PCB专业英语词汇
PCB中英文对照词汇
覆盖层
Cover layer
28
增强板材
Stiffener material
29
铜箔面
Copper-clad surface
30
去铜箔面
Foil removal surface
31
层压板面
Unclad laminate surface
32
基膜面
Base film surface
33
胶粘剂面
Adhesive face
26
刚性双面印制板
Flex-rigid double-sided printed board、rigid-flex double-sided printed
27
刚性多层印制板
Flex-rigidmultilayerprinted board、rigid-flex double-sided printed
Surface laminar circuit(slc)
43
埋入凸块连印制板
B2it printed board
44
多层膜基板
Mutil-layered film substrate(mfs)
45
层间全内导通多层印制板
Alivhmultiplayerprinted board
46
载芯片板
Chip on board (cob)
28
齐平印制板
Flush printed board
29
金属芯印制板
Metal core printed board
30
金属基印制板
Metal base printed board
31
多重布线印制板
Mulit-wiring printed board
PCB专业术语大汇集
PCBJargon(PCB专业术语) AAbsorption 吸收、吸入Accelerated Test（Aging）加速实验、加速老化Accelerator 加速剂、速化剂Accept/Acceptance 允收Acceptable Quality Level（AQL）允收品质水准Accuracy 准确度ACF：Adhesive copper foil 有胶铜箔Activator 活化剂、添加剂比称为ActivatorActive parts（Devices）主动零件，指积体电路或电晶体Addition Agent 添加剂Additive Process 加成法、分全加成、半加成及部份加成Adhesion 附著力Adhesive 胶类或接著剂Aging 老化Air Knife 风刀Ambient Temperature 环境温度Ampere 安培Amp-Hour 安培小时Annular Ring 孔环Anode 阳极Anode Bag 阳极带ANSI: American National Standard Institute 美国规范协会Anti-Forming Agent 消泡剂AOI: Automatic Optical Inspection 自动光学检验Aperture 开口APQP: Advanced Product Quality PlanArray 排列、阵列Artwork 底片ASIC: Application Specific Integrated Circuit 特定用途的积体电路器Aspect Ratio 纵横比、板厚与孔径之比值Assembly 装配、组装ATE: Automatic Testing Equipment 自动电测设备AVL: Approved Vender List 合格供应商BBack Light（Back Lighting）背光法Back-UP 垫板Backpanels/Backplanes 背板、支持板，厚度较厚，Ball Grid Array（BGA）球脚车列（封装）Barrel 孔壁Base Material 基材Batch 批（同时间发料某一数量的板子）Bevelling 切斜边Binder 黏结剂Black oxide 黑氧化层，另有棕氧化（Brown Oxide）Blind Via Hole 盲导孔Blister 局部性分层或起泡Blockout 封网，网板之空网处以水溶胶涂满Blow Hole 吹孔，PTH孔壁有破洞（void）所造成Boiler (Water Tube Boiler/ Fire Tube Boiler)BOM: Bill of Material 用料表Bond Strength 结合强度Bonding Sheet(Layer) 接合片、接著层，指PPBonding Wire 结合线，IC之晶片与PCB之引线Bow 板弯Break-away Panel 可断开板或者说Break Away TabBreak Point 出像点、影像点Break-Out 破出（钻孔破出开成断环情形）Bridging 搭桥、桥接Brightener 光泽剂Brush Plating 刷镀BTU/British Thermal Unit 英制热量单位Bump 突块Buried Via Hole 埋导孔Burn-in 高温加速老化实验Burning 烧焦Burr 毛头Buy-off 认可CCAD: Computer Aided Design 电脑辅助设计CAM: Computer Aided Manufacturing 电脑辅助制造CAT: Computer Aided Testing 电脑辅助测试Capacitance 电容Carbide 碳化物、碳化钨钻头CAR: Corrective Action Report 改善报告Carbon Treatment 活性碳处理Card 卡板Carrier 载体Cartridge 滤芯Cathode 阴极CCL: Copper Clad Laminates 铜箔基板Ceramics 陶瓷Certificate 证明书CFC 氟氯碳化物 Chloro-Fluoro-CarbonChamfer 倒角、去掉直角Characteristic Impedance 特性阻抗Cheek list 检察清单Chip 晶粒、晶片Chip On Board 晶片黏著板Clean Room 无尘室 (Class 100)Cleanliness 清洁度Clearance 余隙、余环COB（Chip on Board）晶片在板上直接组装COC（Certificate of Compliance）出货合格书COF（Chip on Flexible PCB）COG（Chip glass）Coefficient of Thermal Expansion 热膨胀系数（CTE）Cold Solder Joint 冷焊点Component Hole 零件孔Component Side 组件面、零件面Conditioning 整孔Conductivity 导电度Connector 连接器Continuity Test 连通性实验Copper Foil 铜箔、铜皮Copper Ball 铜球Corner Crack 镀通孔转角断角Cp: Capability of Process 制程能力指数Crack 裂痕Crazing 白斑（基板外观上的缺点）Crosstalk 杂讯、串讯Cure/Curing 硬化、热化Current Density （C.D.）电流密度（1 ASD=9.1 ASF）Curtain Coating 液涂法Datum 基准点Deburring 去毛头Defect 不良缺点Degreasing 脱脂Delamination 分层、爆板Dent 凹陷、缓和均匀的下陷Desmearing 除胶渣Developer 显像液Deviation 偏差Device 电子元件Dewetting 缩锡DFM: Design for Manufacturing/Dirty foreign Materials 异物、杂质Die 冲模Dielectric 介质Dielectric Constant 介质常数Dimensional Stability 尺度安定性DIP（Dual Inline Package）双排脚封装体Direct Plating 直接电镀DI Water 纯水 (De-Ionize Water)DOE/Design of Experiment 实验计划法DPPM（Defect Parts Per Million）Drilling 钻孔Drill Bit 钻针Dry Film 干膜Dummy 假镀EECN: Engineering Change Notice 工程变更通知Elongation 延伸性EMI 电磁干扰 Electromagnetic InterferenceENIG: Electroless Nickel Immersion Gold 化镍浸金Entek 有机护铜处理Entry Material 盖板E.T/Electric Test 电测、电气测试Epoxy Resin 环氧树脂ESD: Electro-Static Discharge 静电流量Etching 蚀刻Etchback 加蚀Etch Factor 蚀刻函数Etching Resist 抗蚀阻剂Expose Copper 漏铜Exposure 曝光Eyelet 铆钉 RivetFAAR（First Article Approval Report）Failure 故障、损坏Fault 缺陷、瑕疵FCC/Federal Communication Commission 美国联邦通讯委员会Fiber Exposure 玻织显露Fiducial Mark 基准记号、光学点Film 底片Filter 过滤器Fine Line 细线Finger 手指Finishing 制成品在外观上的最后处理First Article 试产的首件或首批小量产品First Pass-Yield 初检良品率Fixture 夹具、治具 (Rig and Fixture)Flame Resistant 耐燃性（分HB、VO、V1及V2等四级）Flux 助焊剂Foil Burr 铜箔毛边Foot Pint（Land Pattern）脚垫Foreign Material 外来物、异物FR4/Flame Resistant Laminates 耐燃性积层板材Frequency 频率GGauge 量规Gel Time 胶化时间Gerber Data/Gerber File 格搏档案Glass Fiber 玻璃纤维Glass Fiber Protrusion 玻纤突出Glass Transition Temperature/Tg 玻璃态转化温度Golden Board 测试用规范板Grid 规范格Ground Plane 接地层Guide Pin 导针HHaloing 白圈、白边（在钻孔、开槽等机械动作一旦过猛时将造成内部树脂之破碎或微小分层裂开的现象）Hardener 硬化剂Hardness 硬度Heat Dissipation 散热Hertz（Hz）赫芝HEPA/High Efficiency Particulate Air Filter 高效空气尘粒过滤机Hipot Test 高压电测 High Potential TestHit 擎Holding Time 停区时间Hole Block 孔塞Hole Breakout 孔位破出，简称BreakoutHole counter 数孔机Hole Density 孔数密度Hole Pull Strength 孔壁强度Hole Void 破洞Hot Air Levelling 喷锡 HASL/HALTHE(High Temperature Elongation) 高温延伸性II.C.Socket 积体电路插座Image Transfer 影像转移IMC: Inter-metallic compound 介面合金共化物Immersion Plating 浸镀Impedance 阻抗In-Circuit Testing 组装板电测，ICTIndexing Hole 基准孔Infrared(IR) 红外线Ink 油墨Inner Layer 内层Input/Output 输入、输出Insert/Insertion 插接、插装Insulation Resistance 绝缘电阻Integrated Circuit (IC) 积体电路器Interconnection互连Intermatallic Compound(IMC) 介面合金共化物Internal Stress 内应力Ion Cleanliness 离子清洁度Ionic Contamination 离子污染IPC: The Institute for Interconnecting and Packaging Electronic Circuits 美国印刷电路板协会ISO: International Organization for Standardization 国际规范组织Isolation 隔离性JJPCA/Japan Print Circuit Association 日本印刷电路工业会Just-In-Time(JIT) 适时供应KKeyboard 键盘Kraft Paper 牛皮纸LLaminate(s) 基板、积层板Laminator 压膜机Land 孔环焊垫、独立点Landless Hole 无环通孔Laser Direct Imaging/LDI 雷射直接成像Laser Photoplotter 雷射曝光机、绘图机Lay Out 布线、布局 (configuration, general arrangement) Lay Up 叠合Lead Frame 脚架Lead 引脚、接脚Legend 文字标记Levelling 整平Light Intensity 光强度LMW: License Manufacturing Warehouse 保税厂Lot Size 批量LRR(Lot Reject Rate)MMajor Defect 严重缺点、主要缺点Marking 标记Mask 阻剂Mass Lamination 大型压板MCM/Multi-Chip Module 多晶片模组Measling 白点Membrane Switch 薄膜开关Microctching 微蚀Microsectioning 微切片法Migration迁移Mil 英丝0.001 inmisregistration 对不准、对不准度MLB/Multi-Layer Board 多层板Modem 调变及解调器、数据机Modification 修改、改变Module 模组Mother Board 主机板NNail Head 钉头N.C.数值控制（Numerical Control）Negative 负片Negative etch-back 反回蚀Nick 缺口Node 节点Nodule 瘤Non-Conformance 不合格品Non-flammable 非燃性Non-wetting 不沾锡Normal Distribution 常态分配NPI：New project introduction)NRE Charge-Non-Recurring Engineering Charge 不会重收的工程费用OOhm 欧姆Omega Meter 离子污染检测仪Open Circuits 断线Optical Density 光密度Optical Inspection 光学检验Organic Solderability Preservatives(OSP) 有机保焊剂Outgassing 出气、吹气Output 产出、输出Overflow 溢流Oxidation氧化Ozone Depletion 臭氧层耗损PPackaging 封装、购装Packing 包装Pad 配圈、孔环焊垫Panel Plating 全板镀铜Passive Parts 被动零件，如电阻、电容Past 膏（锡膏Solder Paste）Pattern Plating 线路电镀PCB/Printed Circuit Board 印刷电路板Peel Strength 抗撕强度Peripheral 周边附属设备Phototool 底片（一般指偶氮棕片 Diazo Film）Pin Grid Array(PGA) 矩阵式针脚封装Pinhole 针孔Pin 接脚、插梢、插针Pink Ring 粉红圈Pits 凹点（小面积下陷）Pitch 脚距、垫距、线距Plasma 电浆Plated through Hole/PTH 镀通孔Plug 插脚、塞孔Polarization 分极、极化Polyimide(PI) 聚亚酸胺Popcorn Effect 爆M花效应Post Cure 疏孔度实验Power Plane 后续硬化、后烤Power Supply 电源层PPM/Parts Per Million 百万分之几Preheat 预热Prepreg 胶片、树脂片Press Plate 压合钢板Press-Fit Contact 挤入式接触Printing 印刷Probe 探针Profile 轮廓、部面图、升温曲线图积线Punch 横切、冲床QQIT(Quality improvement Team) 品质改善小组Qualified Products List 合格产品（供应者）名单RRadiometer 辐射计、光度计Radius 尺角、半径Reference Dimension 参考尺度、参考尺寸Reflow Soldering 重熔焊接、熔焊Registration 对准度Reject 剔退、拒收Reliability 可靠度、信赖度Repair 修理Resin Content 胶含量、树脂含量Resin Flow 胶流量、树脂流量Resist 阻剂、阻膜Resistor 电阻器、电阻Resolution 解像、解像度、解读度Resolving Power 解读力、解像力（分辨力）Rework(ing) 重工、再加工Ring 套环Roller Cutter 混切机（俗称锯板机）Roller Coating 滚动涂布法Routing 切外型、捞外型RRM: Revolutions per Minute 转速（每分钟）Run-out 偏转、绕转、累积距差SSCAR(Supplier CA Request) 供应商改善报告SCM: Supply chain Management 供应商经管系统Scratch 刮痕Screen Printing 网版印刷Scrubber 磨刷机、磨刷器Selective Plating 选择性电镀SEM/Scanning Electron Microscope 扫瞄式电子显微镜Semi-Conductor 半导体Shearing 剪、裁切Short 短路SIR(Surface Insulation Resistance) 表面绝缘电阻Side Wall 侧壁Sigma(Standard Deviation) 规范差Signal 讯号Silicon 矽Silk Screen 网版印刷、丝网印刷Skin Effect 集肤效应Skip Printing 漏印Slot 槽孔Smear 胶渣SMT/Surface Mount Technology 表面黏装技术Solder 焊锡Solderability 焊锡性Solder Ball 锡球Solder Bridging 锡桥Solder Bump 焊锡凸块Solder Dam 锡堤（IC脚间的防焊）Solder Levelling 喷锡、热风整平Solder Mask(S/M) 绿漆、防焊膜Solder Paste 锡膏Solder Plug 锡塞、锡柱Solder Pot 锡炉Solder Side 焊锡面Soldering Fluid/Soldering Oil 助焊液、护焊汕Solid Content 固体含量SOP(Standard Operation Procedure) 规范作业程序Spacing 间距SPC/Statistical Process Control 统计制程管制Specific Gravity SG比重Specification(Spec) 规范、规格Specimen 样品、试样Spindle 钻轴Spray Coating 喷著涂装Stencil 版膜、网版Storage condition 储存条件Stress Relief 消除应力Substrate 底材Surface Insulation Resistance(SIR) 表面绝缘电阻Surface Tenting 表面张力Surface-Mount Device 表面黏装零件Swelling Agents/Sweller 膨胀剂SWR(Special Working Request) 试产前之“特殊工作要求”TTab 接点、金手指Tape 撕胶带实验Teflon 铁氟龙Temperature Profile 温度曲线Template 模板Tensile Strength 抗拉强度Tenting 盖孔法Terminal 端子Thermal Stress 热应力Thermal Shock 热冲击Thin Copper Foil 薄铜箔Then film Technology 薄膜技术Throwing Power 分布力Tolerance 公差Touch Up 检修（简单的工具在手操作下即可进行的小规范的检修，称之Touch Up或Rewok 有些类似）Trace 线路、导线Traceability 追溯性、可溯性Transistor 电晶体Transmission Line 传输线Twist 板翘、板扭UUL 保险业实验 Underwriters Laboratories/INCUltra Violet Curing(UV Curing) 紫外线硬化Ultrasonic Cleaning 超音波清洗Undercut/Undercutting 侧蚀Universal Tester 万用型电测机VVacuum Lamination 真空压合Vacuum Packing 真空包装Viscosity 黏滞度、黏度Vision Systems 视觉系统Visual Examination(Inspection) 目视检查Voltage 电压WWafer 晶圆Warp/Warpage 板弯Warp and Twist 板弯翘Washer 垫圈Waste Treatment 废弃处理Water Absorption 吸水性Water Break 水膜破散、水破Watermark 水印Wave Soldering 波焊Weave Exposure 织纹显露Weave Texture 织纹隐现Welding 熔接Wet Process 湿式制程Wetting Balance 沾锡、沾湿White Spot 白点Wicking effect 灯芯效应Wire Bonding 打线结合WIP(Working Piece in Process) 在制品XX Axis X轴X-Ray X光YY-Axis Y轴Yield 良品率、良率、产率ZZ-Axis X轴OtherHDI-High Density inter-connect 高密度内连接SWOT Strengths Weaknesses Opportunities ThreatsCD: Compact DiscCPU: Central Process UnitLaser, YAG Laser)DLD: Direct Laser Drilling (CO2DVD: Digital Versatile DiscEEPROM: Electrically Erasable Programmable Read Only Memory EMS: Electronics Manufacturing ServiceGPS: Global Positioning ServiceHDD: Hard Disk DriveHDTV: High Density TVLCD: Liquid Crystal DisplayLED: Light Emitting DiodeVCD: Video Compact DiskQuality System Requirements QS-9000(質量體系要求)Advanced Product Quality Planning and Control Plan APQP(產品質量先期策劃和控制計劃)Measurement Systems Analysis MSA(測量系統分析)Potential Failure Mode and Effects Analysis FMEA(潜在失效模式與後果分析) Production Part Approval Process PPAP (生產件批准程序)Statistical Process Control SPC (統計過程控制)IPC-A-600Classification 分级Acceptance Criteria 允收规格Applicable Documents 参考资料Dimensions And Tolerances 尺度与公差Terms And Definitions 术语及定义Workmanship 工艺水准Externally Observable Characteristics 外观特性Board Edges 板边Burrs 看头、毛刺Nonmetallic Burrs 非金属性毛头Metallic Burrs 金属毛头Nicks 缺口Haloing 白边Base Material 基材Weave Exposure 织纹显露Weave Texture 织纹隐现Exposed/Disrupted Fibers 玻织曝露/扰乱Pits and Voids 凹点与凹坑Base Material Subsurface 基材次表面Measling白点Crazing白斑Delamination/Blister分层/起泡Foreign Inclusions外来夹杂物Solder Coatings and Fused Tin Lead喷锡板或熔锡板Nonwetting拒锡（不沾锡）Dewetting缩锡Holes-Plated-Through-General镀通孔概要Nodules/Burrs镀瘤/毛头Pink Ring粉红圈Voids-Copper Plating镀铜层破洞Voids-Finished Coating完工皮膜之镀层破洞Lifted Lands-(Visual)孔环浮离（目检）Holes-Unsupported未镀孔Haloing白圈Printed Contacts板边接触金手指Surface Plating-General表面镀层通则Surface Plating-Wire Bond Pads打线承垫之表面Burrs on Edge-Board Contacts板边接点之毛头Adhesion of Overplate表面镀层之附着力Marking标记Etched Marking蚀刻标记Screened or Ink Stamped Marking纲印或盖印之标记Solder Resist(Solder Mask)防焊绿漆Coverage Over Conductors (Skip Coverage)边线表面之覆盖性（覆盖不全、跳印）Registration to Holes (All Finishes)对孔之套准度（各种表处理层）Registration to Other Conductive Patterns其他防焊的对准性Ball Grid Array (Solder Resist-Defined Lands)球脚格列体之焊垫（绿漆设限之焊垫）Ball Grid Array (Copper-Defined Lands)球脚格列体（铜面设限之焊垫）Ball Grid Array (Solder Dam)球脚格列体（防焊堤）Blisters/Delamination起泡/分层Adhesion(Flaking or Peeling)附著力（破片或剥落）Waves/Wrinkles/Ripples起浪/起皱/纹路Tenting(Via Holes)盖孔（导通孔、过孔）Pattern Definition-Dimensional圆形尺度特性Conductor Width and Spacing线宽与间距Conductor Width线宽Conductor Spacing导线间距External Annular Ring-Measurement孔环测量External Annular Ring-Supported Holes有孔壁支援的外孔环External Annular Ring-Unsupported Holes无孔壁支援的外孔环Flatness平坦度Internally Observable Characteristics可观察到的内在特性Dielectric Materials介质材料Laminate Voids(Outside Thermal Zone)压板空洞（或热区之外）Registration/Conductors to Holes导体与通孔之间的对准度Clearance Hole/Unsupported/to Power/Ground Planes针对电源层或接地层具隔环之非镀通孔Delamination/Blister分层/起泡Etchback回蚀Negative Etchback反回蚀Smear Removal除胶渣Dielectric Material/Clearance/Metal Plane for Supported Holes 金属层与通孔壁之介质隔距Layer-to-Layer Spacing层与层之间距Resin Recession树脂缩陷Conductive Patterns-General导线概论Etching Characteristics蚀刻特性Print and Etch印后即蚀刻（指正片法）Surface Conductor Thickness(Foil Plus Plating)表导体厚度（铜箔加电镀铜）Foil Thickness-Internal Layers内层箔厚Plated-Through Holes-General镀通孔概论Annular Ring-Internal Layers各内层之孔环Lifted Lands-(Cross-Sections)焊环浮起（切片上所见）Foil Crack-(Internal Foil)“C”Crack内层铜箔之裂纹Foil Crack-(External Foil)镀层破裂Plating Crack-(Barrel)“E”Crack孔壁镀层破裂Plating Crack-(Corner)“F”Crack孔角镀层破裂Plating Nodules镀层长瘤Copper Plating Thickness-Hole Wall孔壁镀铜厚度Plating Voids镀层破洞Solder Coating Thickness (Only When Specified)焊锡皮膜厚度（当已规定检查者）Solder Resist Thickness绿漆厚度Wicking灯芯效应（指玻织束渗入化学铜）Wicking/Clearance Holes隔离孔之渗铜Innerlayer Separation-Vertical (Axial) Microsection内层（环）分离-垂直（纵断面）微切片Innerlayer Separation-Horizontal (Transverse) Microsection内层（环）分离-水平（横断面）微切片Material Fill of Blind and Buried Vias盲孔与埋孔之填充材料钻孔式镀通孔Plated-Through Holes-Drilled钻孔式镀通孔Burrs毛头Nailheading钉头Plated-Through Holes-Punched冲孔式镀通孔Roughness and Nodules粗糙与镀瘤Flare喇叭口Miscellaneous其他离顶Flexible And Rigid-Flex Printed Wiring软性及软硬合板Metal Core Printed Boards金属平心电路板Type Classifications型式分类Spacing Laminated Type间距压合板Insulation Thickness/Insulated Metal Substrate已绝缘金属底材之绝缘厚度Insulation Material Fill/Laminated Type Metal Core压合型金属平心之绝缘填料Cracks in Insulation Material Fill/Laminated Type压合型绝缘填充料之裂纹Core Bond to Plated-Through Hole Wall平心层与镀通孔之间的固著Flush Printed Boards表面全平板Flushness of Surface Conductor表面导线之平坦性Cleanliness Testing清洁度实验Solderability Testing焊锡性实验Plated-Through Holes镀通孔Electrical Integrity电性之完整。
PCB专业术语中英文翻译【VIP专享】
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printed board47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
PCB术语中英文对照表
Adhesion附着力Annular Ring孔环AOI（automatic optical inspection）自动光学检测AQL（acceptable quality level）可接受的质量等级B²it(buried bump interconnection technology)埋入凸块焊点互连技术BBH(buried blind hole)埋盲孔BGA(ball grid array)球栅阵列Blister起泡Board Edges板边Burr毛头/毛刺BUM(Build-up multilayer)积层式多层板BVH（buried/blind via hole）埋/盲导通孔CAD(computer aided design)计算机辅助设计CAM(computer aided manufacturing)计算机辅助制造Carbon oil碳油CEM(composite epoxy material)环氧树脂复合板材chamfer倒角Characteristic impedance特性阻抗CNC（computerized numerical control）计算机化数字控制Conductor Crack导体破裂Conductor Spacing导线间距connector连接器Copper foil铜箔（皮）Crazing微裂纹(白斑)Delamination分层Dewetting半润湿(缩锡)DFM（design for manufacturing）可制造性设计DIP(dual in-line package)双列直插式组件Dk（dielectric constant）介电常数DRC(design rule checking)设计规则检查drawing图纸ECN(engineering change notice)工程更改通知ECO(engineering change order)工程更改指令E glass电子级玻璃entek OSP处理Epoxy resin环氧树脂ESD(electrostatic discharge)静电释放Etched Marking蚀刻标记Flatness翘曲度Foreign Inclusion外来夹杂物Flame resistant阻燃性FR-2(flame-retardant2)耐燃酚醛纸基板FR-3(flame-retardant3)耐燃环氧纸基板FR-4(flame-retardant4)耐燃环氧玻璃布基板FR-5(flame-retardant5)耐燃多功能环氧玻璃布基板ground地面（层）Haloing晕圈HDI(high density interconnection)高密度互连技术HASL(hot air solder leveling)热风焊料整平（整平）IC(integrated circuits)集成电路Ink Stamped Marking盖印标记Insulation resistance绝缘电阻Ion cleanliness离子清洁度IPC(the institute for interconnecting and packaging of electronic circuits)印制电路互连与封装协会ISO(International organization for standardization)国际标准化组织Laminate Voids压合空洞laser激光LDI(laser direct imaging)激光直接成像legend文字标记、符号Lifted Lands焊盘浮起logo标志LPI(liquid photoimageable)液态感光成像LPISM(liquid photoimageable solder mask)液态感光阻焊膜marking标记Measling白斑Microvoids微坑mil密耳（千分之一英寸）MIL-STD(military standard)美国军用标准Negative Etchback欠蚀Nicks缺口Nodules镀镏Nonwetting不润湿(拒锡)open开路OSP(organic solderability preservatives)表面抗氧化oxides氧化物pad焊盘panel拼板pattern板面图形PCB(printed circuit board)印制电路板Pcs(pieces)件、片、只Peeling剥落pinhole针孔Pink Ring粉红圈Pits凹坑pitch中心距Plating Voids镀层破洞plug塞Positive Etchback过蚀power电源层prepreg半固化片PTFE(polytetrafluoroethylene)聚四氟乙烯PTH(plated through-hole)金属化孔PWB(printed-wiring board)印制线路板Registration对准QA(quality assurance)质量保证QC(quality control)质量控制QE(quality engineering)质量工程QFP(quad flat package)方形扁平组件repair修理RCC(resin coated copper)已涂覆树脂的铜箔Reference dimension参考尺寸registration对准度resin树脂rejection拒收revision修订版RF(radio frequency)射频Ripples纹路rout外形铣scratch划伤Screened Marking纲印标记scoring刻槽short短路signal信号Silk screen丝网Skip Coverage漏印slot开槽SMD(surface mount device)表面安装器件SMOBC(solder mask over bare copper)裸铜覆盖阻焊膜SMT(surface mount technology)表面安装技术smear毛刺solder焊锡S/M(solder mask)绿油solderability可焊性Soda Strawing(汽水)吸管式浮空SPC（statistical process control）统计过程控制spacing间距Tape test胶带实验TCE（thermal coefficient of expansion）热胀系数TDR（time-domain reflectometry）时域反射测试tolerance公差Tenting盖孔Texture Condition显布纹Tg(glass transition temperature)玻璃软化温度THT(through hole technology)通孔（插装）技术trace线路（条）UL(underwriters laboratories)安全实验所NPTH非金属化孔UV(ultraviolet)紫外线辐射v-cut V刻Via hole导通孔（过线孔）void空洞warp板弯Waves波浪Weave Exposure露织物wetting沾锡Wicking灯芯效应（渗铜）Wrinkles起皱五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：rectangle pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referanceWelcome !!! 欢迎您的下载，资料仅供参考！。
PCB的相关英文单词
母板mother board子板daughter board背板backplane裸板bare board印制电路printed circuit印制线路printed wiring印制板printed board印制板电路printed circuit board印制线路板printed wiring board印制元件printed component印制接点printed contact印制板装配printed board assembly刚性印制板rigid printed board挠性印制电路flexible printed circuit挠性印制线路flexible printed wiring齐平印制板flush printed board金属芯印制板metal core printed board金属基印制板metal base printed board多重佈线印制板mulit-wiring printed board 模塑电路板molded circuit board散线印制板discrete wiring board微线印制板micro wire board积层印制板buile-up printed board表面层合电路板surface laminar circuit埋入凸块连印制板B2it printed board载芯片板chip on board埋电阻板buried resistance board键盘板夹心板copper-invar-copper board 动态挠性板dynamic flex board静态挠性板static flex board可断拼板break-away planel电缆cable挠性扁平电缆flexible flat cable (FFC)薄膜开关membrane switch混合电路hybrid circuit厚膜thick film厚膜电路thick film circuit薄膜thin film薄膜混合电路thin film hybrid circuit互连interconnection导线conductor trace line齐平导线flush conductor传输线transmission line跨交crossover板边插头edge-board contact导电图形conductive pattern非导电图形non-conductive pattern字元legend标誌mark基材base material层压板laminate覆金属箔基材metal-clad bade material覆铜箔层压板copper-clad laminate (CCL) 复合层压板composite laminate薄层压板thin laminate基体材料basis material预浸材料prepreg粘结片bonding sheet预浸粘结片preimpregnated bonding sheer 环氧玻璃基板epoxy glass substrate预制内层覆箔板mass lamination panel基底substrate基板面real estate导线面conductor side元件面component side焊接面solder side印制printing网格grid图形pattern内层芯板core material粘结层bonding layer粘结膜film adhesive无支撑胶粘剂膜unsupported adhesive film 覆盖层cover layer (cover lay)增强板材stiffener material铜箔面copper-clad surface去铜箔面foil removal surface层压板面unclad laminate surface基膜面base film surface胶粘剂面adhesive faec超薄型层压板ultra thin laminate结晶现象crystalline polamer双晶现象dimorphism共聚物copolymer环氧值epoxy value双氰胺dicyandiamide粘结剂binder胶粘剂adesive固化剂curing agent阻燃剂flame retardant遮光剂opaquer增塑剂plasticizers氟树脂fluroresin硅树脂silicone resin阶树脂A-stage resin A阶树脂B-stage resin B阶树脂C-stage resin C环氧树脂epoxy resin酚醛树脂phenolic resin聚酯树脂polyester resin聚醯亚胺树脂polyimide resin合成树脂synthetic热固性树脂thermosetting resin热塑性树脂thermoplastic resin感光性树脂photosensitive resin双马来醯亚胺三嗪树脂bismaleimide-triazine resin 丙烯酸树脂acrylic resin三聚氰胺甲醛树脂melamine formaldehyde resin 多官能环氧树脂polyfunctional epoxy resin溴化环氧树脂brominated epoxy resin环氧酚醛epoxy novolac硅烷silane不饱和聚酯unsatuiated polyester导电箔conductive foil铜箔copper foil压延铜箔rolled copper foil退火铜箔annealed copper foil薄铜箔thin copper foil涂胶铜箔adhesive coated foil涂胶脂铜箔resin coated copper foil复合金属箔composite metallic material聚酯薄膜polyester聚醯亚胺薄膜polyimide film (PI)玻璃纤维glass fiber玻璃纤维E-glass fibre E玻璃纤维D-glass fibre D玻璃纤维S-glass fibre S玻璃布glass fabric非织布non-woven fabric玻璃纤维垫glass mats白度whitenness陶瓷ceramics印制线路佈设printed wire layout佈设总图master drawing电脑辅助制图computer aided drawing装配图assembly drawing电脑控制显示computer controlled display 佈局placement佈线routing布图设计layout重布rerouting图形显示graphics dispaly比例因数scaling factor扫描填充scan filling矩形填充rectangle filling填充域region filling实体设计physical design逻辑设计logic design逻辑电路logic circuit元件密度component density导线（通道）conduction (track)导线（体）宽度conductor width导线距离conductor spacing导线层conductor layer导线宽度/间距conductor line/space第一导线层conductor layer No.1分线separated time分层eparated layer孔环annular ring元件孔component hole安装孔mounting hole支撑孔supported hole非支撑孔unsupported hole导通孔via镀通孔plated through hole (PTH)余隙孔access hole盲孔blind via (hole)埋孔buried via hole埋,盲孔buried blind via任意层内部导通孔any layer inner via hole 全部钻孔all drilled hole定位孔toaling hole中间孔interstitial hole无连接盘导通孔landless via hole引导孔pilot hole端接全隙孔terminal clearomee hole准尺寸孔dimensioned hole在连接盘中导通孔via-in-pad孔位hole location孔密度hole density孔图hole pattern钻孔图drill drawing定顺序definite sequence圆形盘round pad方形盘square pad菱形盘diamond pad长方形焊盘oblong pad子弹形盘bullet pad泪滴盘teardrop pad雪人盘snowman padV形盘V-shaped pad环形盘annular pad非圆形盘non-circular pad隔离盘isolation pad非功能连接盘monfunctional pad 偏置连接盘offset land。
PCB行业专业词汇大全
ＰCB行业专业词汇大全—马建整理＊ＰroceｓｓMoｄule 說明: ﻩﻩＡ、下料（ＣuｔLamｉnatioｎ) ﻩﻩﻩa-１裁板（Ｓheets Cutｔｉng）ﻩﻩﻩa-2 原物料發料（Ｐａneｌ)（Shｅar mａｔerial ｔｏSize）Ｂ、鑽孔(Drilliｎg) ﻩﻩb—1 內鑽(IｎneｒLayer Drillｉｎg ) ﻩﻩｂ-2 一次孔（Outer Layer Drilｌiｎg ) ﻩﻩb—3 二次孔(2ｎｄDｒｉｌlinｇ)ﻩﻩｂ-4 雷射鑽孔(Lasｅr Drｉｌlinｇ）（Lasｅr Abｌatiｏｎ）ﻩﻩﻩﻩb-５盲（埋)孔鑽孔(Ｂlind＆Buried Ｈole Driｌliｎｇ）ﻩﻩC、乾膜製程（Ｐhｏto Pｒocｅｓs（Ｄ/F）)ﻩc—1前處理（Pretｒeaｔmｅnt）ﻩﻩﻩc－2 壓膜(Dｒy Ｆilm Ｌamination)ﻩﻩﻩc—3曝光（Ｅｘpoｓｕrｅ) ﻩc－4 顯影（Ｄevｅlopinｇ) ﻩﻩﻩc—5蝕銅(Etching）ﻩﻩﻩﻩc-6 去膜（Ｓtrｉpｐiｎｇ)ﻩﻩc—7初檢( Toｕｃh－uｐ）ﻩﻩﻩc－８化學前處理，化學研磨（Cｈemiｃal Miｌling ) ﻩﻩc-9 選擇性浸金壓膜（SelｅｃtivｅGoldＤｒy Film Ｌamination) ﻩc-10 顯影（Deveｌoｐｉng )ﻩﻩc-11去膜(Strippiｎg ）D、壓合Ｌaｍｉnaｔioｎﻩﻩﻩd—1 黑化（Black Oxide Tｒｅatmｅnt）ﻩﻩd—2微蝕（Micｒoetcｈiｎg) d－3鉚釘組合（eｙeｌｅt）ﻩﻩﻩｄ－４疊板(Lay uｐ）ﻩﻩｄ-5 壓合（Lａmｉｎation）ﻩﻩﻩd-6後處理(Post Treatment）ﻩﻩﻩd-7 黑氧化（Blａck Oｘide Reｍovaｌ)ｄ—8 銑靶（spot face)ｄ-9 去溢膠(rｅsiｎfｌｕsh removal）E、減銅（CｏppeｒRｅduction）ﻩe-1 薄化銅（Ｃopper Rｅduction)ﻩF、電鍍（ＨｏrizontａｌElecｔrolytic Plaｔｉng) ﻩｆ—1水平電鍍（Hｏrizontal Eleｃtｒo—Platｉｎg) （Paｎel Pｌaｔｉng）f－２錫鉛電鍍（Tin-Lead Platiｎg ) （Pａｔteｒn Platiｎg）ﻩf-3 低於 1 mil ( Lesｓｔhan 1 ｍiｌTｈiｃkｎｅss )ﻩﻩf-4 高於1 mｉl(Ｍoｒｅthan 1 ｍil Thｉｃknｅｓs）ﻩﻩｆ-5 砂帶研磨（Belt Sandｉng）ｆ－６剝錫鉛(Tｉn—LｅaｄStrｉpｐing)f－7微切片（Microｓection）ﻩG、塞孔（Ｐlug Hｏｌｅ）ﻩﻩg-1 印刷（InｋPriｎt)g—2 預烤（Preｃure）ﻩg－3表面刷磨(Sｃｒub）ﻩg—４後烘烤（Ｐoｓtcure）ﻩﻩH、防焊（綠漆）：(SoldeｒMask）ﻩｈ—1Ｃ面印刷(Printing TｏｐSide）ﻩh-2 S面印刷(Prｉntｉng Bｏttom Side)h-3靜電噴塗（SpraｙCoａtinｇ)h－4前處理（Pretreatment）h—5預烤（Pｒｅcure) ﻩh—6 曝光(Ｅxposure)ﻩﻩh－７顯影(Ｄeｖeloｐ）h—８後烘烤（Pｏstcurｅ）ﻩﻩh-９UV烘烤（UV Ｃure）ﻩﻩh-１０文字印刷（Priｎtｉｎg of Legｅｎｄ) ﻩh-11噴砂（Pumｉce）（Wet Blasｔing）ﻩh—12 印可剝離防焊(Peelabｌe Soｌder Maｓｋ)Ｉ、鍍金Goｌd platｉｎｇﻩﻩi—1 金手指鍍鎳金（Gold Finger )ﻩﻩﻩi-2 電鍍軟金（SofｔNi/AｕPｌatinｇ）ﻩﻩﻩi－3浸鎳金(Iｍｍersｉon Nｉ/Ａｕ) （Elｅcｔｒoless Ｎｉ/Ａu)ﻩJ、噴錫（Hｏt Ａir Solｄer Levelｉng）ﻩｊ—１水平噴錫（Hｏｒizontａl HotＡｉr SｏldｅｒLeｖeｌｉng)ﻩﻩﻩｊ－2 垂直噴錫(Ｖｅrtical Hot Aｉr Solder Leveｌｉng) ﻩﻩj-３超級焊錫(Sｕｐer Ｓｏldｅｒ）ﻩﻩj－４、印焊錫突點(Sｏlder Buｍｐ)ﻩﻩﻩﻩK、成型（Prｏfile)(Form)k－１撈型（Ｎ/ＣRoｕｔinｇ）（Millinｇ)ﻩﻩﻩｋ-2 模具沖（Punch)k-３板面清洗烘烤（Cｌｅanｉnｇ＆Ｂacｋing）ﻩk－4 V型槽（Ｖ-Cut）(V-Sｃoｒiｎｇ)ﻩﻩｋ-5 金手指斜邊( Beveling of G／F）ﻩﻩﻩＬ、短斷路測試（ElｅctｒicaｌTｅsｔｉng)(Ｃonｔiｎｕitｙ& InｓulatｉoｎTesｔing)ﻩﻩl-1 AＯＩ光學檢查（AOＩInｓｐｅctｉon）ﻩﻩｌ-2VRＳ目檢（Verifiｅｄ& Repaｉrｅd）ﻩﻩﻩl-3 汎用型治具測試(UniverｓａｌＴeｓｔer) ﻩﻩｌ—4 專用治具測試（DedicateｄＴesｔer) ﻩl—5飛針測試（Flying Prｏbe）M、終檢（FｉnalＶisual Insｐeｃtｉon）ﻩﻩﻩm-１壓板翹（Warｐage Rｅmove）ﻩﻩﻩm—２X—ＯUT印刷(X—Oｕt Mａｒking）ﻩﻩm—3 包裝及出貨(Ｐａcking ＆shiｐpiｎｇ）ﻩﻩﻩm－4 目檢(VisｕalＩnspection)ﻩm-5 清洗及烘烤( Ｆiｎal Cleaｎ＆Ｂaking)m—６護銅劑（ＥNTＥKＣｕ-10６A）（ＯSP）ﻩm—7 離子殘餘量測試(Ｉｏnｉc Contａmiｎation Teｓt ）(Cleanｌiness Test)m—８冷熱衝擊試驗（Thermaｌｃｙｃlｉng Tesｔing)ｍ—9 焊錫性試驗（Soldeｒａbｉｌity Tｅstｉng)Ｎ、雷射鑽孔(Lａsｅr Ablatioｎ）N－1雷射鑽Tooｌiｎg孔（ＬaｓeｒａblａtioｎTｏolinｇＨolｅ）Ｎ—2 雷射曝光對位孔（Ｌaser Abｌaｔion Ｒｅgｉstration Hole)N—3雷射Ｍask製作(Laser Maｓk)N—4雷射鑽孔(Ｌａsｅr Ablａｔion）ﻩＮ－5AOI 檢查及VRＳ( AOI Ｉｎspecｔion ＆Veriｆied＆Repaired) N－6 BlaｓｅｒAOI（ａfteｒDeｓmeａr and Micｒｏetcｈing)Ｎ－7 除膠渣(Ｄesmear）N—8 微蝕（Microetchiｎg) ﻩA/W（ａｒｔwｏrｋ)ﻩ底片Ablａｔioｎ燒溶(lａser），切除ﻩａｂrａde 粗化ａｂrasion resiｓｔａnｃeﻩ耐磨性absorｐtｉonﻩ吸收ﻩﻩAＣC（accepｔ)ﻩ允收ﻩacceleraｔed coｒroｓｉon tesｔ加速腐蝕ﻩaccｅlerａtｅd teｓt 加速試驗accｅleratiｏｎ速化反應ﻩａcceleｒaｔｏr 加速劑ａccｅptaｂle 允收ａｃｔiｖａtoｒ活化液ﻩactive woｒk ｉn ｐrocｅss 實際在製品ﻩａｄhesioｎﻩ附著力adhｅｓivｅmethoｄ黏著法ﻩﻩａir inclusｉon 氣泡air kｎifeﻩ風刀ﻩamｏｒphｏus chanｇeﻩ不定形得改變ﻩａmountﻩ總量ﻩﻩamylnitriteﻩ硝基戊烷ﻩａnalｙzeｒﻩ分析儀ﻩａnneａｌ回火ﻩａnnular ｒingﻩ環狀墊圈;孔環ﻩaｎode ｓlｉme（sludge)ﻩ陽極泥ａnodizinｇﻩ陽極處理ﻩAOＩ(automatic opｔiｃａl inspｅctｉｏn )自動光學檢測appｌiｃaｂlｅdoｃumentsﻩ引用之文件AQL saｍpｌinｇ允收水準抽樣ﻩａqueous photoresist 液態光阻ａspect raｔｉoﻩ縱橫比(厚寬比）Ａs ｒeceived ﻩ到貨時ｂａｃk ligｈtiｎg 背光baｃk-upﻩ墊板bａｎkｅｄwｏrk ｉn proceｓs預留在製品baｓe ｍaterｉal 基材ｂaｓｅｌine pｅrfｏrｍance基準績效batch 批ｂeｔa bａcｋscatｔeriｎg貝她射線照射法beｖeｌingﻩ切斜邊;斜邊bｉaｘial deforｍａtｉon 二方向之變形black-oxｉdeﻩ黑化ﻩｂlank contｒollerﻩ空白對照組blａnｋpａｎel 空板blａｎkingﻩ挖空ﻩｂｌipﻩ彈開ﻩbｌister 氣泡；起泡ｂｌisterinｇ氣泡ﻩｂlow hoｌe吹孔ﻩﻩboard-ｔhicknessｅrｒｏr 板厚錯誤bonding ｐｌｉｅｓ黏結層bow；bowinｇﻩ板彎ﻩﻩｂreak out 從平環內破出ﻩﻩｂridging 搭橋;橋接ﻩBTO （BｕiｌｄTｏOｒdeｒ）ﻩ接單生產ﻩｂｕｒning 燒焦ﻩﻩbuｒｒﻩ毛邊(毛頭）ﻩcamcorder 一體型攝錄放機ﻩcａｒbide 碳化物ﻩcａｒｌson piｎ定位梢ﻩcarrieｒ載運劑ﻩﻩｃatalyziｎg 催化ﻩﻩcatｈolic sｐutteriｎg 陰極濺射法ﻩﻩｃａuｌｐｌatｅﻩ隔板；鋼板c aｌibraｔion system reqｕirements校驗系統之各種要求center beaｍｍeｔｈod 中心光束法ﻩｃeｎtｒalｐrojectiｏnﻩ集中式投射線cｅｒtifiｃaｔioｎ認證ﻩchａmｆer 倒角（金手指)chamferｉnｇ切斜邊；倒角cｈａracteｒistiｃimpｅｄanｃeﻩ特性阻抗ﻩｃhａrｇe tｒanｓfer ovｅrpｏtｅnｔｉａl電量傳遞過電壓ﻩchaｓeﻩ網框ﻩcheckboａrｄﻩ棋盤ﻩﻩchelatoｒ蟹与劑chemiｃal bond 化學鍵ﻩﻩｃｈｅｍiｃａｌvapoｒｄepoｓiｔionﻩ化學蒸著鍍ﻩｃirｃumｆerenｔial voiｄﻩ圓周性之孔破ﻩｃlａd metａlﻩ包夾金屬ﻩclean rｏｏｍ無塵室ﻩcleａraｎce間隙ﻩcoaｔ鍍外表ﻩｃｏatｉｎg erｒor 防焊覆蓋錯誤ﻩcｏefｆiｃiｅｎt oｆthermaｌｅxpansion(CTE) 熱澎脹系數ﻩｃold soｌder jｏiｎt冷焊點ﻩcｏｌd-weldﻩ金屬粉末冷焊color 顏色ﻩｃolor erｒｏrﻩ顏色錯誤ﻩｐeｎsation 補償ｐetiｔｉve ｐeｒformaｎｃe 競爭力績效ﻩplex salｔﻩ錯化物ﻩplexor 錯化物ﻩponent holeﻩ零件孔ﻩpｏｎent sｉde 零件面ﻩconｃeｎtｒｉcﻩ同心ﻩconｆoｒmance 密貼性consｕmeｒproducts 消費性產品coｎtactｒesisｔaｎcｅ接觸電阻ﻩcontiｎuous peｒｆorｍanｃeﻩ連續發揮效能ﻩcontraｃt seｒviｃeﻩ協力廠ｃｏntroｌｌeｄｓｐｌit均裂式ﻩconｖenｔioｎal flow 亂流方式ｃoｎventional tenｓilｅtｅstﻩ傳統張力測試法ﻩconversｉon coatｉnｇ轉化層ﻩconvex 突出cooｒdinatｅlist 資料清單ﻩｃoｐpeｒclaｄed ｌamｉnatｅs(CCL）銅箔基板ﻩcopｐｅr exｐosure 線路露銅ﻩcopper miｒror 鏡銅ﻩcｏpper paｄ銅箔圓配ﻩcopper ｒｅsiduｅ（coppｅr splash）銅渣ﻩﻩｃｏｒroｓｉon rate nuｍｂｅriｎg腐蝕速率計數系統c orｒosion resｉstance 抗蝕性cｏｕｌomｂｓlawﻩ庫倫定律ﻩﻩcountｅｒsink 喇叭孔ﻩcoｕponﻩ試樣ﻩｃoｕpon locａtｉoｎﻩ試樣點ｃoｖering powerﻩ遮蓋力ﻩﻩCPUﻩ中央處理器ﻩcrackﻩ破裂;裂痕ﻩcrazinｇﻩ裂痕;白斑crosｓlinｋinｇ交聯聚合ﻩcross ｔalkﻩ呼應作用ﻩcｒｏssｌｉnkiｎg 交聯cryｓtaｌcollectioｎ結晶收集ﻩcurｉnｇ聚合體ﻩｃuｒrｅｎt effｉciency 電流效率cut-ｏｕts 挖空cuttingﻩ裁板cyaniｄｅﻩ氰化物cycles of learnｉngﻩ學習循環ﻩcyｃle—tiｍe redｕｃｔion 交期縮短date ｃｏｄeﻩ週期ｄｅburrinｇ去毛頭ﻩﻩｄeｄicaｔｅｄﻩ專用型deｇrａdａtｉonﻩ退變delａｍiｎａtｉoｎﻩ分層ﻩdeｎt / pin ｈｏｌe 凹陷/針孔ｄepartmｅnｔof ｄeｆensｅ國防部ﻩdeｓignatｉon 字碼簡示法ﻩdｅ—smear除膠渣developing 顯影ﻩﻩdewetting 縮錫ｄeｗｅttｉｎg time 縮錫時間dｉmension error 外形尺寸錯誤dieｌecｔric ｃｏｎｓtant 介質常數ﻩdiffｉｃultｙ困難度difunctional 雙功能ﻩﻩdimenｓiｏnﻩ尺寸ﻩdiｍｅnｓiｏn ｓtaｂｉlｉtｙﻩ尺寸安定性ｄimｅnｓionａl stａbiｌｉtｙ尺度安定性ﻩｄimｅnｓiｏn aｎd tolｅrａncｅ尺寸與公差ｄirtｙhoｌeﻩ孔內異物ﻩdｉscｏlor hｏle 孔黑；孔灰；氧化discｏloraｔioｎ變色diｓposabｌe ｅｙeleｔmｅthoｄ消耗性鉚釘法dｉsｔｏrtiｏｎfaｃtorﻩ尺寸變形函數ｄouble siｄｅ雙面板ｄｏｗntｉme停機時間ﻩdrilｌ鑽孔ﻩdrill bｉtﻩ鑽頭ﻩｄrｉll fａｃet 鑽尖切萷面ﻩdｒｉll pｏiｎｔｅｒ鑽尖重（研）磨機ｄrilｌeｄbｌank bｏaｒdﻩ已鑽孔之裸板ﻩﻩdｒilｌiｎg 鑽孔ﻩdry ｆiｌm 乾膜ﻩﻩdｕctｉlityﻩ延展性ecｏnomｙｏf scale 經濟規模ﻩedge sｐacｉng 板邊空地ﻩedge-ｂoard cｏntact （gold ｆinｇer ) 金手指efficiency 能量效率ﻩeleｃtｒｉc tｅｓt 電測ﻩelecｔrｉcａlｔestｉngﻩ電測;測試ｅlecｔrochｅmical mａchｉｎe ＥCM 電化學加工法ｅlｅctroｃhemical reactoｒ電化學反應器electrｏｆｏrmｉng 電鑄electｒｏlｅss plａteﻩ化學銅elｅctrolｅss—ｄeposiｔｉｏn 無電鍍ﻩelｅctｒｏｐｏｌisｈingﻩ電解拋光ﻩﻩeｌecｔroｒefininｇ電解精鍊ﻩｅlectrowｉｎｎｉngﻩ電解萃取ﻩﻩellipｔicaｌsｅt 橢圓形ﻩeｍbｒittlemenｔ脆性ｅntiｔlemeｎt perｆorｍanceﻩ可達成績效ﻩｅｎtrapment 電鍍夾雜物ﻩepoｘy 環氧樹酯ﻩｅｑuipotentialﻩ電位線ﻩﻩeｒrｏｒdata file ﻩ異常情形ﻩﻩetｃh ｒａte 蝕銅速率ﻩetcｈanｔsﻩ蝕刻液ﻩetｃhbaｃkﻩ回蝕ﻩeｖａluaｔioｎproｇｒａmﻩ評估用程式ﻩﻩexposｕre 曝光ﻩeｘterｎal piｎmeｔhodﻩ外部插梢法eｙelｅt hoｌe 鉚釘孔ﻩﻩEyeletｔｉng 鉚眼ﻩfａbric網布ﻩfailurｅ故障ﻩﻩfaｓtｒesｐoｎｓｅﻩ快速回應fａｕlt ﻩ瑕庛；缺陷ｆiber exposureﻩ纖維顯露ｆiｂer ｐrｏtrusiｏnﻩ纖維突出fｉduｃial maｒｋﻩ光學點,基準記號fｉllｅr ﻩ填充料film底片ﻩｆiltrａｔｉon 過濾finished board 成品fixing固著ﻩfｉxture 電測夾具(治具）flaｋinｇoffﻩ粹離flａmmabiｌｉty ratｉｎｇ燃性等級ﻩｆlａrｅﻩ喇叭形孔ﻩflａt cａｂle ﻩ併排電纜feedback loop ﻩ回饋循環ｆirst-iｎ—fｉrst-ｏut （ＦIFＯ）先進先出ﻩflexｉｂle mａｎufacturｉｎg system （ＦMＳ) 彈性製造系統ｆｌux助焊劑foil ｄisｔortion銅層變形ﻩﻩfold空泡ﻩﻩfｏreignｉncludｅ異物ﻩﻩforeｉｇn mａterｉalﻩ基材內異物fｒee rａdiｃaｌchaｉｎpoｌymｅr ｉzａtioｎ自由基連鎖聚合ﻩfully ａｄditive ﻩ加成法ﻩfuｌly annealed typｅﻩ徹底回火軔化之類形ｆuncｔioｎ函數fundamental anｄbasiｃ基本fungｕs resistancｅ抗黴性ﻩﻩfuｎｎｅl ｆlange 喇叭形摺翼ﻩgalｖanizｅｄﻩ加法尼化製程gａp 鑽尖分開gaugｅｌengｔh 有效長度ﻩﻩgel tiｍe 膠化時間ﻩﻩgeneral ｒesiｓt iｎk 一般阻劑油墨gｅneｒaｌﻩ通論ﻩgｅｎeral iｎdustrｉaｌ一般性（電子）工業級ﻩﻩgｅometrical leｖelling 幾何平整ﻩgｌasｓtrａnsiｔion temperatｕre(Tg)玻璃態轉換溫度Gｏlｄ金ﻩgoｌｄfingeｒ金手指goｌd plaｔing 鍍金golden ｂoａrd標準板gｏugｅs ﻩ刷磨凹溝ﻩgougiｎgﻩ挖破ｇｒain bouｎdary 金屬晶體之四邊ﻩgreen 綠色ﻩgｒip ﻩ夾頭ﻩgrｏuｎd pｌane ﻩ接地層ｇroｕnd ｐlane cleａｒanceﻩ接地空環hacｋerｓ駭客ﻩHAＬ（hot air leveling) 噴錫ﻩhaloing ﻩ白邊；白圈ﻩhardｅnｅr 硬化劑ﻩﻩhardnesｓ硬度hｅpａｆｉlｔer 空氣濾清器ｈiｇh performａｎｃe indｕstrial 高性能（電子）工業級higｈreliabilｉty ﻩ高可靠度ﻩhｉgｈrｅsｏｌutｉon 高解析度high teｍperatｕre ｅlongａtion (HTE）高溫延展性銅箔ﻩhigh temperａｔure eｐoxy (HＴE）高溫樹酯ﻩhｉｔ擊hole coｕnter 數孔機ﻩﻩｈｏle ｄｉamｅtｅr 孔徑ﻩｈoｌeｄiａmｅter ｅrrorﻩ孔徑錯誤ｈｏｌe location孔位hｏlｅnumber孔數hole walｌquａliｔy 孔壁品質ﻩｈook ﻩ外弧ﻩｈot dｉp 熱浸法ﻩhull ｃｅll 哈氏槽ﻩhybrid ﻩ混成積體電路hydrｏgeｎbｏndingﻩ氫鍵ﻩhydｒolｙｓis 水解ﻩｈydｒoｍeｔａlluｒgｙﻩ濕法冶金法image aｎalysis ｓyｓｔemﻩ影像分析系統image transfer ﻩ影像轉移iｍｍｅrsｉoｎgolｄﻩ浸金(化鎳金)ﻩimmersiｏn platingﻩ浸鍍法ｉｍpedaｎｃe 阻抗ﻩiｎfrarｅd reflｏｗﻩ紅外線重熔ﻩinhｉbitor 熱聚合抑制劑ｉnjection moｌd 射模iｎｋﻩ油墨ﻩﻩｉnｎｅｒｌayer＆oｕtｌayer內外層inｓulaｔion ｒeｓistａｎce 絕緣電阻inteｎdeｄposiｔionﻩ應該在得位置intenｓｉfierﻩ增強器intenｓityﻩ強度ｉnｔeｒmolecular exchangｅ交互改變ﻩinterconｎeｃｔioｎ互相連通ionic coｎtamｉnａｎtsﻩ離子性污染物ｉonic cｏnｔaｍination ｔeｓting離子污染試驗IＰＡﻩ異丙醇inspiratioｎ(啟蒙)ｉdentificationﻩ確認計劃目標ﻩｉmpｌｅmentation 改善方案ﻩinfｏrｍatioｎ數據ｉnｔｅｒnａｌｉｚａtionﻩ制度化ﻩiｎvisｉｂlｅｉnveｎtｏry 無形得庫存ﻩｋniｆe edgｅs刀緣ﻩＫnoｏｐ努普(硬度單位）ﻩkraft paper ﻩ牛皮紙ﻩlaminaｒflow 層流ｌamｉnａtｅ基層板laｍｉnating 壓合ﻩlaminatioｎ壓合ﻩlamｉnator ﻩ壓膜機ﻩｌａnd 焊墊ﻩlay baｃｋﻩ刃角磨損ﻩlay up 組合疊板layｏut ﻩ佈線;佈局ﻩﻩlead sｃrew牽引螺絲leａkagｅ漏電leaｒｎｉngｃurvｅﻩ學習曲線ｌegenｄﻩ文字標記ﻩｌevelｉnｇﻩ平整ﻩlevｅlling addｉtiveﻩ平整劑ﻩﻩlevellinｇpowｅｒ平整力life ｓuppｏrｔ維繫生命ﻩlimitiｎgｃｕrreｎｔ極限電流ｌineｓpace ﻩ線距lｉｎｅwidthﻩ線寬lｉneaｒvａriable differentiａl trａｎsforｍer(LVDL) 線性可變差動轉換器liqｕid 液狀（態）ﻩﻩliquid cｒｙｓtal ｒesiｎs液晶樹脂ﻩｌiｑｕｉd pｈotoｉmaｇeａble solder resist ｉnｋﻩ液態感光防焊油墨liｑｕid photoresist iｎk 液態光阻劑油墨ﻩlot sizeﻩ批量ﻩlowｅｒcaｒrieｒﻩ底部承載板ﻩmechanical platｉngﻩ機祴鍍法ｍａcｈine scrub刷磨清潔法ﻩmaｃrothroｗinｇpowｅr ﻩ巨分佈力maｒgiｎ鑽頭刃帶maｒket shaｒeﻩ市場佔有率markｉng errｏr 文字錯誤masked lｅｖeling儰裝平整ｍａssｌaｍiｎａｔiｏnﻩ大型壓板ﻩmａｓs transｆer質量傳送效應mass tｒａnｓｆer oｖerpoteｎtｉal 質量傳遞過電壓masｓtrａnspｏrtａtion質傳ﻩmasｔer ｄrawｉngﻩ主圖；藍圖materiａl use fａctorﻩ材料使用率ﻩｍｅａliｎｇﻩ泡點；白點ｍｅmorｙﻩ記憶裝置ﻩｍenｉｓｃｏgrapｈsolderaｂilｉｔｙｍeａsｕreｍenｔ新月型焊錫效果microetch 微蝕ﻩmicroetcｈｉｎg 微蝕ｍicrｏfoｃｕｓﻩ微焦距ｍicroｆoｃus ｓysｔemﻩ微焦距系統ﻩmiｃｒoｐrofile ﻩ微表面ﻩmicrosecｔioningﻩ微切片法ﻩmicroｔhrｏwing power 微分佈力ﻩmｉgrａtｉon遷移mｉni—tensilｅtesteｒﻩ迷您拉力測試儀ｍis ｈole locaｔion孔位錯誤ﻩｍisreｇistraｔｉon 焊錫面與零件面對位偏差ﻩmｉsｒｅgsitration 對不準ﻩmｏiｓtｕre anｄｉnｓulatiｏn resｉstaｎce testﻩ濕氣與絕緣電阻試驗ﻩｍoｌded cｉｒｃuit ｂoaｒｄ(MCB）模製電路板monoetｈaｎａｌamine 單乙醇氨monohｙdｒaｔe state 水化物moｎomer ﻩ單分子膜；單體ｍouse bｉte ﻩ鋸齒;蝕刻缺口ﻩﻩmsec 毫秒ﻩmuｆｆle furnace ﻩ高溫焚火爐ﻩﻩｍｕｌｔiｃｈiｐﻩ超大IC型(多晶片模組）ｍｙｌaｒﻩ保護膜nａiｌheａdﻩ釘頭ﻩﻩＮC dｒill 數位鑽孔機ﻩnｅgative etｃhbａｃｋ反回蝕ｎｅgａtｉve ｆilｍ負片ﻩﻩnegａtivｅrａke angｌｅﻩ負摳耙角ｎetｗoｒk ﻩ迴路;網路ﻩｎｅutralizaｔion 中与ﻩnick 缺口ｎickel 鎳ﻩnoduleﻩ銅瘤;瘤粒no flow ｒeｓｉn ﻩ不流樹脂noｉｓｅ雜訊ﻩｎominal標示ﻩｎoｍinａl dimension 標定長度ｎominal ｇｅl ｔimeﻩ標示膠性時間nomｉnal resin content 標示膠含量ﻩｎoｍinal ｒesin flｏw 標示膠流量noｍinａｌscａlｅd ｆlow ｔhicｋneｓs 標示比例流量厚度OA eqｕip ﻩ辦公室自動化設備obsｏlｅscｅｎｃｅfacｔoｒﻩ報廢因素ﻩＯEMﻩ原設備製造商ﻩｏfｆsｅｔ-list ﻩ補償數據清單ﻩohmmeter 歐姆計ﻩｏpen ﻩ斷路ﻩｏpｅn circuｉｔs ﻩ斷路ﻩﻩopen shorｔtestiｎg ﻩ斷短路測試ｏｐｅnｉｎg開口ﻩoriginａl art ｗｏrk （A／Ｗ）原稿底片Oｔｈers 其它oｕｔgrowｔｈ增出ﻩover design 牛刀殺雞ovｅrlａｐ鑽尖重疊oｖerlａy ｅnｔｒy蓋板oｖeｒｐoｔentiaｌﻩ過電壓oｘｉｄation氧化ﻩoxiｄe trｅaｔmentﻩ黑化處理oｘｉdｅｄcyｔoｃhｒomeﻩ氧化性之細包色素ｏxｙgen evolutionﻩ氧氣發生反應pacｋｅd bｅd充填床式ﻩpad ﻩ錫墊;圓配ﻩpaｄcｏpper eｘpｏsuｒe pad 露銅ｐａnel小型板面；母板ﻩｐaｎｅl plaｔｉｎｇ一次銅電鍍parasitic ﻩ寄生得pａrt no、ﻩ料號patteｒn plating 二次銅電鍍ﻩＰＣB （print cirｃuiｔboａｒd )ﻩ印刷電路板pcｓ片ﻩｐｅel strengｔh ﻩ抗撕強度peｅｌing oｆf ﻩ剝離（剝落) ﻩｐerformanｃe spｅcificａtioｎﻩ性能規範permittivｉｔｙﻩ透電率pｅrspectｉves on ｅxperiｅｎｃe 經驗透視ﻩPEＴﻩ聚酯ﻩｐhｏｔodioｄｅdｅｔectorﻩ發光二極體偵測器ｐｈoto iｎｉtｉator ﻩ感光啟始劑ﻩｐhoｔｏｒesist ﻩ光阻photoｔｏolﻩ光具（指工作底片）ｐieceﻩ子板面ｐinceton ａppｌied resｅaｒchﻩ腐蝕測定儀pｉnk ring 粉紅圈pit凹點ｐiｔch 腳距ﻩpｌａnar ﻩ平面ﻩplａtｉng電鍍ﻩﻩplａting eｘｐoｓｕｒe 下鍍層露出pluｇgaugeﻩ插規pｌｕg hoｌe ﻩ孔塞ﻩPNL （paｎｅl）排板ﻩpolar－polａr interaction 極性之間得吸力polyester ﻩ聚酯類poｌyglycols 聚乙二醇ﻩpｏｌyimide 聚亞醯氨pｏor bevｅlｌｉngﻩ磨邊加工引起突起,剝離ｐoor drill 孔形不良ﻩpoｏｒHＡL噴錫不良ﻩｐooｒmaｒｋiｎg 字體不良ｐｏor pad 錫墊不良ﻩｐｏor ｐrintｅd 印刷偏差ｐｏｏr sｏldeｒａbilitｙﻩ焊錫性不良ｐｏor touch—upﻩ補線不良ﻩｐosition conｔrol systemﻩ位置控制系統ﻩｐositivｅrａｋｅangｌｅ正摳耙角poｗｅr curｖe ｍｏｄeｌﻩ幕次曲線模式ﻩｐrａctｉce 工藝慣例preferreｄ良好premａtｕre tearing ﻩ提前撕裂pｒeｐoｌymer ﻩ預聚合物ﻩpreｐrｅｇﻩ膠片ﻩpre—ｐｒocess(fｒｏｎｔ-end）製前ﻩprｅssﻩ壓床ﻩpｒｅss cycｌe 壓合週期prｉmary current dｉstｒibｕｔion一次電流分佈prｉmary ﻩ主要pｒodｕct lifetｉmes 生命週期ﻩｐroduｃｔprocｅsｓﻩ製程ｐromotｅｒ促進劑ﻩｐrotocal ﻩ初步資料ﻩpｒuｓｓic aciｄﻩ普魯士酸ﻩPTF－baseｄprocess 厚膜糊法ＰＴH(plating thougｈｈole）導通孔ﻩpull awaｙﻩ拉開pumiｃe浮石粉ﻩpumｉce ｓcrub 噴砂清潔法ﻩpyrometallurgy 火燒法冶鍊QC ( qualｉty cｏnｔroｌ)ﻩ品管ﻩQFＰ（ｑｕａd flat pａｃk）ﻩ扁方型封裝體ﻩquaｌiｆicatｉｏn inｓｐｅctioｎﻩ資格審查檢驗qｕalifｉcａｔｉon ｔeｓtinｇ資格檢定ﻩqｕalｉｔyｃlａsｓｉfｉcatiｏnﻩ品質等級qｕantitative計量式測試rack 掛架ﻩｒadioｍetｅrﻩ能量劑rake anｇle 摳耙角ＲAM [Rａndom Access Meｍorｙ隨機存取記憶體real timeﻩ關鍵時刻ｒｅｃｅｓsed trace processﻩ凹槽線路法recovery tank 回收槽rｅductiｏn ﻩ還原re-eniｎforcement 強化rｅfraction折光率reinforcement stｙle 補強材料得型式ﻩrｅgｉｓｔｅr mark 對位用標記ｒegiｓtｒaｔiｏn hole 對位孔ﻩregisｔratioｎｐatternﻩ長方形銅地REJ ( rｅjecｔ) 退貨;拒收ﻩｒejectablｅﻩ拒收rｅleａsｅaｇent 脫模劑ﻩrelief angｌe ﻩ浮離角ｒemaｒk備註ﻩrepair ﻩ修理ﻩresin content ﻩ樹脂含量（膠含量）resin flow 膠流量resｉn ｆｌow peｒcｅntage 樹脂流量之百分率ﻩｒeｓin reｃessｉon樹脂下陷ﻩresiｎｓmear 膠渣ﻩrｅsisｔstｒippers ﻩ剝乾膜劑ﻩresiｓtｏr netwｏrk 排列電阻ﻩreｓoluｔionﻩ解像度ｒｅtｕｒn on asｓeｔｓﻩ資產報酬率reｖeｒｓibilitｙﻩ可逆性ﻩrｅworｋﻩ重工rｏｓiｎ天然松香ﻩrotatinｇcylinderﻩ旋轉圓柱形ﻩroughｔnｅｓs 孔壁粗糙；粗慥ﻩｒｏutｉng ﻩ切外形,成型rｏutinｇbitﻩ銑刀runoｕt 偏轉S/L on hoｌe 孔內沾文字ﻩS/M（soｌder mask ），S／Lﻩ防焊文字Ｓ／M (solder maｓk）防焊ﻩS/M erｒorﻩ防焊種類錯誤ﻩS／M ｏｎｈoleﻩ孔內綠漆salｔspｒａy tｅst 鹽水噴霧試驗ﻩsａmｐling sizｅ抽樣數ﻩscope 範圍ﻩﻩsｃored ﻩ刻痕scorｉnｇ樞槽;刮線ﻩscrａp廢框ﻩscrａtcheｓﻩ刮傷scrｅen ｐrintingﻩ網版印刷sｃum透明殘膜ｓｅaling封孔處理secoｎdaｒy ﻩ次要ｓemi－adｄiｔiｖe半加成法sensitizｅﻩ敏化ﻩsensitizｅrﻩ敏化液ｓeparator 鋼隔板ｓequentｉal laminatｉon 漸成式壓法ﻩｓｅrrated eｄgｅs 毛邊shatter破碎shｏｒｔ短路shuｎｔ分路ｓilａne tｒeatmｅntﻩ矽烷處理silｉｃone couｐling agent 矽烷偶合劑ﻩsiｌｋscreｅｎﻩ文字印刷ﻩsｉmulａｔor模擬器sinｇle axiｓﻩ單軸sizinｇ底片之伸縮補償ﻩskip 漏印skip printｉｎg跳印；漏印sliｖeｒ絲條ｓlotﻩ開槽ﻩｓｌoｔtｉng ﻩ開槽SＭD（surfacｅmouｎt devｉｃe) 表面黏著元件sｍear ﻩ膠渣ﻩSMT（surfaｃｅmount technologｙ）表面黏著技術sodiｕm carｂonate ｍｏnohｙdｒａte 結晶水碳酸鈉ﻩsｏfｔtoｏlｉｎｇ軟性工具ﻩsoｌdeｒ焊錫；錫鉛soｌder bridge ﻩ錫橋ﻩsoldeｒbｕmpﻩ錫突soldｅr ｆｌoat 漂錫solder ｍａｓｋadhesｉｏnﻩ綠漆附著力soｌder ｏnＧ／Fﻩ金手指沾錫ﻩsoｌｄer ｏｎtｒａce ﻩ線路沾錫ﻩsolｄer plug錫塞solｄerｓｉde ﻩ焊錫面ｓolderabiｌitｙ焊錫性solid carｂｉdｅ實質碳化物ﻩspａｃinｇ間距ﻩspacｉng ｎonｅnoｕghﻩ間距不足SPＣ( Ｓtaｔistｉcal Ｐrocess Contｒol) 統計生管ﻩspeciｆicationﻩ規範ﻩspeｃiａl cｏnsｉderaｔionｓﻩ特別考慮sｐin coaｔing ﻩ旋轉塗佈ﻩspｉndleﻩ鑽軸spiｒal cｏｎｔraｃtometerﻩ螺旋收縮儀ｓｐot fａｃe ﻩ銑靶ｓpray cｏatingﻩ噴塗ﻩＳqueegeｅ刮刀ﻩstａckｉng sｔｒucture 疊板結構sｔａmpｉｎg ﻩ沖壓sｔanｄarｄhydｒａulicｌaｍinationﻩ標準液壓法standａrdizｉng標準化ﻩｓtａrvation ﻩ缺膠sｔｅp ｔablｅt ﻩ格片數ｓtocｋｏption 認股選擇權s trａin ﻩ應度ﻩstrｅngｔh 強度ｓｔrｅssmｅｔｅr ﻩ應力計sｕbtractｉveﻩ減除法ﻩsurface conveｘ表面突起ﻩsurfａce examinａtiｏnﻩ表面檢查ﻩsurｆａce insulation resistａncｅ（SIR)ﻩ表面絕緣電阻surfaｃe ｍounｔ表面黏著方式ﻩｓｕrfａｃｅｒoughnesｓ表面粗慥度ｓuｒges ﻩ突波ﻩｓwitch cｉrcuiｔﻩ開關線路tａｂﻩ金手指ﻩtack freｅ不黏ﻩtapeｄhｏlｅgａugｅ錐形孔規tarｇet hoｌｅﻩ靶孔ﻩｔaskｆorce 任務編組ﻩtensile sｔｒengｔh 抗拉強度teｎsiｌｅstrｅss ﻩ張性應力ﻩteｎt浮蓋termsａnd definitions 術語與定義ﻩtｅｒmｉnaｔiｏn loａd 抗匹配負載ﻩteｓt circuit ﻩ測試線路test method試驗方法test ｐｏｉｎtﻩ測試點ﻩthermａl shocｋﻩ熱震盪試驗ｔhｅｒmａl strｅsｓﻩ熱應力試驗ﻩｔhｅrmｉstorﻩ熱電感應式tｈermo cyclingﻩ熱循環試驗tｈeoretiｃal cycle tiｍeﻩ理論性週期時間thickness 厚度ﻩtiｍe ｔo markｅt 上市時機ﻩﻩthickｎeｓs distｒibuｔｉｏnﻩ厚度分佈ﻩtｈiｅf補助陰極thin cｏrｅ薄基板；內層板ﻩthrowing poweｒﻩ分佈力tｏleranｃe ﻩ公差;容差tooｌingｈole ﻩ工具孔ﻩｔoｒｑue ｌｏad 扭力拒之負載tｏtａｌｑｕality prｏｇｒaｍﻩ全面得品質計劃ｔｏugｈness ﻩ堅度tracｅerror ﻩ線路錯誤ﻩtrａcｅｎick &pin holｅﻩ線路缺口及針孔trace peelingﻩ線路剝離ﻩtｒａce pin-ｈoｌｅ線路針孔traｃe surfaｃe rｏｕghness線路表面粗糙tａｒｎiｓh ａnd oxiｄe resisｔ抗污抗氧化劑ｔranｓmiｔtance ﻩ透光度ﻩtrｉｍlinｅ裁切線ﻩtrue levellｉng真平整tｒue positｉon真正位置得孔；真位twｉsｔﻩ板翹tｙpe 種類ﻩumbraﻩ本影ﻩundercｕt 側蝕ﻩｕｎeven ｃｏatiｎgﻩ噴錫厚鍍不平整uｎiversal 萬用型universal ｔensｉle tesｔeｒﻩ萬用拉力試驗機univｅrsａl ｔestｅr ﻩ汎用型測試機ｕpper carriｅr 頂部承載鋼ﻩuptimｅﻩ稼動時間ﻩｖacuuｍｄｅpositiｏｎ真空蒸鍍法ﻩｖacuumｈyｄraulｉc laminaｔion 真空液壓法ﻩvapｏｒizｅr 氣化室V-cut V形槽verticaｌmｉcrｏseｃtionﻩ垂直微切片ﻩvia hoｌe 導通孔viｓible ｉnｖentory有形得庫存vision iｎsｐectionﻩ目視檢查V oid 孔破void in holｅ孔壁上得破洞ﻩvoid in PＴH hｏle孔破waｌkman隨身聽waｒehoｕｓe 倉庫ﻩwaｒp板彎ｗarｐ, wａrpａｇeﻩ板彎ﻩwａter absorｐtionﻩ吸水性wｅaｒｒesistanｃe 耐磨度ｗｅave exｐosure 纖紋顯露ﻩwｅａvｅteｘture ﻩ織紋隱現ﻩｗｅdge anglｅ契尖角ﻩwｅｅｋﻩ週wet ｃhemistry濕式化學製程ﻩwet fｉｌm 濕膜wet ｌaｍinａtiｏn 濕膜壓膜法ﻩweｔｐrｏceｓｓﻩ濕製程ﻩｗetting ﻩ沾錫ﻩweｔtiｎg balaｎｃeﻩ沾錫平衡法ｗickiｎｇ滲銅；滲入；燈蕊效應ﻩwidthﻩ寬度ﻩｗidｔh rｅduce ﻩ線細ﻩwｉdth－ｔo—thicknｅsｓraｔioﻩ寬度與厚度得比值ﻩｗｉndow ﻩ操作範圍ｗorｋ-in-procｅssﻩ在製品ﻩwork oｒder ﻩ工單working ｆiｌm 工作片ﻩworkiｎg mａster ﻩ工作母片ﻩyeaｒ年yellｏw ﻩ金黃色yield 良率glａssy state 玻璃狀態rｕｂbery ｓtate橡膠狀態triaｌ& erroｒ嚐試錯誤ＳOP標準作業程序EDI (Ｅxchange data intｅrfaｃe) 資料交換介面FTP ( ｐrotocol) 檔案傳送協定Web ｓite 網址WAP (ｗirｅles application prｏtocｏl）無線應用協定sｅrieｓconnｅctiｏｎ串聯paｒａllel connecｔion並聯ＮＰI（nｅw Prｏduｃt introductｉon) 新產品導入saｍｐlｅｑｕalｉfiｃatｉon打樣認可iｎdeｐeｎｄｅnt thirｄｐarｔｙａsｓessmｅnt 獨立第三者評鑑ｉnteｒnal aｓsｅssment戶(內部）評鑑end producｔ完工產品rounding ｃonveｎtｉoｎ四捨五入之慣例ｉnsｐｅｃtion ｌｏt 檢驗批taｒgeｔvalue目標值horizoｎtal ｍicrosectｉon 水平切片orｄer of prｅcedence優先順序mａsｔer ｄrawing 主圖ｍaｋｉnｇｉnｋ文字油墨thermal ｐlane 散熱層hole－fill iｎsｕlation maｔeｒial填孔用絕緣物uｎsupportｅd holes 非電鍍通孔hole patｔern accuracy孔位準度dｉelectriｃlaｙｅr thicｋness 介質層厚度ｌifｔｅd lands焊墊浮起ｎａil-ｈeａdiｎg 釘頭Ｐｌaｔｉnｇfolｄs電鍍皺折ｔackｎｅss 沾黏性sample sｉze樣本數ｓaｍｐｌiｎg pｌan 抽樣計劃rejｅcted lotｓ拒收批eｘtｅｒｉｏｒconｔａiners 外箱intｅnｄｅｄusｅ主要用途ｎｏｎ－flow （no-fｌow）非流性etｃhbaｃk (ｗhen speｃifｉed）回蝕（當指定時才做）ａｂrａde 動擦掉；擦傷；磨損ﻩﻩabｒasiｏn 名ﻩ擦破；擦傷;磨滅;剝蝕ﻩaｂriｄgeﻩ動ﻩ縮短；省略；抄錄；縮減;剝奪ﻩabｓorbent 形會吸收得；有吸收力得ﻩabｓｏrｂeｎt coｔtｏnﻩ形脫脂棉ﻩaｂsorｐtionﻩ名ﻩ吸收；專心;合併ﻩﻩabstract 形ﻩ抽象得；理論得；不專心動ﻩ摘錄；抽象；偷；轉移提煉；抽取abuse 動ﻩ濫用;誤用;咒罵;虐待；欺騙ﻩaｃｃeleｒaｔionﻩ名加速[度］；促進accessﻩ名ﻩ接近；接受;會面；捷徑；通路ﻩａｃcesｓorｙ形附屬得；補助得；從犯得ﻩacmoｄatｅ動調節；与解；供應；留;容納aｃcordance 名ﻩ一致;調与ﻩﻩａccoｕnｔ名ﻩ計算；會計；報告;解釋；理由ａccｒeditﻩ動ﻩ相信;認定資格；歸功於、、aｃcumuｌaｔioｎﻩ名累積;堆積ﻩﻩacｃｕrate 形正確得；準確得；精密得ﻩaccuratelyﻩ副ﻩ正確地；精密地acetone 名ﻩ丙酮［揮發性無色液體ﻩachｉeｖe 動ﻩ完成；成就；博得;達到［目得]ﻩacidﻩ形ﻩ酸得;不与悅得；不開心得ﻩａcknｏwledge 動認；承認;自白；感謝aｃknｏwledｇｍｅntﻩ名承認；容許名自白；謝禮；禮物；收帖；收條;感謝aｃoｕstiｃａlﻩ形ﻩ聽覺得；音響學得acryｌｉcﻩ形ﻩ壓克力得;丙烯酸得ﻩaｃｔivatｅﻩ動使活動；催化；淨化;編組ﻩaｃtｉvatｉonﻩ名ﻩ使活動;使催［活］化;活化ａｃtｉvaｔoｒ名使活躍之物;催化劑aｃtiｖｅ形活動[潑]得;勤勉得;主動得;動態acuiｔyﻩ名ﻩ銳敏；激烈;苛刻aｃuｐuｎctｕｒeﻩ名ﻩ針灸；針治ﻩﻩaｃｕte(ａｎgｌe）ﻩ形尖銳得;精明得;激烈得；高音得;（銳角)ﻩadｄed ｖaｌｕe 名附加價值aｄdｅｎdｕｍ名補遺［書得］附冊;附加物additiｖeﻩ形ﻩ該加得;加法得；加法得ﻩﻩﻩ名電池等得]添加劑ﻩaddressﻩ名稱呼；住址；致辭;談吐；請求ﻩﻩ動ﻩ演說；申請;免法官之職；說服;追求ﻩadeｑuaｃyﻩ名ﻩ適當；妥當；足夠ﻩﻩadhｅrｅﻩ動ﻩ黏著;附著；固執；信奉;支持ﻩadherenceﻩ名ﻩ固執;固守；黏著；附著adｈerｅｎtﻩ形ﻩ黏著得;附著於；信奉得ﻩ名ﻩ支持者；伙伴ﻩａdhesionﻩ名黏著；膠著；固執；瘉合ﻩadｊacenｃｙ名鄰接［物;地］；前後節目adｊacｅntﻩ形鄰近得；鄰接得；附近得ﻩadminisｔrateﻩ動管理；支配ﻩａdｍiｎistｒatiｏn 名管理；經營ﻩﻩﻩ名當局；政府；內閣；給與；配藥;遺產[財政]管理ﻩａｄmiｎisｔｒatｉｖｅﻩ形管理行政得ﻩadoptedﻩ形被收養得;被採用得ﻩａｄoption 名採用;收養；過繼;公認aｄvantaｇeﻩ名利益;便利;優勢;優越adverｓｅｌｙﻩ副ﻩ逆地;反對地;不利地advｉsoryﻩ形ﻩ勸告得；建議得；忠告得aesｔhｅｔics 名ﻩ美學ﻩafｆectｅdﻩ形ﻩ受影響得;感染得；感動得afｆiliation 名ﻩ加入;同盟;協力ﻩﻩ名ﻩ私生子父親認定；追溯由來；關係；養父子關係ﻩａffinｉty 名ﻩ姻親;同族關係；親近性ﻩ名遠緣份;嗜好;相處得來得人;親与力affiｒｍﻩ動斷言;確定;肯定；斷定；確認ａffiｘﻩ動ﻩ附加;貼上;簽上;蓋上；使負責ﻩagainstﻩ名ﻩ對,對著;反對；相逆;依；靠ﻩagａrﻩ名海菜;紫菜;石花菜；細菌培養基agｅndaﻩ名會議事項；議事日程；議程ﻩaｇent 名代理者;管理人;代辦人ﻩ名行為者；手下；作因；天然力；官員;推銷員aggloｍeratｉonﻩ名結塊；凝結ﻩﻩaｇｇｒavatinｇ形ﻩ使、、惡化得;可惱得ﻩaｇgregａtｅ動ﻩ聚集；總計;集合；合計得ﻩﻩ名ﻩ集合;集團;集合體;材料aggｒｅsｓiveﻩ形ﻩ侵略得；攻勢得;挑釁得ﻩﻩ形ﻩ氣勢洶洶得；進取［積極］得;精力旺盛得agｉngﻩ形上年紀得;變老得;變舊得;老化agｉtａtion 名攪動;動搖；興奮;煽動ﻩagrｅemeｎtﻩ名ﻩ契約；協議；符合；同意ﻩａｉrｆoｒcｅﻩ名空軍alｃohｏl 名ﻩ酒精;醇；酒；飲酒ﻩalgoｒithm 名ﻩ互除法aｌｉｇn 動ﻩ使成一線;排成一行；排列；合作ﻩalignｍeｎtﻩ名排成直線；整頓；合作ﻩaliquotﻩ形能整除[某數得數］ﻩalkalｉnｅ形鹼屬得；鹼性得ﻩﻩaｌkａliｎity 名ﻩ鹼度ﻩﻩａｌｌｅｖｉatｅﻩ動ﻩ減輕［痛苦］；緩与ﻩalｌocate 動分派；配置;定位置；分配alｌｏw 動ﻩ允許；聽任;給與；斟酌;扣除；想ａllowance 名津貼；零用金；寬限;斟酌ﻩﻩ名扣除；許可;承認；折讓；發津貼；給與定量ﻩalｌoｙﻩ名ﻩ合金；成色;賤金屬；混合物ﻩ動使成合金；減低成色；減少；成合金;攙雜alphａ名希臘字母首字;最初ａlｔer 動改變;改造;改作;閹割;去勢；變ａｌtｅｒation 名ﻩ變更；改造ａｌternateﻩ形ﻩ交互得；間隔得；代理人ﻩﻩ動ﻩ交錯陳列；交替；輪流；交流作用alｔernaｔive 形二中擇一得altitudeﻩ名ﻩ高;高度；海拔高度；高處ﻩａluminum 名鋁［金屬元素] ａmbiｅnt 形包圍得ﻩﻩamｂiguoｕｓ形ﻩ曖昧得;不明確得ﻩambition 名ﻩ雄心；熱望；野心得目標(志) amide 名氨基化合物ﻩａｍmoｎｉａ名ﻩ氨［氣體］；氨水ﻩammoｎｉａcａl 形氨得；氨性得；含氨得ﻩａmperａgｅ名安培數ﻩﻩamｐlitudｅﻩ名ﻩ廣闊;寬；豐富;充足ﻩ名ﻩ振幅;射程；[天體得]出沒方位角ﻩaｎalogﻩ名類似物;相似體;類比ﻩaｎalogｙﻩ名類似;相似;類推ﻩﻩaｎcｈｏrﻩ名ﻩ錨;殿後者;錨紋飾;鑿；急煞車anchoring spur 名ﻩ著力爪ﻩangstromﻩ名ﻩ埃[光得波長單位］ﻩangｕlａｒ形有角［稜]得;尖得;瘦得;笨ﻩaｎｉon 名陰離子ﻩannealﻩ動ﻩ加熱後退火使其韌化;鍛練；(回火);軔化ﻩannｅｘ動附加；追加;併吞；罷佔；侵吞ﻩ名ﻩ加添物；附冊；附件;加建建築;別館ﻩannotaｔe 動註解[書等］;註釋ﻩﻩannual 形ﻩ一年得;每年得；一年生得名一年生植物;年刊書[誌］；年報；年鑑ﻩanｎulａr 形ﻩ環狀得；輪狀得ﻩａnnuliﻩ、、annuｌｕs得複數形ﻩaｎodeﻩ名正極；陽極anoｍaｌｙ名ﻩ不規則;反常;近點離角antimonyﻩ名ﻩ銻[金屬元素］ﻩａpparatｕｓ名［一套］器具；器官;構造ﻩapｐaｒenｔ形顯而易見得;外表上得ﻩaｐｐendiｘ名ﻩ附屬物;附錄；追加;盲腸ａpplｉcablｅﻩ形ﻩ可適用得；能應用得ﻩapplyﻩ動適用;應用;撫;貼;塗;敷；使用appraisａlﻩ名評價；估價;鑑定apｐroａcｈ動接近;近似；向、、交涉；研討ﻩ名ﻩ接近；近似;入口；[研究]門徑；親近；逼近ﻩappropriaｔeﻩ動ﻩ作為專用;挪用ﻩ形ﻩ適當得;特有得;固有得ﻩapｒoｎﻩ名ﻩ圍巾；圍嘴;馬車擋雨得遮腳布ﻩ名法衣；前舞臺；飛機庫前柏油或水泥地;護岸ａqｕeoｕｓ形水得;水般得;水成得ａrchiｖeｓ名公文保管處；擋案；公文ﻩarｉse 動起來;出現；興起；發生；起立;起ａrithmeｔｉc 名算術；算法;計算ａrmy 名ﻩ軍隊；陸軍;大群；團體ﻩﻩﻩaｒoｓe 、、ﻩarise得過去式ﻩaｒray 名打扮；排隊；列舉；召集；軍勢；衣裳ascertａin 動ﻩ確定;稽考;探查ﻩasｐecｔ名ﻩ樣子；光景;容貌;臉相;方向ﻩﻩ名ﻩ方位;面；局面;情勢;[星］視座；相；態ﻩaspｈaltﻩ名ﻩ瀝青；鋪裝用柏油ﻩﻩaｓphaltｉｃﻩ形ﻩ柏油得aｓpｉre 動ﻩ熱望；懷大志;切望；高聳aｓsｅmｂlｙﻩ名ﻩ集會；會合；會議；組合ﻩａｓｓｅssﻩ動ﻩ估定;評價；估價；課稅；徵收asｓｅssｍenｔﻩ名ﻩ估定;評價；課徵；會費ﻩassetｓﻩ名ﻩ財產［可作償債者];資產ﻩﻩassetｓanｄliabiliｔieｓ名資產與負債ﻩaｓsｉｇnmenｔ名ﻩ分配；轉讓;任務ﻩﻩassｉstﻩ動援助；出席；［棒球］補殺ﻩａｓsistaｎceﻩ名援助；幫助ﻩﻩassｉsｔａntﻩ名助手；助理；店員ﻩﻩassociatedﻩ形ﻩ聯合得;關聯得ﻩﻩａsｓume 動採取;承擔；假裝；臆測；擺架子assuｍpｔｉonﻩ名採取；承擔;假定；傲慢ﻩasｙmｍｅtriｃﻩ形不均勻得；不對稱得ﻩatmospheｒｅﻩ名ﻩ大氣;情況；環境;氣氛atomizeｒ名噴霧器；香水噴霧器attaｃhmentﻩ名附著；固著；附著物ﻩ名附屬品；依戀；執著；逮補;拘留ﻩatｔack 動ﻩ攻擊;襲擊；害病；動手ﻩﻩaｔtemptﻩ動嘗試；企圖;窺伺;襲擊;未遂ﻩatｔｅndaｎtﻩ形ﻩ跟隨得；出席得；伴隨得名陪從；隨員；伴隨物；從業者;管理員；加油站得站員attenuａte 動使變稀薄;使變細；弄淡ａｔｔenuatiｏｎ名［使］變薄；稀薄化attestatiｏｎ名ﻩ證據;證言；證明ﻩﻩatｔｉtｕde 名姿勢；身段；態度;心意ﻩaｔｔributｅﻩ動歸因；認為就是、、得緣故ﻩ名ﻩ屬性；特質；附屬物;象徵;形容詞;屬性ﻩatｔributioｎﻩ名ﻩ歸屬;歸因;屬性ａttribｕtive 形ﻩ屬性得；形容得;修飾語ﻩauｄiｅｎceﻩ名聽眾；觀眾;收聽者；收瞧者ﻩﻩauｄｉt 名審計;審核;查帳；決算；旁聽ﻩａurum 名ﻩ金［金屬元素] ﻩﻩauｔhorizatiｏn 名ﻩ授權；委任；認可auｔｏclａveﻩ名快鍋之一種ﻩﻩﻩａuxiｌiａry 形ﻩ補助得;副得；預備得名幫助者;補助物;外國補助部隊;補助艦；助動avenueﻩ名ﻩ林蔭路;林蔭道；大路;門徑ﻩａｗareﻩ形知道；曉得；注意到awａｒenｅsｓﻩ名知道；曉得;注意ﻩﻩａxial 形ﻩ軸得；成軸得；軸周圍得ﻩﻩbacｋlighｔﻩ名背光; ﻩbacｋup名支援;滯銷貨；阻塞；背板;備份ｂackwaｒｄ副ﻩ向後;相反；以前ﻩ形ﻩ向後；落後；怕羞得bagｇyﻩ形袋狀得;寬鬆而下垂得ﻩﻩbａlaｎce 動ﻩ秤;抵消；均衡;躊躇ﻩﻩ名ﻩ秤;對稱；比較；剩餘;（可指尾數板）balaｎce due 名ﻩ不足額ﻩﻩbaｌance ｉn hａnd 名餘款ﻩﻩbarﻩ名染;妨害;禁止;反對;除、、之外ﻩ名ﻩ棒;閂;線條;法院；節線bar coｄe 名條碼ﻩﻩbaｒometrｉcﻩ形氣壓[計］得barrel 名ﻩ桶；槍身；選舉費用ﻩbasket 形ﻩ籃製得;自備得野餐ﻩ名籃簍；一籃；籃形得東西ｂat 名ﻩ球棒；打手；片;棉絮；蝙蝠ﻩﻩ動速寫;充分討論;輪到打擊ﻩbａtｃh 名一爐[麵包等]；一組ﻩbａtｈ名沐浴;溫泉地;浸漬用水ﻩbattery 名ﻩ毆打；電池;投捕手ﻩﻩＢaｕme sｃalｅ名ﻩ波美(比重計）beaｋer 名有倒口得燒杯;大杯ﻩbeaｍ動放射；閃亮;微笑；廣播ﻩﻩ名ﻩ樑;船幅；秤桿；槓杆;光線ﻩﻩｂeｈaｖiｏｒ名規矩;品行;作用ﻩﻩ belｌoｗ(s）動怒吼；咆哮;呼嘯；（風箱（名) bendﻩ動彎;拉;使屈服;傾心ﻩﻩﻩｂeｎeaｔhﻩ副ﻩ在、、之下；比、、差beneｆｉｃiａry 形享受俸祿；臣服得名ﻩ受益人；公費生ﻩbenefｉtﻩ動ﻩ有益;享受利益；受益ﻩﻩ名利益;恩惠;義演；給付ｂｅveｌﻩ名ﻩ斜角;傾斜；斜面；斜角規ﻩﻩ動ﻩ截成斜角;斜切ﻩﻩbiasﻩ動使存偏見；使偏袒；斜得；交叉得ﻩbiasﻩ名斜線;成見;傾向;歪斜；偏見ﻩｂｉfｕrcateﻩ動ﻩ分［成］叉ﻩﻩbiｌaterａlﻩ形兩邊;有兩面得ﻩbinａｒｙ名二要素合成物；雙子星ﻩﻩ形ﻩ兩要素得；二進位得；二元得ﻩﻩbindeｒ名ﻩ裝訂人；使固定得東西;黏結劑ﻩbｉpolａr 形ﻩ有兩極得；雙極得ﻩｂlａdeﻩ名葉；刃；劍術家;扁平；翼ﻩﻩ名ﻩ蕩子;女子；舌得前端ｂlanｋ形ﻩ空白得;單調得;完全得；無效得名空虛；鑰匙；空包彈;標準桿孔規bleedﻩ名ﻩ切印刷部份得頁次ﻩ動ﻩ流血；流出樹液;取血；搾ﻩbｌeｅderﻩ名ﻩ易出血或不止得人ﻩbｌend 名ﻩ混合;混合物；混成語；溶合ﻩbｌeｎdｅrﻩ名ﻩ混合;混合器；攪拌器;果菜榨汁機bｌｉndﻩ動使失去判斷;隱蔽ﻩ形ﻩ瞎得;魯莽得;不完全得;遮眼物;欺瞞ﻩｂlip 名ﻩ雷達映出得影像ﻩﻩblisterﻩ名ﻩ水泡;發泡膏;槍座；使煩惱bloｂ名ﻩ滴;小斑點;零分;濺ﻩﻩb lockﻩ名ﻩ石頭；切肉板；滑車；妨礙；佔地方;一區ｂloｔ名ﻩ污痕;棋子;弱點ﻩﻩﻩ動ﻩ抹髒；塗掉；吸乾；遮蓋ﻩblottingﻩ名乾印（印刷洗紙) ﻩbｌuntﻩ動ﻩ弄鈍;減弱；變鈍ﻩﻩﻩ名短粗得針；現金;鈍得；粗魯；生硬；率直得ｂlur 名ﻩ污髒;矇矓；不清楚；污名ﻩ動ﻩ弄髒;使模糊;朦矓ﻩbｌurrﻩ動ﻩ弄髒；使模糊；朦矓ﻩblurry 形ﻩ模糊得;不清楚得；污斑ﻩｂlｕsh 名ﻩ面赤；紅;赤色；一瞥ﻩ動ﻩ害羞；臉紅;弄紅;使面紅boltﻩ名ﻩ挺直;跑開；脫黨；細瞧ﻩ名箭頭；電光；拒絕;螺釘bｏmbﻩ動ﻩ丟炸彈；轟炸ﻩ名炸彈；手榴彈；突發事件ｂonｄﻩ名ﻩ結合；契約；證券;保證人形ﻩ黏土得；被囚禁得ﻩbooｋｌeｔ名小冊子;印刷品ﻩboｏstﻩ動由後推;推上；援助;聲援ｂｏot 動ﻩ用靴踢;使穿長靴;電腦開機；起動ﻩ名ﻩ靴;放行李處；刑具;利益ﻩｂoｒｄｅｒlinｅ名邊界[上得］ﻩﻩﻩﻩbouｎdﻩ名境界[線]；領域;邊際ﻩ動跳;使彈回;ｂind得過去ﻩ形ﻩ被縛得；裝訂得;決意得ﻩbowﻩ名弓;彎曲；蝴蝶結；槳動鞠躬;屈服；嚮導;使屈服ﻩbｒanchﻩ名枝；分枝;支線;分部bｒand 動打烙印；予以深刻印象ﻩ名ﻩ品種；商標；烙印;污名ﻩbrasｓ名厚臉皮；高級軍官；黃銅[製品]break 動ﻩ弄傷;違背；斷；使破產；損壞；闖入名ﻩ破曉；跑出;阻斷；小憩ｂreａｋ-ａwayﻩ名ﻩ折斷邊ﻩbrｅakdoｗn 名ﻩ故障；挫折；分類；分析ﻩ名ﻩ崩潰；倒塌；破損ｂreaｋer 名ﻩ碎波；破碎者;切斷機ﻩﻩ名ﻩ馴馬師;［飲料用］水桶ﻩbreakｏｖｅr 名崩潰ﻩﻩbreathﻩ名ﻩ氣息；呼吸;低語;微吹ﻩｂriｇhtenﻩ動使輝煌；使快活;使聰ｂrｉghtener 名ﻩ光澤劑ｂrｉstle 名ﻩ剛毛；豬鬃ﻩﻩ動使豎立毛髮;發怒ﻩﻩﻩﻩﻩｂｒoaｄly 副寬廣地；明白地;無禮brittｌeﻩ形ﻩ易碎得；短暫得ﻩbromide 名溴化物ﻩﻩﻩbｒonze 名ﻩ青銅[色;製品］；古銅ｂroｗseﻩ動ﻩ吃嫩葉；放牧；瀏覽名ﻩ嫩葉；嫩芽；嫩枝ﻩbruｓｈ名小衝突；叢林灌木地帶ﻩ名ﻩ刷；筆;筆法；狐尾;拂拭buｂblｅﻩ名泡;泡沫；詐欺ﻩｂuckleﻩ動ﻩ扣住;彎曲；起皺;扣緊ﻩ名ﻩ釦子；彎曲;皺ﻩﻩbudﻩ名芽；花蕾；未發育得；少女；開始發育ﻩbuｆferﻩ名ﻩ緩衝器；減弱衝突得人ｂｕg 名ﻩ毛病；故障；缺點;錯誤ﻩ名半翅類得蟲；病菌；蟲ﻩ動ﻩ裝置防盜鈴［秘密擴音器] bｕｌｇe 名脹；腰；凸出部份;優越ﻩﻩbuｌｌ名ﻩ公牛；金牛座;買空者ﻩ名ﻩ警察；吹牛;靶心；傻事ﻩﻩbumpﻩ名ﻩ碰撞聲音;腫塊;搖;撲通ﻩﻩ動衝撞；碰；交替；免職；顛簸buｏyaｎcyﻩ名輕快;樂觀;浮力ﻩbｕｒeau 名衣屜櫃[大桌］;辦公室ﻩburet 名ﻩ滴管;玻璃量管bｕrn 動ﻩ燒；灼傷；銘感；腐蝕;焦慮ﻩbｕrｎer 名燈口;燒火得;燃燒器ﻩﻩﻩﻩﻩ動ﻩ磨;光;光亮;發光ﻩﻩｂuｒｎishﻩ名ﻩ光輝;光澤ﻩbｕrｎｏutﻩ名燃料燒盡；燒壞ﻩｂｕrrﻩ名光圈；隆隆聲;喉音；鑽孔器；磨刀石buryﻩ動埋葬；葬禮；埋藏;掩蔽ﻩﻩﻩbussｅｓﻩ、、buｓ得複數ﻩbypassﻩ名旁管；迂迴路；忽視;旁路cａbinet 名ﻩ小櫃櫥；會議室;內閣ﻩｃaｌｃiｕm 名ﻩ鈣［金屬元素］ﻩﻩcalculａtｅ動計算；預測；指望ﻩﻩcalibratｉｏnﻩ名ﻩ口徑測定；查刻度ﻩﻩcaliｐｅrs 名測徑器ﻩcａlorimｅtrｙ名ﻩ熱量測定ﻩﻩﻩcam 名ﻩ凸輪ﻩﻩcaｍberﻩ名上彎形［道路];弧形ﻩﻩcancellatｉonﻩ名抹消;取消；解除ﻩcannｉｓｔerﻩ名罐；茶筒；濾毒罐ﻩcant 名哀訴聲;偽善得口吻；黑話;隱語ﻩ名ﻩ口號；時髦話；傾斜；斜角；一堆；一滾ﻩcap 名無邊帽;頭巾;選手；鞘；套;柱頭；雷管名最高部；修過得輪胎得輪底;臨時參加費ｃaｐaｂｌe 形ﻩ有能力得；可以、、得ﻩcaｐacitａncｅ名ﻩ[傳導體得］容量ｃaｐilｌaｒｙ形毛得；毛細管ﻩﻩcaｐｉｔal 形ﻩ首位得;主要得；根本得形優秀得；罪大惡極得；致命得;嚴重得；上好得ﻩcａpiｔal 名ﻩ首都；大寫；資本;本錢；柱頭cａptｉveﻩ名ﻩ俘虜；迷戀;被囚得；專有得ﻩcaptｕｒeﻩ名ﻩ捕獲；被捕獲者ﻩcａｒbidｅ名ﻩ碳化物;碳化鈣carboｎateﻩ動ﻩ使成碳酸鹽；碳化ｃarrｉagｅ名ﻩ車；搬運；姿勢；風度carrierﻩ名運送人；信差；搬運器名ﻩ帶菌者;航空母艦；介質；載波；貨架ﻩcasｈ名錢；現金；小額貨幣cash 動兌現；付現款ﻩﻩcashfｌoｗﻩ名現金流量ﻩcａtalystﻩ名觸媒劑ﻩcaｔegoryﻩ名ﻩ種類；部屬；類目ﻩｃａteｒｐiｌlar 名ﻩ毛蟲;履帶車輛ﻩcａｔhｏde 名陰極ﻩcationﻩ名ﻩ陽離子；陰向游子ﻩｃaul （plaｔe)ﻩ名網膜；羊膜囊;髮網;(隔板）ﻩcauｔiｏnﻩ名ﻩ小心;警戒；警告；擔保；吃驚ﻩcaｕtiousｌy 副謹慎地；小心地ﻩﻩcavitａｔion 名ﻩ［螺旋槳後得］渦捲；半真空；空泡化ﻩcavｉty 名空穴；空窩；腔；蛀牙洞ＣCDﻩ名電眼ceasｅﻩ動ﻩ終止;停頓;停止ｃell 名小室；密室；茅舍；小屋;墓；滲透者名ﻩ囊；蜂窩；窩;細胞;電池ﻩceｌlophaｎe 名ﻩ玻璃紙ﻩﻩcｅlｌuｌar 形細胞得;劃分得ﻩﻩcｅｌｌｕlａr ｐhone 名大哥大行動電話celluloseﻩ名ﻩ纖維素Celsius 名(度）C （＊)ﻩﻩﻩcenｔｒiｆugaｌﻩ形ﻩ離心得;離心力得cｅntrｉｆuｇeﻩ名ﻩ離心分離機ﻩｃentrｉpetaｌﻩ形向心（性）得ｃeramiｃsﻩ名ﻩ窯業;製陶業;陶器ﻩceｒtｉｆicatiｏn 名ﻩ證明；檢定ﻩｃertifiedﻩ形被證明得；有保證得ｃhalk 動用粉筆記;白粉擦;記錄ﻩﻩ名ﻩ粉筆;白粉；記帳出售;眾所珍愛得馬ﻩcｈallengｅﻩ名挑戰；難題；盤問ﻩｃhamberﻩ名ﻩ室；會議場;便壺;窩ﻩ動作房間用;關在室內;上膛ｃｈamferﻩ動去角；取面;挖槽ﻩﻩ名角材去了角得]面；槽ﻩchannｅlﻩ名水路;媒介;手段；頻道ﻩcｈant 動ﻩ吟唱；單調得說話；稱讚ｃｈａｎｔﻩ名歌；讚美詩；單調得語調ﻩﻩﻩchａraｃteristｉc 形ﻩ有特色得ﻩﻩﻩ名ﻩ特徵;指標；標數;特色ｃhartﻩ名畫圖;圖解；海圖;航海圖ﻩchase 動追；挖溝;跑步；拼命；浮彫;打花紋；(網框)ｃheｃkﻩ動ﻩ檢查；阻止；申斥;忽停；開支票;牽制（棒球)名制止物;挫折；號牌;試驗；帳單;支票；裂縫ﻩ、、語氣]對!好！行！可以!［下棋]將軍！ﻩﻩｃhｅck inﻩ、、ﻩ（到旅館登記）住宿ﻩcｈeck ｌiｓt 、、ﻩ核對名冊cｈｅck outﻩ、、ﻩ(結帳後離開)離開ｃhecｋup 、、核對；檢查ｃｈｅck－oｆf 、、ﻩ查訖；扣除（從薪水扣工會會費等）ｃhｉlｌ名冷;掃興;失意chipﻩ動ﻩ切；削;破碎；缺損（晶片) ﻩ名片；瑕疵；籌碼；航程測板；瑣碎物;炸馬鈴薯片ﻩｃｈipｐ動切；削；破碎;缺損ﻩcｈisel 名鑿子；鑿刀［雕刻用]ﻩﻩcｈｌｏrｉｄｅ名ﻩ氯化物；漂白粉;消毒ﻩchlｏrｉｎatｅﻩ動ﻩ使氯作用;氯消毒choｓen 形ﻩ被選得；精選得;純良得ﻩ、、ﻩ得過去分詞ﻩﻩcｈromate 名鉻酸鹽ﻩﻩﻩchｒomium 名鉻［金屬元素]chｕnｋﻩ名厚得;矮胖得；多量;多數ciｒcuｉtｒyﻩ名電氣回路［部分］ﻩﻩcirｃｕｍfereｎceﻩ名圓周；周圍ciｒｃumferential 形周圍;婉曲ﻩcircumstanceﻩ名事情;狀況；環境名ﻩ事實;儀式；隆重;境遇;家道；詳情ｃlaｉmﻩ名ﻩ要求;索賠；主張;資格ﻩclamp 動ﻩ夾住；勒住；束住clariｆyﻩ動澄清;淨化；闡明clasｈ動衝突,抵觸ｃｌａuｓeﻩ名條項;條款;子句;短句ﻩclay 名黏土;泥土；人體;肉體；人clｅａranｃe 名清除；開拓；出港證;餘隙;餘環ｃlientﻩ名ﻩ委託人;顧客；平民;侍從clｉmaｔic 形ﻩ氣候得；風土得;氣候得ﻩ clinch 動敲彎;使釘牢；解決；扭住;擁抱cｌingingﻩ形ﻩ執著得；有黏性得ﻩclip 動ﻩ剪短;削下；省掉；作不合理要求；挾動剪報；迅速行動;修剪；紙夾ﻩclogﻩ名阻礙；故障；墜子；木底鞋；木屐ﻩcloｇgﻩ動妨礙；阻塞；跳clｏｓe—uｐﻩ名(電影照相之）特寫；近距離攝影cｌｏsure 名截止;關閉;停業；終止;圍牆cloth 名布;織品;衣料；衣服；牧師；帆布ﻩclumｐ名ﻩ叢;藪；加得厚鞋底；塊;細菌塊ﻩclｕmsy 形笨拙、不好瞧得;粗陋、粗俗得clｕsteｒ名串;掛;團；叢coaleｓcｅncｅ名接合；結合；合併ﻩﻩｃｏaｒseﻩ形ﻩ粗糙、粗粒、粗鄙、下賤、猥褻得coａxialﻩ形同軸得；共軸得ﻩﻩcoｂaｌtﻩ名ﻩ鈷[金屬元素]ﻩｃｏｄe 名ﻩ法典;規則；法律；暗號；禮節；信號ﻩcoｅｆfｉcｉｅntﻩ形ﻩ共同作用得；係數ﻩcｏeffｉcient ｏf ｔhermａｌexｐansion 、、（CTE) 熱澎脹系數coｇnｉzａntﻩ形ﻩ已認識；曉得；審理得ﻩｃｏgnizｅ動認知;認識ﻩcoｈｅsｉveﻩ形有黏著力得；有附著性得ﻩcoil 動捲;盤繞;盤；捲成一圈；捲線；螺管ﻩcｏincide 動ﻩ與、、一致;符合ﻩﻩｃoiｎcｉdenceﻩ名一致;符合；巧合ﻩcoincident 形一致、符合得ﻩcｏllapse 動ﻩ倒塌;崩潰;衰弱;頹喪ﻩﻩｃolｌａtｅ動對照;校對；整理;檢點；授職ｃolｌｅcｔﻩ動ﻩ收集；使鎮定;聚集;收款ﻩcｏllｅｃｔionﻩ名ﻩ蒐集;採集；團;蒐集品名ﻩ珍藏；收款；徵稅;募捐；積聚；學期考試ﻩcollｅｃtive 形集合、聚集、共同得ﻩcｏlｌectｉvelyﻩ副ﻩ集體地;共同地ﻩcollｅｇe 名大學;學舍；專科大學;團體ﻩｃollｅt 名ﻩ戒指上得寶石座；筒夾;夾頭ｃollimatｅ(lighｔ)ﻩ動照準；瞄準;使成平行；（平行光) ﻩcｏｌlｉmａtｏr 名瞄準儀ﻩﻩﻩcolｌoidａlﻩ形膠體;膠質;膠狀cｏlonyﻩ名ﻩ殖民［地］;僑民；僑居地；群落ﻩｃolumｎarﻩ形ﻩ圓柱[狀]得;圓筒形得ﻩbﻩ名ﻩ梳子;梳狀物;雞冠;蜂窠；梳理;起浪ﻩﻩ。
外贸外语辅导：PCB专业用语综合词汇
1、印制电路：printed circuit 2、印制线路：printed wiring 3、印制板：printed board 4、印制板电路：printed circuit board (pcb) 5、印制线路板：printed wiring board(pwb) 6、印制元件：printed component 7、印制接点：printed contact 8、印制板装配：printed board assembly 9、板：board 10、单⾯印制板：single-sided printed board(ssb) 11、双⾯印制板：double-sided printed board(dsb) 12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单⾯印制板：rigid single-sided printed borad 17、刚性双⾯印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单⾯印制板：flexible single-sided printed board 22、挠性双⾯印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (fpc) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex printed board 26、刚性双⾯印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、⾦属芯印制板：metal core printed board 30、⾦属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated multilayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board 40、积层多层印制板：build-up mulitlayer printed board (bum) 41、积层挠印制板：build-up flexible printed board 42、表⾯层合电路板：surface laminar circuit (slc) 43、埋⼊凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs) 45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯⽚板：chip on board (cob) 47、埋电阻板：buried resistance board 48、母板：mother board49、⼦板：daughter board 50、背板：backplane 51、 *板：bare board 52、键盘板夹⼼板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (ffc) 58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板⾯：real estate 73、导线⾯：conductor side 74、元件⾯：component side 75、焊接⾯：solder side 76、印制：printing 77、格：grid 78、图形：pattern 79、导电图形：conductive pattern 80、⾮导电图形：non-conductive pattern 81、字符：legend 82、标志：mark。
PCB专业术语
BondFilm/BrownOxide
棕化
I/L
InnerLayer
内层线路
O/L
OuterLayer
外层线路
S/M
SolderMask
防焊
P/P
PatternPlating
图形电镀
LCD
LiquidCrystalDisplay
液晶显视器
2ndE
SecondExposure
二次曝光
NC
NumericallyControlled
导通孔（小于20mil）
PlugHole
堵孔
AnnularRing
.孔环
Slothole
槽孔
Traveler
流程单
BuyOff
抽检
Develop
显影
Legend
文字
&
GoldPotassiumCyanide
金盐
Routing
铣切
Silver
银
英文
中文
Gold
金
OSP(OrganicSolderabilityPreservative)
银胶贯孔
TGA
ThermoGravimetricAnalysis
热重量剖析法
RH
RelativeHumidity
相对湿度
三.PCB一般用语
英文
中文
Marking
标志
Void
空洞
FiducialPad
基准焊垫
Package
包装
Shipping
货运
Warpage/BowandTwist
板弯板翘
ViaHole
EngineeringDateSheet
PCB专业术语总结（大全五篇）
PCB专业术语总结（大全五篇）第一篇：PCB专业术语总结AAcceleration 速化反应（台）加速反应Accelerator 加速剂，速化剂（台）促进剂，催化剂Acceptable Quality Level（AQL）允收品质水准（台）合格质量水平Access hole 露出孔，穿露孔（台）余隙孔 Accuracy 准确度（台）精确度 Acid Dip 浸酸（台）弱酸蚀Acrylic（resin）压克力（台）丙烯酸（树脂）Active Parts 主动零件（台）有源器件Anisotropic Conductive Film（Adhesive）单向导接着膜（台）单向导电膜 Anneal 韧化（台）退火Any Layer Interstitial Via Hole（ALIVH）阿力制程（台）全层内部导通孔（工艺），任意层内部通孔（工艺）Area Array Package 面积格列封装（台）面阵列封装BBall Grid Array 球脚阵列（台）球栅阵列Bandability 可弯曲性（台）可挠性Bandwidth 频带宽度，频宽（台）带宽Banking Agent 护岸剂（台）护堤剂 Bare Board 空板，未装板（台）裸板Bare Chip Assembly 裸体芯片组装（台）裸芯片安装 Basic Grid 基本方格（台）基本网络 Blanking 行空断开（台）落料 Bleeding 渗流（台）渗出Block Diagram 电路系统整合图（台）方块框图Blotting 干印（台）吸墨 Blow Hole 吹孔（台）气孔Bond Strength 结合强度，固着强度（台）粘合强度 Bondability 结合性，固着性（台）粘合性Bonding Sheet（Ply，Layer）接合片，接着层（台）粘结片Bonding Wire 结合线（台）键合线 Brazing 硬焊（台）钎焊Breakaway Panel 可断开板（台）可断拼板Breakdown Voltage 崩溃电压（台）击穿电压 Bright Dip 光泽浸渍处理（台）浸亮Buildup Multiayer（BUM）增层法多层板（台）积层法多层板 Burr 毛头（台）毛剌Bus Bar 汇电杆（台）汇流排CCap Laminaton 帽式压合法（台）覆盖层压法Cavity Down / Cavity Up 方凹区朝下/方凹区朝上（台）空腔区朝下/空腔区朝上Cell Phone 行动电话（台）移动电话Chase 网框（台）网框Chemical Resistance 抗化性，耐化性（台）耐化学性 Chip 芯片，晶粒，片状（台）芯片Chip on Board（COB）晶板接装法（台）载芯片板Chip Scale Package 芯片级封装（台）芯片级安装Circumferential Separation 环状断孔（台）环开断裂 Clad / Cladding 披覆（台）覆箔Clinched Lead Terminal 紧箱式引脚（台）折弯引脚Clok Frequency 时脉速率（台）时钟频率Coaxial Cable 同轴缆线（台）同轴电缆 Cold Solder Joint 冷焊点（台）虚焊点Comparative Tracking Index 比较性漏电指数（台）相比起痕指数 Complex Ion 错离子（台）络离子 Component Hole 零件孔（台）组件孔 Component Side 组件面（台）组件面Condensation Soldering 凝热焊接，液化放热焊接（台）冷凝焊接Conductive Anodic Filament 玻纤纱式漏电（台）阳极性玻纤丝的漏电Conductor Spacing 导体间距（台）导线间距Core（Board）核心板，核板（台）芯板Core Material 内层板材，核材（台）内层芯材 Corner Crack 通孔断角（台）拐角裂缝 Corner Mark 板角标记（台）拐角标记Counterboring 垂直向下扩孔，埋头孔（台）沉头孔Countersinking 锥型扩孔，喇叭孔（台）锥形孔CouplingAgent 耦合剂（台）偶联剂Coupon，Test Coupon 板边试样（台）附连测试板 Coverlayer，Coverlay 表护层（台）覆盖层Crease 皱折（台）折痕Creep 潜变（台）蠕变Crosshatching 十字交叉区（台）开窗口Crossover 越交，搭交（台）跨交 Crosstalk 杂讯，串讯（台）串扰 Cure 硬化，熟化（台）固化，硫化Current、Carrying Capability 载流能力（台）载流量Curtain Coating 濂涂法（台）帘幕法DDaisy Chaining 菊花瓣连垫（台）串推 Deburring 去毛头（台）去毛剌Definition 边缘逼真度（台）清晰度Denier 丹尼尔（台）坦尼尔 Dent 凹陷（台）凹坑Deposition 沉积，附积（台）沉积 Desmearing 除胶渣（台）去钻污 Dewetting 缩锡（台）半润湿 Diazo Film 偶氮棕片（台）重氮底片 Dicing 芯片分割（台）切片Die Attach 晶粒安装（台）管芯安装 Die Bonding 晶料接着（台）管芯键合 Dielectric Breakdown 介质崩溃（台）介质击穿Dielectrie Breakdown Voltage 介质崩溃电压（台）介质击穿电压 Dielectric Constant，Dk or εr 介质常数（台）介电常数Differential Scanning Calorimetry（DSC）微差扫瞄热卡分析法（台）示扫描量热法 Dimensional Stability 尺度安定性（台）尺寸稳定性Direct / Indirect Stencil 直间版膜（台）直接/间接法网版Discrete Component 散装零件（台）离散组件Disspation Factor （Df）散失因素（台）损耗因素 Drill Facet 钻尖切削面（台）钻尖切削面 Dual Wave Soldering 双波焊接（台）双波峰焊 Dynamic Flex （FPC）动态软板（台）动态挠性板Dynamic Mechanical Analysis（DMA）动态热机分析法（台）动态力学分析法，热机械分析法EEddy Current 涡电流（台）涡流Edge-Board Connector 板边（金手指）承接器（台）板边连接器Edge-Board Contact 板边金手指（台）板边插头Edge Spacing 板边空地，边宽（台）边距 EDTA 乙 = 胺四醋酸（台）乙 = 胺四乙酸Electric Strength（耐）电性强度（台）电气强度Electrophoresis 电泳动，电渗，电子构装（台）电泳Etchback 回蚀（台）凹蚀阴影Etch Factor 蚀刻因子，蚀刻函数（台）蚀刻系数Etching Indicator 蚀刻指标（台）蚀刻指示图 Etching Resist 抗蚀阻剂（台）抗蚀刻 Eutetic Composition 共融组成（台）共晶组成 Excimer Lesar 准分子雷射（台）准分子激光FFace Bonding 晶面朝下之结合（台）倒芯片键合Fatingue Strength 抗疲劳强度（台）疲劳强度 Fibet Exposure 玻织显露（台）露纤维Fiducial Mark 基准记号，光学靶标（台）基准标记Film Adhesive 接着膜，粘合膜（台）粘结膜Fine pitch 密脚距，密线距，密垫距（台）精细节距GGate Array 闸机阵列，闸列（台）门阵列Gel Time 胶性时间（台）胶化时间，凝胶时间Gelation Particle 胶凝点（台）凝胶点Ghost Image 阴影（台）重影Glass Transition Temperature，Tg 玻璃态转化温度（台）玻璃化温度，玻璃态转变温度 Grid 标准格（台）网格Grid Wing Lead（台）契形引线（脚）HHalation 环晕（台）晕环 Hay Wire 跳线（台）附加线Holding Time 停置时间（台）停留时间 Hole Breakout 孔位破出（台）破坏 Hole Density 孔数密度（台）孔密度Hole Pull Strength 孔壁抗拉强度（台）孔拉脱强度Hole Void 破洞（台）孔壁空洞Hole Air Soldrt Levelling（HASL）喷锡（台）热风整平Hull Cell 哈尔槽（台）霍尔槽IIcicle 锡尖（台）焊料毛剌Imaging 成像处理（台）成像Imperegnate 含浸（台）浸渍Information Appliance（IA）资讯家电（台）信息家电Integrated Circuit（IC）积体电路器（台）集成电路Interface 接口（台）界面JJ调解器 Module 模组（台）模件、组件、模块Moisture and Insulation Resistance T est 湿气与绝缘电阻试验（MIR）（台）潮热绝缘电阻试验Monting Hole 组装孔，机装孔（台）安装孔NNumerically Controlled（N.C.）数值控制（台）数控 Negative 复片，钻尖第一面外缘变窄（台）负像NegativeMethyl Pyrrolidone（NMP）N甲基吡咯烷酮 Nodule 瘤（台）结瘤Noise Budget 杂讯上限（台）最大杂音，最大噪声Nominal Cured Thickness 标示厚度（台）标称厚度 NonContact 架空（台）非接触（印刷）Offset 第一面大小不均（台）钻面不匀Outer Lead Bond（OLB）外引脚结合（台）外部引线粘接Oligomer 寡聚物（台）低聚物 Outgassing 出气，吹气（台）逸气Outgrowth 悬出，横出，侧出（台）镀层情况 Overhang 总浮空（台）镀层突出Overpotential 过电位，过电压（台）趋电势PPanel Plating 全板镀铜（台）整板电镀Passive Device（Component）被动组件（零件）（台）无源组件 Pattern Plating 线路电镀（台）图形电镀 Patten Process 线路电镀法（台）图形电镀法Peel Strength 抗撕强度（台）剥离强度Permittivity 容电率（台）电容率，介电常数Phototinitator 感光启始剂（台）光敏剂 Pin 接脚，插梢，插针（台）管脚Pin Grid Array（PGA）针脚格列封装体（台）针栅阵列 Pitch 跨距，脚距，垫距，线距，中距（台）节距 Pits 凹点（台）麻点 Plasma 电浆（台）等离子PlasticLem）多层板压合（台）多层板压制Relative Permitivity （εr）相对容电率（台）相比介电常数Resin Coated Copper Foil 背胶铜箔（台）涂树脂铜箔，附树脂铜箔Resin Flow 胶流量，树脂流量（台）树脂流动度Resin Recession 树脂缩陷（台）树脂凹缩Resin Rich Area 树脂丰富区，多胶区（台）树脂钻污Resin Starved Area 树脂缺乏区，缺胶区（台）缺胶区Resist 阻剂，阻膜（台）抗蚀剂Resolution 解像，解像变，解析度（台）分辨率 Reverse Image 负片影像（阻剂）（台）负图像Rigid-Flex Printed Board 硬软合板（台）刚挠印制板 Ring 套环（台）钻套Ripple 纹波（台）波动，脉动Roller Coating 滚筒涂布法、辊轮涂布法（台）辊涂式SScratch 刮痕（台）划痕Secondary Side 第二面（台）辅面Self-Alignment 自我回正（台）自定位Shadowing 阴影，回蚀死角（台）凹蚀阴影Shear Strength 抗剪（力）强度（台）剪切强度Silver Fhrough Hole（STH）银胶通孔，银胶贯孔（台）银浆通孔，银浆贯孔Single-Inline Package（SIP）单边插脚封装体（台）单列直插式封装 Solder Connection 焊接点（台）焊点 Solder Paste 锡膏（台）焊膏Solder Plug 锡塞，锡柱（台）焊料堵塞Solder Spread Teat 散锡试验（台）焊料扩展试验Solder Webbing 锡网（台）网状残锡 Soldering 软焊，焊接（台）软钎焊，焊接 Solid Content 固体含量，固形份，固形物Solubility Product 溶解度乘积，溶解度积（台）容度积 Splay 斜钻孔（台）斜孔Spray Coating 喷着涂装，喷射涂装（台）喷涂 Stencil 片膜（台）漏板，模版 Stringing 拖尾，牵丝（台）带状线 Stripper 剥除液，剥除器（台）剥离液Supported Hole（金属）支助通孔（台）支撑孔Surface Mounting Technology 表面贴装技术（台）表面安装技术 Surge 突流、突压（台）波动Swaged Lead 压扁式引脚（台）挤压引线 Syringe 挤浆法，挤膏法，注浆法（台）注射法TTab 接点，金手指（台）印制插头 Telegraphing 浮印，隐印（台）露印 Template 模板（台）靠模板Tensile Strength 抗拉强度（台）拉伸强度，抗拉强度Terminal 端子（台）端接（点）Thermal Conductivity 导热率（台）热导率 Thermal Shock Test 热震荡试验（台）热冲击试验Thermogravimetric Analysis（TGA）热重分析法（台）热解重量分析法Thermosonic Bonding 热超音波结合（台）热声连（焊）接 Thermount 聚醯胺短织席材（台）聚酰胺纤维无纺布Thin Small Outline Packange（TSOP）薄小型积体电路器（台）薄小外形封装 Thixotropy 抗垂流性，摇变性，摇溶性，静凝性（台）触变性 Tin Indicated 浸镀锡（台）浸锡Total Indicated Runout（TIR）总体标示偏转值（台）指针总读数 Touch Up 触修，简修，小修，（台）修版Transfer Bump 移用式突块，转移式突块（台）变换凸块Treament，Trearing 含浸处理（台）浸渍 Twist 板翘、板扭（台）扭曲UUtimate Tensile Strength（UTS）极限抗拉强度（台）极限拉伸强度Ultra Violet Curing（UV Curing）紫外线硬化（台）紫外线固化 Ultrasonic Bonding 超音波结合（台）超声连接Unbalaned Transmission Line 非平衡式传输线（台）非均衡传输线 Unsupported Hole 非镀通孔（台）非支撑孔 Urethane 胺基甲酸乙脂（台）氨基甲酸乙酯VV-Cut V型切槽（台）V槽切割Vacuum Evaporation（or Deposition）真空蒸镀法（台）真空镀膜法 Vacuum Lamination 真空压合（台）真空压制 Varnish 清漆，凡力水（台）树脂漆Visual Examination（Inspection）目视检查（台）目检Voltage Breakdown（崩）溃电压（台）击穿电压Voltage Plane Clearance 电压层的空环（台）电源层隔离WWaviness 波纹、波度（台）云织Weave Exposure 织纹显露；Weave Texture 织纹隐现（台）露布纹Wedge Void 楔形缺口（破洞）（台）楔形空洞Wet Lamination 湿压膜法（台）湿法贴膜Wetting 沾湿、沾锡（台）焊料润湿 Wicking 灯芯效应（台）芯吸Wire Bonding 打线结合（台）金属丝连接 Working Master 工作母片（台）工作原版 Wrinkle 皱褶，皱纹（台）皱褶ZZigzag Inline Package（ZIP）链齿状双排脚封装件（台）弯曲式直插封装第二篇：有关PCB(总结)PCB ：Printed circuit board 印刷电路板介电层（基材）：Dielectric 用来保持线路与各层之间的绝缘性，俗称为基材。
PCB专业英文单词
printed circuit 印制電路printed wiring 印制線路printed board 印制板printed circuit board 印制板電路printed wiring board 印制線路板printed component 印制元件printed contact 印制接點printed board assembly 印制板裝配board 板rigid printed board 剛性印制板flexible printed circuit 撓性印制電路flexible printed wiring 撓性印制線路flush printed board 齊平印制板metal core printed board 金屬芯印制板metal base printed board 金屬基印制板mulit-wiring printed board 多重布線印制板molded circuit board 模塑電路板discrete wiring board 散線印制板micro wire board 微線印制板buile-up printed board 積層印制板surface laminar circuit 表面層合電路板B2it printed board 埋入凸塊連印制板chip on board 載芯片板buried resistance board 埋電阻板mother board 母板daughter board 子板backplane 背板bare board 裸板copper-invar-copper board 鍵盤板夾心板dynamic flex board 動態撓性板static flex board 靜態撓性板break-away planel 可斷拼板cable 電纜flexible flat cable (FFC) 撓性扁平電纜membrane switch 薄膜開關hybrid circuit 混合電路thick film 厚膜thick film circuit 厚膜電路thin film 薄膜thin film hybrid circuit 薄膜混合電路interconnection 互連conductor trace line 導線flush conductor 齊平導線transmission line 傳輸線crossover 跨交edge-board contact 板邊插頭stiffener 增強板substrate 基底real estate 基板面conductor side 導線面component side 元件面solder side 焊接面printing 印制grid 網格pattern 圖形conductive pattern 導電圖形non-conductive pattern 非導電圖形legend 字符mark 標志base material 基材laminate 層壓板metal-clad bade material 覆金屬箔基材copper-clad laminate (CCL) 覆銅箔層壓板composite laminate 復合層壓板thin laminate 薄層壓板basis material 基體材料prepreg 預浸材料bonding sheet 粘結片preimpregnated bonding sheer 預浸粘結片epoxy glass substrate 環氧玻璃基板mass lamination panel 預制內層覆箔板core material 內層芯板bonding layer 粘結層film adhesive 粘結膜unsupported adhesive film 無支撐膠粘劑膜cover layer (cover lay) 覆蓋層stiffener material 增強板材copper-clad surface 銅箔面foil removal surface 去銅箔面unclad laminate surface 層壓板面base film surface 基膜面adhesive faec 膠粘劑面plate finish 原始光潔面matt finish 粗面length wise direction 縱向cross wise direction 模向cut to size panel 剪切板ultra thin laminate 超薄型層壓板A-stage resin A階樹脂B-stage resin B階樹脂C-stage resin C階樹脂epoxy resin 環氧樹脂phenolic resin 酚醛樹脂polyester resin 聚酯樹脂polyimide resin 聚亞胺樹脂bismaleimide-triazine resin 雙馬來亞胺三樹脂acrylic resin 丙烯酸樹脂melamine formaldehyde resin 三聚氰胺甲醛樹脂polyfunctional epoxy resin 多官能環氧樹脂brominated epoxy resin 溴化環氧樹脂epoxy novolac 環氧酚醛fluroresin 氟樹脂silicone resin 硅樹脂silane 硅烷polymer 聚合物amorphous polymer 無定形聚合物crystalline polamer 結晶現象dimorphism 雙晶現象copolymer 共聚物synthetic 合成樹脂thermosetting resin 熱固性樹脂thermoplastic resin 熱塑性樹脂photosensitive resin 感光性樹脂epoxy value 環氧值dicyandiamide 雙氰胺binder 粘結劑adesive 膠粘劑curing agent 固化劑flame retardant 阻燃劑opaquer 遮光劑plasticizers 增塑劑unsatuiated polyester 不飽和聚酯polyester 聚酯薄膜polyimide film (PI) 聚亞胺薄膜polytetrafluoetylene (PTFE) 聚四氟乙烯reinforcing material 增強材料glass fiber 玻璃纖維E-glass fibre E玻璃纖維D-glass fibre D玻璃纖維S-glass fibre S玻璃纖維glass fabric 玻璃布non-woven fabric 非織布glass mats 玻璃纖維墊yarn 紗線filament 單絲strand 絞股weft yarn 緯紗warp yarn 經紗denier 但尼爾warp-wise 經向thread count 織物經緯密度weave structure 織物組織plain structure 平紋組織grey fabric 壞布woven scrim 稀松織物bow of weave 弓緯end missing 斷經mis-picks 缺緯bias 緯斜crease 折痕waviness 雲織fish eye 魚眼feather length 毛圈長mark 厚薄段split 裂縫twist of yarn 捻度size content 浸潤劑含量size residue 浸潤劑殘留量finish level 處理劑含量size 浸潤劑couplint agent 偶聯劑finished fabric 處理織物polyarmide fiber 聚胺纖維aromatic polyamide paper 聚芳胺纖維紙breaking length 斷裂長height of capillary rise 吸水高度wet strength retention 溼強度保留率whitenness 白度ceramics 陶瓷conductive foil 導電箔copper foil 銅箔rolled copper foil 壓延銅箔annealed copper foil 退火銅箔thin copper foil 薄銅箔adhesive coated foil 涂膠銅箔resin coated copper foil 涂膠脂銅箔composite metallic material 復合金屬箔carrier foil 載體箔invar 殷瓦foil profile 箔（剖面）輪廓shiny side 光面matte side 粗糙面treated side 處理面stain proofing 防銹處理double treated foil 雙面處理銅箔shematic diagram 原理圖logic diagram 邏輯圖printed wire layout 印制線路布設master drawing 布設總圖computer aided drawing 計算機輔助制圖computer controlled display 計算機控制顯示placement 布局routing 布線layout 布圖設計rerouting 重布simulation 模擬logic simulation 邏輯模擬circit simulation 電路模擬timing simulation 時序模擬modularization 模塊化layout effeciency 布線完成率MDF databse 機器描述格式數據庫design database 設計數據庫design origin 設計原點optimization (design) 優化（設計）predominant axis 供設計優化坐標軸table origin 表格原點mirroring 鏡像drive file 驅動文件intermediate file 中間文件manufacturing documentation 制造文件queue support database 隊列支撐數據庫component positioning 元件安置graphics dispaly 圖形顯示scaling factor 比例因子scan filling 掃描填充rectangle filling 矩形填充region filling 填充域physical design 實體設計logic design 邏輯設計logic circuit 邏輯電路hierarchical design 層次設計top-down design 自頂向下設計bottom-up design 自底向上設計net 線網digitzing 數字化design rule checking 設計規則檢查router (CAD) 走（布）線器net list 網絡表subnet 子線網objective function 目標函數post design processing (PDP) 設計後處理interactive drawing design 交互式制圖設計cost metrix 費用矩陣engineering drawing 工程圖block diagram 方塊框圖moze 迷宮component density 元件密度traveling salesman problem 回售貨員問題degrees freedom 自由度out going degree 入度incoming degree 出度manhatton distance 曼哈頓距離euclidean distance 歐幾裏德距離network 網絡array 陣列segment 段logic 邏輯logic design automation 邏輯設計自動化separated time 分線separated layer 分層definite sequence 定順序conduction (track) 導線（通道）conductor width 導線（體）寬度conductor spacing 導線距離conductor layer 導線層conductor line/space 導線寬度/間距conductor layer No.1 第一導線層round pad 圓形盤square pad 方形盤diamond pad 菱形盤oblong pad 長方形焊盤bullet pad 子彈形盤teardrop pad 淚滴盤snowman pad 雪人盤V-shaped pad V形盤annular pad 環形盤non-circular pad 非圓形盤isolation pad 隔離盤monfunctional pad 非功能連接盤offset land 偏置連接盤back-bard land 腹（背）裸盤anchoring spaur 盤址land pattern 連接盤圖形land grid array 連接盤網格陣列annular ring 孔環component hole 元件孔mounting hole 安裝孔supported hole 支撐孔unsupported hole 非支撐孔via 導通孔plated through hole (PTH) 鍍通孔access hole 餘隙孔blind via (hole) 盲孔buried via hole 埋孔buried blind via 埋,盲孔any layer inner via hole 任意層內部導通孔all drilled hole 全部鑽孔toaling hole 定位孔landless hole 無連接盤孔interstitial hole 中間孔landless via hole 無連接盤導通孔pilot hole 引導孔terminal clearomee hole 端接全隙孔dimensioned hole 準尺寸孔via-in-pad 在連接盤中導通孔hole location 孔位hole density 孔密度hole pattern 孔圖drill drawing 鑽孔圖assembly drawing 裝配圖datum referan 參考基準。
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PCB专业英语词汇
一．Process 工艺流程
1．Board cut /开料
2．Drill /钻孔
3．IQC(Incoming Quality Control) /来料检查
4．PTH(Plated Through Hole) /沉铜
5．Panel Plating /整板电镀
6．D/F(Dry Film) /干膜
7．Pattern Plating /图形电镀
8．ETCH /蚀刻
9．QC (Quality Control) /品质检查
10. W/F(Wet Film) /湿膜
11.Legend /字符
12.HAL(Hot Air Leveling) /喷锡
13.Immersion gold (chemical gold) /沉金
14.Routing /锣
15.V-CUT /V刻
16.Punting /啤
17.Rinse /清洗
18.FQC(Final Quality Control) /终检
19.QA Audit /审核
20.Package /包装
21.Shipment /出货 ship out
二．The items For QA
1. PQC(Process Quality Control) /过程品质检查
2. IPQC(In Process Quality Control) /过程控制检查
3. First Article check /首件检查
4. Backlight /背光检查
5. Microsection /切片检查
6. Etch Factor /蚀刻系数
7. Tape test /胶纸实验
8. Lot check /批检
9. Full check /全检
10. Sampling check /抽检
11. Customer /客户
12. Date code /日期代码
13. AQL level(Average Quality Level) /AQL水平
14. Sample size /抽样数
15. Lot size /批量数
16. Visual check /目视检查
17. Logo /商标
18. Solder side /焊接面
19. Component side /元件面
20. Gold tape test /金层结合力实验
21. S/M tape test /绿油结合实验
22. C/M tape test /字符结合实验
23. Impedance test /阻抗测试
24. Wetting test(solder ability test) /可焊性实验
25. Specimen 样板，样品
26. Outgoing Report(shipment report) 出货报告
27. ACC(Accepted) 可接受
28. Rej (Rejected) 拒收
29. Pass 过
30. UAI(Use As Is) 特采 （让步接受）
31. Defect 缺陷
32. Corrective Actions 纠正措施
33. MRB(Material Review Bcard) 物料审核委员会
34. Customer Complain 客户投诉
35. DCC(Document Control Center) 文控中心
三．The items for Engineering Department
1. Engineering Department工程部
2. QE: Quality Engineering 品质工程师
3. MI: Manufacturing Instruction生产指引
4. ECN: Engineering Change notice 工程变更通知
5. Template 模板
6. E/T Fixture测试架
7. Ground Layer地层
8. Inner Layer内层
9. Dummy Pad(inner layer)假PAD
10. Artwork Check
11. Pattern
12. Pattern Artwork
13. S/M Artwork
14. Legend Artwork字符非林
15. Carbon Artwork
16. CAD: Computer Assistant Design
17. CAM: Computer Assistant Manufacturing
18. MI Audit
19. Tolerance
20. Second Drill
21. Tenting
22. certificate / 证书
23. clear / 清除
24. client / 客户
25. samples 样板/样品
四． Year or week and month
1. week:星期
2. Monday1:星期
3. Tuesday
4. Wednesday
5. Thursday
6. Friday
7. Saturday
8. Sunday/first day
9. month:月
10. January 1月
11. February 2月
12. March 3月
13. April 4月
14. May 5月
15. June 6月
16. July 7月
17. August 8月
18. September 9月
19. October 10月
20. November 11月
21. December 12月
五 Other one glossary
1. Guarantee 保证
2. Calibration 刻度
3. hole 孔，洞