悬浮上砂金刚石线锯的锯切性能试验分析

2019年2月第1期第39卷总第229期

金刚石与磨料磨具工程

Diamond&Abrasives En g ineerin g

Feb.2019

No.1 Vol.39 Serial229悬浮上砂金刚石线锯的锯切性能试验分析*

郑楚夕1,马晓宾1,谢乾1,毕文波1,葛培琪1,2,龚洋3,柳廷全3

(1.山东大学机械工程学院,济南250061)

(2.山东大学,高效洁净机械制造教育部重点实验室,济南250061)

(3.山田研磨材料有限公司,山东临沂276700)

摘要采用不同上砂位置的悬浮上砂电镀金刚石线锯对单晶硅进行锯切试验,记录锯切时间,计算锯切效率,对比不同上砂位置锯丝的锯切性能三用扫描电镜对锯丝上砂及磨损情况进行观测,用表面粗糙度仪对硅片表面粗糙度进行测量三试验结果表明:不同上砂位置的锯丝的磨粒密度相差较大,上砂位置靠近上砂槽体中心的锯丝磨粒密度最大;磨粒密度较大的锯丝的锯切效率较高三磨粒密度为585颗/mm的

锯丝锯切效率为4.949mm2/min,比磨粒密度为446颗/mm的锯丝锯切效率(2.158mm2/min)提高了138%;用磨粒密度不同的锯丝加工出的硅片表面质量差别不大;锯丝的磨损及损伤形式主要是磨粒的磨损二磨粒的脱落及锯丝镀层的磨损与损伤三

关键词金刚石线锯;上砂位置;锯切性能;锯丝磨损与损伤

中图分类号 TG74;TQ164 文献标志码A 文章编号 1006-852X(2019)01-0076-04

DOI码10.13394/https://www.360docs.net/doc/bf16950353.html,ki.j g szz.2019.1.0014

Ex p erimental anal y sis on sawin g p erformance of

sand-sus p ension-electro p lated wire saw

ZHENG Chuxi1,MA Xiaob in1,XI E Qian1,BI Wenbo1,GE Pei q i1,2,GONG Yan g3,LIU Tin gq uan3

(1.School o f Mechanical En g ineerin g,Shandon g Universit y,J inan250061,China)

(2.Ke y Laborator y o f H i g h-E f f icienc y and Clean Mechanical Manu f acture o f Ministr y o f Education,

Shandon g Universit y,J inan250061,China)

(3.Shantian Abrasive Materials Co.,Ltd.,Lin y i276700,Shandon g,China) Abstract Sus p ended electro p lated diamond wire saws with different sandin g p ositions are used to machine sin g le cr y stal silicon.The sawin g p erformances of different wires are com p ared b y recordin g machine time and calculatin g the efficienc y.SEM is used to observe the sandin g and wear conditions, and the surface rou g hness is measured b y related instruments.Results show that the densit y of abrasive g rain varies g reatl y as sandin g p osition chan g es,while that is the hi g hest when sandin g p osition is close to the center of the launder.It is also found that the cuttin g efficienc y is hi g her if the wire saw has hi g her abrasive densit y.The one with abrasive densit y of585p er mm could cut4.949mm2/min,138% hi g her than that of the com p ared saw which has abrasive densit y of446p er mm and efficienc y of2.158 mm2/min.In addition,there is no bi g difference on surface q ualit y of silicon wafer machined b y wire saws with different abrasive densit y.The main wear or dama g e p atterns of wire saw are abrasive wear, g rain sheddin g and coatin g wear and dama g e.

Ke y words diamond wire saw;sandin g p osition;cuttin g p erformance;wire saw wear and dama g e

*基金项目:国家自然科学基金(No.51775317);山东省重点研发计划(No.2018GGX103039)三

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