GA Information

The GA898CC Die Bonder utilizes user-friendly interface of which all functions.commands and instructions are the monitor display and arranged in a tree menu,There are six main menus (BOND MODE,PRECESS MODE, SETUP MODE,CONVERSION Mode,DIAGNOSTIC Mode,and SERVICE Mode).

To transfer from one main menu to another main menu,press “←”and “→” keys until the desired menu is highlighted then press “ENTER” to go into the desired main menu.

Bond menu switch to PREOCESS menu. To access a sub-menu,press” ↑”and “↓” key until the desired submenu is highlighted then press “ENTER” to go into the desired submenu.

To go back to the main menu or sub-menu,press “ESC”key until the desired menu is displayed. Following is the keyboard,its keys and their corresponding functions.

“0”to “9” and “.” Numerric keys,use for numerical data input. “SP” key,use for apacing. “+” and ”-” key,use for positive and negative data entry. “shift” and “shift lock” keys,use for using the shifted keys in the keyboard.shifted keys can be used when pressing the “shift” key continuously or press “shift key” once,keyboard is locked for using the shifted keys.

“Ctl” an “Alt” key.use for general computer control purpose. “Esc” keys,use to stop an action or function.use to go back to the previous menu from any sub-menu. “BS” key,use to backspace the cursor. “PgUP” and “PgDn”,use to move the page up or page down page by page. “Del” key,use for general deleting purpose. “Enter” key,use to perform a highlighted function or to accept a value. “Stop” key,use to stop an action or function. “上下左右” key,use to toggle the cursor in left,right,up and down direction for desired menu or selection. “F1” to “F10” keys.use to enable or trigger a particular function in all the six modes. chapter 4>Parameter list. Main Menu: There are totally six main modes in GA898CC,Press the arrow key左and右to select and highlight an item then press[ENTER] to select. By pressing “FNT #” key in bond mode,some functions can be activated by the following keys:

FNT # Title Description 1 CaqmSel To select the current displayed camere to wafer,displaying or bonding side. 2 JoySpd To adjust the moving speed of the joystick from keypad. 3 PRSrch To perform PR search manually on current camera side. 4 BndIdx To index a leadframe to the bonding side. 5 ClrWH To clear all leadframe(s) on the workholder platform. 6 DspIdx To index a leadframe to the dispensing side. 7 CamIdx To index the bond optics according to the row of the leadframe. 8 HomeAnvil To home the Up/Down anvil block or window clamp. Bond Mode Auto bond->To perform auto-bonding according to the taught bonding program.All modules including the missing die checking function would be enabled automatically.The following key can be pressed to trigger different functions during bonding: Change the vies of current camera. To bond all leadframe on the workholder platform. To pick leadframe from stack loader to WH platform. To refill LF to the stack loader. To stop bonding after finishing the current picked-up side. To stop bonding immediately. 1 LF Bond-> To bond 1 lF only.This function is mainly used for trial bonding. 1 Die Bond-> To bond 1die only.This function was useful for trial bonding.The bond position would be updated to achieve the target position if the postbond inspection has been learnt and enabled.To teach the postbond inspection,go to”Setup Mode/Vison system/Postbond Inspection”. To enable the postbond inspection,go to”Process Mode/Process Options Menu/Use IQC” set to Yes. Bond Options Walk Path-> The walking path direction of the wafer table during bonding; LtoR-> Wafer table walked from left to right side. LtoB-> Wafer table walked from top to bottom region. Run Time Update(Y/X)-> Number of bonded sample to be collected for each die placement update cycle to the target position if postbond inspection was enabled.Maximum allowable die shift tolerace could be adjusted from”Precess Mode/IQC Setting Menu/IQC Parameters M- eanu/Postbond Inspection/Die Shift Tol”. Run Time Update(Ang)->Number of bonded samples to be collected for each die angele updated cycle to the target rotation if IQC inspection was enabled.Maximum allowableddie rotational tolerance was adjusted from “Process Mode/IQC Setting Menu/IQC Parameters Menu/ Postbon Inspection/Angle Tol”. Run time Update Mode->To select which type of run time update to be used: Always-> Every bonded die will be counted in update counter. OutSpec-> Only bonded die which are out of specification will be counted in update counter. Bond Die Mode->To select which type of die to be bonded: [Good] To bond good die only. [Ink] To bond inked die only. [Defect] To bond defective die only. Run Time Display-> To select the display during bonding. [Normal] Normal display on screen during machine operation. [LF Map] LF map display on screen during macine operation. Fixed wafer walk Dir-> To enable/disable the fixed walking direction of wafer. Units to Bond-> To set number of units to be bonded. Units bonded-> To display the number of units just bonded. Strirp Bonded-> To display the number of strip just bonded. Operations Menu Load/Unload wafer->Load wafer:Get the wafer from wafer cassette and then transfer to the wafer expander by the wafer robot. Unload wafer: Take the wafer out from wafer expander and then put into the wafer cassette by the wafer robot. Before carry out the wafer loading or unloading operation,user was required to adjust the unload position in”Setup Mode/Wafer Table and Expander/Teach Positions Menu/Wafer Unload Position”. To disable the use of wafer robot during wafer loading or unloading,set”Precess Mode/Precess Options Menu/Use Wafer Loader”to “No”. Align Wafer->To align the wafer by rotating the wafer expander,The align position could be set from “Setup Mode/Wafer Table and Expander/Teach Positions Menu/wafer Align Posn”.After finishing the alignment the wafer table would go to the pre-set wafer start position.this position could be taught by entering the “setup mode/wafer table and expander/teach positions menu/wafer start posn”.If wafer-mapping system was enabled,the wafer would be aligned based on the taught reerence die. Cass/Mag Oprerations