(完整版)muRata电感命名规则
muRata电感命名规则
还是先举个例子吧，让大家先有个直观的了解：
LQG15HS1N2S02D：这是0402封装的1.2nH电感，精度误差±0.3nH。
LQG15HS是0402封装的一个电感系列；
1N2表示1.2nH；
S表示精度误差±0.3nH；
0表示特征是“标准型”，LQG15HS系列的这个数值都是0；
2表示电极是锡；
D表示包装是纸带 (?180mm卷盘)
详细的说明如下：
6，电感值
由3位字母数字表示。
单位为微亨(μH)。
第1位和第2位数字为有效数字，第3位数字表示有效数字后的0的个数。
有小数点时以大写字母"R"表示。
此时，所有数字均为有效数字。
如果电感值小于0.1μH，则电感值以两个数字和大写字母"N"的组合来表示，电感
w结构值单位使用纳亨(nH)。
大写字母"N"表示单位"nH"，同时含有1个小数点。
在这种情况时所有数字均为有效数字。
*1：不包括LQM21N系列*2：不包括LQH32系列9，电极
*1不包括LQH43C/LQH66S
*2仅限LQM21D(22 - 47μH)/LQM21F(4.7 - 47μH)/LQM21N(2.7 - 4.7μH)。
*3仅限LQM21D(1.0 - 10μH)/LQM21F(1.0 - 2.2μH)/LQM21N(0.1 - 2.2μH)。
*4不包括LQP15T。
村田磁珠命名规则
村田磁珠命名规则
村田磁珠是一种电子元器件，由于其广泛应用于各种电子设备中，因此命名规则也非常重要。
以下是村田磁珠命名规则：
1. 型号命名规则：村田磁珠的型号由三个部分组成，分别是系列、尺寸和电感值。
例如，一个村田磁珠的型号为LBC2016T220M，
其中LBC为系列，2016为尺寸，220为电感值。
2. 系列命名规则：村田磁珠的系列分为多种类型，包括LC、LQ、LH、LX、LK等。
不同的系列代表着不同的使用场景和特点。
3. 尺寸命名规则：村田磁珠的尺寸一般由长度和宽度两个参数
来表示，单位为毫米。
例如，2016代表着长度为2.0毫米，宽度为1.6毫米。
4. 电感值命名规则：村田磁珠的电感值也是一个重要的参数，
决定着其在电路中的作用。
一般以毫亨为单位来表示，例如220代表着220毫亨的电感值。
综上所述，村田磁珠的命名规则是一个相对固定的体系，有助于人们在使用和选择村田磁珠时更加方便和准确。
- 1 -。
国内外常用电子元器件型号命名规则比如：电阻器,电容器
(5)日本松下旗下三洋电机(Panasonic)
(6)韩国三星(SAMSUNG)
(7)美国基美(KEMET)
(8)英国Syfer
(9)中国台湾国巨(YAGEO)
(10)中国台湾华新科技(WALSIN)
3.电感器
4.变压器
5.二极管
6.三极管
7.发光二极管
8.扬声器
9.电声器件
10晶闸管
11.继电器
国外：
1.国际电子联合会半导体器件命名法
国际电子联合会晶体管型号命名法的特点：
1)这种命名法被欧洲许多国家采用。因此，凡型号以两个字母开头，并且第一个字母是A，B，C，D或R的晶体管，大都是欧洲制造的产品，或是按欧洲某一厂家专利生产的产品。
2)第一个字母表示材料（A表示锗管，B表示硅管），但不表示极性（NPN型或PNP型）。
3)第二个字母表示器件的类别和主要特点。如C表示低频小功率管，D表示低频大功率管，F表示高频小功率管，L表示高频大功率管等等。若记住了这些字母的意义，不查手册也可以判断出类别。例如，BL49型，一见便知是硅大功率专用三极管。
4)第三部分表示登记顺序号。三位数字者为通用品；一个字母加两位数字者为专用品，顺序号相邻的两个型号的特性可能相差很大。例如，AC184为PNP型，而AC185则为NPN型。
8)日本通常把Pcm≥1W的管子，称做大功率管。
5)第四部分字母表示同一型号的某一参数（如hFE或NF）进行分档。
6)型号中的符号均不反映器件的极性（指NPN或PNP）。极性的确定需查阅手册或测量。
2.美国半导体器件型号命名法
美国晶体管或其它半导体器件的型号命名法较混乱。这里介绍的是美国晶体管标准型号命名法，即美国电子工业协会（EIA）规定的晶体管分立器件型号的命名法。如下表：
原来国内外常用电子元器件型号命名规则是这样的，涨知识了！
原来国内外常用电子元器件型号命名规则是这样的，涨知识了！1.电阻器举例：RJ76表示精密金属膜电阻器R——电阻器（第一部分）J——金属膜（第二部分）7——精密（第三部分）6——序号（第四部分）2.电容器国外电容器命名规则不一，国外部分知名厂家命名规则如下：•(1)日本村田(muRata)•(2)日本TDK•(3)日本京瓷(Kyocera)•(4)日本罗姆(ROHM)•(5)日本松下旗下三洋电机(Panasonic)(6)韩国三星(SAMSUNG)•(7)美国基美(KEMET)•(8)英国Syfer•(9)中国台湾国巨(YAGEO)•(10)中国台湾华新科技(WALSIN)3.电感器4.变压器5.二极管6.三极管7.发光二极管8.扬声器9.电声器件10晶闸管11.继电器国外：1.国际电子联合会半导体器件命名法国际电子联合会晶体管型号命名法的特点：•1)这种命名法被欧洲许多国家采用。
因此，凡型号以两个字母开头，并且第一个字母是A，B，C，D或R的晶体管，大都是欧洲制造的产品，或是按欧洲某一厂家专利生产的产品。
•2)第一个字母表示材料（A表示锗管，B表示硅管），但不表示极性（NPN型或PNP型）。
•3)第二个字母表示器件的类别和主要特点。
如C表示低频小功率管，D表示低频大功率管，F表示高频小功率管，L表示高频大功率管等等。
若记住了这些字母的意义，不查手册也可以判断出类别。
例如，BL49型，一见便知是硅大功率专用三极管。
•4)第三部分表示登记顺序号。
三位数字者为通用品；一个字母加两位数字者为专用品，顺序号相邻的两个型号的特性可能相差很大。
例如，AC184为PNP型，而AC185则为NPN型。
•5)第四部分字母表示同一型号的某一参数（如hFE或NF）进行分档。
•6)型号中的符号均不反映器件的极性（指NPN或PNP）。
极性的确定需查阅手册或测量。
2.美国半导体器件型号命名法美国晶体管或其它半导体器件的型号命名法较混乱。
【电容的型号命名规则】murata电容命名规则
【电容的型号命名规则】murata电容命名规则电容的型号命名：1、各国电容器的型号命名很不统一，国产电容器的命名由四部分组成：第一部分：用字母表示名称，电容器为C。
第二部分：用字母表示材料。
第三部分：用数字表示分类。
第四部分：用数字表示序号。
2、电容的标志方法：(1)直标法：用字母和数字把型号、规格直接标在外壳上。
(2)文字符号法：用数字、文字符号有规律的组合来表示容量。
文字符号表示其电容量的单位：P、N、u、m、F等。
和电阻的表示方法相同。
标称允许偏差也和电阻的表示方法相同。
小于10pF的电容，其允许偏差用字母代替：B——±0.1pF，C——±0.2pF，D——±0.5pF，F——±1pF。
(3)色标法：和电阻的表示方法相同，单位一般为pF。
小型电解电容器的耐压也有用色标法的，位置靠近正极引出线的根部，所表示的意义如下表所示：颜色黑棕红橙黄绿蓝紫灰耐压 4V 6.3V 10V 16V 25V 32V 40V 50V 63V (4)进口电容器的标志方法：进口电容器一般有6项组成。
第一项：用字母表示类别：第二项：用两位数字表示其外形、结构、封装方式、引线开始及与轴的关系。
第三项：温度补偿型电容器的温度特性，有用字母的，也有用颜色的，其意义如下表所示：序号字母颜色温度系数允许偏差字母颜色温度系数允许偏差 1 A 金+100 R 黄 -220 2 B 灰 +30 S 绿 -330 3 C 黑 0 T 蓝 -470 4 G ±30 U 紫 -750 5 H 棕 -30 ±60 V -1000 6 J ±120 W -1500 7 K ±250 X -2200 8 L 红 -80 ±500 Y -3300 9 M ±1000 Z -4700 10 N ±2500 SL +350~-1000 11 P 橙 -150 YN -800~-5800 备注：温度系数的单位10e -6/℃；允许偏差是 % 。
MURATA LQH43MN系列芯片电感（Chip Inductors）商品说明书
CHIP COIL （CHIP INDUCTORS ）LQH43MN □□□□03L REFERENCE SPECIFICATION1. ScopeThis reference specification applies to LQH43MN Series, Chip coil (Chip Inductors).2. Part Numbering(ex) LQ H 43 M N 1R0 K 0 3 LProduct ID Structure Dimension Applications CategoryInductance Tolerance Features Electrode Packaging(L×W) a nd L:TapingCharacteristics3. Rating・Operating Temperature Range -40 to +85°C ・Storage Temperature Range-40 to +85°CCustomer’s Part Number MURATA Part NumberInductanceQ (min.)DC Resistance (Ω max) SelfResonantFrequency(MHz min)* RatedCurrent(mA)(μH)Tolerance (%)LQH43MN1R0M03L 1.0 M:±20 200.20120500LQH43MN1R2M03L 1.2 100 LQH43MN1R5M03L 1.50.3085LQH43MN1R8M03L 1.8 75LQH43MN2R2M03L 2.2 62LQH43MN2R7M03L 2.7 0.32 53 LQH43MN3R3M03L 3.3 0.35 47 LQH43MN3R9M03L 3.9 0.38 41 LQH43MN4R7K03L 4.7K:±10 300.40 38LQH43MN5R6K03L 5.6 0.47 33LQH43MN6R8K03L 6.8 0.50 31450LQH43MN8R2K03L 8.2 0.5627 LQH43MN100K03L10K:±10J:± 53523 400LQH43MN100J03LLQH43MN120K03L12 0.62 21 380LQH43MN120J03LLQH43MN150K03L15 0.73 19 360LQH43MN150J03LLQH43MN180K03L18 0.82 17 340LQH43MN180J03LLQH43MN220K03L22 0.94 15 320LQH43MN220J03LLQH43MN270K03L 27 1.1 14 300 LQH43MN270J03L LQH43MN330K03L33 1.2 12 270LQH43MN330J03LLQH43MN390K03L39 1.4 11 240LQH43MN390J03LLQH43MN470K03L47 1.5 10 220LQH43MN470J03LLQH43MN560K03L56 1.7 9.3 200LQH43MN560J03LLQH43MN680K03L68 1.9 8.4 180LQH43MN680J03LCustomer’s Part NumberMURATAPart NumberInductanceQ(min.)DCResistance(Ω max)SelfResonantFrequency(MHz min)* RatedCurrent(mA)(μH)Tolerance(%)LQH43MN820K03L82K:±10J:± 5 35 2.2 7.5 170LQH43MN820J03LLQH43MN101K03L10040 2.5 6.8 160LQH43MN101J03LLQH43MN121K03L120 3.06.2150 LQH43MN121J03LLQH43MN151K03L150 3.75.5130 LQH43MN151J03LLQH43MN181K03L180 4.55.0120 LQH43MN181J03LLQH43MN221K03L220 5.44.5110 LQH43MN221J03LLQH43MN271K03L270 6.84.0100 LQH43MN271J03LLQH43MN331K03L330 8.23.695LQH43MN331J03LLQH43MN391K03L390 9.73.390LQH43MN391J03LLQH43MN471K03L470 11.83.080LQH43MN471J03LLQH43MN561K03L560 14.52.770LQH43MN561J03LLQH43MN681K03L680 17.02.565LQH43MN681J03LLQH43MN821K03L820 20.52.260LQH43MN821J03LLQH43MN102K03L1000 25.02.050LQH43MN102J03LLQH43MN122K03L1200 30.01.845LQH43MN122J03LLQH43MN152K03L1500 37.01.640LQH43MN152J03L* When applied Rated current to the Products , self temperature rise shall be limited to 20°C max and Inductance willbe within ±10% of initial Inductance value.4. Testing Conditions<Unless otherwise specified> <In case of doubt>Temperature: Ordinary Temperature (15 to 35°C) Temperature: 20 ± 2°CHumidity: Ordinary Humidity (25 to 85 %(RH)) Humidity: 60 to 70 %(RH)AtmosphericPressure: 86 to 106 kPa5. Appearance and Dimensions■Unit Mass (Typical value)0.13g(in mm)6. Electrical PerformanceNo. Item Specification TestMethod6.1 Inductance Inductance shall meet item 3. Measuring Equipment：KEYSIGHT4192A or equivalentMeasuring Frequency：1MHz / 1.0 to 390 μH1kHz / 470 to 1500 μH6.2 Q Q shall meet item 3. Measuring Equipment：KEYSIGHT4192A or equivalentMeasuring Frequency：1MHz / 1.0 to 82 μH796kHz / 100 to 820 μH252kHz / 1000 to 1500 μH6.3 DC Resistance DC Resistance shall meet item 3. Measuring Equipment：Digital multi meter6.4 Self ResonantFrequency(S.R.F)S.R.F shall meet item 3. Measuring Equipment：KEYSIGHT E4991A or equivalent6.5 TemperatureCharacteristics Temperature Coefficient150 to 1400 PPM/°CTemperature coefficient on the basis of step 3shall meet specification after tested asfollows.It shall be subjected to the condition ofTable 1, and its inductanse shall be measuredat each step after reaching the thermalequiligrium and be calculated.Table 1Step1 / +20±2°C Step4 / +85±2°CStep2 / -25±2°C Step5 / +20±2°CStep3 / +20±2°C8. Environmental Performance (It shall be soldered on the substrate.)No. Item Specification Test Method8.1 Heat Resistance Appearance ：No damageInductance Change ：within ± 5% Q-factor Change ：within ± 20% Temperature ：85±2°CTime ：1000h (+48 h, -0 h)Then measured after exposure in the room condition for 24±2 hours.8.2 Cold ResistanceTemperature ：-40±2°C Time ：1000h (+48 h, -0 h)Then measured after exposure in the room condition for 24±2 hours.8.3 HumidityTemperature ：40±2°C Humidity ：90 to 95%(RH) Time ：1000h (+48 h, -0 h)Then measured after exposure in the room condition for 24±2 hours.8.4 TemperatureCycle1 cycle ：step 1：-40±2°C / 30±3 minstep 2：Ordinary temp. / 10 to 15 min step 3：+85±2°C / 30±3 minstep 4：Ordinary temp. / 10 to 15 min Total of 10 cyclesThen measured after exposure in the room condition for 24±2 hours.9. Specification of Packaging(in mm)Dimension of the Cavity is measured at the bottom side.9.2 Specification of Taping(1) Packing quantity (standard quantity)500 pcs / reel (2) Packing MethodProducts shall be packed in the each embossed cavity of plastic tape and sealed by cover tape. (3) Sprocket holeThe sprocket holes are to the right as the tape is pulled toward the user. (4) Spliced pointPlastic tape and Cover tape has no spliced point. (5) Missing components numberMissing components number within 0.025 % of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.9.3 Pull StrengthEmbossed carrier tape10N min. Cover tape5N min.2.7±0.2※The packing directions of the chip coilin taping are unified with the in/out positions of the lead wire.9.4 Peeling off force of cover tapeSpeed of Peeling off 300mm/minPeeling off force0.2 to 0.7N (minimum value is typical)9.5 Dimensions of Leader-tape, Trailer and ReelThere shall be leader-tape (cover tape) and trailer-tape (empty tape) as follows.9.6 Marking for reelCustomer part number, MURATA part number, Inspection number(*1), RoHS marking(*2), Quantity etc ･･･*1) <Expression of Inspection No.> □□ OOOO ⨯⨯⨯(1) (2) (3)(1) Factory Code(2) Date First digit : Year / Last digit of yearSeconddigit: Month / Jan. to Sep. → 1 to 9, Oct. to Dec. → O, N, DThird, Fourth digit : Day(3) Serial No.*2) « Expression of RoHS marking » ROHS – Y (△)(1)(2)(1) RoHS regulation conformity(2) MURATA classification number9.7 Marking for Outside package (corrugated paper box)Customer name, Purchasing order number, Customer part number, MURATA part number, RoHS Marking (*2) ,Quantity, etc ･･･9.8. Specification of Outer CaseOuter Case Dimensions(mm) Standard Reel Quantityin Outer Case (Reel)W D H186 186 93 4*Above Outer Case size is typical. It depends on a quantityof an order10. CautionLimitation of ApplicationsPlease contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property.(1) Aircraft equipment(6) Transportation equipment (vehicles, trains, ships, etc.)(2) Aerospace equipment(7) Traffic signal equipment(3) Undersea equipment(8) Disaster prevention / crime prevention equipment(4) Power plant control equipment(9) Data-processing equipment(5) Medical equipment (10) Applications of similar complexity and /or reliability requirementsto the applications listed in the above165to180degreeF Cover tapePlastic tapeW DLabelHTrailer:160m in.11. NoticeThis product is designed for solder mounting.Please consult us in advance for applying other mounting method such as conductive adhesive.11.1 Land pattern designingRecommended land patterns for reflow soldering are as follows:These have been designed for Electric characteristics and solderability.Please follow the recommended patterns. Otherwise, their performance which includes electrical performance or solderability may be affected, or result to "position shift" in soldering process.Reflow Soldering(in mm)11.2 Flux, SolderFlux・Use rosin-based flux.・Don’t use highly acidic flux with halide content exceeding 0.2(wt)% (chlorine conversion value). ・Don’t use water-soluble flux.Solder・Use Sn-3.0Ag-0.5Cu solder・Standard thickness of solder paste : 200μm to 300μmOther flux (except above) Please contact us for details, then use.11.3 Soldering conditions (Reflow)・Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max. Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max.Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. ・Standard soldering profile and the limit soldering profile is as follows.The excessive limit soldering conditions may cause leaching of the electrode and / or resulting in the deterioration of product quality.Reflow soldering profileStandard Profile Limit ProfilePre-heating 150～180°C 、90s ±30sHeating above 220°C 、30s ～60s above 230°C 、60s max. Peak temperature 245±3°C 260°C,10s Cycle of reflow2 times1 timeLimit ProfileStandard Profile 90s±30s 230℃260℃245℃±3℃220℃30s～60s60s max.180150Temp.(s)(℃)Time.11.4 Reworking with soldering iron.The following conditions must be strictly followed when using a soldering iron.Pre-heating 150°C,1 min Tip temperature 350°C max. Soldering iron output 80W max. Tip diameter φ3mm max. Soldering time3(+1,-0)sTimes 2 timesNote : Do not directly touch the products with the tip of the soldering iron in order to prevent the crackon the products due to the thermal shock.11.5 Solder Volume・Solder shall be used not to be exceeded the upper limits as shown below.・Accordingly increasing the solder volume, the mechanical stress to Chip is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance.1/3T ≦t ≦T (T: Lower flange thickness)11.6 Product's locationThe following shall be considered when designing and laying out P.C.B.'s.(1) P.C.B. shall be designed so that products are not subject to the mechanical stress due to warping the board.［Products direction ］Products shall be locatedin the sideways direction (Length:a<b) to the mechanical stress.(2) Components location on P.C.B. separation.It is effective to implement the following measures, to reduce stress in separating the board.It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress.Contents of MeasuresStress Level (1) Turn the mounting direction of the component parallel to the board separation surface. A > D *1 (2) Add slits in the board separation part.A >B (3) Keep the mounting position of the component away from the board separation surface.A > C*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.(3) Mounting Components Near Screw HolesWhen a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw. Mount the component in a position as far away from the screw holes as possible.〈Poor example 〉〈Good example 〉ba SeamSlit ADBCb a Length:a bScrew Hole Recommended11.7 Cleaning ConditionsProducts shall be cleaned on the following conditions.(1) Cleaning temperature shall be limited to 60°C max.(40°C max for IPA.)(2) Ultrasonic cleaning shall comply with the following conditions with avoiding the resonance phenomenonat the mounted products and P.C.B.Power : 20 W /l max. Frequency : 28kHz to 40kHz Time : 5 minutes max.(3) Cleaner1. Alternative cleaner･Isopropyl alcohol (IPA)2. Aqueous agent･PINE ALPHA ST-100S(4) There shall be no residual flux and residual cleaner after cleaning.In the case of using aqueous agent, products shall be dried completely after rinse with de-ionized water in orderto remove the cleaner.(5) Other cleaningPlease contact us.11.8 Resin coatingThe inductance value may change due to high cure-stress of resin to be used for coating/molding products. Anopen circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operatingcondition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis undersome operating condition may cause corrosion of wire of coil, leading to open circuit. So, please pay your carefulattention when you select resin in case of coating/molding the products with the resin. Prior to use the coatingresin, please make sure no reliability issue is observed by evaluating products mounted on your board.11.9 Caution for use・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to thewinding portion to prevent the breaking of wire.・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.11.10 Handling of a substrateAfter mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate.Excessive mechanical stress may cause cracking in the product.Bending Twisting11.11 Storage and Handling Requirements(1) Storage periodUse the products within 12 months after delivered.Solderability should be checked if this period is exceeded.(2) Storage conditions・Products should be stored in the warehouse on the following conditions.Temperature : -10 ~ 40°CHumidity : 15 to 85% relative humidity No rapid change on temperature and humidityThe electrode of the products is coated with solder. Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause oxidization of electrode, resulting in poor solderability.・Products should not be stored on bulk packaging condition to prevent the chipping of the core and the breakingof winding wire caused by the collision between the products.・Products should be stored on the palette for the prevention of the influence from humidity, dust and so on.・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.(3) Handling ConditionCare should be taken when transporting or handling product to avoid excessive vibration or mechanical shock. 12．Note(1) Please make sure that your product has been evaluated in view of your specifications with our product being mountedto your product.(2) You are requested not to use our product deviating from the reference specifications.(3) The contents of this reference specification are subject to change without advance notice. Please approve our productspecifications or transact the approval sheet for product specifications before ordering。
MURATA 电容型号编码规则
r t
Dimension (T) 0.2mm 2-elements (Array Type) 0.3mm 4-elements (Array Type) 0.5mm 0.6mm 0.7mm 0.8mm 0.85mm 1.0mm 1.25mm 1.6mm 2.0mm 2.5mm 3.2mm 1.15mm 1.35mm 1.8mm 2.8mm 1.5mm Depends on individual standards.
EIA 01005 0201 0202 0303 0504 0402 0603
With the array type GNM series, "Dimension(T)" indicates the number of elements.
Depends on individual standards.
murata电容型号编码规则电容村田规则村田电容电容型号村田代码电容器
o Part Numbering
Chip Monolithic Ceramic Capacitors
(Part Number) qProduct ID wSeries Product ID GR ER GQ GM GN Code M 4 7 B M A M L LL C A M GJ M 6 GA GC 2 3 P M Series Tin Plated Layer Only for Information Devices / Tip & Ring Only for Camera Flash Circuit High Frequency Type High Frequency for Flow/Reflow Soldering Monolithic Microchip Capacitor Array Low ESL Wide Width Type Automotive Low ESL Wide Width Type Eight-termination Low ESL Type Ten-termination Low ESL Type High Frequency Low Loss Type Tin Plated Type High Frequency Low Loss Type for AC250V (r.m.s.) Safety Standard Recognized Type Automotive Soldering Electrode Automotive Tin Plated Layer GR q M w 18 e 8 B1 1H y 102 u K i A01 K o !0 rDimension (T) Code 2 2 3 4 5 6 7 8 9 A B C D E F M N R S Q X eDimension (LgW) Code 02 03 05 08 11 15 18 1D 1X 21 22 31 32 3X 42 43 52 55 Dimension (LgW) 0.4g0.2mm 0.6g0.3mm 0.5g0.5mm 0.8g0.8mm 1.25g1.0mm 1.0g0.5mm 1.6g0.8mm 1.4g1.4mm Depends on individual standards. 2.0g1.25mm 2.8g2.8mm 3.2g1.6mm 3.2g2.5mm 4.5g2.0mm 4.5g3.2mm 5.7g2.8mm 5.7g5.0mm 0805 1111 1206 1210 1808 1812 2211 2220
村田Murata LQ系列电感命名方式
B C D G H J K S W iFeatures Code Features Standard Type High-Q/ Low DC Resistance
Series LQG/LQP/LQW/LQH*1 LQW15A/18A/2BH
rApplications and Characteristics Code H M T A H H tCategory Code N S Category Standard Type Series LQG LQP LQW LQH Applications and Characteristics Multilayer Air-core Inductor (Coil) Film Type Film Type (Low DC Resistance Type) High Q Type (UHF-SHF) High Q Type (VHF-UHF) for High-frequency Resonant Circuit
RF Inductor Part Numbering
(Part Number)
LQ q
G w
15 e
H
N
1N0 y
S
0
2
D
yInductance Expressed by three-digit alphanumerics. The unit is micro-henry (µH). The first and second figures are significant digits, and the third figure expresses the number of zeros which follow the two figures. If there is a decimal point, it is expressed by the capital letter "R". In this case, all figures are significant digits. If inductance is less than 0.1µH, the inductance code is expressed by a combination of two figures and the capital letter "N", and the unit of inductance is nano-henry (nH). The capital letter "N" indicates the unit of "nH", and also expresses a decimal point. In this case, all figures are significant digits. uInductance Tolerance Code Inductance Tolerance ±0.1nH ±0.2nH ±0.5nH ±2% ±3% ±5% ±10% ±0.3nH ±0.05nH
各大品牌电容的命名规则
各大品牌电容的命名规则图1 SAMSUNG电容的命名图2 MURATA电容的命名图3 TDK电容的命名图4 KYOCERA电容的命名图5 TAIYO-YUDEN电容的命名图6 KEMET电容的命名图7 PANSONIC电容的命名图8 YAGEO/国巨电容的命名图9 华新（Walsin）电容的命名图10 风华电容的命名图11 宇阳电容的命名SOD/SOT系列产品1产能：400kk/月品种：开关二极管、稳压二极管、肖特基二极管、ESD保护二极管、达林顿三极管、高压三极管、普通三极管、数字三极管、稳压电路等。
封装：SOD-123 、SOD-323、SOD-523、SOT-23 、SOT-323、SOT-363 、SOT-523、SOT-89 、SOT-143、DFN表面安装器件产能：200kk/月品种：贴片整流二极管、快恢复二极管、超高速开关二极管、肖特基二极管、瞬态电压抑制二极管、固态放电管、双向触发二极管、贴片整流桥等。
封装：SOD-123FL 、DO-213AA 、DO-213AB 、SMAJ、SMA 、SMB 、SMC 、DB-1、DB-S 、TBS、MBM、MBS、SMAFL、TO-277A塑封二极管PlasticDiode产能：600kk/月品种：全系列塑封整流二极管、快恢复开关二极管、超高速二极管各类电器专用二极管、肖特基系列二极管、固态放电管二极管瞬态电压抑制二极管、双向触发二极管、变阻器二极管高反压二极管封装：R-1、A-405、A-405F、DO-41、DO-15、DO-15L、DO-15B R-3、DO-27、DO-27S、R-6汽车整流器AutomotiveRectifier产能：1kk/月品种：各类汽车整流器封装：AR 、ARS 、ZQA 、ZQB 、ZQL1 、ZQL2 、ZQL3 、ZQL4、CELL整流桥BridgeRectifier产能：3kk/月品种：桥式整流器、整流模块封装：KBPC、KBPC-W、WOM、KBP、KBJ、GBU、GBP、KBU、KBL、BR、BR-W 、MP、MP-W、SKBPC玻封二极管GlassDiode产能：60kk/月品种：小信号开关二极管稳压管小信号肖特基二极管封装：Mini Melf 、DO-34、DO-35。
村田电容命名规则
村田电容命名规则村田电容型号命名规则muRata村田制作所是电子元器件制造商。
主要制作贴片电容，电感，滤波器等产品，村田制作所的客户分布在PC、手机、汽车电子等领域。
智成电子村田一级代理商详细讲解村田电容型号的命名规则方法。
例如：贴片电容GRM32ER61A107ME20L（1210 X5R 10V 100UF 20%),下面我们把它分解开。
一、GR表示型号:村田贴片电容包含GC,GJ,GM,GQ,GR,KR,LL等二、M表示系列:村田贴片电容包含H,M,A,D,3,J,L三、32表示电容尺寸：村田贴片电容的尺寸包括0201-0402-0603-1206-1210-1812-2220（32是指尺寸长和宽3.2MM*2.5MM，就是我们熟知的1210电容）。
四、E表示厚度2.5MM，村田贴片电容常用的厚度5=0.5mm 6=0.6mm 8=0.8mm 9=0.9mm B=1.25mm C=1.6mm E=2.5mm五、R6代表材质X5R，村田贴片电容的材质常用材质村田代码有5C，R6，R7，F5等，具体的对应值如下：5C=COG/NPO/CH R6=X5R R7=X7R F5=Y5V5C工作温度是-55度+125度，温度系数是0+-30ppm/度；R6工作温度是-55度+85度，温度系数是+-15%；R7工作温度是-55度+125度，温度系数是+-15%；F5工作温度是-30度+85度。
温度系数是+22,-82%六、1A代表电压10V,村田贴片电容常用电压有0J，1A，1C，1E，1H等，对应值如下：0J=6.3V 1A=10V 1C=16V 1E=25V 1H=50V七、107代表容量100UF八、M代表精度+-20%,常用档位有B、C、D、J、K、M、Z,具体对应值如下:B=+-0.1pFC=+-0.25pF D=+-0.5pF J=+-5% K=+-10% M=+-20% Z=+80,-20%九、E20是村田内部代码，不重要。
muRata电感命名规则(可编辑修改word版)
m u R a t a电感命名规则
还是先举个例子吧，让大家先有个直观的了解： LQG15HS1N2S02D：这是 0402 封装的 1.2nH 电感，精度误差±0.3nH。
LQG15HS 是0402
封装的一个电感系列；
1N2 表示 1.2nH；
S 表示精度误差±0.3nH；
0 表示特征是“标准型”，LQG15HS 系列的这个数值都是 0；
2 表示电极是锡；
D 表示包装是纸带 (?180mm 卷盘)
详细的说明如下：
6，电感值
由 3 位字母数字表示。
单位为微亨(μH)。
第 1 位和第 2 位数字为有效数字，第 3 位数字表示有效数字后的 0 的个数。
有小数点时以大写字母"R"表示。
此时，所有数字均为有效数字。
如果电感值小于0.1μH，则电感值以两个数字和大写字母"N"的组合来表示，电感
w 结构值单位使用纳亨(nH)。
大写字母"N"表示单位"nH"，同时含有 1 个小数点。
在这种情况时所有数字均为有效数字。
*1：不包括 LQM21N 系列
*2：不包括 LQH32 系列
9，电极
*1 不包括 LQH43C/LQH66S
*2 仅限 LQM21D(22 - 47μH)/LQM21F(4.7 - 47μH)/LQM21N(2.7 - 4.7μH)。
*3 仅限LQM21D(1.0 - 10μH)/LQM21F(1.0 - 2.2μH)/LQM21N(0.1 - 2.2μH)。
*4 不包括 LQP15T。