Integrated Circuits集成电路(英汉翻译)
Integrated Circuits集成电路The Integrated CircuitDigital logic and electronic circuits derive their functionality from electronic switches called transistor. （数字逻辑和电子电路由称为晶体管的电子开关得到它们的（各种）功能。
）Roughly speaking, the transistor can be likened to an electronically controlled valve whereby ener gy applied to one connection of the valve enables energy to flow between two other connections .By combining multiple transistors, digital logic building blocks such as AND gates and flip-flops ar e formed. Transistors, in turn, are made from semiconductors. （粗略地说，晶体管好似一种电子控制阀，由此加在阀一端的能量可以使能量在另外两个连接端之间流动。
通过多个晶体管的组合就可以构成数字逻辑模块，如与门和触发电路等。
而晶体管是由半导体构成的。
）Consult a periodic table of elements in a college chemistry textbook, and you will locate semicon ductors as a group of elements separating the metals and nonmetals.They are called semiconduct ors because of their ability to behave as both metals and nonmetals.（查阅大学化学书中的元素周期表，你会查到半导体是介于金属与非金属之间的一类元素。
它们之所以被叫做半导体是由于它们表现出来的性质类似于金属和非金属。
）A semiconductor can be made to conduct electricity like a metal or to insulate as a nonmetal doe s. These differing electrical properties can be accurately controlled by mixing the semiconductor with small amounts of other elements. This mixing is called doping.（可使半导体像金属那样导电，或者像非金属那样绝缘。
通过半导体和少量其它元素的混合可以精确地控制这些不同的电特性。
这种混合技术称之为“半导体掺杂”。
）A semiconductor can be doped to contain more electrons (N-type) or fewer electrons (P-type). Ex amples of commonly used semiconductors are silicon and germanium. Phosphorous and boron ar e two elements that are used to dope N-type and P-type silicon, respectively. （半导体通过掺杂可以包含更多的电子（N型）或更少的电子（P型）。
常用的半导体是硅和锗，N型硅半导体掺入磷元素，而P型硅半导体掺入硼元素。
）A transistor is constructed by creating a sandwich of differently doped semiconductor layers. The two most common types of transistors, the bipolar-junction transistor (BJT) and the field-ef fect transistor (FET) are schematically illustrated.This figure shows both the silicon structures of th ese elements and their graphical symbolic representation as would be seen in a circuit diagram. The BJT shown is an NPN transistor, because it is composed of a sandwich of N-P-N doped silicon.（不同掺杂的半导体层形成的三明治状夹层结构可以构成一个晶体管，最常见的两类晶体管是双极型晶体管（BJT）和场效应晶体管（FET），这些晶体管的硅结构，以及它们用于电路图中的符号。
BJT是NPN型晶体管，因为由N—P—N掺杂硅三层构成。
）When a small current is injected into the base terminal, a larger current is enabled to flow from t he collector to the emitter.The FET shown is an N-channel FET, which is composed of two N-type r egions separated by a P-type substrate. When a voltage is applied to the insulated gate terminal, a current is enabled to flow from the drain to the source. It is called N-channel, because the gatevoltage induces an N-channel within the substrate, enabling current to flow between the N-regio ns. （当小电流注入基极时，可使较大的电流从集电极流向发射极。
）（图示的FET是N沟道的场效应型晶体管，它由两块被P型基底分离的N型组成。
）（将电压加在绝缘的栅极上时，可使电流由漏极流向源极。
）（它被叫做N沟道是因为栅极电压诱导基底上的N通道，使电流能在两个N区域之间流动。
）Another basic semiconductor structure is a diode, which is formed simply by a junction of N-type and P-type silicon.（另一个基本的半导体结构是二极管，由N型和P型硅连接而成的结组成。
）Diodes act like one-way valves by conducting current only from P to N.Special diodes can be creat ed that emit light when a voltage is applied. Appropriately enough, these components are called l ight emitting diodes, or LEDs. （二极管的作用就像一个单向阀门，由于电流只能从P流向N。
）（可以构建一些特殊二极管，加电压时可以发光，这些器件被叫做发光二极管或LED。
）These small lights are manufactured by the millions and are found in diverse applications from tel ephones to traffic lights. （这种小灯泡数以百万计地被制造出来，有各种各样的应用，从电话机到交通灯。
）The resulting small chip of semiconductor material on which a transistor or diode is fabricated ca n be encased in a small plastic package for protection against damage and contamination from th e out-side world.Small wires are connected within this package between thesemiconductor sandwich and pins that protrude from the package to make electrical contact with other parts of the intended circuit. Once you have several discrete transistors, digital logic can be built by directly wiring these components together. The circuit will function, but any substantial a mount of digital logic will be very bulky, because several transistors are required to implement ea chof the various types of logic gates.（半导体材料上制作晶体管或二极管所形成的小芯片用塑料封装以防损伤和被外界污染。
在这封装里一些短线连接半导体夹层和从封装内伸出的插脚以便与（使用该晶体管的）电路其余部分连接。
一旦你有了一些分立的晶体管，直接用电线将这些器件连线在一起就可以构建数字逻辑（电路）。
电路会工作，但任何实质性的数字逻辑（电路）都将十分庞大，因为要在各种逻辑门中每实现一种都需要多个晶体管。
）At the time of the invention of the transistor in 1947 by John Bardeen, Walter Brattain, and Willia m Shockley, the only way to assemble multiple transistors into a single circuit was to buy separate discrete transistors and wire them together. （1947年，John Bardeen、Walter Brattain 和and William Shockley发明晶体管的时候。
什么叫集成电路
什么叫集成电路集成电路介绍集成电路（integrated circuit）是一种微型电子器件或部件。
采用一定的工艺，把一个电路中所需的晶体管、电阻、电容和电感等元件及布线互连一起，制作在一小块或几小块半导体晶片或介质基片上，然后封装在一个管壳内，成为具有所需电路功能的微型结构；其中所有元件在结构上已组成一个整体，使电子元件向着微小型化、低功耗、智能化和高可靠性方面迈进了一大步。
它在电路中用字母“IC”表示。
集成电路发明者为杰克·基尔比（基于锗（Ge）的集成电路）和罗伯特·诺伊思（基于硅（Si）的集成电路）。
当今半导体工业大多数应用的是基于硅的集成电路。
集成电路结构电路形成于硅基板上，电路具有至少一输出/输入垫。
固定封环形成于硅基板上，并围绕电路及输出/输入垫。
接地环形成于硅基板及输出/输入垫之间，并与固定封环电连接。
防护环设置于硅基板之上，并围绕输出/输入垫，用以与固定封环电连接。
集成电路特点集成电路具有体积小，重量轻，引出线和焊接点少，寿命长，可靠性高，性能好等优点，同时成本低，便于大规模生产。
它不仅在工、民用电子设备如收录机、电视机、计算机等方面得到广泛的应用，同时在军事、通讯、遥控等方面也得到广泛的应用。
用集成电路来装配电子设备，其装配密度比晶体管可提高几十倍至几千倍，设备的稳定工作时间也可大大提高。
集成电路芯片种类介绍1.按功能结构分集成电路，又称为IC，按其功能、结构的不同，可以分为模拟集成电路、数字集成电路和数/模混合集成电路三大类。
模拟集成电路又称线性电路，用来产生、放大和处理各种模拟信号（指幅度随时间变化的信号。
例如半导体收音机的音频信号、录放机的磁带信号等），其输入信号和输出信号成比例关系。
而数字集成电路用来产生、放大和处理各种数字信号（指在时间上和幅度上离散取值的信号。
例如3G手机、数码相机、电脑CPU、数字电视的逻辑控制和重放的音频信号和视频信号）。
2.按制作工艺分集成电路按制作工艺可分为半导体集成电路和膜集成电路。
集成电路
分类
成电路的分类方法很多，依照电路属模拟或数字，可以分为：模拟集成电路、数字集成电路和混合信号集成电路（模拟和数字在一个芯片上）。
数字集成电路可以包含任何东西，在几平方毫米上有从几千到百万的逻辑门，触发器，多任务器和其他电路。这些电路的小尺寸使得与板级集成相比，有更高速度，更低功耗并降低了制造成本。这些数字IC, 以微处理器，数字信号处理器（DSP）和单片机为代表，工作中使用二进制，处理1和0信号。
IC 由很多重叠的层组成，每层由图像技术定义，通常用不同的颜色表示。一些层标明在哪里不同的掺杂剂扩散进基层（成为扩散层），一些定义哪里额外的离子灌输（灌输层），一些定义导体（多晶硅或金属层），一些定义传导层之间的连接（过孔或接触层）。所有的组件由这些层的特定组合构成。
在一个自排列（CMOS）过程中，所有门层（多晶硅或金属）穿过扩散层的地方形成晶体管。
介绍
晶体管发明并大量生产之后，各式固态半导体组件如二极管、晶体管等大量使用，取代了真空管在电路中的功能与角色。到了20世纪中后期半导体制造技术进步，使得集成电路成为可能。相对于手工组装电路使用个别的分立电子组件，集成电路可以把很大数量的微晶体管集成到一个小芯片，是一个巨大的进步。集成电路的规模生产能力，可靠性，电路设计的模块化方法确保了快速采用标准化IC 代替了设计使用离散晶体管。
在2005年，一个制造厂（通常称为半导体工厂，常简称fab，指fabrication facility）建设费用要超过10亿美金，因为大部分操作是自动化的。
封装
最早的集成电路使用陶瓷扁平封装，这种封装很多年来因为可靠性和小尺寸继续被军方使用。商用电路封装很快转变到双列直插封装（dual in-line package, DIP），开始是陶瓷，之后是塑料。1980年代，VLSI电路的针脚超过了DIP封装的应用限制，最后导致插针网格数组和leadless chip carrier（LCC）的出现。
元器件英语阅读
元器件英语阅读涉及到阅读关于元器件的英语资料时，以下是一些常见的词汇和短语，以及它们的解释：1. Component（元器件）: 用于构建电子产品的基本部件或部分。
2. Resistor（电阻器）: 控制电流流动的元器件，通常用于限制电流或调整电路中的电压。
3. Capacitor（电容器）: 存储电荷的元器件，常用于滤波、耦合和蓄电等应用。
4. Inductor（电感器）: 存储能量的元器件，常用于滤波、辐射抑制和变压器等应用。
5. Diode（二极管）: 具有单向导电性的元器件，通常用于电源保护、整流和信号调节等应用。
6. Transistor（晶体管）: 控制电流流动的半导体设备，常用于放大信号和开关电路等应用。
7. Integrated circuit (IC)（集成电路）: 在单个芯片上集成多个元器件，可实现复杂的功能。
8. Printed Circuit Board (PCB)（印刷电路板）: 用于支持和连接元器件的基板，通常由导电轨道和焊盘组成。
9. Schematic diagram（原理图）: 用符号和线路表示元器件之间的连接关系和电气特性。
10. Datasheet（数据手册）: 包含有关元器件的详细规格、性能和应用信息的文件。
阅读英语资料时，可以注意以下几点：1. 熟悉常见的元器件名称和功能，以便理解文章中的描述。
2. 查看上下文以获取更多信息。
在阅读过程中，可能会遇到不熟悉的词汇或缩写，尝试从上下文推断其含义。
3. 注意关键词和技术术语。
了解相关的专业术语和表达方式，可帮助你更好地理解文章内容。
4. 参考数据手册。
如果遇到不熟悉的元器件或术语，查阅相关的数据手册可以提供更详细的信息。
希望这些提示对你在阅读元器件英语资料时有所帮助！。
关于集成电路的英语作文
关于集成电路的英语作文英文回答：Integrated circuits (ICs), also known as microchips, are small electronic devices that contain a large number of transistors and other electronic components packed into a small space. They are used in a wide range of electronic devices, from computers and smartphones to cars and medical devices.The main components of an IC are transistors, which act as switches or amplifiers, and resistors and capacitors, which control the flow of electricity. ICs are manufactured using a process called photolithography, in which a pattern is created on a silicon wafer using ultraviolet light. The pattern is then etched into the silicon wafer to create the transistors and other components.The first IC was developed in 1958 by Jack Kilby of Texas Instruments. It contained only a few transistors, butit was the foundation for the development of more complex ICs. In the 1970s, the development of large-scale integration (LSI) technology allowed for the creation of ICs with thousands of transistors. This led to the development of microprocessors, which are the central processing units (CPUs) of computers.Today, ICs are used in a wide range of applications, including:Computers.Smartphones.Cars.Medical devices.Industrial automation.Military equipment.ICs have revolutionized the electronics industry and made it possible to create devices that are smaller, faster, and more efficient. They are essential for the developmentof new technologies and will continue to play a vital rolein the future of electronics.中文回答：什么是集成电路。
英文翻译
Integrated circuitsIntegrated circuits are a tiny electronic devices or components. By a certain technology, a circuit for the transistor, the diode, resistance, capacitance and inductance and components and wiring interconnection together, make on a small piece of or a few small piece of semiconductor wafer or medium substrate, and then encapsulated in a tube and shell inside, as has the required the miniature circuit function structure; Among them all components in the structure of a whole has, make the electronic components to micro miniaturization, low power consumption and high reliability take a big step. It in a circuit with the letter "IC" said. Integrated circuit for the inventor jack kilby (based on the silicon integrated circuits) and Robert noe of thought (based on the ge integrated circuit). The semiconductor industry is based on the most applications silicon integrated circuits.1.characteristicsIntegrated circuit has small volume, light weight, lead wire and welding points less, long service life, high reliability, good performance advantages, at the same time, low cost, easy to mass production. It not only in the work, civil electronic equipments such as radio, television, computers and other aspects of the widely application, and in the military, communication, remote control, etc also widely used. With integrated circuit to assembly electronic equipment, its density than transistor can improve assembly several times to thousands of times, the stability of the equipment can greatly improve the work time.2. classificationAccording to their function, integrated circuit of the different structure, can be divided into analog integrated circuit, digital integrated circuit and hybrid integrated circuit model/three categoriesNO.1 According to the function structure classificationAnalog integrated circuit also called linear circuits, used to produce, amplification and dealing with various kinds of analog signals (refers to the signal amplitude change over time. Such as semiconductor radio's audio signal, the tape recorders signal), the input signal and the output signal proportional relations. While digital integrated circuit used to generate, amplification and dealing with various kinds of digital signal (point to in time and range of values in discrete signal. For example 3 G mobile phones, digital cameras, computer CPU, digital TV logic control and replay the audio and video letter.NO.2 According to production processes classificationAccording to the production of integrated circuit technology can be divided into semiconductor integrated circuit and membrane integrated circuit. Film integrated circuit and classification thick film integrated circuit and film integrated circuit.NO.3 According to the classification of high and low level of integrationSSI (Small Scale Integrated circuits)MSI (Medium Scale Integrated circuits)LSI (Large Scale Integrated circuits)VLSI (Very Large Scale Integrated circuits)ULSI (Ultra Large Scale Integrated circuits)GSI (Giga Scale Integration)。
专英
汉译英1. 集成电路 integrated circuit2. 轴向载荷 thrust load3. 柔性制造 flexible manufacture4. 瞬态电流 transient current5. 滑动接触 sliding contact6. 压敏电阻 pizeo-resistive7. 光敏开关 light-activated switch8. 刚性自动化 hard automation9. 圆锥齿轮 bevel gear10.模拟信号 analogue signal11.发光二极管 light-emitting diodes12.耐磨擦轴承 antifriction bearing13.声学传感器 acoustics transducer14.实时控制 real-time control15.随机存储器 random access memory英译汉1.friction clutch 摩擦离合器2. feed rod 进刀杆3. be confronted with 面临着4.angular-contact bearing 角接触轴承5. herringbone 人字齿轮6.lead angle 导角7.internal thread 内螺纹8.robotics 机器人技术9. pressure transducer 压力传感器10.programmable Controllers 可编程调节器11.self-aligning bearing 自动调心轴承12.machining tolerance 机械加工公差13.sliding velocity 滑动速度14.screws and fasteners螺钉和紧固件15.reliability 可靠性16.multipoint tool 多刃刀具17.boring machine 镗床18.rpm 每分钟转速19.work piece 工件20.viscosity 粘性句子翻译（英译汉）1.The life of an individual bearing is defined as the total number of revolutions,or the number of hours at a given constant speed, of bearing operation before the first evidence of fatigue develops.译文：在疲劳损伤首次单个发生之前，单个轴定义的寿命是轴承运转的总转数或以轴承在给定恒速下运转的小时数来定义的。
自动化专业英语unit 3 A
自动化专业英语
Language points
1．Integrated circuit，or IC is a combination．．．to perform definite function involved in converting information． 集成电路缩写为IC，是几个互相连接的电路元件的组合，如晶体管、二极 管、电容器和电阻器等电路元件的组合。它们是在同一个基底结构上，同时
集成电路按其功能可分为两大类，即用于数字系统的电路和用于线性系统的 电路。数字集成电路主要应用于计算机、电子计数器、频率合成器等数字仪 器中。模拟或线性集成电路可在连续范围内工作，通常包括诸如运算放大器 之类的器件。
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Unit 3 Integrated Circuit
自动化专业英语
The invention of IC is a great revolution in the electronic industry．Sharp10 size， weight are possible with these techniques；and more importantly，high reliability， excellent functional performance ， low cost and low power dissipation can be achieved．ICs are widely used in the electronic industry． 集成电路的发明是电子工业的一次伟大革命。利用这种技术，完全可能实现 尺寸明显缩小和重量减轻。更重要的是能够获得高度可靠性、优良的工作性 能、低成本和低功耗。集成电路广泛应用于电子工业。
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集成电路专业英语
集成电路专业英语一、单词1. Integrated Circuit (IC)- 英语释义：A set of electronic circuits on one small flat piece (chip) of semiconductor material, typically silicon.- 用法：常作为名词短语使用，可在句中作主语、宾语等。
例如：The development of integrated circuits has revolutionized the electronics industry.（集成电路的发展使电子工业发生了革命性的变化。
）2. Semiconductor- 英语释义：A material which has a conductivity between that of an insulator and that of most metals, either due to the addition of an impurity or because of temperature effects.- 用法：作名词，例如：Silicon is a widely used semiconductor in integrated circuit manufacturing.（硅是集成电路制造中广泛使用的半导体。
）3. Transistor- 英语释义：A semiconductor device used to amplify or switch electronic signals and electrical power.- 用法：作名词，如：The transistor is a keyponent in integrated circuits.（晶体管是集成电路中的一个关键元件。
）4. Chip- 英语释义：A small piece of semiconducting material (usually silicon) on which an integrated circuit is fabricated.- 用法：作名词，可指集成电路芯片。
IntegratedCircuits集成电路电子信息类专业英语计算机类专业英语文
Integrated Circuits(集成电路)英文原稿:The Integrated CircuitDigital logic and electronic circuits derive their functionality from electronic switches called transistor. Roughly speaking, the transistor can be likened to an electronically controlled valve whereby energy applied to one connection of the valve enables energy to flow between two other connections.By combining multiple transistors, digital logic building blocks such as AND gates and flip-flops are formed. Transistors, in turn, are made from semiconductors. Consult a periodic table of elements in a college chemistry textbook, and you will locate semiconductors as a group of elements separating the metals and nonmetals.They are called semiconductors because of their ability to behave as both metals and nonmetals. A semiconductor can be made to conduct electricity like a metal or to insulate as a nonmetal does. These differing electrical properties can be accurately controlled by mixing the semiconductor with small amounts of other elements. This mixing is called doping. A semiconductor can be doped to contain more electrons (N-type) or fewer electrons (P-type). Examples of commonly used semiconductors are silicon and germanium. Phosphorous and boron are two elements that are used to dope N-type and P-type silicon, respectively.A transistor is constructed by creating a sandwich of differently doped semiconductor layers. The two most common types of transistors, the bipolar-junction transistor (BJT) and the field-effect transistor (FET) are schematically illustrated in Figure 2.1.This figure shows both the silicon structures of these elements and their graphical symbolic representation as would be seen in a circuit diagram. The BJT shown is an NPN transistor, because it is composed of a sandwich of N-P-N doped silicon. When a small current is injected into the base terminal, a larger current is enabled to flow from the collector to the emitter.The FET shown is an N-channel FET, which is composed of two N-type regions separated by a P-type substrate. When a voltage is applied to the insulated gate terminal, a current is enabled to flow from the drain to the source. It is called N-channel, because the gate voltage induces an N-channel within the substrate, enabling current to flow between the N-regions.Another basic semiconductor structure is a diode, which is formed simply by a junction of N-type and P-type silicon. Diodes act like one-way valves by conducting current only from P to N. Special diodes can be created that emit light when a voltage is applied. Appropriately enough, these components are called light emitting diodes, or LEDs. These small lights are manufactured by the millions and are found in diverse applications from telephones to traffic lights.The resulting small chip of semiconductor material on which a transistor or diode is fabricated can be encased in a small plastic package for protection against damage and contamination from the outside world.Small wires are connected within this package between the semiconductor sandwich and pins that protrude from the package to make electrical contact with other parts of the intended circuit. Once you have several discrete transistors, digital logic can be built by directly wiring these components together. The circuit will function, but any substantial amount of digital logic will be very bulky, because several transistors are required to implement each of the various types of logic gates.At the time of the invention of the transistor in 1947 by John Bardeen, Walter Brattain, and William Shockley, the only way to assemble multiple transistors into a single circuit was to buy separate discrete transistors and wire them together. In 1959, Jack Kilby and Robert Noyce independently invented a means of fabricating multiple transistors on a single slab of semiconductor material. Their invention would come to be known as the integrated circuit, or IC, which is the foundation of our modern computerized world. An IC is so called because it integrates multiple transistors and diodes onto the same small semiconductor chip. Instead of having to solder individual wires between discrete components, an IC contains many small components that are already wired together in the desired topology to form a circuit.A typical IC, without its plastic or ceramic package, is a square or rectangular silicon die measuring from 2 to 15 mm on an edge. Depending on the level of technology used to manufacture the IC, there may be anywhere from a dozen to tens of millions of individual transistors on this small chip. This amazing density of electronic components indicates that the transistors and the wires that connect them are extremely small in size. Dimensions on an IC are measured in units of micrometers, with one micrometer (1mm) being one millionth of a meter. To serve as a reference point, a human hair is roughly 100mm in diameter. Some modern ICs contain components and wires that are measured in increments as small as 0.1mm! Each year, researchers and engineers have been finding new ways to steadily reduce these feature sizes to pack more transistors into the same silicon area, as indicated in Figure 2.2.When an IC is designed and fabricated, it generally follows one of two main transistor technologies: bipolar or metal-oxide semiconductor (MOS). Bipolar processes create BJTs, whereas MOS processes create FETs. Bipolar logic was more common before the 1980s, but MOS technologies have since accounted the great majority of digital logic ICs. N-channel FETs are fabricated in an NMOS process, and P-channel FETs are fabricated in a PMOS process. In the 1980s, complementary-MOS, or CMOS, became the dominant process technology and remains so to this day. CMOS ICsincorporate both NMOS and PMOS transistors.Application Specific Integrated CircuitAn application-specific integrated circuit (ASIC) is an integrated circuit (IC) customized for a particular use, rather than intended for general-purpose use. For example, a chip designed solely to run a cell phone is an ASIC. In contrast, the 7400 series and 4000 series integrated circuits are logic building blocks that can be wired together for use in many different applications.As feature sizes have shrunk and design tools improved over the years, the maximum complexity (and hence functionality) possible in an ASIC has grown from 5,000 gates to over 100 million.Modern ASICs often include entire 32-bit processors, memory blocks including ROM, RAM, EEPROM, Flash and other large building blocks. Such an ASIC is often termed a SoC (System-on-Chip). Designers of digital ASICs use a hardware description language (HDL), such as Verilog or VHDL, to describe the functionality of ASICs.Field-programmable gate arrays (FPGA) are the modern day equivalent of 7400 series logic and a breadboard, containing programmable logic blocks and programmable interconnects that allow the same FPGA to be used in many different applications. For smaller designs and/or lower production volumes, FPGAs may be more cost effective than an ASIC design. The non-recurring engineering cost (the cost to setup the factory to produce a particular ASIC) can run into hundreds of thousands of dollars.The general term application specific integrated circuit includes FPGAs, but most designers use ASIC only for non-field programmable devices and make a distinction between ASIC and FPGAs.HistoryThe initial ASICs used gate array technology. Ferranti produced perhaps the first gate-array, the ULA (Uncommitted Logic Array), around 1980. Customization occurred by varying the metal interconnect mask. ULAs had complexities of up to a few thousand gates. Later versions became more generalized, with different base dies customized by both metal and polysilicon layers. Some base dies include RAM elements.Standard cell designIn the mid 1980s a designer would choose an ASIC manufacturer and implement their design using the design tools available from the manufacturer. While third party design tools were available, there was not an effective link from the third party design tools to the layout and actual semiconductor process performance characteristics of the various ASIC manufacturers.Most designers ended up using factory specific tools to complete the implementation of their designs. A solution to thisproblem that also yielded a much higher density device was the implementation of Standard Cells. Every ASIC manufacturer could create functional blocks with known electrical characteristics, such as propagation delay, capacitance and inductance; that could also be represented in third party tools.Standard cell design is the utilization of these functional blocks to achieve very high gate density and good electrical performance. Standard cell design fits between Gate Array and Full Custom design in terms of both its NRE (Non-Recurring Engineering) and recurring component cost.By the late 1980s, logic synthesis tools, such as Design Compiler, became available. Such tools could compile HDL descriptions into a gate-level netlist. This enabled a style of design called standard-cell design. Standard-cell Integrated Circuits (ICs) are designed in the following conceptual stages, although these stages overlap significantly in practice.These steps, implemented with a level of skill common in the industry, almost always produce a final device that correctly implements the original design, unless flaws are later introduced by the physical fabrication process.A team of design engineers starts with a non-formal understanding of the required functions for a new ASIC, usually derived from requirements analysis.*The design team constructs a description of an ASIC to achieve these goals using an HDL. This process is analogous to writing a computer program in a high-level language. This is usually called the RTL (register transfer level) design.*Suitability for purpose is verified by simulation. A virtual system created in software, using a tool such as Virtutech’s Simics, can simulate the performance of ASICs at speeds up to billions of simulated instructions per second.*A logic synthesis tool, such as Design Compiler, transforms the RTL design into a large collection of lower-level constructs called standard cells. These constructs are taken from a standard-cell library consisting of pre-characterized collections of gates such as 2 input nor, 2 input nand, inverters, etc.The standard cells are typically specific to the planned manufacturer of the ASIC. The resulting collection of standard cells, plus the needed electrical connections between them, is called a gate-level netlist.*The gate-level netlist is next processed by a placement tool which places the standard cells onto a region representing the final ASIC. It attempts to find a placement of the standard cells, subject to a variety of specified constraints. Sometimes advanced techniques such as simulated annealing are used to optimize placement.*The routing tool takes the physical placement of the standard cells and uses the netlist to create the electrical connections between them. Since the search space is large, this process will produce a “sufficient” rather than “globally-optimal” solution. The output is a set of photomasks enabling semiconductor fabrication to produce physical ICs.*Close estimates of final delays, parasitic resistances and capacitances, and power consumptions can then be made. In the case of a digital circuit, this will be further mapped into delay information. These estimates are used in a final round of testing. This testing demonstrates that the device will function correctly over all extremes of the process, voltage and temperature. When this testing is complete the photomask information is released for chip fabrication.These design steps (or flow) are also common to standard product design. The significant difference is that Standard Cell design uses the manufacturer’s cell libraries tha t have been used in hundreds of other design implementations and therefore are of much lower risk than full custom design.Gate array designGate array design is a manufacturing method in which the diffused layers, i.e. transistors and other active devices, are predefined and wafers containing such devices are held in stock prior to metallization, in other words, unconnected.The physical design process then defines the interconnections of the final device. It is important to the designer that minimal propagation delays can be achieved in ASICs versus the FPGA solutions available in the marketplace. Gate array ASIC is a compromise as mapping a given design onto what a manufacturer held as a stock wafer never gives 100% utilization.Pure, logic-only gate array design is rarely implemented by circuit designers today, replaced almost entirely by field programmable devices such as FPGAs, which can be programmed by the user and thus offer minimal tooling charges, marginally increased piece part cost and comparable performance.Today gate arrays are evolving into structured ASICs that consist of a large IP core like a processor, DSP unit, peripherals, standard interfaces, integrated memories SRAM, and a block of reconfigurable uncommitted logic.This shift is largely because ASIC devices are capable of integrating such large blocks of system functionality and “system on a chip” requires far more than just logic blocks.Full-custom designThe benefits of full-custom design usually include reduced area, performance improvements and also the ability to integrate analogcomponents and other pre-designed components such as microprocessor cores that form a System-on-Chip. The disadvantages can include increased manufacturing and design time, increased non-recurring engineering costs, more complexity in the CAD system and a much higher skill requirement on the part of the design team.However for digital only designs, “standard-cell” libraries together with modern CAD systems can offer considerable performance/cost benefits with low risk. Automated layout tools are quick and easy to use and also offer the possibility to manually optimize any performance limiting aspect of the design.Structured designStructured ASIC design is an ambiguous expression, with different meanings in different contexts. This is a relatively new term in the industry, which is why there is some variation in its definition. However, the basic premise of a structured ASIC is that both manufacturing cycle time and design cycle time are reduced compared to cell-based ASIC by virtue of there being pre-defined metal layers and pre-characterization of what is on the silicon.One definition states that, in a structured ASIC design, the logic mask-layers of a device are predefined by the ASIC vendor (or in some cases by a third party). Structured ASIC technology is seen as bridging the gap between field-programmable gate arrays and “standard-cell” ASIC designs.What makes a structured ASIC different from a gate array is that in a gate array the predefined metal layers serve to make manufacturing turnaround faster. In a structured ASIC the predefined metallization is primarily to reduce cost of the mask sets and is also used to make the design cycle time significantly shorter as well.Likewise, the design tools used for structured ASIC can substantially lower cost, and are easier to use than cell-based tools, because the tools do not have to perform all the functions that cell-based tools do.One other important aspect about structured ASIC is that it allows IP that i s common to certain applications to be “built in”, rather than “designed in”. By building the IP directly into the architecture the designer can again save both time and money compared to designing IP into a cell-based ASIC.中文翻译：集成电路集成电路数字逻辑和电子电路由称为晶体管的电子开关得到它们的（各种）功能。
电子信息工程专业英语词汇
adj, 水平的，地平线的
vertical
adj 垂直的，顶点的
amplitude
n 振幅，广阔，丰富
attenuation
衰减；变薄；稀薄化
multimeter
万用表
frequency
频率，周率
the cathode-ray tube
阴极射线管
dual-trace oscilloscope
双踪示波器
专供制造
beam
n （光线的）束，柱，梁
polarize v（使）偏振，（使）极化
Cathode Ray Tube （ CRT） 阴极射线管
neuron
n 神经元；神经细胞
fuzzy
adj 模糊的
Artificial Intelligence Shell
人工智能外壳程序
Expert Systems 专家系统
n 微波
charge v 充电，使充电
insulator
n 绝缘体，绝缘物
nonconductive
adj 非导体的，绝缘的
antenna
n 天线；触角
modeling n 建模，造型
simulation n 仿真；模拟
prototype
n 原型
array
n 排队，编队
vector
n 向量，矢量
wavelet
灰度图像 Grey scale images
灰度级 Grey scale level
幅度谱 Magnitude spectrum
相位谱 Phase spectrum
频谱 frequency spectrum
智能设备 Smart Device