封装产业以及制程介绍

PIE 2.8 Year TSMC
(Shanghai)
34 Sec.
Xintec 2.3 Year (Backend) Manager
➢ 06/2002 獲得台積傑出工程師獎 ➢ photo rework rate 0.8% from 4.3%, running 3 years , TSMC 1st ➢ Mask manager system (Repeating defect=0 running 13 months) ➢ Support PIE to gain 3% yield at PHOTO process
Auto
Major Accomplishments
DL Productivity improvement (2009/06~Now) ➢Line_A with Line_B Operation merge (SMF~FVI): Saving 20 HC ➢Raise FVI OMI Inspection rate (48% to 70%) and reduce simplify (25 to 3pcs by lot (1pcs:50dies)), reduce 80%; Saving 8 HC ➢Reduce in-process measure frequency 65% & simplify rate 68% : Saving 12 HC ➢One cassette on line: ➢ reduce 2hr cycle time ;Capacity improve 20% at wet bench process. ➢ Cost saving NT$ 3M/year
Wafer 成品
顯微鏡下的IC 一角
If you are a company boss what you care about is
Major Accomplishments
Lead Xintec Backend development
Base on TSMC/MIC expert experience in Engineering , The essence of self-reliance and innovate to enhance the technological promotion :
knowledge.
Developer smart monitor system to reduce miss operation and pick up a
good yield.
Improve manufacturing capability to enhance the competitiveness of operation and customer service
台灣半導體相關產業在世界扮演的腳色
系統級封裝（System in package, SiP）
Wafer Level CSP Process flow
Wafer Level Chip Scale Packaging (WLCSP)
Dam stage
Bond 1 stage
Research and developer the new knowledge.
PIE &
Future Plan:
RD
Continuously provide better manufacturing service for RD & Eng. Programs
Co-work with RD & Eng. to improve operator & productivity for new
Continue reduce cost & good productivity to gain high profit.
Setup strong training system to reduce business trade Cycle impact
Developer dispatch system to enhance the efficiency for Saw & Notch &
➢Process time & Q-time monitor system ➢Multi-skill certify ➢Batch wafer track in / out system for ETCH and
Bond process ➢Training system setup
Potential for Broader Scope & Responsibilities
(Shanghai)
34 Sec.
台灣技術學院機械系 (1993/9 ~ 1997/6)
2008 PMD :O
Xintec
(MFG)
Experience:
2.5 Year DP.Manager
PHOTO EE 3 Year TSMC 32 Eng.
PHOTO PE 3.5Year
TSMC Group Section
Discipline raise
➢Enhance self audit and find out the Operation handing risk and take action
➢Modify tooling & Machine (wet bench) ➢Rack manager system
Developer system
Tooling & Machine modify
➢Laser marking automation; reduce miss operation and 20 % capacity upgrading
➢Revision software bug to reduce dicing abnormal issue (MO:3 to 0/year)
➢ manual to auto (1 to 25 pcs), capacity improve 70% ; saving 1 HC/Shift. ➢ cost saving 0.6M/Year ➢Apply Auto notch and dicing function ➢ Productivity improvement 100% (1:5 to 1:10), saving 6 DL/Shift, ➢ cost saving NT$3.4M/Year ➢ OCAP rate < 5%
➢B1&B2 cure process (28 to 12 hr) ➢Notch cure process( 9 to 6 hr ) ➢One tape on-line (1.6 hr)
Add Capacity:
➢Blade feed rate 8 to 13mm/sec, Capacity Improve >25% ➢PP robot modify ,capacity improve >50% ➢Improve ETCH available time (83% to 92%) ➢Reduce alarm code of saw (8.5/wafer to 2.8/wafer) ➢Raise efficiency at Saw (76% to 85% /Aligner (90% to
Personality & attributes:
Good Observation & Execute to achieve the targets
En
Responsibility & Conscientious
g
M
Potential scope:
FG
Managerial skills
Nice work style of the leadership
Record High
New low
DM+IDM material cost reduction from us$93 to us$ 64, cost saving 31.18% (2008/03~2009/05) ➢Base on MRP, build up daily material requisite check list to make sure daily MOL. (Safety stock：1 day) ➢Prolong chemical lift time ➢Developer MOL system to review usage by wafer ➢2nd source evaluation & price down (Tape & blade & gas & glass)
Chip 1
Chip 2
Glass 2
“T” Contacts
Epoxy
Barrier Layer
External Lead
Solde Bump
External Lead Formation
BGA Formation
External Passivation
Dicing
➢Co-work with VisEra to allow M-Project release.(2008/04)
Major Accomplishments
Productivity improvement(2008~2009/03):IDL reduce 5HC
➢Design new robot for PP stage, capacity improve 30% (55die to 80die/min) ➢Developer wet bench mode for De-flux process
Be the packaging manufacturing leader Fostering a Dynamic and Fun Work Environment