亿光EL817C光耦
光耦817正向电流
光耦817正向电流光耦是一种常用的光电器件，广泛应用于电子电路中。
在光耦中，817型号是一款常见的光耦，其正向电流是一个重要的参数。
光耦817是由发光二极管和光敏三极管组成的。
发光二极管是光耦的输入端，其正向电流是指流经发光二极管的电流。
正向电流的大小直接影响着光耦的工作性能。
正向电流的大小对光耦的发光强度和光敏三极管的灵敏度都有影响。
在设计电路时，我们需要根据实际需求合理选择正向电流的大小。
正向电流的大小决定了发光二极管的发光强度。
发光二极管作为光耦的输入端，其发光强度直接影响着光耦的工作效果。
过小的正向电流会导致发光强度不足，光敏三极管无法正常接收到光信号，影响光耦的传输功能。
而过大的正向电流则会加大功耗，造成能源浪费。
因此，我们需要根据实际需求合理选择正向电流的大小，以达到最佳的发光效果。
正向电流的大小也影响着光敏三极管的灵敏度。
光敏三极管是光耦的输出端，其灵敏度决定了光耦的传输性能。
正向电流过小会导致光敏三极管的灵敏度降低，无法准确接收到发光二极管发出的光信号。
而正向电流过大则会使光敏三极管过于敏感，可能会产生误触发或干扰信号。
因此，在选择正向电流时，需要综合考虑光敏三极管的灵敏度，以保证光耦的传输性能达到最佳状态。
正向电流的大小也与光敏三极管的工作温度有关。
正向电流过大会使光敏三极管产生过多的热量，导致温度升高。
高温会影响光敏三极管的工作稳定性和寿命。
因此，在选择正向电流时，还要考虑光敏三极管的工作温度范围，避免过高的正向电流对光耦造成损害。
光耦817的正向电流是一个重要的参数，对光耦的工作性能有着直接影响。
在实际应用中，我们需要根据实际需求合理选择正向电流的大小，以达到最佳的光耦工作效果。
同时，还要注意正向电流与发光强度、光敏三极管的灵敏度以及工作温度之间的关系，以保证光耦的传输性能和稳定性。
韩国电子品牌 'OPTO-ELECTRONIC' 的817A型号光电耦合器说明书
Dimensions: [mm]121Scale - 3:1Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg Germany140817140110Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive Solutions140817140110 Max-Eyth-Str. 174638 WaldenburgGermanyTotal Power Dissipation vs. Ambient Temperature:20406080100120140160-55-35-15525456585105125IR-diode -I F(mA)Ambient Temperature (°C)Phototransistor-PO(mW)CollectorPowerDissipation(mW)ForwardCurrent(mA)Collector Dark Current vs. Ambient Temperature:11010010001000025456585105125CollectorDarkCurrent(nA)Ambient Temperature (°C)V CE= 20VV CE= 10VNote: measured with Bin BWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODSaVo001.0052023-08-22DIN ISO 2768-1mDESCRIPTIONWL-OCPT OptocouplerPhototransistor ORDER CODE140817140110SIZE/TYPE BUSINESS UNIT STATUS PAGEAbsolute CTR vs. Ambient Temperature50100150200250300-60-40-20020406080100120AbsoluteCTRAmbient Temperature (°C)V CE= 5VV CE= 0,4VTestcondition: I F=5mA, T A=25°C, Bin BRelative CTR vs. Ambient Temperature:0,40,60,811,21,4-60-40-20020406080100120RelativeCTRAmbient Temperature (°C)V CE= 5VV CE= 0,4VTestcondition: I F=5mA, Normalized to T A=25°C, Bin BWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODSaVo001.0052023-08-22DIN ISO 2768-1mDESCRIPTIONWL-OCPT OptocouplerPhototransistor ORDER CODE140817140110SIZE/TYPE BUSINESS UNIT STATUS PAGEWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive Solutions140817140110 Max-Eyth-Str. 174638 WaldenburgGermanyWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive Solutions140817140110 Max-Eyth-Str. 174638 WaldenburgGermany050100150200250300350400450A b s o l u t e C T R (%)Testcondition T A Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg Germany140817140110050100150200250300A b s o l u t e C T R (%)Testcondition T A Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg Germany1408171401100102030R e s p o n s e T i m e (µs )Testcondition I C Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg Germany140817140110Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive Solutions140817140110 Max-Eyth-Str. 174638 WaldenburgGermanyWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive Solutions140817140110 Max-Eyth-Str. 174638 WaldenburgGermanyT e m p e r a t u r eT T T Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg Germany140817140110Cautions and Warnings:The following conditions apply to all goods within the product series of Optoelectronic Components of Würth Elektronik eiSos GmbH & Co. KG:General:•This optoelectronic component is designed and manufactured for use in general electronic equipment.•Würth Elektronik must be asked for written approval (following the PPAP procedure) before incorporating the components into any equipment in fields such as military, aerospace, aviation, nuclear control, submarine, transportation (automotive control, train control,ship control), transportation signal, disaster prevention, medical, public information network, etc. where higher safety and reliability are especially required and/or if there is the possibility of direct damage or human injury.•Optoelectronic components that will be used in safety-critical or high-reliability applications, should be pre-evaluated by the customer. •The optoelectronic component is designed and manufactured to be used within the datasheet specified values. If the usage and operation conditions specified in the datasheet are not met, the wire insulation may be damaged or dissolved. •Do not drop or impact the components, the component may be damaged•Würth Elektronik products are qualified according to international standards, which are listed in each product reliability report. Würth Elektronik does not warrant any customer qualified product characteristics beyond Würth Elektroniks’ specifications, for its validity and sustainability over time.•The responsibility for the applicability of the customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products also apply to customer specific products.•Unless Würth Elektroik has given its express consent, the customer is under no circumstances entitled to reverse engineer, disassemble or otherwise attempt to extract knowledge or design information from the optoelectronic component.Product specific:Soldering:•The solder profile must comply with the technical product specifications. All other profiles will void the warranty. •All other soldering methods are at the customers’ own risk•The soldering pad pattern shown above is a general recommendation for the easy assembly of optoelectronic components. If a high degree of precision is required for the selected application (i.e. high density assembly), the customer must ensure that the soldering pad pattern is optimized accordingly.Cleaning and Washing:•Washing agents used during the production to clean the customer application might damage or change the characteristics of the optoelectronic component body, marking or plating. Washing agents may have a negative effect on the long-term functionality of the product.• Using a brush during the cleaning process may break the optoelectronic component body. Therefore, we do not recommend using a brush during the PCB cleaning process.Potting:•If the product is potted in the customer application, the potting material might shrink or expand during and after hardening. Shrinking could lead to an incomplete seal, allowing contaminants into the optoelectronic component body, pins or termination. Expansion could damage the components. We recommend a manual inspection after potting to avoid these effects.Storage Conditions:• A storage of Würth Elektronik products for longer than 12 months is not recommended. Within other effects, the terminals may suffer degradation, resulting in bad solderability. Therefore, all products shall be used within the period of 12 months based on the day of shipment.•Do not expose the optoelectronic component to direct sunlight.•The storage conditions in the original packaging are defined according to DIN EN 61760-2.•For a moisture sensitive component, the storage condition in the original packaging is defined according to IPC/JEDEC-J-STD-033. It is also recommended to return the optoelectronic component to the original moisture proof bag and reseal the moisture proof bag again. •The storage conditions stated in the original packaging apply to the storage time and not to the transportation time of the components.Packaging:•The packaging specifications apply only to purchase orders comprising whole packaging units. If the ordered quantity exceeds or is lower than the specified packaging unit, packaging in accordance with the packaging specifications cannot be ensured.Handling:•Violation of the technical product specifications such as exceeding the nominal rated current, will void the warranty. •The product design may influence the automatic optical inspection.•Certain optoelectronic component surfaces consist of soft material. Pressure on the top surface has to be handled carefully to prevent negative influence to the function and reliability of the optoelectronic components.•ESD prevention methods need to be applied for manual handling and processing by machinery. •Resistors for protection are obligatory.•In addition to optoelectronic components testing, products incorporating these devices have to comply with the safety precautions given in IEC 60825-1, IEC 62471 and IEC 62778.Technical specification:•The typical and/or calculated values and graphics of technical parameters can only reflect statistical figures. The actual parameters ofeach single product, may differ from the typical and/or calculated values or the typical characteristic line.Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg GermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCEPROJECTION METHODSaVo001.0052023-08-22DIN ISO 2768-1mDESCRIPTIONWL-OCPT Optocoupler PhototransistorORDER CODE140817140110SIZE/TYPEBUSINESS UNITSTATUSPAGE•In the characteristics curves, all values given in dotted lines may show a higher deviation than the paramters mentioned above. •On each reel, only one bin is sorted and taped. The bin is defined on the current transfer ratio.•In order to ensure highest availability, the reel binning of standard deliveries can vary. A single bin cannot be ordered. Please contact us in advance, if you need a particular bin sorting before placing your order.•These cautions and warnings comply with the state of the scientific and technical knowledge and are believed to be accurate and reliable. However, no responsibility is assumed for inaccuracies or incompleteness.The customer has the sole responsibility to ensure that he uses the latest version of this datasheet, which is available on Würth Elektronik’s homepage. Unless otherwise agreed in writing (i.e. customer specific specification), changes to the content of this datasheet may occurwithout notice, provided that the changes do not have a significant effect on the usability of the optoelectronic components.Würth Elektronik eiSos GmbH & Co. KG EMC & Inductive Solutions Max-Eyth-Str. 174638 Waldenburg GermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCEPROJECTION METHODSaVo001.0052023-08-22DIN ISO 2768-1mDESCRIPTIONWL-OCPT Optocoupler PhototransistorORDER CODE140817140110SIZE/TYPEBUSINESS UNITSTATUSPAGEImportant NotesThe following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component. Therefore, customer is cautioned to verify that data sheets are current before placing orders. The current data sheets can be downloaded at .3. Best Care and AttentionAny product-specific notes, cautions and warnings must be strictly observed. Any disregard will result in the loss of warranty.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve specific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability expectancy before or when the product for application design-in disposal is considered. The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, application, or process in which Würth Elektronik eiSos GmbH & Co. KG components or services are used.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .Würth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyCHECKED REVISION DATE (YYYY-MM-DD)GENERAL TOLERANCE PROJECTIONMETHODSaVo001.0052023-08-22DIN ISO 2768-1mDESCRIPTIONWL-OCPT OptocouplerPhototransistor ORDER CODE140817140110SIZE/TYPE BUSINESS UNIT STATUS PAGE。
光耦817c工作原理
光耦817c工作原理
光耦817c是一种将输入电信号通过光耦合器转化为输出光信
号的电子元件。
它由发光二极管（LED）和光敏晶体管（LPT）组成。
光耦817c的工作原理如下：
1. 输入电信号经过电阻器限流，进入LED。
2. LED受到电信号激励后，产生光能，通过发射端发射出去。
3. 发射出的光线照射到光敏晶体管的接收端。
4. 光敏晶体管的接收端感受到光能后，产生电流。
5. 产生的电流经过输出电阻器，形成与输入电信号相对应的输出电信号。
光敏晶体管光敏区的光电效应和储能效应是使光耦具有可见光控制的主要原因。
当LED处于导通状态时，LED引入的光照
射到光敏晶体管的光敏结上，使该结中的载流子复合，导致其电导下降。
因此，当输入电信号的电平为高时，LED导通，
光照射到光敏结上，光敏晶体管电导减小，输出电信号的电平为低。
反之，当输入电信号的电平为低时，LED截止，无光
照射到光敏结上，光敏晶体管电导增加，输出电信号的电平为高。
光耦817c常用于电气隔离、信号传输、电源控制等领域。
它
具有隔离电气信号、抗干扰能力强、响应速度快等特点，是一种常见且常用的光耦合器。
ORPC817
顺嘉信电子有限公司主营各种品牌光藕817，有亿光EL817、PC817 JC817 OR817。
欢迎咨询！QQ28296675
●特点:
1.电流转换比(CTR: 最小. 50%工作条件IF=5mA, VCE=5V)
2.绝缘电压：(VISO=5,000Vrms)
3.响应时间(tr: TYP. 4μs 工作条件VCE=2V, IC=2mA, RL=100 Ω)
4.CE认证（AC/0431008）
5.CQC认证（CQC09001029446）
6.UL认证（E323844）
7.VDE认证（40029733）
●说明
1. ORPC-817系列光耦合器的组成是：由一个GaAs的发射管和一个 NPN的晶体管组成
2. ORPC-817的BIN脚宽是 2.54mm
●应用范围:
1.电脑.
2.器具的应用, 测量机.
3.贮存器, 复印机, 自动售货机.
4.家用电器, 如风扇等.
5.信号传输系统.
如下是绝缘测试的方法.
(1)将产品的两端短路。
(2)测试绝缘电压时无电流通过。
(3)测试时加正弦波形电压。
*2. 锡焊时间为10秒
●光电特性(常温=25℃)
*1 电流转换比= IC / IF × 100%
●电流转换比的等级分类
说明:
1. 工作条件: IF=5mA, VCE=5V, Ta=25℃.
●外形尺寸
●注解：
*1. 公司英文名. *2. BIN级.
*3. 生产周期.
●特性曲线
●特性曲线
●可靠度测试
●可靠度判断标准。
亿光的光耦el817的工作寿命评估方式
亿光的光耦el817的工作寿命评估方式光耦是一种将输入光信号和输出电信号进行电光转换的器件，广泛应用于各种电子设备中。
其中，亿光的光耦型号el817是一种常用的光耦产品。
在评估el817的工作寿命时，可以考虑以下几个方面：光电转换性能、环境因素、温度、电器荷电量、加电击波和终端压力。
首先，光电转换性能是评估el817工作寿命的重要指标之一。
光电转换性能包括光耦的转换速度、滞后时间和线性度等方面。
在实际应用中，光耦的转换速度要求越高，生命周期就越短。
因此，使用el817作为光耦时，需要根据具体需求选择合适的型号，并根据其提供的转换速度等参数进行评估。
其次，环境因素也会对el817的工作寿命产生影响。
环境因素主要包括湿度、光照强度和尘埃等。
湿度过高会导致光耦内部元件的腐蚀，从而降低工作寿命；光照强度过高会导致光耦内部元件的老化，同样会缩短工作寿命；而尘埃对光耦的外部结构形成阻隔，影响光信号的输入和输出，进而影响光耦的转换性能和工作寿命。
此外，温度对el817的工作寿命也有重要影响。
温度过高会使光耦内部元件的粘结材料老化，导致光电转换性能下降，从而缩短工作寿命。
因此，在设计电路时，需要根据实际环境温度，选择合适的散热措施，以保证el817在合适的温度范围内工作。
同时，电器荷电量也是评估el817工作寿命的重要因素之一。
电器荷电量是指光耦元器件上积累的电荷量，过高的电器荷电量会导致静电放电现象，进而对光电转换性能和工作寿命造成不可逆的损害。
此外，加电击波也是一个重要的评估因素。
在实际应用中，电路开关和继电器的加电冲击会影响光耦的工作寿命。
因此，在电路设计中，需要考虑合适的保护电路来减小电路开关对光耦产生的冲击，从而提高工作寿命。
最后，终端压力也是影响el817工作寿命的因素之一。
终端压力过大，会使光耦内部元件的结构变形，进而影响光电转换性能和工作寿命。
因此，在应用中需要注意处理好终端压力，避免对光耦造成不可逆的损害。
EL817C中文资料(everlight)中文数据手册「EasyDatasheet - 矽搜」
4引脚DIP光电晶体管光耦合器 EL817-G系列
概要
产品特点：
• 卤素免费. • 电流传输比
（CTR：在我50〜600％F =5mA, V CE =5V) • 输入之间的高隔离电压
和输出（维索= 5000 V有效值） • Creepage distance >爬电距离7.62毫米 • 工作温度可达+ 110℃ • 紧凑的小外形封装 • 无铅并符合RoHS标准. • UL认证（编号E214129） • VDE认证（132249号） • SEMKO批准 • NEMKO认可 • DEMKO批准 • FIMKO批准 • CSA认证 • CQC批准
1
芯片中文手册,看全文,戳
数据表
4PIN DIP光电晶体管光耦合器 EL817-G系列
绝对最大额定值（TA = 25℃）
Input
参数 正向电流
峰值正向电流（1微秒,脉冲）
反向电压
功耗
符
IF IFP VR
PD
击穿电压
PC
输出
总功率耗散
隔离电压*
工作温度 储存温度
焊接温度*
集电极电流
80
-
160
当前
EL817B
130
-
260
转让
EL817C
CTR
200
-
400
ratio
EL817D
300
-
600
EL817X
100
-
200
EL817Y
150
集电极 - 发射极
饱和电压
VCE(sat)
-
-
300
0.1
0.2
fl817cf917光耦参数
fl817cf917光耦参数
FL817C是一种光耦，它是一种光电耦合器件，通常由发光二极
管和光敏三极管组成。
光耦的参数通常包括输入和输出的电气特性，以及一些关于光学特性的参数。
以下是关于FL817C光耦的一些常见
参数：
1. 输入电气特性，这包括LED的工作电流和工作电压。
通常来说，FL817C的LED工作电流在10mA左右，工作电压在1.2V左右。
2. 输出电气特性，这包括光敏三极管的最大输出电流和最大工
作电压。
FL817C的最大输出电流通常在50mA左右，最大工作电压
在30V左右。
3. 光电耦合特性，这包括光电耦合器的传输特性，即输入光功
率和输出电流之间的关系。
这通常由光耦合器的CTR（Current Transfer Ratio）来表示，即输出电流与输入光功率之比。
在
FL817C中，CTR通常在50%左右。
4. 工作温度范围，这是指光耦在正常工作条件下能够承受的温
度范围。
FL817C通常可以在-40°C到85°C的温度范围内正常工作。
5. 包装类型，FL817C的封装通常为DIP-4（双列直插封装），
这种封装便于在电路板上进行焊接和安装。
总的来说，FL817C光耦的参数涵盖了其输入和输出的电气特性，以及光电耦合特性，这些参数对于工程师在设计电路和选择器件时
非常重要。
希望这些信息能够帮助到你。
光耦817工作原理
光耦817工作原理
光耦合器（也称为光耦）是一种使用光信号来隔离两个电路的器件。
它通常由一个发送器和一个接收器组成。
光耦的工作原理可以分为两个阶段，发送阶段和接收阶段。
发送阶段：
1. 当输入电路的电流流过发送器时，发送器中的发光二极管被激活，并产生一定强度的光信号。
2. 发光二极管产生的光通过耦合介质（通常是光纤）传输到接收器。
接收阶段：
1. 光信号到达接收器后，光电二极管将光信号转换为电信号。
2. 电信号经过一定的放大和处理后，输出到接收电路。
光耦合器的工作原理是基于发光二极管的电流控制和光电二极管的光电转换。
当光耦合器两端的电路需要隔离时，使用光信号传输来替代传统的电信号传输。
光信号的隔离特性使得光耦合器可以有效地防止电路之间的相互干扰，提高系统的抗电磁干扰能力。
总结而言，光耦合器利用发光二极管将电信号转换为光信号，并通过光纤传输到接收器，接收器将光信号转换为电信号。
这样可以实现电路之间的隔离，提高系统的稳定性和抗干扰能力。
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Technical Data Sheet PhotocouplerEL817 Series Features:• Current transfer ratio(CTR:MIN.50% at IF =5mA ,VCE =5V) • High isolation voltage between input and output (Viso=5000 V rms ) • Compact dual-in-line package EL817*:1-channel type • Pb free• UL approved (No. E214129) • VDE approved (No. 132249)• SEMKO approved (No. 0143133/01-03) • NEMKO approved (No. P0*******) • DEMKO approved (No. 310352-04) • FIMKO approved (No. FI 16763A2) • CSA approved (No. 1143601) • BSI approved (No. 8592 / 8593)• Options available:- Leads with 0.4”(10.16mm) spacing (M Type) - Leads bends for surface mounting (S Type)- Tape and Reel of Type Ⅰ for SMD(Add”-TA” Suffix) - Tape and Reel of Type Ⅱ for SMD(Add”-TB” Suffix) - The tape is 16mm and is wound on a 33cm reelDescriptionThe EL817 series contains a infrared emitting diode optically coupled to a phototransistor. It is packaged in a 4-pin DIP package and available in wide-lead spacing and SMD option.Applications• Computer terminals• System appliances, measuring instruments• Registers, copiers, automatic vending machines • Cassette type recorder• Electric home appliances, such as fan heaters, etc.• Signal transmission between circuits of different potentialsandimpedancesPhotocouplerEL817 Series Device Selection GuideChip MaterialPart. No.IR PTEL817* GaAs SiliconPhotocouplerEL817 Series2. Factory code shall be marked (T: Taiwan / C: China)3. Year date code4. 2-digit work week5. All dimensions are in millimeters6. Specifications are subject to change without noticeTechnical Data Sheet PhotocouplerEL817 SeriesAbsolute Maximum Ratings ( Ta=25°C )Parameter Symbol Rating UnitForward CurrentI F 50 mA Input Reverse Voltage V R 6 V Power Dissipation P 70mWCollector Power DissipationP C 150 mW Output Collector CurrentI C 50mA Collector-Emitter Voltage V CEO 35 V Emitter-Collector Voltage V ECO 6V Total Power DissipationPtot 200 mW＊1Isolation VoltageViso 5000 V rmsOperating Temperature Topr -55~+110 °CStorage TemperatureTstg -55~+125 °C＊2Soldering TemperatureTsol 260 °C*1 AC for 1 minute, R.H= 40~ 60%RH-Isolation voltage shall be measured using the following method.) (1) Short between anode and cathode on the primary side and ) between collector, emitter and base on the secondary side. ) (2) The isolation voltage tester with zero-cross circuit shall be used. ) (3) The waveform of applied voltage shall be a sine wave *2 For 10 secondsTechnical Data Sheet PhotocouplerEL817 SeriesElectro-Optical Characteristics (Ta=25°C)Parameter Symbol Min. Typ. Max. Unit ConditionForwardV F - 1.2 1.4 V I F =20mA ReverseCurrent IR - - 10 uAV R =4VInputTerminal Ct - 30 250 pF V=0,f=1kHz Collector Dark currentI CEO - - 100 nAV CE =20VOutputCollector- Emitter breakdown voltage BV CEO 35 - - V Ic=0.1mACurrent Transfer ratio CTR 50-600 % I F =5mA ,V CE =5VCollector- Emitter saturation voltageV CE(sat) - 0.1 0.2 V I F =20mA ,Ic=1 mAIsolationresistanceR ISO5×10101011 - ΩDC500V,40~60%R.HFloation capacitance Cf - 0.6 1.0 pF V=0, f=1MHz Cut-off frequency fc - 80 - kHz V CE =5V, I C =2 mA R L =100Ω, -3dBRise time t r - 4 18 us TransferCharacteristicsFall timet f - 3 18 usV CE =2VI C =2mA,R L =100ΩPhotocouplerEL817 Series SupplementTechnical Data Sheet PhotocouplerEL817 SeriesRELIABILITY PLANThe reliability of products shall be satisfied with items listed below.Confidence level : 90 % , LTPD : 10 %ClassificationTest ItemDescription & Condition(Acc.) SampleFailure CriteriaReference StandardOperation Life * Ta = 25 ± 3°C IR: If = 50 mAPt: Pc = 130 mW ( Vf=1.4v) , 1000 hrs0 / 22MIL-S-750 : 1026 MIL-S-883 : 1005JIS C 7021 : B-1High Temperature / High Humidity Reverse Bias (H3TRB)Ta = 85 ± 3°C , Humi. = 85 % rh Pt: 80% * Vce (max rating) , 1000 hrs0 / 22 JIS C 7021 : B-11High TemperatureReverse Bias (HTRB) Ta = 105 ± 3°CPt: 100% * Vce (Max rating) ,1000 hrs0 / 22JIS C 7021 : B-8Low Temperature Storage Ta = -50 ± 3°C, 1000 hrs 0 / 22JIS C 7021 : B-12High Temperature Storage Ta = 125 ± 3°C , 1000 hrs0 / 22 JIS C 7021 : B-10 MIL-S-883 : 1008Endurance testAuto claveP = 15 PSIG , Ta = 121 °C , Humi. = 100 % rh , 48 hrs0 / 22JESD 22-A102-BTemperature Cycling (Air to Air) 125°C ~ - 55 °C30 ~ 30 min , 100 cycles 0 / 22 MIL-S-883 :1010 JIS C 7021 : A-4Thermal Shock (Liquid to Liquid)125 ~ - 55°C t (dwell) = 5 mint (trans.) = 10 sec , 100 cycles0 / 22 MIL-S-202 : 107D MIL-S-750 : 1051 MIL-S-883 :1011Solder ResistanceTa = 260 ± 3°C t (dwell) = 10 ± 1 sec0 / 22 MIL-S-750 : 2031 JIS C 7021 : A-1Environmental TestSolder AbilityTa = 230 ± 3 °C t (dwell) = 5 ± 1 sec0 / 22CTR shift > 1.2Vf > U* 1.0 Ir > U * 1.0 Vce(sat) >U*1.0Bvceo < L*1.0 Bveco < L*1.0L :Low Spec.LimitU : Up Spec. LimitMIL-S-883 : 2003 JIS C 7021 : A-2Technical Data SheetPhotocouplerEL817 Series2. 25 Tubes / Inner Carton3. 12 Inner Cartons / Outside CartonTechnical Data Sheet Photocoupler-11-。