCC2 voltage1.Gate drive voltage VgsFigure 3 shows a simplified gate driver circuit, and Figure 4 shows an example of the Vgs waveform. The voltage source VEE gives the voltage of the DS pin of the SiC MOSFET with respect to the VEE2 voltage of the gate driver IC. The voltage source VCC2 gives the supply voltage VCC of the gate driver IC with respect to the DS pinvoltage. As a result, the gate voltage Vgs of the SiC MOSFET is VCC for 'H' voltage and (-VEE) for 'L' voltage. Set HS_VCC and HS_VEE for the high-side circuit, and LS_VCC and LS_VEE for the low-side circuit, respectively.2.Gate Drive Pulse timingVoltage source ‘HS_VPULSE’ generate the gate drive pulse timing. The period T = 5μs and the pulse width = 2.5μs. The actual gate drive pulse output is at the ‘out’ pin of BM61S41RFV-C, the gate driver IC.VgsVCC2=18VVEE=2V+++GDICSiCMOSFETSVCC2GATEVEE22022. Sep65UG040E Rev.001Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model <Simulation Settings>ing Property EditorTo open the Property Editor, right-click on a component and select "Properties" from the pull-down menu. Figure 5 shows an example of the Property Editor. You can browse the parameters of the component from the Property Editor.Components shown in blue have “tunable" parameters, and you can change the parameters in the white text box in the Property Editor. Apply the values within the displayed tolerance range.Figure 5. Property Editor Examples(a) Capacitor (b) Inductor2.‘USE_INITIAL_VOLTAGE’ and ‘USE_INITIAL_CURRENT’The capacitor property 'USE_INITIAL_VOLTAGE' and the inductor property 'USE_INITIAL_CURRENT' are used to improve the convergence of thesimulation and speed up the simulation. Initial voltage or initial current value will be applied to the component as the initial condition. It will improve simulation convergence.When changing simulation parameters, the initial voltage and the initial current should be revised.Table 2 shows the recommendation of the initial voltage and the initial current.Symbol Initial Voltage Recommendation C64, C164(-HS_VEE), (-LS_VEE)C66, C166(HS_VEE+HS_VCC2), (LS_VEE+LS_VCC2)C59, C159HS_VEE, LS_VEEC65, C165VDC C302, C303(VDC/2)C301VDCTable 2. Initial Voltage Recommendation2022. Sep65UG040E Rev.001Note) We have not been able to confirm operation with all combinations. Please read the disclaimer carefully.Symbol Part Number DeviceQ51, Q151SCT4018KE 4G-SiC MOSFET, 1200V, 18mohm D53, D54, D153, D154RB160VAM-60Schottky Barrier Diode D57, D58, D157, D158RFN1LAM7SSuper Fast Recovery DiodeU2, U102BM61S41RFV-C 1ch Gate Driver Providing Galvanic IsolationTable 4. Power Device / Gate Driver IC Component ListDouble Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model <Component List>SymbolR value [ohm]Tun-able CommentsR55, R155 3.3✓Gate resistorsR56, R1560✓R73, R173 4.7k R74, R75, R76, R174, R175, R17610✓RCD Snubber resistors R307, R3081M C Snubber resistors R3210.1mShunt resistorTable 6. Resistor Component ListPart Number of Q51 and Q151 are selectable from the property editor.The list of the part number is shown below.To change the MOSFET, see instruction ‘How to change MOSFET model’or refer to the hands-on manual from the link on Page 1.Symbol Part Number Features Q51, Q151SCT4018KE*1200V, 18mohm SCT4036KE1200V, 36mohm* Default device1. Right-click on the device2. Select “Properties”3. Pull down “SpiceLib Part”4. Select the productHow to change MOSFET Model1234Table 5. SiC MOSFET Part Number ListNote) The value is constant unless otherwise specified as ‘Tunable’.2022. Sep65UG040E Rev.001Note) We have not been able to confirm operation with all combinations. Please read the disclaimer carefully.Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model <Component List>SymbolCapacitor ValuesSimulation Settings DescriptionsC [F]ESR [ohm]ESL [H]Tun-ableInitial Voltage [V]Tun-ableUse Initial VoltageC51, C1510.1μ19.8m 0.37n 0C64, C1640.1μ19.8m 0.37n 0✓✓C66, C1660.1μ19.8m 0.37n 18✓✓C59, C159 4.7μ 3.2m 0.48n 0✓✓C65, C16533n12m0.65n✓800✓✓RCD Snubber capacitorsC302, C3030.47μ8.4m 0.65n ✓400✓✓ C Snubber capacitorsC30110μ9.9m11n✓800✓✓Table 8. Capacitor Component ListSymbolInductor ValuesSimulation SettingsDescriptionsL [H]PAR_RES [ohm]SER_RES [ohm]PAR_CAP[F]Tun-able Use Initial current= 0 OptionL1250μ51k0.132.124p✓✓DPT Inductive Load Table 7. Inductor Component ListFigure 5. Inductor ModelP1P2L SER_RESPAR_RESPAR_CAPP1P2ESLESRCFigure 6. Capacitor ModelNote) Refer to Figure 5 for the model composition.Note) The value is constant unless otherwise specified as ‘Tunable’.Note) Refer to Figure 6 for the model composition.Note) The value is constant unless otherwise specified as ‘Tunable’.2022. Sep65UG040E Rev.001Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model <PCB Pattern Parasitic Inductors>SymbolInductor ValuesSim Settings SERL [nH]SERR [mohm]Tun-able Initial Current = 0 OptionLP10.4205✓LP2 6.38231✓LP3 2.90012✓LP4 1.0325✓LP5 2.7077✓LP6 2.58315✓LP7 4.83225✓LP8 2.58310✓LP90.9365✓LP10 5.21020✓LP110.7964✓LP12 6.39032✓LP13 5.5816.5✓LP140.9816✓LP15 2.9297✓LP161.9389✓Table 9. EVK PCB Pattern Parasitic Inductor modelSymbolInductor Values Sim Settings SERL [nH]SERR [mohm]Tun-able Initial Current =0 OptionLP17 5.22026✓LP18 2.5259✓LP19 1.0695✓LP20 4.0228✓LP21 5.741133✓LP22 4.781165✓LP23 4.96717✓LP240.8563✓LP257.00028✓LP267.00028✓LP27 1.2122✓LP280.5757✓LP29 1.34721✓LP30 3.89166✓LP31 1.28768✓LP320.30616✓P1P2SERLSERR100ohmFigure 7. Parasitic L modelNote) Refer to Figure 7 for the model composition.Note) The value is constant unless otherwise specified as ‘Tunable’.Note) The inductor models are defined from the analysis of the PCB pattern design data and the accuracy is not guaranteed. LP1 through LP32 are PCB pattern inductor models.These are defined from the electro-magnetic analysis of the PCB pattern layout and applied to the simulation circuit as discrete components. Figure 7 shous the model equivalent circuit. The resister of 100 ohm in parallel is for stabilizing simulation.You can modify these inductors, for example, referring to the layout design constraints to relatively evaluate how the pattern layout would affects the switching behaviors.2022. Sep65UG040E Rev.001loss_out t =v t ×i_sense tloss_integ_out t =න0tloss_out t dt* v t : voltage difference between p1 and p2Analytical tools are used in the simulation circuit for current sensing and device loss calculation.Note) The Loss_calc component is a utility module to support power loss calculation, and does not affect the simulation results of circuit operation or performance.Double Pulse Test Simulation with P04SCT4018KE-EVK-001 Simulation Model<Analytical Tools>Figure 8. Current to Continuous QuantityFigure 9. Loss_Calc31.Current Sensing ToolThe component ‘Current to Continuous Quantity’ outputs the current flow ‘p1’ through ‘p2’ (See Figure 8.)It is used to measure the drain current of the SiC MOSFET.2.Device Loss Calculation ToolThe component ‘Loss_Calc3’ calculates the voltage difference between ‘p1’ and ‘p2’, and outputs the products of the voltagedifference and ‘i_sense’ current input as ‘loss_out’ and its integration as ‘loss_integ_out’ (See Figure 9.)NoticeROHM Customer Support System/contact/Thank you for your accessing to ROHM product informations.More detail product informations and catalogs are available, please contact us.N o t e sThe information contained herein is subject to change without notice.Before you use our Products, please contact our sales representative and verify the latest specifica-tions :Although ROHM is continuously working to improve product reliability and quality, semicon-ductors can break down and malfunction due to various factors.Therefore, in order to prevent personal injury or fire arising from failure, please take safety measures such as complying with the derating characteristics, implementing redundant and fire prevention designs, and utilizing backups and fail-safe procedures. ROHM shall have no responsibility for any damages arising out of the use of our Poducts beyond the rating specified by ROHM.Examples of application circuits, circuit constants and any other information contained herein areprovided only to illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production.The technical information specified herein is intended only to show the typical functions of andexamples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM or any other parties. ROHM shall have no responsibility whatsoever for any dispute arising out of the use of such technical information.The Products specified in this document are not designed to be radiation tolerant.For use of our Products in applications requiring a high degree of reliability (as exemplifiedbelow), please contact and consult with a ROHM representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems.Do not use our Products in applications requiring extremely high reliability, such as aerospaceequipment, nuclear power control systems, and submarine repeaters.ROHM shall have no responsibility for any damages or injury arising from non-compliance withthe recommended usage conditions and specifications contained herein.ROHM has used reasonable care to ensur e the accuracy of the information contained in thisdocument. However, ROHM does not warrants that such information is error-free, and ROHM shall have no responsibility for any damages arising from any inaccuracy or misprint of such information.Please use the Products in accordance with any applicable environmental laws and regulations,such as the RoHS Directive. For more details, including RoHS compatibility, please contact a ROHM sales office. ROHM shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations.W hen providing our Products and technologies contained in this document to other countries,you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act.This document, in part or in whole, may not be reprinted or reproduced without prior consent ofROHM.1) 2)3)4)5)6)7)8)9)10)11)12)13)。

碳化硅板挤出试验质量计划

碳化硅板挤出试验质量计划英文回答：Carbonization is a common method used to produce high-quality silicon carbide plates. In order to ensure the success of the extrusion test, a well-planned quality plan is necessary. The quality plan should include several key aspects, such as material selection, process control, and testing procedures.Firstly, material selection is crucial for the extrusion test. The silicon carbide used should have a high purity level and a fine particle size distribution. This is because impurities and large particle sizes can affect the extrusion process and result in poor quality plates. Therefore, it is important to carefully choose the appropriate silicon carbide material.Secondly, process control plays a significant role in achieving the desired quality of the extruded plates. Theextrusion process involves several parameters, such as temperature, pressure, and speed. These parameters need to be carefully controlled and monitored to ensure the smooth flow of the material and the proper formation of the plates. For example, if the temperature is too low, the material may not flow properly, leading to defects in the plates. On the other hand, if the pressure is too high, it may cause excessive deformation and result in a lower quality product. Therefore, it is essential to establish strict process control measures.Thirdly, testing procedures are essential to evaluatethe quality of the extruded plates. Various tests can be conducted, such as dimensional measurements, surface roughness analysis, and mechanical property testing. These tests provide valuable information about the quality of the plates and help identify any defects or deviations from the desired specifications. For instance, dimensional measurements can ensure that the plates meet the required size and thickness, while surface roughness analysis can determine the smoothness and uniformity of the plates' surfaces. By conducting these tests, any potential issuescan be detected and addressed promptly.In conclusion, a well-planned quality plan is crucialfor the success of the carbonization extrusion test of silicon carbide plates. Material selection, process control, and testing procedures are key aspects that need to be considered. By carefully choosing the appropriate material, controlling the process parameters, and conducting thorough testing, high-quality silicon carbide plates can be produced.中文回答：碳化是生产高质量碳化硅板的常用方法。

ASTM E209金属材料常规或快速升温加热率和疲劳率压缩试验规范

machine has been designed speciﬁcally for axial alignment and uniform application of force in elevated-temperature compres-sion testing.A subpress for room-temperature testing is shown in Test Methods E9.For elevated-temperature compression testing,the subpress must accommodate the heating and loading devices and the temperature-sensing elements.The design of the subpress is largely dependent on the size and strength of the specimens,the temperatures to be used,the environment,and other factors.It must be designed so the ram does not jam or tilt the frame as a result of heating or application of force.If the bearing faces of the subpress,the opposite faces of both bearing blocks,and the ends of the specimen are respectively plane and parallel within very close limits,it is unnecessary to use adjustable or spherical seats.Inany case,the specimen should be properly centered in the subpress.3.4Compression Testing Jigs—When testing sheet material, buckling of the specimen during application of compessive forces must be prevented.This may be accomplished by using a jig containing side-support plates that bear against the faces of the specimen.The jig must afford a suitable combination of lateral-support pressure and spring constant to prevent buck-ling without interfering with axial deformation of the specimen (1).Although suitable combinations vary somewhat with variations in specimen material and thickness,testing tempera-ture,and accuracy of alignment,acceptable results can be obtained with rather wide ranges of lateral-support pressure and spring constant for any given test conditions.Generally, the higher the spring constant of the jig,the lower the lateral-support pressure that is required.Proper adjustment of these test variables may be established in preliminary veriﬁ-cation tests for the equipment(Section9).3.4.1This practice does not intend to designate speciﬁc compression jigs for testing sheet metals,but merely to provide a few illustrations and references to jigs that have been used successfully.Many other jigs are acceptable provided they prevent buckling and pass the qualiﬁcation tests set forth in Section9.Satisfactory results have been obtained in room-temperature testing using the jigs illustrated in Test Methods E9.These jigs usually require that the specimen be lubricated to permit normal compression on loading.For elevated-temperature testing,modiﬁed jigs that accommodate the heat-ing and strain-measuring equipment as well as the temperature-sensing elements must be used.A number of compression-testing jigs have been evaluated speciﬁcally for performance in elevated-temperature tests(2,3).The preferred type depends on the material,its thickness,and the temperatures involved. For moderately elevated temperatures,one of the room-temperature designs may be used in an oven in which the air is circulated to provide uniform heating.One design for side-support plates that has been found satisfactory for use at temperatures up to1000°F(538°C)when lubricated with graphite is shown in Fig.1(a)(4).Longitudinal grooves are cut in each plate with the grooves offset across the thickness of the specimen.These plates are made of titanium carbide.A type of side-support plate that has been used in compression jigs to 1800°F(982°C)is shown in Fig.1(b)(4).This is an assembly of small titanium carbide balls backed up by a titanium carbide plate.The balls protrude through holes in the front retaining plate.The holes for the balls are large enough to allow rotation and translation of each ball while at the same time retaining the balls in the plate assembly.The spacing of the balls,which is normally about1⁄8in.(3.2mm),determines the minimum specimen thickness that can be tested without buckling be-tween the balls.Rational values of the ball spacing can be obtained from calculations based upon the plastic buckling of simply supported plates where the plate width can be taken as the ball spacing.Another type of jig has a number of leaf-spring supports on each side of the specimen(3,5).This design is limited to a temperature range in which the metal leaf-spring elements can support the specimen satisfactorily.Jigs for use with specimens that are heated by self resistance are discussed in Ref1,6and7,which also provide quantitative information on the effects of lubrication,lateral-support pressure,spring constant,and misalignment.3.4.2The side-support plates are assembled in a frame that is part of the jig.A typical frame and jig assembly is shown in Fig.2.A furnace is placed around the jig after the specimen and extensometer are assembled in the jig.The holes in the support blocks are for auxiliary cartridge-type heaters.4.Heating Apparatus4.1The apparatus and method for heating the specimens are not speciﬁed,but in present practice the following are mainly used.4.1.1The resistance of the specimen gage length to the passage of an electric current,4.1.2Resistance heating supplemented by radiant heating, 4.1.3Radiant heating,4.1.4Induction heating,or4.1.5Convection heating with circulating-air furnace.4.2The apparatus must be suitable for heating the specimen under the conditions speciﬁed in Section5.5.Test Specimen5.1The size and shape of the test specimen should be based on three requirements as follows:5.1.1The specimen should be representative of the material being investigated and should be taken from the material produced in the form and condition in which it will be used, 5.1.2The specimen should be adapted to meet the require-ments on temperature control and rates of heating and strain-ing,andFIG.1Specimen Side Support Plates(Ref4)5.1.3The specimen should be conducive to the maintenanceof axial alignment uniform application of force,and freedomfrom buckling when loaded to the end point in the apparatusused.5.2The specimens are divided into two general classiﬁca-tions:those with rectangular cross sections and those withround cross sections.The dimensions of the specimens areoptional.The specimen must be long enough to be compressedto the required deformation without interference from a sup-porting jig but not long enough to permit buckling where it isunsupported.The end allowance (dimension between the gagepoints and the adjacent end of the uniform section)should bea minimum of one half the width of rectangular specimens or one half the diameter of round specimens.Typical acceptable specimens are illustrated in Fig.3and Fig.4.5.3When the dimensions of the test material permit,round specimens should be used.Round specimens should be de-signed to be free from buckling up to the end point of the test without lateral support.Rectangular specimens up to 0.250in.(6.35mm)thick normally require lateral support;with greater thicknesses lateral support may not be required in well-aligned equipment.The methods covered by this speciﬁcation are normally satisfactory for testing sheet specimens down to 0.020in.(0.51mm)thick.With smaller thicknesses inaccura-cies resulting from buckling and nonuniform straining tend to increase;consequently,extra care in the design,construction,and use of the test equipment is required to obtain valid results for specimens in this thickness range.All compression speci-mens should be examined after they are tested;any evidence of buckling invalidates the results for that specimen.5.4The width and thickness of rectangular specimens and diameter of round specimens at any point in the gage length should not vary from the average by more than 0.001in.(0.025mm)for dimensions up to 1in.(25.4mm)or by more than 0.1percent for dimensions above 1in.5.5The ends of end-loaded specimens should be parallel within 0.00025in.(0.0064mm)for widths,thicknesses,and diameters up to 1⁄2in.(12.7mm)and within 0.05percent for widths,thicknesses,and diameters above 1⁄2in.The ends of end-loaded specimens should be perpendicular to the sides within 1⁄4of a degree.All machined surfaces should have an average surface ﬁnish of 63µin.or better.Rectangular specimens should have a width of material,equal to at least the thickness of the specimen,machined from all sheared or stamped edges.5.6Shouldered specimens may be used in lieu of specimens with uniform width or diameter,provided the method of applying force is consistent with requirements of axial align-ment,uniform application of force,and freedom from buck-ling.5.7The surfaces of the rectangular specimens in contact with the supporting jig should be lubricated to reduce friction.The lubricant should have negligible reaction with the surface of the specimen for the test temperature and time chosen and should retain its lubricating properties for the duration oftheFIG.2Typical Compression Testing Jig for Sheet SpecimensMounted on Support Jig (Ref3)DimensionsSpecimen 1Specimen 2Specimen 3G.L.—Gage Length,in.(mm) 1.00060.005(25.460.13) 2.00060.005(50.860.13)2.00060.005(50.860.13)L —Uniform Section,in.(mm) 2.50060.005(63.560.13) 3.00060.005(76.260.13)2.50min (63.5)W —Width,in.(mm)0.62560.010(15.960.25) 1.00060.010(25.460.25)0.50060.010(12.760.25)E.A.—End Allowance,in.(mm)0.75(19)0.50(12.7)0.25min (6.35)FIG.3Dimensions of Typical RectangularSpecimenstest.Molybdenum disulﬁde and graphite are examples oflubricants that are used.5.8Specimen dimensions above 0.100(2.54mm)in.shouldbe measured to the nearest 0.001in.(0.025mm)or less;dimensions under 0.100in.should be measured to the nearest1percent or less.The average cross-sectional area of the gagelength should be used for calculation of stress.6.Temperature Control6.1Conventional Heating —When a conventional-heatingrate is desired,variations in indicated temperature within thegage length of the specimen should not exceed the followinglimits during a test:Test Temperature AllowableVariation,deg F(deg C),plusand minusUp to and including 1800°F (982°C)5(3)Over 1800°F (982°C)up to and including 2800°F (1538°C)10(5.5)Over 2800°F (1538°C)up to and including 3500°F (1927°C)20(11)Over 3500°F (1927°C)35(19.5)The time of heating and holding prior to the start of thestressing should be governed by the time necessary to ensurethat the temperatures can be maintained as speciﬁed.Ifcompression tests are being made as the counterpart to tensiontest under Practice E 21,the heating time and holding time inboth types of tests should be the same.The heating and holdingtime actually used should be reported.6.2Rapid Heating —When a rapid heating rate is desired,the preferred conditions for heating the gage length of thespecimen are as follows:6.2.1Sixty seconds or less to heat to the indicated nominaltest temperature,and6.2.2Holding time at the indicated nominal test temperaturebefore applying the force equal to the heating time.6.2.3The indicated control temperature of the specimenshould not vary more than 610°F (5.5°C)from the nominaltest temperature up to and including 1000°F (538°C)and notmore than 61.0%of the nominal test temperature above1000°F.The uniformity of temperature within the specimen gage length should be within +10°F and −20°F (11°C)of the nominal test temperature up to and including 1000°F and within +1.0and −2.0%of the nominal test temperature above 1000°F.N OTE 5—It is recognized that true temperatures will vary more than the indicated temperatures.The permissible indicated temperature variations speciﬁed in 6.1and 6.2are not to be construed as minimizing the importance of good pyrometry practice and accurate temperature control in these tests.All laboratories are obligated to keep both indicated and true temperature variations as small as practicable.In view of the extreme dependency of strength of materials on temperature,close temperature control is necessary.The limits prescribed represent ranges that are common practice.For further information on pyrometric practices refer-ence should be made to the “Panel Discussion on Pyrometric Practices.”46.3In rapid-heating tests a maximum overshoot in the indicated temperature during the heating and holding period of 20°F or 2.0%of the nominal test temperature,whichever is greater,is allowed for a time not exceeding 30s.The overshoot limitation permits a larger temperature variation for a 30-s period prior to testing than permitted for conventional-heating tests,for which no overshoot in temperature beyond the allowable variations in 6.1is allowed.6.4Conditions of heating to and holding at nominal test temperature as speciﬁed in 6.1through 6.3are preferred to facilitate comparison of data between laboratories.The thermal history given material during testing should be accurately reported,particularly when equipment limitations or simulated service testing cause deviations from the requirements of this practice.6.5The “indicated nominal temperature”and“indicated temperatures”as used in the above paragraphs are temperatures indicated by the temperature-measuring instrument with good pyrometric practice.7.Temperature Measurement 7.1Observe the following minimum precautions when ther-mocouples are used for temperature measurements:7.1.1Use small-diameter wires where heat conduction 4Panel Discussion on Pyrometric Practices,ASTM STP 178,Am.Soc.TestingMats.(1955).DimensionsSpecimen 1Specimen 2Specimen 3G.L.—Gage Length,in. 1.00060.005(25.460.13) 2.00060.005(50.860.13)1.00060.005(25.460.13)L —Uniform Section,in. 1.50060.005(38.160.13) 3.37560.05(85.861.27)1.50060.005(38.160.13)D —Diameter,in.0.50060.010(12.760.25) 1.12560.010(28.660.25)0.37560.010(9.560.25)E.A.—End Allowance,in.0.25(6.35)0.69(17.5)0.25(6.35)N OTE 1—Specimen 3,because of its smaller diameter,is especially suitable for tests in which rapid heating is desired.FIG.4Dimensions of Typical RoundSpecimensalong the couples might cause excessive heat loss as,for example,where self-resistant heating is employed.In this method36-gage wire has been found satisfactory.7.1.2Keep the hot junction of the thermocouple in direct contact with the test section of the specimen.In the case of rapid-heating tests,fast response is required,and the preferred method of attaching the thermocouples to the gage section is capacitance welding.The proper power settings should be used in order to minimize any undesirable metallurgical changes at the attachment points.7.1.3Where radiant means of heating are used,shield the thermocouple hot junction from direct radiation by the heating elements in order to prevent erroneous high readings.7.1.4Where electrical self-resistance heating is used,exer-cise care to ensure that there is no superimposed voltage pickup by the couples.7.1.5Use certiﬁed or otherwise calibrated thermocouple wires for all tests.The calibration of a thermocouple may change with age or after exposure to extreme temperatures. Also,noble-metal thermocouples are easily contaminated. Make frequent checks to ensure thermocouple accuracy.In the case of base-metal thermocouples,clipping back the heated portion is generally more convenient than recalibration.7.2Methods other than thermocouples may be used for measuring temperature provided it can be demonstrated that they meet the requirements of Section6.Temperature mea-surements with optical and radiation methods,for example, must be corrected for deviations in specimen emissivity from 1.0in determining the indicated specimen temperature.7.3All equipment used for measuring,controlling and recording tempertatures,should be veriﬁed and if necessary calibrated against a standard periodically.Lead-wire error should also be checked witht the load wires in place as they are normally used.8.Strain Rate During Test8.1Apply the force to the specimen to obtain uniform rates of straining as speciﬁed in8.2and8.3.Start the application of the load at the end of the holding time at the speciﬁed test temperature.8.2Conventional Strain Rate—When a normal rate of straining is desired after conventional or rapid heating,use a strain rate of0.00560.002in./in.(0.560.2percent)/min from the start of loading to the end point of the test.8.3Rapid Strain Rate—When a rapid strain rate is desired after conventional or rapid heating,use a strain rate of0.56 0.2in./in.(50620percent)/min from the start of loading to the end point of the test.Since some ordinary test equipment is not designed for rapid strain rates,precautions should be taken to ensure that equipment used at rapid strain rates is accurate at these rates.8.4When possible,use strain-pacing equipment,an auto-matic feed-back system,or other equivalent means to obtain a constant strain rate.If such equipment is not available,main-tain a constant crosshead speed to obtain the desired average strain rate from the start of loading to the end point of the test. The average strain rate can be determined from a time-interval-marked force-strain record,a time-strain graph,or from a stop-watch measurement of time from the start of loading to the end point of the test.It should be recognized that the use of machines with constant rate of crosshead movement does not ensure constant strain rate throughout a test.8.5The preferred rates of straining are those speciﬁed in8.2 and8.3to facilitate comparison of data between laboratories.It is further recommended that,when a faster rate of straining is desired,the rate be5.062.0in./in.(5006200percent)/min. It is recommended that other rates of straining be conﬁned to those cases where special application of the data or material properties requires intermediate rates.Report the strain rate used with test results.9.Strain Measurement9.1Record the stress-strain diagram up to the end point of the test;prolonging the test beyond the end point deﬁned in Section1is optional.9.2Use an extensometer of Class B-2or better as described in Practice E83,Veriﬁcation and Classiﬁcation of Extensom-eters.4N OTE6—A discussion of the importance of strain-measuring systems used with compression jigs is described in Ref.2.9.3Attach the extensometer directly to the gage length of the specimen.No restrictions are placed on the method of attachment except that it should not affect the properties,and the extensometer should remainﬁxed to the gage length without any slippage.Attachment of the extensometer to any other part of the specimen or apparatus is not recommended, but when such attachment is necessary,it must be accompanied by proof that adequate corrections were used to compensate for the strain that occurred outside the gage length,and the method of attachment and location should be shown.9.4The strain should be measured as opposite sides of the specimen and averaged to give center-line strain.9.5Verify the extensometer for sensitivity and accuracy in accordance with Practice E83.The extensometer should fulﬁll the requirements for the class of extensometer speciﬁed in9.2 at room temperature.Pending the availability of standard methods of calibration at elevated temperatures,exercise care to be sure that the extensometer maintains calibration as the temperature of the specimen is increased to the test temperature and during the test.This requires that those parts of the extensometer that would be affected by the heat of the specimen be shielded from temperature changes during the test.9.6When rapid strain rates are used during a test,the extensometer must be veriﬁed to have a rate of response adequate to measure strain to the limits required in Section7. N OTE7—The forces applied by the extensometer to the specimen may introduce errors in the stress-strain data for small specimens or for tests at very high temperatures where the strength of the specimens is low.In such tests,counterbalancing or other mechanical arrangements should be used to minimize the forces and bending moments introduced by the exten-someter.The use of calculated corrections for the force of the extensom-eter is the least preferred method for correcting this type of error.For tests where the load of the extensometer is signiﬁcant,the report of the test results should show the method of correction used.10.Qualiﬁcation of Test Apparatus10.1The complete compression-test system consistingofjig,strain instrument,and recorders should be qualiﬁed,inaccordance with 10.2-10.5,by each of the personnel assignedto conduct test programs.10.2At room temperature,conduct tests to the proportionallimit on ﬁve different specimens of 2024-T3aluminum alloy toestablish the elastic modulus during both the application andremoval of forces.If each of the modulus values so determinedfalls within 10.73106psi (7.383104MPa)65percent,thecompression-testing technique qualiﬁes for room-temperatureoperation.10.3At elevated temperatures starting at 400°F (204°C)andin 400°F (220°C)increments to the maximum use temperature,determine the modulus of elasticity in tension for threespecimens at each temperature both loading and unloadingusing an alloy with distinct elastic properties at each tempera-ture.Conduct identical tests in compression using the compres-sion test technique.If the compression moduli from consecu-tive specimens fall within 65%of the average tensionmodulus,the technique qualiﬁes for operation to the maximumtemperature successfully reached in this procedure.10.4The qualiﬁcation procedure should be carried out onthe thinnest rectangular specimens or smallest diameter roundspecimens to be tested in the system being qualiﬁed.10.5If the compression-test technique qualiﬁes at roomtemperature and at each test temperature in 400°F incrementsto the maximum use temperature,it shall be consideredsatisfactory for tests at any intermediate temperature in theroom-temperature to the maximum-use-temperature range,provided that all conditions are maintained constant thereafter.11.Report 11.1Report the following minimum information for each test:11.1.1Indicated test temperature,heating rate,holding time at test temperature,and strain rate,and 11.1.2The 0.2percent-offset compressive yield strength as determined from the stress-strain curve.11.2Report the following additional information when needed for design or other purposes:11.2.1Compressive modulus of elasticity,11.2.2Compressive yield strength at other amounts of offset up to the end point of the test,11.2.3Copy of stress-strain curve,11.2.4Drop-of-beam yield point if such a yield point occurs,11.2.5Tangent modulus as a function of stress,and 11.2.6Secant modulus as a function of stress.11.3The following information essential to the interpreta-tion of the results should also be given:11.3.1Description of the material tested and the orientation of the specimen with respect to the test material,11.3.2Nominal size and type of specimen used including machining methods and any special techniques to control surface ﬁnish,11.3.3Type of test apparatus and method of heating,and 11.3.4Accuracy of apparatus.11.4Any deviations from the preferred or speciﬁed condi-tions of testing should be indicated with the results of the tests.REFERENCES(1)Bernett, E. C.,and Gerberich,W.W.,“Rapid-Rate CompressionTesting of Sheet Materials at High Temperatures,”ASTM STP 303,ASTTA,Am.Soc.Testing Mats.,1961,pp.33–46.(2)Gerard,George,“An Evaluation of Compression-Testing Techniquesof Sheet Materials at Elevated Temperatures,”ASTM STP 303,ASTTA,Am.Soc.Testing Mats.,1961,pp.3–11.(3)Hyler,W.S.,“An Evaluation of Compression-Testing Techniques forDetermining Elevated-Temperature Properties of Titanium Sheet,”Titanium Metallurgical Laboratory Report No.43,June 8,1956.(4)King,J.P.,“Compression Testing at Elevated Temperatures,”MetalsEngineering Quarterly ,MENQA,V ol 1,No.3,August,1961,pp.30–38.(5)Breindel,W.W.,Carlson,R.L.,and Holden,F.C.,“An Evaluation of a System for the Compression Testing of Sheet Materials at Elevated Temperatures,”ASTM STP 303,ASTTA,Am.Soc.Testing Mats.,1961,pp.77–84.(6)Fenn,Jr.,R.W.,“Compression Testing Sheet Magnesium Utilizing Rapid Heating,”Proceedings ,ASTEA,Am.Soc.Testing Mats.,V ol 60,1960,p.940.(7)Fenn,Jr.,R.W.,“Evaluation of Test Variables in the Determination of Elevated-Temperature Compressive Yield Strength of Magnesium Alloy Sheet,”ASTM STP 303,ASTTA,Am.Soc.Testing Mats.,1961,pp.48–59.The American Society for Testing and Materials takes no position respecting the validity of any patent rights asserted in connection with any item mentioned in this ers of this standard are expressly advised that determination of the validity of any such patent rights,and the risk of infringement of such rights,are entirely their own responsibility.This standard is subject to revision at any time by the responsible technical committee and must be reviewed every ﬁve years and if not revised,either reapproved or withdrawn.Your comments are invited either for revision of this standard or for additional standards and should be addressed to ASTM Headquarters.Your comments will receive careful consideration at a meeting of the responsible technical committee,which you may attend.If you feel that your comments have not received a fair hearing you should make your views known to the ASTM Committee on Standards,at the address shown below.This standard is copyrighted by ASTM,100Barr Harbor Drive,PO Box C700,West Conshohocken,PA 19428-2959,United States.Individual reprints (single or multiple copies)of this standard may be obtained by contacting ASTM at the above address or at 610-832-9585(phone),610-832-9555(fax),or service@ (e-mail);or through the ASTM website().。

质量管理体系术语(中英双语)

一组质量管理体系术语(中英双语)English Chinesereceipt （入厂）接受，验收，进货handling 搬运packaging 包装storage 保存protection 保护comparison 比较identification 标识replacement of identification mark 标识标志更换maintenance of identification 标识的保持records of identification control 标识控制记录tender 标书normative document 标准文件supplemental 补充nonconforming product 不合格品control of nonconforming product 不合格品控制control procedure of nonconforming products 不合格品控制程序tendency of nonconformance 不合格倾向purchasing 采购verification of purchased product 采购的产品验证purchasing process 采购过程purchasing control procedure 采购控制程序purchasing information 采购信息reference standard 参照标准reference instructions 参照细则stockhouse 仓库measurement, analysis and improvement 测量，分析和改进measurement result 测量结果control procedure of monitoring and measuring devices 测量设备控制程序planning 策划preservation of product 产品保护control procedure for maintenance, replacement and records of product identification 产品标识的保持, 更换及记录控制程序procedure for product identification and traceability 产品标识和可追溯性程序conformity of product 产品的符合性monitoring and measurement of product 产品的监督和测量product plan 产品方案control procedure for product preservation 产品防护控制程序method of product release 产品放行方法conformity of product, product conformity 产品符合性product realization 产品实现planning of product realization 产品实现策划product characteristics 产品特性input to product requirements 产品要求的输入product status 产品状态final acceptance of product 产品最后验收procedure 程序program documents 程序文件continual improvement 持续改进procedure for continual improvement of quality management system 持续改进质量体系程序adequacy 充分性storage location 存放地点agency personnel 代理人员submission of tenders 递交标书adjustment 调整，调节statutory and regulatory requirements 法律法规要求rework, vt 返工repair, vt 返修subcontractor 分承包方annex 附录improvement 改进improvement actions 改进措施on-the-job training 岗位技能培训responsibility of individual department and post 各部门, 各岗位职责change identification 更改标记change order number 更改单编号process sheets 工艺单process specification 工艺规程procedure(process card) 工艺规程(工艺卡)process characteristics 工艺特性Job Description Format 工种描述单work environment 工作环境impartiality 公正性functional requirements 功能要求supplier 供方supplier evaluation procedure 供方评价程序supplier provided special processes 供方提供的特殊过程verification at supplier's premises 供方现场验证supply chain 供应链criteria for supplier selection, evaluation and re-evaluation 供应商选择、评估和再评估准则communication 沟通customer 顾客customer property 顾客财产control procedure for customer property 顾客财产控制程序customer feedback 顾客反馈Customer Service Contact Form 顾客服务联系表customer cummunications 顾客沟通customer satisfaction 顾客满意statistical analysis of customer satisfaction 顾客满意度统计分析customer complaint 顾客投诉identificaion of customer requirements 顾客要求的识别management review 管理评审records from management review 管理评审记录management review control procedure 管理评审控制程序management representative 管理者代表management responsibility 管理职责specified limits of acceptability 规定的可接受界限specified use 规定的用途process 过程complexity of processes 过程的复杂性monitoring and measurement of processes 过程的监视和测量operation of process 过程的运行status of processes 过程的状态process approach 过程方法process controls 过程控制process control documents 过程控制文件process performance 过程业绩appropriateness 合适性changes to contractor 合同的更改contract review control procedure 合同评审控制程序internet sales 互联网销售environmental conditions 环境条件monogram pragram requirements 会标纲要要求type of activities 活动类型infrastructure 基础建设infrastructure 基础设施fundamentals and vocabulary 基础与词汇control of records 记录控制technical specificaion 技术规范process trace sheet 加工跟踪单monitoring and measurement 监视和测量monitoring and measuring device 监视和测量装置control of monitoring and measuring devices 监视和测量装置控制check method 检查方法frequency of checks 检查频次calibration status 检定状态inspection and test control procedure 检验和试验控制程序identification procedure for inspection and test status 检验和试验状态标识程序inspection witness point 检验见证点inspection hold point 检验停止点buildings 建筑物delivery 交付post-delivery activities 交付后的活动delivery activities 交付活动interface 接口acceptance of contract or orders 接受合同或定单type of medium 介质类型experience 经验correction action 纠正措施Corrective action response time 纠正措施答复时间，纠正措施响应时间management procedure for corrective actions 纠正措施管理程序corrective action response times 纠正措施响应时间development activity 开发活动traceability mark 可追溯性标志objectivity 客观性Customer Service Log 客户服务记录簿control feature 控制特性，控制细节control features 控制细则periodic assessment of stock 库存定期评估justification 理由routine 例程，惯例，常规质量职能分配表论证范围internal communication 内部沟通internal audit 内部审核internal audit procedure 内部审核程序internally controlled standard 内控标准internal audit 内审results of internal and external audits 内外部审核结果competence 能力training 培训training needs 培训需要evaluate 评价records of the results of the review 评审结果的记录review output 评审输出review input 评审输入Purchase Requisition 请购单authority 权限validation 确认concession 让步human resources 人力资源job training of personnel 人员岗位培训qualification of personnel 人员资格equipment control procedure 设备控制程序device type 设备类型order of design changes 设计更改通知单design and development control procedure 设计和开发控制程序design and development 设计开发design and development planning 设计开发策划control of design and development changes 设计开发更改控制design and development review 设计开发评审design and development validation 设计开发确认design and development outputs 设计开发输出design and development inputs 设计开发输入design and development verification 设计开发验证design validation 设计确认design documentation 设计文件编制design acceptance criteria 设计验收准则design verification 设计验证audit program 审核大纲conduct of audits 审核行为audit criteria 审核准则production process control 生产过程控制production process control procedure 生产过程控制程序production and service provision 生产和服务提供control of production and service provision 生产和服务提供的控制validation of processes for production and service provision 生产和服务提供过程的确认production order 生产令identification and traceability 识别和可追溯性identification and traceability maintenance and replacement 识别和可追溯性维护与替换invalidate 使失效market survey 市场调研suitability 适宜性scope 适用范围controlled condition 受控状态terms and definitions 术语与定义analysis of data 数据分析sequence 顺序transfer of ownership 所有权转移system document 体系文件statistical technique 统计方法outsource(vt) a process 外包过程external source 外部来源documents of external origin 外来文件outsource, vt 外协unique identification 唯一的标识maintenance 维护Document Change Control 文件更改控制Request For Document Change (RDC) 文件更改需求单control of documents 文件控制documentation requirements 文件要求enquiry 问询，询价field nonconformity analysis 现场不符合分析relevance 相关性interaction 相互作用detail design 详细设计，详图设计，零件设计，施工设计sales department 销售部sales contract 销售合同checklist 校验表，一览表，检查一览表calibration 校准submission of action plans 行动计划的递交documented procedures 形成文件的程序documented statement 形成文件的声明performance requirements 性能要求licensee responsibilities 许可证持有者责任acceptance criteria 验收准则verification arrangement 验证安排verification results 验证结果customer focus 以客户为关注点，以客户为焦点awareness 意识introduction 引言，概述，介绍normative references 引用标准application 应用visit to user 用户访问review of requirements related to the product 有关产品的要求评审competent 有能力的effectiveness 有效性determination of requirements related to the product 与产品有关的要求的确定customer-related processes 与顾客有关的过程preventive action 预防措施management procedure for preventive actions 预防措施管理程序planned results 预期的结果intended use 预期的用途procedure for competence, knowledge and training of personnel 员工能力, 知识和培训程序personnel training procedure 员工培训程序supporting services 支持性服务functions 职能部门responsibility 职责assignment of responsibility 职责分工workmanship 制造工艺manufacturing acceptance criteria 制造验收准则quality policy 质量方针quality programs 质量纲领quality management system 质量管理体系quality management system planning 质量管理体系策划performance of the quality management system 质量管理体系业绩quality plan 质量计划quality records 质量记录quality objectives 质量目标quality audit 质量审核quality manual 质量手册quality problem handling form 质量问题处理单quality requirements 质量要求allocation table of quality responsibilities 质量职能分配表availability of resources 资源的可获得性resource management 资源管理allocation of resources 资源配置provision of resources 资源提供general requirements 总要求，一般要求constituent part 组成部件organization 组织continual improvement of the organization 组织的持续改进size of organization 组织的规模Organizational Diagram 组织机构图final acceptance 最终验收work instructions 作业指导书。

TDK EPCOS C0808 High Current Surface Mount Chip Re

Dimensions: [mm]Scale 20:1742692626017426926260174269262601T e m p e r a t u r eT pT L74269262601Cautions and Warnings:The following conditions apply to all goods within the product series of WE-TMSB ofWürth Elektronik eiSos GmbH & Co. KG:General:•This electronic component was designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Electronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved.•Do not drop or impact the components, the component may be damaged.•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not guarantee any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The customer is responsible for the functionality of their own products. All technical specifications for standard products also apply to customer specific productsProduct specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty. Wave soldering is allowed for components bigger than 0805 after evaluation and approval.•All other soldering methods are at the customers’ own risk.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the wire insulation, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product. Potting:•If the product is potted in the costumer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the core. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects. Storage Conditions:• A storage of Würth Electronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the components to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components. Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured. Handling:•Violation of the technical product specifications such as exceeding the nominal rated current will void the warranty.•The temperature rise of the component must be taken into consideration. The operating temperature is comprised of ambient temperature and temperature rise of the component.The operating temperature of the component shall not exceed the maximum temperature specified.These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable.However, no responsibility is assumed for inaccuracies or incompleteness.Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODMHB001.0012019-03-20DIN ISO 2768-1mDESCRIPTIONWE-TMSB SMT EMI SuppressionFerrite Bead ORDER CODE74269262601SIZE/TYPE BUSINESS UNIT STATUS PAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODMHB001.0012019-03-20DIN ISO 2768-1mDESCRIPTIONWE-TMSB SMT EMI SuppressionFerrite Bead ORDER CODE74269262601SIZE/TYPE BUSINESS UNIT STATUS PAGE。

半导体器件微电子机械器件第21部分：MEMS 薄膜材料泊松比测试方法-最新国标

半导体器件微电子机械器件第21部分：MEMS薄膜材料泊松比测试方法1 范围本文件规定了通过对薄膜材料施加单轴和双轴载荷测试和计算泊松比的方法，适用于长度和宽度小于10µm、厚度小于10µm的MEMS薄膜材料。

2 规范性引用文件下列文件中的内容通过文中的规范性引用而构成本文件必不可少的条款。

其中，注日期的引用文件，仅该日期对应的版本适用于本文件；不注日期的引用文件，其最新版本（包括所有的修改单）适用于本文件。

IEC 62047-8：2011 半导体器件微电子机械器件第8部分：薄膜拉伸特性测量的带材弯曲测试方法ASTM E132-04：2010 室温下泊松比标准测试方法。

3 术语、定义、符号和标志3.1 术语和定义下列术语和定义适用于本文件。

3.1.1泊松比 Poission’s ratioν材料弹性变形范围内，纵向应力均匀分布时，横向应变与纵向应变之比的负值，表示为-εt/εl，其中εt 是横向应变，εl是纵向应变。

3.2 符号和标志图1和表1分别给出了两种类型测试样品的符号和标号。

a ）用于单轴拉伸的1型样品b ）用于鼓膜的2型样品图 1 测量两种类型的样品的泊松比4 样品样品应使用接近于器件实际制造工艺制备的样品，且应与实际器件具有相同的尺寸量级，以使与尺寸相关的特性所产生的影响最小化。

IEC 62047-8中给出了一个制造工艺示例。

应使用退火工艺使样品厚度方向上的内部应力梯度最小化，但当退火工艺可能影响样品的杨氏模量和泊松比时，则应避免使用退火工艺。

4.2和4.3描述文件中使用的两种类型的样品。

4.2 样品4.1 通则形状本文件规定了两种类型的样品。

1型样品类似于一个拉伸试样的形状，如图1 a ）所示，2型样品具有两个膜，如图1 b ）所示。

对于1型样品，应制作两对测试结构标记，以定义纵向和横向应变。

通过测试纵向和横向的应变，泊松比由3.1规定的-εt /εl 的比值计算获得。

ESAB EMS 215ic、EMP 215ic 和 EM 215ic 产品 spare parts

Spare parts list0463412001GB20201209Valid for:serial no.EMS215ic:612-xxx-xxxx;EMP 215ic:552-, 615-,643-,719-xxx-xxxx;EM215ic:623-,627-xxx-xxxxEMS215ic,EMP215ic,EM215icOrdering number Product Notes0558102239EMS215ic BobbinØ4-8in.(100-200mm).CSA/Bayonet 0558102240EMP215ic BobbinØ4-8in.(100-200mm).CSA/Bayonet 0558102436EM215ic BobbinØ4-8in.(100-200mm).CSA/Bayonet 0700300985EMP215ic BobbinØ100-200mm(4-8in.)CE,euro connection 0700300986EM215ic BobbinØ100-200mm(4-8in.)CE,euro connection 0700300988EMP215ic BobbinØ100–200mm(4–8in.)euro connection,forMiddle East0700300993EMP215ic BobbinØ100-200mm(4-8in.)CE,euro connection,for AustraliaSpare parts are to be ordered through the nearest ESAB agency.Kindly indicate type of unit,serial number, denominations and ordering numbers according to the spare parts list.Maintenance and repair work should be performed by an experienced person,and electrical work only by a trained e only recommended spare parts.TABLE OF CONTENTSSPARE PARTS (4)Housing (4)Connections including drive system (6)User interface (8)Control modules (10)WEAR PARTS-CSA (12)WEAR PARTS-CE (14)Rights reserved to alter specifications without notice.SPARE PARTSHousingC=Component designation in circuit diagramItem Qty Ordering no.Denomination Notes C 110558102397Side frame,left210558102398Side frame,right340558102399Handle410558102400Top handle52Screw610558102401Side panel,left CSA,with ESABlogo and weldingdecal10464581001Side panel,left CE,with ESABlogo and weldingdecal710558102402Front foot With decals810558102403Rear foot910558102404Side panel right CSA,with ESABlogo10464582001Side panel right CE,with ESABlogo1010558102406Hinge114Screw M4×8mm124Nut M4×0.7mm134Washer M41420558102407Hinge pin1510558 102 405Roller latch asssembly162Screw M6×180mm178Screw M6×20mm186Screw M4×10mm194Screw M6×20mm202Sex bolt M6218Nut M6Connections including drive systemC=Component designation in circuit diagramItem Qty Ordering no.Denomination Notes C 110558102408Wire feeder mechanism CSA,includingmotor and harness 10464583880Wire feeder mechanism CE,including motorand harness 21Screw M5×16mm310558102409Remote connection outletwith harness8-pin connector 42Nut M3×0.5mm510558102410Brake hub nut610558102411Brake hub kit710558102412Solenoid assembly withhoses With gas valve, hose clamps and hoses810558102413Bracket for solenoid valve92Screw M4×10mm 1010558102414Gas connector CSA 10464587880Gas connector CE 1110558102415Main supply switch1210558102416Circuit breaker1310558102417Current sensor141Screw M3×8mm 1520558102418OKC contact female1610558102419Polarity changeover cablecomplete1720558102420Fan+wire harness Including wireharness 1810558102421Fan protection foam1910464588880Euro connection withharnessCE only2010464589880EMI PCB assembly incl.wireharnessCE only2110558102442Warning pinch-shock label Not included inillustrationUser interfaceC=Component designation in circuit diagramEM215icItem Qty Ordering no.Denomination Notes C 110558102486User interface complete210558102423Knob encoder with retainingring310558102487WF Pot Assembly410558102440Knob,small520558102489WF Pot Knob610558102488Process Select KnobEMP215ic,EMS215icItem Qty Ordering no.Denomination Notes C 110558102422EMP215ic panel assembly CSA10464590880EMP215ic panel assembly CE10558102485EMS215ic panel assembly CSA220558102423Encoder for small knob310558102424Encoder for large knob410558102438Replaceable display lens520558102440Knob,small610558102441Knob,large710558102437EMP215ic lens assembly kit10558102484EMS215ic lens assembly kitControl modulesC=Component designation in circuit diagramItem Qty Ordering no.Denomination Notes CCSA110558102426PCB Power boardassemblyCE10464591880PCB Power boardassembly210558102427PCB Control boardCSAcompleteCE10464592880PCB Control boardcomplete310558102428Main transformer with NTC(3x)410558102429Output diode assembly510558102430Output inductor assembly610558102431PFC inductor assembly710558102432Strain relief assemblyassembly810558102433Mains cable complete CSA only910558102434Warning label Not included inillustrationSPARE PARTSWEAR PARTS-CSAItem Ordering no.Denomination Wire type Wire dimensions10558102326Wire outlet guide Fe/SS/FluxCored 0.030 in. / 0.035 in. /0.045 in.(0.8 mm / 0.9 mm / 1.2 mm)0558102327Wire outlet guide Fe/SS/FluxCored0.024 in.(0.6mm)20558102328Wire inlet guide Fe/SS/FluxCored 0.024 in. / 0.030 in. / 0.035 in. /0.045 in.(0.6 mm / 0.8 mm / 0.9 mm / 1.2 mm)30558102334Key-drive shaft N/A N/A47977036Feed roll“V”groove Fe/SS0.024 in./0.030 in.(0.6 mm / 0.8 mm)W4014800Feed roll“V”groove Fe/SS0.024 in./0.035 in.(0.6 mm / 0.9 mm)7977732Feed roll“V”knurled Flux Cored0.030 in./0.035 in.(0.8 mm / 0.9 mm)7044277Feed roll“V”knurledFlux Cored0.045 in.(1.1 mm)50558102329Locking knob(Wiretension)N/A N/A60558102518Locking knob forthe feed roll70558102331Pressure armcomplete assemblyN/A N/A 80558102330Screw N/A N/A 90558102333MIG gun lockingknobN/A N/AWEAR PARTS-CEItem Ordering no.Denomination Wire type Wire dimensions10558102460Wire outlet guidesteel Fe/SS/FluxCored1.0 mm – 1.2 mm(0.040 in. – 0.045 in.)0558102461Wire outlet guidesteel Fe/SS/FluxCored0.6 mm – 0.8 mm(0.023 in. – 0.030 in.)0464598880Wire outlet guideteflon Aluminium 1.0 mm–1.2 mm(0.040 in.–0.045 in.)20558102328Wire inlet guide Fe/SS/FluxCored 0.6 mm/0.8 mm/0.9 mm/1.2 mm (0.023 in./0.030 in./0.035 in./ 0.045 in.)30191496114Key-drive shaftcrescentN/A N/A40367556001Feed roll“V”groove Fe/SS/FluxCored 0.6 mm/0.8 mm(0.023 in./ 0.030 in.)0367556002Feed roll“V”groove Fe/SS/FluxCored 0.8 mm/1.0 mm(0.030 in./ 0.040 in.)0367556003Feed roll“V”groove Fe/SS/FluxCored 1.0 mm/1.2 mm(0.040 in./ 0.045 in.)0367556004Feed roll"U"groove Aluminium 1.0 mm/1.2 mm(0.040 in./0.045 in.)50558102329Locking knob(Wiretension)N/A N/A60558102518Locking knob for thefeed roll70558102331Pressure armcomplete assemblyN/A N/A80558102330Screw N/A N/A90558102459Euro adapterlocating screwN/A N/AFor contact information visit ESAB AB,Lindholmsallén9,Box8004,40277Gothenburg,Sweden,Phone+46(0)31509000 。

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MATERIALS BENCHMARKING ACTIVITIES FOR CAMP FACILITY
WENQUAN LU (PI) Xin Su, Yan Qin, Manar Ishwait, Linghong Zhang, S. Trask, B. Polzin, D. Dees, and A. Jansen Electrochemical Energy Storage Chemical Sciences and Engineering Division Argonne National Laboratory Vehicle Technologies Annual Merit Review and Peer Evaluation Washington, D.C. Jun 6th – 9th, 2016
1200 Silicon capacity, mAh/g 1000 800 600 400 200 0 0
w/o SLMP
Si-G/NCA cell (N/P=1.6) 1.2M LiPF6 in EC/EMC w/ SLMP Si-G prepared @ANL Prelithiation by FMC
Lithium from anode
Lithium from cathode
w/ SLMP
50 Cycle
100
150
Prelithiation of anode using lithium powder apparently can mitigate the ICL during 1st cycle. Challenge is to apply and activate the lithium powder on anode.
IRREVERSIBLE CAPACITY LOSS (ICL) OF HIGH ENERGY ANODE
Silicon can provide high capacity, but
– Several issues need to be addressed. – One of them is large ICL, regardless of its form: Si, Si/graphite blend, or SiOx. Si/Graphite = 25/75 ICL = 22%
3
OBJECTIVES
To identify and evaluate low-cost cell chemistries that can simultaneously meet the life, performance, abuse tolerance, and cost goals for Plug-in HEV application.
4
APPROACH AND STRATEGY
To collaborate with material developers and leverage ANL’s expertise in electrode design and cell testing. Any cell chemistry, which has impact on the cell performance, will be validated, mainly in terms of – Electrochemical performance, – Electrode optimization, – Thermal stability. The electrochemical performance will be validated using coin type cells under test protocol derived from PHEV 40 requirements.
Characteristics at EOL Reference Equivalent Electric miles Range Peak Discharge Pulse Power (10 kW sec) Peak Regen Pulse Power (10 kW sec) Available Energy for CD kWh (Charge-Depleting) Mode Available Energy for CS kWh (Charge-Sustaining) Mode Maximum System Weight kg
USABC Requirements of Energy Storage Systems for PHEV
Unit PLeabharlann EV-20 mile PHEV-40 mile 20 37 25 5.8 0.3 70 47 40 38 25 11.6 0.3 120 80
USABC Requirements of Energy Storage Systems for PHEV
Budget
Total project funding in FY2016: $350K (as part of CAMP effort) 100% DOE
Partners and Collaborators
The Cell Analysis, Modeling, and Prototyping (CAMP) Facility (Andrew Jansen, ANL) Materials Engineering Research Facility (MERF) (Gregory Krumdick, ANL) Post Test Analysis Facility (Ira Bloom, ANL) Industries, Research institutions, and Universities
Theoretical Capacity (mAh/g)
5000 4000 3000 2000 1000 0
Li4Ti5O12
Li metal
Si
Ge SnO2 Sn
TiO2
Graphite
SiOx ICL = 30%
7
LITHIUM INVENTORY FROM ANODE OR CATHODE

How about blending lithium inventory into cathode electrode during slurry preparation?
– Pros: drop in replacement. – Cons: adding dead weight.
8
LITHIUM RICH Li5FeO4 DEVELOPED
Maximum System Volume
L
Test Protocol development
In order to conduct the electrochemical characterization of the battery chemistries for Applied Battery Research for Transportation (ABR) program, C rate and pulse current was calculated for coin cells according to PHEV 40 requirements.
2
RELEVANCE
An overwhelming number of materials are being marketed/reported by vendors/inventors for Lithium-ion batteries, which are needed to be validated for xEV applications. CAMP Facility was established at ANL to provide a realistic and consistent evaluation of candidate chemistries. In order to utilize the facility more efficiently and economically, the cell chemistries will be validated internally to determine if they warrant further consideration. The benchmarking (validation) activities will not only benefit the CAMP Facility, but also provide an objective opinion to the material developer. Moreover, the better understanding of the active materials at cell system level will support the material development efforts.
Silicon/HC/Lithium inventory High energy NCM Electrode library:
LiCoO2, LiMn2O4, NMC523, etc
PAA/SBR/CMC Additive ceramic coating CB/CNT/Graphene
6
Expanded metal
This presentation does not contain any proprietary, confidential, or otherwise restricted information
Project ID: ES028
OVERVIEW
Timeline
Start – Oct. 1st 2014 Finish – Sep. 30th 2017
5
TECHNICAL ACCOMPLISHMENTS AND MILESTONES