3.0寸 37PIN(CMO+R61509V)(8bit,16bit)16;9 规格书
金士顿e MMC 5.1嵌入式多媒体卡（e
Embedded Multi-Media Card(e•MMC™ 5.1)EMMC16G-IB29-PE90EMMC32G-IB29-PE90EMMC64G-IB29-PE90v1.0Product Features•Packaged managed NAND flash memory with e•MMC™ 5.1 interface•Backward compatible with all prior e•MMC™ specification revisions•153-ball JEDEC FBGA RoHS Compliant package•Operating voltage range:o VCCQ = 1.8 V/3.3 Vo VCC = 3.3 V•Operating Temperature (T case) - 40C to +85C•Storage Temperature -55C to +85C•Compliant with e•MMC™ 5.1 JEDEC Standard Number JESD84-B51•Factory configured with pseudo Single Level Cell (pSLC) mode for enhanced reliability and performance•Factory configured with reliable writee•MMC™ Specific Feature Support•High-speed e•MMC™ protocol•Variable clock frequencies of 0-200MHz•Ten-wire bus interface (clock, 1 bit command, 8 bit data bus) with an optional hardware reset •Supports three different data bus widths: 1 bit(default), 4 bits, 8 bits•Bus Modes:o Single data transfer rate: up to 52MB/s (using 8 parallel data lines at 52MHz)o Dual data rate mode (DDR-104) : up to 104MB/s @ 52MHzo High speed, single data rate mode (HS-200) : up to 200MB/s @ 200MHzo High speed, dual data rate mode (HS-400) : up to 400MB/s @ 200MHz•Supports alternate boot operation mode to provide a simple boot sequence methodo Supports SLEEP/AWAKE (CMD5)o Host initiated explicit sleep mode for power saving•Enhanced write protection with permanent and partial protection options•Multiple user data partition with enhanced attribute for increased reliability•Error free memory accesso Cyclic Redundancy Code (CRC) for reliable command and data communicationo Internal error correction code (ECC) for improved data storage integrityo Internal enhanced data management algorithmo Data protection for sudden power failure during program operations•Securityo Secure bad block erase commandso Enhanced write protection with permanent and partial protection options•Power off notification for sleep•Field firmware update (FFU)•Production state awareness•Device health report•Command queuing•Enhanced strobe•Cache flushing report•Cache barrier•Background operation control & High Priority Interrupt (HPI)•RPMB throughput improvement•Secure write protection•Pre EOL information•Optimal sizeProduct DescriptionKingston’s e•MMC™ products conform to the JEDEC e•MMC™ 5.1standard. These devices are an ideal universal storage solution for many commercial and industrial applications. In a single integrated packaged device, e•MMC™ combines triple-level cell (TLC) NAND flash memory with an onboard e•MMC™ controller, providing an industry standard interface to the host system. The integrated e•MMC™ controller directly manages NAND flash media which relieves the host processor of these tasks, including flash media error control, wear-leveling, NAND flash management and performance optimization. Future revision to the JEDEC e•MMC™ standard will always maintain backward compatibility. The industry standard interface to the host processor ensures compatibility across future NAND flash generations as well, easing product sustainment throughout the product life cycle. ConfigurationsKingston’s e•MMC™ products support a variety of configurations that allow the e•MMC™ device to be tailored to your specific application needs. The most popular configurations described below are each offered under standard part numbers.Standard TLC – By default the e•MMC™ device is configured with the NAND flash in a standard TLC mode. This configuration provides reasonable performance and reliability for many applications. Pseudo Single Level Cell (pSLC) – The TLC NAND flash in the Kingston e•MMC™ device can be configured to further improve device endurance, data retention, reliability and performance over the standard TLC configuration. This is done by converting the NAND TLC cells to a pseudo single level cell (SLC) configuration. In this configuration, along with the performance and reliability gains, the device capacity is reduced by 2/3 of the capacity. This one-time configuration is achieved by setting the e•MMC™ enhanced attribute for the hardware partition.Kingston e•MMC™ can be ordered preconfigured with the option of reliable write or pSLC at no additional cost. Standard TLC devices can also be one-time configured in-field by following the procedures outlined in the JEDEC e•MMC™ specification. The JEDEC e•MMC™ specification allows for many additional configurations such as up to 4 additional general purpose (GPn) hardware partitions each with the option to support pSLC and reliable write. Additionally, Kingston provides a content loading service that can streamline your product assembly while reducing production costs. For more information, contact your Kingston representative.Kingston e•MMC™ devices are fully compliant with the JEDEC Standard Specification No. JESD84-B51. This datasheet provides technical specifications for Kingston’s family of e•MMC™ devices. Refer to the JEDEC e•MMC™ standard for specific information related to e•MMC™ device function and operation. See: /sites/default/files/docs/JESD84-B51.pdfe•MMC™ Mode and ControllerTLC mode using PS8229 - Leading edge 3D NAND flash technology in TLC mode rated to 3,000 endurance cycles.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.pSLC mode using PS8229 - Leading edge 3D NAND flash technology in pSLC mode.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.Part NumberingFigure 1 – Part Number FormatEMMC 16G - xxxx - PE90A B C DPart Number FieldsA: Product Family : EMMCB: Device Capacity : Available capacities of 16GB – 64GBC: Hardware Revision and ConfigurationD: Device Firmware Revision and ConfigurationTable 1 - Device SummaryDevice PerformanceTable 2 below provides sequential read and write speeds for all capacities. Performance numbers can vary under different operating conditions. Values are given at HS400 bus mode. Contact your Kingston Representative for performance numbers using other bus modes.Power ConsumptionDevice current consumption for various device configurations is defined in the power class fields of the EXT_CSD register. Power consumption values are summarized in Table 3 below.Device and Partition CapacityThe device NAND flash capacity is divided across two boot partitions (2048 KB each), a Replay Protected Memory Block (RPMB) partition (512 KB), and the main user storage area. Four additional general purpose storage partitions can be created from the user partition. These partitions can be factory preconfigured or configured in-field by following the procedure outlined in section 6.2 of the JEDEC e•MMC™ specification JESD84-B51. A small portion of the NAND storage capacity is used for the storage of the onboard controller firmware and mapping tables. Additionally, several NAND blocks are held in reserve to boost performance and extend the life of the e•MMC™ device. Table 4 identifies the specific capacity of each partition. This information is reported in the device EXT_CSD register. The contents of this register are also listed in the Appendix.e•MMC™ Bus ModesKingston e•MMC™ devices support all bus modes defined in the JEDEC e•MMC™ 5.1 specification. These modes are summarized in Table 6 below.Signal DescriptionTable 7 - e•MMC™ Signals Name Type DescriptionCLK I Clock: Each cycle of this signal directs a one bit transfer on the command and either a one bit (1x) or a two bits transfer (2x) on all the data lines. The frequency may vary between zero and the maximum clock frequency.DAT[7:0] I/O/PP Data: These are bidirectional data channels. The DAT signals operate in push-pull mode. These bidirectional signals are driven by either the e•MMC™ device or the host controller. By default, after power up or reset, only DAT0 is used for data transfer. A wider data bus can be configured for data transfer, using either DAT0-DAT3 or DAT0-DAT7, by the e•MMC™ host controller. The e•MMC™ device includes internal pull-ups for data lines DAT1-DAT7. Immediately after entering the 4-bit mode, the device disconnects the internal pull ups of lines DAT1, DAT2, and DAT3. Correspondingly, immediately after entering to the 8-bit mode, the device disconnects the internal pull-ups of lines DAT1–DAT7.CMD I/O/PP/OD Command: This signal is a bidirectional command channel used for device initialization and transfer of commands. The CMD signal has two operation modes: open-drain for initialization mode, and push-pull for fast command transfer. Commands are sent from the e•MMC™ host controller to the e•MMC™ device and responses are sent from the device to the host.DS O This signal is generated by the device and used for output in HS400 mode. The frequency of this signal follows the frequency of CLK. For data output each cycle of this signal directs two bits transfer(2x) on the data - one bit for positive edge and the other bit for negative edge. For CRC status response output and CMD response output (enabled only HS400 enhanced strobe mode), the CRC status and CMD Response are latched on the positive edge only, and don't care on the negative edge.RST_n I Hardware Reset: By default, hardware reset is disabled and must be enabled in the EXT_CSD register if used. Otherwise, it can be left un-connected.RFU - Reserved for future use: These pins are not internally connected. Leave floatingNC - Not Connected: These pins are not internally connected. Signals can be routed through these balls to ease printed circuit board design. See Kingston’s Design Guidelines for further details.VSF - Vendor Specific Function: These pins are not internally connectedVddi - Internal Voltage Node: Note that this is not a power supply input. This pin provides access to the output of an internal voltage regulator to allow for the connection of an external Creg capacitor. See Kingston’s Design Guidelines for further details.Vcc S Supply voltage for core Vccq S Supply voltage for I/ODesign GuidelinesDesign guidelines are outlined in a separate document. Contact your Kingston Representative for more information.Package DimensionsFigure 2 – Package DimensionsFigure 3 – Ball Pattern DimensionsBall Assignment (153 ball)Table 8 – Ball Assignment, Top View (HS400)1 2 3 4 5 6 7 8 9 10 11 12 13 14A NC NC DAT0 DAT1 DAT2 Vss RFU NC NC NC NC NC NC NC AB NC DAT3 DAT4 DAT5 DAT6 DAT7 NC NC NC NC NC NC NC NC BC NC Vddi NC Vssq NC Vccq NC NC NC NC NC NC NC NC CD NC NC NC NC NC NC NC DE NC NC NC RFU Vcc Vss VSF VSF VSF NC NC NC EF NC NC NC Vcc VSF NC NC NC FG NC NC RFU Vss VSF NC NC NC GH NC NC NC DS Vss NC NC NC H J NC NC NC Vss Vcc NC NC NC J K NC NC NC RST_n RFU RFU Vss Vcc VSF NC NC NC K L NC NC NC NC NC NC L M NC NC NC Vccq CMD CLK NC NC NC NC NC NC NC NC M N NC Vssq NC Vccq Vssq NC NC NC NC NC NC NC NC NC N P NC NC Vccq Vssq Vccq Vssq RFU NC NC RFU NC NC NC NC P1 2 3 4 5 6 7 8 9 10 11 12 13 14 Note: VSF, RFU and NC balls are not electrically connected. RFU balls may be defined with functionality by the Joint Electron Device Engineering Council (JEDEC) in future revisions of the e•MMC™ standard. Please refer to Kingston’s design guidelines for more info.Device MarkingFigure 4 - EMMC Package Marking240xxxx-xxx.xxxxYYWW PPPPPPPPxxxxxxx-xxxx2xxxxxxTAIWANKingston Logo240xxxx-xxx.xxxx：Internal control numberYYWW：Date code (YY– Last 2 digits ofyear, WW- Work week)PPPPPPPP： Internal control numberxxxxxxx-xxxx Sales P/N2xxxxxx : Internal control numberCountry：TAIWANCard Identification Register (CID)The Card Identification (CID) register is a 128-bit register that contains device identification information used during the e•MMC™ protocol device identification phase. Refer to JEDEC Standard Specification No.JESD84-B51 for details.Field Byte ValueMID [127:120] 0x70reserved [119:114] 0x00CBX [113:112] 0x01OID [111:104] 0x00PNM [103:56 ] IB2916(16G) IB2932(32G) IB2964(64G)PRV [ 55:48 ] 0x90PSN [ 47:16 ] RandomMDT [ 15:8 ] month, yearCRC [ 7:1 ] Follows JEDEC Standard reserved [ 0:0 ] 0x01Card Specific Data Register [CSD]The Card-Specific Data (CSD) register provides information on how to access the contents stored in e•MMC™. The CSD registers are used to define the error correction type, maximum data access time, data transfer speed, data format…etc. For details, refer to section 7.3 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueCSD_Structure [127:126] 0x03 (V2.0)SPEC_VER [125:122] 0x04 (V4.0~4.2)reserved [121:120] 0x00TAAC [119:112] 0x4F (40ms)NSAC [111:104] 0x01TRAN_SPEED [103:96 ] 0x32 (26Mbit/s)CCC [ 95:84 ] 0x0F5READ_BL_LEN [ 83:80 ] 0x09 (512 Bytes)READ_BL_PARTIAL [ 79:79 ] 0x00WRITE_BLK_MISALIGN [ 78:78 ] 0x00READ_BLK_MISALIGN [ 77:77 ] 0x00DSR_IMP [ 76:76 ] 0x00reserved [ 75:74 ] 0x00C_SIZE [ 73:62 ] 0xFFFVDD_R_CURR_MIN [ 61:59 ] 0x07 (100mA)VDD_R_CURR_MAX [ 58:56 ] 0x07 (200mA)VDD_W_CURR_MIN [ 55:53 ] 0x07 (100mA)VDD_W_CURR_MAX [ 52:50 ] 0x07 (200mA)C_SIZE_MULT [ 49:47 ] 0x07 (512 Bytes)ERASE_GRP_SIZE [ 46:42 ] 0x1FERASE_GRP_MULT [ 41:37 ] 0x1FWP_GRP_SIZE [ 36:32 ] 0x0FWP_GRP_ENABLE [ 31:31 ] 0x01DEFAULT_ECC [ 30:29 ] 0x00R2W_FACTOR [ 28:26 ] 0x02WRITE_BL_LEN [ 25:22 ] 0x09 (512 Bytes)WRITE_BL_PARTIAL [ 21:21 ] 0x00reserved [ 20:17 ] 0x00CONTENT_PROT_APP [ 16:16 ] 0x00FILE_FORMAT_GRP [ 15:15 ] 0x00COPY [ 14:14 ] 0x00PERM_WRITE_PROTECT [ 13:13 ] 0x00TMP_WRITE_PROTECT [ 12:12 ] 0x00FILE_FORMAT [ 11:10 ] 0x00Field Byte ValueECC [ 9:8 ] 0x00CRC [ 7:1 ] Follow JEDEC Standard reserved [ 0:0 ] 0x01Extended Card Specific Data Register [EXT_CSD]The Extended CSD register defines the Device properties and selected modes. It is 512 bytes long. The most significant 320 bytes are the Properties segment, which defines the Device capabilities and cannot be modified by the host. The lower 192 bytes are the Modes segment, which defines the configuration the Device is working in. These modes can be changed by the host by means of the SWITCH command. For details, refer to section 7.4 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueReserved [511:506] 0EXT_SECURITY_ERR [505:505] 0x00S_CMD_SET [504:504] 0x01HPI_FEATURES [503:503] 0x01BKOPS_SUPPORT [502:502] 0x01MAX_PACKED_READS [501:501] 0x3CMAX_PACKED_WRITES [500:500] 0x20DATA_TAG_SUPPORT [499:499] 0x01TAG_UNIT_SIZE [498:498] 0x03TAG_RES_SIZE [497:497] 0x00CONTEXT_CAPABILITIES [496:496] 0x05LARGE_UNIT_SIZE_M1 [495:495] 0x17(16G) 0x2F(32G) 0x5F(64G)EXT_SUPPORT [494:494] 0x03 SUPPORTED_MODES [493:493] 0x01FFU_FEATURES [492:492] 0x00 OPERATION_CODE_TIMEOUT [491:491] 0x00FFU_ARG [490:487] 65535 BARRIER_SUPPORT [486:486] 0x01Reserved [485:309] 0CMDQ_SUPPORT [308:308] 0x01CMDQ_DEPTH [307:307] 0x0FReserved [306:306] 0x00 NUMBER_OF_FW_SECTORS_CORRECTLY_PROGRAMMED [305:302] 0 VENDOR_PROPRIETARY_HEALTH_REPORT [301:270] 0 DEVICE_LIFE_TIME_EST_TYP_B [269:269] 0x01DEVICE_LIFE_TIME_EST_TYP_A [268:268] 0x01PRE_EOL_INFO [267:267] 0x01 OPTIMAL_READ_SIZE [266:266] 0x01OPTIMAL_WRITE_SIZE [265:265] 0x08Field Byte Value OPTIMAL_TRIM_UNIT_SIZE [264:264] 0x01 DEVICE_VERSION [263:262] 0FIRMWARE_VERSION [261:254] 0x90 PWR_CL_DDR_200_360 [253:253] 0x00 CACHE_SIZE [252:249] 1024 GENERIC_CMD6_TIME [248:248] 0x32 POWER_OFF_LONG_TIME [247:247] 0xFF BKOPS_STATUS [246:246] 0x00 CORRECTLY_PRG_SECTORS_NUM [245:242] 0 INI_TIMEOUT_AP [241:241] 0x64 CACHE_FLUSH_POLICY [240:240] 0x01 PWR_CL_DDR_52_360 [239:239] 0x00 PWR_CL_DDR_52_195 [238:238] 0x00PWR_CL_200_195 [237:237] 0x00PWR_CL_200_130 [236:236] 0x00 MIN_PERF_DDR_W_8_52 [235:235] 0x00 MIN_PERF_DDR_R_8_52 [234:234] 0x00 Reserved [233:233] 0x00TRIM_MULT [232:232] 0x11(16G) 0x11(32G) 0x22(64G)SEC_FEATURE_SUPPORT [231:231] 0x55 SEC_ERASE_MULT [230:230] 0xF7 SEC_TRIM_MULT [229:229] 0xF7 BOOT_INFO [228:228] 0x07Reserved [227:227] 0x00 BOOT_SIZE_MULT [226:226] 0x20ACC_SIZE [225:225] 0x07(16G) 0x08(32G) 0x09(64G)HC_ERASE_GRP_SIZE [224:224] 0x01ERASE_TIMEOUT_MULT [223:223] 0x11(16G) 0x11(32G) 0x22(64G)REL_WR_SEC_C [222:222] 0x01HC_WP_GRP_SIZE [221:221] 0x10 S_C_VCC [220:220] 0x08S_C_VCCQ [219:219] 0x08 PRODUCTION_STATE_AWARENESS_TIMEOUT [218:218] 0x14 S_A_TIMEOUT [217:217] 0x15 SLEEP_NOTIFICATION_TIME [216:216] 0x0FField Byte ValueSEC_COUNT [215:212] 10207232 (16G) 20414464 (32G) 40828928 (64G)SECURE_WP_INFO [211:211] 0x01 MIN_PERF_W_8_52 [210:210] 0x08 MIN_PERF_R_8_52 [209:209] 0x08 MIN_PERF_W_8_26_4_52 [208:208] 0x08 MIN_PERF_R_8_26_4_52 [207:207] 0x08 MIN_PERF_W_4_26 [206:206] 0x08 MIN_PERF_R_4_26 [205:205] 0x08 Reserved [204:204] 0x00 PWR_CL_26_360 [203:203] 0x00 PWR_CL_52_360 [202:202] 0x00 PWR_CL_26_195 [201:201] 0x00 PWR_CL_52_195 [200:200] 0x00 PARTITION_SWITCH_TIME [199:199] 0xFF OUT_OF_INTERRUPT_TIME [198:198] 0xFF DRIVER_STRENGTH [197:197] 0x1F DEVICE_TYPE [196:196] 0x57 Reserved [195:195] 0x00 CSD_STRUCTURE [194:194] 0x02 Reserved [193:193] 0x00 EXT_CSD_REV [192:192] 0x08 CMD_SET [191:191] 0x00Reserved [190:190] 0x00 CMD_SET_REV [189:189] 0x00 Reserved [188:188] 0x00 POWER_CLASS [187:187] 0x00 Reserved [186:186] 0x00HS_TIMING [185:185] 0x01 STROBE_SUPPORT [184:184] 0x01 BUS_WIDTH [183:183] 0x02Reserved [182:182] 0x00 ERASED_MEM_CONT [181:181] 0x00 Reserved [180:180] 0x00 PARTITION_CONFIG [179:179] 0x00 BOOT_CONFIG_PROT [178:178] 0x00 BOOT_BUS_CONDITIONS [177:177] 0x00 Reserved [176:176] 0x00 ERASE_GROUP_DEF [175:175] 0x00 BOOT_WP_STATUS [174:174] 0x00C - 4Field Byte Value BOOT_WP [173:173] 0x00 Reserved [172:172] 0x00 USER_WP [171:171] 0x00 Reserved [170:170] 0x00 FW_CONFIG [169:169] 0x00 RPMB_SIZE_MULT [168:168] 0x20 WR_REL_SET [167:167] 0x00 WR_REL_PARAM [166:166] 0x15 SANITIZE_START [165:165] 0x00 BKOPS_START [164:164] 0x00 BKOPS_EN [163:163] 0x00 RST_n_FUNCTION[162:162] 0x00 HPI_MGMT[161:161] 0x00 PARTITIONING_SUPPORT [160:160] 0x07 MAX_ENH_SIZE_MULT [159:157] 623(16G) 1246(32G) 2492(64G) PARTITIONS_ATTRIBUTE[156:156] 0x01 PARTITION_SETTING_COMPLETED[155:155] 0x01 GP_SIZE_MULT_4 [154:152] 0 GP_SIZE_MULT_3 [151:149] 0 GP_SIZE_MULT_2 [148:146] 0 GP_SIZE_MULT_1[145:143] 0 ENH_SIZE_MULT[142:140] 623(16G) 1246(32G) 2492(64G)ENH_START_ADDR[139:136] 0 Reserved[135:135] 0x00 SEC_BAD_BLK_MGMNT[134:134] 0x00 PRODUCTION_STATE_AWARENESS[133:133] 0x00 TCASE_SUPPORT [132:132] 0x00 PERIODIC_WAKEUP[131:131] 0x00 PROGRAM _CID_CSD_DDR_SUPPORT[130:130] 0x01 Reserved[129:128] 0 VENDOR_SPECIFIC_FIELD[127:67 ] 538968064ERROR_CODE [ 66:65 ] 0 ERROR_TYPE[ 64:64 ] 0x00 NATIVE_SECTOR_SIZE [ 63:63 ] 0x00 USE_NATIVE_SECTOR [ 62:62 ] 0x00 DATA_SECTOR_SIZE [ 61:61 ] 0x00 INI_TIMEOUT_EMU[ 60:60 ] 0x00C - 5FieldByte Value CLASS_6_CTRL [ 59:59 ] 0x00 DYNCAP_NEEDED[ 58:58 ] 0x00 EXCEPTION_EVENTS_CTRL [ 57:56 ] 0 EXCEPTION_EVENTS_STATUS [ 55:54 ] 0 EXT_PARTITIONS_ATTRIBUTE[ 53:52 ] 0 CONTEXT_CONF[ 51:37 ] 0 PACKED_COMMAND_STATUS [ 36:36 ] 0x00 PACKED_FAILURE_INDEX [ 35:35 ] 0x00 POWER_OFF_NOTIFICATION[ 34:34 ] 0x00 CACHE_CTRL [ 33:33 ] 0x00 FLUSH_CACHE [ 32:32 ] 0x00 BARRIER_CTRL [ 31:31 ] 0x00 MODE_CONFIG[ 30:30 ] 0x00 MODE_OPERATION_CODES[ 29:29 ] 0x00 Reserved [ 28:27 ] 0 FFU_STATUS[ 26:26 ] 0x00 PRE_LOADING_DATA_SIZE [ 25:22 ] 0MAX_PRE_LOADING_DATA_SIZE[ 21:18 ] 3304106(16G) 6608213(32G) 13216426(64G)PRODUCT_STATE_AWARENESS_ENABLEMENT[ 17:17 ] 0x01 SECURE_REMOVAL_TYPE[ 16:16 ] 0x01 CMDQ_MODE_EN[ 15:15 ] 0x00 Reserved[ 14:0 ]。
3.5寸液晶屏规格书SGC035COM—54PIN
Product SpecificationsCustomerDescription 3.45” TFT LCD ModuleModel Name SGC035COM—54PINDate 2008/6/13Doc. No.Revision BCustomer ApprovalDateThe above signature represents that the product specifications, testing regulation, and warranty in the specifications are acceptedEngineeringCheck Date Prepared DateDoris2008/6/13CONTENTSNo. ITEM PAGE0 RECORD OF REVISION 31 SUMMARY 42 FEATURES 43 GENERAL SPECIFICATIONS 44 ABSOLUTE MAXIMUM RATINGS 45 ELECTRICAL CHARACTERISTICS 56 DC CHARATERISTICS 67 AC CHARACTERISTICS 6~108 OPTICAL CHARATERISTIC 119 TOUCH PANEL 14~1510 INTERFACE 16~1911 BLOCK DIAGRAM 2012 QUALITY ASSURANCE 2113 OUTLINE DRAWING 2214 PACKAGE INFORMATION 2315 PRECAUTIONS 24~26RECORD OF REVISIONSRevision Date Page DescriptionA 2008/2/12 all New CreationB 2008/6/13 18 LCM PIN Definition1. SUMMARYThis technical specification applies to 3.45“color TFT-LCD panel. The 3.45“ color TFT-LCD panel is designed for GPS, camcorder, digital camera application and other electronic products which require high quality flat panel displays. This module follows RoHS.2. FEATURESHigh Resolution: 230,400 Dots (320 RGB x 240). SGC 035COM—54PIN is atransmissive type color active matrix liquid crystal display (LCD) which uses amorphous thin film transistor (TFT) asswitching devices. This product is composed of a TFT LCD panel, driver ICs, FPC, backlight unit and touch panel.,3. GENERAL SPECIFICATIONSParameter Specifications Unit Screen size 3.45(Diagonal) InchDisplay Format 320 RGB x 240 DotActive area 70.08(H) x 52.56(V) mmDot size 73x 219 umPixel Configuration RGB-Stripe Outline dimension 76.9(W) x 63.9(H) x 3.3(D) mm Display Mode Normally white/Transmissive Surface Treatment Haze 20% Display Garmut NTSC 60% Input Interface Digital 24-bit RGB/SERIALRGB/CCIR656/CCIR601Weight (31) g View Angle direction 6 o’clockOperation -20~70 ℃Temperature RangeStorage -30~80 ℃4. ABSOLUTE MAXIMUM RATINGSItem Symbol Condition Min. Max. Unit Remark Power Voltage DVDD,AVDD GND=0 -0.3 5.0 V Input SignalVoltage V in GND=0 -0.3 VDD+0.3 VNOTE Logic OutputVoltageV OUT GND=0 -0.3 VDD+0.3 V NOTENote: Device is subject to be damaged permanently if stresses beyond those absolute maximum ratings listed above1. Temp. ≤ 60℃, 90% RH MAX.Temp. ＞ 60℃, Absolute humidity shall be less than 90% RH at 60℃2.5. ELECTRICAL CHARACTERISTICS 5.1. Operating conditions:Parameter SymbolRatingMin. Typ. Max.Unit ConditionPower Voltage VCC 3.0 3.3 3.6 V Digital Operation CurrentIcc 8.6 mA Gate On Power VGH 14 15 18 V Gate Off Power VGL -11-10 -8V Vcom High Voltage VcomH 3.7 V Note1 Vcom low VoltageVcomL-1.6VNote1Vcom level max VcomA 6 VNote1. VcomH& VcomL ：Adjust the color with gamma data. Vp-p should be higher then4V.(Option 5V)Note: Please power on following the sequence VCC Æ VDD5.2 LED driving conditionsParameter Symbol Min. Typ. Max. Unit Remark LED current- 20 - m A Power Consumption - 400 420 mW LED voltage VBL+ 18.619.8 21 V Note 1 LED Life Time - (50,000)- - HrNote 2,3Note 1 : There are 1 Groups LEDILEDNote 2 : Ta = 25℃Note 3 : Brightess to be decreased to 50% of the initial value深圳宏辉成液晶显示有限公司/6. DC CHARATERISTICSParameter SymbolRatingUnit Condition Min. Typ. Max.Low level input voltage V IL 0-0.3VCCVHight level input voltage V IH0.7VCC-VCC V7. AC CHARATERISTICSDigital Parallal RGB interfaceSignal Item Symbol Min Typ Max UnitFrequency Tosc - 156 - ns Dclk High Time Tch - 78 - nsLow Time Tcl - 78 - nsDataSetup Time Tsu 12 - - nsHold Time Thd 12 - - nsPeriod TH - 408 - Tosc Pulse Width THS 5 30 - ToscHsyncBack-Porch Thb 38 ToscDisplay Period TEP - 320 - ToscHsync-den time THE 36 68 88 TsocFront-Porch Thf - 20 - ToscPeriod Tv - 262 - THPulse Width Tvs 1 3 5 TH Vsync Back-Porch Tvb - 15 - TH Display Period Tvd - 240 - THFront-Porch Tvf 2 4 - TH1. Thp + Thb = 68, the user is make up by yourself.2. Tv = Tvs + Tvb + Tvd + Tvf , the user is make up by yourself.3.When SYNC mode is used,1st data start from 68th Dclk after Hsync fallingDigital Serial RGB interfaceSignal Item Symbol Min Typ Max Unit Frequency Tosc - 52 - ns Dclk High Time Tch - 78 - ns Low Time Tcl - 78 - nsData Setup Time Tsu 12 - - nsHold Time Thd 12 - - nsPeriod TH - 1224 - Tosc Pulse Width THS 5 90 - ToscHsyncBack-Porch Thb 114 ToscDisplay Period TEP - 960 - Tosc Hsync-den time THE 108 204 264Front-Porch Thf - 60 - ToscPeriod Tv - 262 - THPulse Width Tvs 1 3 5 THVsync Back-Porch Tvb - 15 - THDisplay Period Tvd - 240 - THFront-Porch Tvf 2 4 - TH Note: 1. Thp + Thb = 204, the user is make up by yourself.2. Tv = Tvs + Tvb + Tvd + Tvf , the user is make up by yourself.3. When SYNC mode is used,1st data start from 204th Dclk after Hsync fallinCCIR601/656 InterfaceSignalData Setup Time Tsu 12 - - ns Hold Time Thd 12 - - ns深圳宏辉成液晶显示有限公司/[_//f+--------------------H " "'= 1560--------------------+jInvalid Data Inva l i d Da t a018,0"'=DOTCLK In va li d DataIn v a l i d Data]---...t--f------------H018, =1440-------------+jslrL//RR[7:0]In va lid DataIn va l i d Dataf---- t.<sP = HBP[6:0]'4+STH[1:0'1-- *. - ----------- IH0,se = 128--- --- ----.!Figure1 CCIR601 Horizontal Timing深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Doc. No.SEL[2:0] = 100- 111, NTSCVSYNC HSYNCRR[7:0]tveP = VBP[6:0]DL1DL2DL3IDL2391DL240I---ODD Field VSYNCEVEN FieldHSYNCRR[7:0]tvsP= VBP[6:0] + 1·IODD FieldI IDL1DL2DL3IDL2391DL240ISEL[2:0] = 100- 111, PAL, PALM=OEVEN VSYNCHSYNCRR[7:0]tvsP= VBP[6:0]DL1DL2DL3IDL2791DL280IODD Field VSYNCEVEN Fi l eHSYNCRR[7:0]tvsP= VBP[6:0] + 1·IODD FieldI IDL1DL2DL3IDL2791DL280ISEL[2:0] = 100 - 111, PAL, PALM=1EVEN VSYNCHSYNCRR[7:0]tveP= VBP[6:0]DL1DL2DL3IDL2871DL288 1ODD Field VSYNCEVEN Fi l eHSYNCI深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648IRR[7:0]lvsP= VBP[6 0] + 1·IDL1DL2DL3IDL287 1DL288 1Figure1CCIR601 Vertical Timing深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure2 CCIR656 Horizontal Timing深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure2 CCIR656 Vertical Timing深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure 3Digital RGB NTSC mode Vertical Data Format for 262THH cycle = 1224tHBP = 204HDISP = 960t HFP = 60DOTCLKHSYNCPixel DataDumm yD0D1----------D 957 D 958 D 959Dum mya ) Horizontal Data Transaction Tim ing V cycle = 262 Lines t VBP = 18VSYNC VDISP = 240 Lines t VFP = 4HSYNC Line 0 b ) Vertical Data Transaction Tim ing Line 239深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure 3 Data Transaction Timing in Serial RGB (8 bit) Interface (SYNC Mode)深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure3 Data Transaction Timing in Serial RGB (8 bit) Interface (DE Mode)深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure3Data Transaction Timing in Parallel RGB (24 bit) Interface (SYNC Mode)深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure4 Data Transaction Timing in Parallel RGB (24 bit) Interface (DE Mode)7.1.1 Standby ON/OFF Control LQ35NC211 has a power ON/OFF sequence control function. When STB pin is pulled L,blank data is outputted for 5-frames first, form the falling edge of the following VSYNC signal. The blank data would be gray level 255 for normally white LC.Figure5 Standby ON/OFF Control 7.1.2 Clock and Sync waveforms深圳宏辉成液晶显示有限公司 /手机 : 133 166 766 58 MSN: lcd.sales@ QQ：1378107648Figure6 CLK and IHS timing waveformTV FTC LTH B7.2 Reset Timing ChartThe RESET input must be held at least 1ms after power is stable8. OPTICAL CHARATERISTICTa=25±2℃, ILED=20mA Item Symbol Condition Min. Typ. Max. Unit Remark Response timeTr θ=0°、Φ=0°Tf- 10 ms- 15 msNote 3,5 Contrast ratio CRAt optimizedviewing angle300 400 - - Note 4,5 Color ChromaticityWhiteRedGreenBlueWxθ=0°、Φ=0WyRxθ=0°、Φ=0RyGxθ=0°、Φ=0GyBxθ=0°、Φ=0By(0.26) (0.31) (0.36) Note 2,6,7(0.28) (0.33) (0.38)Hor.ΘR(50) (60)Viewing angleΘL CR≧10(50) (60)Deg. Note 1Ver.ΦT(40) (50)ΦB(45) (55)Brightness - - 180 200 - cd/m2Center ofdisplayTa=25±2℃, I L=20mANote 1: Definition of viewing angle rangeFig. 8-1 Definition of viewing angleNote 2: Test equipment setup:After stabilizing and leaving the panel alone at a driven temperature for 10 minutes, the measurement should be executed. Measurement should be executed in a stable, windless, and dark room. Optical specifications are measured by Topcon BM-7 luminance meter 1.0° field of view at a distance of 50cm and normal direction.Fig. 8-2 Optical measurement system setupNote 3: Definition of Response time:The response time is defined as the LCD optical switching time interval between “White” state and“Black” state. Rise time, Tr, is the time between photo detector output intensity changed from 90﹪to 10﹪. And fall time, Tf, is the time between photo detector output intensity changedfrom10﹪to 90﹪.Note 4: Definition of contrast ratio:The contrast ratio is defined as the following expression.Contrast ratio (CR)= Luminance measured when LCD on the “White” stateLuminance measured when LCD on the “Black” stateNote 5: White Vi = V i50 ± 1.5VBlack Vi = Vi50 ± 2.0V“±” means that the analog input signal swings in phase with VCOM signal. “±” means that the analog input signal swings out of phase with VCOM signal.The 100% transmission is defined as the transmission of LCD panel when all the input terminals of module are electrically opened.Note 6: Definition of color chromaticity (CIE 1931)Color coordinates measured at the center point of LCDNote 7: Measured at the center area of the panel when all the input terminals of LCD panel are electrically opened.Brightness (min)Note 8 : Uniformity (U) = x 100%Brightness (max)9. TOUCH PANELNA10. INTERFACE10.1. LCM PIN DefinitionPin Symbol I/O Function Remark1 LED- I Backlight LED Ground2 LED- I Backlight LED Ground3 LED+ I Backlight LED Power4 LED+ I Backlight LED Power5 Y1 I Top electrode ,6 X1 I Right electrode7 NC Not Use8 /RESET - Hardware Reset9 SPENA I SPI Interface Data Enable Signal Note 310 SPCLK I SPI Interface Data Clock Note 311 SPDAT I SPI Interface Data Note 312 B0 I Blue Data Bit 013 B1 I Blue Data Bit 114 B2 I Blue Data Bit 215 B3 I Blue Data Bit 316 B4 I Blue Data Bit 417 B5 I Blue Data Bit 518 B6 I Blue Data Bit 619 B7 I Blue Data Bit 720 G0 I Green Data Bit021 G1 I Green Data Bit122 G2 I Green Data Bit223 G3 I Green Data Bit324 G4 I Green Data Bit425 G5 I Green Data Bit526 G6 I Green Data Bit627 G7 I Green Data Bit728 R0 I Red Data Bit0 /DX0 Note 429 R1 I Red Data Bit1 /DX1 Note 430 R2 I Red Data Bit2 /DX2 Note 431 R3 I Red Data Bit3 /DX3 Note 432 R4 I Red Data Bit4 /DX4 Note 4Control the input data format /floatingControl the input data formatControl the input data formatNot UseData Enable Input54 AVSS INote:1. The mode control (SEL2) not use ,it can’t control CCIR601 interface , If not use CCIR601 ,itcan floating.2. For digital RGB input data format, both SYNC mode and DE+SYNC mode are supported. If DEsignal is fixed low, SYNC mode is used. Otherwise, DE+SYNC mode is used.Suggest used SYNC mode!!Suggest the DE signal usually pull low.3. usually pull high.4. IF select serial RGB or CCIR601/656 input mode is selected,only DX0-DX7 used,and the other short to GND, Onlyselected serial RGB、CCIR601/656 interface,DX BUS will enable,Digital input mode DX0 is LSB and DX7 is MSB.5. Control the input data formatDoc. No.10.2 SPI timing CharacteristicsFigure8 SPI read、write timingFigure9 SPI timingFigure10 SPI Reference program10.3 SPI Register DescriptionWill be showing on Application Note From Chihsin .10.4 Basic Display Color and Gray ScaleColorRedMSB LSBInput Color DataGreenMSB LSBBlueMSBLSBR7 R6 R5 R4 R3 R2 R1 R0 G7 G6 G5 G4 G3 G2 G1 G0 B7 B6 B5 B4 B3 B2 B1 B0BasicColorsBlack Red(255) Green(255) Blue(255)CyanMagenta Yellow White 0 0 0 1 1 1 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 1 1 1 1 1 0 0 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 0 0 0 1 1 1 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 1 1 1 0 0 0 1 1 1 0 0 0 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 0 0 0 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 1 1 1 1 1RedRed(0) Dark Red(1) Red(2) :Red(253) Red(254)Red(255) Bright0 0 0 0 0 0 0 0 0 : : : 1 1 1 1 1 1 1 1 10 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 1 0 0 0 : : : : : : : 1 1 1 0 1 0 0 1 1 1 1 0 0 0 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 00 0 0 0 0 0 0 0 0 0 : : : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0GreenGreen(0) Dark 0 0 0 Green(1) 0 0 0 Green(2) 0 0 0:: : : Green(253) 0 0 0 Green(254) 0 0 0 Green(255)Bright 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 : : : : : : : 0 0 0 0 0 1 1 0 0 0 0 0 1 1 0 0 0 0 0 1 1 0 0 0 0 0 0 0 0 0 : : : 1 1 1 1 1 1 1 1 1 0 0 0 0 0 1 0 1 0 : : : 1 0 1 1 1 0 1 1 1 0 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 : : : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0Blue Blue(0) Dark Blue(1) Blue(2): Blue(253)Blue(254)Blue(255) Bright0 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 0 0 00 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 : : : : : : : 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 00 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 00 0 0 0 0 0 0 0 0 : : : 0 0 0 0 0 0 00 0 0 0 0 0 0 0 0 : : : 1 1 1 1 1 1 10 0 0 0 0 0 0 0 0 1 0 0 0 1 0 : : : : : 1 1 1 0 1 1 1 1 1 0 1 1 1 1 111. BLOCK DIAGRAMCUSTOMER’S SYSTEMDigital24-bits,CCIR656, CCIR601,SERIAL SPCLK, SPDAT, Hsync, Vsync, DCLK12. QUALITY ASSURANCENo. Test Items Test Condition REMARK 1 High Temperature Storage Test Ta=80℃ Dry 240h 2 Low Temperature Storage Test Ta=-30℃ Dry 240h 3 High Temperature Operation Test Ta=70℃ Dry 240h 4 Low Temperature Operation Test Ta=-20℃ Dry 240h5High Temperature and High HumidityOperation TestTa=60℃ 90%RH 240h6 Electro Static Discharge Test7 Shock Test (non-operating)8 Vibration Test (non-operating) Panel surface / top case. Contact / Air ：±6KV / ±8KV ，150pF ，330ΩShock Level : 100GWaveform : Half Sinusoidal WaveShock Time : 6msNumber of Shocks : 3 times for each ±X, ±Y, ±Z direction Frequency range: 10Hz ~ 550HzStoke ：1.3mmSweep : 1.5G, 33.3~400HzVibration : Sinusoidal Wave, 1Hrsfor X,YZ direction.Non-operating9 Thermal Shock Test-20℃(0.5h) ~ 70℃(0.5h) / 100cycles***** T a = Ambient TemperatureNote:1. The test samples have recovery time for 2 hours at room temperature before the function check. In the standard conditions, there is no display function NG issue occurred.2. All the cosmetic specifications are judged before the reliability stress.Doc. No.13. OUTLINE DRAWING Rev: BPage: 27 of 30Date: 2008/6/13ITO Film:Sheet Resistance 200~900ΩITO Glass:Sheet Resistance 200~900ΩSurface hardness MIN. 3H此區顯示為 lable 的貼附範圍lable 的實際大小則依據B L specComponent H=1.5mmX2 Y1Y2 X1 +Kapton1DATEDATEDATE 2007-11-192007-11-19TITLE:8Doc. No.14.PACKAGE INFORMATION Rev: BPage: 28 of 30Date: 2008/6/132APPROVED DATEE奇信電子股份有限公司DWG. NO.: HS-P-03450915QH011CHECKED DATE REV.:UNIT: SCALE:SHEET:DESIGNER Lake Chao DATE 01/15"07SIEZ: A2PART NO.: 09150190-001:1 1/14 5DRAWER Lake Chao7DATE 01/15"078TITLE:包材圖15 RECAUTIONSPlease pay attention to the following when you use this TFT LCD module.15.1 MOUNTING PRECAUTIONS(1) You must mount a module using arranged in four corners or four sides.(2) You should consider the mounting structure so that uneven force (ex. Twisted stress) is notapplied to the module.And the case on which a module is mounted should have sufficient strength so that external force is not transmitted directly to the module.(3) Please attach a transparent protective plate to the surface in order to protect the polarizer.Transparent protective plate should have sufficient strength in order to the resist external force.(4) You should adopt radiation structure to satisfy the temperature specification.(5) Acetic acid type and chlorine type materials for the cover case are not describe becausethe former generates corrosive gas of attacking the polarizer at high temperature and the latter causes circuit break by electro-chemical reaction.(6) Do not touch, push or rub the exposed polarizers with glass, tweezers or anything harderthan HB pencil lead. And please do not rub with dust clothes with chemical treatment.Do not touch the surface of polarizer for bare hand or greasy cloth. (Some cosmetics are determined to the polarizer)(7) When the surface becomes dusty, please wipe gently with adsorbent cotton or other softmaterials like chamois soaks with petroleum benzene. Normal-hexane is recommended for cleaning the adhesives used to attach front / rear polarizers. Do not use acetone, toluene and alcohol because they cause chemical damage to the polarizer.(8) Wipe off saliva or water drops as soon as possible. Their long time contact with polarizercauses deformations and color fading.(9) Do not open the case because inside circuits do not have sufficient strength.15.2 OPERATING PRECAUTIONS(1) The spike noise causes the mis-operation of circuits. It should be lower than followingvoltage：V=±200mV(Over and under shoot voltage)(2) Response time depends on the temperature. (In lower temperature, it becomes longer.)(3) Brightness depends on the temperature. (In lower temperature, it becomes lower)And in lower temperature, response time (required time that brightness is stable after turned on) becomes longer.(4) Be careful for condensation at sudden temperature change. Condensation makes damageto polarizer or electrical contacted parts. And after fading condensation, smear or spot will occur.(5) When fixed patterns are displayed for a long time, remnant image is likely to occur.(6) Module has high frequency circuits. Sufficient suppression to the electromagneticinterference shall be done by system manufacturers. Grounding and shielding methods may be important to minimize the interference.15.3 ELECTROSTATIC DISCHARGE CONTROLSince a module is composed of electronic circuits, it is not strong to electrostatic discharge.Make certain that treatment persons are connected to ground through wristband etc. And don’t touch interface pin directly.15.4 PRECAUTIONS FOR STRONG LIGHT EXPOSUREStrong light exposure causes degradation of polarizer and color filter.15.5 STORAGE When storing modules as spares for a long time, the following precautions are necessary. (1) Store them in a dark place. Do not expose the module to sunlight or fluorescent light. Keep the temperature between 5℃ and 35℃ at normal humidity. (2) The polarizer surface should not come in contact with any other object. It is recommended that they be stored in the container in which they were shipped. 15.6 HANDLING PRECAUTIONS FOR PROTECTION FILM (1) When the protection film is peeled off, static electricity is generated between the film and polarizer. This should be peeled off slowly and carefully by people who are electrically grounded and with well ion-blown equipment or in such a condition, etc. (2) The protection film is attached to the polarizer with a small amount of glue. Is apt to remain on the polarizer.Please carefully peel off the protection film without rubbing it against the polarizer. (3) When the module with protection film attached is stored for a long time, sometimes there remains a very small amount of glue still on the polarizer after the protection film is peeled off. (4) You can remove the glue easily. When the glue remains on the polarizer surface or its vestige is recognized, please wipe them off with absorbent cotton waste or other soft material like chamois soaked with normal-hexane. 15.7 Cautions for installing and assembling Bezel edge must be positioned in the area between the Active area and View area. The bezel may press the touch screen and cause activation if the edge touches the active area. A gap of approximately 0.5mm is needed between the bezel and the top electrode. It may cause unexpected activation if the gap is too narrow. There is a tolerance of 0.2 to 0.3mm for the outside dimensions of the touch panel and tail. A gap must be made to absorb the tolerance in the case and connector.。
NS4205深圳市纳芯威科技有限公司双声道D类音频功率放大器说明书
NS4205 3.0W双声道D类音频功率放大器附加待机模式功能1特性●3W输出功率(Vdd=5.0V,RL=4Ω)●0.2%THD（0.5W输出功率、5V电源）●优异的全带宽EMI抑制能力●90%的效率●高PSRR：-80dB（217Hz）●工作电压范围：3.0V～5.25V●过流保护、过热保护、欠压保护●SOP16封装3应用范围●低压音响系统2说明NS4205是一款无需滤波器、D类双声道音频功放。
NS4205采用先进的技术，在全带宽范围内极大地降低了EMI干扰，最大限度地减少对其他部件的影响。
NS4205无需滤波器的PWM调制结构及反馈电阻内置方式减少了外部元件、PCB面积和系统成本。
NS4205内置过流保护、过热保护及欠压保护功能，有效地保护芯片在异常工作状况下不被损坏。
并且利用扩频技术充分优化全新电路设计，高达90%的效率更加适合便携式音频产品。
NS4205提供SOP16封装，额定的工作温度范围为-40℃至85℃。
4应用电路5管脚配置NS4205SOP8的俯视图如下图所示：6极限工作参数●电源电压范围 2.8V~5.5V ●输入电压范围-0.3V~VDD ●ESD电压(HBM)4000V ●工作温度范围-40℃~+85℃●存储温度范围-65℃~+150℃●最大结温+150℃●焊接温度（10s内）+220℃●θJC）/θJA）（SOP-16）20/80o C/W 注：超过上述极限工作参数范围可能导致芯片永久性的损坏。
长时间暴露在上述任何极限条件下可能会影响芯片的可靠性和寿命。
7功能框图图3工作条件（除非特别说明）：T A=25℃，V DD=5V。
注：测试D类时必须加低通滤波器，一般由33uH电感和1uF电容构成。
为减小功率损耗和干扰噪声，让测试数据更加精准，测试NS4205时可选用电阻电容做滤波器，电阻值选500Ω,电容值选10nF。
10典型特性曲线11应用说明11.1工作模式设置NS4205的工作模式通过管脚/SD 和/MUTE 设置，如下表。
ACX502BMU索尼3.5寸液晶屏
HT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aHT CC on f i d e n t i aACX502BMU-7LCD panel Light source 30•‹ Oscilloscope Optical detectorDisplay Data 100% 90% Optical Instruments ResponseWhite(111111) ToffBlack(000000)Ton10% 0%Fig.3 Measurement system-3100% 90%Relative Reflectivity50%10% 0%HT CV10Fig.4 V-R characteristics** Liquid crystal voltage = |Selected voltage level - Common voltage + Reference voltage center - Common voltage center | See page17 for ‘Selected voltage level ‘.CoV50 V90 Selected voltage level (V)31nfide nti aWhite(111111) TimeACX502BMU-7400•}50mm1 •KReflective LCD Module(a)The apparatus for Luminance measurementK K/6 K/3 K/3L/6 1 L/3 L 4 L/3 7 L/6 2Co5 6 8 9 Fig.5 Measurement system-432HT C(b)The spot locations for luminance measurementnfiK/6 3 FPCde nti aIlluminance Colorimeter BM-5AACX502BMU-7Amplifier (Rion NA-42)FFT (Rion SA-01A2)PCLCD10mm LCD module Wood plate Measurement SystemMeasurement pointFig.6 Measurement system-5HT CCo33nfide nti aMicrophone (Rion NH-34)ACX502BMU-721. Note on handling(1) Static charge prevention Be sure to take the following protective measures. TFT-LCD panels are easily damaged by static charges. A) Use non-chargeable gloves, or simply use bare hands. B) Use an earth-band when handling. C) Do not touch any electrodes of a panel. D) Wear non-chargeable clothes and conductive shoes. E) Install grounded conductive mats on the working floor and working table. F) Keep panels away from any charged materials. G) Use ionized air to discharge the panels. (2) Protection from dust and dirt A) Operate in a clean environment. B) Do not touch the front light surface. The surface is easily scratched . C) Use ionized air to blow dust off the panel.(3) Other handling precautions A) Do not twist or bend the flexible PC board especially at the connection region because the board is easily deformed. B) Do not drop the module. C) Do not twist or bend the module. D) Keep the module away from heat sources. E) Do not dampen the module with water or other solvents. F) Avoid storage or using the module at high temperatures or high humidity , as this may result in damage.HT CCo34nfide nti a。
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PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS CONFIDENTIAL TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
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PROPRIETARY NOTE: THIS SHEET OF ENGINEERING DRAWING AND SPECIFICATIONS CONTAINS ONFIDENTIAL TRADE SECRET AND OTHER PROPRIETARY INFORMATION OF DELL INC. ("DELL") THIS DOCUMENT MAY NOT BE TRANSFERRED OR COPIED WITHOUT THE EXPRESS WRITTEN AUTHORIZATION OF DELL. IN ADDITION, NEITHER THIS SHEET NOR THE INFORMATION IT CONTAINS MAY BE USED BY OR DISCLOSED TO ANY THIRD PARTY WITHOUT DELL'S EXPRESS WRITTEN CONSENT.
贴片电阻常见封装有9种(学)
贴片电阻常见封装有9种，用两种尺寸代码来表示。
一种尺寸代码是由4位数字表示的EIA(美国电子工业协会)代码，前两位与后两位分别表示电阻的长与宽，以英寸为单位。
我们常说的0603封装就是指英制代码。
另一种是米制代码，也由4位数字表示，其单位为毫米。
下表列出贴片电阻封装英制和公制的关系及详细的尺寸：英制(inch)公制(mm)长(L)(mm)宽(W)(mm)高(t)(mm)a(mm)b(mm)020106030.60±0.050.30±0.050.23±0.050.10±0.050.15±0.05 04021005 1.00±0.100.50±0.100.30±0.100.20±0.100.25±0.10 06031608 1.60±0.150.80±0.150.40±0.100.30±0.200.30±0.20 08052012 2.00±0.201.25±0.150.50±0.100.40±0.200.40±0.20 12063216 3.20±0.201.60±0.150.55±0.100.50±0.200.50±0.20 12103225 3.20±0.202.50±0.200.55±0.100.50±0.200.50±0.20 18124832 4.50±0.203.20±0.200.55±0.100.50±0.200.50±0.20 20105025 5.00±0.202.50±0.200.55±0.100.60±0.200.60±0.20 25126432 6.40±0.203.20±0.200.55±0.100.60±0.200.60±0.20一、零件规格:(a)、零件规格即零件的外形尺寸，SMT发展至今，业界为方便作业，已经形成了一个标准零件系列，各家零件供货商皆是按这一标准制造。
U-SIN-R6000C-HRCN3 无纸记录仪 使用说明书
请将本手册交于操作者阅读。 在操作之前，请熟读本手册，并对产品有深入了解。 本手册只对产品的功能进行阐述，本公司不保证该产品将适合于用 户的某一特殊用途。
产品保护、安全及改造相关注意事项
为了确保安全使用本产品以及由其控制的系统，操作时请务必遵守 本手册中所述说明和注意事项。如果违反操作规程，则有可能会损坏本 产品所提供的保护功能。对由以上情况产生的质量、性能、功能和安全 问题，本公司不承担任何责任。
III
够完善，请勿运行。 仪表壳体上的通风孔须保持通畅，避免由于高温发生故障、动 作异常、寿命缩短和火灾。 请严格按照本手册的各项说明进行操作，否则可能损坏仪表的 保护装置。
开箱时若发现仪表损坏或变形，请勿使用。 安装时避免灰尘、线头、铁屑或其它异物进入仪表，否则会发 生动作异常或故障。 运行过程中，如需进行修改组态、信号输出、启动、停止等操 作，应充分考虑操作安全性，错误操作可能导致仪表和被控设备 发生故障乃至损坏。 仪表各部件有一定的寿命期限，为保证长期使用，务必进行定 期保养和维护。 报废本产品时，请按工业垃圾处理，避免污染环境。 不使用本产品时，请务必断开产品电源。 本仪表运行过程中如发现冒烟，异味，异响等异常情况时，请 立即关掉电源开关，同时切断供给电源，并及时与本公司取得联 系。
序号
产品包装内容
名称
数量
备注
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无纸记录仪
1
2
说明书
1
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合格证
1
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目录 第一章 产品概述..............................................................................................1 第二章 主要技术参数......................................................................................1 第三章 使用注意事项及安装......................................................................... 3
额定参数——精选推荐
DWIN DMD64480A-01W 智能LCD显示终端Ver1.0 1额定参数! 供电电源：DC12-28V 8VA，纹波不超过100mVp-p；! 工作电流（供电电压为DC12V）：650mA（背光开）/150mA（背光关）；! 通信接口：3线制（DIN/DOUT/GND）RS232串行接口；! 背光方式：CCFL背光；! 显示颜色：256色；! LCD类型：640×4800点阵 10.4” TFT LCD! 西文字库：8×8、8×12点阵全ASCII字符；! 中文字库：12×12、16×16、24×24、32×32点阵全GB2312简体中文点阵字库；! 用户可配置FLASH空间：512KB字库空间，16MB图片存储空间；! 工作温度范围：-20℃－65℃2 软件接口2.1基本约定串口格式：UART（RS232），1/N、8、1、波特率可软件设置；帧结构：0xAA（帧头）＋指令码（1字节，定义见接口指令集）＋数据（N字节，N<253）；帧结束标志：接收超时，超时定时器长度可软件设置。
2.2指令集说明：1.X（XH:XL），Y表示屏幕坐标，XH是X高字节，XL是X低字节；X范围0x00－0x27F，Y范围0x00-0x1DF。
2.所有指令均为十六进制（HEX）格式。
类型指令码数据说明无（下行）查询终端上电是否就绪，终端上电后到能够相应指令需要0.5-2秒时间，随电源不同而不同。
0x00‘OK’（上行）终端应答。
如果终端上电初始化过程未结束，将不应答。
握手举例：查询终端上电是否就绪串口下发： AA 00如果终端就绪，终端将应答：AA 00 4F 4B 04 07(生产日期)0x40 COLOR＋BKCOLOR 设置当前调色板，BKCOLOR为背景颜色（比如清屏即是用背景色填充全屏），COLOR为前景颜色。
颜色范围为0x00-0xFF，最多256色。
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修改记录日期版本修改内容拟制检查核准2012-8-28 01 初版发行上线目录1. 概述 - - - - - - - - - - - - - - - - -- - - - - - - - - - 32. 产品特征 - - - - - - - - - - - - - - - - -- - - - - - - - - - 33. 机械规格- - - - - - - - - - - - - - - - -- - - - - - - - - - 34. 外形尺寸 - - - - - - - - - - - - - - - - -- - - - - - - - - - 45. 接口定义 - - - - - - - - - - - - - - - - -- - - - - - - - - - 56. 功能框图 - - - - - - - - - - - - - - - - -- - - - - - - - - - 67. 接口时序 - - - - - - - - - - - - - - - - -- - - - - - - - - - 68. 复位时序 - - - - - - - - - - - - - - - - -- - - - - - - - - - 79. DDRAM 映射表 - - - - - - - - - - - - - - - - -- - - - - - - - 810. 极限技术参数 - - - - - - - - - - - - - - - - -- - - - - - - - 1011. 电气参数 - - - - - - - - - - - - - - - - -- - - - - - - - - - 1012. 背光参数 - - - - - - - - - - - - - - - - -- - - - - - - - - - 1113. 光电参数 - - - - - - - - - - - - - - - - - - - - - - -- - - - 1114. 极限环境参数- - - - - - - - - - - - - - - - -- - - - - - - - - 1515. 可靠性测试 - - - - - - - - - - - - - - - - - - - - - - - - - - 1516. LCM检验标准 - - - - - - - - - - - - - - - - - - - -- - - - 1617. LCM的使用- - - - - - - - - - - - - - - - -- - - - -- - - - 191. 概述1-1范围:此份规格书涵盖了LCM从上线科技到客户的运输过程中应该注意的所有要求。
1-2产品:LCD模块 (LCM)1-3型号:SX-TFT300-372. 产品特征transmissive(1)显示类型: Transmissive（全透式），1.77寸TFT，COG；(2)显示色彩: 262K；(3)驱动IC: R61509V(4)视角：12点(5)点阵：240(RGB) (W) ×400(H) Pixels；3. 机械规格项目规格单位外形尺寸77.00(L) x45.00(W) x2.8 mm 可视区域65.5(L) x39.5(W) mm 显示内容240RGB *400 Dots --- 结构类型COG+FPC+BL --- 背光类型WHITE LED －7.接口时序8.复位时序9. DDRAM 映射表14 极限环境参数ITEMSYMBOL CONDITIONS CRITERIONOPERATING TEMPERATURE T OPR -20℃～+70℃ NO DEFECT IN DISPLAYING AND OPERATIONAL FUNCTION STORAGE TEMPERATURE T STG -30℃～+80℃NO DEFECT IN DISPLAYING AND OPERATIONAL FUNCTION HUMIDITY－See NoteWITHOUT CONDENSATION15 可靠性测试16．LCM检验标准（1）外观检验项目及标准（非工作状态）次序项目判断标准AQL1 尺寸状况尺寸超出产品规格 12 缺口1、一般缺口2、角缺X Y Z≥ K/8 不进入A区≤TX Y Z≥ K/8 不进入A区不计2.503、引脚部位缺口4、边缘突起缺口伤及线路斑马纸产品Y ≤L/5；导电胶条产品Y ≤L/3；装脚产品Y ≤0.3mm 判断X Y Z ≥ K/8≥ L/3不计X Y ≥ K/8≥ L/33点状缺陷X:长径 Y:短径D:平均直径D=(X+Y)/2D 允许缺陷数 A/B 区 C 区D ＜0.2 不限 不限0.2≤D ＜0.3 2 0.3≤D ≤0.51 D>0.52.504线状缺陷长度 宽度 允许缺陷数 A/B 区 C 区不计 W ≤0.02 不计 不限L ≤3W ≤0.05 2 L ≤2.5W ≤0.05 2W ＞0.05按点状缺陷判定2.503字划/图案 粗细W ：图案设计尺寸 C 、D ：差异尺寸 G=|E-F|宽度接收规格W ＜0.4 C 、D 、G ≤1/2W W ≥0.4C 、D 、G ≤0.21.04点状缺陷X:长径 Y:短径D:平均直径D=(X+Y)/2如黑点、污迹在字段区，按“笔段缺陷”判定D 允许缺陷数 A/B 区 C 区D ＜0.1 不限 不限0.1≤D ＜0.22 0.2≤D ≤0.251 D>0.252.505线状缺陷L:长度 W:宽度长度宽度 允许缺陷数 A/B 区 C 区 不计 W ≤0.02 不计 不限L ≤3 W ≤0.03 2 L ≤2.50.03＜W ≤0.052W ＞0.05按点状缺陷判定2.5017 LCM 的使用16-1晶显示模块LCD 是由玻璃和偏光片组成，在搬运过程中，请注意以下事项： (1) 请保证使用和存储是在规定的温度范围之内。
高温高湿会导致偏光性能降级，产生气泡或者偏光片剥落。
(2) LCM 表面的偏光片质软容易划伤,不要用硬度大于HB 铅笔芯的任何物品（玻璃，镊子等）接触，挤压或者摩擦外露的偏光片(3) 用来粘合底/面偏光片和反射片的有机粘合剂会被一些化学物质，如丙酮，甲苯，乙醇和异链烷烃破坏，建议用N-己烷进行清洁。
(4) 显示屏表面有脏污，请吹拂同时用干的软布擦拭表面。
如果脏污比较严重，建议用脱脂棉或者其他的柔软材料，如擦拭用软皮，浸湿异丙醇或酒精之后进行擦拭其表面。
不要用力擦洗以避免损伤显示屏表面。
(5) 不可使用以下溶剂：水，酮，芳香烃。
其溶剂可能损坏偏光片。
(6) 避免与油和脂肪接触。
(7) 因低温而产生的表面浓缩和端子的连接，会损坏，染污或者弄脏偏光片。
产品在低温测试之后，需要先在容器之内烘干之后才可以与室温接触。
(8) 不要放置或贴附任何东西在屏幕上，以免留下痕迹。
(9) 不要裸手触摸显示器。
这样会染污显示区域，并且降低接线端子之间的绝缘性（对于偏光片一些化妆品是确定的）(10) 采取措施尽量减小电极的腐蚀。
水滴，凝结的潮气或者高湿环境下的电流会加速电极的腐蚀。
(11) 因为玻璃是易碎的，搬运过程中容易产生缺口（特别是边缘）。
请避免跌落或震动。
16-2组装LCM的注意事项因为LCM是高精密度的组装和调试，请避免因过度的撞击，或者进行任何的变更或者修改。
(1) 不要更改或者改变金属框架的突起形状。
(2) 不要在线路印刷板上另外钻孔，修改形状或者改变其上的元器件的位置。
(3) 不要损坏或者修改线路印刷板上的图案。
(4) 绝对不要更改斑马条（导电橡胶）或者热压连接器。
(5) 除了焊接接口，不要用烙铁进行任何的修改或者变更。
(6) 不要跌落，弯曲或者扭转LCM。
特别注意不可用力拉或者扭转I/O口或背光的排线。
(7) 为了防止FPC破裂，请特别注意FPC的可弯曲部分，覆盖层的边缘，镀金区域的表面，焊接区域或者通孔区域。
16-3静电放电控制因为模块使用CMOS LSI,像平常的CMOS IC一样需要注意静电的防护。
(1) 手持LCM时，请确保身体是接地的。
为了尽量减少因静电而产生的LCM功能降级，在运输模块时小心操作避免接触到：印刷电路板的外露区域，元件的电极。
(2) 从包装袋中取出LCM或者与其他装置装配时，请确保模块与你的身体的电势一致。
(3) 焊接LCM的接线端时，请确保烙铁的交流电源没有漏电。
(4) 使用电动螺丝批装配LCM时，电动螺丝批须接地以尽可能减小马达换向器产生火花而引起的电磁波辐射(5) 尽量使你的工衣，工作台达到地电位。
(6) 为了减少静电产生需要注意工作环境的空气不可太干燥。
建议相对湿度为50%-60%。
16-4操作注意事项：(1) 液晶的视角会随着驱动电压（VO）的变化而变化，调节VO使之显示为最好的对比度。
(2) 极限值以上的驱动电压会缩短LCD的使用寿命。
(3) 如果LCM长时间的显示一个图案，图案可能残存（似鬼影）或者其暗影不规则的显示。
隔段时间后使用即可恢复正常。
请注意这种现象不会影响显示。
(4) 在低于操作温度范围的温度下工作会造成响应时间延长。
但是，这并不意味着LCD不能工作。
它会在温度恢复至规定范围后恢复正常。
(5) 如果在工作过程中显示区域被猛烈的挤压，显示会异常。
但是，关电后重新启动后会恢复正常。
(6) 端子的凝结水汽会导致电化学反应，破坏线路的接线端。
所以，必须在低于40°C , 50% RH环境条件下中使用。
(7) 电源打开，在正极/负极电压稳定之后，输入信号。